Power module, method for manufacturing power module, and power conversion device

Abstract

The power module includes: a semiconductor chip; a lead frame on one surface of which the semiconductor chip is mounted; a module base having one surface on which the lead frame is disposed; a main terminal which is a part of the lead frame; a molded part that encapsulates the semiconductor chip, the lead frame, and the module base such that the main terminal is exposed; a heat sink having a base portion integrated with the other surface of the module base exposed from the molding portion, and a plurality of heat dissipation fins protruding toward the opposite side of the base portion from the module base; a bus bar connected to a first main surface of the main terminal or a second main surface on the opposite side to the first main surface; and a terminal block fixed to the base portion of the heat sink and disposed between the main terminal or the bus bar and the base portion, the second main surface of the main terminal facing the heat sink, and the first main surface of the main terminal facing the opposite side of the heat sink.

Description

Technical Field

[0001] The present invention relates to a power module, a method for manufacturing the power module and a power conversion device. Background Art

[0002] For example, Patent Document 1 discloses a heat sink integrated power module having a power module portion, a fin base, and heat dissipation fins. The power module portion has a module base, a power semiconductor element mounted on the module base, and a molded resin for encapsulating the power semiconductor element. The fin base has a heat dissipation diffusion portion on which the heat dissipation fins are mounted, and a base portion formed on the heat dissipation diffusion portion and joined to the module base. The module base is provided with a first concave-convex portion, and the base portion is provided with a second concave-convex portion that fits with the first concave-convex portion.

[0003] Patent Document 1: Japanese Patent No. 675904 Summary of the invention

[0004] If the current flowing through the power module increases, the current flowing through the main terminal also increases, so the temperature rise of the main terminal increases. In order to suppress the temperature rise of the main terminal, a method of connecting a bus bar (external terminal) to the main terminal is generally widely used.

[0005] However, the technology described in Patent Document 1 does not have a structure for connecting the bus bar to the main terminal, so there is a concern that the temperature rise of the main terminal may increase.

[0006] Therefore, an object of the present invention is to provide a technology capable of suppressing a temperature rise of a main terminal by connecting an external terminal to a main terminal in a heat sink integrated power module.

[0007] The power module of the present invention comprises: a semiconductor element; a frame, one surface of which the semiconductor element is mounted; a module base, one surface of which the frame is arranged; a main terminal, which is a part of the frame; a molded portion, which encapsulates the semiconductor element, the frame and the module base in a manner in which the main terminal is exposed; a heat sink, which has a base portion and a plurality of heat dissipation fins, the base portion being integrated with the other surface of the module base exposed from the molded portion, and the plurality of heat dissipation fins protruding to the side of the base portion opposite to the module base; an external terminal, which is connected to a first main surface of the main terminal or a second main surface on the opposite side to the first main surface; and a displacement control structural member, which is fixed to the base portion of the heat sink and is arranged between the main terminal or the external terminal and the base portion, the second main surface of the main terminal being opposite to the heat sink, and the first main surface of the main terminal being facing the opposite side to the heat sink.

[0008] Effects of the Invention

[0009] According to the present invention, since it is not necessary to perform terminal forming processing on the first main surface and the second main surface of the main terminal, the area of ​​the first main surface and the second main surface can be increased. Therefore, in a heat sink integrated power module, an external terminal can be connected to the main terminal, so that the temperature rise of the main terminal can be suppressed.

[0010] The objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a cross-sectional view of the power module according to the first embodiment.

[0012] Figure 2 This is a plan view of the power module according to the first embodiment.

[0013] Figure 3 It is a top view of a power module according to a modification of the first embodiment.

[0014] Figure 4 This is a cross-sectional view showing the connection between a main terminal and a bus bar included in a power module according to a modification of the first embodiment.

[0015] Figure 5 It is a top view of a power module according to a modification of the first embodiment.

[0016] Figure 6 It is a top view of a power module according to a modification of the first embodiment.

[0017] Figure 7 This is a cross-sectional view showing a connection between a main terminal and a bus bar included in a power module according to a modification of the first embodiment, which is achieved by screw fastening.

[0018] Figure 8 This is a plan view showing connection between a main terminal and a bus bar included in a power module according to a modification of the first embodiment, which is achieved by screw fastening.

[0019] Fig. 9 This is a cross-sectional view showing connection by screw fastening between a main terminal included in a power module according to a modification of the first embodiment and a bus bar with a nut.

[0020] Fig.10 This is a cross-sectional view showing connection between a nut-equipped main terminal included in a power module according to a modification of the first embodiment and a bus bar by screw fastening.

[0021] Fig.11This is a cross-sectional view showing connection by screw fastening between a main terminal provided with an auxiliary member for screw fastening and a bus bar included in a power module according to a modification of the first embodiment.

[0022] Fig.12 It is a cross-sectional view showing the positional relationship between a main terminal and an auxiliary screw-fastening member included in a power module according to a modification of the first embodiment.

[0023] Fig.13 It is a cross-sectional view showing the positional relationship between a main terminal included in a power module according to a modification of the first embodiment and an auxiliary screw-fastening member having an elastic function.

[0024] Fig.14 This is a cross-sectional view showing connection by soldering between a main terminal and a bus bar included in a power module according to a modification of the first embodiment.

[0025] Fig.15 This is a cross-sectional view showing connection by welding between a main terminal and a bus bar included in a power module according to a modification of the first embodiment.

[0026] Fig.16 This is a cross-sectional view showing connection by crimping between a main terminal and a bus bar included in a power module according to a modification of the first embodiment.

[0027] Fig.17 This is a cross-sectional view of a power module according to a modification of the first embodiment.

[0028] Fig.18 This is a cross-sectional view of a power module according to a modification of the first embodiment.

[0029] Fig.19 This is a cross-sectional view of a power module according to a modification of the first embodiment.

[0030] Fig. 20 This is a cross-sectional view of a power module according to Embodiment 2.

[0031] Fig.21 It is a top view of a power module according to Embodiment 2.

[0032] Fig. 22 This is a cross-sectional view showing the connection between a terminal block and a heat sink provided in a power module according to the second embodiment by screw fastening.

[0033] Fig.23 This is a cross-sectional view showing connection between a terminal block and a heat sink provided in a power module according to a modification of the second embodiment by soldering.

[0034] Fig.24This is a cross-sectional view showing connection by welding between a terminal block and a heat sink included in a power module according to a modification of the second embodiment.

[0035] Fig.25 This is a cross-sectional view showing connection between a terminal block and a heat sink included in a power module according to a modification of the second embodiment by crimping.

[0036] Fig.26 This is a cross-sectional view showing connection between a main terminal and a bus bar included in a power module according to a modification of the second embodiment, which is achieved by screw fastening.

[0037] Fig. 27 This is a cross-sectional view showing connection by soldering between a main terminal and a bus bar included in a power module according to a modification of the second embodiment.

[0038] Fig.28 This is a cross-sectional view showing connection by welding between a main terminal and a bus bar included in a power module according to a modification of the second embodiment.

[0039] Fig.29 This is a cross-sectional view showing connection by crimping between a main terminal and a bus bar included in a power module according to a modification of the second embodiment.

[0040] Fig.30 1 is a cross-sectional view showing a connection between a main terminal with a nut or a bus bar with a nut and a bus bar by screw fastening, which is included in a power module according to a modification of the second embodiment.

[0041] Fig.31 It is a cross-sectional view showing the arrangement of a terminal block having a positioning structure included in a power module according to a modification of the second embodiment.

[0042] Fig.32 It is a cross-sectional view, a side view, and a plan view showing the arrangement of a terminal block having a positioning structure included in a power module according to a modification of the second embodiment.

[0043] Fig.33 It is a cross-sectional view showing a gap between a main terminal and a terminal block included in a power module according to a modification of the second embodiment.

