Circuit board waste routing monitoring method and device, computer equipment and storage medium

Abstract

The invention provides a circuit board waste routing monitoring method and device, computer equipment and a storage medium. The method comprises the steps that waste screening state parameters of the circuit board are obtained; performing waste region surface adjustment treatment on the waste screening state parameters and preset screening state parameters to obtain waste region area adjustment; and sending a waste nailing loss signal to the routing machine according to the waste region area adjustment. After the waste screening state parameters are collected, the current on-board waste area forming condition of the circuit board is determined, and then the waste screening state parameters are compared with the standard screening parameters, so that the difference between the current on-board waste area forming condition of the circuit board and the standard waste area forming condition is conveniently determined; and finally, according to the difference value, the working mode of driving the positioning nails into the board milling machine is optimized and adjusted, so that the positioning nails can be conveniently driven into the area where the waste materials need to be milled, and the probability of tool collision and scratching caused by waste material shaking is avoided.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit boards, and in particular to a circuit board waste gong plate monitoring method, device, computer equipment and storage medium. Background Art

[0002] The gong plate is mainly controlled by the gong machine to gong out a predetermined shape on the substrate to form a PCB board or multiple PCB boards. The gong machine is a CNC milling machine that can perform shape processing on the substrate. Since the PCB board obtained by the gong plate processing method has smooth edges, precise dimensions, and high hole and groove accuracy, it can greatly save time and cost in small batches and sample production. Therefore, gong plate forming is the mainstream choice for current PCB board shape processing.

[0003] However, with the continuous development of the current PCB process industry, the size of PCB boards is getting larger and larger, and the forming gong process of the gong plate processing is long. The large waste generated during the processing cannot be sucked away by the straw, resulting in wandering on the board surface and scratching. In order to prevent the waste from hitting the knife and causing the PCB to be scrapped and the waste from scratching the board surface, the waste gong crushing method is usually adopted. For oversized waste, the machine is stopped after the first gong plate is completed to manually remove the debris. It is difficult to remove the waste before the gong plate is completed. Sometimes it is even necessary to remove the board, take away the debris, and then put the board on for the next gong plate. The specific gong plate removal process: rough gong is completed (first pass)---stop the machine to manually remove the waste---put on the board for fine gong (second pass)---take the formed board. This process is cumbersome, increasing the downtime of the process when the waste is not taken in time, and it is difficult to manually remove the waste in the middle. Moreover, large-sized waste has the risk of hitting the knife and scratching, resulting in slow gong waste efficiency and long gong process, which leads to reduced efficiency. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a circuit board waste gong board monitoring method, device, computer equipment and storage medium that effectively improves the gong efficiency.

[0005] The purpose of this disclosure is achieved through the following technical solutions:

[0006] A circuit board waste gong board monitoring method, the method comprising:

[0007] Get the scrap screening status parameters of the circuit board;

[0008] The waste screening state parameters and the preset screening state parameters are subjected to waste area surface adjustment processing to obtain waste area area adjustment;

[0009] According to the waste area adjustment, a waste nailing failure signal is sent to the roulette machine to drive positioning nails into the waste area to be rouged of the circuit board.

[0010] In one embodiment, the obtaining of the waste screening state parameters of the circuit board includes: obtaining the waste square edge length of the circuit board.

[0011] In one of the embodiments, the waste screening state parameters are subjected to waste area surface adjustment processing with preset screening state parameters to obtain waste area area adjustment, including: obtaining the adjustment of the waste square side length with the preset length to obtain the waste square area adjustment.

[0012] In one of the embodiments, a waste nailing failure signal is sent to the gong machine based on the waste area area adjustment to drive positioning nails into the waste area to be gonged of the circuit board, including: detecting whether the waste square area adjustment matches the preset square area adjustment; when the waste square area adjustment matches the preset square area adjustment, a waste nailing enable signal is sent to the gong machine.

