Packaging structure for semiconductor processing and packaging method thereof

Abstract

The invention relates to the technical field of chip processing, and discloses a packaging structure for semiconductor processing and a packaging method thereof.The packaging structure comprises a rectangular mounting plate, a plurality of cylinders are fixedly mounted at the top of the rectangular mounting plate, and telescopic springs are fixedly mounted on the inner walls of the bottoms of the cylinders correspondingly; l-shaped sliding rods are fixedly installed at the tops of the multiple telescopic springs correspondingly, the top ends of the multiple L-shaped sliding rods extend out of the multiple cylinders correspondingly, and fixing sleeves are fixedly installed at the ends, close to each other, of the multiple L-shaped sliding rods. Due to the fact that the granular plastic packaging materials are different in weight, the granular plastic packaging materials which are light in mass cannot move to the uppermost portion of the conical circular plate under the action of centrifugal force, the granular plastic packaging materials on the inner wall of the conical circular plate can be evenly distributed at the moment, and therefore the plastic packaging materials can be prevented from being stacked; and the drying efficiency of the granular plastic packaging materials can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing equipment, and in particular to a packaging structure for semiconductor processing and a packaging method thereof. Background Art

[0002] A chip, also known as a microcircuit or integrated circuit, refers to a silicon wafer containing an integrated circuit. It is very small and is often a part of a computer or other electronic device. The preparation of chips mainly relies on micromachining, automation and chemical synthesis technology. According to different usage requirements, micromachining technology can be used to process various microstructures on the chip's base material, and then the necessary biochemical substances are applied and surface treatment is performed. Commonly used chip detection methods include chip capillary electrophoresis separation detection and affinity binding analysis. The chip needs to be packaged during the production and processing process.

[0003] In the process of drying the plastic packaging material, since the plastic packaging material is dried at one time, the plastic packaging material will pile up in the container, resulting in reduced drying efficiency, thereby reducing the packaging efficiency and affecting the progress of semiconductor chip production. Summary of the invention

[0004] The object of the present invention is to provide a packaging structure for semiconductor processing and a packaging method thereof, so as to solve the problem that in the process of drying the plastic packaging material, since the plastic packaging material is dried at one time, the plastic packaging material will pile up in the container, resulting in reduced drying efficiency, thereby reducing the packaging efficiency and affecting the work progress of semiconductor chip production.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions: The present invention is a packaging structure for semiconductor processing, comprising a rectangular mounting plate, a plurality of cylinders are fixedly mounted on the top of the rectangular mounting plate, a plurality of telescopic springs are fixedly mounted on the bottom inner walls of the cylinders, a plurality of L-shaped slide bars are fixedly mounted on the tops of the telescopic springs, the tops of the plurality of L-shaped slide bars extend outside the plurality of cylinders, a plurality of L-shaped slide bars are fixedly mounted on their mutually adjacent ends with fixed sleeves, and further comprising: Separation mechanism, the separation mechanism includes a circular heating cylinder fixedly installed in a fixed sleeve, a conical circular plate is rotatably installed on the inner wall of the circular heating cylinder, a reciprocating threaded rod is rotatably installed in the circular heating cylinder, the reciprocating threaded rod penetrates through the conical circular plate, the top end of the reciprocating threaded rod extends outside the circular heating cylinder, a strip-shaped plate is fixedly installed on the reciprocating threaded rod, an internally threaded plate is threadedly sleeved on the reciprocating threaded rod, an arc-shaped triangular plate is fixedly installed on the front surface of the internally threaded plate, two limiting slide rods are fixedly installed on the top inner wall of the circular heating cylinder, both of the two limiting slide rods penetrate through the internally threaded plate, a plurality of leakage holes are formed in the conical circular plate, a U-shaped fixing plate is fixedly installed on the top of the circular heating cylinder, and a driving motor is fixedly installed on the top inner wall of the U-shaped fixing plate, and an output shaft of the driving motor is fixedly connected to the reciprocating threaded rod.

[0006] Further, an annular fixing plate is fixedly sleeved on the circular heating cylinder, two hot air guns are fixedly installed on the outer wall of the annular fixing plate, two hollow grooves are formed in the annular fixing plate, one ends of the two hollow grooves close to each other extend into the circular heating cylinder, and a plurality of ventilation holes are formed in the inner wall of the circular heating cylinder.

