Etching and cleaning equipment for removing phosphorus, boron and silicon

Abstract

The invention belongs to the technical field of dephosphorization, boron-silicon removal, etching and cleaning equipment, and particularly relates to dephosphorization, boron-silicon removal, etching and cleaning equipment which comprises an acid pickling and drying integrated chain type machine main body, a mechanical arm and an electric negative pressure suction cup assembly, and the outer wall of the lower piece end of the acid pickling and drying integrated chain type machine main body is fixedly connected with two connecting frames; the bottom ends of the connecting frames and the bottom end of the pickling and drying integrated chain type machine body are located on the same horizontal plane, and the outer walls of the two connecting frames are fixedly connected with a driving mechanism. The battery silicon wafer wet etching equipment provided by the invention has the functions of over-etching and incomplete etching detection of the battery silicon wafer, the use reliability of the battery silicon wafer wet etching equipment is improved, and the battery silicon wafer wet etching equipment also has the function of accurately re-etching the incompletely etched battery silicon wafer. The processing quality of the battery silicon wafer can be improved, and the convenience and efficiency of wet etching processing of the battery silicon wafer can also be improved.

Description

Technical Field

[0001] The invention belongs to the technical field of dephosphorization and deboronization and silicon etching and cleaning equipment, and in particular relates to dephosphorization and deboronization and silicon etching and cleaning equipment. Background Art

[0002] Cell wet etching is an important process in the production of solar cells. It uses an acidic mixed liquid to corrode the lower surface and edge of the diffused silicon wafer. Its main purpose is to remove the PN junction at the edge of the silicon wafer, avoid short circuit and reduce parallel resistance. At present, the cell wet etching process often uses an acid-washing and drying integrated chain machine, which includes steps such as loading, wet etching, water washing, drying and unloading.

[0003] At present, the acid cleaning and drying integrated chain machine used for wet etching of battery cells is not completely removed due to the quality difference of battery silicon wafer raw materials and uneven wet etching of acid solution, and the PN junction at the edge of the battery silicon wafer is still retained at the edge of some battery silicon wafers, which affects the qualification rate of battery silicon wafers etched by the battery silicon wafer wet etching equipment and the reliability of the use of the battery silicon wafer wet etching equipment. In addition, after the battery silicon wafers are processed by the wet etching equipment, they need to be transported to the battery silicon wafer testing equipment through the conveying equipment for quality inspection. If the battery silicon wafers are not wet-etched thoroughly, they need to be returned to the pickling and drying integrated chain machine for repair, which affects the convenience and efficiency of the battery silicon wafer wet etching processing.

[0004] To this end, we propose a dephosphorization and deboronization and silicon etching and cleaning equipment to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide a dephosphorization and deboronization and siliconization etching and cleaning device in view of the above problems.

[0006] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a dephosphorization and deboronization and silicon etching cleaning equipment, comprising a pickling and drying integrated chain machine body, a mechanical arm and an electric negative pressure suction cup assembly, the outer wall of the lower sheet end of the pickling and drying integrated chain machine body is fixedly connected to two connecting frames, the bottom end of the connecting frame and the bottom end of the pickling and drying integrated chain machine body are in the same horizontal plane, the outer walls of the two connecting frames are fixedly connected to a driving mechanism, the bottom end of the driving mechanism is fixedly connected to the fixed end of the mechanical arm, the fixed end of the electric negative pressure suction cup assembly is fixedly connected to the movable end of the mechanical arm, and the two connecting frames are fixedly connected to the movable end of the mechanical arm. The outer walls are jointly fixedly connected with a battery silicon wafer detection mechanism and an industrial computer, the outer wall of the industrial computer is fixedly connected with a horizontal plate, the upper surface of the horizontal plate is fixedly connected with a display, the outer walls of the two connecting frames and the outer wall of the pickling and drying integrated chain machine body are fixedly connected with a first support plate and a second support plate, the upper surface of the second support plate is fixedly connected with a reprocessing tank, the inner wall of the reprocessing tank is fixedly connected with a partition, the outer wall on one side of the partition and the outer wall of the reprocessing tank are jointly fixedly connected with a battery silicon wafer re-wet etching mechanism, and the outer wall on the other side of the partition and the inner wall of the reprocessing tank are jointly fixedly connected with a water washing and drying mechanism.

[0007] In the above-mentioned dephosphorization and deboronization and cleaning equipment, the driving mechanism includes a fixed plate fixedly connected to the outer walls of two connecting frames, and the opposite sides of the two fixed plates are connected with a screw through a rolling bearing, and the outer wall of one of the fixed plates is fixedly connected to a servo motor, and the output end of the servo motor is fixedly connected to the side end of the screw, and the rod wall of the screw is threadedly sleeved with a threaded barrel, and the outer wall of the threaded barrel is fixedly sleeved with a fixed frame, the outer wall of the fixed frame is movably connected to the outer walls of the two connecting frames, and the bottom end of the fixed frame is fixedly connected to the fixed end of the robotic arm.

[0008] In the above-mentioned dephosphorization and deboronization and silicon etching and cleaning equipment, the battery silicon wafer detection mechanism includes an L-shaped plate fixedly connected to the outer walls of two connecting frames, the inner wall of the L-shaped plate is fixedly connected to a multi-channel voltage measuring instrument, the output end of the multi-channel voltage measuring instrument is electrically connected to the input end of an industrial computer through a wire, a group of symmetrically distributed connecting through holes are opened on the four side outer walls of the vertical part of the L-shaped plate, and the hole walls of the four groups of connecting through holes are connected to contact components, the outer wall of the electric negative pressure suction cup assembly is fixedly connected to a CCD visual camera, and the vertical part of the L-shaped plate is fixedly connected to a fill light.