[0013] In one embodiment, the obtaining of the waste screening state parameters of the circuit board includes: obtaining the inner diameter of the waste circle of the circuit board.

[0014] In one of the embodiments, the waste screening state parameters are subjected to waste area surface adjustment processing with preset screening state parameters to obtain waste area area adjustment, including: obtaining the adjustment of the inner diameter of the waste circle with a preset diameter to obtain the waste circular area adjustment.

[0015] In one of the embodiments, a waste nailing failure signal is sent to the gong machine based on the waste area area adjustment to drive positioning nails into the waste area to be gonged of the circuit board, including: detecting whether the waste circular area adjustment matches the preset circular area adjustment; when the waste circular area adjustment does not match the preset circular area adjustment, a waste nailing failure signal is sent to the gong machine.

[0016] A circuit board waste gong monitoring device includes: a waste collection module, a waste screening and processing module and a nailing output module; the waste collection module is used to obtain the waste screening state parameters of the circuit board; the waste screening and processing module is used to perform waste area surface leveling processing on the waste screening state parameters and preset screening state parameters to obtain the waste area area leveling; the nailing output module is used to send a waste nailing failure signal to the gong machine according to the waste area area leveling, so as to drive positioning nails into the waste area to be gonged of the circuit board.

[0017] A computer device comprises a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0018] Get the scrap screening status parameters of the circuit board;

[0019] The waste screening state parameters and the preset screening state parameters are subjected to waste area surface adjustment processing to obtain waste area area adjustment;

[0020] According to the waste area adjustment, a waste nailing failure signal is sent to the roulette machine to drive positioning nails into the waste area to be rouged of the circuit board.

[0021] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the following steps:

[0022] Get the scrap screening status parameters of the circuit board;

[0023] The waste screening state parameters and the preset screening state parameters are subjected to waste area surface adjustment processing to obtain waste area area adjustment;

[0024] According to the waste area adjustment, a waste nailing failure signal is sent to the roulette machine to drive positioning nails into the waste area to be rouged of the circuit board.

[0025] Compared with the prior art, the present invention has at least the following advantages:

[0026] After collecting the waste screening state parameters, the molding condition of the waste area on the current board of the circuit board is determined, and then the waste screening state parameters are compared with the standard screening parameters to facilitate the determination of the difference between the molding condition of the waste area on the current board of the circuit board and the molding condition of the standard waste area. Finally, according to the above difference value, the working mode of the routing machine for driving the positioning pins is optimized and adjusted to facilitate the driving of positioning pins in the areas where routing is required, so as to avoid the chance of collision with the knife and scratches caused by the shaking of the waste, and effectively improve the efficiency of routing waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 It is a flow chart of a circuit board waste gong board monitoring method in one embodiment;

[0029] Figure 2 1 is a diagram of the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0033] The present disclosure relates to a circuit board waste gong plate monitoring method. In one embodiment, the circuit board waste gong plate monitoring method includes obtaining the waste screening state parameters of the circuit board; performing waste area surface leveling processing on the waste screening state parameters and the preset screening state parameters to obtain the waste area area leveling; sending a waste nailing failure signal to the gong machine according to the waste area area leveling to drive positioning nails into the waste area to be gonged of the circuit board. After the waste screening state parameters are collected, the molding condition of the waste area on the current board of the circuit board is determined, and then the waste screening state parameters are compared with the standard screening parameters to facilitate the determination of the difference between the molding condition of the waste area on the current board of the circuit board and the molding condition of the standard waste area. Finally, according to the above difference value, the working mode of driving the positioning nail of the gong machine is optimized and adjusted to facilitate driving the positioning nails in the area where the waste needs to be gonged, so as to avoid the chance of collision and scratching caused by the shaking of the waste, and effectively improve the efficiency of gonging waste.

[0034] See also Figure 1 , which is a flow chart of a circuit board waste gong board monitoring method according to an embodiment of the present disclosure. The circuit board waste gong board monitoring method includes all or part of the following steps.

