A miniature electronic transformer with high stability

Abstract

The present invention belongs to the technical field of electronic transformers, and discloses a micro-electronic transformer with high stability, including a bracket structure, a fixing structure, a guide structure and a moisture absorption structure. In the present invention, through the hygroscopic gel plate of the hygroscopic structure, during the daily use of the electronic device, the moisture absorbed by the hygroscopic gel plate will prevent the micro-electronic transformer from being located in an overly dry environment, thereby preventing the occurrence of electrostatic discharge (ESD) and preventing the insulation layer and semiconductor components of the transformer from being damaged; secondly, when the humidity of the surrounding environment rises, the hygroscopic gel plate continues to absorb moisture and expand, and the expansion of the hygroscopic gel plate will push the thermal conductive slider to move in the direction of the blocking plate, thereby making the blocking plate fit the inner wall of the guide frame. At this time, the bottom of the thermal conductive slider covers the first air inlet, preventing the humid air from flowing in the guide frame and corroding the first airway and the second airway, and preventing the guide frame from breaking after long-term corrosion.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic transformers, and in particular relates to a micro electronic transformer with high stability. Background Art

[0002] A micro electronic transformer is a small transformer specially used in electronic equipment. It can convert the voltage of AC or DC power supply to meet the working voltage requirements of electronic equipment. It has the advantages of small size, light weight and high efficiency. Therefore, it is used in power adapters, measuring instruments, control systems, communication equipment, etc.

[0003] During the use of the above-mentioned equipment, some of the equipment needs to be set up in the wild and other places with harsh environments. The current protection of micro-electronic transformers is mostly to ensure that they work within a suitable temperature range, and less consideration is given to the fact that environmental humidity is also a factor that affects the work of electronic transformers. When micro-electronic transformers work in a humid environment, they are prone to problems such as reduced insulation performance, mildew, and changes in electrical properties, causing the micro-electronic transformer to fail to work properly and output incorrect voltage, causing damage to other electrical components on the circuit board, thereby causing damage to the equipment. Summary of the invention

[0004] The object of the present invention is to provide a micro electronic transformer with high stability to solve the problems raised in the above background technology.

[0005] In order to achieve the above object, the present invention provides the following technical solution: a micro electronic transformer with high stability, comprising a support structure and a fixing structure, wherein the support structure comprises a winding frame, the fixing structure comprises a magnetic core fixedly mounted at both ends of the winding frame, a coil is wound on the winding frame, and further comprises:

[0006] The air guide structure comprises a lower bracket and an upper bracket, the lower bracket and the upper bracket are both fixedly sleeved on the outer side surface of the coil, a plurality of air guide frames are fixedly connected between the lower bracket and the upper bracket, one side of the air guide frame abuts against the outer side surface of the coil, a plurality of through grooves are provided on the side surface of the air guide frame, a plurality of first air channels and second air channels are vertically provided inside the air guide frame, a plurality of first air inlets are provided on the bottom surface of the air guide frame, a plurality of first air outlets are provided on the top surface of the air guide frame, the first air inlet is communicated with the first air channel, the first air outlet is communicated with the second air channel, the second air channel is communicated with the first air channels adjacent to the two sides, a plurality of baffle plates are hinged in the first air channel, and a return torsion spring is sleeved on the hinge shaft of the baffle plate to keep the baffle plate in an outward tilted state;

[0007] The hygroscopic structure comprises a semipermeable membrane frame, a plate frame and a hygroscopic gel plate. The semipermeable membrane frame is fixedly arranged inside the flow guide frame and is adjacent to the through grooves on both sides. The plate frame is fixedly connected inside the semipermeable membrane frame. The hygroscopic gel plate is arranged on both sides of the plate frame and is located inside the semipermeable membrane frame.

[0008] As a preferred solution of the present invention, a plurality of second air inlets are provided on the side surface of the lower bracket, a plurality of second air outlets are provided on the top surface of the lower bracket, and the second air outlets are communicated with the first air inlets.

[0009] As a preferred solution of the present invention, a plurality of third air inlets are provided on the bottom surface of the upper bracket, the third air inlets are communicated with the corresponding first air outlets, and a plurality of third air outlets are provided on the top surface of the upper bracket.

[0010] As a preferred solution of the present invention, the moisture absorption structure further comprises a heat-conducting slider slidably connected to the interior of the semi-permeable membrane frame, and the heat-conducting slider is located in the first air channel.