[0044] Fig.34 This is a cross-sectional view showing connection between a main terminal and a bus bar by screw fastening when a gap exists between a main terminal and a terminal block included in a power module according to a modification of the second embodiment.

[0045] Fig.35It is a cross-sectional view showing a gap between a main terminal and a terminal block when a terminal block with a spring function included in a power module according to a modification of the second embodiment is used.

[0046] Fig.36 This is a cross-sectional view showing the connection between the main terminal, the bus bar, and the terminal block included in the power module according to the third embodiment by screw fastening.

[0047] Fig.37 This is a cross-sectional view showing the connection of a main terminal, a bus bar, and a terminal block included in a power module according to a third embodiment by soldering.

[0048] Fig.38 This is a cross-sectional view showing the connection of a main terminal, a bus bar, and a terminal block included in a power module according to a third embodiment by welding.

[0049] Fig.39 This is a cross-sectional view showing the connection by crimping of a main terminal, a bus bar, and a terminal block included in a power module according to a third embodiment.

[0050] Fig.40 1 is a cross-sectional view showing a terminal block having a nut-slip-off preventing metal member included in a power module according to a third embodiment.

[0051] Fig.41 This is a cross-sectional view showing a state of a power module according to Embodiment 3 when a product is used.

[0052] Fig.42 This is a cross-sectional view showing a normal power module when the product is in use.

[0053] Fig.43 It is a cross-sectional view showing a gap between a main terminal and a terminal block included in a power module according to a third embodiment.

[0054] Fig.44 This is a cross-sectional view showing connection of a main terminal, a bus bar, and a terminal block by screw fastening when a gap exists between the main terminal and the terminal block included in the power module according to the third embodiment.

[0055] Fig.45 It is a cross-sectional view showing a gap between a main terminal and a terminal block when a terminal block with a spring function included in a power module according to the third embodiment is used.

[0056] Fig.46 It is a block diagram showing the configuration of a power conversion system to which the power conversion device according to the fourth embodiment is applied. DETAILED DESCRIPTION

[0057] <Implementation Method 1>

[0058] Next, Embodiment 1 will be described with reference to the drawings. Figure 1 It is a cross-sectional view of the power module 202 according to the first embodiment. Figure 2 1 is a plan view of the power module 202 according to the first embodiment.

[0059] like Figure 1 and Figure 2 As shown, the power module 202 is a heat sink integrated power module, which includes a power module unit 9 and a heat sink 13. The power module unit 9 includes a plurality of semiconductor chips 1

[0060] (semiconductor element), lead frame 3 (frame), insulating sheet 4, module base 5, molded portion 8, and a plurality of bus bars 10 (external terminals).

[0061] A plurality of semiconductor chips 1 are mounted on the upper surface (one surface) of the lead frame 3. The lead frame 3 is arranged via an insulating sheet 4 adhered to the upper surface (one surface) of the module base 5. The molded portion 8 is made of a molded resin, and the semiconductor chips 1, the lead frame 3, the insulating sheet 4, and the module base 5 are packaged in such a manner that a part of the lead frame 3, namely, the main terminal 7 and the lower surface (the other surface) of the module base 5 are exposed.

[0062] The heat sink 13 has: a base portion 11, which is integrated with the lower surface (the other surface) of the module base 5; and a plurality of heat dissipation fins 12, which protrude below the base portion 11 (the opposite side of the module base 5). A plurality of concave fitting portions 5a are provided on the lower surface (the other surface) of the module base 5. In addition, a plurality of convex fitting portions 11a that can fit with the fitting portions 5a are provided on the upper surface (the surface on the module base 5 side) of the base portion 11 other than the outer peripheral portion. The module base 5 and the heat sink 13 are integrated by fitting the fitting portions 5a and the fitting portions 11a. The fitting portions 5a and the fitting portions 11a can be respectively provided continuously or intermittently along the depth direction of the module base 5 and the base portion 11.

[0063] Furthermore, by performing molding for forming terminals after the molding, the control terminals 6 and the main terminals 7 are formed as a part of the lead frame 3. However, the molding for forming the terminals is not essential and may be omitted.

[0064] Next, the main terminal 7 and the control terminal 6 are described. The main terminal 7 and the control terminal 6 are part of the lead frame 3, and are connected to the semiconductor chip 1 inside the molded portion 8 through a wiring component such as an aluminum wire (not shown). However, the wiring component does not necessarily have to be an aluminum wire, and for example, an electrical connection can be made through a metal wire such as a copper wire or a metal plate using a bonding component such as solder. The main terminal 7 and the control terminal 6 are integrated by molding in a state where they are exposed from the molded portion 8.

[0065] A plurality of (4) main terminals 7 extend in a direction parallel to the base portion 11 of the heat sink 13, that is, in the left-right direction (first direction), and are exposed from the mold portion 8. Specifically, two main terminals 7 are formed in a straight line so as to extend from the left end of the mold portion 8 to the left, and the remaining two main terminals 7 are formed in a straight line so as to extend from the right end of the mold portion 8 to the right. The second main surface (lower surface) of the main terminal 7 on the opposite side to the first main surface (upper surface) faces the heat sink 13, and the first main surface (upper surface) of the main terminal 7 faces the opposite side (upper side) to the heat sink 13.

[0066] Here, when the current flowing through the power module is large, from the viewpoint of current density, the thickness of the lead frame 3 including the main terminal 7 and the control terminal 6 is often increased. Therefore, if the thick lead frame 3 is intended to be bent by terminal forming processing, the tonnage of the press machine becomes large, and there is a concern that the equipment will be enlarged and the productivity will be reduced.

[0067] In the first embodiment, as described above, the second main surface (lower surface) of the main terminal 7 opposite to the first main surface (upper surface) faces the heat sink 13, and the first main surface (upper surface) of the main terminal 7 faces the opposite side (upper side) of the heat sink 13. That is, the main terminal 7 with a large terminal cross-sectional area is formed in a manner extending in the horizontal direction relative to the molded portion 8, thereby eliminating the need to perform terminal forming processing on the first and second main surfaces of the main terminal 7, thereby increasing the area of ​​the first and second main surfaces. In addition, since only the control terminal 6 with a small terminal cross-sectional area is subjected to terminal forming processing as needed, it is not necessary to enlarge the equipment, thereby improving productivity.

[0068] In addition, by connecting the busbar 10 to the main terminal 7, it is not necessary to extend the length of the main terminal 7 from the viewpoint of heat dissipation, and the length of the main terminal 7 can be shortened. In accordance with the shortening of the length of the main terminal 7, the area of ​​the lead frame 3 including the main terminal 7 can be reduced. As a result, a large number of lead frame 3 shapes can be taken out from one lead frame (large-scale acquisition), and productivity can be improved. Alternatively, in accordance with the shortening of the length of the main terminal 7, the area of ​​the lead frame 3 including the main terminal 7 remains unchanged, and the area of ​​the lead frame 3 inside the power module 202 can be increased. As a result, the design freedom of the configuration of the semiconductor chip 1 and the electrical wiring is improved, and heat dissipation can be improved.

[0069] <Variation of Implementation Example 1>

[0070] Next, a modification of the first embodiment will be described. Figure 3 (a) and (b) are plan views of a power module 202 according to a modification of the first embodiment.

[0071] like Figure 3 As shown in (a), the main terminal 7 may be L-shaped when viewed from above. Figure 3 As shown in (b), the main terminal 7 may also be in a "U" shape when viewed from above. However, the shape of the main terminal 7 is not limited thereto and can be freely designed. By setting it to such a shape, the stress applied to the interface between the main terminal 7 and the molded portion 8 when the main terminal 7 is connected to the bus bar 10 can be reduced. In addition, the stress applied to the interface between the main terminal 7 and the molded portion 8 when vibration is generated during use of the product can also be reduced, thereby improving the vibration resistance of the product.

