Wafer back surface detection structure, wafer appearance detection equipment and control method thereof

Abstract

The invention relates to the technical field of wafer detection, and provides a wafer back surface detection structure, wafer appearance detection equipment and a control method thereof. The wafer back detection structure comprises a bearing part and a detection part. The bearing part comprises a bearing table with an open hole and a fork table set arranged on the bearing table, the fork table set comprises at least two adsorption fork tables arranged around the open hole at intervals, and each adsorption fork table is provided with a supporting face and a limiting face which are arranged at an angle; a bearing space penetrating along the central axis of the opening is defined by the at least two supporting surfaces and the corresponding limiting surfaces; the detection part comprises a lighting assembly and a first image collector, wherein the lighting assembly is arranged below the bearing part and corresponds to the open hole, and the first image collector is used for obtaining a back image of the wafer to be detected exposed out of the open hole. According to the wafer back surface detection structure provided by the invention, the detection efficiency is improved and the detection cost is reduced on the basis of ensuring the back surface detection accuracy.

Description

Technical Field

[0001] The present application relates to the field of wafer inspection technology, and in particular to a wafer backside inspection structure, a wafer appearance inspection device and a control method thereof. Background Art

[0002] Wafer backside defect detection has an important impact on mechanical strength, heat treatment effect, electrical performance, etc. in the semiconductor process. Since the backside of the wafer does not contain circuit patterns, the focus of detection is usually on surface redundancy and surface physical defects, including macro defects such as particle contamination, residues, scratches, electrode contamination, cracks, oxide layer damage, etc.

[0003] At present, the macro defect detection methods of the back side of wafers can be roughly divided into manual visual inspection, semi-automatic inspection equipment inspection and fully automatic inspection equipment inspection according to the degree of automation. Manual visual inspection is mostly carried out through microscope visual inspection or direct visual inspection, and the inspection equipment is mostly equipped with a robot with a flipping function to flip the wafer and place it on the stage for back side inspection. These methods not only lead to low inspection efficiency, but also high inspection costs. Summary of the invention

[0004] Based on this, it is necessary to provide a wafer back side detection structure to improve detection efficiency and reduce detection costs while ensuring back side detection accuracy.

[0005] A wafer back side detection structure comprises a carrying component and a detection component; the carrying component is used to carry a wafer to be tested and comprises a carrying platform with an opening and a fork platform group arranged on the carrying platform, the fork platform group comprises at least two adsorption forks arranged around the opening at intervals, each of the adsorption forks has a supporting surface and a limiting surface set at an angle, at least two of the supporting surfaces and the corresponding limiting surfaces are jointly arranged to form a carrying space passing through the central axis of the opening; the detection component comprises an illumination component and a first image collector arranged below the carrying component and corresponding to the opening, the illumination component is used to generate illumination light and irradiate the illumination light onto the back side of the wafer to be tested through the opening, and the first image collector is used to obtain the back side image of the wafer to be tested exposed through the opening.

[0006] It can be understood that the carrier is used to support the fork stage group, and then support the wafer placed on the fork stage group. When the wafer is placed on the fork stage group, it is supported by at least two support surfaces on the adsorption forks, and the corresponding limit surfaces are against the edge side walls of the wafer to achieve stable fixation of the wafer. After the wafer is fixed, the detection component under the carrier is used to obtain the image information of the back side of the wafer, and the lighting component under the carrier is used to emit illumination light to the wafer to illuminate the field of view of the first image collector. At this time, it is precisely because the carrier is provided with a through opening, and the bearing space is set along the central axis of the opening, so that the back side of the wafer is fully exposed to ensure the detection range and detection accuracy. Therefore, the wafer back side detection structure provided in the present application does not need to be provided with a manipulator for flipping, which simplifies the structure and reduces costs; and, there is no need for flipping operation during the back side detection process, which simplifies the process and improves the detection efficiency.

[0007] In some embodiments, each of the adsorption fork platforms is provided with an adsorption groove and an air duct connected to the corresponding adsorption groove, the adsorption groove is recessed from the corresponding support surface along the central axis direction, and each of the adsorption grooves is arranged in an arc shape surrounding the opening; and / or, the bearing component also includes a driving group, the driving group includes at least two driving mechanisms, each of the driving mechanisms is connected to one of the adsorption fork platforms, and is used to drive the corresponding adsorption fork platform to move closer to or away from the central axis.

[0008] In some of the embodiments, each of the adsorption forks is constructed with at least two of the adsorption grooves spaced apart around the central axis, and each of the adsorption grooves corresponds to an air duct; the central angle α corresponding to each of the adsorption grooves is between 8 degrees and 15 degrees; and / or, among at least two of the adsorption grooves, the central angle β corresponding to the arc formed by the adsorption groove at the head end and the adsorption groove at the tail end opposite to each other is between 35 degrees and 60 degrees.

[0009] In some embodiments, the detection component also includes a supporting substrate for supporting the lighting assembly and the first image collector; the wafer back side detection structure also includes a test box, a support frame is provided in the test box, the support frame has a first support platform and a second support platform arranged at intervals in the vertical direction, the first support platform is arranged above the second support platform, the supporting platform is arranged on the first support platform, and the supporting substrate is arranged on the second support platform; a leveling mechanism is provided between the supporting platform and the first support platform and between the supporting substrate and the second support platform, and each of the leveling mechanisms is used to adjust the horizontality of the supporting platform or the supporting substrate.

[0010] In some embodiments, each of the leveling mechanisms includes a reference component and an adjustment component, which are arranged at intervals and connected to the carrier platform or the supporting substrate, and each group of the adjustment components is used to drive the corresponding carrier platform or the supporting substrate to generate an offset along the center axis direction.

[0011] In some embodiments, each group of the reference components includes a reference column supported on the first support platform or the second support platform and a limiting portion and a locking portion connected to the reference column, the limiting portion and the locking portion are arranged at intervals along the direction of the central axis, and the supporting platform and the supporting substrate are respectively clamped between the corresponding locking portion and the limiting portion; and / or, each group of the adjustment components includes an adjustment column, an adjustment seat provided on the adjustment column and a base supported on the first support platform or the second support platform, one end of the adjustment column is rotatably connected to the base, and the other end is passed through the supporting platform or the supporting substrate, the adjustment seat is supported on the lower surface of the supporting platform, and the adjustment seat can reciprocate relative to the adjustment column along the direction of the central axis to drive the supporting platform or the supporting substrate to move.

[0012] In some embodiments, the wafer back side detection structure also includes a test box and an ion wind component; the ion wind component, the bearing component and the detection component are all arranged in the test box; the ion wind component includes an ion wind rod and an air induction component, the ion wind rod and the air induction component are arranged on both sides of the bearing component along the central axis and are staggered in the horizontal direction, and the air induction component is located below the bearing component; the test box is provided with an air inlet near the ion wind rod, and an air outlet near the air induction component.

[0013] In some embodiments, the test box has an optical detection cavity and an electrical structure cavity which are connected up and down; the bearing component, at least a part of the ion wind component and at least a part of the detection component are installed in the optical detection cavity, an electrical structure is installed in the electrical structure cavity, and the air outlet is arranged at the bottom of the electrical structure cavity.

[0014] In some embodiments, the detection component includes a first light source and a reflective bowl, the first light source is arranged close to the supporting platform, and the reflective bowl is arranged between the first light source and the first image collector; the reflective bowl is arranged to be tapered from the first light source toward the first image collector, and the first light source is used to emit illumination light gathered by the reflective bowl to the wafer to be tested.

[0015] In some embodiments, the first light source includes a diffuse reflector plate and a plurality of lamp beads, the diffuse reflector plate is arranged in a ring shape surrounding the opening, the plurality of lamp beads are arranged on the diffuse reflector plate at intervals, and the direct direction of each lamp bead is arranged at an angle to the supporting surface.

[0016] The present application also provides a wafer appearance inspection device, including a wafer box structure, a conveying structure and the above-mentioned wafer back side inspection structure; the wafer back side inspection structure is used to inspect the back side of the wafer to be tested, the wafer box structure is used to store wafers, the wafer back side inspection structure and the wafer box structure are respectively arranged on the circumferential side of the conveying structure, and the conveying structure is used to transport the wafer between the wafer box structure and the wafer back side inspection structure.

[0017] It can be understood that the transport structure picks up the wafer in the wafer box structure and transports it to the wafer back detection structure for back detection. When performing back detection, the opening on the carrier and the through-carrying space are used to fully expose the back of the wafer to the field of view of the detection component, and the transport structure does not need to flip the wafer, thereby improving the detection efficiency.

[0018] In some embodiments, the transport structure includes a first moving component and a manipulator, the first moving component is used to drive the manipulator to reach into the wafer back side detection structure to pick up and place the wafer, the manipulator and the fork group can independently support the wafer to be tested so that the detection component can perform back side detection; the wafer appearance detection equipment also includes a control system, the control system is used to control the first image collector to collect the back side image of the wafer to be tested in a first state and a second state, respectively, and merge the back side images in the two states to form a final wafer back side image; wherein, in the first state, the manipulator is located in the field of view of the first image collector and supports the wafer to be tested, and the fork group exits the field of view of the first image collector; in the second state, the fork group is located in the field of view of the first image collector and supports the wafer to be tested, and the manipulator exits the field of view of the first image collector.

[0019] In some embodiments, the wafer appearance inspection equipment also includes an EFEM system and a detection system, which are arranged adjacent to or at intervals; the wafer back side detection structure, the wafer material box structure and the conveying structure are all arranged in the EFEM system, and the detection system is provided with a front side detection structure, and the conveying structure is used to convey the wafer between the wafer material box structure, the front side detection structure and the wafer back side detection structure; wherein, at least one of the wafer back side detection structure and the wafer material box structure is detachably connected to the EFEM system.