[0011] As a preferred solution of the present invention, the area of ​​the first air inlet is smaller than the bottom area of ​​the thermally conductive slider, and after the hygroscopic gel plate absorbs water and expands, the thermally conductive slider moves toward the blocking plate and makes the blocking plate fit the inner wall of the first air channel.

[0012] As a preferred solution of the present invention, the top surface and the bottom surface of the winding frame are fixedly connected with symmetrical fixing blocks, and the fixing blocks abut against two sides of the magnetic core.

[0013] As a preferred solution of the present invention, one end of the return torsion spring is fixedly connected to the blocking plate, and the other end thereof is fixedly connected to the inner wall of the guide frame.

[0014] As a preferred solution of the present invention, a plurality of pins are fixedly connected to the bottom end of the winding frame, and insulating tape is wrapped and adhered to the outer surfaces of the two magnetic cores.

[0015] The beneficial effects of the present invention are as follows:

[0016] 1. In the present invention, by setting the hygroscopic gel plate with a hygroscopic structure, during the daily use of the electronic equipment, the moisture absorbed by the hygroscopic gel plate will prevent the micro-electronic transformer from being located in an overly dry environment, thereby preventing the occurrence of electrostatic discharge (ESD) and preventing the insulation layer and semiconductor components of the transformer from being damaged; secondly, when the humidity of the surrounding environment rises, the hygroscopic gel plate continues to absorb moisture and expand. Since only the direction toward the first airway is in a non-closed state, the expansion of the hygroscopic gel plate will push the thermal conductive slider to move toward the blocking plate, thereby making the blocking plate fit against the inner wall of the guide frame. At this time, the bottom of the thermal conductive slider covers the first air inlet, preventing humid air from flowing in the guide frame and corroding the first airway and the second airway, and preventing the guide frame from breaking after long-term corrosion.

[0017] 2. Finally, after the thermally conductive slider closes the first air channel, there is no airflow inside the first air channel and the second air channel, so the coil loses heat dissipation. At this time, the temperature of the coil rises, causing the coil to dissipate heat outward, and the water in the hygroscopic gel plate evaporates through the transfer of heat through the guide frame, the blocking plate and the thermally conductive slider. When the ambient humidity is normal at this time, the hygroscopic gel plate shrinks due to lack of water. At this time, the blocking plate reopens to the outside under the drive of the reset torsion spring, which pushes the thermally conductive slider to reset, so that the hygroscopic structure is reset. At this time, the first air channel is reopened to dissipate heat to the coil through airflow. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 It is a schematic diagram of the fixing structure of the present invention;

[0020] Figure 3 It is an overall schematic diagram of the diversion structure of the present invention;

[0021] Figure 4 It is a schematic diagram of the flow guide structure of the present invention;

[0022] Figure 5 This is a schematic diagram of the lower support structure of the present invention;

[0023] Figure 6 It is a schematic diagram of the cross-sectional structure of the upper bracket of the present invention;

[0024] Figure 7 It is a schematic diagram of the cross-sectional structure of the guide frame of the present invention;

[0025] Figure 8 For the present invention Figure 7 Enlarged view of point A in the middle;

[0026] Fig. 9 It is a schematic diagram of the separation of the hygroscopic structure of the present invention.

[0027] In the figure: 1. bracket structure; 11. winding frame; 12. coil; 13. pin; 14. fixing block; 2. fixing structure; 21. magnetic core; 22. insulating tape; 3. flow guide structure; 31. lower bracket; 32. upper bracket; 33. flow guide frame; 34. through groove; 35. first air inlet; 36. first air outlet; 37. second air inlet; 38. second air outlet; 39. third air inlet; 310. third air outlet; 311. first air duct; 312. second air duct; 313. blocking plate; 314. reset torsion spring; 4. hygroscopic structure; 41. semipermeable membrane frame; 42. plate frame; 43. hygroscopic gel plate; 44. thermal conductive slider. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] like Figures 1 to 9 As shown, an embodiment of the present invention provides a micro electronic transformer with high stability, including a support structure 1 and a fixed structure 2, the support structure 1 includes a winding frame 11, the fixed structure 2 includes a magnetic core 21 fixedly mounted at both ends of the winding frame 11, a coil 12 is wound on the winding frame 11, and further includes:

[0030] The guide structure 3 includes a lower bracket 31 and an upper bracket 32. The lower bracket 31 and the upper bracket 32 ​​are fixedly sleeved on the outer side of the coil 12. A plurality of guide frames 33 are fixedly connected between the lower bracket 31 and the upper bracket 32. One side of the guide frame 33 abuts against the outer side of the coil 12. A plurality of through grooves 34 are provided on the side of the guide frame 33. A plurality of first air channels 311 and second air channels 312 are vertically provided inside the guide frame 33. The bottom surface of the guide frame 33 A plurality of first air inlets 35 are provided, and a plurality of first air outlets 36 are provided on the top surface of the air guide frame 33. The first air inlets 35 are communicated with the first air passage 311, and the first air outlets 36 are communicated with the second air passage 312. The second air passage 312 is communicated with the first air passages 311 adjacent to the two sides. A plurality of blocking plates 313 are hingedly connected in the first air passage 311, and a return torsion spring 314 is sleeved on the hinge shaft of the blocking plate 313 to keep the blocking plate 313 in an outwardly tilted state.

[0031] The hygroscopic structure 4 includes a semipermeable membrane frame 41, a plate frame 42 and a hygroscopic gel plate 43. The semipermeable membrane frame 41 is fixedly arranged inside the flow guide frame 33 and is adjacent to the through groove 34 on both sides. The plate frame 42 is fixedly connected in the semipermeable membrane frame 41. The hygroscopic gel plate 43 is arranged on both sides of the plate frame 42 and is located in the semipermeable membrane frame 41.

[0032] In the present invention, by setting the hygroscopic gel plate 43 of the hygroscopic structure 4, during the daily use of the electronic device, the moisture absorbed by the hygroscopic gel plate 43 will prevent the micro-electronic transformer from being located in an overly dry environment, thereby preventing the occurrence of electrostatic discharge (ESD) and preventing the insulation layer and semiconductor components of the transformer from being damaged; secondly, when the humidity of the surrounding environment rises, the hygroscopic gel plate 43 continues to absorb moisture and expand. Since only the direction toward the first air channel 311 is in a non-closed state, the expansion of the hygroscopic gel plate 43 will push the thermal conductive slider 44 to move toward the blocking plate 313, thereby making the blocking plate 313 fit the inner wall of the guide frame 33. At this time, the bottom of the thermal conductive slider 44 covers the first air inlet 35, preventing humid air from flowing in the guide frame 33 and corroding the first air channel 311 and the second air channel 312, thereby preventing the guide frame 33 from breaking after long-term corrosion.

[0033] Finally, after the thermally conductive slider 44 closes the first air channel 311, there is no airflow inside the first air channel 311 and the second air channel 312, so that the coil 12 loses heat dissipation. At this time, the temperature of the coil 12 increases, causing the coil 12 to dissipate heat outward, and the moisture in the hygroscopic gel plate 43 is evaporated through the transfer of heat through the guide frame 33, the blocking plate 313 and the thermally conductive slider 44. When the ambient humidity is normal at this time, the hygroscopic gel plate 43 shrinks due to lack of moisture. At this time, the blocking plate 313 is reopened to the outside under the drive of the reset torsion spring 314, which pushes the thermally conductive slider 44 to reset, so that the hygroscopic structure 4 is reset. At this time, the first air channel 311 is reopened, and the coil 12 is cooled by airflow.

[0034] like Figure 5 and Figure 6 As shown, a plurality of second air inlets 37 are provided on the side of the lower bracket 31, a plurality of second air outlets 38 are provided on the top surface of the lower bracket 31, and the second air outlets 38 are communicated with the first air inlet 35, a plurality of third air inlets 39 are provided on the bottom surface of the upper bracket 32, and the third air inlets 39 are communicated with the corresponding first air outlets 36, and a plurality of third air outlets 310 are provided on the top surface of the upper bracket 32.

[0035] During daily use of the electronic device, the operation of the device's cooling fan will generate airflow inside the device. As the cooling fan continues to work, the airflow enters the lower bracket 31 from the second air inlet 37, and leaves from the second air outlet 38 and enters the first air duct 311. At this time, the blocking plate 313 blocks the airflow and moves it to the second air duct 312 connected to the first air duct 311. Driven by the airflow, the heat of the coil 12 adjacent to the guide frame 33 is taken away. Then, the hot air flows away from the first air outlet 36 and enters the upper bracket 32 ​​from the third air inlet 39, and finally leaves from the third air outlet 310 on the upper bracket 32, completing the heat dissipation of the coil 12.

