Single switch direct cooling assembly and related methods

Abstract

Particular implementations of a dual-side cooling module may include a high-side module coupled over a low-side module at a first largest flat surface of the high-side module and at a first largest flat surface of the low-side module through a coupling heat sink; a high-side heat sink coupled at a second largest flat surface of the high-side module; and a low-side heat sink coupled at a second largest flat surface of the low-side module. A single cooling fluid may contact the coupling heat sink, the high side heat sink, and the low side heat sink.

Description

background 1. Technical Field

[0002] Aspects of this document generally relate to semiconductor packages, such as packages for semiconductor devices and associated circuits. More specific implementations relate to fluid-cooled semiconductor packages. 2. Background technology

[0003] Semiconductor packages have been designed to provide mechanical support and electrical connections to the semiconductor die and associated components. The various package types can also help protect the semiconductor die from moisture and other contaminants during operation. Summary of the invention

[0004] A specific implementation of the double-sided cooling module may include a high-side module coupled above the low-side module via a coupling heat sink at the first maximum flat surface of the high-side module and at the first maximum flat surface of the low-side module; a high-side heat sink coupled at the second maximum flat surface of the high-side module; and a low-side heat sink coupled at the second maximum flat surface of the low-side module. A single cooling fluid may contact the coupling heat sink, the high-side heat sink, and the low-side heat sink.

[0005] Specific implementations of the double-sided cooling module may include one, all, or any of the following:

[0006] The modules may include electrical connectors extending from both ends of the high-side module and from both ends of the low-side module.

[0007] The high-side module and the low-side module include a single switch.

[0008] The coupling heat sink may be directly coupled to the first maximum planar surface of the high-side module and to the first maximum planar surface of the low-side module.

[0009] The coupling heat sink may include folded fins.

[0010] The coupling heat sink, the high-side heat sink, and the low-side heat sink may all include the same pin-like structure.

[0011] At least one of the coupling heat sink, the high-side heat sink, and the low-side heat sink may include a different pin-shaped structure.

[0012] The housing may enclose a high-side module, a low-side module, a high-side heat sink, a low-side heat sink, and a single cooling fluid.

[0013] A specific implementation of a single-sided cooling module may include a high-side module directly mechanically coupled above the low-side module via a coupling heat sink at a first maximum planar surface of the high-side module and at a first maximum planar surface of the low-side module. The high-side module and the low-side module may be thermally coupled only via the coupling heat sink.

[0014] The specific implementation of the single-sided cooling module may include one, all or any of the following:

[0015] The modules may include electrical connectors extending from both ends of the high-side module and from both ends of the low-side module.

[0016] The high-side module and the low-side module may include a single switch.

[0017] The coupling heat sink may include folded fins.

[0018] A specific implementation of the cooling assembly may include at least two single switch modules coupled to corresponding openings in a support frame; an upper jacket coupled to the support frame; a lower jacket coupled to the support frame; a coolant inlet coupled to the support frame; and a coolant outlet coupled to the support frame. Each of the at least two single switch modules may include a high side module mechanically coupled directly above the low side module at a first maximum planar surface of the high side module and at a first maximum planar surface of the low side module by coupling a heat sink.

[0019] Specific implementations of the cooling assembly may include one, all, or any of the following:

[0020] The support frame may include at least two flow paths therein configured to direct cooling fluid to a coupled heat sink of each of the at least two single switch modules.

[0021] The lower jacket and the upper jacket may be coupled to the at least two single switch modules.

[0022] The assembly may be an immersion cooling module.

[0023] The at least two single switch modules may be configured to perform single-side cooling by flowing the coolant from the coolant inlet to the coolant outlet.

[0024] The at least two single switch modules may be configured to perform double-sided cooling by flowing the coolant from the coolant inlet to the coolant outlet.

[0025] The high-side module and the low-side module may be thermally coupled only by coupling the heat sink.

[0026] The assembly may include: a high side heat sink coupled at the second largest flat surface of the high side module; and a low side heat sink coupled at the second largest flat surface of the low side module. A single cooling fluid may contact the coupled heat sink, the high side heat sink, and the low side heat sink.

