Surface mounting machine and surface mounting method

Abstract

The mounting work includes a plurality of mounting work units (U (1), U (2), U (3), and U (4)), and the plurality of mounting work units (U (1), U (2), U (3), and U (4)) mount a bare chip (Wp) on a substrate (B) from wafers (W1, W2, W3, and W4) of different types. In each of a plurality of mounting work units (U (1), U (2), U (3), and U (4)), suction nozzles (N1, N2) of a type corresponding to wafers (W1, W2, W3, W4) supplied to a wafer supply position (32) are attached to a mounting head (421). A plurality of mounting work units (U (4), U (3), U (2), U (1)) for a substrate (B (2)) are executed in an execution order corresponding to a final tool state (wafer (W4) and suction nozzle (N2)), which is a tool state at the time when the mounting work for the substrate (B (1)) is completed.

Description

Technical Field

[0001] The present invention relates to a surface mounting technology for mounting a bare chip sucked from a wafer composed of a plurality of bare chips by a suction nozzle on a substrate. Background Art

[0002] Patent document 1 discloses a component mounting machine for mounting components having a package such as a QFP (Quad Flat Package) on a substrate. In the component mounting machine, a suction nozzle detachably mounted on an assembly head is used for mounting components. In particular, the order in which components are mounted on a substrate is controlled in order to reduce the number of times the suction nozzle is replaced.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2004-111998 Summary of the invention

[0006] Problems to be solved by the invention

[0007] However, in a surface mounter, a plurality of mounted substrates are produced by repeatedly carrying out the operation of carrying a substrate into an installation operation position, the operation of installing components on the substrate at the installation operation position, and the operation of carrying the substrate out of the installation operation position after the installation operation is completed. In addition, in a surface mounter that mounts a bare chip sucked from a wafer consisting of a plurality of bare chips by a suction nozzle on a substrate, during the installation operation, the wafer is appropriately replaced according to the progress of the installation of the bare chip on the substrate, thereby mounting a plurality of types of bare chips on the substrate. Therefore, the state of a tool such as a suction nozzle or a wafer may be different at the beginning and the end of substrate production. Therefore, when substrate production for one substrate is completed and substrate production for the next substrate is started, it is necessary to restore the tool state from the state when substrate production is completed to the state at the beginning, and from the perspective of improving production efficiency, there is room for improvement.

[0008] The present invention is completed in view of the above-mentioned problems, and its purpose is to suppress the situation in which production efficiency is reduced due to the time required to restore the tool state in order to change the target substrate for substrate production in order to perform substrate carrying-in operation, bare chip mounting operation and substrate unloading operation.

[0009] Technical solutions to solve problems

[0010] The surface mounter involved in the present invention comprises: a wafer storage unit for storing multiple wafers; a wafer supply unit for supplying wafers from the wafer storage unit to a wafer supply position; a substrate conveying unit for carrying a target substrate to a specified installation operation position; a mounting unit for mounting a bare chip constituting the wafer supplied to the wafer supply position on a target substrate at the installation operation position using a suction nozzle assembled in a loadable and detachable manner; and a control unit for controlling the execution of substrate production, wherein the substrate production includes: a carrying-in operation, in which the target substrate is carried into the installation operation position using the substrate conveying unit; an installation operation, in which the bare chip is mounted on the target substrate at the installation operation position using the installation unit; and a carrying-out operation, in which the target substrate after the installation operation is completed is carried out from the installation operation position, wherein the installation operation includes multiple installation operation units, multiple installation operations The unit mounts bare chips on the target substrate from wafers of different types, and the wafer supply unit changes the type of wafer supplied to the wafer supply position according to the execution of multiple installation operation units. In each of the multiple installation operation units, a suction nozzle of a type corresponding to the wafer supplied to the wafer supply position in order to execute the installation operation unit is assembled on the mounting unit. After completing the substrate production with the first substrate as the target substrate and then starting the substrate production with the second substrate as the target substrate, the control unit executes the multiple installation operation units for the second substrate in an execution order corresponding to the final tool state, and the final tool state indicates at least one of the type of wafer located at the wafer supply position at the time point when the installation operation for the first substrate is completed and the type of suction nozzle assembled on the mounting unit.

[0011] The surface mounting method involved in the present invention comprises: a process of moving a first substrate into an installation operation position; a process of performing an installation operation on the first substrate as an object substrate; a process of moving the first substrate after the installation operation is completed out of the installation operation position; a process of moving a second substrate into the installation operation position; a process of performing an installation operation on the second substrate as an object substrate; and a process of moving the second substrate after the installation operation is completed out of the installation operation position. During the installation operation, a bare chip constituting a wafer supplied from a wafer storage portion for storing a plurality of wafers to a wafer supply position is mounted on the object substrate at the installation operation position by using a suction nozzle mounted on the mounting portion in a detachable manner. The installation operation package The invention comprises a plurality of installation operation units, wherein the plurality of installation operation units install bare chips on a target substrate from wafers of different types, wherein the type of wafer supplied to a wafer supply position changes according to the execution of the plurality of installation operation units, and in each of the plurality of installation operation units, a suction nozzle of a type corresponding to the wafer supplied to the wafer supply position for executing the installation operation unit is assembled on a mounting portion, and the plurality of installation operation units for a second substrate are executed in an execution order corresponding to a final tool state, wherein the final tool state indicates at least one of the type of wafer located at the wafer supply position and the type of suction nozzle assembled on the mounting portion at a time point when the installation operation for the first substrate is completed.

[0012] In the present invention (surface mounter and surface mount method) thus constructed, a moving-in operation of moving the object substrate into the installation operation position, a mounting operation of mounting a bare chip on the object substrate at the installation operation position, and a moving-out operation of moving the object substrate that has completed the mounting operation from the installation operation position (substrate production) are performed on the object substrate. In addition, the mounting operation includes a plurality of mounting operation units, and the plurality of mounting operation units mount bare chips on the object substrate from wafers of different types. Correspondingly, the type of wafers supplied to the wafer supply position changes according to the execution of the plurality of mounting operation units. In addition, in each of the plurality of mounting operation units, a suction nozzle of a type corresponding to the wafer supplied to the wafer supply position in order to execute the mounting operation unit is assembled to the mounting portion. Therefore, the tool state such as the type of wafer supplied to the wafer supply position or the type of suction nozzle assembled to the mounting portion may be different at the beginning and completion of the mounting operation for the first substrate. Therefore, if a plurality of installation work units in the installation work for the first substrate and a plurality of installation work units in the installation work for the second substrate following the first substrate are executed in the same order, it may be necessary to restore the tool state when the installation work for the first substrate is completed. In contrast, in the present invention, a plurality of installation work units for the second substrate are executed in an execution order corresponding to the final tool state, which is the tool state at the time point when the installation work for the first substrate is completed. Thus, it is possible to suppress a decrease in production efficiency due to the time required to restore the tool state in order to change the target substrate of substrate production from the first substrate to the second substrate.

[0013] Furthermore, the final tool state may represent a combination of the type of wafer located at the wafer supply position and the type of suction nozzle mounted on the mounting portion at a time point when the mounting work on the first substrate is completed.

[0014] In addition, the surface mounter can also be configured such that the control unit executes a plurality of installation operation units for the first substrate in a predetermined first order, and executes a plurality of installation operation units for the second substrate in a second order opposite to the first order, thereby starting the plurality of installation operation units for the second substrate from the installation operation unit whose combination of the type of the wafer located at the wafer supply position and the type of the suction nozzle mounted on the mounting unit is consistent with the combination represented by the final tool state. In this structure, when the installation operation for the first substrate is completed, it is not necessary to restore the tool state in order to start the installation operation for the second substrate. Therefore, it is possible to suppress the situation in which the production efficiency is reduced due to the time required to restore the tool state in order to change the target substrate of substrate production from the first substrate to the second substrate.

[0015] In addition, the surface mounter can also be configured such that the control unit performs a search process for a corresponding mounting operation unit that satisfies a predetermined first search condition between the final tool state and the plurality of mounting operation units for the second substrate, and starts the plurality of mounting operation units for the second substrate from the corresponding mounting operation unit. By controlling the execution order of the plurality of mounting operation units for the second substrate based on the result of such a search process, it is possible to suppress a decrease in production efficiency due to the time required to restore the tool state in order to change the target substrate of substrate production from the first substrate to the second substrate.

