Automatic film removing equipment for circuit board

Abstract

The invention relates to automatic film removing equipment for a circuit board. The equipment comprises a circuit board feeding assembly, a first circuit board film tearing assembly, a circuit board turning assembly and a second circuit board film tearing assembly, the circuit board feeding assembly comprises a board feeding frame, a circuit board taking and placing mechanism and a partition paper taking and placing mechanism. The first circuit board film tearing assembly comprises a first rack, and a first film body starting mechanism, a first film body tearing mechanism and a first circuit board discharging mechanism which are arranged on the first rack; the circuit board turnover assembly comprises a turnover frame, a circuit board conveying mechanism arranged on the turnover frame and a circuit board turnover mechanism arranged on the conveying mechanism; the second circuit board film tearing assembly comprises a second rack, a second film body starting mechanism, a second film body tearing mechanism and a second circuit board discharging mechanism, wherein the second film body starting mechanism, the second film body tearing mechanism and the second circuit board discharging mechanism are arranged on the second rack. According to the invention, the problems that the efficiency is low, the film is easy to tear and damage, and the production efficiency and the product quality are influenced when the circuit board is fed, discharged and torn manually can be solved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, and in particular to automatic film removal equipment for circuit boards. Background Art

[0002] During the production of flexible circuit boards (circuit boards for short), some production processes require the installation of release films, shielding films and other protective films on the flexible boards to protect them, and the protective films need to be torn off after completing these production processes. Specifically, before the circuit boards are torn off, the circuit boards will be stacked and loaded on a tray. At this time, the stacked circuit boards will be separated by separator paper. When tearing off the protective film on the circuit boards, it is necessary to first separate the separator paper and the circuit boards, and then tear off the edges and corners of the protective film on the circuit boards, and then tear off the entire protective film from the starting position of the edges and corners of the protective film. After the protective film on the circuit boards is torn off, the torn circuit boards are stacked and stored in a tray. When storing the circuit boards, separator paper needs to be used to isolate and protect the circuit boards.

[0003] In traditional technology, circuit boards are usually loaded and unloaded manually, that is, the circuit boards and separators are separated or stacked manually, which has low loading and unloading efficiency and is prone to missing or missing separators. In addition, the protective film on the circuit board is manually torn off, which has low film tearing efficiency and is prone to tearing the protective film, resulting in residual protective film, affecting production efficiency and product quality. Summary of the invention

[0004] The invention provides an automatic film removal device for circuit boards, which can solve the technical problems that the traditional technology uses manual methods to load, unload and remove films on circuit boards, which is inefficient and easy to tear the protective film, thus affecting production efficiency and product quality.

[0005] In order to solve the above technical problems, the present invention provides an automatic film removal device for a circuit board, comprising:

[0006] The circuit board upper plate assembly comprises an upper plate frame, and a circuit board taking and placing mechanism and a spacer paper taking and placing mechanism correspondingly arranged on the upper plate frame;

[0007] A first circuit board film tearing assembly comprises a first frame, and a first film body starting mechanism, a first film body tearing mechanism, and a first circuit board unloading mechanism which are sequentially arranged on the first frame, wherein the first film body starting mechanism corresponds to and cooperates with the circuit board taking and placing mechanism;

[0008] A circuit board flip assembly comprises a flip frame, a circuit board conveying mechanism arranged on the flip frame, and a circuit board flipping mechanism arranged on the conveying mechanism, wherein the circuit board conveying mechanism is connected to the first circuit board unloading mechanism; and

[0009] The second circuit board film tearing assembly includes a second frame, and a second film starting mechanism, a second film tearing mechanism, and a second circuit board unloading mechanism which are sequentially arranged on the second frame. The second film starting mechanism is connected to the circuit board conveying mechanism.

[0010] The beneficial effects brought about by the technical solution provided by the present invention include:

[0011] The paper separation picking and placing mechanism of the circuit board upper plate assembly can automatically remove the paper separation on the circuit board stacked on the circuit board picking and placing mechanism, and automatically move the circuit board to the first rack of the first circuit board film tearing assembly through the circuit board picking and placing mechanism; the protective film on one surface (which can be set as the first surface) of the circuit board transferred to the first rack can be started to be torn off through the first film body tearing mechanism, and the protective film on the circuit board after the film is torn off can be torn off as a whole through the first film body tearing mechanism, and then the circuit board after the protective film on the first surface is torn off can be unloaded through the first circuit board unloading mechanism, and the circuit board can be transferred to the circuit board conveying mechanism of the circuit board flip assembly; the circuit board of the circuit board flip assembly The conveying mechanism can move the circuit board to the circuit board flipping mechanism, and the circuit board can be flipped by the circuit board flipping mechanism so that the protective film on the other surface of the circuit board (which can be regarded as the second surface opposite to the first surface) is in an upward position, and the first surface of the circuit board (with the protective film torn off) is facing downward, and then the circuit board can be conveyed to the second rack of the second circuit board film tearing assembly by the circuit board conveying mechanism; the protective film on the second surface of the circuit board is started to be torn off by the second film body starting mechanism of the second circuit board film tearing group, and the protective film on the second surface of the circuit board after the film tearing off can be torn off as a whole by the second film body tearing mechanism, and then the circuit board with the protective films on both sides torn off can be unloaded by the second circuit board unloading mechanism.

[0012] In this way, the circuit boards can be automatically loaded and unloaded, and the protective films on both sides of the circuit boards can be automatically torn off, which can greatly improve the film tearing efficiency. The protective film can be automatically torn off, and the tearing force and speed can be controlled. The protective film is not easily torn, thereby ensuring the overall production efficiency and product quality of the circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0014] Figure 1A simplified block diagram showing the structure of the automatic film removal device for circuit boards according to an embodiment of the present invention;

[0015] Figure 2 The three-dimensional structure diagram of the first circuit board film removal assembly (or the second circuit board film removal assembly) of the circuit board automatic film removal device according to the embodiment of the present invention is shown in FIG. Figure 1 ;

[0016] Figure 3 The three-dimensional structure diagram of the first circuit board film removal assembly (or the second circuit board film removal assembly) of the circuit board automatic film removal device according to the embodiment of the present invention is shown in FIG. Figure 2 ;

[0017] Figure 4 The three-dimensional structure diagram of the first circuit board film removal assembly (or the second circuit board film removal assembly) of the circuit board automatic film removal device according to the embodiment of the present invention is shown in FIG. Figure 3 ;

[0018] Figure 5 The three-dimensional structure diagram of the first circuit board film removal assembly (or the second circuit board film removal assembly) of the circuit board automatic film removal device according to the embodiment of the present invention is shown in FIG. Figure 4 ;

[0019] Figure 6 It is a schematic diagram of the three-dimensional structure of the circuit board upper plate assembly of the circuit board automatic film removal device according to an embodiment of the present invention;

[0020] Figure 7 Schematic diagram of the three-dimensional structure of the first film body starting mechanism (or the second film body starting mechanism) of the circuit board automatic film removal device according to the embodiment of the present invention Figure 1 ;

[0021] Figure 8 Schematic diagram of the three-dimensional structure of the first film body starting mechanism (or the second film body starting mechanism) of the circuit board automatic film removal device according to the embodiment of the present invention Figure 2 ;

[0022] Fig. 9 Schematic diagram of the three-dimensional structure of the first film tearing mechanism (or the second film tearing mechanism) of the automatic film removal device for circuit board according to the embodiment of the present invention Figure 1 ;

[0023] Fig.10 It is a three-dimensional structural schematic diagram of the film tearing positioning platform mechanism of the first film tearing mechanism (or the second film tearing mechanism) in an embodiment of the present invention;

[0024] Fig.11 It is a schematic diagram of the three-dimensional structure of the entire film tearing mechanism of the first film tearing mechanism (or the second film tearing mechanism) according to an embodiment of the present invention.