[0009] In the above-mentioned dephosphorization and deboron silicon etching and cleaning equipment, the contact assembly includes two conductive rods, the power connection ends of the two conductive rods are electrically connected to the input end of the multi-channel voltage measuring instrument through wires, the contact ends of the two conductive rods are fixedly connected to conductive sponge blocks, the rod walls of the conductive rods are fixedly sleeved with insulating rings, the rod walls of the conductive rods are movably sleeved with insulating springs, and the two ends of the insulating springs are respectively fixedly connected to the insulating rings and the outer walls of the vertical parts of the L-shaped plate.

[0010] In the above-mentioned dephosphorization and deboronization and silicon etching and cleaning equipment, the battery silicon wafer re-wet etching mechanism includes an inclined plate fixedly connected to the inner wall of the reprocessing tank and the outer wall of the partition, and the inclined plate, the partition and the reprocessing tank together constitute an acid storage area, the outer wall of the partition is fixedly connected to a first hollow cover, the bottom end of the first hollow cover is fixedly connected to a surrounding plate on the upper surface of the inclined plate, the inner wall of the surrounding plate is fixedly connected to an exhaust pump, the output end of the exhaust pump passes through the lower surface of the inclined plate and is fixedly connected to an exhaust one-way valve, the suction end of the exhaust pump is fixedly connected to a connecting pipe, the air inlet end of the connecting pipe passes through the upper surface of the first hollow cover and is fixed It is connected with a hollow filter tank, the outer wall of which is fixedly connected to the outer wall of the top end of the reprocessing tank, the top end of the inclined plate is fixedly embedded with a conduit, the top end of which is fixedly connected to the lower surface of the first hollow cover, the upper surface of the first hollow cover is fixedly connected with four electromagnetic control valves, the top ends of the four electromagnetic control valves are fixedly connected with liquid spray nozzles, the lower surface of the reprocessing tank located in the acid storage area is fixedly connected with a normally closed valve, the input end of the normally closed valve passes through the lower surface of the second support plate and is fixedly connected with an acid delivery pipe, the lower surface of the inclined plate is fixedly connected with a sealing cover, and the bottom end of the sealing cover is fixedly embedded with a liquid level switch.

[0011] In the above-mentioned dephosphorization and deboronization and cleaning equipment, the water washing and drying mechanism includes a heat insulation cover fixedly connected to the outer wall of the partition and a second hollow cover, a semiconductor refrigerator is arranged inside the heat insulation cover, the cooling end of the semiconductor refrigerator is fixedly connected to a ceramic heat conductive strip, the side end of the ceramic heat conductive strip passes through the partition and extends into the acid storage area, the outer wall of the ceramic heat conductive strip is provided with a plurality of heat conductive holes, the lower surface of the second hollow cover and the upper surface of the heat insulation cover are fixedly connected to an air guide pipe, the upper surface of the second hollow cover is fixedly connected to a plurality of air nozzles, the bottom end of the second hollow cover is fixedly connected to a water inlet control valve, the input end of the water inlet control valve is fixedly connected to a water supply pipe, the bottom end of the water supply pipe passes through the outer wall of the reprocessing tank, the bottom end of the heat insulation cover is fixedly connected to an air intake pipe, the bottom end of the air intake pipe passes through the lower surface of the second support plate, and is fixedly connected to an air intake fan.

[0012] In the above-mentioned dephosphorization and deboronization and silicon etching cleaning equipment, the outer walls on both sides of the reprocessing tank are respectively fixedly connected with a waste liquid discharge pipe and a waste water discharge pipe.

[0013] In the above-mentioned dephosphorization and deboronization and cleaning equipment, a rectangular mounting hole is opened on the upper surface of the second support plate, and the hole wall of the rectangular mounting hole is movably connected with a waste collection groove, and the bottom end of the waste collection groove is movably contacted with the upper surface of the first support plate.

[0014] In the above-mentioned dephosphorization and deboron silicon etching and cleaning equipment, the pickling and drying integrated chain machine body includes a drying section and a pickling section. A water film mechanism is arranged at the inlet of the drying section, and a first conveying roller is arranged directly below the water film mechanism. A second conveying roller is arranged inside the pickling section. A plurality of umbrella-shaped driven gears are respectively arranged at both ends of the second conveying roller, and a driving gear is meshed on the outer wall of each driven gear. A driving shaft is connected to the connecting end of the driving gear, and connecting plugs are arranged at both ends of the driving shaft. A PEEK bearing matching the side end of the driving shaft is fixedly connected to the inner wall of the connecting hole of the connecting plug, and a supporting locking block is arranged on the outer wall of the driving shaft.

[0015] In the above-mentioned dephosphorization and deboronization and siliconization etching cleaning equipment, a cleaning component is provided on the side of the pickling section close to the outlet of the pickling and drying integrated chain machine body, and the cleaning component includes a circulating water washing section and a direct supply spray section.

[0016] Compared with the existing technology, the advantages of a dephosphorization and deboronization and siliconization etching and cleaning equipment are: 1. Through the set driving mechanism, CCD visual camera, fill light and industrial computer, when the battery silicon wafer is wet-etched and processed by the pickling and drying integrated chain machine body, the robot arm drives the electric negative pressure suction cup assembly to approach the upper surface of the battery silicon wafer through the industrial computer, and then the industrial computer controls the electric negative pressure suction cup assembly to stably absorb the battery silicon wafer. After that, the industrial computer drives the robot arm and the electric negative pressure suction cup assembly to move to the top of the reprocessing tank through the driving mechanism, and then controls the robot arm through the industrial computer to make the battery silicon wafer close to the battery silicon wafer detection mechanism, and at the same time the industrial computer controls the start The CCD vision camera and the fill light are activated, and the light of the fill light is irradiated onto the battery silicon wafer. Then the CCD vision camera takes pictures of the battery silicon wafer under the light state, and uses the visual inspection software loaded on the industrial computer to assist in the inspection. It automatically detects whether there are bright spots on the side of the battery silicon wafer close to the CCD vision camera under the light state. If there are bright spots, it means that the battery silicon wafer is over-etched and unqualified. Otherwise, it means that the battery silicon wafer is not over-etched and is preliminarily qualified. This mechanism is used in battery silicon wafer wet etching equipment with the function of battery silicon wafer over-etching detection.