[0035] S100: Obtaining scrap screening status parameters of the circuit board.

[0036] In this embodiment, the waste screening state parameter is the molding data of the waste area on the current board of the circuit board, that is, the waste screening state parameter is the molding state of each waste board of the circuit board, that is, the waste screening state parameter corresponds to the molding state of the waste area of ​​the circuit board. By collecting the waste screening state parameter, it is convenient to screen and determine the waste area on the circuit board, so as to facilitate screening out different molding states of each waste area.

[0037] S200: performing waste area leveling processing on the waste screening state parameters and the preset screening state parameters to obtain waste area area leveling.

[0038] In this embodiment, the waste screening state parameter is the molding data of the waste area on the current board of the circuit board, that is, the waste screening state parameter is the molding state of each waste board of the circuit board, that is, the waste screening state parameter corresponds to the molding condition of the waste area of ​​the circuit board. By collecting the waste screening state parameter, it is convenient to screen and determine the waste area on the circuit board, so as to facilitate screening out the different molding conditions of each waste area. The preset screening state parameter is the molding data of the standard waste area on the board of the circuit board, that is, the preset screening state parameter is the reference molding state of each waste board of the circuit board, that is, the preset screening state parameter corresponds to the molding condition of the designated waste area of ​​the circuit board. By processing the waste area surface leveling of the waste screening state parameter and the preset screening state parameter, it is convenient to determine the degree of difference in the molding of the waste area on the current board of the circuit board.

[0039] S300: sending a waste nailing failure signal to the roulette machine according to the waste area adjustment, so as to drive positioning nails into the waste area to be rouged of the circuit board.

[0040] In this embodiment, the waste area area adjustment is obtained based on the waste screening state parameter and the preset screening state parameter, and the waste screening state parameter is the molding data of the waste area on the current board of the circuit board, that is, the waste screening state parameter is the molding state of each waste board of the circuit board, that is, the waste screening state parameter corresponds to the molding situation of the waste area of ​​the circuit board. By collecting the waste screening state parameter, it is convenient to screen and determine the waste area on the circuit board, so as to facilitate the screening of different molding situations of each waste area. The preset screening state parameter is the standard waste area molding data on the board of the circuit board, that is, the preset screening state parameter is the reference molding state of each waste board of the circuit board, that is, the preset screening state parameter corresponds to the molding situation of the designated waste area of ​​the circuit board. By processing the waste area surface adjustment of the waste screening state parameter and the preset screening state parameter, it is convenient to determine the degree of difference in the molding of the waste area on the current board of the circuit board. After obtaining the area difference of the waste area, the nailing operation can be added to the rouging machine in the rouging process to fix the waste on the circuit board that needs to be rouged, so as to avoid the risk of collision and scratches caused by the shaking of large-sized waste.

[0041] In the above embodiment, after the waste screening state parameters are collected, the molding condition of the waste area on the current board of the circuit board is determined, and then the waste screening state parameters are compared with the standard screening parameters to facilitate determination of the difference between the molding condition of the waste area on the current board of the circuit board and the molding condition of the standard waste area. Finally, according to the above difference value, the working mode of the gong machine for driving the positioning pins is optimized and adjusted to facilitate driving the positioning pins in the areas where the waste needs to be gonged, so as to avoid the chance of collision with the knife and scratches caused by the shaking of the waste, thereby effectively improving the efficiency of gonging waste.

[0042] In one embodiment, the obtaining of the waste screening state parameters of the circuit board includes: obtaining the waste square side length of the circuit board. In this embodiment, the waste screening state parameters are the molding data of the waste area on the current board of the circuit board, that is, the waste screening state parameters are the molding states of each waste board of the circuit board, that is, the waste screening state parameters correspond to the molding conditions of the waste area of ​​the circuit board. By collecting the waste screening state parameters, it is convenient to screen and determine the waste area on the circuit board, so as to facilitate the screening of different molding conditions of each waste area. The waste screening state parameters include the waste square side length of the circuit board, and the waste square side length is the side length corresponding to the current waste on the circuit board. Specifically, the current waste area on the circuit board is a square area. By collecting the side length of the current waste area on the circuit board, it is convenient to determine the size of the current waste area on the circuit board.

