Laser drilling method for special-shaped hole

Abstract

The invention discloses a laser drilling method for a special-shaped hole. The laser drilling method comprises the following steps: S1, segmenting; s2, forming a light beam path; and S3, removing light beam interference. On one hand, linkage is formed among the mirror reflection adjusting set, the dynamic focusing module and the co-rotating reflector module to change the inclination angle between the generatrix of the machining laser beam and the generatrix of the to-be-machined hole, machining is conducted in the zero-inclination-angle or negative-inclination-angle state, and interference between the upper portion of the hole wall and the machining light beam is avoided; and on the other hand, due to the fact that the inclination angle of the generatrix of the laser beam is adjustable, segmented machining can be conducted no matter the hole wall is bent or inclined, the machining requirements of various hole products or special-shaped columnar products are met, and practicability is high.

Description

[0001] This application is a divisional application with application date of June 5, 2024, application number 2024107188180, and name of a multi-axis linkage laser drilling device and method. Technical Field

[0002] The invention belongs to the technical field of laser processing, and in particular relates to a laser drilling method for special-shaped holes. Background Art

[0003] A commonly used laser beam processing system mainly includes a device base with a laser input channel and a laser output channel, a dynamic focusing module, a reflector adjustment module, and a co-rotating reflector module. After a single laser beam is emitted from the laser input channel, it is adjusted in the optical path by the dynamic focusing module and the reflector adjustment module, and the beam is reflected to the two flip reflector units of the co-rotating reflector module. The two flip reflector units flip back and forth around the Z-axis and Y-axis directions respectively and reflect the optical path out of the laser output channel and scan and cover the welding surface of the coordinate system formed by the X-axis and Y-axis to complete plane or 3D processing (combined with the lifting and lowering movement on the Z-axis formed by the dynamic focusing module).

[0004] However, for some hole processing, combined with the attached Figure 1 As shown, the beam has the following defects during processing:

[0005] 1) Once the generatrix of the hole wall is at an angle with the generatrix of the laser beam (non-parallel to each other), there will inevitably be interference between the upper part of the hole wall to be processed and the beam. Therefore, it is impossible to perform deep hole processing in a mode where the generatrix of the hole wall and the generatrix of the laser beam remain relatively parallel;

[0006] 2) Once the hole wall busbar is bent or tilted, if the light beam tilt angle cannot be adjusted, that is, the corresponding section of the hole wall cannot be fitted, that is, some special-shaped holes cannot be processed. Summary of the invention

[0007] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a new laser drilling method for special-shaped holes.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0009] A laser drilling method for a special-shaped hole, wherein the special-shaped hole comprises a plurality of holes to be processed with different upper and lower inner diameter change rates, and the laser drilling device used in the laser drilling method comprises a device seat, a laser transmitter, a reflector adjustment module, a dynamic focusing module, and a co-rotating reflector module for forming X and Y axial scanning, wherein the reflector adjustment module comprises a reflector group and a mirror reflection adjustment group, and the laser drilling method comprises the following steps:

[0010] S1, Segmentation

[0011] Divide the hole into upper and lower sections according to the change of the inner diameter of the hole to be processed;

[0012] S2. Formation of beam path

[0013] After the laser beam is emitted from the laser emitter, it is reflected by the reflector group to form a light beam in the opposite direction to the emission direction and enter the mirror reflection adjustment group, wherein the mirror reflection adjustment group can keep the incident and emission angles and directions of the light beam consistent and staggered in the coordinate system formed by the X and Y axes; then the laser beam is transmitted to the co-rotating reflector module through the dynamic focusing module, wherein the focus adjustment of the dynamic focusing module forms a setting of the processing depth on the Z axis, and the X and Y axis directions formed by the co-rotating reflector module are covered;

[0014] S3, eliminate beam interference

[0015] The hole to be processed is segmented and the beam path is planned by step S1 and step S2, and in the processing of each corresponding segment of the hole to be processed, the angle of the hole wall generatrix is ​​first set according to the shape of the corresponding segment of the hole to be processed, and then the laser beam is adjusted upward or downward or left or right by the mirror reflection adjustment group, and at the same time, the angle of the rotating mirror module is deflected so that there is a negative inclination angle between the generatrix of the output laser beam and the generatrix of the corresponding segment of the hole to be processed, and then the linear movement of the dynamic focusing module is used to change the processing depth to complete the processing of the corresponding segment of the hole to be processed, and finally, the segments of the hole to be processed are processed in turn from top to bottom to form the special-shaped hole.

