Alignment method of detection equipment and detection equipment

Abstract

The invention provides an alignment method of detection equipment and the detection equipment, and the alignment method comprises the following steps: carrying out the coarse alignment of a to-be-detected object through a mechanical alignment module, and enabling an alignment mark on the surface of the to-be-detected object to be located in the field of view of an optical alignment module; after the coarse alignment, the optical alignment module is used to carry out fine alignment on the to-be-measured object, so that the to-be-measured object is located at a predetermined position. Before the substrate is detected, the direction of the substrate can be adjusted through the mechanical alignment module, the optical alignment module and the bearing table, so that the long side direction of the substrate and the movement direction of the bearing table are consistent, namely, the first direction, and therefore missing detection of a full-detection module can be reduced, and the detection accuracy is effectively improved.

Description

[0001] This application is a divisional application of a Chinese patent application entitled “A detection method, an alignment method for a detection device, and a detection device”, with patent application number 201910944507.5 and application date September 30, 2019. Technical Field

[0002] The present application belongs to the technical field of display panel detection, and in particular, relates to an alignment method of a detection device and a detection device. Background Art

[0003] At present, with the development of technology, OLED is used in high-end display devices because of its advantages of being lighter, brighter, lower power consumption, faster response, higher definition, better flexibility, and higher luminous efficiency. At the same time, the quality requirements of OLED are relatively high. In order to improve the quality of OLED display devices and the production yield, it is necessary to perform defect detection on the OLED substrate during the production process to ensure product quality and production yield. However, due to the large size of OLED, how to improve the detection speed and accuracy of OLED substrates is a problem that needs to be solved urgently. Summary of the invention

[0004] The purpose of the present application is to overcome the deficiencies of the above-mentioned prior art and to provide an alignment method of a detection device and a detection device, which are intended to solve the problem of low accuracy in the existing detection of display substrates.

[0005] The present invention provides an alignment method for a detection device, wherein the detection device comprises a mechanical alignment module and an optical alignment module, and the alignment method for the detection device comprises the following steps:

[0006] Using the mechanical alignment module to perform rough alignment on the object to be measured, the surface of the object to be measured has an alignment mark, and the alignment mark is located in the field of view of the optical alignment module;

[0007] After the rough alignment, the optical alignment module is used to perform fine alignment on the object to be measured so that the object to be measured is at a predetermined position.

[0008] Optionally, the detection device comprises a carrying platform, comprising a carrying area for carrying the object to be tested; the mechanical alignment module comprises a plurality of alignment rollers arranged at the periphery of the carrying area;

[0009] The method of using the mechanical alignment module to roughly align the object to be measured so that the alignment mark is located in the field of view of the optical alignment module comprises the following sub-steps:

[0010] The alignment roller is moved toward the object to be measured until it moves to a preset position and clamps the outer edge of the object to be measured.

[0011] Optionally, the optical alignment module includes at least one optical alignment probe, the alignment mark group includes at least two standard points, and after the rough alignment, fine alignment of the object to be measured using the optical alignment module so that the object to be measured is in a predetermined position includes the following sub-steps:

[0012] photographing the alignment mark by using the optical alignment probe to obtain an alignment image of the alignment mark;

[0013] Acquire the position information of the standard point according to the alignment image;

[0014] Obtaining a position deviation of the object to be measured according to position information of at least two standard points;

[0015] The object to be measured is adjusted according to the position deviation so that the object to be measured is in a predetermined position.

[0016] Optionally, there are multiple optical alignment probes, and the multiple optical alignment probes include a first optical alignment probe and a second optical alignment probe; the alignment mark group includes a first alignment mark and a second alignment mark;

[0017] Acquiring the position information of the standard point according to the alignment image comprises: acquiring first position information of the center of the first alignment mark according to the alignment image of the first alignment mark; acquiring second position information of the center of the second alignment mark according to the alignment image of the second alignment mark;

[0018] The position deviation includes one or a combination of a translation offset and a rotation offset of the object to be measured; obtaining the position deviation of the object to be measured according to the position information of at least two standard points includes:

[0019] The translation offset of the object to be measured is obtained according to the offset between the first position information and the center of the field of view of the first optical alignment probe; and / or the rotation offset of the object to be measured is obtained according to the first position information and the second position information.

[0020] Optionally, the step of adjusting the object to be measured according to the position deviation so that the object to be measured is in a predetermined position includes:

[0021] Obtaining the required adjustment amount according to the position deviation of the object to be measured;

[0022] The object to be measured is adjusted until the center of the field of view of the optical alignment probe coincides with the center of the corresponding alignment mark.