[0027] The foregoing and other aspects, features and advantages will be apparent to those skilled in the art from the detailed description and accompanying drawings, and from the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Embodiments will be described below in conjunction with the accompanying drawings, in which like reference numerals represent like elements, and:

[0029] Figure 1 is a perspective view of a specific implementation of a half-bridge direct cooling module with single-sided cooling;

[0030] Figure 2 yes Figure 1 A side view of a specific implementation of a half-bridge direct cooling module;

[0031] Figure 3 is a perspective view of a specific implementation of a single-switch direct cooling module (single-switch module) with single-side cooling;

[0032] Figure 4 yes Figure 3 A side view of a specific implementation of a single switch module;

[0033] Figure 5 is a perspective view of a specific implementation of a half-bridge direct cooling module with double-sided cooling;

[0034] Figure 6 yes Figure 5 A side view of a specific implementation of a half-bridge direct cooling module;

[0035] Figure 7 is a perspective view of a specific implementation of a single switch direct cooling module (single switch module) with double-sided cooling;

[0036] Figure 8 yes Figure 7 A side view of a specific implementation of a single switch module;

[0037] Fig. 9 is a perspective view of a specific implementation of a half-bridge direct cooling module configured for immersion cooling;

[0038] Fig.10 is a perspective view of a single switch direct cooling module (single switch module) configured for single-sided immersion cooling;

[0039] Fig.11 yes Fig. 9 A side view of a specific implementation of a half-bridge direct cooling module;

[0040] Fig.12 yes Fig.10 A side view of a single switch module of a specific implementation;

[0041] Fig.13 is a perspective view of another embodiment of a half-bridge direct cooling module configured for immersion cooling;

[0042] Fig.14is a perspective view of a specific implementation of a single switch direct cooling module (single switch module) configured for double-sided immersion cooling;

[0043] Fig.15 yes Fig.13 A side view of a specific implementation of a half-bridge direct cooling module;

[0044] Fig.16 yes Fig.14 A side view of a specific implementation of a single switch module;

[0045] Fig.17 is an exploded perspective view of three single switch module embodiments with single-sided cooling prior to coupling with a support frame embodiment;

[0046] Fig.18 is a perspective view of a cooling assembly embodiment with an upper jacket and a lower jacket coupled over three single switch module embodiments and a support frame embodiment with single-sided cooling;

[0047] Fig.19 yes Fig.18 A perspective cutaway view of a cooling assembly embodiment;

[0048] Fig. 20 is an exploded perspective view of a cooling assembly embodiment including three single switch module embodiments with double-sided cooling, showing upper and lower jacket embodiments and a support frame embodiment;

[0049] Fig.21 yes Fig. 20 A perspective assembly diagram of a cooling assembly embodiment of the invention;

[0050] Fig. 22 is an exploded perspective view of a cooling assembly embodiment including three single switch module embodiments with double-sided cooling as well as a frame embodiment and an upper jacket embodiment and a lower jacket embodiment with inlet and outlet portions;

[0051] Fig.23 yes Fig. 22 A perspective assembly diagram of a cooling assembly embodiment of the invention;

[0052] Fig.24 yes Fig.23 a perspective cutaway view of a cooling assembly; and

[0053] Fig.25 is a perspective assembly view of an alternative cooling assembly implemented using three single switch modules with single-sided cooling. DETAILED DESCRIPTION

[0054] The present disclosure, its aspects, and embodiments are not limited to the specific components, assembly processes, or method elements disclosed herein. Many additional components, assembly processes, and / or method elements known in the art that meet the expectations of single-switch direct cooling assemblies and related methods will be readily apparent for use with specific implementations of the present disclosure. Thus, for example, although specific implementations are disclosed, such implementations and implementation components may include any shape, size, style, type, model, version, measurement, concentration, material, quantity, method element, step, etc. known in the art for such single-switch direct cooling assemblies and related methods and implementation components and methods that meet the expected operation and method.