[0016] Preferably, the multiple holes to be processed are divided into upper holes to be processed, middle holes to be processed and lower holes to be processed from top to bottom, and the upper holes to be processed, middle holes to be processed and lower holes to be processed are processed in sequence at a negative inclination angle between the busbar of the output laser beam and the busbar of the corresponding section of holes to be processed.

[0017] According to a specific implementation and preferred aspect of the present invention, the mirror reflection adjustment group includes a first adjustment group for adjusting the laser beam to the left or right, and a second adjustment group for adjusting the laser beam upward or downward, wherein the first adjustment group includes a left inner reflector and a right outer reflector arranged along the left-right direction, the laser beam is relatively reflected between the left inner reflector and the right outer reflector and is emitted from the first adjustment group while maintaining the same angle as the incident angle; the second adjustment group includes an upper inner reflector and a lower outer reflector arranged along the up-down direction, the laser beam is relatively reflected between the upper inner reflector and the lower outer reflector and is emitted from the second adjustment group while maintaining the same angle as the incident angle, and the cooperation between the first adjustment group and the second adjustment group can change the position of the light beam toward the dynamic focusing module along the corresponding adjusted synthetic direction.

[0018] Preferably, the mirror surfaces of the left inner reflector and the right outer reflector are parallel and spaced apart from each other, one of which is fixed and the other can be relatively linearly adjusted, and the laser directed to the dynamic focusing module is adjusted in the left and right directions during movement in the front-to-back direction.

[0019] In some specific embodiments, the mirror surfaces of the left inner reflector and the right outer reflector have two or more reflective surfaces at 45°, and the laser beam is directly incident on the reflective surface of the right outer reflector and then reflected into the left inner reflector, and then reflected forward while maintaining a horizontal state and then reflected to the right and forward, so that the laser beam enters and exits from opposite sides of the right outer reflector in parallel; and / or, the right outer reflector is arranged on the base for linear movement along the front-to-back direction; the left inner reflector is fixed on the base.

[0020] In some specific embodiments, the mirror surfaces of the upper inner reflector and the lower outer reflector are parallel and spaced relative to each other, one of which is fixed and the other can be adjusted linearly relative to each other, and the movement in the front-to-back direction allows the laser directed to the dynamic focus module to be adjusted in the up-down direction. Further, the mirror surfaces of the upper inner reflector and the lower outer reflector each have two or more reflecting surfaces at 45°, and the laser beam is directly incident on the reflecting surface of the lower outer reflector and then emitted upward, forward, downward, and then forward, wherein the laser beam enters and exits in parallel from opposite sides of the lower outer reflector; and / or, the upper inner reflector is fixed and the lower outer reflector can be moved and adjusted along the front-to-back direction, so that the laser directed to the dynamic focus module can be adjusted in the up-down direction.

[0021] According to another specific implementation and preferred aspect of the present invention, the reflector group includes a first reflector and a second reflector, wherein the laser beam emitted from the laser transmitter is reflected by the first reflector and the second reflector in sequence and is emitted into the reflector adjustment module in the opposite direction to the emitted light beam.

[0022] Preferably, the first reflector and the second reflector are symmetrically arranged, and / or, the first reflector and the second reflector are both inclined at 45°.

[0023] In addition, the dynamic focusing module includes a negative focal length lens that can be moved and adjusted along the front-to-back direction; a focusing lens fixed on the device base and capable of focusing the light beam upward, downward, left or right and directing it to the co-rotating reflector module, wherein the linear movement of the negative focal length lens is used to change the processing depth.