[0007] Further, an adaptive mechanism is arranged on the circular heating cylinder, the adaptive mechanism includes a strip-shaped sliding groove formed in the circular heating cylinder, a circular groove is formed in the top of the circular heating cylinder, the bottom end of the circular groove extends into the circular heating cylinder and communicates with the strip-shaped sliding groove, a adapting spring is fixedly installed on the left inner wall and the right inner wall of the strip-shaped sliding groove respectively, one ends of the two adapting springs close to each other are fixedly installed with trapezoidal blocks respectively, and one sides of the two trapezoidal blocks close to each other are in contact.

[0008] Further, a T-shaped annular hollow cylinder is slidably installed in the circular groove, the top end of the T-shaped annular hollow cylinder is in contact with the two trapezoidal blocks, the bottom end of the T-shaped annular hollow cylinder extends into the circular heating cylinder, a supporting spring is sleeved on the T-shaped annular hollow cylinder, the bottom end of the supporting spring is fixedly connected to the T-shaped annular hollow cylinder, the top end of the supporting spring is fixedly connected to the inner wall of the circular heating cylinder, and a U-shaped circular rod is slidably installed on the top of the circular heating cylinder, and the bottom end of the U-shaped circular rod extends into the circular heating cylinder and is fixedly connected to the T-shaped annular hollow cylinder.

[0009] Further, a stirring mechanism is arranged inside the circular heating cylinder. The stirring mechanism includes a perforated circular plate fixedly installed inside the circular heating cylinder. The bottom end of the reciprocating threaded rod is rotatably connected to the perforated circular plate. A plurality of rotating plates are fixedly installed on the outer wall of the reciprocating threaded rod. Two rotating grooves are respectively formed in the plurality of rotating plates. A rotating paddle is rotatably installed in each of the plurality of rotating grooves. A U-shaped mounting plate is fixedly installed on the top of the rectangular mounting plate. A hydraulic cylinder is fixedly installed on the inner wall of the top of the U-shaped mounting plate. The output shaft of the hydraulic cylinder is fixedly connected to the U-shaped fixing plate.

[0010] Further, a packaging mechanism is arranged on the circular heating cylinder. The packaging mechanism includes a packaging mold fixedly installed at the bottom of the circular heating cylinder. A semiconductor chip is fixedly installed on the top of the rectangular mounting plate. A circular through groove is formed in the top of the packaging mold. The circular through groove communicates with the circular heating cylinder.

[0011] Further, a limiting sliding groove is formed inside the packaging mold. The right end of the limiting sliding groove extends outside the packaging mold. A limiting spring is fixedly installed on the left inner wall of the limiting sliding groove. The right end of the limiting spring is fixedly installed with a hollow trapezoidal plate. The right side of the hollow trapezoidal plate extends outside the packaging mold. A strip-shaped stopper is fixedly installed on the bottom inner wall of the packaging mold. A strip-shaped limiting plate is slidably installed on the top of the rectangular mounting plate.

[0012] Further, a method for a packaging structure for semiconductor processing is as follows: S1: Preliminary drying; S2: Reducing air pressure; S3: Crushing materials; S4: Stirring and exhausting; S5: Completing packaging.