[0016] In addition, the surface mounter can also be configured such that the first search condition is a condition that the combination of the type of wafer located at the wafer supply position and the type of nozzle mounted on the mounting portion for executing the corresponding mounting operation unit is consistent with the combination represented by the final tool state. In this structure, when the mounting operation for the first substrate is completed, it is not necessary to restore the tool state in order to start the mounting operation for the second substrate. Therefore, it is possible to suppress the situation where the production efficiency is reduced due to the time required to restore the tool state in order to change the target substrate of substrate production from the first substrate to the second substrate.

[0017] In addition, various specific search orders are conceivable when searching for an installation work unit that satisfies the search condition from among a plurality of installation work units.

[0018] For example, the surface mounter can also be configured to further include a storage unit, which stores a first order representing the order of multiple installation work units. The retrieval process retrieves the installation work unit that satisfies the first retrieval condition from the multiple installation work units in the first order, thereby retrieving the corresponding installation work unit. In the substrate production for the second substrate, the control unit, in the first order, executes from the first installation work unit of the multiple installation work units to the installation work unit that is one before the corresponding installation work unit after executing from the corresponding installation work unit to the last installation work unit of the multiple installation work units.

[0019] Alternatively, the surface mounter may also be configured to further include a storage unit that stores a first order representing the order of multiple installation work units, and the retrieval process retrieves the installation work unit that satisfies the first retrieval condition from the multiple installation work units in a second order opposite to the first order, thereby retrieving the corresponding installation work unit, and the control unit, in the substrate production for the second substrate, executes from the first installation work unit of the multiple installation work units to the installation work unit that is one before the corresponding installation work unit in the second order after executing from the corresponding installation work unit to the last installation work unit of the multiple installation work units.

[0020] In addition, the surface mounter can also be configured to have a plurality of suction nozzles installed on the mounting portion so as to be freely mounted and removable. In the search process, when there is no corresponding installation operation unit satisfying the first search condition, a corresponding installation operation unit satisfying the following second search condition is searched from the plurality of installation operation units for the second substrate: the number of suction nozzles that need to be replaced in order to change the type of each of the plurality of suction nozzles represented by the final tool state to the type of each of the plurality of suction nozzles that should be assembled on the mounting portion in order to execute the corresponding installation operation unit is the minimum. In this structure, the time required to restore the state of the suction nozzle in order to start the installation operation for the second substrate when the installation operation for the first substrate is completed can be suppressed. As a result, the reduction in production efficiency due to the time required to restore the tool state in order to change the target substrate of substrate production from the first substrate to the second substrate can be suppressed.

[0021] In addition, the surface mounter can also be configured such that the substrate production includes: a pre-inspection, which is to check the state of the target substrate carried into the installation operation position by the carrying-in operation before the installation operation; and a post-inspection, which is to check the state of the target substrate that has completed the installation operation before the carrying-out operation, and the control unit performs the pre-inspection before the installation operation and the post-inspection after the installation operation in both the substrate production for the first substrate and the substrate production for the second substrate. In this structure, the pre-inspection and post-inspection of the substrate can be performed at appropriate timing.

[0022] In addition, the surface mounter can also be configured to further include a component supply unit for supplying components to the component supply position, the mounting operation unit includes a bare chip mounting period for mounting a bare chip from a wafer to a target substrate and a component mounting period for mounting a component from the component supply position to a target substrate, the type of suction nozzles mounted on the mounting unit is common during the bare chip mounting period and the component mounting period belonging to the same mounting operation unit, and the wafer supply unit performs replacement of the wafer supplied to the wafer supply position in parallel with the component mounting period. In this structure, the component mounting period can be effectively used to change the type of wafer, thereby achieving improved production efficiency.

[0023] Effects of the Invention

[0024] According to the present invention, it is possible to suppress a decrease in production efficiency due to time required to restore the tool state in order to change the target substrate for substrate production in which substrate carrying-in operation, bare chip mounting operation and substrate unloading operation are performed. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a plan view schematically showing an example of the surface mounting machine according to the present invention.

[0026] Figure 2 Yes means Figure 1A block diagram of the electrical structure of a surface mount machine.

[0027] Figure 3 This is a flowchart showing an example of how a production plan is executed.

[0028] Figure 4 This is a flow chart showing a modified example of substrate production.

[0029] Figure 5 It is expressed in tabular form Figure 4 A diagram showing the execution order of installation work units in substrate production.

[0030] Figure 6 This is a flowchart showing an example of order determination.

[0031] Figure 7 This is a flowchart showing another example of order determination.

[0032] Fig. 8A It is expressed in tabular form Figure 4 A diagram showing the execution order of installation work units in substrate production.

[0033] Figure 8B It is expressed in tabular form according to Fig. 8A A diagram of an example of actions performed in the order of execution.

[0034] Fig. 9 This is a flow chart showing another modified example of substrate production. DETAILED DESCRIPTION

[0035] Figure 1 is a top view schematically showing an example of a surface mounting machine according to the present invention. Figure 2 Yes means Figure 1 The block diagram of the electrical structure of the surface mount machine. Figure 1 As shown, in this specification, an XYZ rectangular coordinate axis consisting of a conveying direction X, a width direction Y, and a vertical direction Z is appropriately used. The conveying direction X and the width direction Y are parallel to the horizontal direction and orthogonal to each other, and the vertical direction Z is orthogonal to the conveying direction X and the width direction Y.

[0036] The surface mounting machine 10 mounts a bare chip Wp on a substrate B carried in from the upstream side in the conveying direction X, and carries out the substrate B to the downstream side in the conveying direction X. Figure 2As shown, the controller 100 has: a control unit 110, which is a processor that performs operations for controlling the entire surface mounter 10; an image processing unit 120, which performs image processing based on the instructions of the control unit 110; and a drive control unit 130, which controls the actions of the substrate conveying unit 2, the bare chip supply mechanism 3, the mounting unit 4, the component supply mechanism 6 and the nozzle replacement machine 7 described later based on the instructions of the control unit 110. In addition, the controller 100 also has a storage unit 140 composed of an SSD (Solid State Drive) or an HDD (Hard Disk Drive). The storage unit 140 stores an installation program 150 for causing the control unit 110 to perform the control described later. The installation program 150 is provided by recording on a recording medium 170 such as a DVD (Digital Versatile Disc) or a USB (Universal Serial Bus) memory, and the control unit 110 saves the installation program 150 read from the recording medium 170 in the storage unit 140. In addition, the method of providing the installer 150 is not limited to this. The installer 150 can also be provided by downloading from an Internet server that records the installer 150, for example.

[0037] The surface mounter 10 includes a substrate transport unit 2 that transports a substrate B in a transport direction X. The substrate transport unit 2 includes a mounting operation position 21, and carries the substrate B into the mounting operation position 21 from the upstream side in the transport direction X. In addition, the substrate transport unit 2 carries out the substrate B on which the bare chip Wp and the component P are mounted at the mounting operation position 21 from the mounting operation position 21 to the downstream side in the transport direction X.

[0038] In addition, the surface mounter 10 is provided with a bare chip supply mechanism 3 for supplying bare chips Wp included in the wafer W. The wafer W is composed of a plurality of bare chips Wp (bare chips) that are individualized by dicing. In contrast, the bare chip supply mechanism 3 has a wafer storage section 31 that can store a plurality of wafers W and a wafer pull-out section 33 that pulls the wafer W from the wafer storage section 31 to a wafer supply position 32. The wafer storage section 31 can raise and lower a shelf that stores a plurality of wafer holders Wh that respectively hold the wafers W in a manner arranged in a vertical direction Z in the vertical direction Z, so that one wafer holder Wh is located at a height at which the wafer pull-out section 33 can receive the wafer W, and the wafer holder Wh is pushed out to the wafer pull-out section 33.