[0072] Figure 4 2 is a cross-sectional view showing the connection between the main terminal 7 and the bus bar 10 of the power module 202 according to the modification of the first embodiment. Figure 4 As shown in FIG. 1 , the main terminal 7 may also be in a crank shape when viewed in cross section. Specifically, the main terminal 7 includes: a first parallel portion 7a that is exposed from the mold portion 8 in a first direction that is parallel to the base portion 11 of the heat sink 13; a first vertical portion 7b that extends in a second direction that is a vertical direction from the first parallel portion 7a; and a second parallel portion 7c that extends in the first direction from the first vertical portion 7b. The bus bar 10 is connected to the first main surface of the second parallel portion 7c of the main terminal 7.

[0073] like Figure 4 As shown in FIG. 1 , by applying a bending process to the main terminal 7 during the terminal forming process, the bent portion has an elastic function, so that the stress applied to the interface between the main terminal 7 and the molded portion 8 when the main terminal 7 is connected to the bus bar 10 can be reduced. Similarly, the stress applied to the interface between the main terminal 7 and the molded portion 8 when vibration occurs during use of the product can also be reduced, thereby improving the vibration resistance of the product. In addition, although for Figure 4 The shape of the main terminal 7 shown requires bending, but since the second parallel portion 7 c extends in the horizontal direction, for example, one bus bar 10 having a large area can be connected to two main terminals 7 in a stable state.

[0074] Here, if Figure 2 As shown, the power module 202 according to the first embodiment has a structure in which the main terminals 7 are arranged on two sides of the molded portion 8 and the control terminals 6 are arranged on the other two sides in a plan view. However, the arrangement of the main terminals 7 and the control terminals 6 is not limited to this. Figure 5 and Figure 6 FIG. 2 is a top view of a power module 202 according to a modification of Embodiment 1. Figure 5 As shown, a main terminal 7 is arranged on one side, and a control terminal 6 is arranged on the other two sides. Figure 6 As shown, the main terminal 7 and the control terminal 6 are mixedly arranged on one side, which can be designed freely. In this way, by arranging the main terminal 7 and the control terminal 6 on multiple sides of the power module 202, there is an advantage that the design freedom of the electrical wiring (for example, aluminum wire) inside the power module 202 becomes larger.

[0075] Figure 7 1 is a cross-sectional view showing connection between a main terminal 7 and a bus bar 10 included in a power module 202 according to a modification of the first embodiment by screw fastening. Figure 8 It is a plan view showing the connection between the main terminal 7 and the bus bar 10 included in the power module 202 according to the modification of the first embodiment by screw fastening.

[0076] like Figure 7 As shown in FIG. 1 , the method of connecting the main terminal 7 and the bus bar 10 by screwing with a screw 14 and a nut 15 can achieve the connection most simply and efficiently. The screwing is described below. Figure 8 As shown, a notch 7d is provided in the main terminal 7, and a notch 10a is provided in a portion corresponding to the notch 7d of the bus bar 10. With the shaft of the screw 14 inserted through the notch 10a and the notch 7d, a nut 15 is fastened to the shaft of the screw 14 to perform threaded fastening.

[0077] In addition, the bus bar 10 may be arranged on the upper side of the main terminal 7, the screw 14 may be arranged on the upper side of the bus bar 10, the nut 15 may be arranged on the lower side of the main terminal 7, and the connection may be made by screwing, or the bus bar 10 may be arranged on the lower side of the main terminal 7, the screw 14 may be arranged on the upper side of the main terminal 7, the nut 15 may be arranged on the lower side of the bus bar 10, and the connection may be made by screwing. In addition, although productivity is reduced, the screw 14 and the nut 15 can be replaced in each arrangement to perform screwing.

[0078] Fig. 9 1 is a cross-sectional view showing the connection between the main terminal 7 and the nut-carrying bus bar 16 of the power module 202 according to the modification of the first embodiment by screw fastening. Fig. 9 As shown, a nut-attached bus bar 16 in which a nut 15 is inserted into the bus bar 10 may be used, and the main terminal 7 and the nut-attached bus bar 16 may be connected by screwing.

[0079] Fig.101 is a cross-sectional view showing connection between a nut-attached main terminal 17 included in a power module 202 according to a modification of the first embodiment and a bus bar 10 by screw fastening. Fig.11 1 is a cross-sectional view showing connection by screw fastening between a main terminal 7 provided with an auxiliary screw fastening member 18 and a bus bar 10 included in a power module 202 according to a modification of the first embodiment.

[0080] Similarly, if Fig.10 As shown, a nut main terminal 17 with a nut 15 inserted into the main terminal 7 can also be used to connect to the bus bar 10 by screw fastening. In this case, the lead frame 3 with the nut 15 inserted into the main terminal 7 is used for molding. Alternatively, after molding, the nut 15 is inserted into the main terminal 7 after the terminal forming process. These methods can all connect the nut main terminal 17 with the bus bar 10 by screw fastening.

[0081] Furthermore, in the case where the main terminal 7 is formed so as to extend in the horizontal direction, when the main terminal 7 and the bus bar 10 are screwed together, as shown in FIG. Fig.11 As shown, by inserting the screw-fastening auxiliary member 18 , the main terminal 7 and the bus bar 10 can be connected by screw fastening with good productivity.

[0082] In addition, by configuring an auxiliary component 18 for threaded fastening, the main terminal 7 and the bus bar 10 are connected by threaded fastening, so that the displacement applied to the main terminal 7 during threaded fastening can be controlled, and the stress applied to the interface between the molded part 8 and the main terminal 7 during threaded fastening can be reduced. Therefore, there is also an advantage of being able to reduce the incidence of defects.

[0083] Fig.12 1 is a cross-sectional view showing the positional relationship between the main terminal 7 and the screw-fastening auxiliary member 18 included in the power module 202 according to the modification of the first embodiment. Fig.13 1 is a cross-sectional view showing the positional relationship between a main terminal 7 included in a power module 202 according to a modified example of the first embodiment and an auxiliary screw-fastening member 20 having an elastic function.

[0084] Here, due to the tolerance of each component and the warpage generated in the molded portion 8, as shown in FIG. Fig.12 As shown in FIG. 1 , the height relationship between the main terminal 7 and the screw-tightening auxiliary component 18 equipped with the nut 15 is not necessarily zero clearance. Fig.12As shown, a state in which there is a gap (displacement) between the main terminal 7 and the screw-fastening auxiliary component 18 or a state in which the main terminal 7 and the screw-fastening auxiliary component 18 interfere with each other is formed. When the displacement generated when the bus bar 10 is connected to the main terminal 7, that is, the gap between the main terminal 7 and the screw-fastening auxiliary component 18 is large, there is a concern that a large stress is applied to the interface between the molded portion 8 and the main terminal 7 during screw fastening, causing peeling and cracking at the interface. Therefore, it is preferable to reduce the gap between the main terminal 7 and the screw-fastening auxiliary component 18.

[0085] like Fig.13 As shown, if the screw-fastening auxiliary component 20 having an elastic function in which the elastic material 19 is arranged between the screw-fastening auxiliary component 18 and the base portion 11 is used, connection can be performed with further improved productivity and a large current can flow through the power module 202 .

[0086] Fig.14 1 is a cross-sectional view showing connection between a main terminal 7 and a bus bar 10 included in a power module 202 according to a modification of the first embodiment, using solder 2 . Fig.15 1 is a cross-sectional view showing connection by welding between a main terminal 7 and a bus bar 10 included in a power module 202 according to a modification of the first embodiment. Fig.16 1 is a cross-sectional view showing connection between a main terminal 7 and a bus bar 10 included in a power module 202 according to a modification of the first embodiment by crimping.

