Universal packaging jig and power module packaging method

Abstract

The invention relates to a universal packaging jig and a power module packaging method, and the jig comprises a plastic packaging mold which comprises a lower mold which is internally provided with a groove with an upward opening; the upper die is arranged at the upper end of the lower die; the first part is clamped in the groove; the second part is arranged at the upper end of the first part; wherein the inverted power module and the substrate abut against the upper end of the second part, the upper mold and the lower mold are assembled and clamp and fix the power module, the first part and the second part together, the plastic package shell at least packages the substrate, the electronic component and the second part, the second part separates a terminal installation space in the plastic package shell, and release materials are arranged at the contact positions of the first part and the plastic package shell and the contact positions of the second part and the plastic package shell. The first part is clamped in the groove of the lower die, the packaging jig is positioned, and the second part separates the terminal installation space in the plastic packaging shell, so that direct extrusion of a sealing material on the terminal and the cylinder body in the plastic packaging process is avoided, and the yield of the power module is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging structures, and in particular to a universal packaging jig and a power module packaging method. Background Art

[0002] like Figure 1 As shown, the power module is mainly composed of a metal base plate 3, a welding layer, a substrate 4, a chip 51, a binding wire 52 or a lead frame, a terminal and a plastic shell 6. When the power module is plastic-sealed, a first cylinder 81 is usually welded on the substrate 4 for the terminal to be inserted. After the substrate 4, the chip 51 and other electronic components, the first cylinder 81 and the like are plastic-sealed, the surface of the plastic-sealed module is ground, and finally the terminal is inserted into the first cylinder 81. The first cylinder 81 is usually made of copper. If the wall thickness of the first cylinder 81 is thin, it is easy to be squeezed by the sealing material during the plastic sealing process, resulting in deformation of the sleeve, making it difficult to insert the terminal into the first cylinder 81 later.

[0003] In addition, if the terminals are directly welded on the substrate 4, the mold needs to be kept away from the terminals during plastic packaging, which makes the process complicated and increases the cost of plastic packaging mold design.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] In view of the deficiencies of the prior art, the embodiments of the present invention disclose a universal packaging jig and a power module packaging method to solve the problem that when the power module is plastic-sealed, the first cylinder is easily squeezed and deformed by the sealing material, resulting in the inability to insert the terminal.

[0006] The technical solution adopted by the present invention is as follows:

[0007] A universal packaging jig is used for a power module, which includes a substrate, a plastic shell and electronic components welded on the substrate; the universal packaging jig includes: a plastic mold, including: a lower mold with a groove inside, the groove opening facing upward; an upper mold arranged at the upper end of the lower mold; a first part clamped in the groove; a second part arranged at the upper end of the first part; wherein, the power module is inverted, the substrate abuts the upper end of the second part, the upper mold and the lower mold are closed and the power module, the first part and the second part are clamped together, the plastic shell at least plasticizes the substrate, the electronic components and the second part, the second part separates a terminal installation space in the plastic shell, and a release material is provided at the contact portion between the first part and the second part and the plastic shell.

[0008] A further technical solution is that the first part is a plate body, the length and width of the plate body are the same as the groove, and a release film is arranged on the upper surface; the second part is a column, and a release film is arranged on the side.

[0009] A further technical solution is that after the universal packaging jig is removed, the first terminal is welded at the corresponding terminal installation space on the substrate, and the outer diameter of the terminal installation space is not less than the outer diameter of the welding surface required for the first terminal to be welded to the substrate.

[0010] Its further technical solution is that after the universal packaging jig is removed, the first cylinder is welded at the corresponding terminal installation space on the substrate, and the second terminal is inserted into the first cylinder. The outer diameter of the terminal installation space is not less than the outer diameter of the welding surface required for the first cylinder to be welded to the substrate.

[0011] A further technical solution is that a release film is arranged on the upper end of the column.

[0012] A further technical solution is that the plate body and the column body are integrally formed and made of steel.

[0013] The present invention also discloses a packaging method for a power module, comprising the following steps: placing a first part and a second part into a lower mold, with the first part being clamped in a groove of the lower mold; inverting the pre-packaged body and placing it into a plastic packaging mold, with the second part abutting against the surface of a substrate; closing the mold, injecting sealing material, and performing plastic packaging; taking out the plastic-sealed power module, removing a universal packaging jig, and separating a terminal installation space in the plastic packaging shell with the second part; and installing the terminal at a position corresponding to the terminal installation space on the substrate.

[0014] A further technical solution is that the step of installing the terminal at the terminal installation space on the substrate includes: welding the first terminal at the corresponding terminal installation space on the substrate.

[0015] A further technical solution is that the step of installing the terminal at the terminal installation space on the substrate includes: welding a first cylinder at a location corresponding to the terminal installation space on the substrate; and inserting the second terminal into the first cylinder.