[0039] The wafer pulling unit 33 includes: a wafer support table 331 for supporting the wafer holder Wh; a fixed rail 332 for supporting the wafer support table 331 so as to be movable in the width direction Y; a ball screw 333 provided in the width direction Y and mounted on the wafer support table 331; and a Y-axis motor 334 for driving the ball screw 333. Therefore, the drive control unit 130 can move the wafer support table 331 in the width direction Y along the fixed rail 332 by rotating the ball screw 333 using the Y-axis motor 334. In addition, as Figure 1 As shown, the wafer storage section 31 and the wafer supply position 32 are arranged to sandwich the substrate conveying section 2 from the width direction Y, and the wafer support table 331 passes under the substrate conveying section 2. The wafer support table 331 receives the wafer holder Wh from the wafer storage section 31 at a receiving position adjacent to the wafer storage section 31, and moves from the receiving position to the wafer supply position 32, thereby pulling the wafer W to the wafer supply position 32.

[0040] Furthermore, the bare chip supply mechanism 3 further includes a bare chip take-out unit 35 for taking out the bare chip Wp from the wafer supply position 32. The bare chip take-out unit 35 includes a take-out head 36 for taking out the bare chip Wp from the wafer supply position 32, and the take-out head 36 is movable in the XY direction. That is, the bare chip take-out unit 35 includes: a support member 351 for supporting the take-out head 36 so as to be movable in the conveying direction X; and an X-axis motor 352 for driving a ball screw mounted on the take-out head 36, which is provided in the conveying direction X. Therefore, the drive control unit 130 can move the take-out head 36 in the conveying direction X by rotating the X-axis motor 352. In addition, the bare chip take-out unit 35 includes: a fixed rail 353 for supporting the support member 351 so as to be movable in the width direction Y; a ball screw 354 for being provided in the width direction Y and mounted on the fixed rail 353; and a Y-axis motor 355 for driving the ball screw 354. Therefore, the drive control unit 130 can move the removal head 36 together with the support member 351 in the width direction Y by rotating the Y-axis motor 355 .

[0041] The removal head 36 includes a bracket 361 extending in the conveying direction X and two suction nozzles 362 rotatably supported on the bracket 361. Each suction nozzle 362 rotates around a rotation axis parallel to the conveying direction X so as to be located at a suction position facing downward and a handover position facing upward ( Figure 1 In addition, the bracket 361 can rise and fall along with each suction nozzle 362.

[0042] Furthermore, the bare chip take-out section 35 also has a mobile camera 356 for photographing the bare chip Wp at the wafer supply position 32 from above, and the mobile camera 356 is movable in the XY direction. That is, in the bare chip take-out section 35, the mobile camera 356 is supported by the support member 351 in a manner that allows it to move in the conveying direction X. In addition, the bare chip take-out section 35 has an X-axis motor 357 that is provided in the conveying direction X and drives the ball screw mounted on the mobile camera 356. Therefore, the drive control section 130 can move the mobile camera 356 in the conveying direction X by rotating the X-axis motor 357, and can move the mobile camera 356 in the width direction Y together with the support member 351 by rotating the Y-axis motor 355.

[0043] In the bare chip supply mechanism 3, the bare chip Wp is supplied as follows. That is, the drive control unit 130 moves the mobile camera 356 to the upper side of the bare chip Wp that is the supply target among the plurality of bare chips Wp of the wafer W supplied to the wafer supply position 32. The mobile camera 356 photographs the bare chip Wp and transmits the photographed image to the image processing unit 120, and the image processing unit 120 recognizes the position of the bare chip Wp based on the photographed image. Then, the drive control unit 130 drives the suction nozzle 362 based on the recognition result of the image processing unit 120 so that the suction nozzle 362 located at the adsorption position faces the bare chip Wp from above, and then lowers the suction nozzle 362 to contact the bare chip Wp. Then, the drive control unit 130 applies negative pressure to the suction nozzle 362 while raising the suction nozzle 362, thereby picking up the bare chip Wp from the wafer supply position 32. Then, the drive control unit 130 supplies the bare chip Wp by positioning the suction nozzle 362 at the handover position.

[0044] The surface mounter 10 is provided with a mounting section 4 for mounting the bare chip Wp supplied by the bare chip supply mechanism 3 on the substrate B. The mounting section 4 includes: a support member 41 that can move along a fixed rail provided on the ceiling of the surface mounter 10 in the width direction Y; and a head unit 42 supported by the support member 41 so as to be movable in the conveying direction X. In addition, the surface mounter 10 is provided with: an X-axis motor 43 that is provided in the conveying direction X and drives a ball screw mounted on the head unit 42; and a Y-axis motor 44 that is provided in the width direction Y and mounted on the support member 41. Therefore, the drive control section 130 can move the head unit 42 in the conveying direction X by rotating the X-axis motor 43, and can move the head unit 42 in the width direction Y along with the support member 41 by rotating the Y-axis motor 44.

[0045] The head unit 42 has two mounting heads 421 and two suction nozzles N respectively mounted on the lower ends of the two mounting heads 421 in a manner that allows for loading and unloading. When picking up the bare chip Wp, the head unit 42 moves to the upper side of the removal head 36, and when the suction nozzle N is brought into contact with the bare chip Wp held by the suction nozzle 362 at the junction position from above, the suction nozzle N is lowered to contact the bare chip Wp. Next, the bare chip supply mechanism 3 releases the negative pressure of the suction nozzle 362, and the mounting unit 4 applies negative pressure to the suction nozzle N, uses the suction nozzle N to absorb the bare chip Wp, and raises the suction nozzle N while applying negative pressure. In this way, the head unit 42 picks up the bare chip Wp using the suction nozzle N.

[0046] In addition, the bare chip supply mechanism 3 has two suction nozzles 362, and two bare chips Wp can be supplied simultaneously by using these suction nozzles 362. On the other hand, the head unit 42 has two suction nozzles N corresponding to the two suction nozzles 362 of the bare chip supply mechanism 3, and two bare chips Wp supplied by the bare chip supply mechanism 3 can be picked up simultaneously by using the two suction nozzles N. However, it is not necessary to supply and pick up two bare chips Wp simultaneously.

[0047] Furthermore, the mounting section 4 further includes a moving camera 45 disposed downward. The moving camera 45 photographs the bare chip Wp supplied by the bare chip supply mechanism 3 and the bare chip Wp mounted on the substrate B from above. The moving camera 45 is mounted on the head unit 42, and the drive control section 130 can move the moving camera 45 in the XY directions similarly to the head unit 42 by rotating the X-axis motor 43 and the Y-axis motor 44.

[0048] Moreover, the surface mounter 10 is also provided with a component supply mechanism 6 provided on the opposite side of the bare chip supply mechanism 3 in the width direction Y. In the component supply mechanism 6, a plurality of feeders F are arranged in the conveying direction X. Each feeder F has a component supply position Fs at the front end portion on the side of the installation operation position 21 in the width direction Y, and supplies a component P (packaged component) having a package such as an integrated circuit, a capacitor or a resistor to the component supply position Fs. Specifically, a component storage belt having a plurality of pockets for storing components P respectively is assembled to the feeder F, and the feeder F supplies components P to the component supply position Fs by intermittently feeding the component storage belt in the width direction Y. In particular, a plurality of feeders F1, F2, F3, and F4 supply components P of different types to the component supply position Fs. In contrast, the head unit 42 of the mounting portion 4 uses a suction nozzle N to absorb the component P supplied to the component supply position Fs and mounts it on the substrate B of the mounting operation position 21.

[0049] In addition, the surface mounter 10 has a fixed camera 5. The fixed camera 5 is fixed to the base facing upward, and photographs the bare chip Wp or component P adsorbed by the suction nozzle N from below. The image (identification image) of the bare chip Wp or component P photographed by the fixed camera 5 is sent to the image processing unit 120, and the image processing unit 120 confirms the position of the bare chip Wp or component P adsorbed by the suction nozzle N based on the identification image of the bare chip Wp or component P.

[0050] In addition, the surface mounting machine 10 is provided with a nozzle replacement machine 7, which replaces the nozzle N of the head unit 42 mounted on the mounting portion 4. The nozzle replacement machine 7 performs the following operations on the head unit 42 opposed to the nozzle replacement machine 7 from above: mounting the nozzle N on the head unit 42 to which the nozzle N is not mounted, or removing the nozzle N mounted on the head unit 42 from the head unit 42 and storing it, or replacing the nozzle N mounted on the head unit 42.