[0025] In the figure: 10, automatic film removal equipment for circuit boards; 100, circuit board upper plate assembly; 110, upper plate rack; 120, circuit board pick-up and placement mechanism; 122, circuit board storage structure; 124, circuit board pick-up and placement drive; 126, circuit board adsorption plate; 130, paper separation pick-up and placement mechanism; 132, paper separation storage structure; 134, paper separation pick-up and placement drive; 1342, horizontal drive structure for picking and placing materials; 1344, vertical drive structure for picking and placing materials; 136, paper separation adsorption plate; 1362, main board for picking and placing materials; 1364, vacuum suction nozzle; 200, first circuit board film tearing assembly; 202, first frame; 204, first film body starting mechanism; 206, first film body tearing mechanism; 208, first circuit board unloading mechanism; 210, flexible board posture Adjustment mechanism; 212, posture visual detection mechanism; 214, flexible plate material adjustment mechanism; 2142, posture adjustment drive structure; 2144, posture adjustment material plate; 220, flexible plate head positioning mechanism; 222, flexible plate lifting support mechanism; 2222, lifting support seat; 2224, lifting drive structure; 2226, lifting support plate; 224, flexible plate clamping positioning mechanism; 2242, clamping positioning frame; 22422, positioning bottom frame; 22424, positioning adjustment slide rail; 22426, clamping positioning plate; 2244, flexible plate clamping mechanism; 22442, fixed clamping claw drive member (adjusting clamping claw drive member); 22444, fixed clamping claw (adjusting clamping claw); 22446, clamp linear drive structure; 22448, Telescopic adjustment drive member; 230, flexible plate ejector head mechanism; 232, ejector platform drive structure; 2322, ejector platform transverse conveyor; 23222, transverse drive motor; 23224, transverse drive shaft; 23226, transverse driven shaft; 23228, transverse drive belt structure; 2324, ejector platform longitudinal drive member; 234, ejector head platform; 2342, ejector platform seat; 2344, ejector head structure; 240, film tearing and feeding mechanism; 242, film tearing and feeding drive structure; 244, film tearing and feeding plate; 250, film tearing positioning platform mechanism; 252, film tearing platform drive structure; 2522, film tearing platform bracket; 2524, film tearing platform drive motor; 2526, film tearing platform rotating shaft; 2 528, film-tearing transmission structure; 254, flexible film-tearing platform; 2542, film-tearing platform seat; 2544, film-tearing platform guide rail; 2546, film-tearing adsorption plate; 2548, plate lifting guide structure; 260, film-body overall tearing mechanism; 262, film-tearing base; 264, film-tearing head driving mechanism; 2642, first film-tearing head driving member; 2644, second film-tearing head driving member; 2646, third film-tearing head driving member; 266, flexible film-tearing head mechanism; 2662, film-tearing head mounting seat; 2664, film-tearing head rotating driving member; 2666, film-shoveling structure; 26662, film-shoveling driving member; 26664, film-shoveling head; 2668, film-clamping structure; 26682, film-clamping driving member; 26684, film-tearing clamping claw;268, film tearing rod structure; 2682, film tearing rod driving member; 2684, film tearing rod mounting seat; 2686, auxiliary film tearing rod; 270, circuit board unloading pick-up and placement assembly; 272, circuit board unloading storage structure; 274, circuit board unloading pick-up and placement structure; 280, unloading paper separation pick-up and placement assembly; 282, unloading paper separation storage structure; 284, unloading paper separation pick-up and placement structure; 300, circuit board flip assembly; 310, flip rack; 320, circuit board conveying mechanism; 330, circuit board flipping mechanism; 400, second circuit board film tearing assembly; 402, second rack; 404, second film body starting mechanism; 406, second film body tearing mechanism; 408, second circuit board unloading mechanism. ; DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] like Figure 1 As shown, the present invention provides an automatic circuit board film removal device 10, comprising a circuit board upper plate assembly 100, a first circuit board film tearing assembly 200, a circuit board flip assembly 300, and a second circuit board film tearing assembly 400, which are arranged in sequence. The circuit board upper plate assembly 100 can automatically load the circuit board onto the first circuit board film tearing assembly 200, the first circuit board film tearing assembly 200 can automatically tear off the protective film on one side of the circuit board, and the circuit board flip assembly 300 can automatically turn the circuit board over so that the torn side of the circuit board faces downward and the other side of the circuit board faces upward, and the second circuit board film tearing assembly 400 can automatically tear off the protective film on the other side of the circuit board.

[0028] Moreover, the circuit board upper plate assembly 100 may include an upper plate frame 110, and a circuit board pick-up and placement mechanism 120 and a spacer paper pick-up and placement mechanism 130 correspondingly arranged on the upper plate frame 110. Moreover, the first circuit board film tearing assembly 200 may include a first frame 202, and a first film body starting mechanism 204, a first film body tearing mechanism 206, and a first circuit board unloading mechanism 208 sequentially arranged on the first frame 202, and the first film body starting mechanism 204 is correspondingly matched with the circuit board pick-up and placement mechanism 120. Moreover, the circuit board flipping assembly 300 may include a flipping frame 310, a circuit board conveying mechanism 320 arranged on the flipping frame 310, and a circuit board flipping mechanism 330 arranged on the conveying mechanism, and the circuit board conveying mechanism 320 is connected to the first circuit board unloading mechanism 208. Moreover, the second circuit board film tearing assembly 400 may include a second frame 402 , and a second film starting mechanism 404 , a second film tearing mechanism 406 , and a second circuit board unloading mechanism 408 sequentially arranged on the second frame 402 , and the second film starting mechanism 404 is connected to the circuit board conveying mechanism 320 .

[0029] The paper separators on the stacked circuit boards on the circuit board placement mechanism 120 can be automatically removed through the paper separator picking and placing mechanism 130 of the circuit board upper plate assembly 100, and the circuit boards can be automatically moved to the first frame 202 of the first circuit board film tearing assembly 200 through the circuit board placement mechanism 120; the protective film on one surface (which can be set as the first surface) of the circuit board transferred to the first frame 202 can be started to be torn off through the first film body starting mechanism 204 of the first circuit board film tearing assembly 200, and the protective film on the circuit board after the film tearing off can be torn off as a whole through the first film body tearing mechanism 206, and then the circuit board after the protective film on the first surface is torn off can be unloaded through the first circuit board unloading mechanism 208, and the circuit board can be transferred to the circuit board conveying mechanism 320 of the circuit board flip assembly 300.

[0030] Moreover, the circuit board can be transferred to the circuit board flipping mechanism 330 (which can be set as a rotating flipping structure) through the circuit board conveying mechanism 320 (which can be set as a belt conveying structure) of the circuit board flipping assembly 300, and the circuit board can be flipped through the circuit board flipping mechanism 330 so that the protective film on the other surface of the circuit board (which can be regarded as the second surface opposite to the first surface) is in an upward position, and the first surface of the circuit board (the protective film has been torn off) is facing downward, and then the circuit board can be conveyed to the second frame 402 of the second circuit board film tearing assembly 400 through the circuit board conveying mechanism 320; the protective film on the second surface of the circuit board is torn off through the second film body starting mechanism 404 of the second circuit board film tearing group, and the protective film on the second surface of the circuit board after the film tearing off can be torn off as a whole through the second film body tearing mechanism 406, and then the circuit board with the protective films on both sides torn off can be unloaded through the second circuit board unloading mechanism 408.

[0031] In this way, the circuit boards can be automatically loaded and unloaded, and the protective films on both sides of the circuit boards can be automatically torn off, which can greatly improve the film tearing efficiency. The protective film can be automatically torn off, and the tearing force and speed can be controlled. The protective film is not easily torn, thereby ensuring the overall production efficiency and product quality of the circuit boards.

[0032] Specifically, Figures 2 to 6 As shown, the paper separation pick-up and placement mechanism 130 of the circuit board upper plate assembly 100 may include a paper separation storage structure 132 provided on the upper plate frame 110, a paper separation pick-up and placement driving member 134 provided above the paper separation storage structure 132, and a paper separation adsorption plate 136 provided on the paper separation pick-up and placement driving member 134, and the paper separation adsorption plate 136 is arranged correspondingly to the paper separation storage structure 132. Moreover, the circuit board pick-up and placement mechanism 120 may include a circuit board storage structure 122 provided on the upper plate frame 110, a circuit board pick-up and placement driving member 124 provided above the circuit board storage structure 122, a circuit board adsorption plate 126 provided on the circuit board pick-up and placement driving member 124, and a circuit board transfer mechanism provided corresponding to the first film body starting mechanism 204 or the second film body starting mechanism 404, and the circuit board adsorption plate 126 is provided correspondingly to the circuit board storage structure 122 and the circuit board transfer mechanism.

[0033] The paper separator storage structure 132 can be used to stack and store paper separators, and the circuit board storage structure 122 is used to stack and store circuit boards covered with paper separators. The paper separator pick-up and placement drive 134 can drive the paper separator adsorption plate 136 to move to the top of the circuit board storage structure 122 of the circuit board pick-up and placement mechanism 120, and drive the paper separator adsorption plate 136 to take the paper separators on the circuit board stored at the circuit board storage structure 122, and transfer the paper separators to the paper separator storage structure 132 for storage; then the circuit board pick-up and placement drive 124 can drive the circuit board adsorption plate 126 to move to the circuit board storage structure 122, take the circuit board after the paper separators are removed, and transfer the circuit board to the circuit board transfer mechanism, and transfer the circuit board to the first circuit board film tearing assembly 200 through the circuit board transfer mechanism, so as to tear off the protective film on the first surface of the circuit board through the first circuit board film tearing assembly 200.

[0034] Furthermore, the paper storage structure 132 may include a paper storage bin disposed on the upper frame 110; the circuit board storage structure 122 may also include a circuit board storage bin disposed on the upper frame 110. Moreover, the paper storage structure 132 may also include a paper bin lifting structure disposed on the upper frame 110, the paper bin lifting structure being connected to the bottom of the paper storage bin and used to lift and move the paper storage bin storing the paper; the circuit board storage structure 122 may also include a circuit board bin lifting structure disposed on the upper frame 110, the circuit board bin lifting structure being connected to the bottom of the circuit board storage bin and used to lift and move the circuit board storage bin storing the circuit board. Both the paper bin lifting structure and the circuit board bin lifting structure may be configured as a motor lifting drive structure or a cylinder lifting drive structure.