[0024] Due to the implementation of the above technical solution, the present invention has the following advantages compared with the prior art:

[0025] With regard to the use of existing laser beams for deep hole processing, once the generatrix of the hole wall is at an angle with the generatrix of the laser beam (non-parallel to each other), there will inevitably be interference between the upper part of the hole wall to be processed and the beam. Therefore, deep hole processing in a mode in which the generatrix of the hole wall and the generatrix of the laser beam are kept relatively parallel cannot be performed; at the same time, once the generatrix of the hole wall is bent or tilted, if the inclination angle of the beam cannot be adjusted, that is, fitting processing of the corresponding section of the hole wall cannot be formed, that is, processing of some special-shaped holes cannot be performed, etc. The present invention cleverly solves the various deficiencies of the existing structure by overall design of the laser drilling method for special-shaped holes. After adopting the laser drilling method of the special-shaped hole, segmentation and beam path planning are performed according to multiple holes to be processed with different upper and lower inner diameter change rates. In the processing of each corresponding segment of the hole to be processed, the angle of the hole wall generatrix is ​​first set according to the shape of the corresponding segment of the hole to be processed, and then the laser beam is adjusted upward or downward or left or right by the mirror reflection adjustment group, and at the same time, the angle of the rotating reflector module is deflected so that the generatrix of the output laser beam and the generatrix of the corresponding segment of the hole to be processed are negatively inclined. Then, the linear movement of the dynamic focusing module is used to change the processing depth to complete the processing of the corresponding segment of the hole to be processed. Finally, the processing of each segment of the hole to be processed is performed in turn from top to bottom to form a special-shaped hole. Therefore, on the one hand, the present invention is based on changing the inclination between the generatrix of the processing laser beam and the generatrix of the hole to be processed, so that it is processed under the state of negative inclination to avoid interference between the upper part of the hole wall and the processing beam; on the other hand, the negative inclination and processing depth are adjustable, and based on segmented processing, it can meet the processing requirements of various hole products or special-shaped columnar products, and has strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of interference in beam processing in the background technology;

[0027] Figure 2 It is a structural schematic diagram of a multi-axis linkage laser drilling device;

[0028] Figure 3 for Figure 2 A top view schematic diagram of

[0029] Figure 4 Schematic diagram of laser beam distribution in processing of zero inclination angle, negative inclination angle, negative cone deep hole and special-shaped deep hole;

[0030] Figure 5 This is a schematic diagram of the laser beam processing path after the first adjustment group and the co-rotating reflector module are adjusted in linkage with each other in this embodiment;

[0031] Figure 6 for Figure 5 A side view schematic diagram of (partially omitted);

[0032] Figure 7 for Figure 6 A magnified schematic diagram of the structure at the machining hole of the workpiece;

[0033] Figure 8 This is a schematic diagram of the laser beam processing path after the second adjustment group and the co-rotating reflector module are adjusted in linkage with each other in this embodiment;

[0034] Fig. 9 for Figure 8 A side view schematic diagram of (partially omitted);

[0035] Fig.10 for Fig. 9 A magnified schematic diagram of the structure at the machining hole of the workpiece;

[0036] Fig.11 Schematic diagram of the laser beam processing path after the first and second adjustment groups and the co-rotating reflector module are adjusted in linkage with each other in this embodiment (I);

[0037] Fig.12 Schematic diagram (II) of the laser beam processing path after the first and second adjustment groups and the co-rotating reflector module are adjusted in linkage with each other in this embodiment;

[0038] Fig.13 Schematic diagram of the laser beam processing path after the first and second adjustment groups and the co-rotating reflector module are adjusted in linkage (III) of this embodiment;

[0039] Fig.14 for Fig.13 A magnified schematic diagram of the structure at the machining hole of the workpiece;

[0040] Among them: 1. Device seat; 2. Laser emitter; 3. Reflector adjustment module; 30. Reflector group; 301. First reflector; 302. Second reflector; 31. Mirror reflection adjustment group; 311. First adjustment group; L. Left inner reflector; R. Right outer reflector; 312. Second adjustment group; U. Upper inner reflector; D. Lower outer reflector; 4. Dynamic focusing module; 40. Negative focal length lens; 41. Focusing lens; 5. Co-rotating reflector module; 5a. X-axis deflection mirror; 5b. Y-axis deflection mirror; 6. Telecentric focusing field lens; G. Workpiece (product to be processed). DETAILED DESCRIPTION

[0041] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0044] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In the invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0046] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0047] like Figures 2 to 4 As shown, the multi-axis linkage laser drilling device of this embodiment includes a device base 1; a laser emitter 2; a reflector adjustment module 3; a dynamic focusing module 4 and a co-rotating reflector module 5 for forming X and Y axial scanning; and a telecentric focusing field lens 6 located below the co-rotating reflector module 5.