[0051] In the surface mounter 10, substrate production is performed under the control of the control unit 110, and the substrate production includes: a carrying-in operation, in which a substrate B (target substrate) is carried into the mounting operation position 21 by the substrate conveying unit 2; a mounting operation, in which a bare chip Wp and a component P are mounted on the substrate B at the mounting operation position 21 by the mounting unit 4; and a carrying-out operation, in which the substrate B after the mounting operation is completed is carried out from the mounting operation position 21. In particular, by performing substrate production on a plurality of substrates B, a plurality of substrates B (mounted substrates) each mounted with a bare chip Wp and a component P are produced. Next, the execution method of the production plan for producing such a plurality of mounted substrates is described.

[0052] Figure 3 This is a flowchart showing an example of how a production plan is executed. Figure 3 The flowchart is executed under the control of the control unit 110. The flowchart includes substrate production for the first substrate B ("steps S101 to S116" on the left end), substrate production for the even-numbered substrates B ("steps S201 to S214" in the middle), and substrate production for the third and subsequent odd-numbered substrates B ("steps S101, S104 to S116" on the right end).

[0053] In order to distinguish between a plurality of substrates B, the expression “substrate B (I)” which also includes a count value I indicating the execution order of substrate production is used as appropriate. Figure 3 In the figure, the wafers W1, W2, W3, and W4 are different types of wafers W. Here, the different types of wafers W refer to different types of bare chips Wp constituting the wafers W. Furthermore, the suction nozzles N1 and N2 are different types of suction nozzles N.

[0054] In step S101, the substrate B (1) is carried to the mounting operation position 21 by the substrate transport unit 2. Then, the nozzle N1 is mounted on the head unit 42 by the nozzle changer 7 (step S102), and the wafer W1 is supplied to the wafer supply position 32 by the wafer pull-out unit 33 (step S103).

[0055] In step S104, the bare chip Wp taken out from the wafer W1 supplied to the wafer supply position 32 is mounted on the substrate B (1) of the mounting operation position 21 by the suction nozzle N1 of the mounting unit 4. In the next step S105, the component P supplied to the component supply position Fs by the feeder F1 is mounted on the substrate B (1) of the mounting operation position 21 by the suction nozzle N1 of the mounting unit 4. In addition, in parallel with step S105, the wafer W supplied to the wafer supply position 32 is changed from the wafer W1 to the wafer W2 (step S106).

[0056] In step S107, the bare chip Wp taken out from the wafer W2 supplied to the wafer supply position 32 is mounted on the substrate B (1) of the mounting operation position 21 by the suction nozzle N1 of the mounting section 4. In the next step S108, the component P supplied to the component supply position Fs by the feeder F2 is mounted on the substrate B (1) of the mounting operation position 21 by the suction nozzle N1 of the mounting section 4. In this way, the wafer W2 and the feeder F2 used for installation in steps S107 and S108 are different from the wafer W1 and the feeder F1 used for installation in steps S104 and S105. On the other hand, the suction nozzle N used for installation in steps S107 and S108 and the suction nozzle N used for installation in steps S104 and S105 are both the suction nozzle N1. In addition, in parallel with step S108, the wafer W supplied to the wafer supply position 32 is changed from wafer W2 to wafer W3 (step S109).

[0057] In step S110 , the nozzle N mounted on the head unit 42 is changed from the nozzle N1 to the nozzle N2 by the nozzle changing machine 7 .

[0058] In step S111, the bare chip Wp taken out from the wafer W3 supplied to the wafer supply position 32 is mounted on the substrate B (1) of the mounting operation position 21 by the suction nozzle N2 of the mounting section 4. In the next step S112, the component P supplied to the component supply position Fs by the feeder F3 is mounted on the substrate B (1) of the mounting operation position 21 by the suction nozzle N2 of the mounting section 4. In this way, the wafer W3 and the feeder F3 used for installation in steps S111 and S112 are different from the wafer W2 and the feeder F2 used for installation in steps S107 and S108. In addition, the suction nozzle N1 used for installation in steps S111 and S112 is different from the suction nozzle N2 used for installation in S107 and S108. In addition, in parallel with step S112, the wafer W supplied to the wafer supply position 32 is changed from wafer W3 to wafer W4 (step S113).

[0059] In step S114, the bare chip Wp taken out from the wafer W4 supplied to the wafer supply position 32 is mounted on the substrate B (1) of the mounting operation position 21 by the suction nozzle N2 of the mounting section 4. In the next step S115, the component P supplied to the component supply position Fs by the feeder F4 is mounted on the substrate B (1) of the mounting operation position 21 by the suction nozzle N2 of the mounting section 4. In this way, the wafer W4 and the feeder F4 used for mounting in steps S114 and S115 are different from the wafer W3 and the feeder F3 used for mounting in steps S111 and S112. On the other hand, the suction nozzle N used for mounting in steps S114 and S114 and the suction nozzle N used for mounting in steps S111 and S112 are both the suction nozzle N2.

[0060] In step S116 , the substrate B ( 1 ) is carried out from the mounting work position 21 by the substrate transport unit 2 .

[0061] In this way, the substrate B (1) is subjected to the following steps: carrying in operation (step S101), installing operation (steps S104, S105, S107, S108, S111, S112, S114, S115) and unloading operation (step S116). In the installation operation for the substrate B (1), the following steps are performed in sequence:

[0062] • Mounting work unit U (1) ... mounting of bare chips Wp constituting wafer W1 and mounting of components P supplied by feeder F1 (steps S104, S105);

[0063] • Mounting work unit U (2) ... mounting of bare chips Wp constituting wafer W2 and mounting of components P supplied by feeder F2 (steps S107, S108);

[0064] • Mounting work unit U (3) ... mounting of bare chips Wp constituting wafer W3 and mounting of components P supplied by feeder F3 (steps S111, S112); and

[0065] • Mounting work unit U (4) ... mounting of bare chips Wp constituting the wafer W4 and mounting of components P supplied by the feeder F4 (steps S114, S115).

[0066] In step S201 , the substrate B ( 2 ) is carried into the mounting work position 21 by the substrate transport unit 2 .

[0067] In step S202, the component P supplied to the component supply position Fs by the feeder F4 is mounted on the substrate B (2) at the mounting operation position 21 by the suction nozzle N2 of the mounting unit 4. In the next step S203, the bare chip Wp taken out from the wafer W4 supplied to the wafer supply position 32 is mounted on the substrate B (2) at the mounting operation position 21 by the suction nozzle N2 of the mounting unit 4.

[0068] In step S204, the component P shared by the component supply position Fs through the feeder F3 is mounted on the substrate B (2) of the mounting operation position 21 by the suction nozzle N2 of the mounting unit 4. In addition, in parallel with step S204, the wafer W supplied to the wafer supply position 32 is changed from the wafer W4 to the wafer W3 (step S205). In the next step S206, the bare chip Wp taken out from the wafer W3 supplied to the wafer supply position 32 is mounted on the substrate B (2) of the mounting operation position 21 by the suction nozzle N2 of the mounting unit 4.

[0069] In step S207 , the nozzle N mounted on the head unit 42 is changed from the nozzle N2 to the nozzle N1 by the nozzle changing machine 7 .

[0070] In step S208, the component P shared by the feeder F2 at the component supply position Fs is mounted on the substrate B (2) at the mounting operation position 21 by the suction nozzle N1 of the mounting unit 4. In addition, in parallel with step S208, the wafer W supplied to the wafer supply position 32 is changed from the wafer W3 to the wafer W2 (step S209). In the next step S210, the bare chip Wp taken out from the wafer W2 supplied to the wafer supply position 32 is mounted on the substrate B (2) at the mounting operation position 21 by the suction nozzle N1 of the mounting unit 4.