[0013] The present invention has the following beneficial effects: (1) For a packaging structure for semiconductor processing according to the present invention, when the driving motor is started, the driving motor drives the reciprocating threaded rod to rotate, the reciprocating threaded rod drives the strip-shaped plate to rotate, and the strip-shaped plate drives the granular plastic packaging material to rotate at a high speed within the conical circular plate. In cooperation with two hot air guns, the hot air guns blow hot air into the circular heating cylinder through the ventilation holes. During the rotation of the granular plastic packaging material, it rises along the inclined surface of the conical circular plate to the top. During the continuous drying process, part of the moisture in the granular plastic packaging material will be evaporated and carried away. At this time, the weight of the granular plastic packaging material with the moisture removed will decrease. Since the weights of the granular plastic packaging materials are different, the granular plastic packaging materials with lighter weights cannot move to the top of the conical circular plate under the action of centrifugal force. At this time, the granular plastic packaging materials on the inner wall of the conical circular plate will be evenly distributed, which can not only prevent the accumulation of plastic packaging materials but also improve the drying efficiency of the granular plastic packaging materials. (2) For a packaging structure for semiconductor processing according to the present invention, when placing the plastic packaging material to be injection-molded into the circular heating cylinder, it is necessary to pull the U-shaped round rod. The U-shaped round rod drives the T-shaped ring-shaped hollow cylinder to rise. At this time, the support spring undergoes a compressive deformation. The T-shaped ring-shaped hollow cylinder will push the two trapezoidal blocks away from each other. At this time, the two adaptive springs will synchronously undergo compressive deformations, and the plastic packaging material will enter the conical circular plate in the circular heating cylinder through the T-shaped ring-shaped hollow cylinder. As the moisture continuously turns into steam and rises, the air pressure in the circular heating cylinder will increase. The steam will push open the two trapezoidal blocks. At this time, the air pressure in the circular heating cylinder is effectively released, avoiding the situation that the steam enters the plastic packaging material again due to too high air pressure in the circular heating cylinder. (3) For a packaging structure for semiconductor processing according to the present invention, during the rotation of the reciprocating threaded rod, the reciprocating threaded rod drives the internally threaded plate to move up and down reciprocally. When the internally threaded plate descends, it drives the arc-shaped triangular plate to descend to a position slightly below the middle of the conical circular plate. The granular plastic packaging material that has discharged moisture in the conical circular plate will hit the arc-shaped triangular plate when being rotated and pushed by the strip-shaped plate. During the impact process, the granular plastic packaging material will be crushed. The crushed dry plastic packaging material fragments will fall onto the perforated circular plate through the leakage holes. Since the holes on the perforated circular plate are smaller than the leakage holes, the crushed plastic packaging materials will not pass through the perforated circular plate. The reciprocating threaded rod drives the rotating plate to rotate, and the rotating plate will stir the plastic packaging materials falling onto the perforated circular plate to make them fully contact the inner wall of the circular heating cylinder and be heated. The crushed plastic packaging materials will increase the contact area with the circular heating cylinder, making the plastic packaging material quickly become fluid and further improving the packaging efficiency. (4)For a packaging structure for semiconductor processing according to the present invention, when the plastic packaging material becomes fluid, during the rotation of the rotating plate, a number of rotating paddles will be driven to rotate. When the rotating paddles rotate in the fluid plastic packaging material, they will rotate on their own under the action of the resistance of the plastic packaging material. The self-rotation of the rotating paddles can further improve the stirring effect on the fluid plastic packaging material, quickly discharge the air in the fluid plastic packaging material, and avoid affecting the quality of the packaged product due to excessive air during the injection molding packaging process, reducing the mechanical strength of the product, affecting the appearance, or causing a decline in electrical performance. (5)For a packaging structure for semiconductor processing according to the present invention, after the fluid plastic packaging material is completely uniform, the fluid plastic packaging material will pass through the holes on the perforated circular plate to the bottom of the circular heating cylinder and flow to the top of the hollow trapezoidal plate through the circular through groove. At this time, the hydraulic cylinder is started, and the hydraulic cylinder drives the U-shaped fixing plate to descend. At this time, the U-shaped fixing plate will drive the circular heating cylinder and the packaging mold to descend, and the packaging mold will drive the hollow trapezoidal plate to descend. When the bottom of the packaging mold is about to contact the semiconductor chip, the hollow trapezoidal plate will contact the strip-shaped limiting plate. Under the action of the inclined surface of the hollow trapezoidal plate, the hollow trapezoidal plate will move towards the direction close to the limiting chute. At this time, the circular through groove will open, and the fluid plastic packaging material in the circular through groove will flow onto the semiconductor chip. At this time, the packaging mold will also contact the semiconductor chip, forming a sealed space. As the fluid plastic packaging material continuously descends onto the semiconductor chip, it will fill the entire packaging mold. At this time, the strip-shaped limiting plate is pushed to move so that the strip-shaped limiting plate leaves the hollow trapezoidal plate, and the hollow trapezoidal plate will reset under the elastic force of the limiting spring, separating the fluid plastic packaging material in the packaging mold from the fluid plastic packaging material in the circular through groove, and waiting for the fluid plastic packaging material to cool to complete the packaging.

[0014] Of course, when implementing any product of the present invention, it is not necessarily required to achieve all the above-mentioned advantages simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for describing the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0016] Figure 1 is the overall structural schematic diagram of the present invention; Figure 2 is the partial cross-sectional structural schematic diagram of the present invention; Figure 3 is for the present invention Figure 2 the enlarged structural schematic diagram of A in; Figure 4 Schematic cross-sectional view of the back part of the present invention; Figure 5 The present invention Figure 4 Enlarged schematic view of B in the present invention; Figure 6 The present invention Figure 4 Enlarged schematic view of C in the present invention; Figure 7 The present invention Figure 2 Enlarged schematic view of D in the present invention; Figure 8 Partial cross-sectional view of the encapsulation mold of the present invention; Fig. 9 Schematic diagram of the method steps of the present invention.