[0023] The present invention also provides a detection device, the detection device comprising:

[0024] Mechanical alignment module and optical alignment module;

[0025] The mechanical alignment module is configured to perform a rough alignment on the object to be measured, and the surface of the object to be measured has an alignment mark, so that the alignment mark is located in the field of view of the optical alignment module;

[0026] After the optical alignment module is configured to perform the rough alignment, the optical alignment module is used to perform the fine alignment on the object to be measured so that the object to be measured is at a predetermined position.

[0027] Optionally, it includes a carrying platform, including a carrying area for carrying the object to be tested; the mechanical alignment module includes a plurality of alignment rollers arranged on the periphery of the carrying area; and a driving device is used to drive the alignment rollers to move toward the carrying area.

[0028] Optionally, the alignment mark group includes a first alignment mark and a second alignment mark; the number of the optical alignment probes is multiple, and the multiple alignment probes include a first optical alignment probe and a second optical alignment probe, the first optical alignment probe is used to capture an image of the first alignment mark, and the second optical alignment probe is used to capture an image of the second alignment mark.

[0029] The beneficial effects of the technical solution of the present application are as follows: since the detection device of the present application is provided with a mechanical alignment module and an optical alignment module, the direction of the substrate can be adjusted by the mechanical alignment module, the optical alignment module and the carrier before the substrate is detected, so that the long side direction of the substrate is consistent with the movement direction of the carrier, that is, both are in the first direction, thereby reducing the missed detection of the full inspection module and effectively improving the detection

[0030] accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 is a top view of the overall structure of the detection device provided in an embodiment of the present application;

[0033] Figure 2 It is a schematic diagram of the detection coverage area of ​​the re-inspection module of the detection device provided in the embodiment of the present application;

[0034] Figure 3 is a structural schematic diagram of a mechanical alignment module of a detection device provided in an embodiment of the present application;

[0035] Figure 4is a flow chart of an alignment method of a detection device provided in an embodiment of the present application;

[0036] Figure 5 is a flow chart of a rough alignment of an alignment method of a detection device provided in an embodiment of the present application;

[0037] Figure 6 is a structural schematic diagram of an optical alignment module of a detection device provided in an embodiment of the present application;

[0038] Figure 7 It is a schematic diagram of the precise alignment effect of the detection device provided in the embodiment of the present application;

[0039] Figure 8 is a flow chart of optical alignment of an alignment method of a detection device provided in an embodiment of the present application;

[0040] Fig. 9 It is a schematic diagram of the entire inspection process of the detection method provided in the embodiment of the present application;

[0041] Fig.10 is a flow chart of the detection method provided in the embodiment of the present application;

[0042] Fig.11 It is a flow chart of the re-inspection process of the detection method provided in the embodiment of the present application;

[0043] Fig.12 It is a schematic diagram of the process of deflection correction of the detection unit of the detection method provided in the embodiment of the present application;

[0044] Fig.13 is a schematic diagram of the start / end scanning signal of the detection unit of the detection method provided in the embodiment of the present application;

[0045] Fig.14 It is a schematic diagram of the process of combining the scanning detection process and the re-inspection process of the detection method provided in the embodiment of the present application;

[0046] Fig.15 It is a schematic diagram of the screening process of the detection method provided in the embodiment of the present application.

[0047] Description of Figure Numbers:

[0048] Label name Label name 10 substrate 22 Second translation stage 30 Detection unit 41 First re-test probe 42 Second re-test probe 511 First alignment mark 512 Second alignment mark 521 First optical alignment probe 522 Second optical alignment probe 60 Alignment roller 23 The third mobile platform DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0050] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0051] It should also be noted that the directional terms such as left, right, up and down in the embodiments of the present application are merely relative concepts or are based on the normal use status of the product, and should not be considered as restrictive.

[0052] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0053] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" indicate the position or location relationship based on the position or location shown in the drawings.

[0054] The relationship is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present application.

[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0056] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0057] The embodiments of the present application provide a detection method and a detection device for implementing the detection method.

[0058] See also Fig. 9 , Fig.10 as well as Fig.14 In a preferred embodiment, the present application proposes a detection method, comprising:

[0059] S1. Scan and inspect the object to be tested to obtain defect information of surface defects of the object to be tested;

[0060] S2. Screen and process defects according to defect information to obtain re-inspection defects;

[0061] S3. Re-inspect the re-inspected defect and obtain re-inspection information of the re-inspected defect.