[0048] Specifically, the laser emitter 2 is installed at one end of the base 1, and the laser is emitted in a front-to-back direction. In some specific implementations, the laser is emitted from back to front.

[0049] The reflector adjustment module 3 includes a reflector group 30 for changing the optical path so that the light beam emitted by the laser emitter 2 is emitted in an anti-parallel manner, and a mirror reflection adjustment group 31 capable of adjusting the laser beam upward, downward, leftward or rightward to be emitted toward the dynamic focusing module 4, wherein the reflector group 30 includes a first reflector 301 and a second reflector 302, wherein the laser beam emitted from the laser emitter 2 is respectively reflected by the first reflector 301 and the second reflector 302 in sequence and enters the reflector adjustment module 31 in the opposite direction to the emitted light beam. In short, the laser beam emitted from the back to the front is reflected by the first reflector 301 and the second reflector 302 in sequence, and then enters the reflector adjustment module 31 from the front to the back.

[0050] In some specific implementations, the first reflector 301 and the second reflector 302 are symmetrically arranged and are both inclined at 45°.

[0051] The mirror reflection adjustment group 31 includes a first adjustment group 311 for adjusting the laser beam to the left or right, and a second adjustment group 312 for adjusting the laser beam upward or downward, wherein the first adjustment group 311 includes a left inner reflector L and a right outer reflector R arranged along the left and right directions, and the laser beam is relatively reflected between the left inner reflector L and the right outer reflector R and is emitted from the first adjustment group 311 while maintaining the same angle of incidence; the second adjustment group 312 includes an upper inner reflector U and a lower outer reflector D arranged along the up and down directions, and the laser beam is relatively reflected between the upper inner reflector U and the lower outer reflector D and is emitted from the second adjustment group 312 while maintaining the same angle of incidence. In short, the first adjustment group 311 and the second adjustment group 312 can not only be operated and adjusted individually, but also can be adjusted collaboratively. Specifically, when the two adjustment groups collaborate to change the position of the beam toward the dynamic focusing module along the corresponding synthetic direction of the adjustment. For a clearer expression, for example, the synthetic direction of left and upward can be understood as the upper left, and the others are completely referred to this method (equivalent to the concept of force synthesis). In some specific embodiments, the mirror surfaces of the left inner reflector L and the right outer reflector R are parallel and spaced apart from each other. At the same time, the mirror surfaces of the left inner reflector L and the right outer reflector R each have two reflective surfaces at an angle of 45°, that is, the two reflective surfaces of the left inner reflector L and the right outer reflector R are vertically arranged. In this way, a spacing channel is formed between the inner and outer mirror surfaces, and the light beam incident forward is reflected by the reflective surface on the rear side of the right outer reflector R into the spacing channel, and is reflected forward by the reflective surface on the rear side of the left inner reflector L, and then reflected rightward by the reflective surface on the front side of the left inner reflector L to the reflective surface on the front side of the right outer reflector R, and then emitted forward. In this example, the right outer reflector R is arranged on the base 1 along the front-to-back direction for linear motion; the left inner reflector L is fixed on the base 1. Such movement in the front-to-back direction allows the laser directed to the dynamic focusing module to be adjusted in the left-to-right direction without changing the reflection path of the light beam. However, the entry and exit positions of the light beam are different, thereby changing the position of the output laser beam. In addition, regardless of the entry and exit positions of the light beam, the entry and exit directions of the laser beam from the rear and front reflection surfaces of the right outer reflector R are parallel (or understood to be consistent or the same).

[0052] In some specific embodiments, the mirror surfaces of the upper inner reflector U and the lower outer reflector D are parallel and spaced apart from each other. At the same time, the mirror surfaces of the upper inner reflector U and the lower outer reflector D each have two reflective surfaces at 45°, that is, the two reflective surfaces of the upper inner reflector U and the lower outer reflector D are vertically arranged. In this way, a spacing channel is formed between the inner and outer mirror surfaces, and the light beam incident forward is reflected upward by the reflective surface on the rear side of the lower outer reflector D to enter the spacing channel, and is reflected forward by the reflective surface on the rear side of the upper inner reflector U, and then reflected downward by the reflective surface on the front side of the upper inner reflector U to the reflective surface on the front side of the lower outer reflector D, and then emitted forward. In this example, the lower outer reflector D is arranged on the base 1 along the front-to-back direction for linear motion; the upper inner reflector U is fixed on the base 1. Such movement in the front-to-back direction allows the laser directed to the dynamic focusing module to be adjusted in the up-and-down direction without changing the reflection path of the light beam. However, the entry and exit positions of the light beam are different, thereby changing the position of the output laser beam. In addition, regardless of the entry and exit positions of the light beam, the entry and exit directions of the laser beam from the rear and front reflection surfaces of the lower external reflector D are parallel (or understood to be consistent or the same).

