Wafer processing tool

Abstract

The invention discloses a wafer processing tool, relates to the technical field of wafer processing, and can avoid the phenomenon that an etching medium corrodes the back surface of a wafer in a wafer etching process. The wafer processing tool comprises a sucker which is adsorbed on the back surface of a wafer, and the back surface is arranged opposite to an etched surface; the flow baffle surrounds the circumferential side of the wafer in the thickness direction along the circumferential part of the wafer, and a gap is formed between the flow baffle and the circumferential side of the wafer; the blocking piece is connected to the suction cup, and the blocking piece is used for covering or wrapping the edge of the back face of the wafer and shielding the etching medium flowing to the back face of the wafer through the flow blocking plate.

Description

Technical Field

[0001] The present application relates to the field of wafer processing technology, and in particular to a wafer processing tool. Background Art

[0002] At present, the production process of micro-electro-mechanical system (MEMS) device chips involves various etching solutions to corrode or remove certain sacrificial layers, such as the patterning process of the silicon wafer surface. Wafer silicon wafers include single-sided wafers and double-sided wafers. The single-sided wafer has a fine-planed surface with a graphic structure, which is conducive to the patterning of the wafer. The double-sided wafer is a structure in which two silicon wafers are pressed together at high temperature. In the patterning of the silicon wafer surface, the required silicon dioxide needs to be formed on the silicon wafer surface, and then the wet single-chip etching is used to form the pattern.

[0003] However, in order to prevent the back of the wafer from being corroded by acid, the existing single-wafer etching machine will use nitrogen or deionized water for protection. This method is special for the double-planing process. The back of the double-planed wafer has a layer of silicon dioxide. When the etching liquid containing negative ions is used to etch the etched surface of the wafer, the etching medium splashes back to the baffle and exhaust air. The etching medium is acidic, and the acid or acid gas will be attached to the back of the wafer with the exhaust air and react with silicon dioxide. At the same time, the deionized water cleaning area of ​​the suction cup has a dark area, which makes it impossible to clean some areas on the back of the wafer, resulting in the corrosion of the silicon dioxide edge on the back of the wafer. Due to the increased roughness of the back of the wafer, it is difficult for the wafer to be adsorbed by the robot arm, which affects the subsequent process.

[0004] In summary, how to prevent the back of the wafer from being corroded during the etching process is an urgent problem to be solved. Summary of the invention

[0005] A wafer processing tool provided in an embodiment of the present application can prevent the etching medium from corroding the back side of the wafer during the wafer etching process.

[0006] According to a first aspect of an embodiment of the present application, there is provided a wafer processing tool, comprising:

[0007] A suction cup is attached to the back side of the wafer, and the back side is arranged opposite to the etched side;

[0008] A baffle plate surrounds the peripheral side of the wafer in the thickness direction along the peripheral portion of the wafer, and a gap is provided between the baffle plate and the peripheral side of the wafer;

[0009] The blocking member is connected to the suction cup and is used to cover or envelop the back edge of the wafer and block the etching medium flowing to the back of the wafer through the baffle plate.

[0010] In some embodiments, the connecting portion is connected to the suction cup;

[0011] The covering part is connected to the connecting part, and the covering part extends along the radial direction of the back side of the wafer. Part of the covering part covers or envelops the edge of the back side of the wafer, and part of the covering part is used to block the etching medium flowing to the back side of the wafer through the baffle.

[0012] In some embodiments, the connecting portion includes a plurality of clamping posts;

[0013] A plurality of slots are provided on the side wall surface of the suction cup;

[0014] The clamping column is used for clamping in the clamping slot.

[0015] In some embodiments, the spacing between the groove walls of the card groove decreases continuously in a direction from the suction cup away from the wafer.

[0016] In some embodiments, the plurality of clamping posts are arranged at equal angles along the circumferential direction of the suction cup.

[0017] In some embodiments, a portion of the wall surface of the blocking member close to the wafer is in the same plane as a plane of the suction cup close to the wafer.

[0018] In some embodiments, part of the covering portion is bent in a direction in which the suction cup is away from the wafer, and a gap exists between the covering portion and the baffle.

[0019] In some embodiments, the blocking member is integrally formed on the plane where the suction cup is located.

[0020] In some embodiments, it further comprises:

[0021] A support rod, one end of which is connected to the blocking member, and the other end of which is connected to the rotating shaft of the suction cup;

[0022] The rotating axis is perpendicular to a plane where the suction cup is away from the wafer.