[0062] It should be noted that in this embodiment, the object to be tested is specifically a substrate 10 of an OLED display screen, and the defects may be as follows: Fig.14 The star-shaped graph in the figure indicates that the substrate 10 is first scanned and inspected to obtain defect information, then the defect information is screened and processed to obtain re-inspected defects, and then the re-inspected defects are re-inspected. After multiple scanning and inspection processes and re-inspection processes, the purpose of avoiding missed inspections as much as possible and re-inspecting the screened defects can be achieved, which is conducive to improving the inspection speed and inspection accuracy of the substrate 10.

[0063] Furthermore, the steps of scanning, detecting and re-testing are repeated for different test areas of the object to be tested.

[0064] Furthermore, after the first scanning and detecting process is performed on the object to be detected, the steps of first screening process and re-testing process are performed.

[0065] Furthermore, the second and subsequent scanning and testing processes are performed in parallel with the retest process, and the scanning and testing processes are performed on the test area of ​​the test object.

[0066] For example, the defects not screened out in the first full scan can be combined with the defects obtained in the second full scan, and the defect value evaluation can be performed together to screen out the defects for re-inspection in the third full scan process. In this way, all defects on the substrate 10 can be obtained through repeated scanning, and the occurrence of missed detection can be effectively reduced, further improving the accuracy of detection. Moreover, the second and subsequent scanning detection processes are performed in parallel with the re-inspection process, which can also effectively improve the detection efficiency.

[0067] Furthermore, after all the test areas of the object to be tested have been scanned and inspected, it also includes: re-inspecting the re-inspected defects that have not been re-inspected. For example, after all the test areas of the object to be tested have been scanned and inspected, a number of N partial re-inspected defects have been obtained, but according to the preset re-inspection defect quantity index (the number is M, and M≥N), it is still necessary to re-shoot the remaining defects for a number of MN. Specifically, this process will evaluate the defect value in the set of all unscreened full inspection defect results, and finally screen out MN global optimal solutions, which are then sorted, and re-inspected and photographed in sequence according to the "move-stop-shoot" fixed-point shooting mode until all re-inspected defects are photographed.

[0068] See also Figures 1 to 3 The present invention also provides a detection device, the detection device comprising:

[0069] A carrying platform (not shown), used for carrying the object to be tested;

[0070] The full inspection module is used to scan the object to be tested to realize scanning inspection processing, obtain defect information of surface defects of the object to be tested, and screen and process the defects according to the defect information to obtain re-inspection defects;

[0071] A re-inspection module, used for re-inspecting the re-inspection defects; and,

[0072] The control system (not shown) is used to control the full inspection module and the re-inspection module to implement the inspection method as described above.

[0073] The first translation platform (not shown) is used to drive the supporting platform to translate along the first direction.

[0074] The second translation stage 22 is used to drive the full inspection module to translate along a second direction, and the first direction is not parallel to the second direction. Specifically, the first direction is perpendicular to the second direction or has an acute angle.

[0075] A third mobile platform 23, used to drive the re-inspection module to translate along a third direction, which is different from the first direction;

[0076] Specifically, in this embodiment, the third direction is the same as the second direction.

[0077] It should be noted here that the first direction and the second direction have a first angle, the object to be tested is a quadrilateral, the object to be tested includes a first side and a second side that intersect, the first side and the second side have a second angle, and the second angle is equal to the first angle; in addition, the detection equipment also includes a rotating table, which is used to drive the carrier to rotate around a rotation axis, the rotation axis is perpendicular to the first direction, and the rotation axis is perpendicular to the second direction, so that the second angle can be equal to the first angle, so as to facilitate subsequent detection. Specifically, the object to be tested can be a substrate 10 arranged in a rectangular shape, and its first angle and second angle are both right angles. The first angle and the second angle can also be acute angles. Specifically, in the above detection method, the scanning detection processing step includes: translating the object to be tested along the first direction by a first translation table, and detecting the object to be tested by a full inspection module;

[0078] After one scanning and detection process and before the next scanning and detection process, the method further includes: moving the full inspection module along the second direction by a predetermined distance.

[0079] See also Fig. 9 and Fig.14 In a preferred embodiment, the full inspection module includes a plurality of inspection units 30, the field of view of the inspection unit 30 is rectangular, the field of view includes adjacent third and fourth sides, and the length of the third side is greater than or equal to the fourth side.