[0043] Further, the waste area surface adjustment processing of the waste screening state parameter and the preset screening state parameter to obtain the waste area area adjustment includes: obtaining the adjustment of the waste square side length and the preset length to obtain the waste square area adjustment. In this embodiment, the waste screening state parameter is the molding data of the waste area on the current board of the circuit board, that is, the waste screening state parameter is the molding state of each waste board of the circuit board, that is, the waste screening state parameter corresponds to the molding situation of the waste area of ​​the circuit board. By collecting the waste screening state parameter, it is convenient to screen and determine the waste area on the circuit board, so as to facilitate the screening of different molding situations of each waste area. The preset screening state parameter is the standard waste area molding data on the board of the circuit board, that is, the preset screening state parameter is the reference molding state of each waste board of the circuit board, that is, the preset screening state parameter corresponds to the molding situation of the designated waste area of ​​the circuit board. By performing the waste area surface adjustment processing of the waste screening state parameter and the preset screening state parameter, it is convenient to determine the degree of difference in the molding of the waste area on the current board of the circuit board. The waste screening state parameter includes the waste square side length of the circuit board, and the waste square side length is the side length corresponding to the current waste on the circuit board. Specifically, the current waste area on the circuit board is a square area. By collecting the side length of the current waste area on the circuit board, it is convenient to determine the size of the current waste area on the circuit board. The preset length is the side length corresponding to the standard square waste area on the circuit board. By calculating the difference between the waste square side length and the preset length, it is convenient to determine the difference between the size of the current waste area on the circuit board and the size of the standard waste area.

[0044] Furthermore, the waste nailing failure signal is sent to the gong machine according to the waste area area adjustment to drive positioning nails into the waste area to be gonged of the circuit board, including: detecting whether the waste square area adjustment matches the preset square area adjustment; when the waste square area adjustment matches the preset square area adjustment, sending a waste nailing enable signal to the gong machine. In this embodiment, the waste area area adjustment is obtained based on the waste screening state parameter and the preset screening state parameter, and the waste screening state parameter is the current board waste area molding data of the circuit board, that is, the waste screening state parameter is the molding state of each waste board of the circuit board, that is, the waste screening state parameter corresponds to the molding condition of the waste area of ​​the circuit board. By collecting the waste screening state parameter, it is convenient to screen and determine the waste area on the circuit board, so as to facilitate the screening of different molding conditions of each waste area. The preset screening state parameter is the standard waste area molding data on the board of the circuit board, that is, the preset screening state parameter is the reference molding state of each waste board of the circuit board, that is, the preset screening state parameter corresponds to the molding condition of the designated waste area of ​​the circuit board. By processing the waste area surface leveling of the waste screening state parameter and the preset screening state parameter, it is convenient to determine the degree of difference in the molding of the waste area on the current board of the circuit board. After obtaining the waste area area leveling, the gong machine can add a nailing operation in the gong process to fix the waste that needs to be gonged on the circuit board to avoid the risk of collision and scratching caused by the shaking of large-sized waste. The waste screening state parameter includes the waste square side length of the circuit board, and the waste square side length is the side length corresponding to the current waste on the circuit board. Specifically, the current waste area on the circuit board is a square area. By collecting the side length of the current waste area on the circuit board, it is convenient to determine the size of the current waste area on the circuit board. The preset length is the side length corresponding to the standard square waste area on the circuit board. By calculating the difference between the side length of the waste square and the preset length, the difference between the size of the current waste area on the circuit board and the size of the standard waste area can be determined. The waste square area adjustment matches the preset square area adjustment, indicating that the current waste area on the circuit board belongs to a large-sized waste area. At this time, the current waste area on the circuit board is prone to shaking during gong. By sending a waste nailing enable signal to the gong machine, the current waste area on the circuit board can be nailed, so that the shaking amplitude of the current waste area on the circuit board is reduced.