[0023] In some embodiments, the plurality of support rods are arranged at equal angles along the circumference of the suction cup.

[0024] The beneficial effects of this application are:

[0025] The barrier covers or envelops the edge of the back side of the wafer, and the barrier can be attached to the back side of the wafer, so that the etching medium flowing down the side wall of the wafer is blocked by the barrier, so that the etching medium is difficult to flow to the back side of the wafer to corrode the back side of the wafer;

[0026] The blocking member protects the edge of the back side of the wafer and can also prevent splashing from the wall surface of the baffle plate to the back side of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1A schematic partial structural diagram of a wafer processing tool provided in an embodiment of the present application;

[0028] Figure 2 A schematic partial structural diagram of another wafer processing tool provided in an embodiment of the present application;

[0029] Figure 3 A schematic partial structural diagram of another wafer processing tool provided in an embodiment of the present application;

[0030] Figure 4 A schematic top view of a wafer processing tool provided in an embodiment of the present application;

[0031] Figure 5 A schematic top view of another wafer processing tooling provided in an embodiment of the present application;

[0032] Figure 6 A schematic partial structural diagram of a bent blocking member of a wafer processing tool provided in an embodiment of the present application;

[0033] Figure 7 A schematic partial exploded structural diagram of a suction cup and a blocking member of a wafer processing tool provided in an embodiment of the present application.

[0034] The reference numerals in the figure represent respectively:

[0035] 100, wafer; 200, suction cup; 201, card slot; 210, motor; 211, rotating shaft; 300, baffle; 400, blocking member; 410, connecting part; 411, card column; 420, covering part; 500, support rod; 600, robot arm; 700, ventilation duct. DETAILED DESCRIPTION

[0036] In order to better understand the technical solutions provided by the embodiments of this specification, the technical solutions of the embodiments of this specification are described in detail below through the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0037] In this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of more restrictions, the elements limited by the statement "comprise one..." do not exclude the existence of other identical elements in the process, method, article or equipment including the elements. The term "more than two" includes two or more than two situations.

[0038] At present, during the process of etching the etched surface of the wafer with an etching medium, the etching medium flows back to the back of the wafer due to factors such as liquid splashback, low wafer rotation speed or low pressure, thereby corroding part of the surface on the back of the wafer, affecting the uniformity of the back of the wafer and making it difficult for the robotic arm to adsorb the wafer.

[0039] In view of this, a wafer processing tool provided in an embodiment of the present application can avoid the phenomenon that the etching medium corrodes the back side of the wafer during the wafer etching process.

[0040] First, Figure 1 A schematic partial structural diagram of a wafer processing tool provided in an embodiment of the present application, see Figure 1 The present application provides a wafer processing tool, including: a robot arm 600, a suction cup 200, a baffle 300 and a blocking member 400. The suction cup 200 absorbs the wafer 100 and drives the wafer 100 to rotate. The suction cup 200 can also spray nitrogen or deionized water toward the back of the wafer. The robot arm 600 transmits the etching medium toward the etched surface of the wafer 100. The robot arm 600 reciprocates along the edge of the etched surface of the wafer 100 toward the center, so that the etching medium is evenly distributed on the etched surface of the wafer 100 through the rotation of the wafer 100. At this time, the wafer 100 is in a uniform speed or high rotation state. At the same time, there is also a situation where part of the etching medium is separated from the wafer 100, for example, the rotation of the wafer 100 causes part of the etching medium to be separated from the wafer 100. In some examples, part of the etching medium flows down from the peripheral side of the wafer 100, and then is blocked by the blocking member 400 that covers or envelops at least the back edge of the wafer 100. In some examples, part of the etching medium splashes back to the back side of the wafer through the baffle plate 300 on the peripheral side of the wafer 100, and then is blocked by the wall surface of the blocking member 400.

[0041] In some examples, the etching medium is in liquid form, for example, the etching medium may be an etching solution, the etching medium is acidic, and the acid or acid gas may be understood as the etching medium, which can cause corrosion to the wafer 100 .