[0017] In the attached drawings, the list of components represented by each reference numeral is as follows: In the figure: 1, rectangular mounting plate; 2, cylinder; 3, telescopic spring; 4, L-shaped sliding rod; 401, fixed sleeve; 5, separation mechanism; 501, circular heating cylinder; 502, conical circular plate; 503, reciprocating threaded rod; 504, strip plate; 505, internal threaded plate; 506, arc-shaped triangular plate; 507, limiting sliding rod; 508, leakage hole; 509, U-shaped fixing plate; 510, driving motor; 511, annular fixing plate; 512, hot air gun; 513, hollow groove; 514, ventilation hole; 6, adaptive mechanism; 601, strip-shaped sliding groove; 602, circular groove; 603, adaptive spring; 604, trapezoidal block; 605, T-shaped annular hollow cylinder; 606, supporting spring; 607, U-shaped round rod; 7, stirring mechanism; 701, perforated round plate; 702, rotating plate; 703, rotating groove; 704, rotating paddle; 705, U-shaped mounting plate; 706, hydraulic cylinder; 8, encapsulation mechanism; 801, encapsulation mold; 802, semiconductor chip; 803, circular through groove; 804, limiting sliding groove; 805, limiting spring; 806, hollow trapezoidal plate; 807, strip-shaped stop block; 808, strip-shaped limiting plate. Detailed implementation manners

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] Please refer to Figure 1 - Fig. 9As shown in the figure, the present invention is a packaging structure for semiconductor processing, including a rectangular mounting plate 1. A plurality of cylinders 2 are fixedly installed on the top of the rectangular mounting plate 1. Telescopic springs 3 are respectively fixedly installed on the bottom inner walls of the plurality of cylinders 2. L-shaped sliding rods 4 are respectively fixedly installed on the tops of the plurality of telescopic springs 3. The tops of the plurality of L-shaped sliding rods 4 respectively extend outside the plurality of cylinders 2. A fixing sleeve 401 is fixedly installed at one end of the plurality of L-shaped sliding rods 4 close to each other. It also includes: A separating mechanism 5. The separating mechanism 5 includes a circular heating cylinder 501 fixedly installed in the fixing sleeve 401. A conical circular plate 502 is rotatably installed on the inner wall of the circular heating cylinder 501. A reciprocating threaded rod 503 is rotatably installed in the circular heating cylinder 501. The reciprocating threaded rod 503 penetrates through the conical circular plate 502. The top of the reciprocating threaded rod 503 extends outside the circular heating cylinder 501. A strip-shaped plate 504 is fixedly installed on the reciprocating threaded rod 503. An internally threaded plate 505 is sleeved on the reciprocating threaded rod 503. An arc-shaped triangular plate 506 is fixedly installed on the front of the internally threaded plate 505. Two limiting sliding rods 507 are fixedly installed on the top inner wall of the circular heating cylinder 501. Both of the two limiting sliding rods 507 penetrate through the internally threaded plate 505. A plurality of leakage holes 508 are formed in the conical circular plate 502. A U-shaped fixing plate 509 is fixedly installed on the top of the circular heating cylinder 501. A driving motor 510 is fixedly installed on the top inner wall of the U-shaped fixing plate 509. The output shaft of the driving motor 510 is fixedly connected to the reciprocating threaded rod 503.

[0020] As Figure 5 shown in the figure, an annular fixing plate 511 is fixedly sleeved on the circular heating cylinder 501. Two hot air guns 512 are fixedly installed on the outer wall of the annular fixing plate 511. Two hollow grooves 513 are formed in the annular fixing plate 511. One end of the two hollow grooves 513 close to each other extends into the circular heating cylinder 501. A plurality of ventilation holes 514 are formed in the inner wall of the circular heating cylinder 501.

[0021] The strip-shaped plate 504 will drive the granular plastic packaging material to rotate at a high speed in the conical circular plate 502. Cooperating with the two hot air guns 512, the hot air guns 512 will blow hot air into the circular heating cylinder 501 through the ventilation holes 514.