[0035] Moreover, both the paper pick-up and placement drive 134 and the circuit board pick-up and placement drive 124 may include a material pick-up and placement horizontal drive structure 1342 disposed on the upper plate frame 110, and a material pick-up and placement vertical drive structure 1344 disposed on the material pick-up and placement horizontal drive structure 1342. Moreover, the material pick-up and placement horizontal drive structure 1342 may include at least one of a material pick-up and placement horizontal transverse drive member and a material pick-up and placement horizontal longitudinal drive member. Moreover, the material pick-up and placement horizontal transverse drive member, the material pick-up and placement horizontal longitudinal drive member, and the material pick-up and placement vertical drive structure 1344 may all be configured as a motor linear drive module or a cylinder linear drive module. In addition, both the paper pick-up and placement adsorption plate 136 and the circuit board adsorption plate 126 may include a material pick-up and placement mainboard 1362 connected to the material pick-up and placement vertical drive structure, and a vacuum adsorption hole or / and a vacuum suction nozzle 1364 disposed on the bottom surface of the material pick-up and placement mainboard 1362.

[0036] In addition, the circuit board transfer mechanism may include a circuit board transfer drive disposed between the upper plate frame 110 and the first frame 202, and a circuit board carrier connected to the circuit board transfer drive. The circuit board carrier can receive the circuit board obtained by the circuit board picking and placing mechanism 120, and the circuit board carrier and the circuit board carried by it can be driven by the circuit board transfer drive to move to the first film starting mechanism 204 on the first frame 202 to perform starting processing on the protective film on the circuit board.

[0037] In addition, the circuit board upper plate assembly 100 can be independently arranged relative to the first circuit board film tearing assembly 200 or the second circuit board film tearing assembly 400, or can be arranged on the first circuit board film tearing assembly 200, that is, the upper plate frame 110 of the circuit board upper plate assembly 100 can be arranged on the first frame 202. Moreover, the circuit board transfer mechanism can not only be independently arranged, but also be set as the same structure as the circuit board pick-up and placement mechanism 120, that is, the circuit board can be transferred to the first film body starting mechanism 204 of the first circuit board film tearing assembly 200 through the circuit board pick-up and placement mechanism 120.

[0038] Moreover, the paper separation pick-up and placement driving member 134 of the paper separation pick-up and placement mechanism 130 and the circuit board pick-up and placement driving member 124 of the circuit board pick-up and placement mechanism 120 can not only be independently provided, but also be provided with the same structure; correspondingly, the paper separation adsorption plate 136 of the paper separation pick-up and placement mechanism 130 and the circuit board adsorption plate 126 of the circuit board pick-up and placement mechanism 120 can not only be independently provided, but also be provided with the same structure. In this way, the circuit board adsorption plate 126 can be driven by the circuit board pick-up and placement driving member 124 to pick up and place the circuit board, and can also pick up and place the paper separation.

[0039] In addition, if Figures 2 to 5 As shown, the first film body starting mechanism 204 of the first circuit board film tearing assembly 200 and the second film body starting mechanism 404 of the second circuit board film tearing assembly 400 both include a flexible plate posture adjustment mechanism 210, a flexible plate starting positioning mechanism 220, and a flexible plate ejector starting mechanism 230, which are arranged on the first frame 202 or the second frame 402. The flexible plate posture adjustment mechanism 210 can be used to obtain and shape the circuit board delivered by the circuit board transfer mechanism or the circuit board pick-and-place mechanism 120, and the shaped circuit board is placed on the flexible plate starting positioning mechanism 220 for positioning and fixing, and then the protective film on the positioned circuit board is started by the flexible plate ejector starting mechanism 230 (i.e., the corners of the protective film are lifted up to make the corners of the protective film tilted, so as to facilitate the subsequent overall tearing off of the protective film from the tilted position).

[0040] Specifically, Figures 2 to 5 As shown, the flexible board posture adjustment mechanism 210 may include a posture visual detection mechanism 212 disposed on the first frame 202 or the second frame 402, and a flexible board material adjustment mechanism 214 disposed corresponding to the posture visual detection mechanism 212. The posture visual detection mechanism 212 can detect the posture of the circuit board conveyed by the circuit board transfer mechanism or the circuit board pick-and-place mechanism 120, and the flexible board material adjustment mechanism 214 can obtain and transfer the circuit board. Moreover, when the circuit board is transferred by the flexible board material adjustment mechanism 214, the posture of the circuit board can be adjusted so that the circuit board meets the positioning and fixing requirements of the flexible board head positioning mechanism 220 and meets the lifting requirements of the flexible board ejector head mechanism 230.

[0041] Furthermore, if Figure 7As shown, the flexible board picking adjustment mechanism 214 may include a posture adjustment drive structure 2142 disposed on the first frame 202 or the second frame 402, and a posture adjustment picking plate 2144 connected to the posture adjustment drive structure 2142, and the posture adjustment picking plate 2144 is arranged corresponding to the posture visual detection mechanism 212. The posture adjustment drive structure can drive the posture adjustment picking plate to pick up the circuit board transferred by the circuit board transfer mechanism, and transfer the circuit board to the flexible board starting positioning mechanism 220 for positioning. Moreover, during the transfer process, the posture of the obtained circuit board can be adjusted and shaped. Moreover, the posture adjustment drive structure 2142 can move the posture adjustment picking plate 2144 horizontally (including horizontal lateral or / and horizontal longitudinally) and vertically (i.e., lifting and lowering); in addition, the posture adjustment picking plate 2144 can also be rotated. The posture adjustment picking plate 2144 can absorb and grab the circuit board, and its specific structure is similar to the specific structure of the paper separation adsorption plate 136 (and the circuit board adsorption plate 126). In addition, the posture visual detection mechanism 212 may include a visual detection camera module disposed on the first frame 202 or the second frame 402 .

[0042] Moreover, the flexible board material picking adjustment mechanism 214 can be set up separately, or it can be set up as the same structure as the circuit board transfer mechanism or the circuit board pick-up and placement mechanism 120, that is, the circuit board can be transferred to the flexible board starting positioning mechanism 220 through the circuit board transfer mechanism or the circuit board pick-up and placement mechanism 120, and the posture of the circuit board can also be adjusted at the same time.

[0043] In addition, if Figures 2 to 5 As shown, the flexible board starting positioning mechanism 220 may include a flexible board lifting support mechanism 222 disposed on the first frame 202 or the second frame 402, and a flexible board clamping positioning mechanism 224 disposed above the flexible board lifting support mechanism 222, and the flexible board material adjustment mechanism 214 is correspondingly located between the circuit board picking and placing mechanism 120 and the flexible board clamping positioning mechanism 224. When the circuit board is moved and placed onto the flexible board clamping positioning mechanism 224 through the flexible board material adjustment mechanism 214, the circuit board can be supported from the bottom by the flexible board lifting support mechanism 222, so that the flexible board clamping positioning mechanism 224 can clamp and position the circuit board from the peripheral side.

[0044] Further, the flexible board lifting support mechanism 222 may include a lifting support seat 2222 disposed on the first frame 202 or the second frame 402, a lifting drive structure 2224 disposed on the lifting support seat 2222, and a lifting support plate 2226 slidably disposed on the lifting support seat 2222 and connected to the lifting drive structure 2224, wherein a plurality of adsorption holes are disposed on the lifting support plate 2226. The lifting drive structure 2224 can drive the lifting support plate 2226 to rise to a height position flush with the flexible board clamping and positioning mechanism 224, and the lifting support plate 2226 can be used to adsorb and support the circuit board to be clamped, and then the flexible board clamping and positioning mechanism 224 can clamp and position the circuit board from all sides; after the clamping and positioning of the circuit board is completed, the lifting drive structure 2224 can drive the lifting support plate 2226 to descend, so that the flexible board ejector pin starting mechanism 230 can start the protective film on the positioned circuit board. In addition, the lifting drive structure 2224 can be set as a cylinder drive structure or a motor drive structure.

[0045] Moreover, the flexible board clamping and positioning mechanism 224 may include a clamping and positioning frame 2242 disposed on the first frame 202 or the second frame 402, and a flexible board clamping mechanism 2244 disposed around the clamping and positioning frame 2242, wherein the flexible board clamping mechanism 2244 is located below the flexible board material taking and adjusting mechanism 214 and above the flexible board lifting and supporting mechanism 222. The flexible board lifting and supporting mechanism 222 may be located below the clamping and positioning frame 2242, the lifting and supporting plate 2226 corresponds to the middle gap of the clamping and positioning frame 2242, and the flexible board clamping mechanism 2244 corresponds to the surroundings of the lifting and supporting plate 2226, so that the circuit board supported by the lifting and supporting plate 2226 can be clamped and fixed from all sides.