[0087] Here, the connection between the main terminal 7 and the bus bar 10 can be achieved not only by screw fastening, but also by Fig.14 The connection is achieved by a bonding material such as solder 2 as shown in the figure, Fig.15 The connection achieved by welding as shown, Fig.16 The busbar 10 and the main terminal 7 can be connected by any connection method such as the connection by crimping shown in the figure. Regardless of the connection method, sufficient connection strength can be obtained, the contact resistance and contact thermal resistance can be stably reduced, and the contact area between the busbar 10 and the main terminal 7 can be increased, so the temperature rise of the main terminal 7 when the product is used can be suppressed. Here, Fig.15 Reference numeral 22a denotes a welded portion.

[0088] In addition, a connection method that combines several connection methods, such as threaded fastening and crimping, may also be used. By combining the connection methods, the connection strength is further improved compared to the case where only any one method is used, the contact resistance and contact thermal resistance can be further stably reduced, and the contact area between the bus bar 10 and the main terminal 7 can be further increased, so that the temperature rise of the main terminal 7 when the product is used can be further suppressed.

[0089] <Other Modifications>

[0090] Figure 17 to Figure 19 FIG. 2 is a cross-sectional view of a power module 202 according to a modification of Embodiment 1. Figure 1 In the figure, as the heat sink 13, an example of a riveted heat sink in which a base portion 11 and a plurality of heat sink fins 12 are integrated by riveting is shown. The base portion 11 is processed by machining, die casting, forging, or extrusion, and is made of aluminum or an aluminum alloy. The heat sink fins 12 are made of a plate material such as aluminum or an aluminum alloy, so that both processability and heat dissipation can be achieved.

[0091] However, the base portion 11 and the heat dissipation fins 12 are not limited to aluminum materials, and each may also be a combination of different materials. For example, from the perspective of heat dissipation capacity, by setting the heat dissipation fins 12 to a copper plate material with a thermal conductivity greater than that of an aluminum material, the heat dissipation capacity can be further improved compared to the case of an aluminum material.

[0092] In addition, the heat sink 13 is not limited to a riveted heat sink, and may also be Fig.17 The extruded heat sink made by extrusion, the cut heat sink made by cutting or the forged heat sink made by forging as shown in the figure can also be Fig.18 A die-cast heat sink manufactured by die-casting as shown.

[0093] And, you can also Fig.19 As shown, the module base 5 and the heat sink 13 are integrated by a bonding material such as solder 2 and an adhesive. Alternatively, the module base 5 and the heat sink 13 may be integrated by combining a plurality of methods such as caulking and bonding materials.

[0094] In addition, the module base 5 is processed by machining, die casting, forging or extrusion, and is made of aluminum or aluminum alloy. However, the material of the module base 5 is not limited to aluminum, and by using a copper plate having a higher thermal conductivity than aluminum, the heat dissipation capacity is further improved compared to aluminum.

[0095] The semiconductor chip 1 may be made of silicon, or may be a wide-bandgap semiconductor such as silicon carbide or gallium nitride.

[0096] From the viewpoint of resistivity and workability, the lead frame 3 and the bus bar 10 are preferably made of a copper-based material or an aluminum-based material, but any material may be a metal material and is not limited thereto.

[0097] <Effect>

[0098] As described above, in embodiment 1, the power module 202 includes: a semiconductor chip 1; a lead frame 3, one surface of which is equipped with the semiconductor chip 1; a module base 5, one surface of which is configured with the lead frame 3; a main terminal 7, which is a part of the lead frame 3; a molded portion 8, which encapsulates the semiconductor chip 1, the lead frame 3 and the module base 5 in a manner in which the main terminal 7 is exposed; a heat sink 13, which is integrated with the other surface of the module base 5 exposed from the molded portion 8; and a bus bar 10, which is connected to the first main surface of the main terminal 7 or the second main surface on the opposite side of the first main surface, the second main surface of the main terminal 7 is opposite to the heat sink 13, and the first main surface of the main terminal 7 faces the opposite side of the heat sink 13.

[0099] The method for manufacturing the power module 202 includes a step (a) of connecting the bus bar 10 to the first main surface or the second main surface of the main terminal 7 by screwing, bonding, or crimping.

[0100] Therefore, it is not necessary to perform terminal forming processing on the first main surface and the second main surface of the main terminal 7, so the area of ​​the first main surface and the second main surface can be increased. As a result, in the heat sink integrated power module 202, the bus bar 10 can be connected to the main terminal 7, so the temperature rise of the main terminal 7 can be suppressed. As a result, a large current can flow through the power module 202.

[0101] Furthermore, since the bus bar 10 is connected to the first main surface or the second main surface of the main terminal 7 by the screw 14 and the nut 15 , the bus bar 10 can be connected to the main terminal 7 with high productivity by a simple method.

[0102] In addition, the heat sink 13 has: a base portion 11, which is integrated with the other side of the module base 5; and a plurality of heat dissipation fins 12, which protrude toward the side of the base portion 11 opposite to the module base 5, and the main terminal 7 extends in a direction parallel to the base portion 11 of the heat sink 13, i.e., in a first direction, and is exposed from the molded portion 8.

[0103] Therefore, it is not necessary to perform terminal forming processing on the first main surface and the second main surface of the main terminal 7, so the area of ​​the first main surface and the second main surface can be increased. In addition, since only the control terminal 6 with a small terminal cross-sectional area is subjected to terminal forming processing as needed, it is not necessary to enlarge the equipment, and the productivity of the power module is improved.

[0104] In addition, the main terminal 7 has: a first parallel portion 7a, which is exposed from the molded portion 8 in a first direction that is parallel to the base portion 11 of the heat sink 13; a first vertical portion 7b, which extends from the first parallel portion 7a in a vertical direction, that is, a second direction; and a second parallel portion 7c, which extends from the first vertical portion 7b in the first direction, and the bus bar 10 is connected to the second parallel portion 7c of the main terminal 7.

[0105] Therefore, the stress applied to the interface between the main terminal 7 and the molded portion 8 when the main terminal 7 is connected to the bus bar 10 can be reduced. Similarly, the stress applied to the interface between the main terminal 7 and the molded portion 8 when vibration occurs during product use can also be reduced, thereby improving the vibration resistance of the product.

[0106] In addition, a fitting portion 5a is provided on the other surface of the module base 5, and a fitted portion 11a that can be fitted with the fitting portion 5a is provided on the surface of the base portion 11 of the heat sink 13 on the module base 5 side. The module base 5 and the heat sink 13 are integrated by fitting the fitting portion 5a and the fitted portion 11a.

[0107] Therefore, integration of the process at room temperature can be achieved without increasing the size and complexity of the equipment, thereby improving productivity.

[0108] <Implementation Method 2>

[0109] Next, a power module 202 according to the second embodiment will be described. Fig. 20 It is a cross-sectional view of a power module 202 according to the second embodiment. Fig.21 It is a top view of a power module 202 according to Embodiment 2. In Embodiment 2, the same components as those described in Embodiment 1 are denoted by the same reference numerals, and the description thereof is omitted.

[0110] like Fig. 20 and Fig.21 As shown, in Embodiment 2, power module 202 further includes terminal block 25 (displacement control structural member) compared to Embodiment 1. Terminal block 25 is fixed to the outer periphery of base 11 of heat sink 13 and is disposed between main terminal 7 and base 11 .

[0111] Here, in Fig. 20 In the embodiment, the bus bar 10 is arranged on the upper side of the main terminal 7, and the terminal block 25 is arranged on the lower side of the main terminal 7, but it is not limited to this. The bus bar 10 may be arranged on the lower side of the main terminal 7, and the terminal block 25 may be arranged on the lower side of the bus bar 10. From the viewpoint of processability and insulation, the material of the terminal block 25 is composed of resin. However, it is not necessarily composed of resin, and it may be composed of metal material.