[0022] As Figure 6 shown in the figure, an adaptive mechanism 6 is arranged on the circular heating cylinder 501. The adaptive mechanism 6 includes a strip-shaped sliding groove 601 formed in the circular heating cylinder 501. A circular groove 602 is formed in the top of the circular heating cylinder 501. The bottom end of the circular groove 602 extends into the circular heating cylinder 501 and communicates with the strip-shaped sliding groove 601. Adaptive springs 603 are respectively fixedly installed on the left inner wall and the right inner wall of the strip-shaped sliding groove 601. Trapezoidal blocks 604 are respectively fixedly installed at one ends of the two adaptive springs 603 close to each other. One sides of the two trapezoidal blocks 604 close to each other are in contact.

[0023] As the moisture continuously turns into steam and rises, the air pressure inside the circular heating cylinder 501 will increase, and the steam will push open the two trapezoidal blocks 604. At this time, the air pressure inside the circular heating cylinder 501 is effectively released, preventing the air pressure inside the circular heating cylinder 501 from being too high and causing the steam to enter the plastic encapsulation material again.

[0024] As Figure 3 and Figure 6 As shown in the figure, a T-shaped annular hollow cylinder 605 is slidably installed in the circular groove 602. The top end of the T-shaped annular hollow cylinder 605 is in contact with the two trapezoidal blocks 604. The bottom end of the T-shaped annular hollow cylinder 605 extends into the circular heating cylinder 501. A support spring 606 is sleeved on the T-shaped annular hollow cylinder 605. The bottom end of the support spring 606 is fixedly connected to the T-shaped annular hollow cylinder 605, and the top end of the support spring 606 is fixedly connected to the inner wall of the circular heating cylinder 501. A U-shaped circular rod 607 is slidably installed at the top of the circular heating cylinder 501. The bottom end of the U-shaped circular rod 607 extends into the circular heating cylinder 501 and is fixedly connected to the T-shaped annular hollow cylinder 605.

[0025] When placing the plastic encapsulation material to be injection-molded into the circular heating cylinder 501, it is necessary to pull the U-shaped circular rod 607. The U-shaped circular rod 607 drives the T-shaped annular hollow cylinder 605 to rise. At this time, the support spring 606 undergoes a compressive deformation. The T-shaped annular hollow cylinder 605 will push the two trapezoidal blocks 604 away from each other. At this time, the two adaptation springs 603 will synchronously undergo a compressive deformation, and the plastic encapsulation material will enter the conical circular plate 502 inside the circular heating cylinder 501 through the T-shaped annular hollow cylinder 605.

[0026] As Figure 4 and Figure 7 As shown in the figure, a stirring mechanism 7 is arranged inside the circular heating cylinder 501. The stirring mechanism 7 includes a perforated circular plate 701 fixedly installed inside the circular heating cylinder 501. The bottom end of the reciprocating threaded rod 503 is rotatably connected to the perforated circular plate 701. A number of rotating plates 702 are fixedly installed on the outer wall of the reciprocating threaded rod 503. Two rotating grooves 703 are respectively formed on a number of rotating plates 702. A rotating paddle 704 is respectively rotatably installed in a number of rotating grooves 703. A U-shaped mounting plate 705 is fixedly installed at the top of the rectangular mounting plate 1. A hydraulic cylinder 706 is fixedly installed on the inner wall of the top of the U-shaped mounting plate 705. The output shaft of the hydraulic cylinder 706 is fixedly connected to the U-shaped fixing plate 509.

[0027] Since the holes on the perforated circular plate 701 are smaller than the leakage holes 508, the pulverized plastic encapsulation material will not pass through the perforated circular plate 701. The reciprocating threaded rod 503 will drive the rotating plates 702 to rotate, and the rotating plates 702 will stir the plastic encapsulation material falling on the perforated circular plate 701 to make it fully contact the inner wall of the circular heating cylinder 501 and be heated.

[0028] like Figure 4 and Figure 8 As shown, a packaging mechanism 8 is provided on the circular heating tube 501, and the packaging mechanism 8 includes a packaging mold 801 fixedly installed on the bottom of the circular heating tube 501, a semiconductor chip 802 is fixedly installed on the top of the rectangular mounting plate 1, and a circular through groove 803 is opened on the top of the packaging mold 801, and the circular through groove 803 is communicated with the circular heating tube 501.

[0029] When the plastic packaging material becomes fluid, the rotating plate 702 will drive several rotating paddles 704 to rotate during the rotation process. The rotating paddles 704 will rotate in the fluid plastic packaging material and rotate under the action of the resistance of the plastic packaging material. The rotation of the rotating paddles 704 can further improve the stirring effect on the fluid plastic packaging material, so that the air in the fluid plastic packaging material can be quickly discharged, avoiding excessive air in the injection molding process, which may affect the quality of the packaged product, reduce the mechanical strength of the product, affect the appearance or cause a decrease in electrical performance.