[0046] Furthermore, if Figure 7 and Figure 8 As shown, the clamping and positioning frame 2242 may include a positioning bottom frame 22422 disposed on the first frame 202 or the second frame 402, a positioning adjustment slide rail 22424 disposed at each end of the positioning bottom frame 22422, and two clamping and positioning plates 22426 slidably disposed on the two positioning adjustment slide rails 22424 side by side (the two ends of each clamping and positioning plate 22426 are slidably disposed on the two positioning adjustment slide rails 22424 respectively), and the flexible board clamp mechanism 2244 is disposed on the two clamping and positioning plates 22426. By sliding the two clamping and positioning plates 22426 on the two positioning adjustment slide rails 22424, the distance between the two clamping and positioning plates 22426 can be adjusted to adapt to circuit boards of different widths.

[0047] Moreover, the flexible board clamp mechanism 2244 may include fixed positioning clamps and adjustable positioning clamps respectively arranged around the two clamping positioning plates 22426 of the clamping positioning frame 2242, and the fixed positioning clamps and adjustable positioning clamps are respectively located around the flexible board lifting support mechanism 222. By respectively arranging a plurality of fixed positioning clamps and adjustable positioning clamps on the two clamping positioning plates 22426, the circuit board can be clamped from different positions on both sides of the circuit board. Moreover, by making the flexible board clamp mechanism 2244 include fixed positioning clamps and adjustable positioning clamps, the fixed positioning clamp can clamp the circuit board from a fixed position, and the adjustable positioning clamp can clamp the circuit board from different positions, so that the clamping and positioning of the circuit board is flexible and reliable.

[0048] Furthermore, the fixed positioning fixture may include a fixed clamping claw driving member 22442 disposed on the clamping positioning plate 22426, and a fixed clamping claw 22444 connected to the fixed clamping claw driving member 22442. The fixed clamping claw 22444 may be driven to tighten or loosen by the fixed clamping claw driving member 22442 to clamp or loosen the edge of the circuit board.

[0049] Moreover, the adjusting and positioning fixture may include a fixture linear driving structure 22446 or / and a telescopic adjusting driving member 22448 provided on the clamping and positioning plate 22426, an adjusting clamping claw driving member provided on the fixture linear driving structure 22446 or the telescopic adjusting driving member 22448, and an adjusting clamping claw connected to the adjusting clamping claw driving member. That is, the adjusting and positioning fixture may include at least one of the fixture linear driving structure 22446 and the telescopic adjusting driving member 22448, and the adjusting clamping claw may be linearly driven or / and telescopically adjusted; and, by adjusting the clamping claw driving member, the adjusting clamping claw may be driven to tighten or loosen, so as to clamp or loosen the edge of the circuit board. Moreover, by the fixture linear driving structure 22446, the adjusting clamping claw may be linearly moved over a long distance, and the position of the adjusting clamping claw may be roughly adjusted; and by the telescopic adjusting driving member 22448, the adjusting clamping claw may be telescopically moved over a short distance, and the position of the adjusting clamping claw may be finely adjusted. In this way, the clamping and positioning of the circuit board can be accurate and reliable.

[0050] In some embodiments, the adjustment and positioning fixture may include a fixture linear drive structure 22446 disposed on the clamping and positioning plate 22426, a telescopic adjustment driving member 22448 disposed on the fixture linear drive structure 22446, an adjustment jaw driving member disposed on the telescopic adjustment driving member 22448, and an adjustment jaw connected to the adjustment jaw driving member. In this case, the adjustment and positioning fixture includes both the fixture linear drive structure 22446 and the telescopic adjustment driving member 22448.

[0051] In addition, in other embodiments, the adjustment and positioning fixture may include a telescopic adjustment driving member 22448 disposed on the clamping and positioning plate 22426, an adjustment jaw driving member disposed on the telescopic adjustment driving member 22448, and an adjustment clamping jaw connected to the adjustment jaw driving member. In this case, the adjustment and positioning fixture only includes the telescopic adjustment driving member 22448.

[0052] In addition, in other embodiments, the adjustment and positioning fixture may include a fixture linear drive structure 22446 disposed on the clamping and positioning plate 22426, an adjustment clamping claw driving member disposed on the fixture linear drive structure 22446, and an adjustment clamping claw connected to the adjustment clamping claw driving member. In this case, the adjustment and positioning fixture only includes the fixture linear drive structure 22446.

[0053] Moreover, the flexible plate clamp mechanism 2244 may include a first adjustment and positioning clamp and a second adjustment and positioning clamp respectively disposed on the clamping and positioning plate 22426, and the telescopic driving direction of the telescopic adjustment driving member 22448 of the first adjustment and positioning clamp is the same as or perpendicular to the telescopic driving direction of the telescopic adjustment driving member 22448 of the second adjustment and positioning clamp. That is, when both adjustment and positioning clamps include the telescopic adjustment driving member 22448, the telescopic driving directions of the two telescopic adjustment driving members 22448 may extend along the length direction or the width direction of the circuit board; in addition, the telescopic driving direction of one telescopic adjustment driving member 22448 may extend along the length direction of the circuit board, and the telescopic driving direction of the other telescopic adjustment driving member 22448 may extend along the width direction of the circuit board.

[0054] In addition, the fixture linear drive structure 22446 may include a fixture rail arranged along the extension direction of the clamping and positioning plate 22426 (referring to the length direction of the clamping and positioning plate 22426, which may correspond to the length direction of the circuit board), and a fixture linear drive module arranged on the clamping and positioning plate 22426, and the fixture linear drive module is connected to the telescopic adjustment drive member 22448 or the adjustment clamping claw drive member slidably arranged on the fixture rail. The clamp linear drive module can drive the adjustment clamping claw to move back and forth linearly along the fixture rail in the length direction of the clamping and positioning plate 22426 to adapt to circuit boards of different lengths. In addition, the fixture linear drive module can be set as a motor linear drive module or a cylinder linear drive module; the adjustment clamping claw drive member and the fixed clamping claw drive member 22442 can both be set as a cylinder drive structure.

[0055] In addition, if Figure 7 and Figure 8As shown, the flex board ejector head mechanism 230 may include an ejector platform driving structure 232 disposed on the first frame 202 or the second frame 402, an ejector head platform 234 disposed on the ejector platform driving structure 232, and a head visual detection mechanism disposed on the side of the ejector head platform 234, and the ejector head platform 234 and the head visual detection mechanism are located below the flex board clamping and positioning mechanism 224. After the circuit board is clamped and positioned by the flex board clamping and positioning mechanism 224, the ejector head platform 234 can be driven by the ejector platform driving structure 232 below to move to the corner position of the positioned circuit board, and the protective film at the corner of the circuit board is ejected and headed by the ejector head platform 234, so that the corner of the protective film on the circuit board is tilted. Moreover, in the process of driving the ejector platform 234 to move to the corner position of the positioned circuit board through the ejector platform driving structure 232, the circuit board can be visually inspected by the starting visual inspection mechanism to detect and determine whether the ejector platform 234 has moved to the corner starting position of the circuit board.

[0056] Further, the ejector platform driving structure 232 may include an ejector platform transverse conveying member 2322 disposed on the first frame 202 or the second frame 402, and an ejector platform longitudinal driving member 2324 disposed on the ejector platform transverse conveying member 2322, and the ejector head platform 234 is disposed on the ejector platform longitudinal driving member 2324. The ejector head platform 234 may be moved and conveyed in the transverse direction by the ejector platform transverse conveying member 2322, and the ejector head platform 234 may be moved and adjusted in the longitudinal direction by the ejector platform longitudinal driving member 2324, so that the ejector head platform 234 corresponds to the starting position of the corner of the positioned circuit board in the upper and lower directions.

[0057] Furthermore, the ejector platform transverse conveying member 2322 includes a transverse driving motor 23222 arranged on the first frame 202 or the second frame 402, a transverse driving shaft 23224 connected to the transverse driving motor 23222, a transverse driven shaft 23226 arranged side by side with the transverse driving shaft 23224, and two transverse transmission belt structures 23228 connected side by side to the transverse driving shaft 23224 and the transverse driven shaft 23226, and the ejector platform longitudinal driving member 2324 is arranged between the two transverse transmission belt structures 23228. The lateral drive motor 23222 can drive the lateral drive shaft 23224 to rotate, thereby driving the lateral drive belt structures 23228 disposed on both sides of the lateral drive shaft 23224 to operate, so that the two lateral drive belt structures 23228 drive the ejector platform longitudinal drive member 2324 to move in the lateral direction, and thus drive the ejector starter platform 234 to move in the lateral direction. In addition, the ejector platform transverse conveyor 2322 can also include two platform transverse guide rails disposed side by side on the first frame 202 or the second frame 402, each platform transverse guide rail extending along the transmission direction of the transverse drive belt structure 23228, and the two sides of the ejector platform longitudinal drive member 2324 are respectively slidably disposed on the two platform transverse guide rails.

[0058] Moreover, the ejector platform longitudinal movement driving member 2324 may include a platform longitudinal movement seat connected between two transverse movement transmission belt structures 23228, a platform longitudinal movement guide rail disposed on the platform longitudinal movement seat, and a platform longitudinal movement driving module disposed on the platform longitudinal movement seat, and the ejector head platform 234 is connected to the platform longitudinal movement driving module and slidably disposed on the platform longitudinal movement guide rail. The two transverse movement transmission belt structures 23228 synchronously drive the platform longitudinal movement seat to move laterally from both sides, and the platform longitudinal movement driving module disposed on the platform longitudinal movement seat can drive the ejector head platform 234 to slide longitudinally along the platform longitudinal movement guide rail, so that the ejector head platform 234 is aligned with the corner starting position of the positioned circuit board. In addition, the platform longitudinal movement driving module can be set as a motor linear drive module.

