Electronic device and shielding member

Abstract

The embodiment of the invention provides electronic equipment and a shielding part. The electronic equipment comprises a main board, a camera device and a shielding piece. The mainboard comprises a first connecting terminal and a grounding terminal. The camera device comprises a camera module, a circuit board and a second connecting terminal. The camera module is electrically connected with the circuit board. The second connecting terminal is electrically connected with the circuit board. The first connection terminal and the second connection terminal are electrically connected. A containing space is formed between the shielding piece and the main board. And the first connecting terminal and the second connecting terminal are positioned in the accommodating space. The shielding piece comprises a shielding frame and a shielding cover which are electrically connected. The shielding frame is connected with the mainboard. The shielding frame is electrically connected with the grounding end. And the shielding cover is connected with the shielding frame. The second connection terminal is electrically connected with the shielding cover. The electronic equipment provided by the embodiment of the invention can reduce the possibility that the photographing experience is influenced by signal interference on the photographing device.

Description

[0001] This application is a divisional application. The original application has the application number 202310120762.4 and the original application date is February 2, 2023. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of terminal technology, and in particular to an electronic device and a shielding component. Background Technology

[0003] With the explosive growth of electronic devices such as smartphones and tablets, their functions are becoming increasingly diverse. As people expect electronic devices to fulfill more functional needs, the functions they can perform are also increasing. For example, electronic devices include camera units. People expect electronic devices to have increasingly higher camera performance to obtain high-resolution images. Camera units include camera modules, such as rear-facing camera modules. The camera module is used to photograph a selected target and form corresponding image information. The camera module includes a light-inlet section for receiving light. External light can enter the camera module through the light-inlet section. The camera module can be electrically connected to the motherboard; for example, the camera module can be electrically connected to the motherboard via a circuit board to achieve signal interaction. However, when electronic devices perform the shooting function, there is a possibility that the camera unit may be subject to signal interference, resulting in phenomena such as screen tearing, lag, or freezing on the shooting interface, affecting the shooting experience of the electronic device. Summary of the Invention

[0004] This application provides an electronic device and a shielding component that can reduce the possibility of signal interference affecting the shooting experience of the camera device.

[0005] The first aspect of this application provides an electronic device, which includes a motherboard, a camera device, and a shielding component.

[0006] The motherboard includes a first connection terminal and a ground terminal. The camera device includes a camera module, a circuit board, and a second connection terminal. The camera module is electrically connected to the circuit board. The second connection terminal is electrically connected to the circuit board. The first connection terminal and the second connection terminal are electrically connected. A receiving space is formed between the shielding component and the motherboard. The first connection terminal and the second connection terminal are located within the receiving space. The shielding component includes an electrically connected shielding frame and a shielding cover. The shielding frame is connected to the motherboard. The shielding frame is electrically connected to the ground terminal. The shielding cover is connected to the shielding frame. The second connection terminal is electrically connected to the shielding cover.

[0007] In the electronic device of this application, the motherboard includes a first connection terminal and a ground terminal, while the camera device includes a camera module, a circuit board, and a second connection terminal. The first and second connection terminals are connected. The first and second connection terminals are electrically connected. The camera device and the motherboard communicate with each other to achieve signal interaction. A shielding component is connected to the motherboard and covers the outside of the first and second connection terminals. The shielding component is electrically connected to the ground terminal of the motherboard to achieve grounding. The second connection terminal is electrically connected to the shielding component. Therefore, the first connection terminal, the second connection terminal, the shielding cover, and the shielding frame can be grounded through the ground terminal of the motherboard, which helps to reduce the ground impedance at the connector formed by the first and second connection terminals, avoids impedance abrupt changes at the connector formed by the first and second connection terminals, and also helps to eliminate the parasitic capacitance formed between the connector formed by the first and second connection terminals and the ground terminal of the motherboard. This helps to reduce the possibility of electromagnetic signals interfering with the first and second connection terminals and causing electromagnetic coupling, ensuring stable signal transmission between the camera device and the motherboard, enabling the electronic device to perform the shooting function smoothly and improving the shooting experience. The shielding component can also effectively shield electromagnetic signals from adverse effects and interference on the first and second connection terminals, thereby further reducing the possibility of interference with the interaction signals between the camera device and the motherboard.

[0008] In one possible implementation, the shielding frame is a ring structure. The first connecting terminal is located inside the shielding frame.

[0009] The shielding frame is arranged around the first connecting terminal, so that the shielding frame can provide good shielding for the first connecting terminal in any direction.

[0010] In one possible implementation, the shielding frame includes a bottom flange, a first side plate, and a top flange. Both the bottom flange and the top flange are connected to the first side plate. The bottom flange is electrically connected to a grounding terminal. The outer surface of the top flange facing away from the motherboard is electrically connected to the inner surface of the shielding cover facing the motherboard.

[0011] The top flange facing away from the motherboard is electrically connected to the inner surface of the shielding cover facing the motherboard. This facilitates a larger electrical connection area between the shielding cover and the shielding frame, effectively reducing impedance and ensuring a good electrical connection between them.

[0012] In one possible implementation, the outer surface of the top flange facing away from the motherboard directly abuts against the inner surface of the shielding cover facing the motherboard, so that the top flange and the shielding cover are electrically connected.

[0013] At least part of the top flange is wider than the bottom flange.

[0014] Setting the width of at least part of the top flange to be larger helps to increase the contact area between the shielding cover and the shielding frame, thereby effectively compensating for the contact area between the shielding cover and the shielding frame and reducing the possibility that the contact area may not meet the requirements due to unevenness of the surfaces of the shielding cover and the shielding frame used for contact.

[0015] Setting the bottom flange to a relatively small width can reduce the projected area of ​​the bottom flange on the motherboard while ensuring the connection strength between the bottom flange and the motherboard. This reduces the space occupied by the bottom flange on the motherboard and the possibility of reducing the area on the motherboard where electronic components can be placed due to the bottom flange occupying too much motherboard space.

[0016] In one possible implementation, the shielding cover and the first side plate are snapped together.

[0017] The shielding cover and the first side plate are connected by a snap-fit ​​mechanism, which facilitates quick assembly or separation of the shielding cover and the shielding frame, improving the efficiency of assembly or separation.

[0018] In one possible implementation, a snap-fit ​​portion is provided on one of the shielding cover and the first side plate, and a locking portion is provided on the other. The snap-fit ​​portion engages with the locking portion.

[0019] In one possible implementation, the shielding cover includes a connected top plate and a second side plate. One of the first and second side plates has a snap-fit ​​portion, and the other has an engagement portion. A first connecting terminal and a second connecting terminal are disposed between the top plate and the main board. The outer surface of the top flange facing away from the main board is electrically connected to the inner surface of the top plate facing the main board.

[0020] In one possible implementation, there are multiple second side plates. A gap exists between adjacent second side plates.

[0021] Each second side plate is set independently, so that if any second side plate deforms during the snap-fit ​​process, it will not pull on the other second side plates.

[0022] In one possible implementation, the outer surface of the top flange facing away from the motherboard directly abuts against the inner surface of the top plate facing the motherboard, so that the top flange is electrically connected to the top plate.

[0023] In one possible implementation, the shielding cover and the shielding frame are interlocked.

[0024] The shielding cover and the shielding frame are connected by a snap-fit ​​mechanism, which facilitates quick assembly or separation of the shielding cover and the shielding frame, improving the efficiency of assembly or separation.

[0025] In one possible implementation, the surface of the second connecting terminal facing away from the first connecting terminal is bonded to the shielding cover with conductive adhesive, so that the second connecting terminal is electrically connected to the shielding cover.

[0026] In one possible implementation, the electronic device further includes a reinforcing member. At least a portion of the reinforcing member is disposed on the side of the second connection terminal facing away from the first connection terminal. The reinforcing member is conductive. The reinforcing member is electrically connected to the second connection terminal. The reinforcing member is electrically connected to the shielding cover.

[0027] The reinforcing member provides protection for the second connecting terminal, effectively preventing structural damage caused by external impacts. The shielding member applies compressive stress to the reinforcing member towards the second connecting terminal to ensure the reliability and stability of the connection between the first and second connecting terminals, reducing the possibility of the second connecting terminal disengaging from the first connecting terminal.

[0028] In one possible implementation, the shielding cover abuts directly against the reinforcement.

[0029] The shielding cover of the shielding component makes direct contact with the reinforcing component to achieve electrical connection, so that no additional structural components are needed between the shielding component and the reinforcing component to achieve electrical connection, which helps to reduce the number of parts used and assembly steps.

[0030] In one possible implementation, the electronic device further includes a conductive element. The conductive element is disposed between the shielding cover and the reinforcing element. The conductive element electrically connects the shielding cover and the reinforcing element.

[0031] The shielding cover and the reinforcing member can work together to press the conductive member, ensuring good contact between the shielding member and the reinforcing member and the conductive member, and maintaining the stability of the electrical connection between the shielding member and the reinforcing member and the conductive member.

[0032] In one possible implementation, the conductive element is a flexible structure.

[0033] Since conductive components can be compressed and deformed, if there are uneven surfaces on at least one of the shielding cover and the reinforcing component of the shielding component, the conductive component can compensate by its own deformation. This ensures that the shielding cover and the conductive component, as well as the reinforcing component and the conductive component, maintain a tight fit and contact, thus ensuring a good electrical connection between the shielding cover and the reinforcing component, which helps to reduce impedance.

[0034] In one possible implementation, the reinforcement and the shielding cover are capacitively coupled.

[0035] The fact that the reinforcement and the shielding cover are not in direct contact can avoid poor contact between the shielding cover and the reinforcement, thereby reducing the possibility of passive inter-modulation (PIM) problems and stray radiation (RSE) problems caused by poor contact.

[0036] In one possible implementation, the electronic device further includes a high-dielectric layer. The high-dielectric layer is disposed between the reinforcement and the shielding cover.