[0042] like Figure 1 As shown, illustratively, the wafer 100 can be placed on the suction cup 200, and the side of the wafer 100 facing away from the suction cup 200 is the etched surface of the wafer 100. The suction cup 200 is attached to the back side of the wafer 100, that is, the wafer 100 includes an etched surface and a back side that are opposite to each other. The baffle 300 is located on the peripheral side of the wafer 100, and the baffle 300 at least partially surrounds the peripheral side of the wafer 100. The baffle 300 can resist the etching medium separated from the etched surface of the wafer 100, and there is a certain distance between the baffle 300 and the wafer 100, and the distance can avoid the situation where the wafer 100 is damaged due to direct contact between the baffle 300 and the wafer 100. The blocking member 400 is connected to the suction cup 200, and the blocking member 400 extends radially along the wafer 100. When the suction cup 200 is adsorbed on the back of the wafer, part of the blocking member 400 can fit on the back and edge of the wafer 100, thereby blocking the etching medium flowing along the circumferential wall of the wafer 100 to the back of the wafer, or blocking the etching medium from flowing from the etched surface of the wafer 100 to the back of the wafer through the baffle 300, resulting in corrosion of part of the back of the wafer. Therefore, the tooling of the present application can be suitable for the production and processing of single-surface and double-surface wafers 100.

[0043] It should be noted that the thickness of the baffle plate 300 should be greater than the thickness of the wafer 100 so as to play a role in blocking the etching medium.

[0044] Figure 2 A schematic partial structural diagram of another wafer processing tooling provided in an embodiment of the present application, for example, see Figure 2 The blocking member 400 has an inner wall surface and an outer wall surface. The inner wall surface of the blocking member 400 is attached to the side wall surface of the suction cup 200. The outer wall surface of the blocking member 400 is closer to the baffle plate 300 than the side wall surface of the wafer 100. The distance between the blocking member 400 and the baffle plate 300 is closer. The etching medium flowing to the back side of the wafer through the baffle plate 300 will be blocked by the wall surface of the blocking member 400 facing the wafer 100 and not covered by the wafer 100, or by the wall surface of the blocking member 400 facing away from the wafer 100. The inner diameter of the blocking member 400 can be the same as the diameter of the suction cup 200, and the outer diameter of the blocking member 400 is greater than or equal to the diameter of the wafer 100, so as to achieve the function of covering or enveloping the back edge of the wafer 100, for example Figure 2 The outer diameter of the middle stopper 400 is greater than the diameter of the wafer 100 .

[0045] In some examples, since the distance between the blocking member 400 and the baffle plate 300 is closer, the blocking member 400 is more likely to collect the etching medium flowing out of the baffle plate 300. Figure 2 In the example of FIG. 4 , the thickness of the blocking member 400 can be less than Figure 1 The thickness of the blocking member 400 in the example of .

[0046] Exemplarily, the center of the blocking member 400 and the center of the suction cup 200 are located at the same position to ensure the rotation stability of the blocking member 400 .

[0047] In some examples, one of the cross-sections of the outer wall surface of the blocking member 400 may be circular, the diameter of the circle is greater than or equal to the diameter of the wafer 100, or the cross-section is rectangular, the size of the short side of the rectangle is greater than or equal to the diameter of the wafer 100, or the cross-section is an irregular shape, and the orthographic projection of the blocking member 400 on the wafer 100 covers the edge of the wafer 100.

[0048] Figure 3 A schematic partial structural diagram of another wafer processing tooling provided in an embodiment of the present application, exemplarily, as shown in FIG. Figure 3 As shown, it also includes a support rod 500, one end of which is connected to the blocking member 400, for example, the support rod 500 is connected to the side of the blocking member 400 away from the wafer 100, and the other end of the support rod 500 is connected to the rotating shaft 211 of the suction cup 200.

[0049] The support rod 500 is used to assist in adjusting the position, flatness or other parameters of the blocking member 400. In some examples, the two ends of the support rod 500 may be respectively hingedly connected to the blocking member 400 and the rotating shaft 211, or in some examples, the two ends of the support rod 500 may be respectively detachably connected to the blocking member 400 and the rotating shaft 211, and the parameters of the blocking member 400 may be adjusted by adjusting the installation positions of the two ends of the support rod 500.

[0050] For example, Figure 3 As shown, the suction cup 200 is rotated by the motor 210, and the driving shaft of the motor 210 is also the rotation shaft 211 of the suction cup 200. One end of the rotation shaft 211 is fixed to the center position of the suction cup 200, or in order to realize other rotation forms of the wafer 100, the rotation shaft 211 can be fixed to other positions of the suction cup 200. The rotation shaft 211 is perpendicular to the suction cup 200, so as to ensure that the wafer 100 rotates in a horizontal plane.