[0020] The present application also provides a control method for a wafer appearance inspection device, comprising the following steps:

[0021] Pick up the wafers at the wafer cassette structure and move them to the alignment station for wafer alignment;

[0022] The aligned wafer is transported to the front inspection structure, and after being fixed by the inspection base of the inspection system, the transport structure is controlled to withdraw from the inspection area, and the front inspection structure is used to perform front inspection;

[0023] The wafer after front-side inspection is transported to the wafer back-side inspection structure, fixed by the fork assembly, and then back-side inspection is performed using the inspection component;

[0024] After the inspection is completed, the wafer will be moved to the next process.

[0025] In some embodiments, the wafer after the front side inspection is transported to the wafer back side inspection structure, fixed by the fork assembly, and then back side inspection is performed using the inspection component, including:

[0026] Controlling the transport structure to pick up the wafer at the front detection structure and move it to the carrying component;

[0027] When it is detected that a wafer is placed on the carrier component, vacuum adsorption is turned on to fix the wafer;

[0028] Control the handling structure to evacuate the inspection area, and conduct the first optical inspection of the inspection parts;

[0029] Control the transport structure to move to the inspection area, turn off the vacuum adsorption of the carrying component and switch to positive pressure drive, and the transport structure picks up the wafer;

[0030] Each adsorption fork is controlled to move in a direction away from the central axis to evacuate the detection area, and the detection component is subjected to a second optical inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 A first schematic diagram of a wafer backside detection structure provided in the present application;

[0033] Figure 2 A first partial schematic diagram of a wafer backside detection structure provided in the present application;

[0034] Figure 3 A second partial schematic diagram of the wafer backside detection structure provided in the present application;

[0035] Figure 4 A cross-sectional view of the wafer backside detection structure provided in this application;

[0036] Figure 5 A first schematic diagram of a bearing component in a wafer backside inspection structure provided in the present application;

[0037] Figure 6 A second schematic diagram of a bearing component in a wafer backside inspection structure provided in the present application;

[0038] Figure 7 for Figure 6 A schematic diagram of the suction fork platform in the load-bearing component provided;

[0039] Figure 8 for Figure 5 A top view of the suction fork platform in the load-bearing component is provided;

[0040] Fig. 9 for Figure 8 Cross-section of the middle AA;

[0041] Fig.10 for Figure 5 A first schematic diagram of the cooperation between the suction fork platform and the driving mechanism in the load-bearing component is provided;

[0042] Fig.11 for Figure 5 A second schematic diagram of the cooperation between the suction fork platform and the driving mechanism in the load-bearing component provided;

[0043] Fig.12 for Figure 5 A cross-sectional view of the cooperation between the carrying platform and the leveling mechanism in the carrying component provided;

[0044] Fig.13 for Fig.12 A partial schematic diagram of a reference component in a leveling mechanism is provided;

[0045] Fig.14 for Fig.12 A partial schematic diagram of an adjustment component in a leveling mechanism is provided;

[0046] Fig.15 A schematic diagram of a wafer appearance inspection device provided for this application;

[0047] Fig.16 A top view of the wafer appearance inspection device provided in this application;

[0048] Fig.17 The first image collector of the present application collects the back side image of the wafer in the second state;

[0049] Fig.18 The first image collector of the present application collects the back side image of the wafer in the first state;

[0050] Fig.19 This is the final wafer back side image after fusion of this application.

[0051] Figure numerals: 11, bearing component; 12, detection component; 13, test box; 14, leveling mechanism; 15, ion wind component; 21, carrying platform; 22, positioning component; 31, first moving component; 32, manipulator; 33, robot arm; 41, second image collector; 42, second light source; 51, alignment structure; 52, first box; 61, third box; 62, second moving component; 63, detection base; 100, wafer back side detection structure; 111, bearing platform; 112, fork platform group; 113, drive group; 114, detection group; 12 1. lighting assembly; 122. first image collector; 123. support substrate; 124. macro lens; 131. support frame; 132. extension section; 133. partition; 134. bottom plate; 141. reference assembly; 142. adjustment assembly; 151. ion wind rod; 152. air induction member; 200. wafer material box structure; 300. handling structure; 321. pick-up support seat; 400. front detection structure; 500. EFEM system; 600. detection system; 700. interaction module; 1110. opening; 1120. adsorption fork platform; 112 1. Support surface; 1122. Limiting surface; 1123. Adsorption groove; 1124. Airway; 1124a. Horizontal section; 1124b. Vertical section; 1125. Air hole; 1126. Assembly hole; 1127. Extension; 1130. Driving mechanism; 1131. Fixing platform; 1132. Connecting column; 1133. Driving member; 1134. Adapter; 1135. Guide member; 1136. Limiting baffle; 1137. Buffer member; 1141. Proximity switch; 1142. Trigger sheet; 1211. First light source; 1212. Reflecting bowl; 123 1. Support arm; 1301. Air inlet; 1302. Air outlet; 1303. Inner cavity; 1303a. Optical detection cavity; 1303b. Electrical structure cavity; 1304. Outer cavity; 1305. Second window; 1311. First support platform; 1312. Second support platform; 1320. Extension cavity; 1330. Air outlet; 1411. Reference column; 1411a. Large diameter section; 1411b. Small diameter section; 1412. Limiting part; 1413. Locking part; 1421. Adjusting column; 1422. Adjusting seat; 1423. Base; 3210. Notch. DETAILED DESCRIPTION

[0052] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0053] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0054] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0055] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0056] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0057] See also Figures 1 to 7An embodiment of the present application provides a wafer backside detection structure 100, including a carrying component 11 and a detection component 12. The carrying component 11 is used to carry a wafer to be tested, and the carrying component 11 includes a carrying platform 111 with an opening 1110 and a fork platform group 112 arranged on the carrying platform 111, and the fork platform group 112 includes at least two adsorption forks 1120 arranged at intervals around the opening 1110. Each adsorption fork platform 1120 has a supporting surface 1121 and a limiting surface 1122 set at an angle, and at least two supporting surfaces 1121 and corresponding limiting surfaces 1122 are jointly arranged to form a bearing space that passes through the central axis of the opening 1110. The detection component 12 includes an illumination component 121 and a first image collector 122 disposed below the carrier component 11 and corresponding to the opening 1110. The illumination component 121 is used to generate illumination light and incident on the back side of the wafer to be tested (hereinafter referred to as the wafer) through the opening 1110. The first image collector 122 is used to obtain the back side image of the wafer exposed through the opening 1110. The central axis direction of the opening 1110 is the Z-axis direction.

[0058] It can be understood that the carrier 111 is used to support the fork stage group 112, and further can support the wafer placed on the fork stage group 112. When the wafer is placed on the fork stage group 112, the wafer is supported by the support surface 1121 on at least two spaced-apart adsorption forks 1120, and the corresponding limiting surfaces 1122 can abut against the edge side wall of the wafer, thereby achieving stable fixation of the wafer. After the wafer is fixed, the lighting assembly 121 under the carrier 111 is used to emit illumination light to the wafer to illuminate the field of view of the first image collector 122. At this time, it is precisely because the carrier 111 is provided with a through opening 1110, and the fork stage group 112 is used to support the bearing space of the wafer and is arranged through along the Z-axis direction, so that the back of the wafer is fully exposed to the illumination range of the illumination light and the field of view of the first image collector 122, ensuring the detection range and detection accuracy. In this process, there is no need to set up a robot for flipping, which simplifies the structure and reduces costs. In addition, there is no need for flipping operations during the back side inspection process, which simplifies the process and improves inspection efficiency.

[0059] Among them, each suction fork platform 1120 is constructed with a limiting step (not shown in the figure), and the limiting step includes a limiting surface 1122 along the vertical direction and a supporting surface 1121 along the horizontal direction, so the limiting surface 1122 can limit the edge of the wafer to prevent the wafer from shifting in the horizontal direction. Each limiting step can be set in an arc shape, and the corresponding supporting surface 1121 and limiting surface 1122 are also set in an arc shape, which improves the adaptability with the wafer, increases the limiting range, and improves the accuracy.

[0060] In some specific embodiments, there are two adsorption fork platforms 1120, which are arranged at an interval of 180°; or, there are three adsorption fork platforms 1120, which are arranged at an interval of 120°; or, there are four adsorption fork platforms 1120, which are arranged at an interval of 90°. It is sufficient as long as it can stably support the wafer and reduce the offset.

[0061] like Figures 7 to 10 As shown, in an optional embodiment, each adsorption fork platform 1120 is provided with an adsorption groove 1123 and an air channel 1124 connected to the corresponding adsorption groove 1123, and the adsorption groove 1123 is recessed downward from the corresponding support surface 1121 along the Z-axis direction, and each adsorption groove 1123 is arranged in an arc shape surrounding the opening 1110. Take the example of two adsorption fork platforms 1120 being provided and arranged oppositely and at intervals along the Y-axis direction. When in use, when the wafer is supported on the support surface 1121, the adsorption groove 1123 is connected to the pneumatic source through the air channel 1124 to vacuum adsorb the wafer; and the limiting surface 1122 is limited to the edge of the wafer. In this way, the wafer can be stably fixed and the horizontal displacement of the wafer can be reduced.

[0062] Specifically, an air hole 1125 is constructed in the adsorption groove 1123, one end of the air hole 1125 is connected to the air channel 1124, and the other end is connected to the corresponding adsorption groove 1123, and the end of the air channel 1124 away from the air hole 1125 is connected to the pneumatic source. The air channel 1124 can be formed by opening a hole on the adsorption fork platform 1120. The air channel 1124 includes a horizontal section 1124a and a vertical section 1124b, which are connected and arranged at an angle. The end of the horizontal section 1124a away from the vertical section 1124b is connected to the corresponding air hole 1125, and the vertical section 1124b is used to connect the gas connector. It can be understood that the horizontal section 1124a penetrates along the Y-axis direction to the side of the adsorption fork platform 1120 away from the air hole 1125, and a plug is installed at the end to ensure sealing and avoid air leakage. The vertical section 1124b is connected to the gas supply pipe of the pneumatic source through the gas connector. The vertical section 1124b extends upward in the vertical direction to transfer the access point of the airway 1124 to the vertical direction, making it easier to connect the gas connector from above the adsorption fork platform 1120, thereby avoiding interference between the assembly of the gas connector and the drive acting on the adsorption fork platform 1120 and the detection component 12 located below the adsorption fork platform 1120.