[0017] 2. Through the set battery silicon wafer detection mechanism, when the battery silicon wafer passes the preliminary detection by the CCD visual camera and the industrial computer, the battery silicon wafer needs to be tested again by the battery silicon wafer detection mechanism. At this time, the multi-channel voltage measuring instrument in the battery silicon wafer detection mechanism cooperates with the four groups of contact components, and measures the voltage on the four sides of the battery silicon wafer. At the same time, the multi-channel voltage measuring instrument sends the voltage detected by the contact components on each detection channel to the industrial computer one by one in the form of electrical signals. If one or more groups of voltage values ​​are lower than the standard voltage value at the etching edge after comparing the four groups of voltage values ​​with the standard voltage value at the etching edge, this is because the edge of the battery silicon wafer still has a PN junction due to incomplete etching, and causes a short circuit in the edge area of ​​the battery silicon wafer, and there are problems of reduced resistance and easy current flow, thereby reducing the voltage at the side of the battery silicon wafer. Then the industrial computer controls the mechanical arm through the voltage reduction signal to move the battery silicon wafer to the battery silicon wafer wet etching mechanism. The mechanism is used in the battery silicon wafer wet etching equipment to have the function of incomplete battery silicon wafer etching detection, thereby improving the reliability of the battery silicon wafer wet etching equipment.

[0018] 3. Through the set battery silicon wafer re-wet etching mechanism and water washing and drying mechanism, when there is incomplete etching on the side of the battery silicon wafer, the industrial computer controls the robotic arm to move the battery silicon wafer to the battery silicon wafer re-wet etching mechanism, and performs targeted re-etching and trimming on the incomplete etching position. After the re-etching and trimming, it is cleaned and dried by the water washing and drying mechanism. The dried battery silicon wafer is then inspected by the battery silicon wafer inspection mechanism, and is transported to the next processing position if qualified. This mechanism enables the dephosphorization and deboronization and siliconization etching cleaning equipment to have the function of precise re-etching processing of incompletely etched battery silicon wafers, which can not only improve the quality of battery silicon wafer processing, but also improve the convenience and efficiency of battery silicon wafer wet etching processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of a dephosphorization and deboronization and siliconization etching and cleaning device provided by the present invention; Figure 2 It is a structural schematic diagram of a connecting frame part in a dephosphorization and deboronization and siliconization etching and cleaning device provided by the present invention; Figure 3 It is a structural schematic diagram of a battery silicon wafer detection mechanism in a dephosphorization and deboronization silicon etching and cleaning device provided by the present invention; Figure 4 It is a structural schematic diagram of a CCD visual camera part in a dephosphorization and deboronization and siliconization etching and cleaning device provided by the present invention; Figure 5 It is a structural schematic diagram of a left-side view of an L-shaped plate in a dephosphorization and deboronization and siliconization etching and cleaning device provided by the present invention; Figure 6It is a schematic diagram of a partial cross-section structure of a dephosphorization and deboronization and siliconization etching and cleaning device provided by the present invention; Figure 7 yes Figure 6 A schematic diagram of the partially enlarged structure; Figure 8 It is a schematic diagram of the structure of a top view of a ceramic heat conductive strip portion in a dephosphorization and deboronization and siliconization etching and cleaning device provided by the present invention; Fig. 9 It is a structural schematic diagram of a main body of a chain machine integrated with pickling and drying in a dephosphorization and deboronization and siliconization etching and cleaning device provided by the present invention; Fig.10 yes Fig. 9 A schematic diagram of the partially enlarged structure; Fig.11 It is a structural schematic diagram of part A of a dephosphorization and deboronization and siliconization etching and cleaning device provided by the present invention; Fig.12 It is a structural schematic diagram of part B of a dephosphorization and deboronization and siliconization etching and cleaning device provided by the present invention; Fig.13 It is a structural schematic diagram of a connection plug-in in a dephosphorization and deboronization and siliconization etching and cleaning device provided by the present invention; Fig.14 It is a partially enlarged structural schematic diagram of a dephosphorization and deboronization and silicon etching cleaning device provided by the present invention.