[0051] For example, see Figure 1The robot arm 600 is disposed on the side of the suction cup 200 facing the wafer 100, and one end of the robot arm 600 is bent toward the suction cup 200. In some examples, the robot arm 600 is bent at a right angle, and one end of the robot arm 600 is perpendicular to the plane where the suction cup 200 is located, so as to face the suction cup 200 or the wafer 100, and the extension direction of the other end of the robot arm 600 is parallel to the radial direction of the suction cup 200. The robot arm 600 is hollow, and the etching medium can flow through the robot arm 600. At the same time, the robot arm 600 can adjust the position of the robot arm 600 corresponding to the wafer 100 by moving in a radial direction parallel to the suction cup 200.

[0052] In some examples, the wafer 100 is adsorbed on the suction cup 200, and the suction cup 200 controls the wafer 100 to rotate in the counterclockwise direction, and the position of the robot arm 600 is adjusted so that the robot arm 600 corresponds to the edge of the wafer 100 away from the suction cup 200. The robot arm 600 is controlled to move at a uniform speed along the radial direction parallel to the suction cup 200 to a position corresponding to the center of the wafer, and then returns to a position corresponding to the edge of the wafer 100, and the uniform speed transmission of the etching medium is controlled. After a certain period of time, the spraying of the etching medium is stopped, and then after a water washing and drying process, the processing and etching of the wafer 100 can be completed.

[0053] Figure 4 A schematic top view of a wafer processing tooling provided in an embodiment of the present application is shown in FIG. Figure 4 As shown, the top view of the blocking member 400 is in a circular ring shape, and the blocking member 400 can be transitionally matched with the suction cup 200. The blocking member 400 has a certain thickness to block the etching medium.

[0054] For example, see Figure 4 , the baffle 300 completely surrounds the circumference of the wafer 100, or Figure 5 A schematic top view of another wafer processing tooling provided in an embodiment of the present application is shown in FIG. Figure 5 The baffle plate 300 partially surrounds the circumference of the wafer 100 .

[0055] In some examples, one cross section of the baffle plate 300 is fan-shaped, the inner wall surface of the baffle plate 300 has an arc, and the etching medium flows toward the back side of the wafer through the inner wall surface of the baffle plate 300 .

[0056] For example, the number of the baffles 300 is multiple, see Figure 5 The baffle plates 300 are arranged circumferentially with reference to the suction cup 200 , and a plurality of baffle plates 300 are disposed at intervals.

[0057] Exemplarily, a dimension of the baffle plate 300 along the thickness direction of the wafer 100 is greater than the sum of the thicknesses of the wafer 100 and the suction cup 200 .

[0058] In some examples, the wafer 100 and the suction cup 200 correspond to the central position inside the baffle 300. It can be understood that the baffle 300 covers the side walls of the wafer 100 and the suction cup 200, and there is a gap between the baffle 300 and the side walls, so that the baffle 300 blocks part or all of the etching medium thrown out by the rotation of the wafer 100.

[0059] Exemplarily, the baffle 300 may be in various shapes, rather than being limited to a structure with a fan-shaped cross section.

[0060] In some examples, the cross-section of the baffle plate 300 may be a regular shape, such as a rectangle, or the cross-section of the baffle plate 300 may be an irregular shape.

[0061] Figure 6 A schematic partial structural diagram of a bent blocking member 400 of a wafer processing tooling provided in an embodiment of the present application, as shown in FIG. Figure 6 As shown, illustratively, a portion of the structure of the blocking member 400 is bent toward the wafer 100 , thereby covering the back edge of the wafer 100 .

[0062] Exemplarily, the blocking member 400 and the suction cup 200 are integrally formed.

[0063] In some examples, the integrally formed blocking member 400 and suction cup 200 can more easily ensure that the surface close to the wafer 100 is in the same horizontal plane. The blocking member 400 and the outer shell of the suction cup 200 can be cast by the same mold.

[0064] In some examples, at least one side of the blocking member 400 close to the suction cup 200 is integrally formed with the suction cup 200 , and the remaining structure of the blocking member 400 can be spliced ​​or snap-connected to the side of the blocking member 400 close to the suction cup 200 .

[0065] Exemplarily, the blocking member 400 is detachably connected to the suction cup 200 , for example, the blocking member 400 is snap-connected to the suction cup 200 .

[0066] Figure 7 A schematic partial exploded structural diagram of a suction cup 200 and a blocking member 400 of a wafer processing tooling provided in an embodiment of the present application, as shown in FIG. Figure 7 As shown, exemplarily, the blocking member 400 includes a connecting portion 410 and a covering portion 420, the connecting portion 410 is used to be connected to the suction cup 200, the covering portion 420 is arranged on a side of the connecting portion 410 away from the suction cup 200, the covering portion 420 is connected to the connecting portion 410, the covering portion 420 extends along the radial direction of the back side of the wafer and there is a gap between the covering portion 420 and the baffle 300, a portion of the covering portion 420 covers or envelops the back edge of the wafer 100, and the covering portion 420 can also cover a portion of the back side of the wafer 100, thereby blocking the etching medium flowing to the back side of the wafer.