[0059] In addition, the ejector platform 234 may include an ejector platform seat 2342 connected to a platform longitudinal drive module disposed on the ejector platform longitudinal drive member 2324, and a plurality of ejector head structures 2344 disposed on the ejector platform seat 2342, wherein the ejector platform seat 2342 and the ejector head structures 2344 are both located below the flexible board clamping and positioning mechanism 224. The ejector platform seat 2342 can be used to lift and start the corners of the protective film on the circuit board clamped and positioned by the flexible board clamping and positioning mechanism 224 (an ejector hole can be pre-arranged at the corner position of the circuit board, and the ejector head structure 2344 can lift and start the protective film on the surface of the circuit board through the ejector hole on the circuit board). Moreover, by disposing a plurality of ejector head structures 2344 on the ejector platform seat 2342, the corners of the protective film on the circuit board can be started from multiple positions, and the starting effect is good.

[0060] Further, the ejector platform seat 2342 may include a platform base plate arranged on the ejector platform longitudinal movement driving member 2324, a platform lifting driving member arranged on the platform base plate, and a platform top plate arranged on the top of the platform lifting driving member, the side of the platform top plate is slidably connected to the side of the platform base plate, and the starting visual detection mechanism is arranged on the side of the platform base plate or the platform top plate. The platform lifting driving member can drive the platform top plate to move up and down, thereby driving the multiple ejector starting structures 2344 arranged around the platform top plate to move up and down, so that the ejector starting structures 2344 are close to or away from the circuit board to be started. Moreover, the two sides of the platform top plate can be slidably connected to the two sides of the platform base plate in a one-to-one correspondence, so that the lifting and moving of the platform top plate is stable and reliable. The starting visual detection mechanism can perform visual detection on the circuit board during the movement of the ejector platform seat 2342 to determine whether the ejector starting platform 234 has moved to the corner starting position of the circuit board.

[0061] Moreover, each ejector pin starting structure 2344 may include an ejector pin telescopic drive member disposed on the peripheral side of the platform top plate, and a starting ejector pin disposed on the top of the ejector pin telescopic drive member, and the ejector pin telescopic drive member is used to drive the starting ejector pin to move up and down on the platform top plate. The ejector pin telescopic drive member can be driven to move up and down, and the starting ejector pin can be driven to protrude outside the platform top plate or shrink inside the platform top plate. When the starting ejector pin protrudes outside the platform top plate, the corner position of the protective film of the circuit board above the platform top plate can be lifted up (i.e., the corner of the protective film is separated from the circuit board and tilted up). In addition, the ejector pin telescopic drive member can be set as a cylinder drive structure.

[0062] In addition, if Figures 2 to 5As shown, the first film tearing mechanism 206 of the first circuit board film tearing assembly 200 and the second film tearing mechanism 406 of the second circuit board film tearing assembly 400 can both include a film tearing material discharging mechanism 240, a film tearing positioning platform mechanism 250, and a film body integral tearing mechanism 260, which are arranged on the first frame 202 or the second frame 402. After the protective film on the circuit board is started by the first film body starting mechanism 204 or the second film body starting mechanism 404, the film tearing material discharging mechanism 240 of the first film body tearing mechanism 206 or the second film body tearing mechanism 406 can grab and transfer the started circuit board, place the circuit board on the film tearing positioning platform mechanism 250, position the circuit board by the film tearing positioning platform mechanism 250, and transport the positioned circuit board to the film body integral tearing mechanism 260, and the protective film on the circuit board can be completely torn off from the starting position by the film body integral tearing mechanism 260.

[0063] Specifically, Figures 9 to 11 As shown, the film tearing and placing mechanism 240 may include a film tearing and placing driving structure 242 disposed on the first frame 202 or the second frame 402, and a film tearing and placing plate 244 disposed on the film tearing and placing driving structure 242, and the film tearing and placing plate 244 is correspondingly matched with the first film body starting mechanism 204 or the second film body starting mechanism 404. The film tearing and placing driving structure 242 can drive the film tearing and placing plate 244 to move to the first film body starting mechanism 204 or the second film body starting mechanism 404, grab and move the circuit board after the first film body starting mechanism 204 or the second film body starting mechanism 404, and place the circuit board after the starting on the film tearing positioning platform mechanism 250 for positioning. In addition, the specific structure of the film tearing and placing driving structure 242 is similar to the specific structure of the circuit board placing and placing driving member 124 described above, and the specific structure of the film tearing and placing plate 244 is similar to the specific structure of the circuit board adsorption plate 126 described above.

[0064] In addition, the film tearing positioning platform mechanism 250 may include a film tearing platform driving structure 252 disposed on the first frame 202 or the second frame 402, and a flexible film tearing platform 254 disposed on the film tearing platform driving structure 252, and the film tearing material taking and unloading plate 244 is located above the flexible film tearing platform 254. The film tearing platform driving structure 252 can drive the flexible film tearing platform 254 to move, and the flexible film tearing platform 254 can be moved to a position corresponding to the film tearing material taking and unloading plate 244 of the film tearing material taking and unloading mechanism 240 to receive and position the circuit board transferred by the film tearing material taking and unloading plate 244, and the flexible film tearing platform 254 can also be moved to the film body integral tearing mechanism 260, so that the protective film of the circuit board positioned on the flexible film tearing platform 254 can be integrally torn off by the film body integral tearing mechanism 260.

[0065] Furthermore, the film tearing platform driving structure 252 may include a film tearing platform bracket 2522 arranged on the first frame 202 or the second frame 402, a film tearing platform driving motor 2524 arranged on the film tearing platform bracket 2522, a film tearing platform rotating shaft 2526 connected to the film tearing platform driving motor 2524, and a film tearing transmission structure 2528 arranged on the film tearing bracket, the film tearing platform rotating shaft 2526 is connected to the film tearing transmission structure 2528, and the flexible plate film tearing platform 254 is arranged on the film tearing transmission structure 2528. The film tearing platform driving motor 2524 can drive the film tearing platform rotating shaft 2526 to drive the film tearing conveying structure 2528 to operate, so that the film tearing conveying structure 2528 drives the flexible plate film tearing platform 254 to move to the bottom of the film tearing material taking and discharging plate 244 of the film tearing material taking and discharging mechanism 240 to receive the circuit board, and can also make the flexible plate film tearing platform 254 move to the bottom of the film body tearing off mechanism 260, so that the film body tearing off mechanism 260 can tear the circuit board on the flexible plate film tearing platform 254.

[0066] Moreover, the flexible plate film-tearing platform 254 may include a film-tearing platform seat 2542 connected to the film-tearing conveying structure 2528, a film-tearing platform guide rail 2544 provided on the film-tearing platform bracket 2522, and a film-tearing adsorption plate 2546 provided on the film-tearing platform seat 2542, and the film-tearing adsorption plate 2546 or the film-tearing platform seat 2542 is slidably provided on the film-tearing platform guide rail 2544. Moreover, the film-tearing conveying structure 2528 includes a film-tearing conveyor belt provided on both sides of the film-tearing platform rotating shaft 2526, respectively, and the two film-tearing platform seats 2542 of the flexible plate film-tearing platform 254 are provided on the two film-tearing conveyor belts, respectively, so that the film-tearing adsorption plate 2546 can move together with the two film-tearing conveyor belts. Moreover, the two sides of the film-tearing adsorption plate 2546 are slidably provided on the two film-tearing platform guide rails 2544 on the film-tearing platform bracket 2522, respectively, so that the film-tearing adsorption plate 2546 can move stably and reliably.

[0067] In some embodiments, the flexible plate film-tearing platform 254 may include two film-tearing adsorption flat plates 2546 arranged in a staggered manner, wherein one of the film-tearing adsorption flat plates 2546 corresponds vertically to the film-tearing material taking and placing plate 244, and the other film-tearing adsorption flat plate 2546 corresponds vertically to the flexible plate film-tearing head mechanism 266. Through the two staggered film-tearing adsorption flat plates 2546, one film-tearing adsorption flat plate 2546 can receive the circuit board transferred by the film-tearing material taking and placing plate 244, and at the same time, the other film-tearing adsorption flat plate 2546 can transfer the received circuit board to the bottom of the flexible plate film-tearing head mechanism 266 for film-tearing, which can greatly improve the film-tearing efficiency.

[0068] Furthermore, the flexible film tearing platform 254 may include a first film tearing platform seat 2542 and a second film tearing platform seat 2542 respectively connected to the upper and lower sides of the film tearing conveying structure 2528, a first film tearing platform guide rail 2544 and a second film tearing platform guide rail 2544 respectively arranged on the upper and lower sides of the film tearing platform bracket 2522, and a first film tearing adsorption plate 2546 arranged on the first film tearing platform seat 2542 and slidably arranged on the first film tearing platform guide rail 2544, a second film tearing adsorption plate 2546 arranged on the second film tearing platform seat 2542, the second film tearing platform seat 2542 is slidably arranged on the second film tearing platform guide rail 2544, and the first film tearing adsorption plate 2546 and the second film tearing adsorption plate 2546 are staggered.