[0080] Here, a plurality of detection units 30 are distributed at equal intervals along the second direction, and each detection unit 30 includes a full inspection scanning probe, which uses a linear array charge coupled device to implement scanning. Specifically, during a scanning process, the carrier platform gives low-latency start scanning and end scanning signals according to the position information. After receiving the start scanning signal, the full inspection scanning probe of each detection unit 30 will continuously expose and output images until receiving the end scanning signal and stopping exposure. After the first comprehensive scanning detection process, that is, the detection scanning of the field of view PASS1 of the full inspection scanning probe of the detection unit 30 is completed, all the full inspection scanning probes will move a predetermined distance along the second direction, that is, step to the position of the second comprehensive scanning detection process at the same time, change the scanning direction to continue scanning to complete PASS2, and so on PASS3 and PASS4, until all rounds of scanning are completed. In this way, it is conducive to the integrity of the full inspection scan, and can avoid the occurrence of missed detection due to incomplete coverage as much as possible, but the specific number of detection units 30, the size and number of field of view, etc. are related to the actual detection requirements.

[0081] In order to achieve better positioning accuracy, it is necessary to consider the impact of the delay in starting to collect signals on the position information of the image, the positioning error caused by the inconsistent scanning directions of two adjacent scanning detection processes, and the positioning error caused by the positioning accuracy of the substrate 10 and the carrier itself. Therefore, further, the detection areas of adjacent detection units 30 partially overlap; during two adjacent scanning detection processes, the field of view of the detection unit 30 partially overlaps in the second direction to correct the position deviation during multiple scanning detection processes. In other words, the field of view of all detection units 30 can be combined to cover the substrate 10 in the second direction, thereby avoiding missed detection to the greatest extent and effectively improving the detection accuracy. Since the angle deflection of the probe may occur during the installation and debugging of the full-inspection scanning probe, for this reason, before the scanning detection process, the detection method also includes: performing a second adjustment on the detection unit 30 so that the third side of the field of view of the detection unit 30 is perpendicular to the first direction, so that the detection unit 30 can be straightened. Specifically, as shown in FIG. Fig.12 As shown, the dotted rectangular box in the figure represents a certain detection unit 30, and the deflection angle of each detection unit 30 is different. On the premise that the substrate 10 has been aligned, the deflection angle can be calculated with the help of the alignment mark on the substrate 10, and then the adjustment mechanism of the detection unit 30 needs to be adjusted to align the detection unit 30.

[0082] like Fig.12 and Fig.13 As shown, different detection units 30 have a certain offset in the first direction, and the offset error will directly lead to the deviation of the starting position of the probe shooting. Due to the precision limitation of mechanical adjustment, it is further necessary to quantify the offset of the detection unit 30 in the first direction and perform position compensation through software algorithm. Therefore, before the scanning detection process, the detection method also includes:

[0083] Obtaining the offset of the field of view of each detection unit 30 along the first direction;

[0084] According to the offset, the movement range of the full inspection module along the first direction during the scanning inspection process is compensated.

[0085] Here, since there is an offset between the detection units 30 in the first direction, in order to ensure that all the detection units 30 can capture the complete substrate 10 in the first direction, the start scanning signal and the end scanning signal of the carrier stage need to comprehensively consider the positional relationship of the detection units 30. For example, Fig.12 The middle arrow indicates the moving direction of the substrate 10, the left part indicates that the detection unit 30 is about to start scanning the substrate 10, the right part indicates that the detection unit 30 has just finished scanning the substrate 10, and the left dotted line indicates the start signal position.

[0086] The dotted line on the right indicates the end signal position. It can be clearly seen from the figure that the start signal position is based on the position of the detection unit 30 that first photographs the substrate 10 area, and the end signal position is based on the position of the detection unit 30 that last completes photographing the substrate 10 area. For other probes, some invalid areas will be photographed, and these invalid areas will be selectively eliminated based on the position information, and no defect detection analysis will be performed.

[0087] In a preferred embodiment, in order to ensure imaging quality and positioning accuracy, before the first scanning and detection process of the object to be detected, the following steps are also included:

[0088] The position of the object to be measured is adjusted so that the object to be measured rotates around the rotation axis so that the first side is parallel to the first direction and the second side is parallel to the second direction.

[0089] In the technical solution of the present application, the defect information includes the location information of the defect;

[0090] Here, see Fig.11 , re-inspect the re-inspected defect, and obtaining the re-inspection information of the re-inspected defect includes the following steps:

[0091] S31, moving the object to be tested in a first direction at a preset speed;

[0092] S32, obtaining a re-inspection path for re-inspecting each re-inspection defect according to the location information of the re-inspection defect that has not been re-inspected, the preset speed, and the location of the re-inspection module;

[0093] S33, determining the next re-inspection defect to be re-inspected according to the re-inspection path as the defect to be re-inspected;

[0094] S34. According to the position information of the defect to be re-inspected, the re-inspection module is translated along the third direction, and the defect to be re-inspected is re-inspected.