[0055] Reference Figure 1 , illustrates a perspective view of a specific implementation of a half-bridge direct cooled module 2 with single-sided cooling via a folded fin heat sink 4 coupled to a first largest flat surface 6 of the module 2 . Figure 2 A side view of a half-bridge direct cooling module 2 is illustrated, showing the structure of the folded fin heat sink 4. The half-bridge direct cooling module 2 is electrically combined with another half-bridge direct cooling module 2 to form a single switch that can be used with a direct current (DC) motor or an alternating current motor (AC) (non-limiting example). Because the half-bridge direct cooling modules are cooled only on one face when included in a liquid cooling assembly, they are aligned side by side and their largest flat surfaces are oriented in parallel to allow the folded fin heat sink 4 to have an equal opportunity to contact the fluid flow. For an assembly including three switches used in a three-phase motor drive (non-limiting example), six half-bridge direct cooling modules are included, which results in the cooling assembly being six modules long and can result in a significant temperature increase from the first module to the sixth module along the length of the cooling assembly. This results in the cooling of the sixth module being less efficient than the cooling of the first module due to the increase in the temperature of the cooling fluid.

[0056] Reference Figure 3 , illustrates a specific implementation of a single switch direct cooling module (single switch module) 8 using a folded fin heat sink 10 for single-side cooling. Here, the single switch module 8 includes a high-side module 12 and a low-side module 14. The high-side module 12 includes a high-side half-bridge circuit of a switch, and the low-side module 14 includes a low-side half-bridge circuit of a switch. Although the semiconductor package specific implementation disclosed herein includes semiconductor devices and related circuits used in switches, the mechanical and thermal structures and principles disclosed herein can be applied to a wide variety of semiconductor device / circuit types, including, by way of non-limiting examples, rectifiers, inverters, boost converters, thyristors, lateral devices, metal oxide semiconductor field effect transistors (MOSFETs), insulated gate bipolar transistors (IGBTs), gallium nitride semiconductor devices, silicon carbide semiconductor devices, gallium arsenide semiconductor devices, or any other semiconductor device / circuit type in which it is desired to use a heat sink to fluidly cool the package.

[0057] like Figure 3 As illustrated, using a single folded fin heat sink 10 to directly couple the high-side module 12 and the low-side module 14 allows the perimeters of the two modules to be substantially aligned with each other. As in this embodiment, if the high-side module 12 and the low-side module 14 are half-bridge modules forming a single circuit, this ability to overlap the perimeters of the modules can allow the overall length of the cooling assembly including the single switch module to be reduced. For example, in a cooling assembly including three single switch modules such as Figure 3 In the cases shown in , the total length of the cooling assembly would now only need to be three modules long, rather than Figure 1 and Figure 2 The half-bridge direct cooling module shown would need to be six modules long. Figure 3 In the specific implementations shown and referring to Figure 4 As shown in the side view, the coupling heat sink 10 (in this embodiment, a single folded fin heat sink) mechanically and thermally couples the high-side module 12 and the low-side module 14 together at the first largest planar surface 16 of the high-side module 12 and at the first largest planar surface 18 of the low-side module 14. Figure 3 to Figure 4 The use of a folded fin heat sink design is illustrated throughout this document, but this is for convenience only, as many other heat sink designs may be used in various implementations, including, by way of non-limiting example, a pin fin heat sink, an extruded heat sink, a bonded fin heat sink, a scraper heat sink, or any other type of heat sink capable of mechanically and thermally connecting the high side module 12 and the low side module 14.

[0058] like Figure 3 to Figure 4 As illustrated, various electrical connectors 20, 22, 24 extend from both ends of the high-side module 12 and the low-side module 14. In various module implementations, the specific type, orientation, and point at which the electrical connectors extend from the modules depends on the specific semiconductor devices / circuits included in the modules, and thus a wide variety of electrical connector types may be employed in various implementations.