[0037] The shielding and reinforcing components are in non-electrical contact with the high-dielectric layer. Since capacitive coupling eliminates the problem of poor contact, there are no requirements for the stability of the contact resistance between the shielding and reinforcing components and the high-dielectric layer. Therefore, surface treatments such as nickel plating or gold plating are not necessary for the shielding and reinforcing components. Furthermore, the placement of the high-dielectric layer can be freely and flexibly selected according to design requirements.

[0038] In one possible implementation, the material of the high dielectric layer includes a microwave absorbing material.

[0039] A high dielectric layer can absorb and attenuate electromagnetic signals incident in space, reduce or eliminate reflected electromagnetic signals, and help reduce interference caused by bad electromagnetic signals.

[0040] In one possible implementation, a clearance hole is provided between the shielding cover and the shielding frame. The circuit board passes through the clearance hole.

[0041] In one possible implementation, an insulating layer is provided on the outer surface of the shielding cover.

[0042] The insulating layer on the shielding cover helps maintain good insulation between the cover and other conductive components. Without an insulating layer, the shielding cover could become electrically connected to other conductive components. Poor contact between the shielding cover and these components could lead to passive intermodulation (PIM) and stray radiation (RSE) problems. The insulating layer on the outer surface of the shielding cover in this application effectively reduces the likelihood of these problems.

[0043] In one possible implementation, the electronic device further includes electronic components disposed on a motherboard, disposed within a receiving space, and spaced apart from the first connection terminal.

[0044] Shielding components can shield electronic components, making it difficult for electromagnetic signals emitted by electronic components to propagate to devices located outside the shielding component and relatively close to the electronic component when the electronic component is in operation. This effectively reduces the possibility of signal interference caused by the electronic component to nearby devices.

[0045] In one possible implementation, the electronic device includes a housing and an antenna. A motherboard is disposed within the housing. The housing includes a frame. The antenna is disposed within the frame. A first connection terminal, a second connection terminal, and a shield are disposed near the antenna.

[0046] Since the shielding component can effectively shield the first and second connection terminals, when the antenna is in the working state of radiating wireless signals, the electromagnetic signals generated by the antenna are less likely to interfere with the first and second connection terminals, reducing the possibility of the antenna having an adverse effect on the camera device when performing the shooting function.

[0047] A second aspect of this application provides a shielding member for use in electronic devices. The shielding member includes a shielding frame and a shielding cover. The shielding cover is connected to the shielding frame. The shielding cover and shielding frame are connected and form a receiving cavity. The receiving cavity has an opening. The shielding frame is used for grounding. The shielding cover and shielding frame are electrically connected.

[0048] A third aspect of this application provides an electronic device, which includes a motherboard, a camera device, and a shielding component.

[0049] The motherboard includes a first connection terminal and a ground terminal. The camera device includes a camera module, a circuit board, and a second connection terminal. The camera module is electrically connected to the circuit board. The second connection terminal is disposed on the circuit board. The first and second connection terminals are electrically connected. The shielding component is a one-piece molded structure. The shielding component is connected to the motherboard. A receiving space is formed between the shielding component and the motherboard. The first and second connection terminals are located within the receiving space. The shielding component is electrically connected to the ground terminal. The second connection terminal is electrically connected to the shielding component.

[0050] In one possible implementation, the shielding component includes a top wall and side walls. The side walls have an annular structure. The side walls are connected to the motherboard. The side walls are electrically connected to the ground terminal of the motherboard. The top wall is electrically connected to a second connection terminal.

[0051] The sidewalls of the shielding component are arranged around the first connecting terminal, so that the shielding component can provide a good shielding effect for the first connecting terminal in any direction.

[0052] In one possible implementation, the surface of the second connecting terminal facing away from the first connecting terminal is bonded to the top wall of the shielding member with conductive adhesive, so that the second connecting terminal is electrically connected to the top wall of the shielding member.

[0053] In one possible implementation, the electronic device further includes a reinforcing member. The reinforcing member is disposed on the side of the second connection terminal facing away from the first connection terminal. The reinforcing member is a conductive structure. The reinforcing member is electrically connected to the second connection terminal. The reinforcing member is electrically connected to the top wall of the shielding member.

[0054] The reinforcing member provides protection for the second connecting terminal, effectively preventing structural damage caused by external impacts. The shielding member applies compressive stress to the reinforcing member towards the second connecting terminal to ensure the reliability and stability of the connection between the first and second connecting terminals, reducing the possibility of the second connecting terminal disengaging from the first connecting terminal.

[0055] In one possible implementation, the top wall of the shielding member directly abuts against the reinforcing member.

[0056] The top wall of the shielding component is in direct contact with the reinforcing component to achieve electrical connection. This eliminates the need for additional structural components to achieve electrical connection between the shielding component and the reinforcing component, which helps to reduce the number of parts used and assembly steps.

[0057] In one possible implementation, the electronic device further includes a conductive element. The conductive element is disposed between the top wall of the shield and the reinforcing element. The conductive element electrically connects the top wall of the shield and the reinforcing element.

[0058] The shielding component and the reinforcing component can work together to press the conductive component, ensuring good contact between the shielding component and the conductive component and maintaining the stability of the electrical connection between the shielding component and the conductive component and the conductive component.

[0059] In one possible implementation, the conductive element is a flexible structure.

[0060] Since conductive components can be compressed and deformed, if there are uneven surfaces on at least one of the shielding component and the reinforcing component, the conductive component can compensate by its own deformation. This ensures that the shielding component and the conductive component, as well as the reinforcing component and the conductive component, maintain a tight fit and contact, thus ensuring a good electrical connection between the shielding component and the reinforcing component, which helps to reduce impedance.

[0061] In one possible implementation, the reinforcement and the top wall of the shield are capacitively coupled.

[0062] The fact that the reinforcement and the shielding are not in direct contact can avoid poor contact between the two components, thereby reducing the possibility of passive inter-modulation (PIM) problems and stray radiation (RSE) problems caused by poor contact.

[0063] In one possible implementation, the electronic device further includes a high-dielectric layer. The high-dielectric layer is disposed between the top wall of the reinforcement and the shield.

[0064] The shielding and reinforcing components are in non-electrical contact with the high-dielectric layer. Since capacitive coupling eliminates the problem of poor contact, there are no requirements for the stability of the contact resistance between the shielding and reinforcing components and the high-dielectric layer. Therefore, surface treatments such as nickel plating or gold plating are not necessary for the shielding and reinforcing components. Furthermore, the placement of the high-dielectric layer can be freely and flexibly selected according to design requirements.

[0065] In one possible implementation, the shield has clearance holes. The circuit board passes through the clearance holes.

[0066] In one possible implementation, an insulating layer is provided on the outer surface of the shield.

[0067] The insulating layer on the shielding component helps maintain good insulation and isolation between the shielding component and other conductive structural components. Without an insulating layer, there is a possibility of electrical connection between the shielding component and other conductive structural components. Poor contact between the shielding component and other conductive structural components can lead to passive intermodulation (PIM) problems and stray radiation (RSE) problems. The shielding component of this application has an insulating layer on its outer surface, which effectively reduces the possibility of the above-mentioned problems. Attached Figure Description

[0068] Figure 1 A schematic diagram of the structure of the electronic device provided in this application;

[0069] Figure 2 A partial exploded view of the electronic device provided in this application;

[0070] Figure 3 A partial structural schematic diagram of the camera device provided in this application;

[0071] Figure 4 A partial cross-sectional structural diagram of an electronic device provided for related technologies;

[0072] Figure 5 A partial structural schematic diagram of the electronic device provided in this application;

[0073] Figure 6 A partial exploded view of the electronic device provided in this application;

[0074] Figure 7 A partial structural schematic diagram of the electronic device provided in this application;

[0075] Figure 8 A partial cross-sectional view of the electronic device provided in this application;

[0076] Figure 9 A partial structural schematic diagram of the electronic device provided in this application;

[0077] Figure 10 A partial structural diagram of the electronic device provided in this application;

[0078] Figure 11 A partial cross-sectional view of the electronic device provided in this application;

[0079] Figure 12 for Figure 11 Enlarged view of point M in the middle;

[0080] Figure 13 A partial cross-sectional view of the electronic device provided in this application;

[0081] Figure 14 A partial cross-sectional view of the electronic device provided in this application;

[0082] Figure 15 A partial cross-sectional view of the electronic device provided in this application;

[0083] Figure 16 A partial structural schematic diagram of the electronic device provided in this application;

[0084] Figure 17 A partial structural schematic diagram of the electronic device provided in this application;

[0085] Figure 18 A partial structural diagram of the electronic device provided in this application.

[0086] Figure label:

[0087] 10. Electronic devices;

[0088] 20. Display components;

[0089] 30. Housing; 31. Back cover; 32. Frame;

[0090] 40. Mainboard; 41. First connection terminal; 42. Grounding terminal;

[0091] 50. Electronic components;

[0092] 60. Camera device; 61. Camera module; 611. Optical imaging system; 612. Image sensor; 62. Circuit board; 63. Second connection terminal;

[0093] 70. Shielding components;

[0094] 71. Shielding frame; 71a. Central through hole; 711. Bottom flange; 712. First side plate; 7121. First outer side surface; 7122. Second outer side surface; 7123. Third outer side surface; 7124. Fourth outer side surface; 713. Top flange;

[0095] 72. Shielding cover; 721. Top plate; 722. Second side plate;

[0096] 70a. Top wall;

[0097] 70b, sidewall;

[0098] 80. Connecting part;

[0099] 90. Card-connecting part;

[0100] 100. Reinforcing components;

[0101] 110. Conductive components;

[0102] 120. High dielectric layer;

[0103] 130. Clearance hole;

[0104] 140. Insulation layer;

[0105] 150. Electronic components;

[0106] 160. Antenna;

[0107] 170. System-on-a-Chip (SoC);

[0108] 180. Accommodation space;

[0109] 190. Connector;

[0110] 200. Metal bracket;

[0111] Z, thickness direction. Detailed Implementation

[0112] The electronic devices in this application embodiment can be referred to as user equipment (UE) or terminals, etc. For example, electronic devices can be portable Android devices (PADs), personal digital assistants (PDAs), handheld devices with wireless communication capabilities, computing devices, in-vehicle devices, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical care, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, wireless terminals in smart homes, and other mobile or fixed terminals. This application embodiment does not specifically limit the form of the terminal device.