[0112] Next, connection between the terminal block 25 and the base portion 11 , and between the main terminal 7 and the bus bar 10 will be described. Fig. 22 1 is a cross-sectional view showing the connection between the terminal block 25 included in the power module 202 according to the second embodiment and the heat sink 13 by screw fastening. Fig.23 1 is a cross-sectional view showing connection between a terminal block 25 and a heat sink 13 provided in a power module 202 according to a modification of the second embodiment, using solder 2 . Fig.24This is a cross-sectional view showing the connection between the terminal block 25 and the heat sink 13 included in the power module 202 according to the modification of the second embodiment by welding. Fig.25 1 is a cross-sectional view showing connection between a terminal block 25 included in a power module 202 according to a modification of the second embodiment and a heat sink 13 by crimping. Fig.26 1 is a cross-sectional view showing connection between a main terminal 7 and a bus bar 10 included in a power module 202 according to a modification of the second embodiment by screw fastening. Fig. 27 1 is a cross-sectional view showing connection between main terminal 7 and bus bar 10 provided in power module 202 according to a modification of the second embodiment, using solder 2 . Fig.28 1 is a cross-sectional view showing connection by welding between a main terminal 7 and a bus bar 10 included in a power module 202 according to a modification of the second embodiment. Fig.29 1 is a cross-sectional view showing connection by crimping between a main terminal 7 and a bus bar 10 included in a power module 202 according to a modification of the second embodiment.

[0113] The terminal base 25 and the base portion 11 of the heat sink 13 can be fixed using Fig. 22 The connection achieved by threaded fastening as shown, Fig.23 The connection is achieved by a bonding material such as solder 2 as shown in the figure, Fig.24 A connection by welding as shown or Fig.25 The connection between the main terminal 7 and the bus bar 10 can be achieved by any connection method such as the connection by crimping shown in the figure. Fig.26 The connection achieved by threaded fastening as shown, Fig. 27 The connection is achieved by a bonding material such as solder 2 as shown in the figure, Fig.28 A connection by welding as shown or Fig.29 Any connection method such as connection by crimping as shown. Fig.24 and Fig.28 Reference numeral 22a indicates a welded portion. Fig.25 Reference numeral 22b denotes a crimping portion.

[0114] The power module 202 further has a terminal block 25, which can control the displacement applied to the main terminal 7, reduce the stress applied to the interface between the molded portion 8 and the main terminal 7, and thus reduce the defect rate in the process of connecting the bus bar 10 to the main terminal 7. In addition, when the product is used, the gap between the main terminal 7 or the bus bar 10 and the terminal block 25 can be controlled. As a result, the displacement during vibration can be reduced, so the stress applied to the interface between the molded portion 8 and the main terminal 7 can be reduced, and the vibration resistance of the product is improved.

[0115] Regarding the threaded fastening structure, Fig.26 As shown, by configuring a nut 15 on a terminal block 25 fixed to a base portion 11 of a heat sink 13, the bus bar 10 is connected to the main terminal 7, or by fixing a terminal block 25 configured with a nut 15 to the base portion 11, the bus bar 10 is connected to the main terminal 7, thereby being achieved with good productivity in a simple method.

[0116] Fig.30 (a) and (b) are cross-sectional views showing the connection between the main terminal 7 and the bus bar 10 by screw fastening using the main terminal 17 with a nut or the bus bar 16 with a nut of the power module 202 according to the modification of the second embodiment. Fig.30 As shown in (a), a space 25a for the nut 15 is provided in the terminal block 25, a main terminal 17 with a nut is used, and a bus bar 10 is arranged on the upper side of the main terminal 17 with a nut, and connected by screwing. Fig.30 As shown in (b), a space 25a for the nut 15 may be provided in the terminal block 25, a bus bar 16 with a nut may be used, the main terminal 7 may be arranged on the upper side of the bus bar 16 with a nut, and the connection may be performed by screwing.

[0117] Regarding the solder joint structure, Fig. 27 The structure shown in the figure can be realized with good productivity by a simple method. Fig.28 The simple method of welding or brazing as shown can be realized with good productivity.

[0118] Regarding the crimp connection structure, Fig.29 As shown in (a) and (b), a space 10b for crimping is provided in the bus bar 10, and pressure is applied from the bus bar 10 to the main terminal 7 formed in a manner corresponding to the shape of the space 10b, thereby connecting the bus bar 10 and the main terminal 7. This simple method can be achieved with good productivity. Fig.29 In (a), the space 10b is triangular in cross-section. Fig.29 In (b), the space 10b is trapezoidal in cross-section. Fig.29 In the embodiment, pressure is applied from the bus bar 10 to the main terminal 7 , but the present invention is not limited thereto. A space may be provided in the main terminal 7 , and pressure may be applied from the main terminal 7 to the bus bar 10 for crimping.

[0119] Fig.31 It is a cross-sectional view showing the arrangement of a terminal block 25 having a positioning structure included in a power module 202 according to a modification of the second embodiment.

[0120] like Fig.31As shown, by providing the base portion 11 of the heat sink 13 with the positioning groove 26a and providing the terminal block 25 with a convex positioning portion 26 that can fit into the groove 11b, the terminal block mounting process can be simplified and productivity can be improved.

[0121] Fig.32 (a) and (b) are cross-sectional views showing the arrangement of a terminal block 25 having a positioning structure in a power module 202 according to a modification of the second embodiment. Fig.32 (c) is a side view. In addition, Fig.32 (d) and (e) are plan views showing the arrangement of the terminal block 25 having the positioning structure included in the power module 202 according to the modification of the second embodiment.

[0122] The positioning portion 26 of the terminal block 25 is not limited to Fig.31 The structure shown, for example, is Fig.32 The structures shown in (a) to (e) can be any structure as long as the position of the terminal block 25 in at least one direction is determined. Fig.32 As shown in (a), a positioning groove 26a may be provided in the terminal block 25, and a positioning portion 26 having a T-shape in cross-section may be provided on the base portion 11. Alternatively, Fig.32 As shown in (b), the lower end of the terminal block 25 may be entirely provided as the positioning portion 26, and a groove 26a that can be engaged with the positioning portion 26 may be provided in the base portion 11. Fig.32 As shown in (c), two convex positioning portions 26 may be provided on the base portion 11, and two grooves 26a may be provided on the terminal base 25. Alternatively, Fig.32 As shown in (d), the positioning portion 26 provided on the base portion 11 may also be in the shape of two crosses connected in a plan view. Fig.32 As shown in (e), the two positioning parts 26 provided on the base part 11 may both be cylindrical.

[0123] Next, the gap between the main terminal 7 and the terminal block 25 will be described. Fig.33 It is a cross-sectional view showing a gap between a main terminal 7 and a terminal block 25 included in a power module 202 according to a modification of the second embodiment. Fig.34 This is a cross-sectional view showing connection between the main terminal 7 and the bus bar 10 by screw fastening when a gap exists between the main terminal 7 and the terminal block 25 included in the power module 202 according to the modification of the second embodiment. Fig.35 This is a cross-sectional view showing a gap between the main terminal 7 and the terminal block 25 when the terminal block 27 with a spring function included in the power module 202 according to the modification of the second embodiment is used.

[0124] Due to the tolerance of each component and the warpage in the molded part 8, Fig.33 As shown in FIG. 1 , the height relationship between the main terminal 7 and the terminal block 25 is not necessarily zero clearance. Fig.33 As shown in FIG. 1 , a gap (displacement) exists between the main terminal 7 and the terminal block 25, or the main terminal 7 and the terminal block 25 interfere with each other. When the displacement generated when the bus bar 10 is connected to the main terminal 7, that is, the gap between the main terminal 7 and the terminal block 25 is large, there is a concern that Fig.34 As shown, a large stress is applied to the interface between the molded portion 8 and the main terminal 7 during screw tightening, causing peeling and cracking at the interface. Therefore, it is preferable that the gap between the main terminal 7 and the terminal base 25 is small.