[0063] Furthermore, each adsorption fork platform 1120 is constructed with at least two adsorption grooves 1123 arranged at intervals around the Z axis. In this way, the adsorption and fixing range of each adsorption fork platform 1120 relative to the wafer is increased, further improving the fixing effect and preventing the wafer from easily shifting. For example, each adsorption fork platform 1120 is provided with two adsorption grooves 1123 arranged at intervals around the Z axis, and the two adsorption grooves 1123 are respectively arranged at the two ends of the circumference of the adsorption fork platform 1120, and are dispersedly arranged to meet the requirements of stable support when the number of adsorption forks 1120 is small.

[0064] When the adsorption fork 1120 is needed to fix the wafer, negative pressure is generated at each adsorption groove 1123 for vacuum adsorption; when the robot 32 is needed to pick up the wafer, positive pressure can be generated at at least one adsorption groove 1123 to drive the wafer to break the adsorption state, facilitate subsequent handling, and reduce the wear on the wafer. The adsorption groove 1123 is connected to a vacuum pump to generate negative pressure and an air compressor to generate positive pressure. Alternatively, among at least two adsorption grooves 1123, negative pressure is generated at at least one adsorption groove 1123, and positive pressure is generated at at least another adsorption groove 1123. When the wafer is fixed by vacuum adsorption, positive pressure can be used to cause the wafer to suspend and reduce the wear between the wafer and the supporting surface 1121. It is worth noting that when the wafer is supported and fixed by the adsorption fork 1120, it cannot exceed the height of the limit surface 1122 to avoid deviation. Among them, the control of positive and negative pressures can change the flow direction by setting a solenoid valve.

[0065] It should be noted that the number of adsorption slots 1123 on each adsorption fork platform 1120 should not be too large, as too many adsorption slots may affect the structural strength of the adsorption fork platform 1120. At the same time, the number of adsorption slots 1123 is also related to the arc length of the adsorption fork platform 1120 around the central axis and the arc length of a single adsorption slot 1123.

[0066] like Figure 8 As shown, in an optional embodiment, the central angle α corresponding to each adsorption groove 1123 is between 8 degrees and 15 degrees. Such a setting is equivalent to limiting the arc length of each adsorption groove 1123 around the central axis. The arc length of each adsorption groove 1123 should not be too small or too large. If it is too small, the safe adsorption range cannot be guaranteed, and there will be problems of unstable fixation; and when the adsorption groove 1123 is too small, the required number will increase, and it is inconvenient to process. If it is too large, the range of air that needs to be sucked in each adsorption groove 1123 increases, increasing the cost. Therefore, it is necessary to limit the arc length of each adsorption groove 1123 to ensure a sufficient and safe adsorption range to improve the fixing stability; and, the wafer can be firmly fixed under a relatively small suction force to reduce costs. In some specific embodiments, the central angle of each adsorption groove 1123 can be 8 degrees, 10 degrees, 12.5 degrees or 15 degrees.

[0067] like Figure 8 As shown, further, among the at least two adsorption grooves 1123 on each adsorption fork platform 1120, the center angle β of the arc formed by the adsorption groove 1123 at the head end and the adsorption groove 1123 at the tail end is between 35 degrees and 60 degrees. Taking the adsorption fork platform 1120 placed horizontally as an example, the first adsorption groove 1123 clockwise around the Z axis is the adsorption groove 1123 at the head end, and the last adsorption groove 1123 is the adsorption groove 1123 at the tail end.

[0068] Take two adsorption grooves 1123 as an example. Such a setting is equivalent to limiting the total range of each adsorption fork 1120 fixed relative to the wafer. If the total range is too large, it is equivalent to the larger the arc length of the adsorption fork 1120. Since each fork group 112 includes at least two adsorption forks 1120, there may be a waste of resources. Of course, if the total range is too small, it also means that the arc length of the adsorption fork 1120 is too small, which affects the fixation and adsorption range of a single adsorption fork 1120; and, a total range that is too small will cause the distance between the positive pressure and the negative pressure to be closer, making it inconvenient to adjust the action mode. In some specific embodiments, the central angle β corresponding to the arc formed by the adsorption groove 1123 at the head end and the adsorption groove 1123 at the tail end is 35 degrees, 45 degrees, 55 degrees or 60 degrees.

[0069] Alternatively, if three adsorption grooves 1123 are provided on each adsorption fork platform 1120, taking the adsorption fork platform 1120 placed horizontally as an example, the first adsorption groove 1123 in the clockwise direction around the central axis is the adsorption groove 1123 at the head end, and the third adsorption groove 1123 is the adsorption groove 1123 at the tail end.

[0070] See also Figure 5 and Figure 6 Exemplarily, the bearing component 11 further includes a driving group 113, and the driving group 113 includes at least two driving mechanisms 1130, each of which is connected to an adsorption fork platform 1120, and is used to drive the corresponding adsorption fork platform 1120 to move, specifically, to drive the corresponding adsorption fork platform 1120 to move toward or away from the central axis of the opening 1110. When moving toward, at least two adsorption forks 1120 can be used to carry and fix the wafer; when moving away, the wafer is canceled from being carried, moved out of the field of view of the first image collector 122, and other structures that interact with the wafer are avoided. At this time, the wafer should be picked up and fixed by a robot.

[0071] In actual use, the bearing component 11 includes at least two groups of fork platforms 112, each group of fork platforms 112 is surrounded by a bearing space, and the sizes of the bearing spaces are different. At least two groups of fork platforms 112 can be selected to cooperate with the driving group 113, and each driving mechanism 1130 can be detachably connected to an adsorption fork platform 1120 in any group of fork platforms 112 to drive the corresponding adsorption fork platform 1120 to move. Such a setting can also meet the requirements of bearing and adsorption fixation for wafers of different sizes. Among them, screws can be used to connect to the adsorption fork platform 1120 in each group of fork platforms 112 to achieve a detachable connection. Of course, snap fit can also be used. In actual use, each driving mechanism 1130 includes a fixed platform 1131 for connecting to the adsorption fork platform 1120, and the fixed platform 1131 is connected to two spaced-apart connecting columns 1132. Each adsorption fork platform 1120 is constructed with two spaced-apart assembly holes 1126, and the connecting columns 1132 are threadedly connected to the hole wall of the assembly hole 1126 to achieve a detachable connection with the fixed platform 1131.

[0072] like Figure 6 and Figure 7 As shown, in some embodiments, when the corresponding bearing space of the fork platform set 112 is small, the corresponding adsorption fork platform 1120 extends an extension portion 1127 toward the side away from the limiting step to compensate for the connection length compared to the fixed platform 1131. The extension portion 1127 is detachably connected to the fixed platform 1131.

[0073] See also Figure 5 , Figure 6 , Fig.10 and Fig.11 Optionally, each driving mechanism 1130 further includes a driving member 1133 and an adapter seat 1134. The driving member 1133 and the fixed platform 1131 are arranged on opposite sides of the adapter seat 1134 along the driving direction, and the driving end of the driving member 1133 passes through the adapter seat 1134 and is connected to the fixed platform 1131. A guide member 1135 is provided between the fixed platform 1131 and the adapter seat 1134, and can move under the action of the driving member 1133. The fixed platform 1131 is connected to the corresponding adsorption fork platform 1120. It can be understood that the guide member 1135 plays a role in moving guide, ensuring that each adsorption fork platform 1120 in each fork platform group 112 can make a linear motion. The adapter seat 1134 is connected to the bearing platform 111 as the installation reference of the driving mechanism 1130, and is used to support the driving member 1133. A floating head is installed between the driving member 1133 and the fixed platform 1131 to improve the safety of use. The driving member 1133 is a cylinder, and the piston rod of the cylinder passes through the adapter 1134 and is connected to the fixed platform 1131 through a floating head. Alternatively, the driving member 1133 can also be an electric push rod, which is only used as an example here.

[0074] In actual use, the guide member 1135 is inserted into the adapter seat 1134 and can move relative to the adapter seat 1134 along its own axis. For example, the guide member 1135 is a smooth guide shaft. Each driving mechanism 1130 also includes a limit baffle 1136 provided on the side of the adapter seat 1134 away from the fixed platform 1131. One end of the guide member 1135 is connected to the fixed platform 1131, and the other end is connected to the limit baffle 1136. When the driving member 1133 drives the fixed platform 1131 to move, the guide member 1135 drives the limit baffle 1136 to move synchronously under the action of the fixed platform 1131. The adapter seat 1134 is provided with a buffer member 1137 on at least one side along the moving direction of the fixed platform 1131, and the buffer member 1137 is used to abut against the fixed platform 1131 or the limit baffle 1136. In other words, the setting of the limit baffle 1136 can limit the driving of the driving member 1133 radially inward along the bearing space, ensuring that the extension is not too long to affect the wafer. In this process, the setting of the buffer 1137 can reduce the collision between the limit baffle 1136 and the fixed platform 1131 relative to the adapter 1134, thereby improving the driving stability. In some specific embodiments, buffers 1137 are provided on both sides of the adapter 1134, which are respectively buffered with the fixed platform 1131 and the limit baffle 1136. The buffer 1137 is made of rubber or other materials.