[0030] like Figure 4 and Figure 8 As shown, a limiting slot 804 is provided in the packaging mold 801, and the right end of the limiting slot 804 extends to the outside of the packaging mold 801. A limiting spring 805 is fixedly installed on the left inner wall of the limiting slot 804, and a hollow trapezoidal plate 806 is fixedly installed on the right end of the limiting spring 805. The right side of the hollow trapezoidal plate 806 extends to the outside of the packaging mold 801, and a strip stopper 807 is fixedly installed on the bottom inner wall of the packaging mold 801, and a strip limiting plate 808 is slidably installed on the top of the rectangular mounting plate 1.

[0031] When the bottom of the packaging mold 801 is about to contact the semiconductor chip 802, the hollow trapezoidal plate 806 will contact the strip limiting plate 808. Under the action of the inclined surface of the hollow trapezoidal plate 806, the hollow trapezoidal plate 806 will move toward the direction close to the limiting slide groove 804. At this time, the circular through groove 803 will open, and the fluid plastic packaging material in the circular through groove 803 will flow onto the semiconductor chip 802.

[0032] like Figure 1-Figure 9 A method for packaging a semiconductor processing structure is shown, and the method steps are as follows: S1: preliminary drying; S2: Reduce air pressure; S3: crushed material; S4: stirring and exhausting; S5: Packaging is completed.

[0033] When in use, start the drive motor 510. The drive motor 510 drives the reciprocating threaded rod 503 to rotate. The reciprocating threaded rod 503 drives the strip plate 504 to rotate. The strip plate 504 will drive the granular plastic packaging material to rotate at a high speed within the conical circular plate 502. In cooperation with two hot air guns 512, the hot air guns 512 will blow hot air into the circular heating cylinder 501 through the ventilation holes 514. During the rotation of the granular plastic packaging material, it will rise along the inclined surface of the conical circular plate 502 to the top. During the continuous drying process, part of the moisture in the granular plastic packaging material will be evaporated and carried away. At this time, the weight of the granular plastic packaging material with the moisture removed will decrease. Since the weights of the granular plastic packaging materials are different, the granular plastic packaging materials with lighter weights cannot move to the uppermost part of the conical circular plate 502 under the action of centrifugal force. At this time, the granular plastic packaging materials on the inner wall of the conical circular plate 502 will be evenly distributed, which can not only prevent the plastic packaging materials from accumulating, but also improve the drying efficiency of the granular plastic packaging materials; To place the plastic packaging material to be injection-molded into the circular heating cylinder 501, it is necessary to pull the U-shaped round rod 607. The U-shaped round rod 607 drives the T-shaped annular hollow cylinder 605 to rise. At this time, the support spring 606 undergoes compressive deformation. The T-shaped annular hollow cylinder 605 will push the two trapezoidal blocks 604 away from each other. At this time, the two adaptive springs 603 will synchronously undergo compressive deformation. The plastic packaging material enters the conical circular plate 502 in the circular heating cylinder 501 through the T-shaped annular hollow cylinder 605. As the moisture continuously turns into steam and rises, the air pressure in the circular heating cylinder 501 will increase. The steam will push open the two trapezoidal blocks 604. At this time, the air pressure in the circular heating cylinder 501 is effectively released, preventing the air pressure in the circular heating cylinder 501 from being too high and causing the steam to enter the plastic packaging material again; During the rotation of the reciprocating threaded rod 503, the reciprocating threaded rod 503 will drive the internal threaded plate 505 to reciprocate up and down. When the internal threaded plate 505 descends, it will drive the arc triangular plate 506 to descend to the middle and lower position of the conical circular plate 502. The granular plastic packaging material that has discharged moisture in the conical circular plate 502 will collide with the arc triangular plate 506 when it is pushed by the rotation of the strip plate 504. During the collision, the granular plastic packaging material will be crushed. The crushed dry plastic packaging material fragments will fall onto the perforated circular plate 701 through the leakage hole 508. Since the hole on the perforated circular plate 701 is smaller than the leakage hole 508, the crushed plastic packaging material will not pass through the perforated circular plate 701. The reciprocating threaded rod 503 will drive the rotating plate 702 to rotate, and the rotating plate 702 will stir and fall onto the perforated circular plate 701. The plastic packaging material on the circular heating tube 501 is fully in contact with the inner wall of the circular heating tube 501 for heating. The crushed plastic packaging material will increase the contact area with the circular heating tube 501, so that the plastic packaging material quickly becomes fluid, further improving the packaging efficiency. When the plastic packaging material becomes fluid, the rotating plate 702 will drive a number of rotating paddles 704 to rotate during the rotation process. The rotating paddles 704 rotate in the fluid plastic packaging material and rotate under the action of the resistance of the plastic packaging material. The rotation of the rotating paddles 704 can further improve the stirring effect on the fluid plastic packaging material, so that the air in the fluid plastic packaging material is quickly discharged, avoiding the excessive air in the injection molding process that affects the quality of the packaged product, reduces the mechanical strength of the product, affects the appearance or causes the electrical performance to decrease. After the flowable plastic encapsulation material is thoroughly and evenly distributed, the flowable plastic encapsulation material passes through the holes in the perforated circular plate 701 to the bottom of the circular heating cylinder 501 and flows to the top of the hollow trapezoidal plate 806 through the circular through groove 803. At this time, the hydraulic cylinder 706 is activated, and the hydraulic cylinder 706 drives the U-shaped fixing plate 509 to descend. At this time, the U-shaped fixing plate 509 drives the circular heating cylinder 501 and the encapsulation mold 801 to descend, and the encapsulation mold 801 drives the hollow trapezoidal plate 806 to descend. When the bottom of the encapsulation mold 801 is about to contact the semiconductor chip 802, the hollow trapezoidal plate 806 contacts the strip-shaped limiting plate 808. Under the action of the inclined surface of the hollow trapezoidal plate 806, the hollow trapezoidal plate 806 moves in the direction close to the limiting chute 804. At this time, the circular through groove 803 opens, and the flowable plastic encapsulation material in the circular through groove 803 flows onto the semiconductor chip 802. At this time, the encapsulation mold 801 also contacts the semiconductor chip 802 to form a sealed space. As the flowable plastic encapsulation material continuously descends onto the semiconductor chip 802, the flowable plastic encapsulation material fills the entire encapsulation mold 801. At this time, the strip-shaped limiting plate 808 is pushed to move so that the strip-shaped limiting plate 808 leaves the hollow trapezoidal plate 806, and the hollow trapezoidal plate 806 will reset under the elastic force of the limiting spring 805, separating the flowable plastic encapsulation material in the encapsulation mold 801 from the flowable plastic encapsulation material in the circular through groove 803. Wait for the flowable plastic encapsulation material to cool to complete the encapsulation.