[0059] Reference Figure 5 , illustrates a perspective view of a specific implementation of a half-bridge direct cooling module 26 having two folded fin heat sinks 28 , 30 , each coupled to the largest planar surface of the module 26 . Figure 6 Example Figure 5 A side view of a specific implementation of Figure 1 and Figure 2 As in the half-bridge direct cooling module 2 illustrated in FIG. 1 , although the use of two folded fin heat sinks 28, 30 helps increase heat transfer from the module, since the module is only half of the switching circuit, the length of the cooling assembly will be the same as that of the one using the heat sink. Figure 1 to Figure 2Furthermore, the increased ability to transfer heat from the half-bridge direct cooling module 26 due to the increased surface area of ​​the two heat sinks may exacerbate rather than improve the problem of increased coolant temperature along the length of the cooling assembly because the cooling fluid will experience enhanced heat transfer.

[0060] Reference Figure 7 , illustrates a specific implementation of a single switch module 32 in combination with double-sided cooling. Figure 3 to Figure 4 In the single switch module embodiment 8, the module 32 includes a high-side module 34 and a low-side module 36 that are directly mechanically coupled via a coupling heat sink 38. The coupling heat sink 38 also thermally couples the high-side module 34 and the low-side module 36 at a first maximum flat surface 40 of the high-side module 34 and a first maximum flat surface 42 of the low-side module 36. Figure 7 and Figure 8 As illustrated, the high-side heat sink 44 is coupled to the second largest planar surface 46 of the high-side module 34. The low-side heat sink 48 is also coupled to the second largest planar surface 50 of the low-side module 36. As previously described, the high-side module 34 and the low-side module 36 together form a single switch circuit. However, any semiconductor device and circuit implementation disclosed in this document can be used to replace the high-side module and the low-side module in various packaging implementations.

[0061] Although all three of the coupling heat sink 38, the high-side heat sink 44, and the low-side heat sink 48 are illustrated as having the same structure (in Figures 7 and 8 ), but they can be different heat sink designs in various implementations. For example, the coupling heat sink 38 can have one pin-like structure, while the high-side heat sink 44 and the low-side heat sink 48 can use another pin-like structure. Alternatively, all three heat sinks can use different pin-like structures. Any heat sink type and pin-like structure disclosed in this document can be used for the coupling heat sink 38, the high-side heat sink 44, or the low-side heat sink 48.

[0062] The types of modules discussed previously are used in cooling systems where a flowing coolant contacts the surface of the module. Since the flowing coolant in these systems is often conductive (like water) and may contain corrosive ions or other chemicals, the semiconductor components of the module are encapsulated / packaged in a molding compound or other protective film. However, in an immersion cooling system, since the coolant is not conductive and does not contain appreciable amounts of corrosives or other conductive materials, the need for packaging the module to improve the heat transfer effect to the coolant may be avoided. Therefore, the various semiconductor dies and other components remain exposed to the coolant.

[0063] Fig. 9A half-bridge direct cooling module 52 is illustrated without encapsulant and various semiconductor dies 54, 56 are shown therein. This half-bridge direct cooling module 52 would be placed into an immersion cooling assembly along with other similar modules. Fig.11 , which illustrates in more detail Fig. 9 5 is a side view of a half-bridge direct cooling module, showing semiconductor die 54, 56 and heat transfer plate 74 coupled thereto. Similar to the cooling assembly of the half-bridge module discussed previously, in various implementations, the half-bridge modules will be placed side by side along the length of the immersion cooling assembly, resulting in an immersion cooling assembly that will be six half-bridge modules long for an assembly containing three switching circuits.

[0064] Reference Fig.10 , illustrates a specific implementation of a single switch module 58 designed for use in an immersion cooling assembly. Here, the high side module 60 and the low side module 62 are coupled together at the first end 64, 66 and at the second end 68, 70. In various specific implementations, they can be mechanically coupled together using spacers and fasteners, molding compounds, clamps, brackets, spacers and molding compounds, or any other structure or system for mechanical coupling (non-limiting example). A coupling heat sink 72 is coupled between / to the high side module 60 and the low side module 62. In this specific implementation, the coupling heat sink 72 can mechanically couple the high side module 60 and the low side module 62 together. In other specific implementations, the coupling heat sink 72 can be used primarily to thermally couple the high side module 60 and the low side module 62 together. As Fig.10 As illustrated, the coupled heat sink 72 is a folded fin heat exchanger, but in other implementations, any other heat exchanger type / pin design disclosed herein may be employed. Fig.12 yes Fig.10 5 is a side view of a single switch module 58, showing the coupled heat sink and how it couples to the heat transfer plates 76, 78 of the high side module 60 and the low side module 62, respectively. Similar to the single switch modules discussed previously, various electrical connectors 80, 82, 84 extend from the first end 64, 66 and the second end 68, 70 to allow the single switch module to be electrically coupled to the larger circuit of the system that the switch circuit is controlling. Fig.10 Also shown is how mold compounds 86 , 88 are used to couple the first ends 64 , 66 and the second ends 68 , 70 together.