[0016] A further technical solution is that after the step of installing the terminal at the terminal installation space on the substrate, it also includes: injecting sealing material into the first terminal or the side cavity of the first cylinder and curing it into shape.

[0017] The beneficial effects of the embodiments of the present invention are as follows:

[0018] (I) The universal packaging jig of the present invention includes a plastic packaging mold, a first part and a second part. The first part is clamped in the groove of the lower mold to position the packaging jig, and the second part abuts the surface of the substrate. After plastic packaging, the first part and the second part are removed, and the second part separates the terminal installation space in the plastic packaging shell, thereby avoiding the direct squeezing of the sealing material on the terminal and the cylinder during the plastic packaging process, thereby improving the power module yield rate. By setting the contact parts of the first part and the second part with the plastic packaging shell to use release material, the first part and the second part are easy to demold from the sealing material, and can be recycled.

[0019] In addition, the second part is used to separate the terminal installation space in the plastic package shell, and the terminal installation space can be suitable for direct welding terminals and plug-in terminals according to the size of different terminal installation spaces, and has good versatility.

[0020] (ii) The packaging method of the power module of the present invention is as follows: the first part is clamped in the groove of the lower mold to position the packaging jig, the second part abuts the surface of the substrate, the upper mold and the lower mold are clamped together to clamp the power module, the first part and the second part together, and after the plastic packaging, the first part and the second part are removed, the second part is used to separate the terminal installation space in the plastic packaging shell, and then the terminal is installed at the corresponding terminal installation space on the substrate, thereby avoiding the direct squeezing of the sealing material on the terminal and the cylinder during the plastic packaging process. The plastic packaging operation is convenient, the steps are simple, and the power module production efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of a power module in the prior art.

[0022] Figure 2 It is a schematic structural diagram of the universal packaging jig and power module of the present invention.

[0023] Figure 3 It is a schematic diagram of the structure of welding the first terminal on the power module substrate after plastic packaging.

[0024] Figure 4 It is a structural schematic diagram of welding the first cylinder on the power module substrate after plastic packaging.

[0025] Figure 5 The figure is a flow chart of the power module packaging method of the present invention.

[0026] In the figure:

[0027] 1. First part; 2. Second part; 3. Metal base plate; 4. Substrate; 5. Electronic components; 51. Chip; 52. Binding wire; 6. Plastic package; 61. Cavity; 7. First terminal; 71. Connecting part; 81. First cylinder; 82. Second terminal; 83. Outer edge; 91. Upper mold; 92. Lower mold; 921. Groove. DETAILED DESCRIPTION

[0028] The specific implementation of the present invention is described below in conjunction with the accompanying drawings.

[0029] In order to make the purpose, technical scheme and advantages of the present invention clearer, the device proposed by the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the accompanying drawings adopt a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size, etc. illustrated by the accompanying drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that the present invention can produce and the purpose that can be achieved, should still fall within the scope of the technical content disclosed by the present invention.

[0030] First embodiment:

[0031] This embodiment discloses a universal packaging jig.

[0032] like Figure 2 As shown, the universal packaging jig is used for a power module, which includes a substrate 4, a plastic shell 6, and an electronic component 5 welded on the substrate 4. Exemplarily, the power module includes a metal base plate 3, a substrate 4, a plastic shell 6, and an electronic component 5 welded on the substrate 4. The metal base plate 3 is welded to the lower end of the substrate 4. The electronic component 5 includes a chip 51 and a bonding wire 52, the chip 51 is welded to the copper layer on the surface of the substrate 4, and the bonding wire 52 electrically connects the electrode of the chip 51 to the copper layer on the surface of the substrate 4.

[0033] like Figure 2 As shown, the universal packaging jig includes a plastic packaging mold, a first part 1 and a second part 2.

[0034] The plastic encapsulation mold includes an upper mold 91 and a lower mold 92. The lower mold 92 has a groove 921 inside, and the groove 921 opens upward. The upper mold 91 is arranged at the upper end of the lower mold 92. Exemplarily, the groove 921 is a rectangular parallelepiped.

[0035] The first part 1 is clamped in the groove 921. Exemplarily, the first part 1 is a plate body, and the length and width of the plate body are the same as those of the groove 921, so that the plate body is just clamped into the bottom of the groove 921, and the plate body is positioned, and the plate body and the substrate 4 are on the same axis to ensure that the packaging jig can accurately separate the terminal installation space.

[0036] The second part 2 is disposed at the upper end of the first part 1. Exemplarily, the second part 2 is a column. Of course, in other embodiments of the present invention, the second part 2 may also be in the shape of a polygonal column, a cylinder, etc., as long as it can separate the terminal installation space in the plastic package 6, and the present invention does not impose further restrictions on this. The plate body and the column are integrally formed and made of steel.