[0034] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, according to the content of this specification, many modifications and changes can be made. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A packaging structure for semiconductor processing, comprising a rectangular mounting plate (1), a plurality of cylinders (2) being fixedly mounted on the top of the rectangular mounting plate (1), a plurality of telescopic springs (3) being fixedly mounted on the bottom inner walls of the plurality of cylinders (2), a plurality of L-shaped slide bars (4) being fixedly mounted on the tops of the plurality of telescopic springs (3), the top ends of the plurality of L-shaped slide bars (4) respectively extending outside the plurality of cylinders (2), a fixing sleeve (401) being fixedly mounted on the ends of the plurality of L-shaped slide bars (4) close to each other, characterized in that: It further includes: A separating mechanism (5), the separating mechanism (5) includes a circular heating cylinder (501) fixedly installed inside a fixed sleeve (401), a conical circular plate (502) is rotatably installed on the inner wall of the circular heating cylinder (501), a reciprocating threaded rod (503) is rotatably installed inside the circular heating cylinder (501), the reciprocating threaded rod (503) penetrates through the conical circular plate (502), the top end of the reciprocating threaded rod (503) extends outside the circular heating cylinder (501), a strip-shaped plate (504) is fixedly installed on the reciprocating threaded rod (503), an internally threaded plate (505) is threadedly sleeved on the reciprocating threaded rod (503), an arc-shaped triangular plate (506) is fixedly installed on the front surface of the internally threaded plate (505), two limiting slide rods (507) are fixedly installed on the top inner wall of the circular heating cylinder (501), both of the two limiting slide rods (507) penetrate through the internally threaded plate (505), a plurality of leakage holes (508) are formed in the conical circular plate (502), a U-shaped fixing plate (509) is fixedly installed on the top of the circular heating cylinder (501), a driving motor (510) is fixedly installed on the top inner wall of the U-shaped fixing plate (509), and an output shaft of the driving motor (510) is fixedly connected to the reciprocating threaded rod (503).