[0067] In some examples, the connection portion 410 can extend along the thickness direction of the suction cup 200, thereby increasing the contact area between the connection portion 410 and the suction cup 200, making the connection structure between the blocking member 400 and the suction cup 200 more stable.

[0068] In some examples, the thickness of the connecting portion 410 is greater than the thickness of the covering portion 420, and the structure corresponding to the thickness difference can provide space for the installation of the clamp. Since the suction cup 200 is cylindrical, the blocking member 400 surrounds the suction cup 200, and the wall surface of the connecting portion 410 fits the wall surface of the suction cup 200, so the connecting portion 410 can be clamped on the suction cup 200 by the clamp. In some examples, in order to facilitate the clamping operation of the clamp, the connecting portion 410 is provided with a plurality of grooves along its thickness direction. During the process of reducing the enclosed length of the clamp, the clamp can squeeze the connecting portion 410, and the grooves provide space for reducing the size of the connecting portion 410, thereby facilitating the connecting portion 410 to fit the wall surface of the suction cup 200.

[0069] For example, see Figure 7 The connecting portion 410 includes a plurality of clamping columns 411 along the circumferential direction of the suction cup 200. The clamping columns 411 are arranged at intervals along the circumferential direction of the suction cup 200. A plurality of clamping grooves 201 are provided on the side wall surface of the suction cup 200. The shape and position of the clamping grooves 201 correspond to the shape and position of the clamping columns 411. Therefore, the clamping columns 411 can be clamped in the clamping grooves 201 to realize the detachable connection between the blocking member 400 and the suction cup 200.

[0070] Exemplarily, along the direction where the suction cup 200 moves away from the wafer 100 , the distance between the groove walls of the clamping groove 201 is continuously reduced, so that the clamping column 411 is squeezed by the groove wall, thereby enhancing the connection effect between the blocking member 400 and the suction cup 200 .

[0071] Exemplarily, a portion of the wall surface of the blocking member 400 close to the wafer 100 is in the same plane as a plane of the suction cup 200 close to the wafer 100 .

[0072] In some examples, since it is difficult for the etching medium to flow to the partial structure of the blocking member 400 close to the suction cup 200, such as the portion of the cover portion 420 close to the connecting portion 410, the partial structure may be hollowed out and not attached to the wafer 100. Accordingly, the partial structure of the blocking member 400 close to the edge of the back side of the wafer is attached to the wafer 100, and the partial structure is used to block the etching medium flowing from the peripheral side of the wafer 100 and the blocking member 400 to the back side of the wafer.

[0073] Exemplarily, a portion of the covering portion 420 is bent along the thickness direction of the suction cup 200 .

[0074] In some examples, the cover portion 420 may be bent in a direction from the suction cup 200 toward the wafer 100, thereby covering the back edge of the wafer 100. Alternatively, in some examples, the cover portion 420 may be bent in a direction from the suction cup 200 away from the wafer 100, thereby blocking the etching medium flowing toward the back of the wafer through the baffle 300. In some examples, the portion of the cover portion 420 close to the connecting portion 410 may be hollow.

[0075] It should be noted that the blocking member 400 is a replacement member, and the detachable connection between the blocking member 400 and the suction cup 200 is more conducive to practical use. Or in some cases, an anti-corrosion film layer can be applied on the side wall surface of the blocking member 400 and the wall surface away from the wafer 100 to improve the service life of the blocking member 400.

[0076] For example, see Figure 6 , also includes a ventilation duct 700, which is arranged above the robot arm 600, and the ventilation duct 700 is used to exhaust air to the wafer 100.

[0077] For example, the blocking member 400 and the support rod 500 may be made of a material having the characteristics of corrosion resistance, wear resistance, and light weight.

[0078] For example, since the blocking member 400 can prevent the etching medium from flowing to the back of the wafer, when the blocking member 400 entirely covers the back of the wafer, the suction cup 200 may not be provided with a spray port for spraying nitrogen or deionized water. When the blocking member 400 partially covers the back of the wafer, for example, the blocking member 400 has a hollow portion, the suction cup 200 may be provided with a spray port for spraying nitrogen or deionized water, which can further prevent the etching medium that the blocking member 400 fails to block from flowing to the back of the wafer and corroding the back of the wafer.