[0113] In the embodiments of this application, Figure 1 The structure of electronic device 10 is shown schematically. See also Figure 1As shown, the example described is an electronic device 10 that is a handheld device with wireless communication capabilities. A handheld device with wireless communication capabilities could be, for example, a mobile phone.

[0114] Figure 2 A partial exploded view of the electronic device 10 is schematically shown. See also Figure 1 and Figure 2 As shown, the electronic device 10 of this application embodiment includes a display component 20, a housing 30, a motherboard 40, and electronic devices 50.

[0115] Display component 20 has a display area for displaying image information. Display component 20 presents image information to the user through the display area. Display component 20 is mounted on housing 30.

[0116] The motherboard 40 can be connected to the housing 30 and located within the housing 30. The motherboard 40 can be positioned between the display assembly 20 and the housing 30, making it difficult for a user to observe from outside the electronic device 10. Exemplarily, the housing 30 includes a back cover 31 and a frame 32. The back cover 31 is connected to the frame 32. Exemplarily, the frame 32 can be, but is not limited to, a rectangular frame. The motherboard 40 can be disposed within the space formed by the back cover 31 and the frame 32.

[0117] Electronic device 50 is mounted on motherboard 40. Motherboard 40 may be a printed circuit board (PCB). Electronic device 50 is soldered to motherboard 40 using a soldering process. Electronic device 50 includes, but is not limited to, radio frequency integrated circuit (RFIC), radio frequency power amplifier (RFPA), wireless fidelity (WIFI) chip, central processing unit (CPU), intelligent algorithm chip, power management IC (PMIC), or application processor (AP). Application processor may, for example, be used to carry a system-on-chip (SOC). System-on-chip includes image signal processing (ISP) modules. Due to the limited internal space of electronic device 10, electronic device 50 is highly integrated on motherboard 40 to significantly reduce the size of motherboard 40 and its space occupancy rate.

[0118] The electronic device 10 may also include other components such as a battery. The battery may be housed within the casing 30. A battery is a structural component that converts chemical energy into electrical energy. The battery provides electrical energy to the electronic device 10 to ensure its normal operation. For example, the battery may provide electrical energy to the display component 20 to display image information or complete corresponding operation commands, or the battery may provide electrical energy to the motherboard 40 to ensure the normal operation of the electronic devices 50 on the motherboard 40. Exemplarily, the battery may be a lithium-ion battery, such as a lithium iron phosphate battery.

[0119] Figure 3 A schematic diagram showing a portion of the camera device's structure. See also... Figure 2 and Figure 3 As shown, the electronic device 10 may include a camera device 60. The camera device 60 may include a camera module 61 and a circuit board 62. The camera module 61 can be electrically connected to the motherboard 40 via the circuit board 62 to achieve signal interaction. Exemplarily, the circuit board 62 may be, but is not limited to, a flexible printed circuit board (FPCB). The camera module 61 of the camera device 60 may be disposed within a housing 30. The housing 30 has a light-transmitting hole. Along the axial direction of the light-transmitting hole, the light-inlet portion of the camera module 61 is disposed corresponding to the light-transmitting hole. External light can reach the light-inlet portion through the light-transmitting hole. Exemplarily, the cross-sectional shape of the light-transmitting hole may be circular, elliptical, or polygonal; this application does not limit this. The camera device 60 may be a rear-facing camera or a front-facing camera; this application does not limit this.

[0120] The camera module 61 may include an optical imaging system 611 and an image sensor 612. The optical imaging system 611 may include multiple lenses. When taking a picture using the camera module 61, light from the object side can pass through the optical imaging system 611 and then be incident on the photosensitive surface of the image sensor 612. The photosensitive surface of the image sensor 612 refers to the surface that receives light. The optical imaging system 611 has a virtual imaging surface. The imaging surface of the optical imaging system 611 may coincide with the photosensitive surface of the image sensor 612. The image sensor 612 may be a sensor that converts the light signal incident on the photosensitive surface into an electrical signal. For example, the image sensor 612 may be a complementary metal-oxide-semiconductor (CMOS) sensor or a charge-coupled device (CCD).

[0121] In related technologies, Figure 4 A partial cross-sectional view of an electronic device of the related art is shown schematically. See also Figure 4As shown, the image sensor 612 of the camera module 61 can be electrically connected to the system-on-a-chip 170 on the motherboard 40 via the circuit board 62 and connector 190. Connector 190 includes two interlocking terminals. For example, connector 190 can be a board-to-board connector. When the camera device 60 of the electronic device 10 performs its shooting function, there is signal interaction between the image sensor 612, circuit board 62, connector 190, wires on the motherboard 40, and the image signal processing module of the system-on-a-chip 170, such as data signals or control signals. However, connector 190 has a large ground impedance, making it an impedance discontinuity point with impedance abrupt changes. This makes it prone to coupling with external electromagnetic fields, potentially interfering with the data signals or control signals transmitted between the camera module 61 and the image signal processing module. This can lead to signal interference with the camera device 60, resulting in screen flickering, stuttering, or freezing on the shooting interface, thus affecting the shooting experience of the electronic device 10. For example, when the radio frequency chip or wireless fidelity chip transmits at high power, the resulting electromagnetic signals can cause signal interference to connector 190.

[0122] The electronic device 10 provided in this application embodiment has a shielding component disposed on the motherboard 40 and covering the outside of the first and second connection terminals. The first and second connection terminals can be grounded through the shielding component, effectively reducing impedance. Furthermore, the shielding component can be used to shield the first and second connection terminals. Therefore, the electronic device 10 of this application embodiment can reduce the possibility of electromagnetic signal interference to the first and second connection terminals, thereby reducing the possibility of signal interference to the camera device 60 and improving the shooting experience of the electronic device 10.

[0123] Figure 5 A schematic diagram of a partial structure of an electronic device. Figure 5 For along Figure 4 Top view of the thickness direction Z of the motherboard 40. Figure 6 A partial exploded view of the electronic device 10 is schematically shown. See also Figure 5 and Figure 6 As shown, the motherboard 40 in this embodiment includes a first connection terminal 41 and a ground terminal 42. The first connection terminal 41 provides an interface for conversion. The first connection terminal 41 can be electrically connected to the system-on-a-chip 170 on the motherboard 40. The ground terminal 42 is used for grounding.

[0124] The camera device 60 includes a camera module 61, a circuit board 62, and a second connection terminal 63. The camera module 61 is electrically connected to the circuit board 62. The second connection terminal 63 is disposed on the circuit board 62 and electrically connected to the circuit board 62. Exemplarily, the circuit board 62 may be a flexible circuit board. Exemplarily, the circuit board 62 may be a strip structure. The camera module 61 is electrically connected to one end of the circuit board 62, and the second connection terminal 63 is electrically connected to the other end of the circuit board 62. A first connection terminal 41 and a second connection terminal 63 are electrically connected. The first connection terminal 41 and the second connection terminal 63 are detachably connected to facilitate the assembly or separation of the first connection terminal 41 and the second connection terminal 63, thereby facilitating the assembly or separation of the camera device 60 and the motherboard 40. The first connection terminal 41 and the second connection terminal 63 are connected to form a connector. Exemplarily, the connector formed by the first connection terminal 41 and the second connection terminal 63 may be a board-to-board connector. The first connection terminal 41 and the second connection terminal 63 may be connected by a plug-in method. For example, the first connection terminal 41 and the second connection terminal 63 each have pins, and the two are electrically connected to each other by plugging in their respective pins. The camera module 61 can communicate with the motherboard 40 through the circuit board 62, the second connection terminal 63 and the first connection terminal 41 to realize the interaction of signals such as data signals or control signals.

[0125] See Figure 5 and Figure 6 As shown, the electronic device 10 also includes a shielding member 70. The motherboard 40 provides a mounting base for the shielding member 70. The shielding member 70 is connected to the motherboard 40. The shielding member 70 can avoid obstructing the placement of electronic components 50 on the motherboard 40. A receiving space 180 is formed between the shielding member 70 and the motherboard 40 (e.g., ...). Figure 8 (As shown). The first connection terminal 41 and the second connection terminal 63 are located within the receiving space 180. The shield 70 is electrically connected to the ground terminal 42 of the main board 40 to ground the shield 70.

[0126] Figure 7 A schematic diagram of a partial structure of an electronic device. Figure 8 A schematic cross-sectional view of an electronic device is shown. See also Figure 6 , Figure 7 and Figure 8 As shown, the shielding component 70 includes a shielding frame 71 and a shielding cover 72 electrically connected. The shielding frame 71 is used for grounding. The shielding frame 71 is connected to the motherboard 40. The shielding frame 71 is electrically connected to the grounding terminal 42 of the motherboard 40. The shielding cover 72 is connected to the shielding frame 71. Exemplarily, the shielding cover 72 and the shielding frame 71 are detachably connected. The shielding cover 72 is connected to the shielding frame 71 and forms a receiving cavity with an opening. After the shielding cover 72 and the shielding frame 71 are assembled, the shielding component 70 with the receiving cavity is formed. A second connection terminal 63 is electrically connected to the shielding cover 72.

[0127] In this application, the shielding frame 71 and the shielding cover 72 are electrically connected, and the shielding frame 71 is electrically connected to the grounding terminal 42. Therefore, the shielding cover 72 is indirectly grounded through the shielding frame 71, and the second connection terminal 63 is indirectly grounded through the shielding cover 72 and the shielding frame 71. The assembled shielding component 70 can cover the first connection terminal 41 and the second connection terminal 63. At the same time, the shielding component 70 is grounded, which helps to eliminate the parasitic capacitance formed between the connector formed by the first connection terminal 41 and the second connection terminal 63 and the grounding terminal 42 of the motherboard 40, thereby reducing the possibility of electromagnetic coupling interference to the first connection terminal 41 and the second connection terminal 63.