[0045] In another embodiment, when the waste square area adjustment does not match the preset square area adjustment, a waste nailing disable signal is sent to the gong machine. At this time, the current waste area on the circuit board is a small-sized waste area and no nailing operation is required.

[0046] In one of the embodiments, the obtaining of the waste screening state parameters of the circuit board includes: obtaining the inner diameter of the waste circle of the circuit board. In this embodiment, the waste screening state parameters are the molding data of the waste area on the current board of the circuit board, that is, the waste screening state parameters are the molding states of each waste board of the circuit board, that is, the waste screening state parameters correspond to the molding conditions of the waste area of ​​the circuit board. By collecting the waste screening state parameters, it is convenient to screen and determine the waste area on the circuit board, so as to facilitate the screening of different molding conditions of each waste area. The waste screening state parameters include the inner diameter of the waste circle of the circuit board, and the inner diameter of the waste circle is the side length corresponding to the current waste on the circuit board. Specifically, the current waste area on the circuit board is a circular area. By collecting the diameter of the current waste area on the circuit board, it is convenient to determine the size of the current waste area on the circuit board.

[0047] Further, the waste area surface adjustment processing of the waste screening state parameter and the preset screening state parameter to obtain the waste area area adjustment includes: obtaining the adjustment of the inner diameter of the waste circle and the preset diameter to obtain the waste circular area adjustment. In this embodiment, the waste screening state parameter is the molding data of the waste area on the current board of the circuit board, that is, the waste screening state parameter is the molding state of each waste board of the circuit board, that is, the waste screening state parameter corresponds to the molding situation of the waste area of ​​the circuit board. By collecting the waste screening state parameter, it is convenient to screen and determine the waste area on the circuit board, so as to facilitate the screening of different molding situations of each waste area. The preset screening state parameter is the standard waste area molding data on the board of the circuit board, that is, the preset screening state parameter is the reference molding state of each waste board of the circuit board, that is, the preset screening state parameter corresponds to the molding situation of the designated waste area of ​​the circuit board. By performing the waste area surface adjustment processing of the waste screening state parameter and the preset screening state parameter, it is convenient to determine the degree of difference in molding of the waste area on the current board of the circuit board. The waste screening state parameter includes the waste circle inner diameter of the circuit board, and the waste circle inner diameter is the diameter corresponding to the current waste on the circuit board. Specifically, the current waste area on the circuit board is a circular area. By collecting the diameter of the current waste area on the circuit board, it is convenient to determine the size of the current waste area on the circuit board. The preset diameter is the diameter corresponding to the standard circular waste area on the circuit board. By calculating the difference between the waste circle inner diameter and the preset diameter, it is convenient to determine the difference between the size of the current waste area on the circuit board and the size of the standard waste area.