[0069] Specifically, a first film-tearing platform seat 2542 may be provided on the upper side of the two film-tearing conveyor belts of the film-tearing conveying structure 2528, and two first film-tearing platform guide rails 2544 may be provided on the upper side of the film-tearing platform bracket 2522, and a first film-tearing adsorption flat plate 2546 may be provided between the two first film-tearing platform seats 2542, and both sides of the first film-tearing adsorption flat plate 2546 may be provided on the two first film-tearing platform guide rails 2544 in a one-to-one correspondence. Moreover, a second film-tearing platform seat 2542 may be provided on the lower side of the two film-tearing conveyor belts of the film-tearing conveying structure 2528, and two second film-tearing platform guide rails 2544 may be provided on the upper side of the film-tearing platform bracket 2522, and a second film-tearing adsorption flat plate 2546 may be provided between the two second film-tearing platform seats 2542, and both sides of the second film-tearing adsorption flat plate 2546 may be provided on the two second film-tearing platform guide rails 2544 in a one-to-one correspondence. In this way, the two film tearing adsorption plates 2546 can be arranged in a double layer without interfering with each other.

[0070] Moreover, the flexible film-tearing platform 254 may include a flat plate lifting guide structure 2548 connecting the second film-tearing platform seat 2542 and the second film-tearing adsorption flat plate 2546. The flat plate lifting guide structure 2548 allows the second film-tearing adsorption flat plate 2546 to automatically lift and lower when moving along with the film-tearing conveying structure 2528, so that when the second film-tearing adsorption flat plate 2546 and the first film-tearing adsorption flat plate 2546 meet during the movement, they can automatically stagger without causing interference. In this way, the first film-tearing adsorption flat plate 2546 and the second film-tearing adsorption flat plate 2546 can be kept at the same height when receiving the circuit board and tearing the film on the circuit board.

[0071] Further, the flat plate lifting guide structure 2548 may include a vertical lifting guide rod structure movably provided on the second film-tearing platform seat 2542, and a transverse lifting guide plate having a transverse lifting guide groove provided on the first frame 202 or the second frame 402 or the film-tearing platform bracket 2522. A flat plate sliding protrusion slidingly provided in the transverse lifting guide groove is provided on the second film-tearing adsorption flat plate 2546, and the transverse lifting guide plate is extended along the driving direction of the film-tearing conveying structure 2528. The second film-tearing adsorption flat plate 2546 can be vertically supported from a vertical direction by the vertical lifting guide rod structure, and when the second film-tearing adsorption flat plate 2546 moves laterally with the second film-tearing adsorption flat plate 2546, the flat plate sliding protrusion on the second film-tearing adsorption flat plate 2546 will slide in the transverse lifting guide groove of the transverse lifting guide plate, so that the second film-tearing adsorption flat plate 2546 is lifted and lowered with the lifting and lowering of the transverse lifting guide groove. Moreover, the transverse lifting guide groove of the transverse lifting guide plate is opened along the side of the transverse lifting guide plate and extends along the length direction of the transverse lifting guide plate, and the two ends of the transverse lifting guide groove are located at the high position of the transverse lifting guide plate, and the middle section of the transverse lifting guide groove is located at the low position of the transverse lifting guide plate, so that the second film tearing adsorption plate 2546 can first descend and then rise when sliding along the transverse lifting guide groove of the transverse lifting guide plate.

[0072] In addition, the film body integral tearing mechanism 260 may include a film tearing base 262 arranged on the first frame 202 or the second frame 402, a film tearing head driving mechanism 264 arranged on the film tearing base 262, a flexible film tearing head mechanism 266 arranged on the film tearing head driving mechanism 264, and a film tearing rod structure 268 arranged on the first frame 202 or the second frame 402 and corresponding to the flexible film tearing head mechanism 266. The flexible film tearing head mechanism 266 and the film tearing rod structure 268 are both located above the flexible film tearing platform 254. When the flexible plate film-tearing platform 254 moves to the bottom of the flexible plate film-tearing head mechanism 266, the protective film on the circuit board where the flexible plate film-tearing platform 254 is located can be torn off from the starting position by the flexible plate film-tearing head mechanism 266, and during the film-tearing process, the flexible plate film-tearing head mechanism 266 is driven to move by the film-tearing head driving mechanism 264, so that the flexible plate film-tearing head mechanism 266 can fully tear off the protective film on the circuit board. Moreover, when the protective film on the circuit board is torn off, the film-tearing rod structure 268 can cooperate with the flexible plate film-tearing head mechanism 266 to assist in tearing off the protective film, thereby improving the film-tearing efficiency and the film-tearing quality.

[0073] Specifically, the film-tearing base 262 may include two film-tearing seat brackets arranged side by side on the first frame 202 or the second frame 402. Moreover, the film-tearing head driving mechanism 264 may include a first film-tearing head driving member 2642 respectively arranged on the two film-tearing seat brackets, a second film-tearing head driving member 2644 connected between the two first film-tearing head driving members 2642, and a third film-tearing head driving member 2646 connected to the second film-tearing head driving member 2644. The flexible film-tearing head mechanism 266 is arranged on the third film-tearing head driving member 2646. The driving directions of the first film-tearing head driving member 2642, the second film-tearing head driving member 2644, and the third film-tearing head driving member 2646 are perpendicular to each other.

[0074] The flexible film tearing platform 254 and the circuit board positioned thereon can be transported between the two film tearing seat brackets through the film tearing conveying structure 2528, and then the flexible film tearing head mechanism 266 can be driven to move horizontally (or horizontally and longitudinally, or vertically) through the first film tearing head driving component 2642 on the two film tearing seat brackets, and the flexible film tearing head mechanism 266 can be driven to move horizontally and longitudinally (or horizontally and transversely, or vertically) through the second film tearing head driving component 2644, and the flexible film tearing head mechanism 266 can be driven to move vertically (or horizontally and transversely, or horizontally and longitudinally) through the third film tearing head driving component 2646, so that the flexible film tearing head mechanism 266 corresponds to the starting point of the corner of the protective film on the circuit board positioned on the flexible film tearing platform 254, grabs the starting point of the corner of the protective film, and tears off the entire protective film starting from the corner position of the protective film.

[0075] Furthermore, the first film tearing head driving member 2642 may include a first linear motor driving module disposed on the film tearing seat bracket, and the two first linear motor driving modules may share one driving motor. That is, the two first linear motor driving modules may be driven to work by one driving motor, so that the two first linear motor driving modules may synchronously drive the second film tearing head driving member 2644. In addition, the two first linear motor driving modules may also be completely independently disposed, and each may be driven by a different driving motor.

[0076] Furthermore, the second film-tearing head driving member 2644 may include a second driving base slidably connected to the two first linear motor driving modules, and a second linear motor driving module disposed on the second driving base, and the third film-tearing head driving member 2646 is connected to the second linear motor driving module. Furthermore, the third film-tearing head driving member 2646 may include a third driving base slidably connected to the side of the second linear motor driving module, and a third linear motor driving module or a cylinder lifting driving module disposed on the third driving base and connected to the flexible plate film-tearing head mechanism 266, and the flexible plate film-tearing head mechanism 266 is connected to the third linear motor driving module or the cylinder lifting driving module.

[0077] Moreover, in some embodiments, the flexible film-tearing head mechanism 266 may include a film-tearing head mounting seat 2662 provided on the third linear motor driving module (or cylinder lifting driving module) of the film-tearing head driving mechanism 264, a film-tearing head rotating driving member 2664 provided on the film-tearing head connecting seat, and a film-shoveling structure 2666 and a film-clamping structure 2668 correspondingly provided on the film-tearing head rotating driving member 2664. The film-shoveling structure 2666 can be used to shovel the protective film on the positioned circuit board from the starting position, and the film-clamping structure 2668 can be used to clamp the shoveled protective film, and then the film-tearing head driving mechanism 264 can drive the flexible film-tearing head mechanism 266 clamping the protective film, so that the flexible film-tearing head mechanism 266 starts to tear the clamped protective film from the starting position until the entire protective film is torn off. Moreover, when scraping and clamping the film, the film scraping structure 2666 and / or the film clamping structure 2668 can be driven to rotate by the film tearing head rotary drive member 2664, so that the protective film can be more conveniently torn off the circuit board. In addition, the film tearing head rotary drive member 2664 can be set as a rotary drive cylinder structure or a rotary drive motor structure.

[0078] Further, the film scraping structure 2666 may include a film scraping driving member 26662 connected to the film tearing head rotation driving member 2664, and a film scraping head 26664 connected to the film scraping driving member 26662. The film scraping driving member 26662 can drive the film scraping head 26664 to move telescopically, so that the film scraping head 26664 scrapes the raised corner of the protective film on the circuit board to scrape the protective film from the corner position.