[0037] like Figure 2 As shown, the power module is inverted, the substrate 4 abuts against the upper end of the second part 2, the upper mold 91 and the lower mold 92 are molded together to clamp the power module, the first part 1 and the second part 2 together. The plastic package 6 encapsulates the substrate 4, the electronic components 5 and the second part 2, and the second part 2 is separated from the terminal installation space in the plastic package 6. Release material is set at the contact part between the first part 1 and the second part 2 and the plastic package 6.

[0038] like Figure 3 As shown, for example, after removing the universal packaging jig, the first terminal 7 is welded at the corresponding terminal installation space on the substrate 4, and the outer diameter of the terminal installation space is not less than the outer diameter of the welding surface required for the first terminal 7 to be welded to the substrate 4. The first terminal 7 is a direct welding terminal, and the lower end of the terminal has a connection portion 71 for welding. Figure 4 As shown, after removing the universal packaging jig, the first barrel 81 is welded at the corresponding terminal installation space on the substrate 4, and the second terminal 82 is inserted into the first barrel 81. The outer diameter of the terminal installation space is not less than the outer diameter of the welding surface required for the first barrel 81 to be welded to the substrate 4. The second terminal 82 is a plug-in terminal, such as a fisheye pin. The first barrel 81 is made of copper and has multiple copper layers welded to the surface of the substrate 4. The upper and lower ends of the outer side of the first barrel 81 have outer edges 83. The outer edge 83 at the lower end improves the welding strength between the first barrel 81 and the substrate 4, and the outer edge 83 at the upper end facilitates the placement and removal of the first barrel 81 when mounting.

[0039] like Figure 2 As shown, the plate body is at the lower end of the plastic package shell 6, and only a release film is required on the upper surface. The plastic package shell 6 plastic packages the column, and a release film is provided on the side of the column. Preferably, a release film is provided on the upper end of the column to protect the contact surface between the column and the substrate 4, so as to facilitate demoulding of the plastic package mold.

[0040] In this embodiment, the first part 1 is clamped in the groove 921 of the lower mold 92, the packaging jig is positioned, the second part 2 abuts the surface of the substrate 4, and after the plastic packaging, the first part 1 and the second part 2 are removed, and the second part 2 is separated from the terminal installation space in the plastic packaging shell 6, thereby avoiding the direct squeezing of the sealing material on the terminal and the barrel during the plastic packaging process, thereby improving the power module yield rate. By setting the contact parts of the first part 1 and the second part 2 with the plastic packaging shell 6 to use release material, it is convenient for the first part 1 and the second part 2 to be demolded from the sealing material, and can be recycled.

[0041] In addition, the second portion 2 is used to separate a terminal installation space in the plastic package 6. Depending on the size of the terminal installation space, it can be suitable for direct welding terminals and plug-in terminals, and has good versatility.

[0042] Second embodiment:

[0043] like Figure 5 As shown, this embodiment discloses a packaging method for a power module, comprising the following steps:

[0044] Step S1 , placing the first part 1 and the second part 2 into the lower mold 92 , and the first part 1 is locked in the groove 921 of the lower mold 92 .

[0045] Specifically, the plate body is inserted into the bottom of the groove 921 , and the plate body is coaxial with the lower mold 92 .

[0046] Step S2 , inverting the pre-packaged body and placing it into a plastic packaging mold, with the second portion 2 abutting against the surface of the substrate 4 .

[0047] Specifically, the pre-packaged body is the same as the power module in that it only lacks the plastic package 6. The substrate 4 of the pre-packaged body is coaxial with the board body to ensure that the packaging jig can accurately separate the terminal installation space.

[0048] Step S3, closing the mold, injecting sealing material, and plastic sealing.

[0049] Specifically, the lower mold 92 and the upper mold 91 are clamped to generate extrusion pressure between the second part 2 and the surface of the substrate 4. The sealing material is heated and melted, and injected into the groove 921 in a low viscosity state. The injection pressure is always maintained during the curing process of the sealing material, but the extrusion pressure between the second part 2 and the surface of the substrate 4 is greater than the injection pressure to ensure that the sealing material does not flow between them until the sealing material is cured to form the plastic package 6.

[0050] Step S4 , taking out the plastic-encapsulated power module, removing the universal encapsulation jig, and separating the terminal installation space in the plastic encapsulation shell 6 by the second part 2 .

[0051] Specifically, since the first part 1 and the second part 2 are integrally formed and the contacting portion with the plastic package shell 6 is made of release material, the first part 1 and the second part 2 can be demoulded from the plastic package shell 6 relatively easily.

[0052] Step S5 , installing terminals on the substrate 4 at locations corresponding to the terminal installation spaces.

[0053] Specifically, the first terminal 7 is welded at the corresponding terminal installation space on the substrate 4 . Alternatively, the first cylinder 81 is welded at the corresponding terminal installation space on the substrate 4 , and then the second terminal 82 is inserted into the first cylinder 81 .