[0075] like Fig.11 As shown, further, the bearing component 11 also includes a detection group 114 arranged in the driving group 113, and each driving mechanism 1130 corresponds to a detection group 114, which is used to detect the model of the fork platform group 112. The detection group 114 includes a proximity switch 1141 and a trigger plate 1142, the trigger plate 1142 is connected to the side of the adsorption fork platform 1120 away from the limit step, and the proximity switch 1141 is installed on the side of the adapter 1134 away from the fixed platform 1131. The trigger plate 1142 can move with the corresponding adsorption fork platform 1120 to trigger the proximity switch 1141. Among them, there are two proximity switches 1141, which are arranged at intervals along the arc length direction of the adsorption fork platform 1120, one proximity switch 1141 corresponds to one model of the fork platform group 112, and the other proximity switch 1141 corresponds to another model of the fork platform group 112. Taking the example that each fork platform group 112 includes two adsorption fork platforms 1120, the model detection of the corresponding fork platform group 112 can be satisfied only when the trigger sheets 1142 corresponding to the two adsorption fork platforms 1120 respectively trigger the corresponding proximity switches 1141 at the same time.

[0076] In other embodiments, the detection group 114 can be used to detect the initial position of each fork stage group 112. At this time, two proximity switches 1141 in a detection group 114 can be triggered at the same time, and the triggering piece 1142 is U-shaped and has two vertical arms to respectively trigger the two proximity switches 1141. Such a setting can improve the position detection accuracy of a single adsorption fork stage 1120. This is only an example.

[0077] See also Figure 2 , Figure 5 , Figure 6 and Fig.12 As an exemplary example, the detection component 12 also includes a support substrate 123 for supporting the lighting assembly 121 and the first image collector 122. The wafer backside detection structure 100 also includes a test box 13, in which a support frame 131 is provided. The support frame 131 has a first support platform 1311 and a second support platform 1312 arranged at intervals along the Z-axis direction, and the first support platform 1311 is arranged above the second support platform 1312. The carrier 111 is arranged on the first support platform 1311, and the support substrate 123 is arranged on the second support platform 1312. A leveling mechanism 14 is provided between the carrier 111 and the first support platform 1311, and between the support substrate 123 and the second support platform 1312. Each leveling mechanism 14 is used to adjust the horizontality of the carrier 111 or the support substrate 123.

[0078] It can be understood that the carrier 111 supports the wafer through the fork stage group 112, which is convenient for the detection group 114 at the bottom to perform detection. Therefore, it is necessary to ensure that the support reference of the carrier 111 and the detection reference of the detection group 114 are level, so as to ensure the coaxiality of the wafer, the lighting assembly 121 and the first image collector 122 along the optical axis direction (Z-axis direction in this application). The higher the coaxiality, the better the imaging effect and the higher the detection accuracy. Therefore, the two leveling mechanisms 14 mentioned above can be used for adjusting the level of the carrier 111 and the supporting substrate 123 respectively to ensure the reference level of both.

[0079] Take the leveling mechanism 14 connected between the carrier 111 and the first support 1311 as an example. Figure 5 , Figure 6 and Fig.12As shown, in some embodiments, the leveling mechanism 14 includes a reference component 141 and an adjustment component 142, both of which are arranged at intervals and connected to the carrier 111, and the adjustment component 142 is used to drive the carrier 111 to generate an offset in the Z-axis direction. In other words, the adjustment component 142 is used to cause the carrier 111 to generate a certain offset in the vertical direction, so as to achieve the horizontal adjustment of the carrier 111; in this process, it is precisely because of the connection between the reference component 141 and the carrier 111 that the installation reference of the carrier 111 can be maintained, and no matter whether the carrier 111 is offset upward or downward in the Z-axis direction under the action of the adjustment component 142, the connection between the carrier 111 and the reference component 141 maintains the original reference. Moreover, it is precisely because of the interval arrangement of the reference component 141 and the adjustment component 142 that the two can not interfere with each other, that is, the reference is guaranteed, and the flatness adjustment is convenient. In this way, it can be ensured that the carrier 111 can be kept in the original position of the X-axis and the Y-axis during the leveling process, so that the overall position after leveling is not easy to be offset.

[0080] like Fig.12 and Fig.13 As shown, further, the reference assembly 141 includes a reference column 1411 supported on the first support platform 1311 and a limiting portion 1412 and a locking portion 1413 connected to the reference column 1411, the limiting portion 1412 and the locking portion 1413 are arranged at intervals along the Z-axis direction, and the carrier 111 is sandwiched between the locking portion 1413 and the limiting portion 1412. Specifically, the carrier 111 is configured with a reference hole for the reference column 1411 to penetrate, and the reference hole penetrates the carrier 111 along the Z-axis direction. The limiting portion 1412 can abut against the lower surface of the carrier 111, and the locking portion 1413 abuts against the upper surface of the carrier 111, thereby realizing the connection between the reference assembly 141 and the carrier 111, and ensuring the initial installation reference of the carrier 111. For example, the locking portion 1413 is threadedly connected to the reference column 1411. Such a setting facilitates the disassembly and assembly of the reference assembly 141 relative to the carrier 111. For example, the locking part 1413 rotates clockwise relative to the reference column 1411 to press on the upper surface of the carrier 111, and cooperates with the setting of the limiting part 1412 to lock the carrier 111 relative to the reference component 141 to achieve the assembly of the two; then, rotate counterclockwise to loosen. Conversely, rotate clockwise to loosen, and rotate counterclockwise to lock.

[0081] like Fig.13As shown, in some specific embodiments, the reference column 1411 includes a large diameter section 1411a and a small diameter section 1411b connected to one end of the large diameter section 1411a, and the end surface of the large diameter section 1411a facing the end of the small diameter section 1411b forms a limit portion 1412, and the small diameter section 1411b is penetrated through the bearing platform 111 and connected with the locking portion 1413. In this way, it is convenient to directly process the limit portion 1412 from the reference column 1411, which is convenient for production and manufacturing; and such a setting reduces the number of assembly parts and simplifies the assembly process. The end of the small diameter section 1411b away from the large diameter section 1411a is configured with an external thread to be threadedly connected with the locking portion 1413. The end of the large diameter section 1411a away from the small diameter section 1411b is connected to the first support platform 1311. Among them, the outer side wall of the part of the small diameter section 1411b penetrated through the reference hole is smooth. Compared with a direct threaded connection with the support platform 111 , such a configuration avoids deformation of the support platform 111 due to the restraint of the reference component 141 during adjustment.

[0082] like Fig.12 and Fig.14 As shown, further, the adjustment component 142 includes an adjustment column 1421, an adjustment seat 1422 arranged on the adjustment column 1421, and a base 1423 supported on the first support platform 1311. One end of the adjustment column 1421 is rotatably connected to the base 1423, and the other end is passed through the support platform 111. The adjustment seat 1422 is supported on the lower surface of the support platform 111, and the adjustment seat 1422 can reciprocate along the Z-axis direction relative to the adjustment column 1421 to drive the support platform 111 to move.

[0083] Specifically, the bearing platform 111 is also constructed with an adjustment hole that is set along the thickness direction of itself, and the adjustment column 1421 is penetrated in the adjustment hole. The setting of the adjustment seat 1422, on the one hand, satisfies the support of the bearing platform 111, and on the other hand, utilizes the movement of the adjustment seat 1422 relative to the adjustment column 1421 to drive the bearing platform 111 to shift in the vertical direction to achieve horizontal adjustment. At the same time, the rotational cooperation between the base 1423 and the adjustment column 1421 increases the degree of freedom of the adjustment position, avoiding the problem of poor adjustment or stuck due to the fixation of the reference component 141 during adjustment; and such a setting reduces the risk of deformation of the bearing platform 111 during the adjustment process. In actual use, when the adjustment seat 1422 moves upward relative to the adjustment column 1421 to push the bearing platform 111 upward; when the adjustment seat 1422 moves downward relative to the adjustment column 1421, the bearing platform 111 can move downward under its own weight and overlap on the adjustment seat 1422. In this way, the horizontal adjustment can be satisfied. The adjusting seat 1422 is threadedly connected to the adjusting column 1421 , and the adjusting seat 1422 can be rotated to move along the axial direction of the adjusting column 1421 to achieve horizontal adjustment of the supporting platform 111 .

[0084] In some specific embodiments, the base 1423 has a central axis arranged in the vertical direction, and the rotation offset of the adjustment column 1421 relative to the central axis of the base 1423 is less than or equal to 8 degrees. If the rotation offset of the adjustment column 1421 is small, the degree of freedom here will be weakened, and there will still be problems of poor adjustment and a small adjustment range; if the rotation offset of the adjustment column 1421 is large, it will lead to instability of stability, which is not convenient for the support platform 111 to stably support other structures. Therefore, it is necessary to limit the rotation offset of the adjustment column 1421 to ensure the degree of freedom within the safe range, not only to meet the larger range and higher degree of freedom adjustment, but also to maintain the good stability of the support platform 111. For example, the rotation offset of the adjustment column 1421 relative to the central axis of the base 1423 can be 5 degrees, 6 degrees, 7.5 degrees or 8 degrees.

[0085] like Fig.14 As shown, in actual use, one of the adjustment column 1421 and the base 1423 is configured with a mounting hole, and the other is configured with an insertion end, which is inserted into the mounting hole and cooperates with the spherical surface of the hole wall of the mounting hole to satisfy the rotation of the above-mentioned adjustment column 1421. For example, the base 1423 may be provided with a mounting hole concave downward in the vertical direction on one side facing the support platform 111, and the adjustment column 1421 may be configured with an insertion end to be inserted in the mounting hole. Alternatively, the base 1423 may be provided with an insertion end convexly on one side facing the support platform 111, and the end of the adjustment column 1421 may be provided with a mounting hole concave upward in the vertical direction to satisfy the cooperation between the insertion end and the mounting hole.

[0086] In another specific embodiment, the support platform 111 is provided with reference components 141 and multiple groups of adjustment components 142 at intervals along its circumference. On the one hand, the support stability of the support platform 111 is improved, and on the other hand, each group of adjustment components 142 can be adjusted separately to improve the adjustment accuracy. In this process, it is precisely because the adjustment column 1421 in each group of adjustment components 142 has a certain angle of rotation offset that the deformation of the support platform 111 can be reduced when each group of adjustment components 142 is adjusted.