[0071] In step S211, the component P shared by the component supply position Fs through the feeder F1 is mounted on the substrate B (2) of the mounting operation position 21 by the suction nozzle N1 of the mounting unit 4. In addition, in parallel with step S211, the wafer W supplied to the wafer supply position 32 is changed from the wafer W2 to the wafer W1 (step S212). In the next step S213, the bare chip Wp taken out from the wafer W1 supplied to the wafer supply position 32 is mounted on the substrate B (2) of the mounting operation position 21 by the suction nozzle N1 of the mounting unit 4.

[0072] In step S214 , the substrate B ( 2 ) is carried out from the mounting work position 21 by the substrate transport unit 2 .

[0073] In this way, the substrate B (2) is subjected to the loading operation (step S201), the installation operation (steps S202, S203, S204, S206, S208, S210, S211, S213) and the unloading operation (step S214). In addition, in the installation operation for the substrate B (2), the following operations are performed in sequence:

[0074] • Mounting work unit U (4) ... mounting of bare chips Wp constituting wafer W4 and mounting of components P supplied by feeder F4 (steps S202, S203);

[0075] • Mounting work unit U (3) ... mounting of bare chips Wp constituting wafer W3 and mounting of components P supplied by feeder F3 (steps S204, S206);

[0076] • Mounting work unit U (2) ... mounting of bare chips Wp constituting wafer W2 and mounting of components P supplied by feeder F2 (steps S208, S210); and

[0077] • Mounting work unit U(1) ... Mounting of bare chips Wp constituting wafer W1 and mounting of components P supplied by feeder F1 (steps S211, S213).

[0078] In step S301, the substrate B (3) is carried into the mounting work position 21 by the substrate transport unit 2. Then, steps S304 to S116 are performed on the substrate B (2) in the same manner as steps S104 to S116.

[0079] That is, the substrate B (3) is subjected to the loading operation (step S301), the installation operation (steps S304, S305, S307, S308, S311, S312, S314, S315) and the unloading operation (step S316). In addition, in the installation operation for the substrate B (3), the following are performed in sequence:

[0080] • Mounting work unit U (1) ... mounting of bare chips Wp constituting wafer W1 and mounting of components P supplied by feeder F1 (steps S304, S305);

[0081] • Mounting work unit U (2) ... mounting of bare chips Wp constituting wafer W2 and mounting of components P supplied by feeder F2 (steps S307, S308);

[0082] • Mounting work unit U (3) ... mounting of bare chips Wp constituting wafer W3 and mounting of components P supplied by feeder F3 (steps S311, S312); and

[0083] • Mounting work unit U (4) ... mounting of bare chips Wp constituting the wafer W4 and mounting of components P supplied by the feeder F4 (steps S314, S315).

[0084] Thereafter, steps S201 to S214 are performed on the even-numbered substrate B (even), and steps S301 to S316 are performed on the odd-numbered substrate B (odd).

[0085] In this way, Figure 3In the illustrated embodiment, a loading operation of loading the substrate B (target substrate) into the mounting operation position 21, a mounting operation of mounting the bare chip Wp on the substrate B at the mounting operation position 21, and a unloading operation of unloading the substrate B from the mounting operation position 21 after the mounting operation is completed are performed on the substrate B (substrate production). In addition, the mounting operation includes a plurality of mounting operation units U(1), U(2), U(3), and U(4), and the plurality of mounting operation units U(1), U(2), U(3), and U(4) mount the bare chip Wp on the substrate B from wafers W1, W2, W3, and W4 of different types. Accordingly, the type of wafer W supplied to the wafer supply position 32 is changed according to the execution of the plurality of mounting operation units U(1), U(2), U(3), and U(4) (for example, steps S103, S106, S109, and S113). In addition, in each of the plurality of installation work units U(1), U(2), U(3), and U(4), suction nozzles N1 and N2 of the type corresponding to the wafers W1, W2, W3, and W4 supplied to the wafer supply position 32 are mounted on the mounting head 421. Therefore, the combination of the type of wafer W supplied to the wafer supply position 32 and the type of suction nozzle N mounted on the mounting head 421, i.e., the tool state, is different at the start and at the completion of the installation work on the substrate B(1) (first substrate). Therefore, if the plurality of installation work units U(1), U(2), U(3), and U(4) in the installation work on the substrate B(1) and the plurality of installation work units U(1), U(2), U(3), and U(4) in the installation work on the substrate B(2) (second substrate) subsequent to the substrate B(2) are performed in the same order, it is necessary to restore the tool state when the installation work on the substrate B(1) is completed. In contrast, in the present embodiment, a plurality of mounting operation units U(4), U(3), U(2), and U(1) for substrate B(2) are executed in the execution order corresponding to the tool state at the time point when the mounting operation for substrate B(1) is completed, i.e., the final tool state (wafer W4 and suction nozzle N2). Thus, it is possible to suppress a decrease in production efficiency due to the time required to restore the tool state in order to change the target substrate B of substrate production from substrate B(1) to substrate B(2).

[0086] In addition, the same control is performed for the change from substrate B (even) to substrate B (odd) and the change from substrate B (odd) to substrate B (even). Thus, it is possible to suppress the situation where the production efficiency is reduced due to the time required to restore the tool state in order to change the target substrate B of substrate production from substrate B (even) to substrate B (odd), and it is possible to suppress the situation where the production efficiency is reduced due to the time required to restore the tool state in order to change the target substrate B of substrate production from substrate B (odd) to substrate B (even).

[0087] In particular, the control unit 110 executes a plurality of installation work units U for substrate B(1) (first substrate) in a prescribed first order (U(1), U(2), U(3), U(4)), and executes a plurality of installation work units U for substrate B(2) (second substrate) in a second order U(4), U(3), U(2), U(1) opposite to the first order. Thus, the plurality of installation work units U(4), U(3), U(2), U(1) for substrate B(2) are started from the installation work unit U(4) whose combination of the type of wafer W located at the wafer supply position 32 and the type of suction nozzle N mounted on the mounting head 421 is consistent with the combination represented by the final tool state (wafer W4 and suction nozzle N2). In this structure, when the installation work for substrate B(1) is completed, it is not necessary to restore the tool state in order to start the installation work for substrate B(2). Therefore, it is possible to suppress the situation in which the production efficiency is reduced due to the time required to restore the tool state in order to change the target substrate of substrate production from substrate B(1) to substrate B(2).

[0088] In addition, the same control is performed for the change from substrate B (even) to substrate B (odd) and the change from substrate B (odd) to substrate B (even). Thus, it is possible to suppress the situation where the production efficiency is reduced due to the time required to restore the tool state in order to change the target substrate B of substrate production from substrate B (even) to substrate B (odd), and it is possible to suppress the situation where the production efficiency is reduced due to the time required to restore the tool state in order to change the target substrate B of substrate production from substrate B (odd) to substrate B (even).

[0089] In addition, there is a component supply mechanism 6 (feeders F1 to F4) for supplying components P to the component supply position Fs. Furthermore, the installation work units U(1), U(2), U(3), and U(4) each include a bare chip installation period in which a bare chip Wp is installed from a wafer W to a substrate B (e.g., steps S104, S107, S111, and S114) and a component installation period in which a component P is installed from a component supply position Fs to a substrate B (e.g., steps S105, S108, S112, and S115). In addition, in the bare chip installation period and the component installation period belonging to the same installation work unit U, the type of suction nozzle N mounted on the installation head 421 is common. Furthermore, the wafer pulling section 33 (wafer supply section) performs replacement of the wafer W supplied to the wafer supply position 32 in parallel with the component installation period (e.g., steps S103, S106, S109, and S113). In this configuration, the component mounting period can be effectively utilized for changing the type of wafer W, thereby achieving improvement in production efficiency.

[0090] By the way, in Figure 3In the example, in each of the installation work units U(1), U(2), U(3), and U(4) for the odd-numbered substrates B(odd), the installation of the component P supplied from the feeder F is performed after the installation of the bare chip Wp constituting the wafer W. In addition, in each of the installation work units U(4), U(3), U(2), and U(1) for the even-numbered substrates B(even), the installation of the bare chip Wp constituting the wafer W is performed after the installation of the component P supplied from the feeder F. However, their execution order can be changed appropriately. For example, in each of the installation work units U(4), U(3), U(2), and U(1) for the even-numbered substrates B(even), the installation of the component P supplied from the feeder F is performed after the installation of the bare chip Wp constituting the wafer W. In this example, the same effect as above can also be achieved.