[0053] The dynamic focusing module 4 includes a negative focal length lens 40 which can be moved and adjusted along the front-to-back direction; a focusing lens 41 which is fixed on the base 1 and can focus the light beam upward, downward, left or right and guide it to the co-rotating reflector module 5, wherein the linear movement of the negative focal length lens 40 is used to change the processing depth.

[0054] The co-rotating reflector module 5, the mirror reflection adjustment group 3 and the dynamic focusing module 4 form a linkage of axial movement and axial deflection to change the generatrix of the output laser beam to be parallel to the generatrix of the hole to be processed or to make a negative inclination angle between the generatrix of the output laser beam and the generatrix of the hole to be processed.

[0055] Recombination Figure 4 It can be seen that processing can only be carried out when the generatrix of the laser beam is parallel to the generatrix of the hole to be processed and when there is a negative inclination between the generatrix of the laser beam and the generatrix of the hole to be processed, and it can meet the processing needs of products with different holes.

[0056] Combination Figures 5 to 7 As shown, the right outer reflector R moves backward by XX1 value, the laser beam moves to the right, and the X motor rotates counterclockwise to angle β (i.e., after the X-axis deflection mirror 5a rotates by angle β); the laser beam reaches the X-extreme of the workpiece, and the side of the laser beam near the workpiece is parallel to the generatrix of the inner wall of the workpiece, and will not interfere with the hole wall. Similarly, the right outer reflector R moves forward, the laser beam moves to the left, and the X motor rotates counterclockwise by a corresponding angle (i.e., after the X-axis deflection mirror 5a rotates by a corresponding angle), the laser beam reaches the X-extreme of the workpiece, and the side of the laser beam near the workpiece is parallel to the generatrix of the inner wall of the workpiece G, and will not interfere with the hole wall.

[0057] Combination Figures 8 to 10 As shown, the lower outer reflector D moves forward by the value of YY1, the laser beam moves upward, and the Y motor rotates counterclockwise to an angle of α (i.e., after the Y-axis deflection mirror 5b rotates by an angle of α); the laser beam reaches the Y+ extreme value of the workpiece, and the side of the laser beam near the workpiece is parallel to the generatrix of the inner wall of the workpiece, and will not interfere with the hole wall. Similarly, the lower outer reflector D moves backward, the laser beam moves downward, and after the Y motor rotates counterclockwise by a corresponding angle (i.e., after the Y-axis deflection mirror 5b rotates by a corresponding angle), the laser beam reaches the Y+ extreme value of the workpiece, and the side of the laser beam near the workpiece is parallel to the generatrix of the inner wall of the workpiece G, and will not interfere with the hole wall.

[0058] Combination Figures 11 to 14 As shown, the right outer reflector R moves forward by XX3 value, the lower outer reflector D moves forward by YY3 value, the laser beam moves to the upper right at an angle of 45°, the X motor rotates to β3 angle, and the Y motor rotates to α3 angle; the laser beam reaches the workpiece at: X = -2^0.5 / 2*r; Y = 2^0.5 / 2*r (r is the radius of the processing hole shown in the figure), the side of the laser beam near the workpiece G is parallel to the generatrix of the inner wall of the workpiece G, and will not interfere with the hole wall.

[0059] Therefore, the implementation process of this embodiment is as follows:

[0060] S1. Formation of beam path

[0061] After the laser beam is emitted from the laser emitter, it is reflected by the reflector group to form a light beam in the opposite direction of the emission direction and enters the mirror reflection adjustment group. Then, the laser beam is transmitted to the co-rotating reflector module through the dynamic focusing module, and the co-rotating reflector module forms a covering processing in the XY axis direction. At the same time, the dynamic focusing module is used to adjust the focus so that the processing depth is set on the Z axis.