[0087] It is worth noting that the arrangement of the leveling mechanism 14 on the supporting base plate 123 is substantially similar to that described above, except that the adjustment component 142 and the reference component 141 in the corresponding leveling mechanism 14 are respectively supported on the second support platform 1312 .

[0088] See also Figures 2 to 4As another example, the wafer backside detection structure 100 also includes a test box 13 and an ion wind component 15. The ion wind component 15, the bearing component 11 and the detection component 12 are all arranged in the cavity of the test box 13. The ion wind component 15 includes an ion wind rod 151 and an air induction member 152, which are arranged on both sides of the bearing component 11 along the Z-axis direction and staggered in the horizontal direction, and the air induction member 152 is arranged below the bearing component 11. The test box 13 is provided with an air inlet 1301 near the ion wind rod 151, and an air outlet 1302 near the air induction member 152.

[0089] It can be understood that the ion wind rod 151 is used to blow ion wind toward the wafer supported on the support platform 111, neutralize the charge on the wafer, and achieve the effect of eliminating static electricity. The air inlet 1301 sends fresh air flow to the cavity of the test box 13, mixes with the ion wind blown by the ion wind rod 151, and is discharged from the air outlet 1302 of the box under the action of the air induction member 152. In this process, it is precisely because the air induction member 152 is located below the support platform 111, which is equivalent to generating an airflow from top to bottom in the test box 13. Positive pressure can be used to act on the wafer to ensure that the neutralized ion wind is discharged while stabilizing the support of the wafer and improving the support stability of the wafer. At the same time, the air induction member 152 and the ion wind rod 151 are staggered, so that the ion wind sent out by the ion wind rod 151 needs to flow in the horizontal direction at least before it can be discharged through the air induction member 152, which increases the flow path of the ion wind, ensures that the ion wind is in more sufficient contact with the wafer, and improves the neutralization effect. Figure 4 For example, the ion wind bar 151 is disposed above the support platform 111 and located on the left, and the air induction member 152 is disposed below the support platform 111 and located on the right. Therefore, the ion wind sent by the ion wind bar 151 must flow to the right after blowing to the wafer, and can be discharged through the air induction member 152. Figure 4 The arrow in the middle shows the direction of air flow.

[0090] The air inducing member 152 may be a fan, and at least two air inducing members 152 may be arranged at intervals along the axial direction (Y-axis direction) of the ion wind rod 151 to improve the air inducing efficiency and exhaust performance.

[0091] like Figure 4As shown, further, the ion wind rod 151 is arranged obliquely above the support platform 111, and the ion air outlet of the ion wind rod 151 faces the support surface of the support platform 111. Among them, the ion wind rod 151 and the air induction member 152 are staggered along the X-axis direction as an example. Such an arrangement makes the ion wind rod 151 tilted relative to the support surface 1121 in the support component 11, so that the ion wind sent through the ion wind rod 151 has a certain angle relative to the support surface 1121, which is more conducive to full contact with the wafer. Specifically, the support platform 111 is horizontally arranged, and the angle between the ion wind rod 151 and the support surface 1121 is an acute angle, which can be between 20°-70°, for example, 20°, 35°, 45°, 58°, 65° or 70°. This is just an example.

[0092] like Figure 1 and Figure 4 As shown, further, an extension section 132 is provided on one side of the test box 13 close to the ion wind rod 151, and the extension section 132 extends upward along the Z-axis direction. An extension cavity 1320 is surrounded by the extension section 132, and an opening is left at the top of the extension section 132 to form an air inlet 1301, and the ion wind rod 151 is located between the extension cavity 1320 and the cavity. Alternatively, a second window 1305 is provided on one side wall of the test box 13 close to the ion wind rod 151 along the X-axis direction, serving as the air inlet 1301, and the second window 1305 can also serve as a material loading and unloading port of the wafer backside detection structure 100.

[0093] Please continue reading Figures 2 to 4 Optionally, the test box 13 has an optical detection chamber 1303a and an electrical structure chamber 1303b which are connected to each other from top to bottom. The optical detection chamber 1303a is equipped with a bearing component 11, an ion wind component 15 and at least part of the detection component 12. The electrical structure chamber 1303b is equipped with an electrical structure (not shown), such as an AC / DC power supply structure, a light source controller and a vacuum switching solenoid valve assembly. The air outlet 1302 is arranged at the bottom of the electrical structure chamber 1303b. The fresh airflow introduced through the air inlet 1301 of the box body flows to the optical detection chamber 1303a, mixes with the ion wind and acts on the wafer in the optical detection chamber 1303a to neutralize the charge on the wafer; the neutralized ion wind flows through the optical detection chamber 1303a and then flows to the electrical structure chamber 1303b, and then flows from the air outlet 1330 to the external chamber 1304, and then is discharged from the air outlet 1302 of the box body. Such a configuration can prevent impurities or heat in the electrical structure cavity 1303 b from entering the optical detection cavity 1303 a and affecting the detection performance of the detection component 12 as much as possible.

[0094] Specifically, a partition 133 is provided in the test box 13, and the partition 133 divides the cavity of the test box 13 into an inner cavity 1303 and an outer cavity 1304 connected to the external environment, and the inner cavity 1303 is divided into an optical detection cavity 1303a and an electrical structure cavity 1303b connected up and down. The air outlet 1302 is provided in the outer cavity 1304 to achieve the connection between the outer cavity 1304 and the external environment; the air inlet 1301 is provided in the inner cavity 1303 to meet the requirements of the fresh air flow. The partition 133 is constructed with an air outlet 1330 connecting the inner cavity 1303 and the outer cavity 1304, and the air induction member 152 is provided corresponding to the air outlet 1330. The provision of the air outlet 1330, on the one hand, facilitates the discharge of the ion wind after the charge neutralization with the wafer in the inner cavity 1303 to the outer cavity 1304, and then discharged from the air outlet 1302; on the other hand, it can guide the flow of the neutralized ion wind in an orderly manner, and allow the part of the partition 133 except the air outlet 1330 to still be assembled with other structures, such as the assembly of electrical structures.

[0095] In actual use, the electrical structure is installed on the side of the partition 133 facing the inner cavity 1303, and the air induction member 152 is installed on the side of the partition 133 facing the outer cavity 1304. The air outlet 1330 and the ion wind rod 151 are staggered in the horizontal direction so that the air outlet 1330 is offset relative to the electrical structure to fully avoid the electrical structure. At the same time, a bottom plate 134 is provided below the partition 133, and the air outlet 1302 is provided on the bottom plate 134, so that the heat transferred from the electrical structure to the partition 133 can be fully dissipated to the bottom plate 134 and dissipated from the air outlet 1302. The partition 133 and the bottom plate 134 are both installed on the support frame 131 in the test box 13. The support frame 131 includes a plurality of cross beams and a plurality of vertical beams, which are spliced ​​into a quadrangular prism shape, and a plurality of cross beams spaced along the Z-axis direction can be provided between the topmost cross beam and the bottommost cross beam. The first support platform 1311 and the second support platform 1312 can both be formed by a crossbeam. The outer side of the support frame 131 is also covered with a box shell, and the bottom plate 134 is a part of the box shell. The box shell can be made of sheet metal splicing, and a sealing strip is pressed at the splicing. Rollers are also provided at the bottom of the test box 13 for easy transportation.

[0096] Please continue reading Figures 2 to 4, another option, for the lighting assembly 121 in the detection component 12, it includes a first light source 1211 and a reflective bowl 1212. The first light source 1211 is arranged close to the carrier 111, and the reflective bowl 1212 is arranged between the first light source 1211 and the first image collector 122. The first light source 1211 is used to emit the illumination light collected by the reflective bowl 1212 to the wafer to be tested, and the reflective bowl 1212 is gradually arranged from the first light source 1211 toward the first image collector 122, and is used to reflect the illumination light of the first light source 1211, so that the back side of the wafer can be illuminated more evenly and stably, thereby improving the lighting effect. The end of the reflective bowl 1212 facing away from the first light source 1211 is supported on the aforementioned supporting substrate 123, and the supporting substrate 123 is constructed with a through avoidance hole, which is beneficial for the first image collector 122 to collect the back image of the wafer. A support arm 1231 extending downward along the Z-axis direction is provided on the support substrate 123, and the support arm 1231 is connected to the first image collector 122. In this way, the assembly of the detection component 12 relative to the test box 13 can be realized. The support substrate 123 divides the inner cavity 1303 into an optical detection cavity 1303a and an electrical structure cavity 1303b. The first image collector 122 is arranged in the electrical structure cavity 1303b, which is convenient for connection with other electrical structures. Of course, the first image collector 122 can also be placed in the optical detection cavity 1303a as an optical element. The first image collector 122 can use a high-resolution array metrology camera, and a macro lens 124 is connected to its collection end for adjusting the imaging focal length. The reflective bowl 1212 and the first light source 1211 are both arranged in the optical detection cavity 1303a to illuminate the back of the wafer. Alternatively, the part of the reflective bowl 1212 facing the first image collector 122 can also pass through the support substrate 123 and extend into the electrical structure cavity 1303b.

[0097] Furthermore, the first light source 1211 includes a diffuse reflector plate and a plurality of lamp beads, the diffuse reflector plate is arranged in a ring shape around the opening 1110, and the plurality of lamp beads are arranged at intervals on the diffuse reflector plate, and the direct direction of each lamp bead is set at an angle to the support surface 1121 of the adsorption fork platform 1120. In other words, the first light source 1211 adopts an annular light source to minimize the lighting blind spot; and the annular light source is arranged around the opening 1110 on the supporting platform 111 and is located on the outer peripheral side of the opening 1110 to ensure the lighting range. Among them, the diffuse reflector plate is arranged at an angle, so that the direct direction of each lamp bead is set at an angle with the support surface 1121, for example, 0°-45°, to increase the lighting range. Specifically, the angle between the direct direction of each lamp bead and the support surface can be 0°, 15°, 28°, 36° or 45°, etc.