[0095] It can be understood that by processing the position information of the defect, the preset speeds of the second translation stage 22 and the third mobile platform 23, and the position of the re-inspection module, a simpler re-inspection path can be obtained, which is beneficial to improving the inspection efficiency.

[0096] It should be noted that the first direction is perpendicular to the second direction; the third direction is perpendicular to the first direction. Specifically, the substrate 10 is rectangular and has two opposite long sides. The direction of the long sides is the length direction of the substrate 10. The moving direction of the substrate 10 during detection is the first direction. The direction perpendicular to the first direction on the horizontal plane is the second direction and the third direction. After the substrate 10 is aligned, the first direction

[0097] It is consistent with the length direction of the substrate 10, that is, the length direction of the substrate 10 is the first direction, and its width direction is the second direction; in addition, the second translation platform 22 and the third mobile platform 23 are installed on their respective corresponding gantries; wherein the second translation platform 22 is installed on the middle gantry, and the second translation platform 22 is provided with a full inspection module, and the second translation platform 22 drives the full inspection module to translate along the second direction; a third mobile platform 23 is installed on each of the other two gantries on both sides, and each third mobile platform 23 is provided with a re-inspection module, and the third mobile platform 23 drives the re-inspection module to translate along the third direction; the first translation platform drives the supporting platform carrying the substrate 10 to translate along the first direction relative to the full inspection module. Specifically, Fig. 9 and Fig.13 The solid rectangular frame in the figure represents a complete area of ​​the substrate 10, and the arrow direction represents the scanning direction of a scan along the first direction. The scanning directions of the multiple full inspection scanning probes included in the full inspection module are consistent in the same scan. Of course, the number of full inspection scanning probes, the number of scans, and the coverage of a probe do not represent the actual proportional relationship with the size of the substrate 10, and are only for the convenience of explanation.

[0098] See also Figure 1 and Figure 2 , the re-inspection module includes a plurality of re-inspection probes, and the movement ranges of the plurality of re-inspection probes along the third direction do not overlap;

[0099] Before obtaining the re-inspection path for re-inspecting each re-inspection defect, re-inspecting the re-inspection defect, the step of obtaining re-inspection information of the re-inspection defect further includes: allocating a re-inspection area to each re-inspection probe according to the moving range of the plurality of re-inspection probes, and the re-inspection probes re-inspect the re-inspection defects in their respective re-inspection areas;

[0100] Acquiring a re-inspection path for re-inspecting each re-inspection defect includes: planning a re-inspection path for each re-inspection probe according to location information of the re-inspection defect.

[0101] Specific as Figure 2 As shown, the re-inspection module includes two re-inspection probes, namely a first re-inspection probe 41 and a second re-inspection probe 42. The re-inspection area allocated to the first re-inspection probe 41 covers the right area of ​​the substrate 10, and the re-inspection area allocated to the second re-inspection probe 42 covers the left area of ​​the substrate 10. The two re-inspection areas are combined to cover the substrate 10 along a first direction, and the middle parts of the two parts overlap. In this way, the detection efficiency can be improved and missed detection will not occur.

[0102] In this embodiment, the multiple re-inspection probes are respectively located on different gantries, and the different gantries are arranged along the first direction.

[0103] It can be understood that in the technical solution of the present application, since at least two re-inspection modules are included, the efficiency of re-inspection and taking pictures is relatively high, and through the operation control of the control system, the technical purpose of simultaneously photographing two defects within a certain area can also be achieved. Here, the two re-inspection modules will each cover a part of the area to be inspected of the substrate 10, so compared with the design scheme in which one re-inspection probe covers the entire area of ​​the substrate 10, the movement distance of the substrate 10 of the present application in the first direction is shorter, so each scan can save a certain amount of scanning time, especially when multiple scans are performed, the time saving will be more considerable, thereby greatly improving the detection speed of the detection equipment. In addition, by obtaining the location information of the re-inspection defects and intelligently planning the re-inspection path, time can be effectively saved and the detection speed can be improved.

[0104] See also Fig.15 In a preferred embodiment, the screening process includes the following steps:

[0105] S21, screening out a preliminary defect set consisting of multiple defects according to the screening condition;

[0106] S22. Calculate the value of each single defect in the preliminary defect set;

[0107] S23, forming a defect sequence set arranged in descending order according to the value of all defects in the preliminary defect set;

[0108] S24, selecting a preset number of defects in the defect sequence set to form a maximum defect set;

[0109] S25. Re-inspect the defects in the maximum defect set.