[0128] A shielding element 70 is disposed around the connector formed by the first connecting terminal 41 and the second connecting terminal 63. The shielding element 70 covers the connector formed by the first connecting terminal 41 and the second connecting terminal 63. The receiving space 180 formed by the shielding element 70 and the motherboard 40 can also be called a shielding space. The opening of the receiving cavity of the shielding element 70 faces the motherboard 40. The receiving space 180 includes the receiving cavity of the shielding element 70. The first connecting terminal 41 and the second connecting terminal 63 are located within the shielding space. The shielding element 70 can effectively shield the first connecting terminal 41 and the second connecting terminal 63, reducing electromagnetic interference from other components outside the shielding element 70 or from the electromagnetic signals of the environment in which the electronic device 10 is located. This helps to reduce the possibility of signal interference between the camera module 61 and the motherboard 40 caused by electromagnetic interference from the first connecting terminal 41 and the second connecting terminal 63, thereby improving the operational stability of the camera device 60.

[0129] In the electronic device 10 of this application, the motherboard 40 includes a first connection terminal 41 and a ground terminal 42, while the camera device 60 includes a camera module 61, a circuit board 62, and a second connection terminal 63. The first connection terminal 41 and the second connection terminal 63 are detachably connected. The first connection terminal 41 and the second connection terminal 63 are electrically connected. The camera device 60 and the motherboard 40 are communicatively connected to achieve signal interaction. A shielding member 70 is connected to the motherboard 40 and covers the outside of the first connection terminal 41 and the second connection terminal 63. The shielding member 70 is electrically connected to the ground terminal 42 of the motherboard 40 to achieve grounding. The second connection terminal 63 is electrically connected to the shielding member 70. Therefore, the first connecting terminal 41, the second connecting terminal 63, the shielding cover 72, and the shielding frame 71 can be grounded through the grounding terminal 42 of the motherboard 40. This helps reduce the ground impedance at the connector formed by the first connecting terminal 41 and the second connecting terminal 63, preventing impedance abrupt changes at the connector. It also helps eliminate parasitic capacitance between the connector formed by the first connecting terminal 41 and the second connecting terminal 63 and the grounding terminal 42 of the motherboard 40. This further reduces the possibility of electromagnetic signals interfering with the first connecting terminal 41 and the second connecting terminal 63 and causing electromagnetic coupling, ensuring stable signal transmission between the camera device 60 and the motherboard 40. This allows the electronic device 10 to smoothly perform its shooting function, improving the shooting experience. The shielding component 70 can also effectively shield the first connecting terminal 41 and the second connecting terminal 63 from adverse effects and interference, further reducing the possibility of interference with the interactive signals between the camera device 60 and the motherboard 40.

[0130] In some feasible ways, the shielding component 70, the shielding cover 72 and the shielding frame 71 of this application can be welded together, which helps to ensure that the shielding cover 72 and the shielding frame 71 have good connection reliability and stability, and reduces the possibility that the shielding cover 72 and the shielding frame 71 will separate due to accidental impact.

[0131] In some feasible implementations, the shielding component 70, shielding cover 72, and shielding frame 71 of this application are detachably connected, facilitating the assembly or separation of the shielding cover 72 and shielding frame 71. A first connecting terminal 41 and a second connecting terminal 63 are disposed between the shielding cover 72 and the motherboard 40. When maintenance or inspection of the first connecting terminal 41 and the second connecting terminal 63 is required, the shielding cover 72 can be removed from the shielding frame 71 without completely removing the shielding component 70 from the motherboard 40. After maintenance or inspection of the first connecting terminal 41 and the second connecting terminal 63 is completed, the shielding cover 72 is reassembled with the shielding frame 71. Therefore, the detachable connection between the shielding cover 72 and the shielding frame 71 improves the efficiency of maintenance or inspection work. The assembly process may include, but is not limited to, setting the first connecting terminal 41 on the motherboard 40, then fitting the shielding frame 71 around the first connecting terminal 41, connecting the shielding frame 71 to the motherboard 40, connecting the second connecting terminal 63 to the first connecting terminal 41, and connecting the shielding cover 72 to the shielding frame 71. The assembled shield 70 covers the first connecting terminal 41 and the second connecting terminal 63.

[0132] In some feasible methods, the shielding component 70 can be soldered to the motherboard 40 using a soldering process. Soldering the shielding component 70 to the grounding terminal 42 facilitates good grounding and ensures a strong connection between the shielding component 70 and the grounding terminal 42, thus improving the stability of the connection. For example, the shielding component 70 and the grounding terminal 42 can be soldered together. Specifically, the shielding frame 71 of the shielding component 70 can be soldered to the motherboard 40 using a soldering process. The shielding frame 71 of the shielding component 70 can also be soldered to the grounding terminal 42.

[0133] In some possible implementations, both the shielding cover 72 and the shielding frame 71 can be made of conductive metallic materials. For example, the shielding cover 72 and the shielding frame 71 can be made of stainless steel.

[0134] See also some of the possible implementation methods. Figure 6As shown, the electronic device 10 also includes an electronic component 150. The electronic component 150 is disposed on the motherboard 40. The electronic component 150 is disposed within the receiving space 180. The electronic component 150 is spaced apart from the first connection terminal 41. The shield 70 can shield the electronic component 150, making it difficult for the electromagnetic signals emitted by the electronic component 150 to propagate to devices located outside the shield 70 and relatively close to the electronic component 150 when the electronic component 150 is in operation, effectively reducing the possibility of signal interference from the electronic component 150 to nearby devices. In some examples, the electronic component 150 can be an inductor. The electronic device 10 also includes an antenna. The housing 30 includes a back cover 31 and a frame 32. The antenna can be disposed on the frame 32. When the first connection terminal 41 and the shield 70 are disposed on the edge area of ​​the motherboard 40 near the antenna, the electronic component 150 (e.g., an inductor) near the first connection terminal 41 is relatively close to the antenna. In this embodiment, because the inductor is shielded by the shielding component 70, the inductor is less likely to cause signal interference to the nearby antenna when it is in operation.

[0135] In some feasible ways, Figure 9 This diagram schematically illustrates a portion of the electronic device's structure. See also... Figure 6 and Figure 9 As shown, the shielding frame 71 can be a frame with a central through hole 71a. The first connecting terminal 41 is located in the central through hole 71a. In some examples, the shielding frame 71 can be an annular frame. The shape of the orthographic projection of the shielding frame 71 onto the motherboard 40 can be regular, such as rectangular or circular. The shape of the orthographic projection of the shielding frame 71 onto the motherboard 40 can also be irregular, and this application does not specifically limit this. In some examples, the shielding frame 71 can also have a notch, and the shielding frame 71 is discontinuous at the notch, so that the shielding frame 71 is not a continuous annular structure.

[0136] The first connecting terminal 41 is located within the shielding frame 71. Exemplarily, there is a gap between the first connecting terminal 41 and the shielding frame 71. Along the thickness direction Z of the motherboard 40, the orthographic projection of the first connecting terminal 41 lies within the orthographic projection of the shielding frame 71, and the two do not overlap. The central through-hole 71a of the shielding frame 71 avoids the first connecting terminal 41, thereby preventing positional interference between the shielding frame 71 and the second connecting terminal 63 during assembly with the first connecting terminal 41. In some examples, the shielding frame 71 can be an annular frame. The shielding frame 71 is arranged around the first connecting terminal 41, so that the shielding frame 71 can provide good shielding for the first connecting terminal 41 in any direction.

[0137] See also some of the possible implementation methods. Figure 6 , Figure 7 and Figure 8As shown, the shielding frame 71 includes a bottom flange 711, a first side plate 712, and a top flange 713. Both the bottom flange 711 and the top flange 713 are connected to the first side plate 712. The bottom flange 711 and the top flange 713 are respectively intersecting with the first side plate 712. The bottom flange 711 is electrically connected to the grounding terminal 42 of the motherboard 40. Exemplarily, the bottom flange 711 can be soldered to the grounding terminal 42 of the motherboard 40. Exemplarily, the bottom flange 711 has a ring structure, and the shape of the grounding terminal 42 of the motherboard 40 can match the bottom flange 711, i.e., it can also be a ring structure. Exemplarily, the material of the grounding terminal 42 can be, but is not limited to, copper or a copper alloy.

[0138] The outer surface of the top flange 713 facing away from the motherboard 40 is electrically connected to the inner surface of the shielding cover 72 facing the motherboard 40. This facilitates a larger electrical connection area between the shielding cover 72 and the shielding frame 71, effectively reducing impedance and maintaining a good electrical connection between them. The shielding cover 72 can be grounded to the grounding terminal 42 of the motherboard 40 through the top flange 713, the first side plate 712, and the bottom flange 711. In some examples, the outer surface of the top flange 713 facing away from the motherboard 40 directly abuts against the inner surface of the shielding cover 72 facing the motherboard 40, thereby electrically connecting the top flange 713 and the shielding cover 72.

[0139] In some examples, along the thickness direction Z of the motherboard 40, a bottom flange 711 and a top flange 713 are respectively disposed at the bottom and top of the first side plate 712. The bottom flange 711 and the top flange 713 are located on both sides of the first side plate 712. The bottom flange 711 can be folded outwards away from the first connecting terminal 41, while the top flange 713 can be folded inwards towards the first connecting terminal 41. Along the thickness direction Z of the motherboard 40, the orthographic projection of the top flange 713 does not overlap with the orthographic projection of the first connecting terminal 41.