[0125] Therefore, if Fig.35 As shown, by using the terminal block 27 with elastic function in which the elastic material 19 is arranged between the terminal block 25 and the base portion 11, a large current can be passed through the power module 202 with further improved productivity.

[0126] In the second embodiment, the terminal block 25 with the nut 15 is used to connect the main terminal 7 and the bus bar 10 by screw fastening, but the present invention is not limited to this. The same effect can be obtained by using the terminal block 27 with elastic function when the main terminal 7 and the bus bar 10 are connected by welding, welding or crimping. In addition, the case of extending in the horizontal direction is described, but the main terminal 7 may also be Figure 4 In such a shape, in this case, the terminal block 25 is arranged between the second parallel portion 7 c and the base portion 11 , or between the base portion 11 and the bus bar 10 arranged below the second parallel portion 7 c .

[0127] As described above, in the second embodiment, the power module 202 further includes the terminal block 25 which is fixed to the base portion 11 of the heat sink 13 and is disposed between the main terminal 7 or the bus bar 10 and the base portion 11 .

[0128] In addition, the manufacturing method of the power module 202 includes: step (a), connecting the bus bar 10 to the first main surface or the second main surface of the main terminal 7 by threaded fastening, joining or crimping; and step (b), fixing the terminal block 25 to the base portion 11 of the heat sink 13 while the terminal block 25 is in contact with the main terminal 7 or the bus bar 10.

[0129] Therefore, the displacement applied to the main terminal 7 can be controlled with good productivity, and the stress applied to the interface between the main terminal 7 and the molded portion 8 can be reduced when the main terminal 7 is connected to the bus bar 10. Similarly, when the product is used, the gap between the main terminal 7 or the bus bar 10 and the terminal seat 25 can be controlled, and the stress applied to the interface between the main terminal 7 and the molded portion 8 can be reduced during vibration, thereby improving the vibration resistance of the product.

[0130] Furthermore, since the terminal block 25 is in contact with the main terminal 7 or the bus bar 10 , the power module and the terminal block 25 vibrate as one during vibration, and thus the vibration resistance of the product is further improved.

[0131] In addition, the power module 202 also has an elastic material 19 arranged between the terminal seat 25 and the base portion 11. Therefore, when there is a gap in the height direction between the main terminal 7 or the bus bar 10 and the terminal seat 25, the main terminal 7 or the bus bar 10 can also be brought into contact with the terminal seat 25 through the elastic material 19.

[0132] <Implementation Method 3>

[0133] Next, a power module 202 according to the third embodiment will be described. Since the cross-sectional view and the top view of the power module 202 according to the third embodiment are the same as those of the second embodiment, the cross-sectional view and the top view are shown in FIG. Fig. 20 and Fig.21 In the third embodiment, the same components as those described in the first and second embodiments are denoted by the same reference numerals, and description thereof will be omitted.

[0134] In implementation mode 3, Fig. 20 and Fig.21 As shown, in addition to the busbar 10, the terminal block 25 fixed to the heat sink 13 is also connected to the main terminal 7. Fig. 20 In the embodiment, the bus bar 10 is arranged on the upper side of the main terminal 7, and the terminal block 25 is connected to the lower side of the main terminal 7, but it is not limited to this. The bus bar 10 can also be arranged on the lower side of the main terminal 7, and the terminal block 25 can be further arranged on the lower side of the bus bar 10.

[0135] The terminal base 25 and the base portion 11 of the heat sink 13 can be fixed using Fig. 22 The connection achieved by threaded fastening as shown, Fig.23 The connection is achieved by a bonding material such as solder 2 as shown in the figure, Fig.24 A connection by welding as shown, or Fig.25 Any connection method such as connection by crimping as shown.

[0136] Fig.361 is a cross-sectional view showing the connection between the main terminal 7 , the bus bar 10 , and the terminal block 25 included in the power module 202 according to the third embodiment by screw fastening. Fig.37 1 is a cross-sectional view showing the connection of the main terminal 7 , the bus bar 10 , and the terminal block 25 included in the power module 202 according to the third embodiment by means of the solder 2 . Fig.38 1 is a cross-sectional view showing the connection of the main terminal 7 , the bus bar 10 , and the terminal block 25 included in the power module 202 according to the third embodiment by welding. Fig.39 (a) and (b) are cross-sectional views showing the connection of the main terminal 7, the bus bar 10, and the terminal block 25 included in the power module 202 according to the third embodiment by crimping.

[0137] In addition, the connection between the main terminal 7, the bus bar 10 and the terminal block 25 can be used Fig.36 The connection achieved by threaded fastening as shown, Fig.37 The connection is achieved by a bonding material such as solder 2 as shown in the figure, Fig.38 The connection achieved by welding as shown, Fig.39 Any connection method such as connection by crimping as shown in (a) and (b). Thus, the displacement applied to the main terminal 7 can be controlled with good productivity, and the stress applied to the interface between the molded portion 8 and the main terminal 7 can be reduced, thereby reducing the defect rate in the process of connecting the main terminal 7 and the bus bar 10.

[0138] Regarding the threaded fastening structure, the nut 15 may be fixed to the terminal base 25 by any method such as inserting the nut 15 when the terminal base 25 is formed, pressing the nut 15 after the terminal base 25 is formed, or joining the nut 15 using a joining material.

[0139] Fig.40 FIG. 2 is a cross-sectional view showing a terminal block 25 having a metal member 28 for preventing a nut from coming out, which is provided in a power module 202 according to Embodiment 3. Fig.40 As shown, in order to further realize a power module 202 with good productivity, a space 25a for configuring the nut 15 can also be provided on the terminal seat 25, the nut 15 is arranged in the space 25a, and a metal component 28 in the shape of a "コ" in cross-section is arranged on the nut 15 to prevent the nut from falling out. When the metal component 28 restricts the upward movement of the nut 15, the metal component 28 is inserted into the terminal seat 25.

[0140] Regarding the crimp connection structure, Fig.39 As shown in (a), a space 25b for crimping is provided in the terminal block 25, and pressure is applied from the bus bar 10 to the main terminal 7 and the terminal block 25, thereby connecting the main terminal 7 and the bus bar 10 to the terminal block 25, or as shown in Fig.39As shown in (b), a space 10b for crimping is provided on the bus bar 10, and pressure is applied from the bus bar 10 to the main terminal 7 and the terminal seat 25 formed in a manner corresponding to the shape of the space 10b, so that the main terminal 7 and the bus bar 10 are connected to the terminal seat 25, thereby achieving good productivity in a simple method. The main terminal 7 and the bus bar 10 are connected to the terminal seat 25, and the terminal seat 25 is fixed to the heat sink 13 integrated with the power module part 9, so that the stress applied to the main terminal 7 due to the vibration generated when the product is used can be reduced, so the vibration resistance of the product is improved.

[0141] Here, the reason why the vibration resistance is improved when the product is used is described. Fig.41 This is a cross-sectional view showing a state of a power module 202 according to the third embodiment when a product is used. Fig.42 3 is a cross-sectional view showing a normal power module 302 when a product is used.

[0142] like Fig.41 As shown, when the product is used, the heat sink 13 is fixed to the unit frame 29 of the product by screw fastening or the like. Fig.42 In a conventional power module 302 as shown, a terminal base 30 is arranged inside the power module 302, and a heat dissipation component 34 such as thermal grease is interposed between the power module portion 9 and the heat sink 13, that is, between the base portion 11 and the metal component 32 arranged on the lower side of the insulating component 4, and the power module portion 9 and the heat sink 13 are fixed by screws 14. Therefore, when the product vibrates, the unit frame 29 and the heat sink 13 vibrate in a fixed state, but the components (main terminals 7 and bus bars 10) located above the power module portion 9 connected to the heat sink 13 via the heat dissipation component 34 vibrate separately. As a result, it is considered that excessive stress caused by vibration is applied between the main terminal 7 and the bus bar 10, causing defects such as terminal bending.