[0020] In the figure: 1 pickling and drying integrated chain machine body, 101 drying section, 102 pickling section, 103 water film mechanism, 104 first conveying roller, 105 second conveying roller, 106 driven gear, 107 driving gear, 108 driving shaft, 109 connecting plug, 110 supporting locking block, 111 circulating water washing section, 112 direct supply spray section, 113 PEEK bearing, 2 mechanical arm, 3 electric negative pressure suction cup assembly, 4 connecting frame, 5 driving mechanism, 51 fixing plate, 52 screw rod, 53 servo motor, 54 threaded barrel, 55 fixing frame, 6 battery silicon wafer detection mechanism, 61 L-shaped plate, 62 multi-channel voltage measuring instrument, 63 contact assembly, 631 conductive rod, 632 conductive sponge block, 633 insulating ring, 634 insulating spring, 64 CCD visual camera, 65 fill light, 7 industrial computer, 8 electric Pool silicon wafer wet etching mechanism, 81 tilting plate, 82 acid storage area, 83 first hollow cover, 84 enclosure, 85 vacuum pump, 86 exhaust check valve, 87 connecting pipe, 88 hollow filter tank, 89 conduit, 810 electromagnetic control valve, 811 liquid spray nozzle, 812 normally closed valve, 813 acid delivery pipe, 814 sealing cover, 815 liquid level switch, 9 water washing and drying mechanism, 91 heat insulation cover, 92 second hollow cover, 93 semiconductor refrigerator, 94 ceramic thermal conductive strip, 95 thermal conductive hole, 96 air guide pipe, 97 air nozzle, 98 water inlet control valve, 99 water supply pipe, 910 air inlet pipe, 911 air inlet fan, 10 horizontal plate, 11 display, 12 first support plate, 13 second support plate, 14 reprocessing tank, 15 partition, 16 waste liquid discharge pipe, 17 waste water discharge pipe, 18 waste material collection tank. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] like Figure 1-Figure 14As shown, a dephosphorization and deboronization and silicon etching cleaning equipment comprises a pickling and drying integrated chain machine body 1, a mechanical arm 2 and an electric negative pressure suction cup assembly 3, the outer wall of the lower sheet end of the pickling and drying integrated chain machine body 1 is fixedly connected to two connecting frames 4, the bottom end of the connecting frame 4 is in the same horizontal plane as the bottom end of the pickling and drying integrated chain machine body 1, the outer walls of the two connecting frames 4 are fixedly connected to a driving mechanism 5, the driving mechanism 5 comprises a fixing plate 51 fixedly connected to the outer walls of the two connecting frames 4, the opposite sides of the two fixing plates 51 are connected to a screw rod 52 through a rolling bearing, the outer wall of one of the fixing plates 51 is fixedly connected to a servo motor 53, the output end of the servo motor 53 is fixedly connected to the side end of the screw rod 52, the rod wall of the screw rod 52 is threadedly sleeved with a threaded barrel 54, the outer wall of the threaded barrel 54 is fixedly sleeved with a fixing frame 55, the outer wall of the fixing frame 55 is movably connected to the outer walls of the two connecting frames 4, and the bottom end of the fixing frame 55 is fixedly connected to the fixed end of the mechanical arm 2.

[0023] The bottom end of the driving mechanism 5 is fixedly connected to the fixed end of the robot arm 2, the fixed end of the electric negative pressure suction cup assembly 3 is fixedly connected to the movable end of the robot arm 2, the outer walls of the two connecting frames 4 are commonly fixedly connected with the battery silicon wafer detection mechanism 6 and the industrial computer 7, the battery silicon wafer detection mechanism 6 includes an L-shaped plate 61 fixedly connected to the outer walls of the two connecting frames 4, the inner wall of the L-shaped plate 61 is fixedly connected with a multi-channel voltage measuring instrument 62, the output end of the multi-channel voltage measuring instrument 62 is electrically connected to the input end of the industrial computer 7 through a wire, the four side outer walls of the vertical part of the L-shaped plate 61 are each provided with a group of symmetrically distributed connecting through holes, and the hole walls of the four groups of connecting through holes are each connected with a contact assembly 63, the contact assembly 63 includes two conductive rods 631, and the two conductive rods 63 The power connection ends of 1 are electrically connected to the input ends of the multi-channel voltage measuring instrument 62 through wires, the contact ends of the two conductive rods 631 are fixedly connected with conductive sponge blocks 632, the rod wall of the conductive rod 631 is fixedly sleeved with an insulating ring 633, the rod wall of the conductive rod 631 is movably sleeved with an insulating spring 634, the two ends of the insulating spring 634 are respectively fixedly connected to the insulating ring 633 and the outer wall of the vertical part of the L-shaped plate 61, the conductive sponge block 632 and the insulating spring 634 cooperate to make the conductive rod 631 have a certain buffering capacity, thereby protecting the battery silicon wafer and preventing the battery silicon wafer from being damaged by bumps, the outer wall of the electric negative pressure suction cup assembly 3 is fixedly connected with a CCD visual camera 64, and the vertical part of the L-shaped plate 61 is fixedly connected with a fill light 65.

[0024] The outer wall of the industrial computer 7 is fixedly connected with a horizontal plate 10, and the upper surface of the horizontal plate 10 is fixedly connected with a display 11. The outer walls of the two connecting frames 4 and the outer wall of the pickling and drying integrated chain machine body 1 are fixedly connected with a first support plate 12 and a second support plate 13. A rectangular mounting hole is opened on the upper surface of the second support plate 13, and the hole wall of the rectangular mounting hole is movably connected with a waste collection groove 18. The bottom end of the waste collection groove 18 is in movably contact with the upper surface of the first support plate 12. The waste collection groove 18 can conveniently collect over-etched battery silicon wafers, and by screening the over-etched battery silicon wafers, the qualified rate of battery silicon wafers processed by wet etching equipment is improved. The upper surface of the second support plate 13 is fixedly connected with a reprocessing groove 14. The reprocessing groove The outer walls on both sides of 14 are respectively fixedly connected with a waste liquid discharge pipe 16 and a waste water discharge pipe 17, which can discharge the used acid solution and pure water respectively. The inner wall of the reprocessing tank 14 is fixedly connected with a partition 15, and the outer wall on one side of the partition 15 and the outer wall of the reprocessing tank 14 are jointly fixedly connected with a battery silicon wafer re-wet etching mechanism 8. The battery silicon wafer re-wet etching mechanism 8 includes an inclined plate 81 that is jointly fixedly connected with the inner wall of the reprocessing tank 14 and the outer wall of the partition 15. The inclined plate 81, the partition 15 and the reprocessing tank 14 together constitute an acid storage area 82. The outer wall of the partition 15 is fixedly connected with a first hollow cover 83, and the bottom end of the first hollow cover 83 is jointly fixedly connected with the upper surface of the inclined plate 81. The enclosing plate 84 is fixedly connected to the inner wall of the enclosing plate 84, and an air pump 85 is fixedly connected to the inner wall of the enclosing plate 84. The output end of the air pump 85 passes through the lower surface of the inclined plate 81 and is fixedly connected to an exhaust check valve 86. The suction end of the air pump 85 is fixedly connected to a connecting pipe 87. The air inlet end of the connecting pipe 87 passes through the upper surface of the first hollow cover 83 and is fixedly connected to a hollow filter tank 88. The outer wall of the hollow filter tank 88 is fixedly connected to the outer wall of the top end of the reprocessing tank 14. A conduit 89 is fixedly embedded in the top of the inclined plate 81. The top of the conduit 89 is fixedly connected to the lower surface of the first hollow cover 83. The upper surface of the first hollow cover 83 is fixedly connected to four electromagnetic control valves 810. The top ends of the four electromagnetic control valves 810 are fixedly connected. A liquid spray nozzle 811 is fixedly connected to the reprocessing tank 14 located in the acid storage area 82, and a normally closed valve 812 is fixedly connected to the lower surface. The input end of the normally closed valve 812 passes through the lower surface of the second support plate 13 and is fixedly connected to the acid delivery pipe 813. A sealing cover 814 is fixedly connected to the lower surface of the inclined plate 81, and a liquid level switch 815 is fixedly embedded at the bottom end of the sealing cover 814. When the upper surface of the acid solution in the acid storage area 82 is lower than the liquid level switch 815, the liquid level switch 815 automatically controls the normally closed valve 812 to open and replenish the acid solution. When the upper surface of the acid solution is higher than the liquid level switch 815, the liquid level switch 815 automatically controls the normally closed valve 812 to cut off the power, thereby realizing automatic replenishment of the acid solution.