[0062] S2, eliminate beam interference

[0063] The angle of the hole wall busbar is set according to the shape of the hole to be processed, and then the mirror reflection adjustment group adjusts the laser beam upward or downward or left or right. Then, under the angle deflection of the co-rotating reflector module, the busbar of the processing laser beam is made relatively parallel to the busbar of the hole wall, or the busbar of the output laser beam and the busbar of the hole to be processed have a negative inclination angle. Then, under the setting of the processing depth, the processing of the hole to be processed is completed.

[0064] In addition, when the hole to be processed is a special-shaped hole with a variable inner diameter, the special-shaped hole is first divided into upper and lower sections, and in the corresponding depth processing of each section, the processing laser beam is parallel to the generatrix of the inner wall surface of the deep hole to be processed, and the special-shaped hole is processed section by section in the above steps S1 and S2. In short, not only the processing of common straight holes and inclined holes can be realized, but also the processing of special-shaped holes (for example Figure 4 The special-shaped hole shown in the figure is clearly divided into three sections: upper, middle and lower. The laser is used to adjust the angles in sequence to process the three sections.

[0065] In summary, after adopting the laser drilling device, after the laser beam is emitted from the laser transmitter, it is reflected by the reflector group to form a light beam opposite to the emission direction and enters the mirror reflection adjustment group, and then the laser beam is transmitted to the co-rotating reflector module through the dynamic focusing module, and the XY axis direction is covered by the co-rotating reflector module. At the same time, the focus adjustment of the dynamic focusing module forms a processing depth setting on the Z axis; the angle of the hole wall busbar is set according to the shape of the hole to be processed, and then the mirror reflection adjustment group adjusts the laser beam upward or downward or left or right, and then under the angle deflection of the co-rotating reflector module, the busbar of the processing laser beam is relatively parallel to the busbar of the hole wall. Or a negative inclination angle is formed between the busbar of the output laser beam and the busbar of the hole to be processed, and then the processing depth is set to complete the processing of the hole to be processed. Therefore, on the one hand, the present invention forms a linkage between the mirror reflection adjustment group, the dynamic focusing module, and the co-rotating reflector module to change the inclination angle between the busbar of the processing laser beam and the busbar of the hole to be processed, so that processing is performed at a zero inclination angle or a negative inclination angle to avoid interference between the upper part of the hole wall and the processing light beam; on the other hand, since the inclination angle of the busbar of the laser beam is adjustable, no matter whether the hole wall is bent or tilted, it can be processed in sections to meet the processing requirements of various hole products or special-shaped columnar products, and the practicality is strong.

[0066] The above detailed description of the present invention is intended to enable persons familiar with the art to understand the contents of the present invention and implement them. It does not limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser drilling method for special-shaped holes, characterized in that: The special-shaped hole includes a plurality of holes to be processed with different upper and lower inner diameter change rates, and the laser drilling device used in the laser drilling method includes a device seat, a laser transmitter, a reflector adjustment module, a dynamic focusing module, and a co-rotating reflector module for forming X and Y axial scanning, wherein the reflector adjustment module includes a reflector group and a mirror reflection adjustment group, and the laser drilling method includes the following steps: S1, Segmentation Divide the hole into upper and lower sections according to the change of the inner diameter of the hole to be processed; S2. Formation of beam path After the laser beam is emitted from the laser emitter, it is reflected by the reflector group to form a light beam in the opposite direction to the emission direction and enter the mirror reflection adjustment group, wherein the mirror reflection adjustment group can keep the incident and emission angles and directions of the light beam consistent and staggered in the coordinate system formed by the X and Y axes; then the laser beam is transmitted to the co-rotating reflector module through the dynamic focusing module, wherein the focus adjustment of the dynamic focusing module forms a setting of the processing depth on the Z axis, and the X and Y axis directions formed by the co-rotating reflector module are covered; S3, eliminate beam interference The hole to be processed is segmented and the beam path is planned by step S1 and step S2, and in the processing of each corresponding segment of the hole to be processed, the angle of the hole wall generatrix is ​​first set according to the shape of the corresponding segment of the hole to be processed, and then the laser beam is adjusted upward or downward or left or right by the mirror reflection adjustment group, and at the same time, the angle of the rotating mirror module is deflected so that there is a negative inclination angle between the generatrix of the output laser beam and the generatrix of the corresponding segment of the hole to be processed, and then the linear movement of the dynamic focusing module is used to change the processing depth to complete the processing of the corresponding segment of the hole to be processed, and finally, the segments of the hole to be processed are processed in turn from top to bottom to form the special-shaped hole.