[0079] In summary, the present application covers or envelops the edge of the back side of the wafer by the blocking member 400, and the blocking member 400 can be attached to the back side of the wafer, so that the etching medium flowing down the side wall of the wafer 100 is difficult to flow to the back side of the wafer through the blocking member 400;

[0080] The blocking member 400 protects the edge of the back side of the wafer and can also prevent splashing from the wall surface of the baffle plate 300 to the back side of the wafer;

[0081] The blocking member 400 and the support rod 500 have the characteristics of corrosion resistance, wear resistance, and light material, so as to prevent the damage of the baffle plate and the support rod 500 by the etching medium, and ensure the life and reliability of the processing tooling;

[0082] At the same time, the turntable rotating device also takes into account the characteristic that it cannot cause corrosion to the back of the wafer at different rotation speeds, so that the application has the effects of high stability, strong controllability and good repeatability.

[0083] In the second aspect, the present application also proposes a single-chip microcomputer processing platform, including the wafer processing tooling in any of the above-mentioned technical solutions.

[0084] In some examples, the wafer processing tooling can adopt blocking and protection methods to prevent the etching medium on the wafer 100 from etching the back of the wafer, improve the uniformity of the back of the wafer, and prevent the etching medium from remaining on the back of the wafer during the etching process, which causes unnecessary corrosion to the back of the wafer device and affects the uniformity of the back. At the same time, the wafer processing tooling improves the structural integrity and processing reliability of the wafer device and increases the service life.

[0085] Exemplarily, the wafer processing tooling can be electrically connected to the control cabinet, and the moving position of the robot arm 600 and the spraying speed of the etching medium can be controlled through the working machine.

[0086] It should be noted that in the above embodiments, the description of each embodiment has its own emphasis, and for parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0087] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

[0088] Although the preferred embodiments of this specification have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of this specification.

[0089] Obviously, those skilled in the art can make various changes and modifications to this specification without departing from the spirit and scope of this specification. Thus, if these modifications and variations of this specification fall within the scope of the claims of this specification and their equivalents, this specification is also intended to include these modifications and variations.

Claims

1. A wafer processing tool, characterized in that: include: A suction cup is attached to the back side of the wafer, wherein the back side is arranged opposite to the etched side; a baffle plate, surrounding the peripheral side of the wafer in the thickness direction along the circumferential portion of the wafer, with a spacing between the baffle plate and the peripheral side of the wafer; A blocking member is connected to the suction cup, and is used to cover or envelop the back edge of the wafer and block the etching medium flowing to the back of the wafer through the baffle plate.

2. The wafer processing tooling according to claim 1, characterized in that: The blocking member comprises: A connecting portion connected to the suction cup; A covering portion is connected to the connecting portion, the covering portion extends along the radial direction of the back side of the wafer, a portion of the covering portion covers or envelops the edge of the back side of the wafer, and a portion of the covering portion is used to block the etching medium flowing to the back side of the wafer through the baffle.

3. The wafer processing tooling according to claim 2, characterized in that: The connecting portion includes a plurality of clamping posts; A plurality of slots are provided on the side wall surface of the suction cup; Wherein, the clamping column is used to be clamped in the clamping slot.

4. The wafer processing tooling according to claim 3, characterized in that: The spacing between the groove walls of the clamping groove decreases continuously in a direction in which the suction cup is away from the wafer.

5. The wafer processing tool according to claim 3, characterized in that: The plurality of clamping columns are arranged at equal angles along the circumferential direction of the suction cup.

6. The wafer processing tooling according to claim 2, characterized in that: A portion of the wall surface of the blocking member close to the wafer is in the same plane as a plane of the suction cup close to the wafer.

7. The wafer processing tooling according to claim 2, characterized in that: A portion of the covering portion is bent along a direction in which the suction cup is away from the wafer, and a gap exists between the covering portion and the baffle plate.

8. The wafer processing tool according to claim 1, characterized in that: The blocking member is integrally formed on the suction cup.

9. The wafer processing tool according to claim 1, characterized in that: Also includes: A support rod, one end of which is connected to the blocking member, and the other end of which is connected to the rotating shaft of the suction cup; Wherein, the rotating axis is perpendicular to the plane where the suction cup is located.

10. The wafer processing tool according to claim 9, characterized in that: The plurality of support rods are arranged at equal angles along the circumference of the suction cup.

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