[0110] Here, the value D of a single defect is calculated according to a preset formula, which is D=D1*D2+D3*D4; where D1 is the area of ​​the defect, D2 is the area weight of the defect, D3 is the average gray value of the defect image, and D4 is the average gray value weight of the defect image. In this way, through these conditions and screening processes, defects with more re-inspection value can be screened out more effectively, thereby improving the efficiency and accuracy of defect detection.

[0111] See also Figures 3 to 8 The present invention also provides an alignment method for a detection device, wherein the aforementioned detection device includes a mechanical alignment module and an optical alignment module, and the alignment method for the detection device includes the following steps:

[0112] S100, using a mechanical alignment module to roughly align the object to be measured, where the surface of the object to be measured has an alignment mark, and the alignment mark is located in the field of view of the optical alignment module;

[0113] S200 , after the rough alignment, use the optical alignment module to perform fine alignment on the object to be measured so that the object to be measured is at a predetermined position.

[0114] Specifically, the detection equipment includes the aforementioned supporting platform, mechanical alignment module and driving device (not shown); wherein, the supporting platform is used to carry the object to be tested, such as the substrate 10 in this embodiment; the mechanical alignment module includes a plurality of alignment rollers 60 arranged on the periphery of the supporting area; the driving device is used to drive the alignment rollers 60 to move toward the supporting area.

[0115] It can be understood that since the detection equipment of the present application is provided with a mechanical alignment module and an optical alignment module, before the substrate 10 is inspected, the direction of the substrate 10 can be adjusted by the mechanical alignment module, the optical alignment module and the supporting platform, so that the long side direction of the substrate 10 is consistent with the movement direction of the supporting platform, that is, both are the first direction, thereby reducing the missed detection of the full inspection module and effectively improving the accuracy of the detection.

[0116] Specifically, Figure 5 As shown, using the mechanical alignment module to roughly align the object to be measured so that the alignment mark is located in the field of view of the optical alignment module includes the following steps:

[0117] S210, moving the alignment roller 60 toward the object to be measured until it moves to a preset position and clamps the outer edge of the object to be measured.

[0118] Specifically, refer to Figure 3 There are eight alignment rollers 60 distributed around the substrate 10, that is, two alignment rollers 60 are provided outside each side, and the arrow represents the moving direction of each alignment roller 60. When the substrate 10 is placed on the moving table, the eight alignment rollers 60 will simultaneously move inward to a preset position and clamp the substrate 10. The positions of the eight alignment rollers 60 can form a rectangle, and its length-to-width ratio is consistent with the length-to-width ratio of the substrate 10. During the process of the eight alignment rollers 60 moving inward at the same time, the length-to-width ratio of the corresponding rectangle is kept unchanged, thereby achieving the technical purpose of aligning the substrate 10.

[0119] In addition, after this sub-step, the following steps are also included:

[0120] S220, turning on the vacuum adsorption device on the carrying platform to adsorb and fix the object to be tested on the carrying platform;

[0121] It can be understood that this arrangement can firmly fix the substrate 10 of the object to be tested and the carrier platform through vacuum adsorption, thereby facilitating subsequent optical alignment and scanning detection.

[0122] S230, all the alignment rollers 60 are released simultaneously to separate from the object to be tested.

[0123] It should be noted here that the key points of using the mechanical alignment module for coarse alignment are force, accuracy and synchronization.

[0124] First, in terms of force, during the clamping process of rough alignment, since the alignment roller 60 is a cylinder, its side surface is in direct point contact or line contact with the edge of the substrate 10, so the acceleration and speed of the alignment roller 60 should not be too large, and need to be adjusted to a suitable range. If the clamping force is too large, the substrate 10 will be locally subjected to greater pressure and easily broken; and if the acceleration and speed of the alignment roller 60 are set too small, the mechanical alignment process will take a long time, thereby affecting the overall detection efficiency of the detection equipment.

[0125] The second point is about precision. When all the alignment rollers 60 are in the clamping state, the gap between each alignment roller 60 and the substrate 10 must be within the specified target range (on the order of hundreds of microns), and cannot be too large or too small. If the gap is too large, the substrate 10 will not be properly aligned, and if the gap is too small, the substrate 10 may be easily damaged. In addition, there are strict requirements on the repeatability of the clamping position of each alignment roller 60. The repeatability of the position of the alignment roller 60 itself determines the repeatability of the alignment of the substrate 10.

[0126] The third point is about synchronization, that is, during the rough alignment process, each alignment roller 60 needs to move synchronously, the clamping synchronization requirement is higher, and the release synchronization requirement is lower; and each alignment roller 60 starts to move and clamp at the same time, so that the edge of the substrate 10 can be more evenly stressed and the action execution efficiency is higher.