[0143] On the other hand, Fig.41 In the power module 202 according to the third embodiment shown in the figure, the terminal block 25 fixed to the heat sink 13, the main terminal 7, and the bus bar 10 connected to the main terminal 7 are formed, so the power module 202 fixed to the unit frame 29 is integrally vibrated with each connection part. Therefore, the stress applied to the interface between the molded part 8 and the main terminal 7 when the product vibrates can be reduced, and the vibration resistance of the product is improved.

[0144] Fig.43 It is a cross-sectional view showing a gap between a main terminal 7 and a terminal block 25 included in a power module 202 according to the third embodiment. Fig.44This is a cross-sectional view showing the connection between the main terminal 7 , the bus bar 10 , and the terminal block 25 by screw fastening when a gap exists between the main terminal 7 and the terminal block 25 included in the power module 202 according to the third embodiment. Fig.45 It is a cross-sectional view showing the gap between the main terminal 7 and the terminal block 25 when the terminal block 27 with a spring function included in the power module 202 according to the third embodiment is used.

[0145] Here, when connecting the main terminal 7, the bus bar 10, and the terminal block 25, due to the tolerance of each component and the warping of the molded portion 8, the Fig.43 As shown, the positional relationship in the height direction between the main terminal 7 and the terminal block provided with the nut 15 is not necessarily zero clearance.

[0146] That is, Fig.43 As shown in FIG. 1 , a gap (displacement) exists between the main terminal 7 and the terminal seat 25 equipped with the nut 15, or the terminal seat 25 equipped with the nut 15 interferes with the main terminal 7. When the displacement generated when connecting the main terminal 7 and the bus bar 10, that is, the gap between the main terminal 7 and the terminal seat 25 equipped with the nut 15 is large, there is a concern that Fig.44 As shown, during screw tightening, a large stress is applied to the interface between the molded portion 8 and the main terminal 7, causing peeling and cracking at the interface. Therefore, it is preferable to reduce the gap between the main terminal 7 and the terminal base 25 equipped with the nut 15.

[0147] Therefore, if Fig.45 As shown, by using the terminal block 27 with elastic function in which the elastic material 19 is arranged between the terminal block 25 where the nut 15 is arranged and the base portion 11 , productivity can be further improved and a large current can flow through the power module 202 .

[0148] In the third embodiment, the terminal block 25 with the nut 15 is used to connect the main terminal 7 and the bus bar 10 by screw fastening, but the present invention is not limited to this. The same effect can be obtained by using the terminal block 27 with elastic function when the main terminal 7 and the bus bar 10 are connected by welding, welding or crimping. In addition, the case of extending in the horizontal direction is described, but the main terminal 7 may also be Figure 4 In such a shape, in this case, the terminal block 25 is arranged between the second parallel portion 7 c and the base portion 11 , or between the base portion 11 and the bus bar 10 arranged below the second parallel portion 7 c .

[0149] As described above, in the third embodiment, since the terminal block 25 fixed to the heat sink 13 is also connected to the main terminal 7 in addition to the bus bar 10, the stress applied to the main terminal 7 due to vibration generated when the product is used can be reduced, and the vibration resistance of the product is improved.

[0150] <Implementation Method 4>

[0151] This embodiment is to apply the power module 202 involved in the above-mentioned embodiments 1 to 3 to a power conversion device. The application of the power module 202 involved in the embodiments 1 to 3 is not limited to a specific power conversion device, but the following, as an embodiment 4, the case where the power module 202 involved in the embodiments 1 to 3 is applied to a three-phase inverter is described.

[0152] Fig.46 It is a block diagram showing the configuration of a power conversion system to which the power conversion device according to the present embodiment is applied.

[0153] Fig.46 The power conversion system shown is composed of a power supply 100, a power conversion device 200, and a load 300. The power supply 100 is a DC power supply, and supplies DC power to the power conversion device 200. The power supply 100 can be composed of various power supplies, for example, it can be composed of a DC system, a solar cell, a storage battery, or a rectifier circuit connected to an AC system, or an AC / DC converter. In addition, the power supply 100 can also be composed of a DC / DC converter that converts the DC power output from the DC system into a specified power.

[0154] The power conversion device 200 is a three-phase inverter connected between the power source 100 and the load 300, converts the DC power supplied from the power source 100 into AC power, and supplies the AC power to the load 300. Fig.46 As shown, the power conversion device 200 includes: a main conversion circuit 201 that converts DC power into AC power and outputs it; and a control circuit 203 that outputs a control signal for controlling the main conversion circuit 201 to the main conversion circuit 201 .

[0155] Load 300 is a three-phase motor driven by AC power supplied from power converter 200. Load 300 is not limited to a specific use, and is a motor mounted on various electrical devices, for example, a motor for hybrid vehicles, electric vehicles, railway vehicles, elevators, or air conditioners.

[0156] The details of the power conversion device 200 are described below. The main conversion circuit 201 has a switching element (not shown) and a freewheeling diode (not shown). By turning on and off the switching element, the DC power supplied from the power supply 100 is converted into AC power and supplied to the load 300. The specific circuit structure of the main conversion circuit 201 is various, but the main conversion circuit 201 involved in this embodiment is a 2-level three-phase full-bridge circuit, which can be composed of 6 switching elements and 6 freewheeling diodes respectively connected in anti-parallel with the switching elements. The power module 202 involved in any of the above-mentioned embodiments 1 to 3 is applied to at least any one of the switching elements and freewheeling diodes of the main conversion circuit 201. The 6 switching elements are connected in series two by two to form upper and lower bridge arms, and each upper and lower bridge arm constitutes each phase (U phase, V phase, W phase) of the full-bridge circuit. In addition, the output terminals of each upper and lower bridge arm, that is, the three output terminals of the main conversion circuit 201, are connected to the load 300.

[0157] In addition, the main conversion circuit 201 has a driving circuit (not shown) for driving each switching element, but the driving circuit may be built into the power module 202, or may be a structure having a driving circuit separate from the power module 202. The driving circuit generates a driving signal for driving the switching element of the main conversion circuit 201, and supplies it to the control electrode of the switching element of the main conversion circuit 201. Specifically, according to the control signal from the control circuit 203 described later, a driving signal for turning the switching element into an on state and a driving signal for turning the switching element into an off state are output to the control electrode of each switching element. When the switching element is maintained in an on state, the driving signal is a voltage signal (on signal) greater than or equal to the threshold voltage of the switching element, and when the switching element is maintained in an off state, the driving signal is a voltage signal (off signal) less than or equal to the threshold voltage of the switching element.

[0158] The control circuit 203 controls the switching elements of the main conversion circuit 201 to supply the desired power to the load 300. Specifically, the time (on time) at which each switching element of the main conversion circuit 201 should be in the on state is calculated based on the power to be supplied to the load 300. For example, the main conversion circuit 201 can be controlled by PWM control that modulates the on time of the switching element according to the voltage to be output. In addition, a control instruction (control signal) is output to a drive circuit of the main conversion circuit 201 so that an on signal is output to the switching element that should be in the on state and an off signal is output to the switching element that should be in the off state at each time point. The drive circuit outputs the on signal or the off signal as a drive signal to the control electrode of each switching element according to the control signal.

[0159] In the power conversion device according to the present embodiment, since the power module 202 according to Embodiments 1 to 3 is used as a switching element and a freewheeling diode of the main conversion circuit 201 , it is possible to improve productivity.

[0160] In this embodiment, an example of applying the power module 202 involved in embodiments 1 to 3 to a 2-level three-phase inverter is described, but the application of the power module 202 involved in embodiments 1 to 3 is not limited to this, and can be applied to various power conversion devices. In this embodiment, a 2-level power conversion device is set, but it can also be a 3-level or multi-level power conversion device. When power is supplied to a single-phase load, the power module 202 involved in embodiments 1 to 3 can also be applied to a single-phase inverter. In addition, when power is supplied to a DC load, the power module 202 involved in embodiments 1 to 3 can also be applied to a DC / DC converter or an AC / DC converter.