[0140] See in some examples Figure 6 and Figure 8 As shown, the outer surface of the top flange 713 facing away from the motherboard 40 directly abuts against the inner surface of the shielding cover 72 facing the motherboard 40, so that the top flange 713 and the shielding cover 72 are electrically connected. See also Figure 6 and Figure 9As shown, at least a portion of the width of the top flange 713 is greater than the width of the bottom flange 711. The widths of the top flange 713 and the bottom flange 711 refer to the dimensions measured along the thickness direction Z perpendicular to the motherboard 40. Since the shielding cover 72 and the shielding frame 71 may have uneven surfaces after manufacturing, unevenness on the surfaces used for contact will reduce the actual contact area between them, hindering a good electrical connection. In this application, setting the width of at least a portion of the top flange 713 to a larger value increases the contact area between the shielding cover 72 and the shielding frame 71, effectively compensating for the unevenness of their contact surfaces and reducing the possibility of insufficient contact area due to unevenness.

[0141] The bottom flange 711 is set to a relatively small width, which can reduce the positive projection area of ​​the bottom flange 711 on the motherboard 40 while ensuring the connection strength between the bottom flange 711 and the motherboard 40. This reduces the space occupied by the bottom flange 711 on the motherboard 40 and reduces the possibility that the area on the motherboard 40 where electronic devices 50 can be set will be reduced due to the bottom flange 711 occupying too much space on the motherboard 40.

[0142] For example, the width of the top flange 713 at any position is greater than the width of the bottom flange 711.

[0143] For example, the width of a portion of the top flange 713 is greater than the width of the remaining portions. In areas where the top flange 713 needs to avoid the first connecting terminal 41, the width of the top flange 713 can be set to be relatively small, while in areas where the top flange 713 does not need to avoid the first connecting terminal 41, the width of the top flange 713 can be set to be relatively large. This allows the top flange 713 to be set to a larger overall width without interfering with the position of the first connecting terminal 41, thereby facilitating a larger contact area between the shielding cover 72 and the shielding frame 71.

[0144] For example, the blank for manufacturing the shielding frame 71 is a flat plate. First, the blank is stamped using a stamping process to stamp out the shielding frame 71, which has a bottom flange 711, a first side plate 712, and a top flange 713. Then, the shielding frame 71 is shaped to fully release the internal stress of the shielding frame 71.

[0145] See also some of the possible implementation methods. Figure 6 , Figure 7 and Figure 8As shown, the shielding cover 72 and the shielding frame 71 are interlocked. The shielding cover 72 and the shielding frame 71 contact and press against each other at the interlocking position, ensuring a good electrical connection even at this position. One of the shielding cover 72 and the shielding frame 71 has a snap-fit ​​part 80, and the other has a locking part 90. The shielding cover 72 and the shielding frame 71 can be interlocked via the snap-fit ​​part 80 and the locking part 90. This snap-fit ​​method facilitates quick assembly or disassembly of the shielding cover 72 and the shielding frame 71, improving assembly or disassembly efficiency.

[0146] The interlocking parts 80 and 90 can press and fit together, ensuring a good electrical connection between the shielding cover 72 and the shielding frame 71 at the interlocking positions. After the interlocking part 80 engages with the snap-fit ​​part 90, it is restrained by the snap-fit ​​part 90, maintaining a stable connection. Under external force, the interlocking part 80 is less likely to detach from the snap-fit ​​part 90, reducing the possibility of the shielding cover 72 and the shielding frame 71 separating due to accidental impact, thus preventing shielding failure of the shielding component 70.

[0147] In some examples, the snap-fit ​​portion 80 can be a protrusion, while the snap-fit ​​portion 90 can be a blind hole or a through hole.

[0148] In some examples, the shielding cover 72 can be a one-piece molded structure. The shielding frame 71 can also be a one-piece molded structure. A snap-fit ​​portion 80 can be directly machined onto one of the shielding cover 72 and the shielding frame 71, and a locking portion 90 can be directly machined onto the other. Therefore, on the one hand, the shielding cover 72 and the shielding frame 71 can maintain good overall integrity; on the other hand, there is no need to additionally provide snap-fit ​​components including the snap-fit ​​portion 80 and the locking portion 90 between the shielding cover 72 and the shielding frame 71, which helps to reduce the number of parts used and reduce the assembly process where one of the shielding cover 72 and the shielding frame 71 needs to be assembled with the snap-fit ​​portion 80 and the other needs to be assembled with the locking portion 90.

[0149] In some examples, the outer surface of the top flange 713 facing away from the motherboard 40 directly abuts against the inner surface of the shielding cover 72 facing the motherboard 40. At the same time, the shielding cover 72 and the shielding frame 71 are interlocked, which can improve the connection reliability between the shielding cover 72 and the shielding frame 71. This allows the shielding cover 72 to effectively press the top flange 713, ensuring that the shielding cover 72 and the top flange 713 maintain a good fit and contact state. This reduces the possibility of poor contact between the shielding cover 72 and the top flange 713 due to loosening of the shielding cover 72 and the shielding frame 71, thereby reducing the possibility of passive inter-modulation (PIM) problems and stray radiation (RSE) problems caused by poor contact.

[0150] In some examples, the shielding frame 71 may include a connected first side plate 712, a bottom flange 711, and a top flange 713. The shielding cover 72 and the first side plate 712 are snapped together. The snap-fit ​​method between the shielding cover 72 and the first side plate 712 facilitates quick assembly or disassembly of the shielding cover 72 and the shielding frame 71, improving assembly or disassembly efficiency. Exemplarily, one of the shielding cover 72 and the first side plate 712 is provided with a snap-fit ​​portion 80, and the other is provided with a snap-fit ​​portion 90. The snap-fit ​​portion 80 and the snap-fit ​​portion 90 are snapped together. The outer surface of the top flange 713 of the shielding frame 71 facing away from the motherboard 40 is electrically connected to the inner surface of the top plate facing the motherboard 40.

[0151] See Figure 6 , Figure 7 and Figure 8 As shown, the shielding cover 72 may include a connected top plate 721 and a second side plate 722. The second side plate 722 and the top plate 721 of the shielding cover 72 are intersecting and have a predetermined included angle between them. For example, the included angle between the second side plate 722 and the top plate 721 may be 90°. There may also be an arc transition section between the second side plate 722 and the top plate 721 to reduce stress concentration between the second side plate 722 and the top plate 721. Exemplarily, the blank for manufacturing the shielding cover 72 is a flat plate. First, the blank is stamped using a stamping process to stamp out the shielding cover 72 with the second side plate 722 and the top plate 721. Then, the shielding cover 72 is shaped to fully release the internal stress of the shielding cover 72.

[0152] A latching portion 80 is provided on one of the first side plate 712 of the shielding frame 71 and the second side plate 722 of the shielding cover 72, and a locking portion 90 is provided on the other. A first connecting terminal 41 and a second connecting terminal 63 are disposed between the top plate 721 of the shielding cover 72 and the main board 40. The first connecting terminal 41 and the second connecting terminal 63 are disposed on the side of the top plate 721 of the shielding cover 72 facing the main board 40.

[0153] In some examples, during the assembly of the shielding cover 72 and the shielding frame 71, the second side plate 722 of the shielding cover 72 can undergo elastic deformation before the snap-fit ​​part 80 snaps into the engaging part 90. After the snap-fit ​​part 80 snaps into the engaging part 90, under the elastic restoring force of the second side plate 722, the snap-fit ​​part 80 and the engaging part 90 are pressed and adhered to each other. At the same time, the top flange 713 of the shielding frame 71 and the top plate 721 of the shielding cover 72 are pressed and adhered to each other.

[0154] In some examples, the shielding cover 72 is provided with a snap-fit ​​portion 80, while the shielding frame 71 is provided with a snap-fit ​​portion 90. Exemplarily, the first side plate 712 of the shielding frame 71 is provided with a snap-fit ​​portion 90, while the second side plate 722 of the shielding cover 72 is provided with a snap-fit ​​portion 80.

[0155] The engaging portion 90 on the first side plate 712 of the shielding frame 71 has an opening facing away from the central through hole 71a, i.e., the engaging portion 90 has an outward-facing opening. The engaging portion 80 on the second side plate 722 of the shielding cover 72 protrudes towards the receiving space 180. After the shielding cover 72 and the shielding frame 71 are assembled, the second side plate 722 of the shielding cover 72 is located outside the first side plate 712 of the shielding frame 71 and is visible from the outside. The engaging portion 80 on the second side plate 722 is located inside the engaging portion 90.

[0156] In some examples, after the shielding cover 72 and the shielding frame 71 are snapped together, the second side plate 722 can abut against the first side plate 712, so that the first side plate 712 and the second side plate 722 make contact.

[0157] In some examples, the first side plate 712 of the shielding frame 71 may have multiple outer surfaces. The shielding cover 72 may include multiple second side plates 722. Each of the multiple second side plates 722 is independent. There is a gap between two adjacent second side plates 722, so that a gap is formed between two adjacent second side plates 722. Each second side plate 722 is independently arranged so that when any second side plate 722 deforms during the snap-fit ​​process, it will not pull on the other second side plates 722. Each second side plate 722 may be provided with a snap-fit ​​part 80. The first side plate 712 is provided with a snap-fit ​​part 90 corresponding to the position of the second side plate 722.

[0158] For example, Figure 10 This diagram schematically illustrates a portion of the electronic device's structure. See also... Figures 8 to 10 As shown, the first side plate 712 of the shielding frame 71 has a first outer side 7121, a second outer side 7122, a third outer side 7123, and a fourth outer side 7124 that are interconnected. The circuit board 62 of the camera device 60 can pass through the shielding cover 72 and the shielding frame 71. The circuit board 62 of the camera device 60 is disposed corresponding to the first outer side 7121. The third outer side 7123 can be a stepped surface. The shielding cover 72 can include five second side plates 722. The first outer side 7121 corresponds to one second side plate 722, and the second side plate 722 is close to the fourth outer side 7124, while there is a gap between the second side plate 722 and the circuit board 62 of the camera device 60. The second outer side 7122 and the fourth outer side 7124 each correspond to one second side plate 722. The third outer side 7123 corresponds to two second side plates 722, wherein one of the second side plates 722 closer to the second outer side 7122 is relatively closer to the first outer side 7121, while the second side plate 722 closer to the fourth outer side 7124 is relatively farther away from the first outer side 7121.