[0127] See also Figures 5 to 8 In a preferred embodiment, the optical alignment module includes at least one optical alignment probe, which can be provided with an alignment mark group and includes at least two standard points. After the rough alignment, the optical alignment module is used to perform fine alignment on the object to be measured so that the object to be measured is in a predetermined position, which includes the following sub-steps:

[0128] S310, photographing the alignment mark by using an optical alignment probe to obtain an alignment image of the alignment mark;

[0129] S320, acquiring position information of the standard point according to the alignment image;

[0130] S330, obtaining a position deviation of the object to be measured according to position information of at least two standard points;

[0131] S340, adjusting the object to be measured according to the position deviation so that the object to be measured is in a predetermined position.

[0132] Specifically, the alignment mark group includes a first alignment mark 511 and a second alignment mark 512; there are multiple optical alignment probes, including a first optical alignment probe 521 and a second optical alignment probe 522, the first optical alignment probe 521 is used to capture an image of the first alignment mark 511, and the second optical alignment probe 522 is used to capture an image of the second alignment mark 512. The first optical alignment probe 521 and the second optical alignment probe 522 are arranged at intervals along the second direction, and the first alignment mark 511 and the second alignment mark 512 are also arranged at intervals along the second direction.

[0133] Wherein, acquiring the position information of the standard point according to the alignment image includes: acquiring the first position information of the center of the first alignment mark 511 according to the alignment image of the first alignment mark 511; acquiring the second position information of the center of the second alignment mark 512 according to the alignment image of the second alignment mark 512;

[0134] The position deviation includes the translation offset and / or rotation offset of the object to be measured; obtaining the position deviation of the object to be measured based on the position information of at least two standard points includes: obtaining the translation offset of the object to be measured based on the offset between the first position information and the center of the field of view of the first optical alignment probe 521; and / or obtaining the rotation offset of the object to be measured based on the first position information and the second position information.

[0135] Here, the step of adjusting the object to be measured according to the position deviation so that the object to be measured is in a predetermined position includes:

[0136] Obtain the required adjustment amount based on the position deviation of the object to be measured;

[0137] The object to be measured is adjusted until the center of the field of view of the optical alignment probe coincides with the center of the corresponding alignment mark.

[0138] In other words, the substrate 10 and the carrier stage can be adjusted in angle by adjusting the azimuth axis of the carrier stage until the center of the first alignment mark 511 coincides with the center of the field of view of the first optical alignment probe 521, and the center of the second alignment mark 512 coincides with the center of the field of view of the second optical alignment probe 522. Figure 6 and Figure 7As shown, the solid rectangular frame represents the substrate 10, and there are first alignment marks 511 and second alignment marks 512 at the upper and lower ends of the right side of the substrate 10. The optical alignment module uses a black and white area array CCD probe, which can capture the complete first alignment mark 511 and second alignment mark 512 as shown in the dotted rectangular frame in the figure within the field of view. In addition, since the alignment mark positions of different substrates 10 may be different, the two optical alignment probes have the freedom of displacement adjustment along the short side direction of the substrate 10, i.e., the second direction, as shown by the dotted arrows in the figure. The substrate 10 and the carrier have the freedom of angle adjustment with the center position of the substrate 10 as the rotation center. Specifically, Figure 7 The left side of the figure shows the state after rough alignment but before fine alignment. The first optical alignment probe 521 and the second optical alignment probe 522 respectively shoot their respective cross-shaped first alignment mark 511 and second alignment mark 512 to obtain the alignment images of the alignment marks. Both alignment marks are within the field of view but not at the center of the field of view. Then, the position deviation is calculated by the aforementioned method to calculate the required adjustment amount. Then, the angle axis of the movable carrier is adjusted to make adjustments.

[0139] The state shown on the right side of the figure can be obtained, that is, the centers of the two alignment marks are respectively located at the center of the field of view of their respective optical alignment probes. At this time, the substrate 10 has completed the precise alignment operation, that is, the long side direction of the substrate 10 is basically parallel to the moving direction of the substrate 10. Since the position of the alignment mark on the entire substrate 10 is known and determined, after the optical alignment is completed, the position information of the carrier can be matched with the position information of the alignment mark on the substrate 10, and then the conversion relationship between the coordinate system of the carrier and the coordinate system of the substrate 10 can be determined to achieve precise positioning of the substrate 10. It should be specially noted here that the size of the alignment mark in the accompanying drawings is not in real proportion to the size of the substrate 10. The size in the figure is only for the convenience of explanation. The size of the real alignment mark is in the micrometer order.