[0098] See also Figure 2 , Figure 5 , Fig.15 and Fig.16Another embodiment of the present application provides a wafer appearance inspection device, including a wafer material box structure 200, a handling structure 300 and the above-mentioned wafer backside inspection structure 100. The wafer backside inspection structure 100 is used to inspect the back side of the wafer, the wafer material box structure 200 is used to store the wafer, the wafer backside inspection structure 100 and the wafer material box structure 200 are respectively arranged on the peripheral side of the handling structure 300, and the handling structure 300 is used to transport the wafer between the wafer material box structure 200 and the wafer backside inspection structure 100.

[0099] In actual use, the transport structure 300 can pick up the wafers in the wafer box structure 200, transport them to the wafer back detection structure 100 for back detection, and then transport the detected wafers to the wafer box structure 200 for storage, or transport them to other unloading locations or other processes. When performing back detection, the opening 1110 on the carrier 111 and the penetrating bearing space are used to fully expose the back of the wafer to the field of view of the detection component 12, without the need for the transport structure 300 to flip the wafer, thereby improving detection efficiency.

[0100] Please continue reading Figure 2 , Figure 5 , Fig.15 and Fig.16 Exemplarily, the transport structure 300 includes a first moving component 31 and a manipulator 32. The first moving component 31 is used to drive the manipulator 32 to extend into the wafer back side detection structure 100 to pick up and place the wafer. The manipulator 32 and the fork stage group 112 can independently support the wafer so that the detection component 12 can perform back side detection. The wafer appearance detection equipment also includes a control system, which is used to control the first image collector 122 to collect the back side image of the wafer in the first state and the second state, respectively, and fuse the back side images in the two states to form a final wafer back side image. In the first state, the manipulator 32 is located in the field of view of the first image collector 122 and supports the wafer, and the fork stage group 112 withdraws from the field of view of the first image collector 122; in the second state, the fork stage group 112 is located in the field of view of the first image collector 122 and supports the wafer to be tested, and the manipulator 32 withdraws from the field of view of the first image collector 122.

[0101] It can be understood that when the wafer is fixed by the adsorption fork 1120 on the carrier 111, the bottom edge of the wafer overlaps the support surface 1121, and the back image acquired by the first image collector 122 is blocked by the adsorption fork 1120, resulting in an imperfect image (such as Fig.17 Therefore, the robot 32 is required to fix the wafer, and each suction fork 1120 is away from the wafer, so that the edge of the wafer is fully exposed and the back image is acquired again (such as Fig.18 Then, the two images are stitched together to obtain a complete back image (i.e., Fig.19 The final wafer back side image). When fusion is performed, it can be done by cutting and splicing.

[0102] It should be noted that in order to transfer the wafer between the wafer back detection structure 100 and the wafer material box structure 200, the wafer appearance inspection equipment will inevitably use the manipulator 32 to pick up and place the wafer. In other words, there will inevitably be a state where the manipulator 32 is located in the field of view of the first image collector 122. The present application only needs to withdraw the adsorption fork 1120 and increase the wafer back exposure time once (μs level) to obtain the wafer back image, and then merge it with the wafer back image obtained in the second state to obtain a complete wafer back image. It can be seen that the present application does not require an additional back detection device, nor does it need to rotate the wafer before shooting. It only needs to increase the wafer exposure time once (i.e., the exposure time in the first state), and then perform image processing to obtain a complete wafer back image, thereby improving the efficiency of wafer back detection and image integrity (here it is assumed that the image must be collected with the exposure time in the second state, because any wafer back optical inspection device must be exposed at least once to obtain a wafer image).

[0103] like Fig.15 and Fig.16 As shown, optionally, the wafer appearance inspection device further includes an EFEM system 500 and an inspection system 600, which are arranged adjacently or at intervals. The wafer backside inspection structure 100, the wafer material box structure 200 and the transport structure 300 are all arranged in the EFEM system 500, and the inspection system 600 is provided with a front inspection structure 400, and the transport structure 300 is used to transport the wafer between the wafer material box structure 200, the front inspection structure 400 and the wafer backside inspection structure 100; wherein, at least one of the wafer backside inspection structure 100 and the wafer material box structure 200 is detachably connected to the EFEM system 500.

[0104] Among them, the EFEM system 500 mainly includes a wafer loading device, a wafer handling robot and an alignment structure 51. In the semiconductor production process, wafers need to be frequently switched between environments with different cleanliness levels, and during the switching process, it is necessary to ensure that the wafers are not attached and affected by particles. Therefore, the wafer loading device serves as the input and output of the wafer environment conversion to realize the wafer handling between the track of the production workshop and the wafer appearance inspection equipment. The wafer handling robot is used to pick up wafers for transportation between different workstations. Among them, the wafer handling robot can be the aforementioned handling structure 300.

[0105] The wafer material box structure 200 and the wafer back detection structure 100 are both detachably connected to the EFEM system 500, which is convenient for disassembly, assembly and replacement. For example, when the wafer back detection structure 100 is needed, it can be installed in the EFEM system 500; when the wafer back detection structure 100 is not needed, it can be disassembled and replaced with another wafer material box structure 200. Among them, the wafer material box structure 200 and the wafer back detection structure 100 are both installed on the side of the EFEM system 500 away from the detection system 600, thereby avoiding the interference of the detection system 600 and the front detection structure 400 caused by the disassembly and assembly operation of the wafer material box structure 200 and the wafer back detection structure 100 relative to the EFEM system 500.

[0106] Alternatively, only the wafer backside inspection structure 100 may be detachably connected to the EFEM system 500 ; or only the wafer material box structure 200 may be detachably connected to the EFEM system 500 .

[0107] In some specific embodiments, the front detection structure 400 and the wafer back detection structure 100 are arranged on both sides of the transport structure 300 along the X-axis direction, and the wafer box structure 200 is arranged on the same side as the wafer back detection structure 100, and is arranged at intervals along the Y-axis direction. Among them, the wafer box structure 200 can also be set into two, and arranged at intervals along the Y-axis direction, one wafer box structure 200 is used to provide wafers to be inspected, and the other wafer box structure 200 is used to collect wafers after inspection. Alternatively, the front detection structure 400 and the wafer box structure 200 are arranged on both sides of the transport structure 300 along the X-axis direction, and the wafer back detection structure 100 is arranged on one side of the transport structure 300 along the Y-axis direction. This is only an example.

[0108] like Figure 1 , Fig.15 and Fig.16 As shown, in actual use, the arrangement of the EFEM system 500 and the detection system 600 along the X-axis direction is taken as an example. The EFEM system 500 includes a first box body 52 enclosed to form a first cavity, and the first box body 52 is configured with two first windows arranged in an axial direction and connected to the first cavity at one side away from the detection system 600 along the X-axis direction. The test box 13 in the wafer back side detection structure 100 is configured with a second window 1305 connected to the optical detection cavity 1303a. The second window 1305 is arranged toward and connected to one of the first windows. In this way, it is convenient for the transport structure 300 to transport the wafer in the first box body 52 from the first window and the second window 1305 to the test box 13.

[0109] Further, the detection system 600 includes a third box 61 that is surrounded by a third cavity. The sides of the third box 61 and the first box 52 facing each other can be set to be open, so that the third cavity and the first cavity are connected, so that the handling structure 300 can carry the wafer between the first cavity and the third cavity. Alternatively, the third box 61 can be configured with a third window connected to the third cavity on one side facing the EFEM system 500 along the X-axis direction, and the first box 52 can be configured with a fourth window connected to the first cavity on one side facing the detection system 600 along the X-axis direction. The fourth window is arranged and connected to the third window, and the handling structure 300 transfers the wafer between the third cavity and the first cavity through the third window and the fourth window. Another alternative is that the detection system 600 and the EFEM system 500 can also share a box, that is, the first box 52 and the third box 61 are an integrated structure. This is only an example.

[0110] Furthermore, the EFEM system 500 is also connected to an interaction module 700 to facilitate human-computer interaction.

[0111] like Fig.16 As shown, optionally, the alignment structure 51 in the EFEM system 500 is used to calibrate the wafer posture, and the transport structure 300 can transport the wafer calibrated by the alignment structure 51 to the front detection structure 400 and the wafer back detection structure 100 for appearance inspection. In other words, the transport structure 300 can first pick up the wafer in the wafer box structure 200, transport it to the alignment structure 51 for wafer posture calibration, and then the transport structure 300 is started again to pick up the wafer and transport it to the front detection structure 400 for front detection; after the front detection, the transport structure 300 is started again to transport the wafer to the wafer back detection structure 100 for back detection. Of course, it is also possible to first transport the wafer calibrated by the alignment structure 51 to the wafer back detection structure 100, and then transport the wafer after the back detection to the front detection structure 400.

[0112] Furthermore, the alignment structure 51 includes an alignment base having a first axis and a third image collector, the third image collector is arranged above the alignment base, and the alignment base is configured to rotate around the first axis in response to the acquisition information of the third image collector. It can be understood that the alignment base is used to support and position the wafer, and then the alignment base can rotate around the first axis to drive the wafer to rotate. In this process, the third image collector obtains the image information of the wafer, which is convenient for adjusting the wafer to the target posture. The third image collector can be a camera. Among them, a first adsorption portion is constructed on one side of the alignment base for supporting the wafer to fix the wafer by vacuum adsorption.

[0113] In actual use, a notch is provided on the edge of the wafer. Before alignment, the position of the notch is uncertain, so it is necessary to use the alignment structure 51 to locate the notch position on the edge of the wafer and rotate the notch direction to a specified direction. Specifically, after the wafer is fixed relative to the alignment base, the third image collector obtains wafer image information, obtains the notch position on the edge of the wafer, and then rotates the alignment base by a corresponding angle to adjust the notch direction to a specified direction.

[0114] The specific structure of the alignment structure 51 is an existing mature technology and is only used as an example here.