[0036] like Figures 7 to 9 As shown, the hygroscopic structure 4 also includes a heat-conducting slider 44 slidably connected to the inside of the semi-permeable membrane frame 41, the heat-conducting slider 44 is located in the first air channel 311, the area of ​​the first air inlet 35 is smaller than the bottom area of ​​the heat-conducting slider 44, and after the hygroscopic gel plate 43 absorbs water and expands, the heat-conducting slider 44 moves toward the blocking plate 313 and makes the blocking plate 313 fit the inner wall of the first air channel 311.

[0037] When there is no hygroscopic structure 4 in the guide frame 33, the through groove 34 is connected to the first air channel 311, and the semi-permeable membrane frame 41 is provided to block the two. The thermal conductive slider 44 is provided to close the first air inlet 35 when the ambient humidity is too high. When the ambient humidity decreases, the temperature rise of the coil 12 will heat the hygroscopic gel plate 43 through the transfer of the thermal conductive slider 44, so that the moisture in the hygroscopic gel plate 43 evaporates, thereby cooling the coil 12. At the same time, the hygroscopic gel plate 43 shrinks and recovers after losing this part of the moisture.

[0038] like Figure 2 As shown, the top and bottom surfaces of the winding frame 11 are fixedly connected with symmetrical fixing blocks 14, which abut against both sides of the magnetic core 21. The setting of the fixing blocks 14 serves to improve the stability of the overall structure when assembling the magnetic core 21 and winding the insulating tape 22.

[0039] like Figure 8 As shown, one end of the return torsion spring 314 is fixedly connected to the blocking plate 313 , and the other end thereof is fixedly connected to the inner wall of the guide frame 33 .

[0040] As can be seen from the figure, the baffle plate 313 located at the bottom is located above the connecting port below the first air duct 311 and the second air duct 312, and the baffle plate 313 located at the top is located above the connecting port above the first air duct 311 and the second air duct 312. When the airflow enters the first air duct 311 from the first air inlet 35 below, most of the airflow will enter the second air duct 312 as it is blocked by the baffle plate 313, and the remaining airflow continues to rise. After being blocked by multiple baffle plates 313, the airflow speed decreases. At this time, the high-speed airflow in the second air duct 312 will drive the above-mentioned airflow to leave together, and the connecting port arranged obliquely upward prevents the airflow from entering the first air duct 311 from the second air duct 312.

[0041] like Figure 1 , Figure 2 As shown, a plurality of pins 13 are fixedly connected to the bottom end of the winding frame 11 , and an insulating tape 22 is wrapped and adhered to the outer surfaces of the two magnetic cores 21 .

[0042] Working principle:

[0043] During daily use of the present invention, as the cooling fan of the device rotates, the airflow passes through the device of the present invention and enters the lower bracket 31 from the second air inlet 37 of the lower bracket 31. As the airflow flows, the airflow leaves the lower bracket 31 from the second air outlet 38 and enters the first air duct 311 from the first air inlet 35. At this time, part of the airflow will move to the second air duct 312 next to it due to the obstruction of the blocking plate 313, while the remaining airflow will continue to move upward. Under the obstruction of the remaining blocking plate 313 above, the speed of this part of the airflow is reduced and it is driven by the second air duct 312 to enter the second air duct 312 from the upper connecting port. At this time, the airflow leaves the guide frame 33 from the first air outlet 36 and enters the upper bracket 32 ​​from the third air inlet 39. At the same time, the heat generated by the coil 12 during operation is also taken away by the airflow, thereby reducing the heat generated by the coil 12 during operation. As the airflow continues to flow, the hot airflow leaves the upper bracket 32 ​​from the third air outlet 310 and is finally driven by the airflow generated by the cooling fan to move outside the device.

[0044] When the humidity of the environment around the device suddenly increases, such as due to weather problems such as rain, the humidity inside the device will also increase. Usually, chip electronic components are set near the micro-electronic transformer. These electronic components are usually packaged and reinforced with materials such as epoxy resin so that they will not come into contact with moisture. At this time, moisture will move toward the micro-electronic transformer. As the moisture arrives, the water molecules in the moisture are captured by the hygroscopic gel plate 43, causing the hygroscopic gel plate 43 to become damp and expand. Due to the setting of the semi-permeable membrane frame 41 and the plate frame 42, the hygroscopic gel plate 43 can only expand in the direction of the heat-conducting slider 44 and push the heat-conducting slider 44. At this time, the movement of the heat-conducting slider 44 will push the blocking plate 313 to stick to the inner wall of the first airway 311. At the same time, the movement of the heat-conducting slider 44 will also close the first air inlet 35, making the outside The humid air cannot enter the first air passage 311. At this time, the temperature of the coil 12 rises due to the loss of the heat dissipation effect of the airflow. At this time, under the heat conduction of the blocking plate 313 and the thermally conductive slider 44, the heat is conducted to the hygroscopic gel plate 43, causing the moisture in the hygroscopic gel plate 43 to evaporate. When the ambient humidity returns to normal, as the moisture in the hygroscopic gel plate 43 returns to its initial state, it no longer squeezes and pushes the thermally conductive slider 44. At this time, the reset torsion spring 314 is reset, causing one end of the blocking plate 313 to rise again. As the blocking plate 313 rises, it pushes the thermally conductive slider 44 to reset, causing the hygroscopic structure 4 to reset. At the same time, the blocking plate 313 is also reset at this time, so that the entire present invention is reset.