[0025] The outer wall of the other side of the partition 15 and the inner wall of the reprocessing tank 14 are fixedly connected to a washing and drying mechanism 9, which includes a heat insulation cover 91 and a second hollow cover 92 fixedly connected to the outer wall of the partition 15. A semiconductor refrigerator 93 is arranged inside the heat insulation cover 91. A ceramic heat conduction strip 94 is fixedly connected to the cooling end of the semiconductor refrigerator 93. The side end of the ceramic heat conduction strip 94 passes through the partition 15 and extends into the acid storage area 82. A plurality of heat conduction holes 95 are opened on the outer wall of the ceramic heat conduction strip 94. The lower surface of the second hollow cover 92 and the upper surface of the heat insulation cover 91 are fixedly connected to a heat conduction strip 94. The air pipe 96, the upper surface of the second hollow cover 92 is fixedly connected with a plurality of air nozzles 97, the bottom end of the second hollow cover 92 is fixedly connected with a water inlet control valve 98, the input end of the water inlet control valve 98 is fixedly connected with a water supply pipe 99, the bottom end of the water supply pipe 99 passes through the outer wall of the reprocessing tank 14, the bottom end of the heat insulation cover 91 is fixedly connected with an air inlet pipe 910, the bottom end of the air inlet pipe 910 passes through the lower surface of the second support plate 13, and is fixedly connected with an air inlet fan 911. This mechanism enables the battery silicon wafer wet etching mechanism 8 to have the functions of water washing, cleaning and drying, thereby ensuring the quality of battery silicon wafer processing.

[0026] The main body 1 of the pickling and drying integrated chain machine includes a drying section 101 and a pickling section 102. A water film mechanism 103 is provided at the entrance of the drying section 101. A first conveying roller 104 is provided directly below the water film mechanism 103. A second conveying roller 105 is provided inside the pickling section 102. A plurality of umbrella-shaped driven gears 106 are provided at both ends of the second conveying roller 105. A driving gear 107 is meshed on the outer wall of each driven gear 106. A driving shaft 108 is connected to the connecting end of the driving gear 107. The driving gear 107 and the driven gear 106 cooperate to improve the stability of transportation and reduce the torque. Connecting plug-ins 109 are provided at both ends of the driving shaft 108. The inner wall of the connecting hole of the connecting plug-in 109 is fixedly connected with a drive gear 107 that cooperates with the side end of the driving shaft 108. The PEEK bearing 113 has the characteristics of high speed and silence, smooth transmission and small overall roller vibration, which improves the stability of equipment operation. The outer wall of the drive shaft 108 is provided with a support locking block 110. The support locking block 110 greatly improves the overall stability of transportation and has a good improvement in the flexible adjustability of the horizontality. The pickling section 102 is provided with a cleaning component on the side close to the outlet of the pickling and drying integrated chain machine body 1, and the cleaning component includes a circulating water washing section 111 and a direct supply spray section 112. The water of the direct supply spray section 112 is retained in the auxiliary tank and reused in the circulating water washing section 111, thereby improving the utilization rate of water resources. The cleaning component can achieve the purpose of dephosphorization and deboronization, and can ensure the cleanliness of the battery silicon wafer by removing excess phosphorus and boron.

[0027] The multi-channel voltage meter 62 and the CCD visual camera 64 are both electrically connected to the input terminal of the industrial computer 7 through wires, wherein the multi-channel voltage meter 62 is a voltage measuring device, and has multiple channels to separately measure the voltage at the side walls of the battery silicon wafer, and the multi-channel voltage meter 62 can send the measured voltage value and electrical signal to the industrial computer 7, the robotic arm 2, the electric negative pressure suction cup assembly 3, the servo motor 53, the vacuum pump 85, the electromagnetic control valve 810, the semiconductor refrigerator 93, the water inlet control valve 98, the inlet fan 911 and the display 11 are all electrically connected to the output terminal of the industrial computer 7 through wires, the model of the industrial computer 7 is Lenovo ECI-521P industrial computer, the normally closed valve 812 is electrically connected to the external power supply through the liquid level switch 815, and the above-mentioned power-on equipment and electrical connections are all existing technologies and will not be repeated here.