[0115] like Fig.16 As shown, as some of them are exemplary, the detection system 600 also includes a second moving component 62 and a detection base 63, the front detection structure 400 includes a second image collector 41, the second image collector 41 is arranged above the detection base 63, the detection base 63 is arranged on the second moving component 62, and moves relative to the second image collector 41 under the action of the second moving component 62. Among them, the detection base 63 is constructed with a second adsorption portion, and the vacuum adsorption of the second adsorption portion is used to act on the wafer. In actual use, the transport structure 300 transports the wafer to the detection base 63, and fixes and positions it via the detection base 63; then, the second moving component 62 drives the detection base 63 to move to adjust the position relative to the second image collector 41; and, during the detection process, the wafer can also be driven to move to capture multiple segments of image information to improve the detection accuracy.

[0116] The second moving assembly 62 includes an X-axis linear module and a Y-axis linear module to achieve movement along the X-axis direction and the Y-axis direction. The second image collector 41 can also be a camera. In actual use, the front detection structure 400 also includes a second light source 42 for illuminating the collection field of view of the second image collector 41.

[0117] like Fig.15 and Fig.16As shown, in some embodiments, the wafer material box structure 200 includes a loading platform 21, a material box carrier and a positioning component 22, and the material box carrier is limited to the loading platform 21 by the positioning component 22. The loading platform 21 is connected to the aforementioned EFEM system 500 and is used to support the material box carrier. It can be understood that the material box carrier is used to carry a material box loaded with wafers, and is limited to the loading platform 21 by the positioning component 22 to ensure stability when taking and placing wafers. The positioning component includes a positioning clamping arm provided on the loading platform 21 and a fixed clamping block provided on the material box carrier, and the extended end of the fixed clamping block is configured with a hook back portion, and the fixed clamping block is clamped and fixed with the positioning clamping arm through the hook back portion. At the same time, the positioning component also includes a positioning column provided on the loading platform 21 and a positioning block provided on the material box carrier, and the positioning block is configured with a socket, and the positioning column can be inserted and positioned with the positioning block through the socket. There are multiple positioning blocks arranged at intervals, and each positioning block corresponds to a positioning column. In this way, the positioning and assembly of the material box carrier relative to the carrying platform 21 can be satisfied, so that the transport structure 300 can be convenient for taking and placing the wafer. This is only an example.

[0118] In some specific embodiments, the interactive module 700 includes an operation keyboard and a display. The image information collected by the first image collector 122, the second image collector 41 and the third image collector are all transmitted to the interactive module 700 and displayed via the display for easy viewing by the operator. At the same time, the operation keyboard facilitates the operator to apply operation instructions to achieve operation control. Further, the EFEM system 500 and the detection system 600 both include an electric control box, which is arranged at the bottom and has an electrical structure installed therein; and the control system mentioned above is also arranged in the electric control box.

[0119] like Fig.16As shown, in actual use, the manipulator 32 at least includes a pick-up support seat 321 and a plurality of adsorbents, the pick-up support seat 321 is configured with a notch 3210, and a plurality of adsorbents are arranged at intervals on the pick-up support seat 321 and are arranged around the outer peripheral side of the notch 3210. The pick-up support seat 321 is connected to the first moving component 31. Among them, the first moving component 31 also includes an X-axis linear module and a Y-axis linear module, and the first moving component 31 also includes a Z-axis linear module, which is convenient for the manipulator 32 to carry the wafer along the X-axis direction, the Y-axis direction and the Z-axis direction to realize the handling, picking and placing of the wafer between each module. For example, the X-axis linear module can be connected to the power output end of the Y-axis linear module, the Z-axis linear module can be connected to the power output end of the X-axis linear module, and the pick-up support seat 321 can be connected to the power output end of the Z-axis linear module. The setting of the adsorbent is used to vacuum adsorb the wafer to reduce the wear on the wafer. The notch 3210 on the pick-up support seat 321 is provided to reduce the interference between the robot 32 and other structures when picking up and placing the wafer, for example, to reduce the interference between the robot 32 and the alignment structure 51. The notch 3210 is provided in a semicircular shape. When the alignment structure 51 uses a calibrator to calibrate the wafer posture, the semicircular notch 3210 just matches the periphery of the calibrator, and the center of the semicircular notch 3210 coincides with the center of the calibrator.

[0120] In actual use, the pick-up support seat 321 is arranged in a plate shape. The material box for storing wafers has a storage cavity and a plurality of support tables arranged in the storage cavity. The plurality of support tables are arranged in groups of two, and the plurality of groups of support tables are arranged at intervals along the Z-axis direction, and each group of support tables is used to carry a wafer. Therefore, the aforementioned plate-shaped pick-up support seat 321 can just extend into the gap between any two adjacent groups of support tables to adsorb the corresponding wafer.

[0121] Furthermore, the transport structure 300 further includes a robot arm 33 connected between the first moving component 31 and the robot arm 32 .

[0122] It should be added that the aforementioned linear modules are all existing mature technologies and will not be described in detail here.

[0123] Please continue reading Figure 1 , Figure 2 , Figure 5 , Fig.15 and Fig.16 The present application once again provides a control method for a wafer appearance inspection device, which can be used for front-side inspection and back-side inspection. The control method includes the following steps:

[0124] S10: Pick up the wafer at the wafer material box structure 200 and move it to the alignment station to perform wafer alignment;

[0125] S20: The aligned wafer is transported to the front inspection structure 400, and after being fixed by the inspection base 63 of the inspection system 600, the transport structure 300 is controlled to withdraw from the inspection area, and the front inspection structure 400 is used to perform front inspection;

[0126] S30: The wafer after the front side inspection is transported to the wafer back side inspection structure 100, fixed by the fork assembly 112, and then the back side inspection is performed by the inspection component 12;

[0127] S40: After the inspection is completed, the wafer is moved to the next process.

[0128] The wafer after the front side inspection is transported to the wafer back side inspection structure 100, fixed by the fork stage group 112, and then the back side inspection is performed by the inspection component 12, including:

[0129] S31: Control the transport structure 300 to pick up the wafer at the front detection structure 400 and move it to the carrying component 11;

[0130] S32: when it is detected that a wafer is placed on the carrier 11, vacuum adsorption is turned on to fix the wafer;

[0131] S33: Control the transport structure 300 to evacuate the detection area (the second state at this time), and the detection component 12 performs the first optical inspection;

[0132] S34: Control the transport structure 300 to move to the inspection area and pick up the wafer, turn off the vacuum adsorption of the carrier 11 and switch to positive pressure drive;

[0133] S35: Control each suction fork 1120 to move away from the central axis to leave the detection area (this is the first state), and the detection component 12 performs a second optical inspection.

[0134] It should be noted that the above-mentioned second optical inspection is performed when taking the wafer, and in other embodiments it can also be performed when placing the wafer, that is: when the wafer is moved to the position of the supporting component 11 in step S31 (at this time the fork assembly 112 needs to exit the field of view of the first image collector 122), the first optical inspection is performed first, and after the first optical inspection is completed, the fork assembly 112 is extended to receive the wafer, and the subsequent steps except S35 remain unchanged.

[0135] When the wafer is stored in the wafer material box structure 200, the manipulator 32 in the transport structure 300 moves to the wafer material box structure 200 under the action of the first moving component 31. The manipulator 32 extends into the material box placed in the wafer material box structure 200 under the action of the mechanical arm 33, and absorbs and picks up a wafer through the manipulator 32, and then transports it to the alignment structure 51. When in the alignment structure 51, the alignment base in the alignment structure 51 absorbs and fixes the wafer through the first adsorption part. After the wafer is stably fixed, the transport structure 300 moves away from the alignment structure 51 to avoid causing operational interference with the alignment structure 51. The third image collector on the alignment base captures the image information of the wafer, and then the alignment base rotates the corresponding angle to adjust the wafer to the target posture. After reaching the target posture, the transport structure 300 is started again, and the manipulator 32 is used to absorb and pick up the wafer, and it is transported to the front detection structure 400.

[0136] In the front detection structure 400, the detection base 63 is adjusted to the target position under the action of the second moving component 62, and the wafer is fixed by the second adsorption part. After the wafer is stably fixed, the transport structure 300 moves away from the detection base 63 to evacuate the acquisition range of the second image collector 41 and the movement range of the detection base 63. Then the second light source 42 is turned on to illuminate the acquisition field of view of the second image collector 41, and the detection base 63 moves under the action of the second moving component 62 until the second image collector 41 captures multiple front images of the wafer. After the front detection is completed, the transport structure 300 picks up the wafer and moves it to the wafer back detection structure 100. The control system receives multiple front images of the second image collector 41 and splices them to form a final front image. Of course, a complete front image can also be obtained with a single shot.

[0137] When the wafer backside inspection structure 100 is in progress, each suction fork 1120 moves toward the direction close to the central axis of the opening 1110, so that the edge of the wafer overlaps the support surface 1121, and the suction groove 1123 is used to suction and fix the wafer, and the limiting part 1412 is used to press against the edge of the wafer to achieve the temperature fixation of the wafer. After the wafer is fixed, the transport structure 300 moves out of the field of view of the first image collector 122, the lighting component 121 illuminates the back side of the wafer, and the first image collector 122 obtains the back side image of the wafer, that is, the first optical inspection; then, the manipulator 32 of the transport structure 300 moves into the field of view of the first image collector 122 and picks up the wafer again, keeping the wafer still in the field of view of the first image collector 122, and each suction fork 1120 moves toward the direction away from the central axis of the opening 1110 to move out of the field of view of the first image collector 122, and the first image collector 122 obtains the back side image of the wafer again, that is, the second optical inspection. After the two optical inspections are completed, the transport structure 300 transports the wafer to the next process, and after the control system receives the two optical inspection image information transmitted by the first image collector 122, it can merge them into the final wafer back side image.