[0065] Reference Fig.13, illustrates another implementation of a half-bridge direct cooling module 90 designed for immersion cooling using dual cooling, which includes an upper heat transfer plate / block 92. The use of the upper heat transfer plate / block 92 is used to facilitate heat transfer from the top and bottom sides of the module, and in some implementations, heat sinks such as those disclosed herein can be attached to the upper heat transfer plate / block 92 and the corresponding lower heat transfer plate / block 94. Fig.15 yes Fig.13 90 , showing the exposed semiconductor dies 96 , 98 and the upper and lower heat transfer plates / blocks 92 , 94 .

[0066] Reference Fig.14 , illustrates a perspective view of a single switch module 100 designed for use in an immersion cooling assembly. As illustrated in the figure, the single switch module 100 includes a high-side module 102 and a low-side module 104 (at Fig.16 ). A high-side heat sink 108 is coupled to the high-side module 102, and a low-side heat sink 110 is coupled to the low-side module 104. Fig.10 Single switch module 58, Fig.14 and Fig.16 The high side module 102 and the low side module 104 illustrated in the embodiment are coupled together at their ends by encapsulant / mold compound 112, 114. The single switch module 100 also includes electrical connectors 116, 118, 120 extending from the ends of the high side module 102 and the low side module 104. Similar to Fig.10 , because the perimeters of the high-side module 102 and the low-side module 104 are substantially overlapped / arranged above each other, three single switch modules can be placed side by side in approximately half the length of a circuit equivalent number of half-bridge modules (six). Therefore, for the same switching capacity, the use of single-sided modules 58, 100 can significantly reduce the length of the immersion cooling assembly in which the module is installed. Similar to the half-bridge module 90, exposed semiconductor dies 122, 124 are included in each of the high-side module 102 and the low-side module 104.

[0067] The various single switch modules disclosed in this document (both single-sided cooling and double-sided cooling) can be combined in various implementations of cooling assemblies, including both immersion cooling and flow cooling. Fig.17, illustrates a specific implementation of a support frame 126 that includes an opening 128 into which a single-sided direct cooling single switch module 130 such as those disclosed herein can be coupled / attached. The support frame 126 includes a fluid inlet port 132 and a fluid outlet port 134 through which cooling fluid enters and is directed through a coupled heat sink 136 of the single-sided direct cooling single switch module 130. In order to retain and direct the fluid through the coupled heat sink 136 and refer to Fig.18 , an upper jacket 138 and a lower jacket 140 are coupled over the single switch module 130 to form a seal around the flow of cooling fluid and the module. Fig.19 Shows Fig.18 FIG. 1 is a cross-section of a cooling assembly showing the cooling fluid flow direction from the fluid inlet port 132 to the fluid outlet port 134 and the channel 142 in which the fluid flows between the upper jacket 138 and the lower jacket 140. In various implementations, the upper jacket 138 and the lower jacket 140 can provide some additional thermal cooling for the single switch module 130.

[0068] Although the support frame 126 is illustrated as being used with an upper jacket 138 and a lower jacket 140 coupled thereto and a single switch module 130, in other implementations, such as Fig.25 Reference Fig.17 As illustrated, a jacket may not be used, with the system instead relying on a seal between the single switch module 130 and the opening 128 of the support frame 126 to retain the cooling fluid as it flows from the fluid inlet port 132 and the fluid outlet port 134. In this implementation, cooling of the cooling assembly is performed almost entirely using the cooling fluid itself. However, the weight of the cooling assembly may be reduced by not including a jacket.