[0091] Figure 4 is a flow chart showing a variation of substrate production. Figure 5 It is expressed in tabular form Figure 4 A diagram showing the execution order of installation work units in substrate production. Figure 4 The flowchart is executed under the control of the control unit 110. Figure 5 The execution order O1 shown is stored in the recording medium 170, for example. The execution order O1 indicates that the installation work units U(1), U(2), U(3), and U(4) are executed in the order of these. Furthermore, the execution order O1 indicates that in each of the installation work units U(1), U(2), U(3), and U(4), the installation of the components P supplied from the feeder F is executed after the installation of the bare chips Wp constituting the wafer W (intra-unit order).

[0092] exist Figure 4 In the flowchart, in step S401, the substrate B (1) is moved to the installation operation position 21. Then, the installation operation units U (1), U (2), U (3), U (4) are executed in the execution order O1 (steps S402, S403). In addition, the timing of the supply of wafer W to the wafer supply position 32 and the replacement of the suction nozzle N are the same as described above. When the installation operation units U (1), U (2), U (3), U (4) are executed ("Yes" in step S403), confirm whether there are any bare chips Wp or components P that have failed to be installed in the installation operation units U (1), U (2), U (3), U (4) (step S404).

[0093] Specifically, the presence or absence of mounting failure can be determined based on images obtained by photographing the state of the bare chip Wp or component P adsorbed to the suction nozzle N before mounting on the substrate B (1) and the state of the suction nozzle N after mounting on the substrate B (1) by the fixed camera 5. That is, when the suction posture of the suction nozzle N for the bare chip Wp or component P before mounting is tilted, or when the bare chip Wp or component P is attached to the suction nozzle N after mounting, it is determined that the mounting has failed.

[0094] If there is no mounting failure ("No" in step S404), the process proceeds to step S406 to unload the substrate B (1) from the mounting operation position 21. On the other hand, if there is a mounting failure ("Yes" in step S404), step S406 is executed after step S405.

[0095] In step S405, the installation of the bare chip Wp or component P that failed to be installed is performed again. In the example here, it is assumed that the installation of the bare chip Wp constituting the wafer W2 in the installation operation unit U(2) has failed. At this time, since the installation operation unit U(2) has not been completed, the installation of the bare chip Wp is performed again. In addition, in step S403, it is confirmed that at the time point when the installation operation units U(1), U(2), U(3), and U(4) are executed, the wafer W4 is supplied to the wafer supply position 32, and the suction nozzle N2 is equipped on the installation head 421. Therefore, in step S405, the wafer W supplied to the wafer supply position 32 is changed from wafer W4 to wafer W2, and the suction nozzle N equipped on the installation head 421 is changed from suction nozzle N2 to suction nozzle N1. And, when the installation of the bare chip Wp constituting the wafer W2 is successful, the installation operation unit U(2) is completed. As a result, all bare chips Wp and components P that should be installed by the installation work units U(1), U(2), U(3), and U(4) are successfully installed on the substrate B(1), and the installation work units U(1), U(2), U(3), and U(4) are completed.

[0096] Then, after substrate B(1), substrate B(2) is subjected to Figure 4 When producing a substrate of, determine the order in which the installation work unit U is to be executed on the substrate B (2) ( Figure 6 ). Figure 6 This is a flowchart showing an example of order determination. Figure 6 The flowchart is executed under the control of the control unit 110.

[0097] In step S501, the tool state at the time point when the installation work units U(1), U(2), U(3), and U(4) for the substrate B(1) are completed, that is, the final tool state at the time point when the installation work is completed, is confirmed. Here, the installation work completion time point is not the time point when the installation work units U(1), U(2), U(3), and U(4) are executed (the time point when it is "yes" in step S403), but the time point when the installation of the bare chip Wp or the component P is successfully executed again in step S405. That is, at the former time point, since the installation work unit U(2) that failed to be installed was not completed, it cannot be determined that the installation work is completed. The time point when all the bare chips Wp and components P that should be installed in the installation work units U(1), U(2), U(3), and U(4) are successfully installed becomes the installation work completion time point. Therefore, the final tool state confirmed in step S501 represents the combination of wafer W3 and suction nozzle N2.

[0098] In step S502, the identifier J (J=1, 2, 3, 4) identifying the installation work unit U(J) is reset to zero, and in step S503, the identifier J is incremented by 1. Then, it is determined whether the combination of the type of wafer W and the type of nozzle N used in the installation work unit U(J), that is, the tool state, is consistent with the final tool state (wafer W2, nozzle N1) (step S504). In the execution sequence O1, since the tool state (wafer W1 and nozzle N1) when executing the installation work unit U(1) is different from the final tool state ("No" in step S504), it returns to step S503 and increments the identifier J by 1. In this way, steps S503 and S504 are repeated until an installation work unit U(J) with a tool state consistent with the final tool state is found (until it becomes "Yes" in step S504). As a result, in the example here, the installation work unit U(2) will be retrieved.

[0099] In step S505, it is determined that the installation work units U(1), U(2), U(3), and U(4) for the substrate B(2) are cyclically executed according to the execution order O1 starting from the corresponding installation work unit U(2) retrieved in step S504. Here, the so-called cyclic execution according to the execution order O1 means that after executing sequentially from the corresponding installation work unit U(2) to the last in the execution order O1, the installation work units U(1), U(2), U(3), and U(4) are executed sequentially from the first installation work unit U(1). Therefore, in the execution order O1, after executing from the corresponding installation work unit U(2) to the last installation work unit U(4), the first installation work unit U(1) is executed, thereby executing the installation work units U(1), U(2), U(3), and U(4).

[0100] In this way, Figure 6 In the order of determining, the control unit 110 performs a search process (steps S501 to S504) to retrieve the corresponding installation work unit U(2) that satisfies the search condition (first search condition) that its tool state is consistent with the final tool state from the multiple installation work units U(1), U(2), U(3), and U(4) for the substrate B(2) (the second substrate). Then, starting from the corresponding installation work unit U(2), the multiple installation work units U(1), U(2), U(3), and U(4) for the substrate B(2) are retrieved. By controlling the execution order of the multiple installation work units U(1), U(2), U(3), and U(4) for the substrate B(2) based on the result of such a search process, it is possible to suppress the situation in which the production efficiency is reduced due to the time required to restore the tool state in order to change the target substrate of substrate production from substrate B(1) to substrate B(2).

[0101] Specifically, a search is performed for an installation operation unit U(2) that satisfies the search condition that the combination of the type of wafer W (wafer W2) located at the wafer supply position 32 and the type of nozzle N (nozzle N1) mounted on the installation head 421 for executing the corresponding installation operation unit U(2) is consistent with the combination (wafer W2 and nozzle N1) represented by the final tool state. Thus, when the installation operation for substrate B(1) is completed, it is not necessary to restore the combination of wafer W and nozzle N in order to start the installation operation for substrate B(2). Therefore, it is possible to suppress the situation in which the production efficiency is reduced due to the time required to restore the combination of wafer W and nozzle N in order to change the target substrate of substrate production from substrate B(1) to substrate B(2).

[0102] In addition, various specific search orders are considered when searching for a corresponding installation work unit U(2) that meets the search conditions from multiple installation work units U(1), U(2), U(3), and U(4). Figure 6 In the example, the corresponding installation work unit U(2) that meets the search condition is searched from the plurality of installation work units U(1), U(2), U(3), and U(4) in the execution order O1 (first order), and it is decided to execute the execution order O1 cyclically starting from the corresponding installation work unit U(2). However, it is also possible to Figure 7 That way the execution order is determined.

[0103] Figure 7 This is a flowchart showing another example of order determination. Figure 7The flowchart is executed under the control of the control unit 110. In step S601, the tool state at the time point when the installation work units U(1), U(2), U(3), and U(4) for the substrate B(1) are completed, that is, the final tool state at the time point when the installation work is completed is confirmed. In step S602, the identifier J (J=1, 2, 3, 4) for identifying the installation work unit U(J) is set to Jx+1. Here, Jx is the number of installation work units U(J), that is, the maximum value of the identifier J=4. In addition, in step S603, the identifier J is decremented by 1.