[0159] In some examples, the outer surface of the top flange 713 facing away from the motherboard 40 directly abuts against the inner surface of the top plate 721 facing the motherboard 40, so that the top flange 713 and the top plate 721 are electrically connected.

[0160] In some implementations, one end of the circuit board 62 is connected to the camera module 61, and the other end is provided with a second connection terminal 63. The second connection terminal 63 is located at the end of the circuit board 62 away from the camera module 61.

[0161] In some examples, Figure 11 A schematic view of a partial cross-sectional structure of an electronic device. Figure 12 for Figure 11 A magnified view of point M in the middle. See also... Figure 11 and Figure 12 As shown, the shielding member 70 includes a clearance hole 130. In some examples, the end of the second connection terminal 63 on the circuit board 62 passes through the clearance hole 130 and is located within the receiving space 180 together with the second connection terminal 63. After the shielding cover 72 and the shielding frame 71 are assembled by interlocking, the clearance hole 130 can be formed between the shielding cover 72 and the shielding frame 71. The circuit board 62 of the camera device 60 passes through the clearance hole 130. After the second connection terminal 63 and the first connection terminal 41 are connected, the circuit board 62 is located above the shielding frame 71. Exemplarily, the clearance hole 130 is provided corresponding to the first outer surface 7121 of the first side plate 712. The circuit board 62 of the camera device 60 is provided corresponding to the first outer surface 7121 of the first side plate 712.

[0162] In some feasible methods, the surface of the second connecting terminal 63 facing away from the first connecting terminal 41 is bonded to the shielding cover 72 with conductive adhesive to achieve electrical connection between the second connecting terminal 63 and the shielding cover 72. The assembly method may include, but is not limited to, applying conductive adhesive to the surface of the second connecting terminal 63 facing away from the first connecting terminal 41 after assembly. Then, the shielding cover 72 is fastened to the shielding frame 71. After assembly, the shielding cover 72 is bonded to the conductive adhesive.

[0163] See also some of the possible implementation methods. Figure 12 As shown, the electronic device 10 also includes a reinforcing member 100. The reinforcing member 100 is located within the receiving space 180. At least a portion of the reinforcing member 100 is disposed on the side of the second connection terminal 63 facing away from the first connection terminal 41. The shielding member 70 can apply compressive stress to the reinforcing member 100 toward the second connection terminal 63 to ensure the reliability and stability of the connection between the first connection terminal 41 and the second connection terminal 63, and reduce the possibility of the second connection terminal 63 disengaging from the first connection terminal 41 or becoming disconnected.

[0164] The reinforcing member 100 can provide protection for the second connecting terminal 63, effectively preventing structural damage to the second connecting terminal 63 due to external impact. For example, the reinforcing member 100 can separate the second connecting terminal 63 from the shielding member 70, reducing the possibility of structural damage to the second connecting terminal 63 caused by the shielding member 70 directly applying compressive stress to it. For example, the reinforcing member 100 can be connected to the second connecting terminal 63.

[0165] The reinforcing member 100 is a conductive structure. The reinforcing member 100 is electrically connected to the second connecting terminal 63. The reinforcing member 100 is also electrically connected to the shielding cover 72. Therefore, the second connecting terminal 63 is electrically connected to the grounding terminal 42 of the main board 40 through the reinforcing member 100, the shielding cover 72, and the shielding frame 71 to achieve indirect grounding.

[0166] In some embodiments, the structure of the shield 70 described above can be replaced by a clamping steel sheet. For example, a strip-shaped clamping steel sheet is provided above the reinforcing member 100 along the thickness direction Z of the motherboard 40. The clamping steel sheet is used to clamp the reinforcing member 100 and the second connecting terminal 63 along the thickness direction Z of the motherboard 40. The two ends of the clamping steel sheet can be grounded to the motherboard 40. Exemplarily, the ends of the clamping steel sheet can be connected to the motherboard 40 using fasteners such as screws to achieve grounding. In this solution, the grounding area between the clamping steel sheet and the motherboard 40 is small, and the area of ​​the clamping steel sheet blocking the first connecting terminal 41 and the second connecting terminal 63 is also small. Compared to the structure of the shield 70 described above, the grounding area between the shield 70 and the motherboard 40 is relatively large, and the shield 70 can cover the first connecting terminal 41 and the second connecting terminal 63, thereby effectively improving the shielding effect. In addition, the relatively large contact area between the reinforcing member 100 and the shielding member 70 is beneficial to achieving a larger electrical connection area between the reinforcing member 100 and the shielding member 70, reducing impedance. Thus, the method of simultaneously setting the shielding member 70 and the reinforcing member 100 can effectively improve the shielding effect.

[0167] The reinforcing member 100 can be made of a metallic material. For example, the reinforcing member 100 can be made of steel, such as stainless steel. Alternatively, the reinforcing member 100 can be a steel sheet.

[0168] In some examples, at least one of the second connecting terminal 63 and the top plate 721 of the shielding cover 72 can be bonded to the reinforcing member 100. Exemplarily, the reinforcing member 100 can be bonded to the second connecting terminal 63 by adhesive bonding. Exemplarily, the reinforcing member 100 can be bonded to the second connecting terminal 63 by a conductive adhesive layer, thereby achieving an electrical connection between the reinforcing member 100 and the second connecting terminal 63.

[0169] In some examples, the shielding cover 72 of the shielding component 70 directly abuts against the reinforcing component 100. Direct contact between the shielding cover 72 and the reinforcing component 100 enables electrical connection, eliminating the need for additional structural components to achieve this connection, thus reducing the number of parts and assembly steps. The shielding cover 72 is located on the side of the reinforcing component 100 facing away from the motherboard 40. After assembly with the shielding frame 71, the shielding cover 72 can directly abut against the reinforcing component 100. The shielding cover 72 can apply compressive stress to the reinforcing component 100 and the second connecting terminal 63 to ensure the stability of the connection between the second connecting terminal 63 and the first connecting terminal 41.

[0170] In some examples, Figure 13 A schematic cross-sectional view of an electronic device is shown. See also Figure 13 As shown, the shielding member 70 has an insulating layer 140. The insulating layer 140 can be provided on the outer surface of the shielding cover 72. The insulating layer 140 on the shielding cover 72 helps maintain good insulation between the shielding cover 72 and other conductive structures. If the shielding cover 72 does not have an insulating layer 140, there is a possibility of electrical connection between the shielding cover 72 and other conductive structures. If there is poor contact between the shielding cover 72 and other conductive structures, it may lead to passive intermodulation (PIM) problems and stray radiation (RSE) problems. The shielding cover 72 of this application has an insulating layer 140 on its outer surface, which can effectively reduce the possibility of the above problems occurring.

[0171] For example, an insulating varnish may be applied to the outer surface of the shielding cover 72. The insulating varnish cures to form an insulating layer 140. For instance, the insulating varnish may be sprayed onto the outer surface of the shielding cover 72.

[0172] In some examples, Figure 14 A schematic cross-sectional view of an electronic device is shown. See also Figure 13 As shown, the electronic device 10 also includes a conductive element 110. The conductive element 110 is disposed between the shielding cover 72 of the shielding element 70 and the reinforcing element 100. The conductive element 110 enables electrical connection between the shielding element 70 and the reinforcing element 100. After the shielding cover 72 and the shielding frame 71 are assembled, the shielding cover 72 and the reinforcing element 100 can jointly press the conductive element 110 to ensure good contact between the shielding element 70 and the reinforcing element 100 and the conductive element 110, maintaining the stability of the electrical connection between the shielding element 70 and the reinforcing element 100 and the conductive element 110.

[0173] The conductive element 110 can be a flexible structure with compressible deformation properties. The shielding cover 72 of the shielding element 70 and the reinforcing element 100 can jointly press the conductive element 110 together. Since the conductive element 110 can be compressed and deformed, if there are uneven surfaces on at least one of the shielding cover 72 and the reinforcing element 100, the conductive element 110 can compensate for this by its own deformation. This ensures that the shielding cover 72 and the conductive element 110, as well as the reinforcing element 100 and the conductive element 110, maintain a tight fit and contact, thus maintaining a good electrical connection between the shielding cover 72 and the reinforcing element 100, which helps to reduce impedance.

[0174] For example, the conductive element 110 may be a conductive cloth or a conductive adhesive layer.

[0175] In some examples, the reinforcing member 100 and the shielding cover 72 of the shielding member 70 are capacitively coupled, thereby achieving an equivalent electrical connection between the two. A relatively large capacitor can be formed between the reinforcing member 100 and the shielding cover 72 of the shielding member 70, allowing electrical signals to be coupled from one of them to the other. The lack of direct contact between the reinforcing member 100 and the shielding cover 72 avoids poor contact, thus reducing the likelihood of passive intermodulation (PIM) and stray radiation (RSE) problems caused by poor contact.

[0176] Figure 15 A schematic cross-sectional view of an electronic device is shown. See also Figure 15 As shown, the electronic device 10 also includes a high-dielectric layer 120. The high-dielectric layer 120 is disposed between the shielding cover 72 of the shielding member 70 and the reinforcing member 100. When the shielding member 70, the reinforcing member 100, and the high-dielectric layer 120 are assembled, the shielding cover 72 of the shielding member 70 and the reinforcing member 100 can jointly compress the high-dielectric layer 120. The shielding member 70, the reinforcing member 100, and the high-dielectric layer 120 form a capacitive coupling connection.