[0138] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0139] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A wafer backside detection structure, characterized in that: include: A bearing component (11) for bearing a wafer to be tested, comprising a bearing platform (111) having an opening (1110) and a fork platform group (112) arranged on the bearing platform (111), wherein the fork platform group (112) comprises at least two adsorption forks (1120) arranged at intervals around the opening (1110), each of the adsorption forks (1120) having a supporting surface (1121) and a limiting surface (1122) arranged at an angle, and at least two of the supporting surfaces (1121) and the corresponding limiting surfaces (1122) are jointly arranged to form a bearing space that passes through the central axis of the opening (1110); The detection component (12) comprises an illumination component (121) and a first image collector (122) arranged below the supporting component (11) and corresponding to the opening (1110), wherein the illumination component (121) is used to generate illumination light and to be incident on the back side of the wafer to be tested through the opening (1110), and the first image collector (122) is used to obtain an image of the back side of the wafer to be tested exposed through the opening (1110).

2. The wafer backside detection structure according to claim 1, characterized in that: Each of the adsorption fork platforms (1120) is provided with an adsorption groove (1123) and an air passage (1124) connected to the corresponding adsorption groove (1123); the adsorption groove (1123) is recessed from the corresponding support surface (1121) along the central axis direction, and each of the adsorption grooves (1123) is arranged in an arc shape surrounding the opening (1110); and / or, The bearing component (11) further comprises a driving group (113), wherein the driving group (113) comprises at least two driving mechanisms (1130), each of the driving mechanisms (1130) being connected to one of the adsorption fork platforms (1120) and being used for driving the corresponding adsorption fork platform (1120) to move towards or away from the central axis.

3. The wafer backside detection structure according to claim 2, characterized in that: Each of the adsorption fork platforms (1120) is constructed with at least two adsorption grooves (1123) arranged at intervals around a central axis, and each of the adsorption grooves (1123) corresponds to an air channel (1124); The central angle α corresponding to each of the adsorption grooves (1123) is between 8 degrees and 15 degrees; and / or, among at least two of the adsorption grooves (1123), the central angle β corresponding to the arc formed by the adsorption groove (1123) at the head end and the adsorption groove (1123) at the tail end opposite to each other is between 35 degrees and 60 degrees.

4. The wafer backside detection structure according to claim 1, characterized in that: The detection component (12) further comprises a supporting substrate (123) for supporting the lighting assembly (121) and the first image collector (122); The wafer backside inspection structure (100) further comprises a test box (13), wherein a support frame (131) is provided in the test box (13), wherein the support frame (131) comprises a first support platform (1311) and a second support platform (1312) which are arranged at intervals in a vertical direction, wherein the first support platform (1311) is arranged above the second support platform (1312), the carrying platform (111) is arranged on the first support platform (1311), and the supporting substrate (123) is arranged on the second support platform (1312); A leveling mechanism (14) is provided between the carrying platform (111) and the first supporting platform (1311), and between the supporting substrate (123) and the second supporting platform (1312), and each of the leveling mechanisms (14) is used to adjust the horizontality of the carrying platform (111) or the supporting substrate (123).

5. The wafer backside detection structure according to claim 4, characterized in that: Each of the leveling mechanisms (14) comprises a reference component (141) and an adjustment component (142), which are arranged at intervals and are both connected to the carrier platform (111) or the support substrate (123), and each group of the adjustment components (142) is used to drive the corresponding carrier platform (111) or the support substrate (123) to generate an offset along the central axis direction.

6. The wafer backside detection structure according to claim 5, characterized in that: Each group of the reference components (141) comprises a reference column (1411) supported on the first support platform (1311) or the second support platform (1312), and a limiting portion (1412) and a locking portion (1413) connected to the reference column (1411), wherein the limiting portion (1412) and the locking portion (1413) are arranged at intervals along the direction of the central axis, and the supporting platform (111) and the supporting substrate (123) are respectively sandwiched between the corresponding locking portion (1413) and the limiting portion (1412); and / or, Each group of the adjustment components (142) includes an adjustment column (1421), an adjustment seat (1422) arranged on the adjustment column (1421), and a base (1423) supported on the first support platform (1311) or the second support platform (1312). One end of the adjustment column (1421) is rotatably connected to the base (1423), and the other end is passed through the support platform (111) or the support substrate (123). The adjustment seat (1422) is supported on the lower surface of the support platform (111) or the support substrate (123). The adjustment seat (1422) can reciprocate relative to the adjustment column (1421) along the direction of the central axis to drive the support platform (111) or the support substrate (123) to move.

7. The wafer backside detection structure according to claim 1, characterized in that: The wafer backside detection structure (100) further comprises a test box (13) and an ion wind component (15); The ion wind component (15), the bearing component (11) and the detection component (12) are all arranged in the test box (13); The ion wind component (15) comprises an ion wind rod (151) and an air induction member (152); the ion wind rod (151) and the air induction member (152) are respectively arranged on both sides of the bearing component (11) along the central axis direction and are staggered in the horizontal direction; and the air induction member (152) is located below the bearing component (11); The test box (13) is provided with an air inlet (1301) near the ion wind rod (151), and is provided with an air outlet (1302) near the air induction member (152).

8. The wafer backside detection structure according to claim 7, characterized in that: The test box (13) comprises an optical detection cavity (1303a) and an electrical structure cavity (1303b) which are connected to each other in an upper and lower manner; The carrying component (11), the ion wind component (15) and at least part of the detection component (12) are installed in the optical detection cavity (1303a), an electrical structure is installed in the electrical structure cavity (1303b), and the air outlet (1302) is arranged at the bottom of the electrical structure cavity (1303b).

9. The wafer backside detection structure according to claim 1, characterized in that: The lighting assembly (121) comprises a first light source (1211) and a reflective bowl (1212), wherein the first light source (1211) is arranged close to the supporting platform (111), and the reflective bowl (1212) is arranged between the first light source (1211) and the first image collector (122); The reflective bowl (1212) is arranged to be gradually reduced from the first light source (1211) toward the first image collector (122), and the first light source (1211) is used to emit illumination light collected by the reflective bowl (1212) toward the wafer to be tested.

10. The wafer backside detection structure according to claim 9, characterized in that: The first light source (1211) comprises a diffuse reflector plate and a plurality of lamp beads, the diffuse reflector plate being arranged in a ring shape surrounding the opening (1110), the plurality of lamp beads being arranged on the diffuse reflector plate at intervals, and the direct emission direction of each lamp bead being arranged at an angle to the support surface (1121).

11. A wafer appearance inspection device, characterized in that: The wafer appearance inspection device comprises a wafer material box structure (200), a transport structure (300) and a wafer back side inspection structure according to any one of claims 1 to 10; The wafer back side detection structure (100) is used to detect the back side of a wafer to be tested, and the wafer material box structure (200) is used to store wafers. The wafer back side detection structure (100) and the wafer material box structure (200) are respectively arranged on the peripheral sides of the transport structure (300), and the transport structure (300) is used to transport wafers to flow between the wafer material box structure (200) and the wafer back side detection structure (100).

12. The wafer appearance inspection device according to claim 11, characterized in that: The transport structure (300) comprises a first moving component (31) and a robot (32), wherein the first moving component (31) is used to drive the robot (32) to extend into the wafer backside detection structure (100) to pick up and place the wafer, and the robot (32) and the fork assembly (112) are respectively capable of independently supporting the wafer to be tested so that the detection component (12) can perform backside detection; The wafer appearance inspection device also includes a control system, which is used to control the first image collector (122) to collect the back image of the wafer to be tested in the first state and the second state respectively, and fuse the back images in the two states to form a final wafer back image; Wherein, in the first state, the manipulator (32) is located in the field of view of the first image collector (122) and supports the wafer to be tested, and the fork stage group (112) exits the field of view of the first image collector (122); in the second state, the fork stage group (112) is located in the field of view of the first image collector (122) and supports the wafer to be tested, and the manipulator (32) exits the field of view of the first image collector (122).

13. The wafer appearance inspection device according to claim 11, characterized in that: The wafer appearance inspection device further comprises an EFEM system (500) and a detection system (600), which are arranged adjacently or spaced apart; The wafer backside detection structure (100), the wafer material box structure (200) and the transport structure (300) are all arranged in the EFEM system (500); the detection system (600) is provided with a front detection structure (400); the transport structure (300) is used to transport wafers to flow between the wafer material box structure (200), the front detection structure (400) and the wafer backside detection structure (100); Wherein, at least one of the wafer backside detection structure (100) and the wafer material box structure (200) is detachably connected to the EFEM system (500).

14. A control method for wafer appearance inspection equipment, characterized in that: The following steps are involved: Picking up the wafer at the wafer material box structure (200) and transporting it to the alignment station to perform wafer alignment; The aligned wafer is transported to the front detection structure (400), and after being fixed by the detection base of the detection system (600), the transport structure (300) is controlled to withdraw from the detection area, and the front detection structure (400) is used to perform front detection; The wafer after the front side inspection is transported to the wafer back side inspection structure (100), fixed by a fork assembly (112), and then back side inspection is performed using an inspection component (12); After the inspection is completed, the wafer will be moved to the next process.

15. The control method according to claim 14, characterized in that: The wafer after the front side inspection is transported to the wafer back side inspection structure (100), fixed by a fork stage group (112), and then back side inspection is performed using an inspection component (12), including: Controlling the transport structure (300) to pick up the wafer at the front detection structure (400) and move it to the carrying component (11); When it is detected that a wafer is placed on the carrier component (11), vacuum adsorption is turned on to fix the wafer; Controlling the transport structure (300) to withdraw from the detection area, and the detection component (12) to perform a first optical inspection; Controlling the transport structure (300) to move to the detection area, turning off the vacuum adsorption of the carrying component (11) and switching to positive pressure drive, so that the transport structure (300) picks up the wafer; Each adsorption fork platform (1120) is controlled to move in a direction away from the central axis to evacuate the detection area, and the detection component (12) performs a second optical inspection.

Images