[0054] Step S6, injecting sealing material into the first terminal 7 or the side cavity 61 of the first cylinder 81 and curing and forming.

[0055] Specifically, since the outer diameter of the terminal installation space is not less than the outer diameter of the welding surface required for welding the first terminal 7 or the first barrel 81 to the substrate 4, after welding, there is a cavity 61 between the side of the first terminal 7 and the side of the first barrel 81 and the plastic package 6, and it is necessary to inject sealing material into the cavity 61 and solidify it to plastic-seal the first terminal 7 and the first barrel 81. Since the injection amount is small, the side of the first barrel 81 will not be squeezed, and the terminal can be smoothly inserted.

[0056] In this embodiment, the first part 1 is clamped in the groove 921 of the lower mold 92 to position the packaging jig, and the second part 2 abuts the surface of the substrate 4. The upper mold 91 and the lower mold 92 are clamped together to clamp the power module, the first part 1 and the second part 2 together. After the plastic packaging, the first part 1 and the second part 2 are removed, and the second part 2 is separated into a terminal installation space in the plastic packaging shell 6, and then the terminal is installed on the substrate 4 at the corresponding terminal installation space, thereby avoiding the direct squeezing of the sealing material on the terminal and the cylinder during the plastic packaging process. The plastic packaging operation is convenient, the steps are simple, and the power module production efficiency is high.

[0057] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. Universal packaging jig, characterized in that: Used in a power module, the power module comprising a substrate (4), a plastic package (6), and electronic components (5) welded on the substrate (4); The universal packaging tool comprises: Plastic packaging mold, including: A lower mold (92) having a groove (921) inside, wherein the groove (921) opens upward; An upper mold (91) is arranged on the upper end of the lower mold (92); A first portion (1) is locked in the groove (921); A second part (2) is arranged on an upper end of the first part (1); The power module is inverted, the substrate (4) abuts against the upper end of the second part (2), the upper mold (91) and the lower mold (92) are molded together to clamp the power module, the first part (1) and the second part (2) together, the plastic package (6) at least seals the substrate (4), the electronic components (5) and the second part (2), the second part (2) is separated from the terminal installation space in the plastic package (6), and a release material is provided at the contact portion between the first part (1) and the second part (2) and the plastic package (6).

2. The universal packaging jig according to claim 1, characterized in that: The first part (1) is a plate body, the length and width of the plate body are the same as the groove (921), and a release film is arranged on the upper surface; the second part (2) is a column, and a release film is arranged on the side.

3. The universal packaging jig according to claim 2, characterized in that: If the first terminal (7) is welded to the corresponding terminal installation space on the substrate (4) after the universal packaging jig is removed, the outer diameter of the terminal installation space is not less than the outer diameter of the welding surface required for welding the first terminal (7) to the substrate (4).

4. The universal packaging jig according to claim 2, characterized in that: After the universal packaging jig is removed, the first cylinder (81) is welded to the corresponding terminal installation space on the substrate (4), and the second terminal (82) is inserted into the first cylinder (81), and the outer diameter of the terminal installation space is not less than the outer diameter of the welding surface required for the first cylinder (81) to be welded to the substrate (4).

5. The universal packaging jig according to claim 2, characterized in that: A release film is arranged on the upper end of the column.

6. The universal packaging jig according to claim 2, characterized in that: The plate body and the column body are integrally formed and made of steel.

7. A method for packaging a power module, characterized in that: The following steps are involved: Place the first part (1) and the second part (2) into the lower mold (92), with the first part (1) being clamped in the groove (921) of the lower mold (92); The pre-packaged body is inverted and placed into a plastic encapsulation mold, with the second portion (2) abutting against the surface of the substrate (4); Close the mold, inject sealing material, and plastic seal the mold; Take out the plastic-encapsulated power module, remove the universal encapsulation jig, and separate the terminal installation space in the plastic encapsulation shell (6) by the second part (2); The terminals are installed at the corresponding terminal installation spaces on the substrate (4).

8. The method for packaging a power module according to claim 7, characterized in that: The step of installing the terminal at the terminal installation space on the substrate (4) comprises: A first terminal (7) is welded on the substrate (4) at a location corresponding to the terminal installation space.

9. The method for packaging a power module according to claim 7, characterized in that: The step of installing the terminal at the terminal installation space on the substrate (4) comprises: Welding a first cylinder (81) on the substrate (4) at a location corresponding to the terminal installation space; The second terminal (82) is inserted into the first cylinder (81).

10. The packaging method of a power module according to claim 8 or 9, characterized in that: After the step of installing the terminal at the terminal installation space on the substrate (4), the method further includes: A sealing material is injected into the side cavity (61) of the first terminal (7) or the first cylinder (81) and cured to form the sealing material.

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