[0069] For double-sided cooled single switch modules, a similar structure can be used, but a jacket is required to form a flow channel around the high-side heat sink and the low-side heat sink. Fig. 20 , illustrates an exploded perspective view of a cooling assembly 144 that includes a support frame 146 that includes a fluid inlet port 148 and a fluid outlet port 150. The support frame 146 includes an opening 152 into which a double-sided cooled single switch module 154 is coupled, and an upper jacket 156 and a lower jacket 158 ​​are coupled above the opening. As illustrated, in this embodiment, a recess 160 is provided in the upper jacket 156 and the lower jacket 158 ​​that accommodates the dimensions of the high-side heat sink and the low-side heat sink of the single switch module 154 and provides a fluid path for the cooling fluid to contact the high-side and low-side heat sinks. Referring to Fig.21 , exemplifies Fig. 201, showing the overlapping relationship between the upper and lower jackets 156, 158 and the fluid inlet and outlet ports 148, 150, which allows fluid to flow into the recesses in the jackets.

[0070] Reference Fig. 22 , illustrates another specific implementation of a cooling assembly 162 in an exploded view. As illustrated, it includes a support frame 164, which shows a flow channel 166 that guides the coolant to an opening 168 therethrough. The design of the support frame 164 is more Fig. 20 146 is thicker, thereby allowing cooling water to flow through frame 164 rather than over the frame material as in frame 146. Due to the greater thickness of frame 164, separate inlet ports 170 and outlet ports 172 are coupled to frame 164. As illustrated in the perspective view of outlet portion 172, inside opening 174 is more expanded than the outside opening (and correspondingly in the inlet portion, although in Fig. 22 The upper jacket 178 and the lower jacket 180 each include passages 182, 184 therein. Fig.23 is an assembled perspective view of cooling assembly 162 , illustrating how the thickness of upper and lower jackets 178 , 180 are set to allow them to be flush with inlet and outlet ports 170 , 172 .

[0071] Reference Fig.24 , the expanded inner openings 174 and 186 function to allow cooling fluid to flow through the openings 166 in the support frame 164 and upward and downward into the channels in the upper jacket 178 and the lower jacket 180. This allows the cooling fluid to flow through the high side heat sink 190 and the low side heat sink 192 and the coupling heat sink 194 of the double-sided cooling single switch module 188.

[0072] Any cooling assembly disclosed in this document can be used with a single switch module designed for fluid flow cooling or immersion cooling. In various specific implementations of the cooling assembly for immersion cooling, the immersion fluid can be circulated through the cooling assembly, similar to the specific implementation of fluid flow cooling. The main difference between the two versions is the nature of the cooling fluid and whether the semiconductor die is covered with a protective material to prevent direct contact with the cooling fluid. The double-sided cooling single switch module 188 of the cooling assembly 162 is designed for immersion cooling. Therefore, the cooling assembly 162 is designed for immersion cooling, whether single-phase or two-phase cooling. In the case of a two-phase immersion cooling system, a two-phase transition can occur throughout the cooling assembly 162. In other specific implementations, the phase transition can occur in a flash tank or other container coupled to the outlet of the cooling assembly. Any of a variety of immersion cooling system components can be used with the various cooling assemblies disclosed herein. Similarly, any of a variety of flow cooling system components (heat exchangers, etc.) can be used with various cooling assemblies for flow cooling.

[0073] like Fig.24 A specific implementation of the cooling assembly 162 and Fig.19 As illustrated in the cross-section of a specific implementation of the cooling assembly 143, during operation, a single cooling fluid contacts the coupled heat sink, the high side heat sink, and the low side heat sink of each module. This is because each cooling assembly and the double-sided cooling single switch module work together to direct the same coolant (immersed or otherwise) to flow over the heat sink of each module. In this way, the need for multiple flow paths through the same module or the use of multiple coolant streams is avoided.

[0074] Where the above description mentions specific implementations of single switch direct cooling components and related methods and implementation components, sub-components, methods and sub-methods, it should be apparent that various modifications may be made without departing from the essence thereof, and that these specific implementations, implementation components, sub-components, methods and sub-methods may be applied to other single switch direct cooling components and related methods.