[0048] Furthermore, the waste nailing failure signal is sent to the gong machine according to the waste area area adjustment to drive positioning nails into the waste area to be gonged of the circuit board, including: detecting whether the waste circular area adjustment matches the preset circular area adjustment; when the waste circular area adjustment does not match the preset circular area adjustment, sending a waste nailing failure signal to the gong machine. In this embodiment, the waste area area adjustment is obtained based on the waste screening state parameter and the preset screening state parameter, and the waste screening state parameter is the molding data of the waste area on the current board of the circuit board, that is, the waste screening state parameter is the molding state of each waste board of the circuit board, that is, the waste screening state parameter corresponds to the molding condition of the waste area of ​​the circuit board. By collecting the waste screening state parameter, it is convenient to screen and determine the waste area on the circuit board, so as to facilitate the screening of different molding conditions of each waste area. The preset screening state parameter is the standard waste area molding data on the board of the circuit board, that is, the preset screening state parameter is the reference molding state of each waste board of the circuit board, that is, the preset screening state parameter corresponds to the molding condition of the designated waste area of ​​the circuit board. By processing the waste area surface leveling of the waste screening state parameter and the preset screening state parameter, it is convenient to determine the degree of difference in the molding of the waste area on the current board of the circuit board. After obtaining the waste area area leveling, the gong machine can add a nailing operation in the gong process to fix the waste that needs to be gonged on the circuit board to avoid the risk of collision and scratching caused by the shaking of large-sized waste. The waste screening state parameter includes the waste circle inner diameter of the circuit board, and the waste circle inner diameter is the diameter corresponding to the current waste on the circuit board. Specifically, the current waste area on the circuit board is a circular area. By collecting the diameter of the current waste area on the circuit board, it is convenient to determine the size of the current waste area on the circuit board. The preset diameter is the diameter corresponding to the standard circular waste area on the circuit board. By calculating the adjustment between the inner diameter of the waste circle and the preset diameter, the difference between the size of the current waste area on the circuit board and the size of the standard waste area can be determined. The waste circular area adjustment does not match the preset circular area adjustment, indicating that the current waste area on the circuit board is a small-sized circular waste area, and no nailing operation is required to avoid nailing and fixing the waste area that has no impact.

[0049] In another embodiment, when the circular area adjustment of the waste material matches the preset circular area adjustment, it indicates that the current waste area on the circuit board belongs to a large-sized circular waste area. At this time, the current waste area on the circuit board is prone to shaking during gong operation. By sending a waste nailing enable signal to the gong machine to facilitate the nailing operation on the current waste area on the circuit board, the shaking amplitude of the current waste area on the circuit board is reduced.

[0050] In the actual waste reaping process of the circuit board, the waste area to be reaped of the circuit board needs to be nailed with positioning nails to fix the waste area to be reaped. However, before the reaping, some holes have been drilled on the waste area of ​​the circuit board. If holes for the positioning nails are drilled, the recycling value of the waste area will be lost.

[0051] In order to improve the recycling value of waste materials, the waste nailing failure signal is sent to the gong machine according to the area adjustment of the waste area, so as to drive the positioning nails into the waste area to be gonged of the circuit board, and the following steps are also included:

[0052] Obtaining the waste drilling hole diameter of the circuit board;

[0053] Detecting whether the borehole diameter of the waste material is greater than or equal to a preset borehole diameter;

[0054] When the waste drilling hole diameter is greater than or equal to the preset hole diameter, a drilling-free hole positioning signal is sent to the gong machine to select the current drilling hole as the positioning hole.

[0055] In this embodiment, the waste drilling hole diameter is the size of the hole drilled in the waste area on the circuit board, and the preset hole diameter is the minimum hole diameter of the additional drilling hole in the waste area on the circuit board. Specifically, the preset hole diameter is equal to the diameter of the positioning pin. The waste drilling hole diameter is greater than or equal to the preset hole diameter, indicating that the size of the hole drilled in the waste area on the circuit board is greater than the specified drilling size, that is, it indicates that the hole drilled in the waste area on the circuit board can be used for the installation of positioning pins, that is, it indicates that there are holes in the waste area on the circuit board that are suitable for nailing positioning pins. At this time, a drilling-free hole positioning signal is sent to the gong machine to select the current hole as the positioning hole, and there is no need to drill additional holes in the current waste area on the circuit board. The existing hole is directly used as the installation hole for the positioning pin.