[0079] Moreover, the film clamping structure 2668 may include a film clamping driving member 26682 connected to the film tearing head rotation driving member 2664, and a film tearing jaw 26684 connected to the film clamping driving member 26682, and the film tearing jaw 26684 corresponds to the film scraping head 26664. The film clamping driving member 26682 can drive the film tearing jaw 26684 to clamp or expand, so that the film tearing jaw 26684 can clamp the corner of the scooped protective film, so as to tear off the entire protective film from the corner position of the protective film. In addition, the film scraping driving member 26662 and the film clamping driving member 26682 can be set as a cylinder drive structure or a motor drive structure.

[0080] In addition, in some other embodiments, the flexible film tearing head mechanism 266 may also include a film tearing head mounting seat 2662 arranged on the third linear motor drive module (or cylinder lifting drive module) of the film tearing head drive mechanism 264, and a film scraping structure 2666 and a film clamping structure 2668 correspondingly arranged on the film tearing head mounting seat 2662.

[0081] In addition, the film-tearing rod structure 268 may include a film-tearing rod driving member 2682 disposed on the first frame 202 or the second frame 402, a film-tearing rod mounting seat 2684 connected to the film-tearing rod driving member 2682, and an auxiliary film-tearing rod 2686 disposed on the film-tearing rod mounting seat 2684. The auxiliary film-tearing rod 2686 is disposed horizontally above the flexible plate film-tearing platform 254 and corresponds to the flexible plate film-tearing head mechanism 266. When the protective film on the circuit board is clamped by the flexible plate film-tearing head mechanism 266 for tearing off, the auxiliary film-tearing rod 2686 can be driven by the film-tearing rod driving member 2682 to move along with the rear of the flexible plate film-tearing head mechanism 266, so that the auxiliary film-tearing rod 2686 can assist in tearing off the protective film on the circuit board from the horizontal direction, which can improve the film-tearing efficiency and make the force on the protective film balanced during film-tearing, so that the protective film is not easily torn off.

[0082] In addition, the film body integral tearing mechanism 260 may further include a waste material storage bin disposed below the film tearing base 262 for receiving the protective film waste material torn off the circuit board by the film body integral tearing mechanism 260 .

[0083] In addition, if Figures 2 to 5 As shown, the first circuit board unloading mechanism 208 of the first circuit board tearing assembly 200 and the second circuit board unloading mechanism 408 of the second circuit board tearing assembly 400 may both include a unloading circuit board picking and placing assembly 270 and a unloading spacer paper picking and placing assembly 280 arranged on the first frame 202 or the second frame 402.

[0084] Furthermore, the blanking circuit board pick-up and placement assembly 270 may also include a circuit board blanking storage structure 272 disposed on the first frame 202 or the second frame 402, and a circuit board blanking pick-up and placement structure 274 disposed above the circuit board blanking storage structure 272, and the circuit board blanking pick-up and placement structure 274 may be correspondingly matched with the first film tearing mechanism 206 or the second film tearing mechanism 406. Furthermore, the blanking paper separator pick-up and placement assembly 280 may also include a blanking paper separator storage structure 282 disposed on the first frame 202 or the second frame 402, and a blanking paper separator pick-up and placement structure 284 disposed above the blanking paper separator storage structure 282.

[0085] The circuit board after the protective film is torn off by the first film tearing mechanism 206 or the second film tearing mechanism 406 can be grabbed by the circuit board unloading and placing structure 274, and the circuit board can be transferred to the circuit board unloading and storage structure 272 for storage; then, the unloading and placing paper separator stored in the unloading and placing paper separator storage structure 282 can be taken by the unloading and placing paper separator structure 284, and the paper separator can be transferred to the circuit board stored in the circuit board unloading and storage structure 272 to separate two adjacent circuit boards.

[0086] Moreover, the circuit board unloading storage structure 272 may be similar in structure to the circuit board storage structure 122, the unloading paper separation storage structure 282 may be similar in structure to the paper separation storage structure 132, and the circuit board unloading pick-up and placement structure 274 and the unloading paper separation pick-up and placement structure 284 may be similar in structure to the circuit board loading pick-up and placement structure (composed of the circuit board picking-up and placement drive 124 and the circuit board adsorption plate 126), or the paper separation loading pick-up and placement structure (composed of the paper separation pick-up and placement drive 134 and the unloading paper separation picking plate) (or), which will not be described in detail here. The circuit board unloading pick-up and placement structure 274 and the unloading paper separation pick-up and placement structure 284 may both be set as material picking manipulators, and the two may be set independently of each other or may be set as one body.

[0087] The automatic circuit board film removal device 10 provided by the present invention can automatically remove the protective films on both sides of the circuit board, can be suitable for circuit boards of different sizes, can greatly improve the film removal efficiency, and ensure product quality.

[0088] It should be noted that, in the present invention, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0089] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features invented herein.

Claims

1. A circuit board automatic film removal device, It is characterized in that include: The circuit board upper plate assembly comprises an upper plate frame, and a circuit board taking and placing mechanism and a spacer paper taking and placing mechanism correspondingly arranged on the upper plate frame; A first circuit board film tearing assembly comprises a first frame, and a first film body starting mechanism, a first film body tearing mechanism, and a first circuit board unloading mechanism which are sequentially arranged on the first frame, wherein the first film body starting mechanism corresponds to and cooperates with the circuit board taking and placing mechanism; A circuit board flip assembly comprises a flip frame, a circuit board conveying mechanism arranged on the flip frame, and a circuit board flipping mechanism arranged on the conveying mechanism, wherein the circuit board conveying mechanism is connected to the first circuit board unloading mechanism; and The second circuit board film tearing assembly includes a second frame, and a second film starting mechanism, a second film tearing mechanism, and a second circuit board unloading mechanism which are sequentially arranged on the second frame. The second film starting mechanism is connected to the circuit board conveying mechanism.

2. The automatic film removal equipment for circuit boards according to claim 1, It is characterized in that The first membrane starting mechanism and the second membrane starting mechanism both include: A flexible plate posture adjustment mechanism, comprising a posture visual detection mechanism provided on the first frame or the second frame, and a flexible plate material taking adjustment mechanism provided corresponding to the posture visual detection mechanism; The flexible board starting positioning mechanism comprises a flexible board lifting support mechanism provided on the first frame or the second frame, and a flexible board clamping positioning mechanism provided above the flexible board lifting support mechanism, and the flexible board material taking adjustment mechanism is correspondingly located between the circuit board taking and placing mechanism and the flexible board clamping positioning mechanism; The flexible plate ejector head mechanism comprises an ejector platform driving structure arranged on the first frame or the second frame, an ejector head platform arranged on the ejector platform driving structure, and a head visual detection mechanism arranged on the side of the ejector head platform, wherein the ejector head platform and the head visual detection mechanism are located below the flexible plate clamping and positioning mechanism.

3. The automatic film removal equipment for circuit boards according to claim 2, It is characterized in that The ejector platform driving structure includes an ejector platform transverse conveying member provided on the first frame or the second frame, and an ejector platform longitudinal driving member provided on the ejector platform transverse conveying member; The ejector platform comprises an ejector platform seat arranged on the ejector platform longitudinal driving member, and a plurality of ejector platform structures arranged on the ejector platform seat. The ejector platform seat and the ejector platform structures are both located below the flexible plate clamping and positioning mechanism.

4. The automatic film removal equipment for circuit boards according to claim 3, It is characterized in that The ejector platform seat comprises a platform base plate arranged on the ejector platform longitudinal movement driving member, a platform lifting driving member arranged on the platform base plate, and a platform top plate arranged on the top of the platform lifting driving member, the side of the platform top plate is slidably connected to the side of the platform base plate, and the starting visual detection mechanism is arranged on the side of the platform base plate or the platform top plate; The ejector head structure includes an ejector telescopic driving member arranged on the peripheral side of the platform top plate, and a starting ejector pin arranged on the top of the ejector telescopic driving member, and the ejector telescopic driving member is used to drive the starting ejector pin to move up and down on the platform top plate.

5. The automatic film removal equipment for circuit boards according to claim 3, It is characterized in that The ejector platform transverse conveyor comprises a transverse drive motor arranged on the first frame or the second frame, a transverse drive shaft connected to the transverse drive motor, a transverse driven shaft arranged side by side with the transverse drive shaft, and two transverse transmission belt structures connected side by side to the transverse drive shaft and the transverse driven shaft; The ejector platform longitudinal movement driving component includes a platform longitudinal movement seat connected between the two transverse movement transmission belt structures, a platform longitudinal movement guide rail arranged on the platform longitudinal movement seat, and a platform longitudinal movement driving module arranged on the platform longitudinal movement seat. The ejector starting platform is connected to the platform longitudinal movement driving module and is slidably arranged on the platform longitudinal movement guide rail.

6. The automatic film removal equipment for circuit boards according to claim 2, It is characterized in that The flexible plate material taking adjustment mechanism includes a posture adjustment drive structure provided on the first frame or the second frame, and a posture adjustment material taking plate connected to the posture adjustment drive structure, and the posture adjustment material taking plate is provided corresponding to the posture visual detection mechanism; The flexible plate lifting support mechanism includes a lifting support seat arranged on the first frame or the second frame, a lifting drive structure arranged on the lifting support seat, and a lifting support plate slidably arranged on the lifting support seat and connected to the lifting drive structure, wherein a plurality of adsorption holes are arranged on the lifting support plate.