[0028] The operating principle of the present invention is described as follows: after the battery silicon wafer is wet-etched and processed by the pickling and drying integrated chain machine body 1, the robot arm 2 drives the electric negative pressure suction cup assembly 3 to approach the upper surface of the battery silicon wafer through the industrial computer 7, and then the industrial computer 7 controls the electric negative pressure suction cup assembly 3 to stably absorb the battery silicon wafer, and then the industrial computer 7 also controls the servo motor 53 to rotate forward, and the forward rotating servo motor 53 moves the fixed frame 55 through the threaded cylinder 54 and the screw rod 52. The fixed frame 55 drives the robot arm 2 and the electric negative pressure suction cup assembly 3 to move to the top of the reprocessing tank 14, and then the servo motor 53 stops rotating, and then the industrial computer 7 controls the robot arm 2 again through the industrial computer 7 to make the battery silicon wafer close to the battery silicon wafer detection mechanism 6. At the same time, the industrial computer 7 controls to start the CCD visual camera 64 and the fill light 65. The light of the fill light 65 is irradiated onto the battery silicon wafer, and then the CCD visual The visual camera 64 then takes a picture of the battery silicon wafer under the light state, and uses the visual inspection software loaded on the industrial computer 7 to assist in the inspection, and automatically detects whether there is a bright spot on the side of the battery silicon wafer close to the CCD visual camera 64 under the light state. If the CCD visual camera 64 cooperates with the industrial computer 7 to automatically detect that there is a bright spot on the battery silicon wafer under the light state, it means that the battery silicon wafer is over-etched and unqualified. Then the industrial computer 7 automatically controls the servo motor 53 to reverse according to the detection result, and the reversed servo motor 53 moves the fixed frame 55 to the top of the waste collection tank 18. Then the industrial computer 7 controls the robot arm 2 and the electric negative pressure suction cup assembly 3 to put the over-etched battery silicon wafer into the waste collection tank 18. If the CCD visual camera 64 cooperates with the industrial computer 7 to detect that there is no bright spot on the battery silicon wafer under the light state, it means that the battery silicon wafer is not over-etched and is preliminarily qualified. After the battery silicon wafer passes the preliminary inspection by the CCD visual camera 64 and the industrial computer 7, the battery silicon wafer needs to be inspected again by the battery silicon wafer inspection mechanism 6. At this time, the multi-channel voltage measuring instrument 62 in the battery silicon wafer inspection mechanism 6 cooperates with the four groups of contact components 63 and measures the voltage on the four sides of the battery silicon wafer. At the same time, the multi-channel voltage measuring instrument 62 sends the voltage detected by the contact components 63 on each inspection channel to the industrial computer 7 one by one in the form of electrical signals. At this time, the four inspection components are marked as A1, A2, A3, A4, A5, A6, A7, A8, A9, A10, A110, A210, A120, A130, A140, A150, A160, A170, A180, A190, A200, A210, A210, A220, A230, A240, A250, A260, A270, A270, A280, A290, A300, A31 ... A3 and A4, then the industrial computer 7 analyzes the electrical signal to obtain the voltage value, and compares the measured voltage value with the standard voltage value at the etching edge preset by the industrial computer 7. If the four sets of voltage values ​​are consistent with the standard voltage value at the etching edge within the error range, it means that the battery silicon wafer is qualified for wet etching in the pickling and drying integrated chain machine body 1. Then the industrial computer 7 automatically controls the mechanical arm 2 and the electric negative pressure suction cup assembly 3 according to the qualified test result of the battery silicon wafer detection mechanism 6 to move the battery silicon wafer to the conveyor belt of the assembly line and transport it to the next If one or more groups of voltage values ​​are lower than the standard voltage value at the etching edge after the four groups of voltage values ​​are compared with the standard voltage value at the etching edge, this is because the PN junction still exists at the edge of the battery silicon wafer due to incomplete etching, which causes a short circuit in the edge area of ​​the battery silicon wafer, and there is a problem of reduced resistance and easy current flow, thereby reducing the voltage at the side of the battery silicon wafer. After that, the industrial computer 7 determines that the side wall of the battery silicon wafer at that position has an incomplete etching problem based on the voltage electrical signals transmitted one by one by the multi-channel voltage measuring instrument 62, and then the industrial computer 7 controls the robot arm 2 to move the battery silicon wafer to the battery silicon wafer wet etching mechanism 8 through the voltage reduction signal. At the same time, the industrial computer 7 controls to start the electromagnetic control valve 810 corresponding to the position of the incompletely etched side wall of the battery silicon wafer, and the industrial computer 7 installs the four electromagnetic control valves 810 on the first hollow cover 83 in a clockwise direction and marks them as B1, B2, B3 and B4. This mechanism is used in the battery silicon wafer wet etching equipment and has the function of detecting over-etching and incomplete etching of the battery silicon wafer, thereby improving the reliability of the battery silicon wafer wet etching equipment.