2. The laser drilling method for special-shaped holes according to claim 1, characterized in that: The multiple holes to be processed are divided into upper holes to be processed, middle holes to be processed and lower holes to be processed from top to bottom, and the upper holes to be processed, middle holes to be processed and lower holes to be processed are processed in sequence at a negative inclination angle between the generatrix of the output laser beam and the generatrix of the corresponding section of holes to be processed.

3. The laser drilling method for special-shaped holes according to claim 1, characterized in that: The mirror reflection adjustment group includes a first adjustment group for adjusting the laser beam to the left or right, and a second adjustment group for adjusting the laser beam upward or downward, wherein the first adjustment group includes a left inner reflector and a right outer reflector arranged along the left-right direction, the laser beam is relatively reflected between the left inner reflector and the right outer reflector and is emitted from the first adjustment group while maintaining the same angle as the incident angle; the second adjustment group includes an upper inner reflector and a lower outer reflector arranged along the up-down direction, the laser beam is relatively reflected between the upper inner reflector and the lower outer reflector and is emitted from the second adjustment group while maintaining the same angle as the incident angle, and the cooperation between the first adjustment group and the second adjustment group can change the position of the light beam toward the dynamic focusing module along the corresponding adjusted synthetic direction.

4. The laser drilling method for special-shaped holes according to claim 3, characterized in that: The mirror surfaces of the left inner reflector and the right outer reflector are parallel and spaced apart from each other. One of them is fixed and the other can be adjusted linearly relative to each other, and the laser directed to the dynamic focusing module can be adjusted in the left and right directions during movement in the front-to-back direction.

5. The laser drilling method for special-shaped holes according to claim 3 or 4, characterized in that: The mirror surfaces of the left inner reflector and the right outer reflector have two or more reflective surfaces at an angle of 45 degrees, and the laser beam is directly incident on the reflective surface of the right outer reflector and then reflects inside the left inner reflector, then reflects forward while maintaining a horizontal state and then reflects rightward and forward, so that the laser beam enters and exits from opposite sides of the right outer reflector in parallel; and / or, the right outer reflector is arranged on the base for linear movement along the front-rear direction; the left inner reflector is fixed on the base.

6. The laser drilling method for special-shaped holes according to claim 3, characterized in that: The mirror surfaces of the upper inner reflector and the lower outer reflector are parallel and spaced apart from each other. One of them is fixed, and the other can be adjusted linearly relative to the other, and can be moved in the front-to-back direction so that the laser directed to the dynamic focusing module can be adjusted in the up-and-down direction.

7. The laser drilling method for special-shaped holes according to claim 6, characterized in that: The mirror surfaces of the upper inner reflector and the lower outer reflector have two or more reflective surfaces at an angle of 45°, and the laser beam is directly incident on the reflective surface of the lower outer reflector and then emitted upward, forward, downward, and forward again, wherein the laser beam enters and exits in parallel from opposite sides of the lower outer reflector; and / or, the upper inner reflector is fixedly arranged, and the lower outer reflector can be moved and adjusted in the front-to-back direction, so that the laser directed to the dynamic focusing module can be adjusted in the up-and-down direction.

8. The laser drilling method for special-shaped holes according to claim 1, characterized in that: The reflector group includes a first reflector and a second reflector, wherein the laser beam emitted from the laser emitter is reflected by the first reflector and the second reflector in sequence and is emitted into the reflector adjustment module in the opposite direction to the emitted light beam.

9. The laser drilling method for special-shaped holes according to claim 8, characterized in that: The first reflector and the second reflector are symmetrically arranged, and / or the first reflector and the second reflector are both inclined at 45°.

10. The laser drilling method for special-shaped holes according to claim 1, characterized in that: The dynamic focusing module includes a negative focal length lens that can be moved and adjusted along the front-to-back direction; a focusing lens fixed on the device base and capable of focusing the light beam upward, downward, left or right and directing it to the co-rotating reflector module, wherein the linear movement of the negative focal length lens is used to change the processing depth.

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