[0056] Further, when the waste drilling hole diameter is greater than or equal to the preset hole diameter, a drilling-free hole positioning signal is sent to the gong machine to select the current drilling hole as the positioning hole, which specifically includes the following steps:

[0057] When the waste drilling hole diameter is greater than or equal to the preset hole diameter, obtaining the waste positioning hole edge spacing of the circuit board;

[0058] Detecting whether the waste positioning hole edge spacing is greater than or equal to a preset hole edge spacing;

[0059] When the waste positioning hole edge spacing is greater than or equal to the preset hole edge spacing, a drilling-free hole positioning signal is sent to the gong machine.

[0060] In this embodiment, the waste positioning hole edge spacing is the distance between the positioning hole selected in the waste area on the circuit board and the boundary of the waste area, and the preset hole edge spacing is the safety distance between the positioning hole and the boundary in the waste area on the circuit board. Specifically, the preset hole edge spacing is the anti-collision safety distance between the gong cutter near the boundary of the waste area and the positioning pins during gong operation. The waste positioning hole edge spacing is greater than or equal to the preset hole edge spacing, indicating that the positioning hole selected in the waste area on the circuit board is kept above the safety distance from the boundary of the waste area. At this time, the position of the positioning hole meets the requirements, which facilitates further determination of the rationality of the currently selected positioning hole and avoids collision between the gong cutter and the positioning pins during gong operation.

[0061] Furthermore, the detecting whether the waste positioning hole side spacing is greater than or equal to the preset hole side spacing further includes:

[0062] When the waste positioning hole side spacing is less than the preset hole side spacing, obtaining the waste drilling hole over-center deviation angle of the circuit board;

[0063] Detecting whether the waste material drilling through-center deviation angle is equal to 0;

[0064] When the deviation angle of the waste material drilling hole through the center is not equal to 0, a signal for drilling two more holes through the center is sent to the gong machine.

[0065] In the present embodiment, the edge spacing of the waste positioning holes is smaller than the preset hole edge spacing, indicating that the positioning holes selected in the waste area on the circuit board are too close to the boundary of the waste area, and the gong cutter is easy to collide with the positioning pins to cause loosening. At this time, the waste drilling through-center deviation angle is collected, and the waste drilling through-center deviation angle is the deviation angle between the center lines of the two positioning holes selected in the waste area on the circuit board and the center straight line passing through the waste area. The waste drilling through-center deviation angle is not equal to 0, indicating that the center lines of the two positioning holes selected in the waste area on the circuit board do not coincide with the center straight line passing through the waste area, that is, the two positioning holes selected in the waste area on the circuit board do not form the farthest central symmetrical holes in the waste area. At this time, the fixing effect produced by the positioning pins corresponding to the two positioning holes is poor and cannot withstand the shaking when colliding with the gong cutter. By sending a signal for drilling double holes through the center to the gong machine, two positioning holes whose center lines coincide with the center straight line of the waste area are re-drilled, so that the positioning pins have sufficient fixing force on the circuit board when the positioning holes are too close to the boundary of the waste area.

[0066] In another embodiment, when the through-center deviation angle of the waste drilling hole is equal to 0, a drilling-free hole positioning signal is resent to the gong machine.

[0067] In another embodiment, the detection of whether the waste drilling hole diameter is greater than or equal to the preset hole diameter further includes: when the waste drilling hole diameter is smaller than the preset hole diameter, sending a drilling through-center double hole signal to the gong machine to drill two through-center positioning holes for driving the positioning nails.

[0068] The above-mentioned various preset variables are all set in the database to facilitate timely retrieval, and different preset variables are placed in different storage units, that is, in different storage stacks.

[0069] In one of the embodiments, the present disclosure also relates to a circuit board waste gong plate monitoring device, comprising: a waste collection module, a waste screening and processing module and a nailing output module; the waste collection module is used to obtain the waste screening state parameters of the circuit board; the waste screening and processing module is used to perform waste area surface leveling processing on the waste screening state parameters and the preset screening state parameters to obtain the waste area area leveling; the nailing output module is used to send a waste nailing failure signal to the gong machine according to the waste area area leveling, so as to drive positioning nails into the waste area to be gonged of the circuit board.