[0029] When the incomplete etching of the side of the battery silicon wafer detected by the contact component 63 at the A1 position needs to be trimmed, the battery silicon wafer is controlled by the robot arm 2 to move to the top of the spray nozzle 811 in the battery silicon wafer wet etching mechanism 8, and the industrial computer 7 controls the electromagnetic control valve 810 at the B1 position to open. At the same time, the time when the industrial computer 7 controls the electromagnetic control valve 810 at the B1 position to be energized and opened is inversely proportional to the voltage value of the side of the battery silicon wafer detected by the contact component 63 at the A1 position, that is, the smaller the measured voltage value on the side of the battery silicon wafer, the more PN junctions there are in the side wall area of ​​the battery silicon wafer, that is, the higher the degree of incomplete etching, and then the amount of acid solution sprayed by the electromagnetic control valve 810 and the spray nozzle 811 is more, thereby ensuring that the incompletely etched side of the battery silicon wafer has sufficient time to complete the wet etching process again, thereby improving the quality of the battery silicon wafer etching process. At this time, the industrial computer 7 also controls the start of the pump The air pump 85 delivers air to the acid storage area 82 through the exhaust check valve 86, and the air pushes the acid solution in the acid storage area 82 to be delivered to the first hollow cover 83 along the conduit 89, and then the acid solution enters the liquid spray nozzle 811 through the opened electromagnetic control valve 810, and then the acid solution in the liquid spray nozzle 811 is sprayed to the side of the battery silicon wafer where the etching is not complete to complete the wet etching again. After the wet etching of the battery silicon wafer is completed again, the industrial computer 7 controls the air pump 85 and the electromagnetic control valve 810 at the corresponding position to cut off the power and close, and then the industrial computer 7 controls the robot arm 2 to move the battery silicon wafer to the top of the second hollow cover 92 of the washing and drying mechanism 9. Similarly, when the etching of the battery silicon wafer side detected by the contact assembly 63 at A2, A3 and A4 is incomplete and needs to be trimmed, the industrial computer 7 controls the electromagnetic control valve 810 at the positions of B2, B3 and B4 to open; At this time, the industrial computer 7 controls the air intake control valve to be powered on and opened for 30 seconds. Within 30 seconds, the water supply pipe 99 transports pure water to the inside of the second hollow cover 92. Finally, the pure water is sprayed to the battery silicon wafer through the water nozzle for water washing. When the battery silicon wafer wet etching equipment is working, the industrial computer 7 also controls the semiconductor refrigerator 93 to work. The cooling side of the semiconductor refrigerator 93 reduces the temperature of the ceramic thermal conductive strip 94. The low-temperature ceramic thermal conductive strip 94 maintains the temperature of the acid solution in the acid storage area 82 at 8 degrees Celsius. When the temperature is high, the etching acid solution will be unstable during the etching process, affecting the accuracy of the battery silicon wafer etching processing. The temperature of the etching acid solution is generally not suitable for a long time. More than 10 degrees Celsius, in addition, the heat on the working heat dissipation side of the semiconductor refrigerator 93 is transported by the air inlet fan 911. On the one hand, the air carrying heat can increase the water temperature of the washing water. The higher water temperature can improve the flushing of the residual acid solution on the surface of the battery silicon wafer, accelerate the dissolution of the residual acid solution, and improve the effect of the washing. After 30 seconds, the water inlet control valve 98 is controlled by the industrial computer 7 to cut off the power and close, and no pure water enters the second hollow cover 92. At this time, the second hollow cover 92 transports air with a higher temperature, which makes it convenient to dry the battery silicon wafers after washing. The dried battery silicon wafers are then inspected by the battery silicon wafer inspection mechanism 6, and are transported to the next processing position after the inspection. This mechanism enables the dephosphorization and deboronization and siliconization etching cleaning equipment to have the function of accurately re-etching the incompletely etched battery silicon wafers, which can not only improve the quality of battery silicon wafer processing, but also improve the convenience and efficiency of battery silicon wafer wet etching processing.

[0030] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A dephosphorization and deboronization and silicon etching cleaning device, comprising an acid cleaning and drying integrated chain machine body (1), a mechanical arm (2) and an electric negative pressure suction cup assembly (3), characterized in that: The outer wall of the lower sheet end of the pickling and drying integrated chain machine body (1) is fixedly connected to two connecting frames (4), the bottom end of the connecting frame (4) and the bottom end of the pickling and drying integrated chain machine body (1) are in the same horizontal plane, the outer walls of the two connecting frames (4) are fixedly connected to a driving mechanism (5), the bottom end of the driving mechanism (5) is fixedly connected to the fixed end of the mechanical arm (2), the fixed end of the electric negative pressure suction cup assembly (3) is fixedly connected to the movable end of the mechanical arm (2), the outer walls of the two connecting frames (4) are commonly fixedly connected to a battery silicon wafer detection mechanism (6) and an industrial control computer (7), and the outer wall of the industrial control computer (7) is fixedly connected to a horizontal plate (10), A display (11) is fixedly connected to the upper surface of the transverse plate (10); a first support plate (12) and a second support plate (13) are fixedly connected to the outer wall of the two connecting frames (4) and the outer wall of the pickling and drying integrated chain machine body (1); a reprocessing tank (14) is fixedly connected to the upper surface of the second support plate (13); a partition (15) is fixedly connected to the inner wall of the reprocessing tank (14); an outer wall on one side of the partition (15) and the outer wall of the reprocessing tank (14) are jointly fixedly connected to a battery silicon wafer re-wet etching mechanism (8); and an outer wall on the other side of the partition (15) and the inner wall of the reprocessing tank (14) are jointly fixedly connected to a water washing and drying mechanism (9).

2. The dephosphorization and deboronization and siliconization etching and cleaning equipment according to claim 1, characterized in that: The driving mechanism (5) comprises a fixing plate (51) fixedly connected to the outer walls of the two connecting frames (4); opposite sides of the two fixing plates (51) are connected to screw rods (52) via rolling bearings; the outer wall of one of the fixing plates (51) is fixedly connected to a servo motor (53); the output end of the servo motor (53) is fixedly connected to the side end of the screw rod (52); a threaded barrel (54) is threadedly sleeved on the rod wall of the screw rod (52); a fixing frame (55) is fixedly sleeved on the outer wall of the threaded barrel (54); the outer wall of the fixing frame (55) is movably connected to the outer walls of the two connecting frames (4); and the bottom end of the fixing frame (55) is fixedly connected to the fixed end of the mechanical arm (2).

3. The dephosphorization and deboronization and siliconization etching and cleaning equipment according to claim 1, characterized in that: The battery silicon wafer detection mechanism (6) comprises an L-shaped plate (61) fixedly connected to the outer walls of the two connecting frames (4); the inner wall of the L-shaped plate (61) is fixedly connected to a multi-channel voltage measuring instrument (62); the output end of the multi-channel voltage measuring instrument (62) is electrically connected to the input end of the industrial control computer (7) via a wire; the four side outer walls of the vertical portion of the L-shaped plate (61) are each provided with a group of symmetrically distributed connecting through holes, and the hole walls of the four groups of connecting through holes are each connected to a contact assembly (63); the outer wall of the electric negative pressure suction cup assembly (3) is fixedly connected to a CCD visual camera (64); and the vertical portion of the L-shaped plate (61) is fixedly connected to a fill light (65).