[0161] In addition, the power conversion device using the power module 202 involved in embodiments 1 to 3 is not limited to the case where the above-mentioned load is an electric motor. For example, it can also be used as a power supply device for an electric discharge machine, a laser processing machine or an induction heating cooker, a contactless power supply system, and can also be used as a power conditioner for a solar power generation system, a power storage system, etc.

[0162] While the present invention has been described in detail, the above description is in all aspects illustrative and not restrictive, and it should be understood that numerous modifications not shown are conceivable.

[0163] Furthermore, the various embodiments may be freely combined, and the various embodiments may be appropriately modified or omitted.

[0164] Various aspects of the present invention are summarized and described below as supplementary notes.

[0165] (Note 1)

[0166] A power module comprising:

[0167] Semiconductor components;

[0168] a frame, one surface of which is provided with the semiconductor element;

[0169] a module base, one surface of which is provided with the frame;

[0170] a main terminal, which is part of the frame;

[0171] a molding part for encapsulating the semiconductor element, the frame, and the module base in a manner that the main terminals are exposed;

[0172] a heat sink having a base portion and a plurality of heat dissipation fins, the base portion being integrated with the other surface of the module base exposed from the mold portion, the plurality of heat dissipation fins protruding toward the side of the base portion opposite to the module base;

[0173] an external terminal connected to the first main surface of the main terminal or the second main surface opposite to the first main surface; and

[0174] a displacement control structural member fixed to the base portion of the heat sink and arranged between the main terminal or the external terminal and the base portion;

[0175] The second main surface of the main terminal faces the heat sink,

[0176] The first main surface of the main terminal faces the opposite side to the heat sink.

[0177] (Note 2)

[0178] The power module according to Supplement 1, wherein:

[0179] The external terminal is connected to the first main surface or the second main surface of the main terminal by means of a screw and a nut.

[0180] (Note 3)

[0181] The power module according to Supplement 1, wherein:

[0182] The main terminal extends in a first direction which is a direction parallel to the base portion of the heat sink and is exposed from the mold portion.

[0183] (Note 4)

[0184] The power module according to Supplement 1, wherein:

[0185] The main terminal comprises: a first parallel portion exposed from the molded portion in a first direction parallel to the base portion of the heat sink; a first vertical portion extending from the first parallel portion in a second direction in a vertical direction; and a second parallel portion extending from the first vertical portion in the first direction.

[0186] The external terminal is connected to the second parallel portion of the main terminal.

[0187] (Note 5)

[0188] The power module according to Supplement 1, wherein:

[0189] The displacement control structural member is in contact with the main terminal or the external terminal.

[0190] (Note 6)

[0191] The power module according to Supplementary Note 5, wherein:

[0192] The invention further includes an elastic material disposed between the displacement control structural member and the base portion.

[0193] (Note 7)

[0194] The power module according to Supplement 3, wherein:

[0195] A fitting portion is provided on the other surface of the module base,

[0196] A fitted portion capable of fitting with the fitting portion is provided on a surface of the base portion of the heat sink on the module base side.

[0197] The module base and the heat sink are integrated by fitting the fitting portion and the fitted portion.

[0198] (Note 8)

[0199] The power module according to Supplement 4, wherein:

[0200] A fitting portion is provided on the other surface of the module base,

[0201] A fitted portion capable of fitting with the fitting portion is provided on a surface of the base portion of the heat sink on the module base side.

[0202] The module base and the heat sink are integrated by fitting the fitting portion and the fitted portion.

[0203] (Note 9)

[0204] A method for manufacturing a power module, which is a method for manufacturing the power module described in Supplement 1, comprising:

[0205] Step (a), connecting the external terminal to the first main surface or the second main surface of the main terminal by screwing, bonding or crimping; and

[0206] The step (b) is to fix the displacement control structural component to the base portion of the heat sink in a state where the displacement control structural component is in contact with the main terminal or the external terminal.

[0207] (Note 10)

[0208] A power conversion device comprising:

[0209] A main conversion circuit having the power module described in Supplementary Note 1, wherein the main conversion circuit converts input power and outputs the input power; and

[0210] A control circuit outputs a control signal for controlling the main conversion circuit to the main conversion circuit.

[0211] Description of the label

[0212] 1 semiconductor chip, 3 lead frame, 5 module base, 5a fitting portion, 7 main terminal, 7a first parallel portion, 7b first vertical portion, 7c second parallel portion, 8 molded portion, 10 bus bar, 11 base portion, 11a fitted portion, 12 heat sink fin, 13 heat sink, 14 screw, 15 nut, 16 bus bar with nut, 17 main terminal with nut, 19 elastic material, 25 terminal block, 27 terminal block with elastic function, 200 power conversion device, 201 main conversion circuit, 202 power module, 203 control circuit.

Claims

1. A power module, comprising: Semiconductor components; a frame, one surface of which is provided with the semiconductor element; a module base, one surface of which is provided with the frame; a main terminal, which is part of the frame; a molding part for encapsulating the semiconductor element, the frame, and the module base in a manner that the main terminals are exposed; a heat sink having a base portion and a plurality of heat dissipation fins, the base portion being integrated with the other surface of the module base exposed from the mold portion, the plurality of heat dissipation fins protruding toward the side of the base portion opposite to the module base; an external terminal connected to the first main surface of the main terminal or the second main surface opposite to the first main surface; as well as a displacement control structural member fixed to the base portion of the heat sink and arranged between the main terminal or the external terminal and the base portion; The second main surface of the main terminal faces the heat sink, The first main surface of the main terminal faces the side opposite to the heat sink.

2. The power module according to claim 1, wherein: The external terminal is connected to the first main surface or the second main surface of the main terminal by means of a screw and a nut.

3. The power module according to claim 1, wherein: The main terminal extends in a first direction which is a direction parallel to the base portion of the heat sink and is exposed from the mold portion.

4. The power module according to claim 1, wherein: The main terminal has: a first parallel portion exposed from the molded portion in a first direction parallel to the base portion of the heat sink; and a first vertical portion extending from the first parallel portion in a second direction in a vertical direction. and a second parallel portion extending from the first vertical portion in the first direction, The external terminal is connected to the second parallel portion of the main terminal.

5. The power module according to claim 1, wherein: The displacement control structural member is in contact with the main terminal or the external terminal.

6. The power module according to claim 5, wherein: The invention further includes an elastic material disposed between the displacement control structural member and the base portion.

7. The power module according to claim 3, wherein: A fitting portion is provided on the other surface of the module base, A fitted portion capable of fitting with the fitting portion is provided on a surface of the base portion of the heat sink on the module base side. The module base and the heat sink are integrated by fitting the fitting portion and the fitted portion.

8. The power module according to claim 4, wherein: A fitting portion is provided on the other surface of the module base, A fitted portion capable of fitting with the fitting portion is provided on a surface of the base portion of the heat sink on the module base side. The module base and the heat sink are integrated by fitting the fitting portion and the fitted portion.

9. A method for manufacturing a power module, which is a method for manufacturing the power module according to claim 1, comprising: Step (a), connecting the external terminal to the first main surface or the second main surface of the main terminal by screwing, bonding or crimping; and The step (b) is to fix the displacement control structural component to the base portion of the heat sink in a state where the displacement control structural component is in contact with the main terminal or the external terminal.

10. A power conversion device, comprising: A main conversion circuit, comprising the power module according to claim 1, wherein the main conversion circuit converts input power and outputs the input power; and A control circuit outputs a control signal for controlling the main conversion circuit to the main conversion circuit.

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