[0045] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0046] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A micro electronic transformer with high stability, comprising a support structure (1) and a fixing structure (2), wherein the support structure (1) comprises a winding frame (11), the fixing structure (2) comprises a magnetic core (21) fixedly mounted at two ends of the winding frame (11), and a coil (12) is wound on the winding frame (11), characterized in that: Also includes: A flow guide structure (3), comprising a lower bracket (31) and an upper bracket (32), wherein the lower bracket (31) and the upper bracket (32) are both fixedly sleeved on the outer side surface of the coil (12), a plurality of flow guide frames (33) are fixedly connected between the lower bracket (31) and the upper bracket (32), one side of the flow guide frame (33) abuts against the outer side surface of the coil (12), a plurality of through grooves (34) are provided on the side surface of the flow guide frame (33), a plurality of first air passages (311) and second air passages (312) are vertically provided inside the flow guide frame (33), and the flow guide frame (33) ) is provided with a plurality of first air inlets (35) on its bottom surface, and a plurality of first air outlets (36) are provided on its top surface, wherein the first air inlets (35) are in communication with the first air passage (311), the first air outlets (36) are in communication with the second air passage (312), the second air passage (312) is in communication with the first air passages (311) adjacent to each other on both sides, and the first air passage (311) is hinged with a plurality of blocking plates (313), and the hinge shafts of the blocking plates (313) are sleeved with return torsion springs (314) to keep the blocking plates (313) in an outwardly tilted state; A moisture absorption structure (4), the moisture absorption structure (4) comprising a semipermeable membrane frame (41), a plate frame (42) and a moisture absorption gel plate (43), the semipermeable membrane frame (41) being fixedly arranged inside the flow guide frame (33) and adjacent to the through groove (34) on both sides, the plate frame (42) being fixedly connected inside the semipermeable membrane frame (41), and the moisture absorption gel plate (43) being arranged on both sides of the plate frame (42) and located inside the semipermeable membrane frame (41); The moisture absorbing structure (4) further comprises a heat-conducting slider (44) slidably connected to the interior of the semi-permeable membrane frame (41), and the heat-conducting slider (44) is located in the first air channel (311); The area of ​​the first air inlet (35) is smaller than the bottom area of ​​the heat-conducting slider (44); after the moisture-absorbing gel plate (43) absorbs moisture and expands, the heat-conducting slider (44) moves toward the blocking plate (313) and makes the blocking plate (313) fit the inner wall of the first air channel (311).

2. A micro electronic transformer with high stability according to claim 1, characterized in that: A plurality of second air inlets (37) are provided on the side surface of the lower bracket (31), and a plurality of second air outlets (38) are provided on the top surface of the lower bracket (31), wherein the second air outlets (38) are in communication with the first air inlets (35).

3. A micro electronic transformer with high stability according to claim 2, characterized in that: The bottom surface of the upper bracket (32) is provided with a plurality of third air inlets (39), the third air inlets (39) are communicated with the corresponding first air outlets (36), and the top surface of the upper bracket (32) is provided with a plurality of third air outlets (310).

4. A micro electronic transformer with high stability according to claim 3, characterized in that: Symmetrical fixing blocks (14) are fixedly connected to the top and bottom surfaces of the winding frame (11), and the fixing blocks (14) abut against two sides of the magnetic core (21).

5. A micro electronic transformer with high stability according to claim 4, characterized in that: One end of the return torsion spring (314) is fixedly connected to the blocking plate (313), and the other end of the return torsion spring (314) is fixedly connected to the inner wall of the guide frame (33).

6. A micro electronic transformer with high stability according to claim 1, characterized in that: A plurality of pins (13) are fixedly connected to the bottom end of the winding frame (11), and insulating tape (22) is wound and adhered to the outer surfaces of the two magnetic cores (21).

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