[0104] Then, determine whether the combination of the type of wafer W and the type of nozzle N used in the installation work unit U (J), that is, the tool state, is consistent with the final tool state (wafer W2, nozzle N1) (step S604). In the execution sequence O1, since the tool state (wafer W4 and nozzle N2) when executing the installation work unit U (4) is different from the final tool state ("No" in step S604), return to step S603 and decrement the identifier J by 1. In this way, steps S603 and S604 are repeated until an installation work unit U (J) with a tool state consistent with the final tool state is found (until it becomes "Yes" in step S604). As a result, in the example here, the installation work unit U (2) is retrieved.

[0105] In step S605, it is decided to cyclically execute the installation work units U(1), U(2), U(3), and U(4) for the substrate B(2) starting from the corresponding installation work unit U(2) retrieved in step S604 in the reverse order of the execution order O1. Here, the so-called cyclic execution in the reverse order of the execution order O1 means that after executing in reverse order from the corresponding installation work unit U(2) to the beginning in the execution order O1, the execution is reversed from the last installation work unit U(1), thereby executing the installation work units U(1), U(2), U(3), and U(4). Therefore, in the execution order O1, after executing in reverse order from the corresponding installation work unit U(2) to the beginning installation work unit U(1), the execution is reversed from the last installation work unit U(4) to the installation work unit U(3), thereby executing the installation work units U(1), U(2), U(3), and U(4). At this time, Figure 3 Similarly, in steps S202 to S213 in the example of FIG. 1 , the order within the unit is also reversed, and after the mounting of the components P supplied by the feeder F, the mounting of the bare chips Wp constituting the wafer W is performed.

[0106] That is, in Figure 7In the example, the corresponding installation work unit U(2) that meets the search condition is retrieved from multiple installation work units U(1), U(2), U(3), and U(4) in the order (second order) opposite to the execution order O1 (first order), and it is decided to cyclically execute the order opposite to the execution order O1 starting from the corresponding installation work unit U(2).

[0107] Fig. 8A It is expressed in tabular form Figure 4 A diagram showing the execution order of the installation work units in the production of substrates. Figure 8B It is expressed in tabular form according to Fig. 8A A diagram of an example of actions performed in the order of execution. Fig. 8A The execution order O2 shown indicates that the installation work units U(1) and U(2) are executed in the order in which they are installed. Furthermore, the execution order O2 indicates that the installation of the components P supplied from the feeder F is executed after the installation of the bare chips Wp constituting the wafer W in the installation work unit U(1) (intra-unit order). Fig. 8A In the example, three mounting heads 421 are provided in the head unit 42, and the three mounting heads 421 are identified by head numbers H1, H2, and H3. According to the execution order O2, in the mounting operation unit U(1), the suction nozzle N1 is installed in each mounting head 421, and in the mounting operation unit U(2), the suction nozzle N2 is installed in each mounting head 421.

[0108] In this example, it is assumed that after the mounting work units U(1) and U(2) for the substrate B(1) are completed in the execution order O2, the execution order of the mounting work units U(1) and U(2) for the substrate B(2) is determined. In particular, it is assumed that the mounting head 421 with head number H2 fails to mount the component P supplied by the feeder F1 when the nozzle N1 is used to mount the component P in the mounting work unit U(1) for the substrate B(1).

[0109] Since the installation fails, after executing the installation operation unit U(2), the installation of component P using the suction nozzle N1 of the installation head 421 with head number H2 in the installation operation unit U(1) is executed again on the substrate B (step S405). In this way, the installation operation units U(1) and U(2) for the substrate B(1) are completed. As a result, in the final tool state, the wafer W2 is located at the wafer supply position 32, and the three installation heads 421 are respectively equipped with suction nozzles N2, N1, and N2 ( Figure 8B ).

[0110] Therefore, in Figure 6In the order determination, among the installation work units U(1) and U(2) represented by the execution order O2, there is no corresponding installation work unit U having a tool state consistent with the final tool state. Therefore, the control unit 110 searches for the installation work units U(1) and U(2) that satisfies the search condition (second search condition) that the number of suction nozzles N that need to be replaced in order to change the types of the multiple suction nozzles N2, N1, and N2 represented by the final tool state to the types of the multiple suction nozzles N that should be mounted on the multiple mounting heads 421 in order to execute the corresponding installation work unit U is the smallest.

[0111] exist Fig. 8A In the example, in order to get from the final tool state ( Figure 8B ) is changed to the nozzles N1, N1, N1 that should be installed in order to perform the installation work unit U (1), and the two nozzles N of head numbers H1 and H3 must be changed from nozzle N2 to nozzle N1. On the other hand, in order to change from the final tool state ( Figure 8B ) is changed to the nozzles N2, N2, N2 that should be installed in order to execute the installation work unit U(2), and it is sufficient to change one nozzle N of the head number H2 from nozzle N1 to nozzle N2. Therefore, it is determined that the installation work unit U(2) satisfies the search condition. As a result, the execution of the installation work units U(1) and U(2) for the substrate B(2) is determined to start from the corresponding installation work unit U(2).

[0112] In this embodiment, when the mounting operation on the substrate B (1) (first substrate) is completed, the time required to restore the state of the suction nozzle N in order to start the mounting operation on the substrate B (2) (second substrate) can be suppressed. As a result, it is possible to suppress the situation in which the production efficiency is reduced due to the time required to restore the tool state in order to change the target substrate of substrate production from the substrate B (1) to the substrate B (2).

[0113] Fig. 9 is a flow chart showing another variation of substrate production. Fig. 9 In the production of substrates, after the substrate B is moved to the installation operation position 21 in step S301 and before the installation operation (steps S302 to S305) for the substrate B is started, a preliminary inspection (step S307) is performed. In this preliminary inspection, for example, the control unit 110 checks whether the substrate B has any abnormality based on the image of the substrate B captured by the mobile camera 45. Fig. 9In the production of the substrate B, after the mounting operation (steps S302 to S305) on the substrate B is completed and before the substrate B is moved out of the mounting operation position 21, a post-inspection (step S308) is performed. In the post-inspection, for example, the control unit 110 checks whether the bare chip Wp or the component P mounted on the substrate B has an abnormality based on the image of the bare chip Wp or the component P captured by the mobile camera 356.

[0114] Then, for multiple substrates B, Fig. 9 At this time, when the production of substrate B(1) is completed and the production of substrate B(2) is started, the order of executing the plurality of installation work units U for substrate B(2) is determined according to the final tool state after the installation work of substrate B(1) is completed. However, the order of executing the plurality of installation work units U after executing the pre-check (step S307) and the order of executing the post-check (step S308) after executing the plurality of installation work units U are maintained for substrate B(1) and substrate B(2).

[0115] That is, the substrate production includes: a pre-inspection (step S307) to check the state of the substrate B carried into the installation operation position 21 by the carrying-in operation (step S301) before the installation operation (steps S302 to S305); and a post-inspection (step S308) to check the state of the substrate B that has completed the installation operation (steps S302 to S305) before the unloading operation (step S306). In this regard, the control unit 110 performs the pre-inspection (step S307) before the installation operation (steps S302 to S305) and performs the post-inspection (step S308) after the installation operation (steps S302 to S305) in both the substrate production for substrate B (1) and the substrate production for substrate B (2). In this structure, the pre-inspection (step S307) and post-inspection (step S308) of the substrate B can be performed at appropriate timing.

[0116] Thus, in the above-mentioned embodiment, the surface mounter 10 is equivalent to an example of the “surface mounter” of the present invention, the control unit 110 is equivalent to an example of the “control unit” of the present invention, the storage unit 140 is equivalent to an example of the “storage unit” of the present invention, the substrate conveying unit 2 is equivalent to an example of the “substrate conveying unit” of the present invention, the installation operation position 21 is equivalent to an example of the “installation operation position” of the present invention, the wafer storage unit 31 is equivalent to an example of the “wafer storage unit” of the present invention, the wafer supply position 32 is equivalent to an example of the “wafer supply position” of the present invention, the wafer pulling unit 33 is equivalent to an example of the “wafer supply unit” of the present invention, the mounting unit 4 is equivalent to an example of the “mounting unit” of the present invention, the component supply mechanism 6 is equivalent to an example of the “component supply unit” of the present invention, the substrate B is equivalent to an example of the “target substrate” of the present invention, the suction nozzle N is equivalent to an example of the “suction nozzle” of the present invention, the installation operation unit U is equivalent to an example of the “installation operation unit” of the present invention, the wafer W is equivalent to an example of the “wafer” of the present invention, and the bare chip Wp is equivalent to an example of the “bare chip” of the present invention.