[0177] The high-dielectric layer 120 is a film structure with a high dielectric constant. The high-dielectric layer 120 can act as an insulating medium, thereby isolating the reinforcing member 100 from the shielding member 70. The shielding caps 72 of the reinforcing member 100 and the shielding member 70 respectively form coupling surfaces with the corresponding regions of the high-dielectric layer 120. According to the capacitance calculation formula, under the premise that the distance between the reinforcing member 100 and the shielding caps 72 of the shielding member 70 and the area of ​​the coupling surface remain unchanged, the larger the dielectric constant of the insulating medium between the reinforcing member 100 and the shielding caps 72 of the shielding member 70, the larger the equivalent capacitance. According to the capacitance impedance calculation formula, the larger the capacitance, the smaller its capacitance impedance. The capacitance impedance is the equivalent impedance.

[0178] The shielding component 70 and the reinforcing component 100 are not electrically connected to the high-dielectric layer 120. Since capacitive coupling does not have the problem of poor contact, there are no requirements for the stability of the contact resistance between the shielding component 70 and the reinforcing component 100 and the high-dielectric layer 120. Therefore, it is not necessary to perform surface treatments such as nickel plating or gold plating on the shielding component 70 and the reinforcing component 100. In addition, the placement position of the high-dielectric layer 120 can be freely and flexibly selected according to design requirements.

[0179] For example, when a high-frequency electrical signal is generated on the reinforcing member 100, the high-frequency electrical signal can be released to the shielding member 70 through capacitive coupling between the reinforcing member 100 and the shielding member 70.

[0180] For example, the high dielectric layer 120 itself can have good elasticity, so it can be applied to a confined space, and the resilience of the high dielectric layer 120 can be used to absorb the assembly tolerance and processing tolerance of the shield 70 and the reinforcement 100, ensuring that the shield 70 and the reinforcement 100 are in good pressure against the high dielectric layer 120.

[0181] For example, the high dielectric layer 120 may include an elastomer and magnesium or aluminum powder disposed in the elastomer. The elastomer may be made of plastic.

[0182] For example, the high-dielectric layer 120 may include an absorbing material, thereby absorbing and attenuating incident electromagnetic signals, reducing or eliminating reflected electromagnetic signals, which helps to reduce interference caused by unwanted electromagnetic signals. For example, the absorbing material of the high-dielectric layer 120 may include an iron-silicon-aluminum material.

[0183] In some feasible ways, Figure 16 This diagram schematically illustrates a portion of the electronic device's structure. See also... Figure 16 As shown, unlike the above-mentioned shielding component 70 which includes a shielding frame 71 and a shielding cover 72, the shielding component 70 in this embodiment is an integrally formed structure.

[0184] The shield 70 is connected to the motherboard 40. Exemplarily, the shield 70 is soldered to the motherboard 40. A receiving space is formed between the shield 70 and the motherboard 40. A first connection terminal 41 and a second connection terminal 63 are located within the receiving space. The shield 70 is electrically connected to the ground terminal 42. The second connection terminal 63 is electrically connected to the shield 70.

[0185] In some examples, the shield 70 includes a top wall 70a and a side wall 70b. The side wall 70b is connected to the motherboard 40. The side wall 70b is electrically connected to the ground terminal 42 of the motherboard 40. Exemplarily, the shield 70 is soldered to the ground terminal 42. The top wall 70a is electrically connected to the second connection terminal 63. The first connection terminal 41, the second connection terminal 63, the top wall 70a, and the side wall 70b can be grounded through the ground terminal 42 of the motherboard 40.

[0186] The sidewall 70b can be a ring structure. The sidewall 70b of the shielding member 70 surrounds the first connecting terminal 41, thus providing good shielding for the first connecting terminal 41 in any direction. The shape of the sidewall 70b can be regular, such as rectangular or circular. The shape of the sidewall 70b can also be irregular; this application does not specifically limit this. In some examples, the sidewall 70b may also have a notch, and the sidewall 70b is discontinuous at the notch, making the sidewall 70b not a continuous ring structure.

[0187] The surface of the second connecting terminal 63 facing away from the first connecting terminal 41 is bonded to the top wall 70a of the shielding member 70 using conductive adhesive, thereby electrically connecting the second connecting terminal 63 to the top wall 70a of the shielding member 70. The assembly method may include, but is not limited to, applying conductive adhesive to the surface of the second connecting terminal 63 facing away from the first connecting terminal 41 after assembly. Then, the shielding member 70 is assembled to the main board 40. After assembly, the top wall 70a of the shielding member 70 is bonded to the conductive adhesive.

[0188] The electronic device 10 also includes a reinforcing member 100. The reinforcing member 100 is disposed on the side of the second connecting terminal 63 facing away from the first connecting terminal 41. The reinforcing member 100 is conductive. The reinforcing member 100 is electrically connected to the second connecting terminal 63. The reinforcing member 100 is electrically connected to the top wall 70a of the shielding member 70.

[0189] The reinforcing member 100 can provide protection for the second connecting terminal 63, effectively preventing structural damage to the second connecting terminal 63 due to external impact. The shielding member 70 can apply compressive stress to the reinforcing member 100 toward the second connecting terminal 63 to ensure the reliability and stability of the connection between the first connecting terminal 41 and the second connecting terminal 63, and reduce the possibility of the second connecting terminal 63 coming out of the first connecting terminal 41 and becoming disconnected.

[0190] In some examples, the top wall 70a of the shield 70 directly abuts against the reinforcing member 100. This direct contact between the top wall 70a of the shield 70 and the reinforcing member 100 enables electrical connection, eliminating the need for additional structural components for electrical connection between the shield 70 and the reinforcing member 100, thus reducing the number of components and assembly steps. The top wall 70a of the shield 70 is located on the side of the reinforcing member 100 facing away from the main board 40. After the shield 70 and the main board 40 are assembled, the top wall 70a of the shield 70 can directly abut against the reinforcing member 100. The top wall 70a of the shield 70 can apply compressive stress to the reinforcing member 100 and the second connecting terminal 63 to ensure the stability of the connection between the second connecting terminal 63 and the first connecting terminal 41.

[0191] In some examples, the electronic device 10 also includes a conductive element 110. The conductive element 110 is disposed between the top wall 70a of the shield 70 and the reinforcing element 100. The conductive element 110 electrically connects the top wall 70a of the shield 70 and the reinforcing element 100. The conductive element 110 enables electrical connection between the shield 70 and the reinforcing element 100. After the shield 70 and the motherboard 40 are assembled, the top wall 70a of the shield 70 and the reinforcing element 100 can jointly press the conductive element 110 to ensure good contact between the shield 70 and the reinforcing element 100 and the conductive element 110, maintaining the stability of the electrical connection between the shield 70 and the reinforcing element 100 and the conductive element 110. Exemplarily, the conductive element 110 can be a flexible structure with compressible deformation properties. Since the conductive element 110 can be compressed and deformed, if there are uneven surfaces on at least one of the shielding element 70 and the reinforcing element 100, the conductive element 110 can compensate for this unevenness through its own deformation. This ensures that the shielding element 70 and the conductive element 110, as well as the reinforcing element 100 and the conductive element 110, maintain a tight fit and contact, thus ensuring a good electrical connection between the shielding element 70 and the reinforcing element 100, which helps to reduce impedance. For example, the conductive element 110 can be a conductive cloth or a conductive adhesive layer.

[0192] In some examples, the reinforcement 100 and the top wall 70a of the shield 70 are capacitively coupled, thus achieving an equivalent electrical connection between the two. A large capacitor can be effectively formed between the reinforcement 100 and the top wall 70a of the shield 70, allowing electrical signals to be coupled from one of the reinforcement 100 to the other. The absence of direct contact between the reinforcement 100 and the shield 70 avoids poor contact, reducing the likelihood of passive intermodulation (PIM) and stray radiation (RSE) problems caused by poor contact.

[0193] In some examples, the electronic device 10 also includes a high-dielectric layer 120. The high-dielectric layer 120 is disposed between the reinforcing member 100 and the top wall 70a of the shielding member 70. When the shielding member 70, the reinforcing member 100, and the high-dielectric layer 120 are assembled, the top wall 70a of the shielding member 70 and the reinforcing member 100 can jointly compress the high-dielectric layer 120. The shielding member 70, the reinforcing member 100, and the high-dielectric layer 120 form a capacitively coupled connection.

[0194] The shielding component 70 and the reinforcing component 100 are not electrically connected to the high-dielectric layer 120. Since capacitive coupling does not have the problem of poor contact, there are no requirements for the stability of the contact resistance between the shielding component 70 and the reinforcing component 100 and the high-dielectric layer 120. Therefore, it is not necessary to perform surface treatments such as nickel plating or gold plating on the shielding component 70 and the reinforcing component 100. In addition, the placement position of the high-dielectric layer 120 can be freely and flexibly selected according to design requirements.

[0195] In some examples, the shield 70 has a clearance hole 130. The circuit board 62 passes through the clearance hole 130.

[0196] In some examples, an insulating layer 140 is provided on the outer surface of the shield 70. The insulating layer 140 on the shield 70 helps maintain good insulation between the shield 70 and other conductive structures. If the shield 70 does not have an insulating layer 140, there is a possibility of electrical connection between the shield 70 and other conductive structures. Poor contact between the shield 70 and other conductive structures can lead to passive intermodulation (PIM) problems and stray radiation (RSE) problems. The insulating layer 140 on the outer surface of the shield 70 in this application effectively reduces the possibility of these problems.

[0197] In some feasible ways, Figure 17A partial structure of the electronic device is schematically shown. The electronic device 10 may include one or more camera devices 60. For each camera device 60, a corresponding shielding member 70 may be provided in any of the manner described in the above embodiments. See also... Figure 17 As shown, the electronic device 10 also includes an antenna 160. Combined with... Figures 1 to 3 The housing 30 includes a rear cover 31 and a frame 32. The rear cover 31 can be connected to the frame 32. The antenna 160 is disposed on the frame 32. Exemplarily, the antenna 160 is disposed on the inner wall of the frame 32 facing the motherboard 40. The first connection terminal 41, the second connection terminal 63, and the shielding member 70 are disposed close to the antenna 160. The first connection terminal 41, the second connection terminal 63, and the shielding member 70 can be disposed in the edge area of ​​the motherboard 40, thereby effectively utilizing the edge area of ​​the motherboard 40 to improve the utilization rate of the motherboard 40. Since the shielding member 70 can effectively shield the first connection terminal 41 and the second connection terminal 63, when the antenna 160 is in the working state of radiating wireless signals, the electromagnetic signals generated by the antenna 160 are unlikely to interfere with the first connection terminal 41 and the second connection terminal 63, reducing the possibility that the antenna 160 will have an adverse effect on the camera device 60 when performing the shooting function.