[0140] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A method for aligning a detection device, characterized in that: The detection device comprises a mechanical alignment module and an optical alignment module, and the alignment method of the detection device comprises the following steps: Using the mechanical alignment module to roughly align the object to be measured, the surface of the object to be measured has an alignment mark, and the alignment mark is located in the field of view of the optical alignment module; After the rough alignment, the optical alignment module is used to perform fine alignment on the object to be measured so that the object to be measured is in a predetermined position; the optical alignment module includes at least one optical alignment probe, an alignment mark group is provided and includes at least two standard points; Wherein, after the rough alignment, the optical alignment module is used to perform fine alignment on the object to be measured so that the object to be measured is in a predetermined position, which includes the following sub-steps: photographing the alignment mark by the optical alignment probe to obtain an alignment image of the alignment mark; obtaining the position information of the standard point according to the alignment image; obtaining the position deviation of the object to be measured according to the position information of at least two standard points; the position deviation includes one or a combination of the translation offset and the rotation offset of the object to be measured; adjusting the object to be measured according to the position deviation so that the object to be measured is in a predetermined position; Among them, the step of adjusting the object to be measured according to the position deviation so that the object to be measured is in a predetermined position includes: obtaining the required adjustment amount according to the position deviation of the object to be measured; adjusting the object to be measured until the center of the field of view of the optical alignment probe coincides with the center of the corresponding alignment mark.

2. The alignment method of the detection device according to claim 1, characterized in that: The detection device comprises a carrying platform, comprising a carrying area for carrying the object to be tested; the mechanical alignment module comprises a plurality of alignment rollers arranged at the periphery of the carrying area; The method of using the mechanical alignment module to roughly align the object to be measured so that the alignment mark is located in the field of view of the optical alignment module comprises the following sub-steps: The alignment roller is moved toward the object to be measured until it moves to a preset position and clamps the outer edge of the object to be measured.

3. The alignment method of the detection device according to claim 1, characterized in that: The number of the optical alignment probes is multiple, and the multiple optical alignment probes include a first optical alignment probe and a second optical alignment probe; the alignment mark group includes a first alignment mark and a second alignment mark; Acquiring the position information of the standard point according to the alignment image comprises: acquiring first position information of the center of the first alignment mark according to the alignment image of the first alignment mark; acquiring second position information of the center of the second alignment mark according to the alignment image of the second alignment mark; Based on the position information of at least two standard points, obtaining the position deviation of the object to be measured includes: obtaining the translation offset of the object to be measured based on the offset between the first position information and the center of the field of view of the first optical alignment probe; and / or obtaining the rotation offset of the object to be measured based on the first position information and the second position information.

4. A detection device, characterized in that: include: Mechanical alignment module and optical alignment module; The mechanical alignment module is configured to perform a rough alignment on the object to be measured, and the surface of the object to be measured has an alignment mark, so that the alignment mark is located in the field of view of the optical alignment module; After the optical alignment module is configured to perform the rough alignment, the optical alignment module is used to perform the fine alignment on the object to be measured so that the object to be measured is at a predetermined position.

5. The detection device according to claim 4, characterized in that The optical alignment module includes at least one optical alignment probe, which is provided with an alignment mark group and includes at least two standard points; the optical alignment module is specifically configured as follows: After the rough alignment, the alignment mark is photographed by the optical alignment probe to obtain an alignment image of the alignment mark; the position information of the standard point is obtained according to the alignment image; the position deviation of the object to be measured is obtained according to the position information of at least two standard points; the position deviation includes one or a combination of the translation offset and the rotation offset of the object to be measured; the object to be measured is adjusted according to the position deviation so that the object to be measured is in a predetermined position.

6. The detection device according to claim 5, characterized in that The step of adjusting the object to be measured according to the position deviation so that the object to be measured is in a predetermined position includes: The required adjustment amount is obtained according to the position deviation of the object to be measured; and the object to be measured is adjusted until the center of the field of view of the optical alignment probe coincides with the center of the corresponding alignment mark.

7. The detection device according to claim 4, characterized in that It comprises a carrying platform, comprising a carrying area for carrying the object to be tested; the mechanical alignment module comprises a plurality of alignment rollers arranged at the periphery of the carrying area; A driving device is used to drive the alignment roller to move toward the load-bearing area.

8. The detection device according to claim 4, characterized in that: An alignment mark group is set to include two standard points and are respectively recorded as a first alignment mark and a second alignment mark; the number of the optical alignment probes is multiple, and the multiple alignment probes include a first optical alignment probe and a second optical alignment probe, the first optical alignment probe is used to capture an image of the first alignment mark, and the second optical alignment probe is used to capture an image of the second alignment mark.

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