Claims

1. A double-sided cooling module (32), comprising: a high-side module (34) coupled above the low-side module (36) via a coupling heat sink (38) at a first maximum planar surface (40) of the high-side module (34) and at a first maximum planar surface (42) of the low-side module (36); a high-side heat sink (44) coupled to the second largest planar surface (46) of the high-side module (34); and a low-side heat sink (48) coupled to the second largest planar surface (50) of the low-side module (36); A single cooling fluid contacts the coupling heat sink (38), the high-side heat sink (44), and the low-side heat sink (48).

2. The module of claim 1, further comprising electrical connectors (20, 22, 24) extending from both ends of the high-side module (34) and from both ends of the low-side module (36).

3. The module of claim 1, wherein the high-side module (34) and the low-side module (36) comprise a single switch.

4. The module of claim 1, wherein the coupling heat sink (38) is directly coupled to the first maximum planar surface (40) of the high-side module (34) and to the first maximum planar surface (42) of the low-side module (36).

5. The module of claim 1, wherein the coupling heat sink (38) comprises folded fins.

6. The module of claim 1, wherein the coupling heat sink (38), the high-side heat sink (44), and the low-side heat sink (48) all comprise the same pin-like structure.

7. The module of claim 1, wherein at least one of the coupling heat sink (38), the high-side heat sink (44), and the low-side heat sink (48) comprises a different pin-like structure.

8. The module of claim 1, wherein a housing encloses the high side module (34), the low side module (36), the high side heat sink (44), the low side heat sink (48), and the single cooling fluid.

9. A single-side cooling module (8), comprising: A high-side module (12) mechanically coupled directly above the low-side module (14) via a coupling heat sink (10) at a first maximum planar surface (16) of the high-side module (12) and at a first maximum planar surface (18) of the low-side module (14); The high-side module (12) and the low-side module (14) are thermally coupled only through the coupling heat sink (10).

10. The module of claim 9, further comprising electrical connectors (20, 22, 24) extending from both ends of the high-side module (12) and from both ends of the low-side module (14).

11. The module of claim 9, wherein the high-side module (12) and the low-side module (14) comprise a single switch.

12. The module of claim 9, wherein the coupling heat sink (10) comprises folded fins.

13. A cooling assembly comprising: at least two single switch modules (130) coupled to corresponding openings (128) in the support frame (126); an upper jacket (138) coupled to the support frame (126); a lower jacket (140) coupled to the support frame (126); a coolant inlet (132) coupled to the support frame (126); and a coolant outlet (134) coupled to the support frame (126); Each of the at least two single switch modules (130) includes a high-side module (12) that is mechanically coupled directly above the low-side module (14) via a coupling heat sink (10) at a first maximum planar surface (16) of the high-side module (12) and at a first maximum planar surface (18) of the low-side module (14).

14. The assembly of claim 13, wherein the support frame (126) includes at least two flow paths therein, the at least two flow paths being configured to direct cooling fluid to the coupled heat sink (10) of each of the at least two single switch modules (130).

15. The assembly of claim 13, wherein the lower jacket (140) and the upper jacket (138) are coupled above the at least two single switch modules (130).

16. The assembly of claim 13, wherein the assembly (143) is an immersion cooling module.

17. The assembly of claim 13, wherein the at least two single switch modules (130) are configured for single-side cooling by coolant flowing from the coolant inlet (132) to the coolant outlet (134).

18. The assembly of claim 13, wherein the at least two single switch modules (154) are configured for double-sided cooling by coolant flowing from the coolant inlet (148) to the coolant outlet (150).

19. The assembly of claim 13, wherein the high-side module (12) and the low-side module (14) are thermally coupled only through the coupling heat sink (10).

20. The assembly of claim 13, further comprising: a high-side heat sink (44) coupled to the second largest planar surface (46) of the high-side module (34); and A low-side heat sink (48) is coupled to the second largest flat surface (50) of the low-side module (36); wherein a single cooling fluid contacts the coupled heat sink (38), the high-side heat sink (44), and the low-side heat sink (48).

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