[0198] In some examples, electronic components 150 are mounted on the motherboard 40. The electronic components 150 are housed within a receiving space 180. A shielding member 70 can shield the electronic components 150. When the electronic components 150 are in operation, the electromagnetic signals emitted by the electronic components 150 are less likely to propagate to the antenna 160, which is located outside the shielding member 70 and relatively close to the electronic components 150, effectively reducing the possibility of signal interference from the electronic components 150 to the antenna 160.

[0199] In some examples, as shown in Table 1, a comparison of relevant data between the electronic device 10 of this application embodiment and the electronic device 10 of related technologies is described exemplarily:

[0200] Table 1:

[0201]

[0202] The antenna 160 can operate in the N1, N3, and B39 frequency bands. When the antenna 160 operates in these frequency bands, if the connector formed by the first connecting terminal 41 and the second connecting terminal 63 is not externally shielded by a shield 70, the isolation between the connector formed by the first connecting terminal 41 and the second connecting terminal 63 and the antenna 160 can be -41.2 dB. In this application, the connector formed by the first connecting terminal 41 and the second connecting terminal 63 is externally shielded by a shield 70, so that when the antenna 160 operates in these frequency bands, the isolation between the antenna 160 and the connector can be -50.7 dB, thereby improving the isolation and meeting the isolation requirements between the antenna 160 and the connector, reducing the possibility of signal interference. For example, the camera device 60 can be a rear-facing camera of the electronic device 10.

[0203] It should be noted that isolation is used to quantitatively characterize the strength of electromagnetic coupling, and the unit is dB.

[0204] The antenna 160 can operate in the N41 band and the 2.4GHz WIFI band. When the antenna 160 operates in these bands, if the connector formed by the first connecting terminal 41 and the second connecting terminal 63 is not externally shielded by a shield 70, the isolation between the connector formed by the first connecting terminal 41 and the second connecting terminal 63 and the antenna 160 can be -40.2dB. In this application, the connector formed externally by the first connecting terminal 41 and the second connecting terminal 63 is shielded by a shield 70, so that when the antenna 160 operates in these bands, the isolation between the antenna 160 and the connector can be -50.1dB, thereby improving the isolation and meeting the isolation requirements between the antenna 160 and the connector, reducing the possibility of signal interference.

[0205] In some examples, in related technologies, the connector formed by the first connecting terminal 41 and the second connecting terminal 63 does not have an external shield 70. In an environment with electromagnetic signals, the maximum measured value of the electric field strength at the locations of the first connecting terminal 41 and the second connecting terminal 63 can be 42 dB V / m. In this application, the connector formed by the first connecting terminal 41 and the second connecting terminal 63 has an external shield 70. In the same environment, the maximum measured value of the electric field strength at the locations of the first connecting terminal 41 and the second connecting terminal 63 can be 26 dB V / m, thus achieving a relative optimization of 16 dB V / m. Therefore, by providing the shield 70, the first connecting terminal 41 and the second connecting terminal 63 can be effectively protected, reducing signal interference.

[0206] In some feasible ways, Figure 18 A schematic cross-sectional view of an electronic device is shown. See also Figure 18As shown, the electronic device 10 also includes a metal bracket 200. The motherboard 40 can be connected to the metal bracket 200. The metal bracket 200 provides support and a mounting base for the motherboard 40. A portion of the metal bracket 200 can be located on one side of the shield 70. The shield 70 can be located between the motherboard 40 and the metal bracket 200. Because the shield 70 is grounded and covers the connector formed by the first connection terminal 41 and the second connection terminal 63, the shield 70 can effectively isolate the connector formed by the first connection terminal 41 and the second connection terminal 63 from the metal bracket 200, thereby reducing the possibility of electromagnetic signal interference between the connector formed by the first connection terminal 41 and the second connection terminal 63 due to the metal bracket 200.

[0207] The outer surface of the shield 70 may have an insulating layer 140, so that the metal bracket 200 and the shield 70 are kept in an insulating isolation state and the two are not electrically connected.

[0208] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0209] The embodiments described herein are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0210] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0211] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship between the preceding and following related objects.

[0212] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0213] It is understood that, in the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

1. An electronic device, characterized in that: include: A mainboard, comprising a first connecting terminal and a grounding terminal; A camera device, comprising a camera module, a circuit board and a second connection terminal, wherein the camera module is electrically connected to the circuit board, the second connection terminal is electrically connected to the circuit board, and the first connection terminal is electrically connected to the second connection terminal; A shielding member forms a receiving space with the mainboard, the first connecting terminal and the second connecting terminal are located in the receiving space, the shielding member is connected to the mainboard, the second connecting terminal is electrically connected to the shielding member, and the shielding member is electrically connected to the ground terminal.

2. The electronic device according to claim 1, characterized in that: The shielding component includes an electrically connected shielding frame and a shielding cover, the shielding frame is connected to the mainboard, the shielding frame is electrically connected to the ground terminal, the shielding cover is connected to the shielding frame, and the second connecting terminal is electrically connected to the shielding cover.

3. The electronic device according to claim 2, characterized in that: The shielding frame is a ring-shaped structure, and the first connecting terminal is located in the shielding frame.

4. The electronic device according to claim 2, characterized in that: The shielding cover is detachably connected to the shielding frame.

5. The electronic device according to claim 2, characterized in that: The shielding cover and the shielding frame are clamped with each other.

6. The electronic device according to claim 2, characterized in that: The shielding frame includes a bottom flange, a first side plate and a top flange, the bottom flange and the top flange are both connected to the first side plate, the bottom flange is electrically connected to the grounding terminal, and the outer surface of the top flange facing away from the mainboard is electrically connected to the inner surface of the shielding cover facing the mainboard.

7. The electronic device according to claim 6, characterized in that: The outer surface of the top flange facing away from the mainboard directly abuts against the inner surface of the shielding cover facing the mainboard, so that the top flange is electrically connected to the shielding cover, and at least part of the width of the top flange is greater than the width of the bottom flange.

8. The electronic device according to claim 6, characterized in that: The shielding cover and the first side plate are clamped with each other.

9. The electronic device according to claim 8, characterized in that: A clamping portion is disposed on one of the shielding cover and the first side plate, and a clamping portion is disposed on the other of the shielding cover and the first side plate, and the clamping portion is clamped with the clamping portion.

10. The electronic device according to claim 9, characterized in that: The shielding cover includes a connected top plate and a second side plate, the clamping portion is arranged on one of the first side plate and the second side plate, and the clamping portion is arranged on the other side, the first connecting terminal and the second connecting terminal are arranged between the top plate and the main board, and the outer surface of the top flange facing away from the main board is electrically connected to the inner surface of the top plate facing the main board.

11. The electronic device according to claim 10, characterized in that: There are multiple second side plates, and there is a gap between two adjacent second side plates.

12. The electronic device according to claim 10, characterized in that: The outer surface of the top flange facing away from the main board directly abuts against the inner surface of the top plate facing the main board, so that the top flange is electrically connected to the top plate.

13. The electronic device according to any one of claims 2 to 12, characterized in that: The surface of the second connection terminal facing away from the first connection terminal is bonded to the shielding cover by conductive adhesive, so that the second connection terminal is electrically connected to the shielding cover.

14. The electronic device according to any one of claims 2 to 12, characterized in that: The electronic device further comprises a reinforcing piece, at least part of which is arranged on the side of the second connecting terminal facing away from the first connecting terminal, the reinforcing piece is a conductive structure, the reinforcing piece is electrically connected to the second connecting terminal, and the reinforcing piece is electrically connected to the shielding cover.

15. The electronic device according to claim 14, characterized in that: The shielding cover directly contacts the reinforcing member.

16. The electronic device according to claim 14, characterized in that: The electronic device further comprises a conductive member, which is disposed between the shielding cover and the reinforcing member and electrically connects the shielding cover and the reinforcing member.

17. The electronic device according to claim 16, characterized in that: The conductive element is a flexible structure.

18. The electronic device according to claim 14, characterized in that: The reinforcing piece is capacitively coupled to the shielding cover.

19. The electronic device according to claim 18, characterized in that: The electronic device further comprises a high dielectric layer, and the high dielectric layer is arranged between the reinforcing piece and the shielding cover.

20. The electronic device according to claim 19, characterized in that: The material of the high dielectric layer includes a wave absorbing material.

21. The electronic device according to any one of claims 2 to 12, characterized in that: An escape hole is provided between the shielding cover and the shielding frame, and the circuit board is passed through the escape hole.

22. The electronic device according to any one of claims 2 to 12, characterized in that: An insulating layer is disposed on the outer surface of the shielding cover.

23. The electronic device according to any one of claims 1 to 12, characterized in that: The electronic device further includes an electronic component, which is disposed on the mainboard, disposed in the accommodation space, and spaced apart from the first connection terminal.

24. The electronic device according to any one of claims 1 to 12, characterized in that: The electronic device comprises a shell and an antenna, the mainboard is arranged in the shell, the shell comprises a frame, the antenna is arranged in the frame, and the first connecting terminal, the second connecting terminal and the shielding component are arranged close to the antenna.

25. A shielding member for electronic equipment, characterized in that: include: Shielding frame and shielding cover; The shielding cover is connected to the shielding frame, the shielding cover is connected to the shielding frame and forms a receiving cavity, the receiving cavity has an opening, the shielding frame is used for grounding, and the shielding cover is electrically connected to the shielding frame.

26. The shielding element according to claim 25, characterized in that The shielding component is used for the electronic device according to any one of claims 1 to 24.

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