4. The dephosphorization and deboronization and siliconization etching and cleaning equipment according to claim 3, characterized in that: The contact assembly (63) comprises two conductive rods (631), the electrical connection ends of the two conductive rods (631) are electrically connected to the input end of the multi-channel voltage measuring instrument (62) via wires, the contact ends of the two conductive rods (631) are fixedly connected to a conductive sponge block (632), the rod wall of the conductive rod (631) is fixedly sleeved with an insulating ring (633), the rod wall of the conductive rod (631) is movably sleeved with an insulating spring (634), and the two ends of the insulating spring (634) are respectively fixedly connected to the insulating ring (633) and the outer wall of the vertical portion of the L-shaped plate (61).

5. The dephosphorization and deboronization and siliconization etching and cleaning equipment according to claim 1, characterized in that: The battery silicon wafer re-wet etching mechanism (8) comprises an inclined plate (81) fixedly connected to the inner wall of the reprocessing tank (14) and the outer wall of the partition (15); the inclined plate (81), the partition (15) and the reprocessing tank (14) together constitute an acid storage area (82); the outer wall of the partition (15) is fixedly connected to a first hollow cover (83); the bottom end of the first hollow cover (83) is fixedly connected to a surrounding plate (84) fixedly connected to the upper surface of the inclined plate (81); the inner wall of the surrounding plate (84) is fixedly connected to an air pump (85); the output end of the air pump (85) passes through the lower surface of the inclined plate (81) and is fixedly connected to an exhaust check valve (86); the suction end of the air pump (85) is fixedly connected to a connecting pipe (87); the air inlet end of the connecting pipe (87) passes through the upper surface of the first hollow cover (83) and is fixedly connected to a hollow filter tank (88); ), the outer wall of the hollow filter tank (88) is fixedly connected to the outer wall of the top end of the reprocessing tank (14), the top end of the inclined plate (81) is fixedly embedded with a conduit (89), the top end of the conduit (89) is fixedly connected to the lower surface of the first hollow cover (83), the upper surface of the first hollow cover (83) is fixedly connected with four electromagnetic control valves (810), the top ends of the four electromagnetic control valves (810) are fixedly connected with a liquid spray nozzle (811), the lower surface of the reprocessing tank (14) located in the acid storage area is fixedly connected with a normally closed valve (812), the input end of the normally closed valve (812) passes through the lower surface of the second support plate (13) and is fixedly connected with an acid delivery pipe (813), the lower surface of the inclined plate (81) is fixedly connected with a sealing cover (814), and the bottom end of the sealing cover (814) is fixedly embedded with a liquid level switch (815).

6. The dephosphorization and deboronization and siliconization etching and cleaning equipment according to claim 5, characterized in that: The washing and drying mechanism (9) comprises a heat-insulating cover (91) fixedly connected to the outer wall of the partition (15) and a second hollow cover (92); a semiconductor refrigerator (93) is provided inside the heat-insulating cover (91); a ceramic heat-conducting strip (94) is fixedly connected to the cooling end of the semiconductor refrigerator (93); a side end of the ceramic heat-conducting strip (94) passes through the partition (15) and extends into the acid storage area (82); a plurality of heat-conducting holes (95) are provided on the outer wall of the ceramic heat-conducting strip (94); and the lower surface of the second hollow cover (92) and the upper surface of the heat-insulating cover (91) are fixedly connected together. The second hollow cover (92) is connected to an air guide pipe (96); the upper surface of the second hollow cover (92) is fixedly connected to a plurality of air nozzles (97); the bottom end of the second hollow cover (92) is fixedly connected to a water inlet control valve (98); the input end of the water inlet control valve (98) is fixedly connected to a water supply pipe (99); the bottom end of the water supply pipe (99) passes through the outer wall of the reprocessing tank (14); the bottom end of the heat insulation cover (91) is fixedly connected to an air inlet pipe (910); the bottom end of the air inlet pipe (910) passes through the lower surface of the second support plate (13) and is fixedly connected to an air inlet fan (911).

7. The dephosphorization and deboronization and siliconization etching and cleaning equipment according to claim 1, characterized in that: The outer walls on both sides of the reprocessing tank (14) are respectively fixedly connected to a waste liquid discharge pipe (16) and a waste water discharge pipe (17).

8. The dephosphorization and deboronization and siliconization etching and cleaning equipment according to claim 1, characterized in that: A rectangular mounting hole is provided on the upper surface of the second support plate (13), and a waste collection trough (18) is movably connected to the hole wall of the rectangular mounting hole, wherein the bottom end of the waste collection trough (18) is in movably contact with the upper surface of the first support plate (12).

9. The dephosphorization and deboronization and siliconization etching and cleaning equipment according to claim 1, characterized in that: The pickling and drying integrated chain machine body (1) comprises a drying section (101) and a pickling section (102); a water film mechanism (103) is arranged at the entrance of the drying section (101); a first conveying roller (104) is arranged directly below the water film mechanism (103); a second conveying roller (105) is arranged inside the pickling section (102); a plurality of umbrella-shaped driven gears (106) are arranged at both ends of the second conveying roller (105); a driving gear (107) is meshed on the outer wall of each driven gear (106); a driving shaft (108) is connected to the connecting end of the driving gear (107); connecting plug-ins (109) are arranged at both ends of the driving shaft (108); a PEEK bearing (113) matching the side end of the driving shaft (108) is fixedly connected to the inner wall of the connecting hole of the connecting plug-in (109); and a supporting locking block (110) is arranged on the outer wall of the driving shaft (108).

10. The dephosphorization and deboronization and siliconization etching and cleaning equipment according to claim 1, characterized in that: A cleaning component is provided on one side of the pickling section (102) close to the outlet of the pickling and drying integrated chain machine body (1), and the cleaning component comprises a circulating water washing section (111) and a direct supply spraying section (112).

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