[0117] The present invention is not limited to the above-described embodiment, and various modifications may be made to the above-described embodiment without departing from the gist thereof. For example, the content represented by the tool status is not limited to the combination of the type of wafer W and the type of nozzle N, but may be one of these types.

[0118] In the above-described example, the surface mounter 10 functions as a flip chip die bonder, but may also function as a die bonder that does not flip a bare chip.

[0119] Description of symbols

[0120] 10…Surface mount machine;

[0121] 110…Control Department;

[0122] 140 ... storage unit;

[0123] 2…substrate transport unit;

[0124] 21… Installation operation location;

[0125] 31…wafer storage unit;

[0126] 32…wafer supply position;

[0127] 33 ... wafer pulling section (wafer supply section);

[0128] 4…Installation department;

[0129] 6…component supply mechanism (component supply unit);

[0130] B…substrate (target substrate);

[0131] N…sucking nozzle;

[0132] U…Installation operation unit;

[0133] W…wafer;

[0134] Wp…bare chip.

Claims

1. A surface mounting machine comprising: A wafer storage section for storing a plurality of wafers; a wafer supply unit for supplying the wafer from the wafer storage unit to a wafer supply position; The substrate transport unit transports the target substrate to the specified installation operation position; a mounting section for mounting bare chips constituting the wafer supplied to the wafer supply position on the target substrate at the mounting operation position using a suction nozzle detachably mounted on the mounting section; and A control unit controls the execution of substrate production, wherein the substrate production includes: a carrying operation, wherein the target substrate is carried into the installation operation position by using the substrate transport unit; The bare chip is mounted on the target substrate at the mounting operation position by the mounting unit; and the target substrate after the mounting operation is removed from the mounting operation position is removed from the mounting operation position. The mounting operation includes a plurality of mounting operation units, and the plurality of mounting operation units mount the bare chip on the target substrate from the wafers of different types. The wafer supply unit changes the type of the wafer supplied to the wafer supply position according to the execution of the plurality of mounting work units. In each of the plurality of mounting work units, the suction nozzle of a type corresponding to the wafer supplied to the wafer supply position for execution of the mounting work unit is mounted on the mounting portion, When the substrate production with the first substrate as the target substrate is completed and then the substrate production with the second substrate as the target substrate is started, the control unit executes the multiple installation operation units for the second substrate in an execution order corresponding to a final tool state, and the final tool state indicates at least one of the type of the wafer located at the wafer supply position and the type of the suction nozzle assembled on the installation unit at the time point when the installation operation for the first substrate is completed.

2. The surface mounting machine according to claim 1, wherein: The final tool state indicates a combination of the type of the wafer located at the wafer supply position and the type of the suction nozzle mounted on the mounting portion at a time point when the mounting work on the first substrate is completed.

3. The surface mounting machine according to claim 2, wherein: The control unit executes the multiple installation work units for the first substrate in a prescribed first order, and executes the multiple installation work units for the second substrate in a second order opposite to the first order, thereby starting from the installation work unit whose combination of the type of the wafer located at the wafer supply position and the type of the suction nozzle assembled on the mounting portion is consistent with the combination represented by the final tool state.

4. The surface mounting machine according to claim 2, wherein: The control unit performs a search process for searching a corresponding installation work unit that satisfies a prescribed first search condition between the multiple installation work units for the second substrate and the final tool state, and starts the multiple installation work units for the second substrate from the corresponding installation work unit.

5. The surface mounting machine according to claim 4, wherein: The first search condition is a condition that a combination of the type of the wafer located at the wafer supply position and the type of the suction nozzle mounted on the mounting portion for execution of the corresponding mounting work unit matches a combination represented by the final tool state.

6. The surface mounting machine according to claim 5, wherein: The surface mounting machine further includes a storage unit storing a first order indicating the order of the plurality of mounting work units. The search process searches for the corresponding installation work unit by searching for the installation work unit satisfying the first search condition from among the plurality of installation work units in the first order, thereby searching for the corresponding installation work unit. During the production of the substrate for the second substrate, in the first sequence, the control unit executes from the first installation work unit of the multiple installation work units to the installation work unit that is one before the corresponding installation work unit, after executing from the corresponding installation work unit to the last installation work unit of the multiple installation work units.

7. The surface mounting machine according to claim 5, wherein: The surface mounting machine further includes a storage unit storing a first order indicating the order of the plurality of mounting work units. The retrieval process retrieves the corresponding installation work unit by retrieving the installation work unit satisfying the first retrieval condition from the plurality of installation work units in a second order opposite to the first order, thereby retrieving the corresponding installation work unit. During the production of the second substrate for the second substrate, in the second sequence, the control unit executes from the first installation work unit of the multiple installation work units to the installation work unit that is earlier than the corresponding installation work unit after executing from the corresponding installation work unit to the last installation work unit of the multiple installation work units.

8. The surface mounting machine according to any one of claims 5 to 7, wherein: A plurality of suction nozzles are detachably mounted on the mounting portion. In the retrieval process, when there is no corresponding installation work unit that satisfies the first retrieval condition, the corresponding installation work unit that satisfies the following second retrieval condition is searched from the multiple installation work units for the second substrate: the number of suction nozzles that need to be replaced in order to change the types of the multiple suction nozzles represented by the final tool state to the types of the multiple suction nozzles that should be assembled on the mounting part for the execution of the corresponding installation work unit is minimized.

9. The surface mounting machine according to any one of claims 1 to 8, wherein: The substrate production includes: a pre-inspection, which is to check the state of the target substrate that has been carried into the installation operation position by the carrying-in operation before the installation operation; and a post-inspection, which is to check the state of the target substrate that has completed the installation operation before the carrying-out operation. The control unit performs the pre-inspection before the mounting work and performs the post-inspection after the mounting work in both the substrate production for the first substrate and the substrate production for the second substrate.

10. The surface mounting machine according to any one of claims 1 to 9, wherein: The surface mounting machine further includes a component supply unit for supplying components to the component supply position. The mounting operation unit includes a bare chip mounting period in which the bare chip is mounted on the target substrate from the wafer and a component mounting period in which the component is mounted on the target substrate from the component supply position. During the bare chip mounting period and the component mounting period belonging to the same mounting work unit, the type of the suction nozzle mounted on the mounting portion is common, The wafer supply section performs replacement of the wafer supplied to the wafer supply position in parallel with the component mounting period.

11. A surface mounting method, comprising: The process of moving the first substrate into an installation operation position; A step of performing a mounting operation on the first substrate as a target substrate; The step of moving the first substrate after the installation operation is completed out of the installation operation position; The process of moving the second substrate into the installation operation position; a step of performing the mounting operation on the second substrate as a target substrate; and a step of moving the second substrate after the installation operation is completed from the installation operation position; In the mounting operation, the mounting section mounts bare chips constituting wafers supplied from a wafer storage section storing a plurality of wafers to a wafer supply position on the target substrate at the mounting operation position using a suction nozzle detachably mounted on the mounting section. The mounting operation includes a plurality of mounting operation units, and the plurality of mounting operation units mount the bare chip on the target substrate from the wafers of different types. The type of the wafer supplied to the wafer supply position is changed according to the execution of the plurality of mounting work units. In each of the plurality of mounting work units, the suction nozzle of a type corresponding to the wafer supplied to the wafer supply position for execution of the mounting work unit is mounted on the mounting portion, The multiple installation work units for the second substrate are executed in an execution order corresponding to a final tool state, and the final tool state represents at least one of the type of the wafer located at the wafer supply position and the type of the suction nozzle assembled on the mounting part at a time point when the installation work for the first substrate is completed.

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