[0070] In this embodiment, after the waste collection module collects the waste screening state parameters, the molding condition of the waste area on the current board of the circuit board is determined, and then the waste screening processing module compares the waste screening state parameters with the standard screening parameters to facilitate determining the difference between the molding condition of the waste area on the current board of the circuit board and the molding condition of the standard waste area. Finally, the nailing output module optimizes and adjusts the working mode of the gong machine for driving the positioning nails according to the above difference value, so as to facilitate driving the positioning nails in the area where the gong waste is needed, so as to avoid the chance of collision with the knife and scratches caused by the shaking of the waste, thereby effectively improving the gong waste efficiency.

[0071] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Figure 2 As shown. The computer device includes a processor, a memory and a network interface connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store data such as ambient light-sensitive acquisition state parameters, brightness differences, and output lighting brightness adjustment signals. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a circuit board waste gong board monitoring method is implemented.

[0072] Those skilled in the art will understand that Figure 2 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0073] In one of the embodiments, the present application further provides a computer device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above-mentioned method embodiments when executing the computer program.

[0074] In one of the embodiments, the present application further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0075] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0076] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be based on the attached claims.

Claims

1. A circuit board waste gong board monitoring method, characterized in that: include: Get the scrap screening status parameters of the circuit board; Performing waste area leveling processing on the waste screening state parameters and the preset screening state parameters to obtain waste area area leveling; According to the area adjustment of the waste area, a waste nailing failure signal is sent to the roulette machine to drive positioning nails into the waste area to be rouged of the circuit board.

2. The circuit board waste gong board monitoring method according to claim 1, characterized in that: The step of obtaining the waste screening state parameters of the circuit board includes: Obtain the waste square edge length of the circuit board.

3. The circuit board waste gong plate monitoring method according to claim 2 is characterized in that: The waste area adjustment process of the waste screening state parameter and the preset screening state parameter to obtain the waste area area adjustment includes: The square side length of the waste material is adjusted with a preset length to obtain the square area adjustment of the waste material.

4. The circuit board waste gong board monitoring method according to claim 3 is characterized in that: The method of sending a waste nailing failure signal to a gong machine according to the waste area adjustment to drive positioning nails into the waste area to be gonged of the circuit board comprises: Detecting whether the waste square area adjustment matches the preset square area adjustment; When the waste square area adjustment matches the preset square area adjustment, a waste nailing enable signal is sent to the gong machine.

5. The circuit board waste gong board monitoring method according to claim 1, characterized in that: The step of obtaining the waste screening state parameters of the circuit board includes: The inner diameter of the waste circle of the circuit board is obtained.

6. The circuit board waste gong board monitoring method according to claim 5, characterized in that: The waste area adjustment process of the waste screening state parameter and the preset screening state parameter to obtain the waste area area adjustment includes: The adjustment between the inner diameter of the waste circle and the preset diameter is calculated to obtain the waste circular area adjustment.

7. The circuit board waste gong board monitoring method according to claim 6, characterized in that: The method of sending a waste nailing failure signal to a gong machine according to the waste area adjustment to drive positioning nails into the waste area to be gonged of the circuit board comprises: Detecting whether the circular area adjustment of the waste material matches the preset circular area adjustment; When the waste circular area adjustment does not match the preset circular area adjustment, a waste nailing disable signal is sent to the gong machine.

8. A circuit board waste gong board monitoring device, characterized in that: include: A waste collection module, the waste collection module is used to obtain waste screening state parameters of the circuit board; A waste screening processing module, the waste screening processing module is used to perform waste area leveling processing on the waste screening state parameters and the preset screening state parameters to obtain waste area area leveling; The nailing output module is used to send a waste nailing failure signal to the gong machine according to the area adjustment of the waste area, so as to drive positioning nails into the waste area to be gonged of the circuit board.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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