2. A semiconductor processing packaging structure according to claim 1, characterized in that: An annular fixing plate (511) is fixedly sleeved on the circular heating cylinder (501), two hot air guns (512) are fixedly installed on the outer wall of the annular fixing plate (511), two hollow grooves (513) are formed inside the annular fixing plate (511), one ends of the two hollow grooves (513) close to each other extend into the circular heating cylinder (501), and a plurality of ventilation holes (514) are formed in the inner wall of the circular heating cylinder (501).

3. A semiconductor processing packaging structure according to claim 2, characterized in that: An adaptive mechanism (6) is arranged on the circular heating cylinder (501), the adaptive mechanism (6) includes a strip-shaped sliding groove (601) formed inside the circular heating cylinder (501), a circular groove (602) is formed in the top of the circular heating cylinder (501), the bottom end of the circular groove (602) extends into the circular heating cylinder (501) and communicates with the strip-shaped sliding groove (601), a adapting spring (603) is fixedly installed on each of the left inner wall and the right inner wall of the strip-shaped sliding groove (601), a trapezoidal block (604) is fixedly installed at one end of each of the two adapting springs (603) close to each other, and one sides of the two trapezoidal blocks (604) close to each other are in contact.

4. A semiconductor processing packaging structure according to claim 3, characterized in that: A T-shaped annular hollow cylinder (605) is slidably installed in the circular groove (602). The top end of the T-shaped annular hollow cylinder (605) is in contact with two trapezoidal blocks (604). The bottom end of the T-shaped annular hollow cylinder (605) extends into the circular heating cylinder (501). A support spring (606) is sleeved on the T-shaped annular hollow cylinder (605). The bottom end of the support spring (606) is fixedly connected to the T-shaped annular hollow cylinder (605), and the top end of the support spring (606) is fixedly connected to the inner wall of the circular heating cylinder (501). A C-shaped round rod (607) is slidably installed at the top of the circular heating cylinder (501). The bottom end of the C-shaped round rod (607) extends into the circular heating cylinder (501) and is fixedly connected to the T-shaped annular hollow cylinder (605).

5. A semiconductor processing packaging structure according to claim 4, characterized in that: A stirring mechanism (7) is arranged in the circular heating cylinder (501). The stirring mechanism (7) includes a perforated circular plate (701) fixedly installed in the circular heating cylinder (501). The bottom end of the reciprocating threaded rod (503) is rotatably connected to the perforated circular plate (701). A plurality of rotating plates (702) are fixedly installed on the outer wall of the reciprocating threaded rod (503). Two rotating grooves (703) are respectively formed in the plurality of rotating plates (702). A rotating paddle (704) is rotatably installed in each of the plurality of rotating grooves (703). A C-shaped mounting plate (705) is fixedly installed at the top of the rectangular mounting plate (1). A hydraulic cylinder (706) is fixedly installed on the inner wall of the top of the C-shaped mounting plate (705). The output shaft of the hydraulic cylinder (706) is fixedly connected to the C-shaped fixing plate (509).

6. A semiconductor processing packaging structure according to claim 5, characterized in that: An encapsulation mechanism (8) is arranged on the circular heating cylinder (501). The encapsulation mechanism (8) includes an encapsulation mold (801) fixedly installed at the bottom of the circular heating cylinder (501). A semiconductor chip (802) is fixedly installed at the top of the rectangular mounting plate (1). A circular through groove (803) is formed at the top of the encapsulation mold (801). The circular through groove (803) communicates with the circular heating cylinder (501).

7. A semiconductor processing packaging structure according to claim 6, characterized in that: A limiting sliding groove (804) is formed in the encapsulation mold (801). The right end of the limiting sliding groove (804) extends outside the encapsulation mold (801). A limiting spring (805) is fixedly installed on the left inner wall of the limiting sliding groove (804). The right end of the limiting spring (805) is fixedly installed with a hollow trapezoidal plate (806). The right side of the hollow trapezoidal plate (806) extends outside the encapsulation mold (801). A strip-shaped stop block (807) is fixedly installed on the bottom inner wall of the encapsulation mold (801). A strip-shaped limiting plate (808) is slidably installed at the top of the rectangular mounting plate (1).

8. A method for using a semiconductor processing packaging structure, using the semiconductor processing packaging structure as claimed in claim 7, characterized in that: The method steps are as follows: S1: Preliminary drying; S2: Reducing air pressure; S3: Crushing materials; S4: Stirring and exhausting; S5: Completing encapsulation.

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