7. The automatic film removal equipment for circuit boards according to claim 2, It is characterized in that The flexible plate clamping and positioning mechanism comprises a clamping and positioning frame arranged on the first frame or the second frame, and a flexible plate clamping mechanism arranged around the clamping and positioning frame, wherein the flexible plate clamping mechanism is located below the flexible plate material taking and adjusting mechanism and above the flexible plate lifting and supporting mechanism; The flexible plate clamp mechanism comprises a fixed positioning clamp and an adjustable positioning clamp respectively arranged on the four sides of the clamping and positioning frame, and the fixed positioning clamp and the adjustable positioning clamp are respectively located on the four sides of the flexible plate lifting support mechanism.

8. The automatic film removal equipment for circuit boards according to claim 7, It is characterized in that The clamping and positioning frame comprises a positioning bottom frame arranged on the first frame or the second frame, a positioning and adjusting slide rail respectively arranged at both ends of the positioning bottom frame, and two clamping and positioning plates slidably arranged side by side on the two positioning and adjusting slide rails; The fixed positioning fixture comprises a fixed clamping claw driving member provided on the clamping positioning plate, and a fixed clamping claw connected to the fixed clamping claw driving member; The adjustment and positioning fixture includes a fixture linear drive structure and / or a telescopic adjustment drive member arranged on the clamping and positioning plate, an adjustment jaw drive member arranged on the fixture linear drive structure or the telescopic adjustment drive member, and an adjustment clamping jaw connected to the adjustment jaw drive member.

9. The automatic film removal equipment for circuit boards according to claim 8, It is characterized in that The flexible plate clamp mechanism comprises a first adjusting and positioning clamp and a second adjusting and positioning clamp respectively arranged on the clamping and positioning plate, wherein the telescopic driving direction of the telescopic adjusting driving member of the first adjusting and positioning clamp is the same as or perpendicular to the telescopic driving direction of the telescopic adjusting driving member of the second adjusting and positioning clamp; The clamp linear drive structure includes a clamp guide rail arranged along the extension direction of the clamping positioning plate, and a clamp linear drive module arranged on the clamping positioning plate, and the clamp linear drive module is connected to the telescopic adjustment drive member or the adjustment jaw drive member slidably arranged on the clamp guide rail.

10. The automatic film removal device for circuit boards according to any one of claims 1 to 9, It is characterized in that The first film tearing mechanism and the second film tearing mechanism both include: The film tearing and discharging mechanism comprises a film tearing and discharging driving structure provided on the first frame or the second frame, and a film tearing and discharging plate provided on the film tearing and discharging driving structure, wherein the film tearing and discharging plate is matched with the first film body starting mechanism or the second film body starting mechanism; The film tearing positioning platform mechanism comprises a film tearing platform driving structure arranged on the first frame or the second frame, and a flexible plate film tearing platform arranged on the film tearing platform driving structure, wherein the film tearing material taking and placing plate is located above the flexible plate film tearing platform; and The overall film tearing mechanism includes a film tearing base arranged on the first frame or the second frame, a film tearing head driving mechanism arranged on the film tearing base, a flexible film tearing head mechanism arranged on the film tearing head driving mechanism, and a film tearing rod structure arranged on the first frame or the second frame and corresponding to the flexible film tearing head mechanism, wherein the flexible film tearing head mechanism and the film tearing rod structure are both located above the flexible film tearing platform.

11. The automatic film removal equipment for circuit boards according to claim 10, It is characterized in that The film-tearing platform driving structure includes a film-tearing platform bracket provided on the first frame or the second frame, a film-tearing platform driving motor provided on the film-tearing platform bracket, a film-tearing platform rotating shaft connected to the film-tearing platform driving motor, and a film-tearing conveying structure provided on the film-tearing bracket, wherein the film-tearing platform rotating shaft is connected to the film-tearing conveying structure; The flexible plate film tearing platform includes a film tearing platform seat connected to the film tearing conveying structure, a film tearing platform guide rail arranged on the film tearing platform bracket, and a film tearing adsorption plate arranged on the film tearing platform seat, and the film tearing adsorption plate or the film tearing platform seat is slidably arranged on the film tearing platform guide rail.

12. The automatic film removal equipment for circuit boards according to claim 11, It is characterized in that The flexible plate film tearing platform comprises two film tearing adsorption flat plates which are staggered, wherein one of the film tearing adsorption flat plates corresponds up and down to the film tearing material taking and placing plate, and the other film tearing adsorption flat plate corresponds up and down to the flexible plate film tearing head mechanism.

13. The automatic film removal device for circuit board according to claim 12, It is characterized in that The flexible film tearing platform includes a first film tearing platform seat and a second film tearing platform seat respectively connected to the upper side and the lower side of the film tearing conveying structure, a first film tearing platform guide rail and a second film tearing platform guide rail respectively arranged on the upper side and the lower side of the film tearing platform bracket, and a first film tearing adsorption flat plate arranged on the first film tearing platform seat and slidably arranged on the first film tearing platform guide rail, a second film tearing adsorption flat plate arranged on the second film tearing platform seat, the second film tearing platform seat is slidably arranged on the second film tearing platform guide rail, and the first film tearing adsorption flat plate and the second film tearing adsorption flat plate are staggered.

14. The automatic film removal device for circuit board according to claim 13, It is characterized in that The flexible film-tearing platform comprises a plate lifting and guiding structure connecting the second film-tearing platform seat and the second film-tearing adsorption plate; The flat plate lifting guide structure includes a vertical lifting guide rod structure movably arranged on the second film tearing platform seat, and a transverse lifting guide plate with a transverse lifting guide groove arranged on the first frame or the second frame or the film tearing platform bracket; the second film tearing adsorption flat plate is provided with a flat plate sliding protrusion slidingly arranged in the transverse lifting guide groove.

15. The automatic film removal device for circuit board according to claim 10, It is characterized in that The film tearing base includes two film tearing base brackets arranged side by side on the first frame or the second frame; The film tearing head driving mechanism includes a first film tearing head driving member respectively arranged on the two film tearing seat brackets, a second film tearing head driving member connected between the two first film tearing head driving members, and a third film tearing head driving member connected to the second film tearing head driving member, the flexible film tearing head mechanism is arranged on the third film tearing head driving member, and the driving directions of the first film tearing head driving member, the second film tearing head driving member and the third film tearing head driving member are perpendicular to each other.

16. The automatic film removal device for circuit board according to claim 15, It is characterized in that The first film tearing head driving component comprises a first linear motor driving module arranged on the film tearing seat bracket, and two first linear motor driving modules share one driving motor; The second film tearing head driving member comprises a second driving base slidably connected to the two first linear motor driving modules, and a second linear motor driving module arranged on the second driving base; The third film tearing head driving component includes a third driving base slidably connected to the side of the second linear motor driving module, and a third linear motor driving module or a cylinder lifting driving module arranged on the third driving base and connected to the flexible plate film tearing head mechanism.

17. The automatic film removal equipment for circuit boards according to claim 10, It is characterized in that The flexible plate film tearing head mechanism includes a film tearing head mounting seat arranged on the film tearing head driving mechanism, a film tearing head rotating driving member arranged on the film tearing head connecting seat, and a film scraping structure and a film clamping structure correspondingly arranged on the film tearing head rotating driving member.

18. The automatic film removal device for circuit board according to claim 17, It is characterized in that The film scraping structure includes a film scraping driving member connected to the film tearing head rotation driving member, and a film scraping head connected to the film scraping driving member; The film clamping structure comprises a film clamping driving member connected to the film tearing head rotation driving member, and a film tearing clamping claw connected to the film clamping driving member, and the film tearing clamping claw is correspondingly matched with the film scraping head.

19. The automatic film removal device for circuit board according to claim 10, It is characterized in that The film tearing rod structure includes a film tearing rod driving component arranged on the first frame or the second frame, a film tearing rod mounting seat connected to the film tearing rod driving component, and an auxiliary film tearing rod arranged on the film tearing rod mounting seat. The auxiliary film tearing rod is horizontally arranged above the flexible plate film tearing platform and corresponds to the flexible plate film tearing head mechanism.

20. The automatic film removal device for circuit board according to claim 10, It is characterized in that The circuit board placement mechanism includes a circuit board storage structure provided on the upper plate rack, a circuit board placement driving member provided above the circuit board storage structure, a circuit board adsorption plate provided on the circuit board placement driving member, and a circuit board transfer mechanism provided corresponding to the first film body starting mechanism or the second film body starting mechanism, and the circuit board adsorption plate and the circuit board storage structure and the circuit board transfer mechanism are provided corresponding to each other; The paper separation picking and placing mechanism includes a paper separation storage structure arranged on the upper plate frame, a paper separation picking and placing driving component arranged above the paper separation storage structure, and a paper separation adsorption plate arranged on the paper separation picking and placing driving component, and the paper separation adsorption plate is arranged correspondingly to the paper separation storage structure above and below.

Images