Ultrafast laser parallel processing system

Abstract

The present application relates to an ultrafast laser parallel processing system, and to the field of laser precision processing technology. The ultrafast laser parallel processing system includes a main processing unit, and the main processing unit includes: a first lifting and conveying module, a double-layer conveying module, a second lifting and conveying module, a connecting and conveying module, a two-way conveying line module, an identification module, a frame, a laser processing module, and an image detection module connected in sequence along a first direction. In the process of processing the workpiece, the above-mentioned ultrafast laser parallel processing system improves the efficiency of the processing line, saves time, and at the same time improves the efficiency during processing, thereby realizing automated low-cost, large-scale production.

Description

Technical Field

[0001] The present application relates to the technical field of laser precision processing, and in particular to an ultrafast laser parallel processing system. Background Art

[0002] There are many methods for preparing micro-nano structures on the surface of materials, such as photolithography, nanoimprinting, electron beam etching, laser processing, etc. Femtosecond laser micromachining is a processing technology that can form microstructures on almost any surface without a mask, and it has high processing accuracy, can process a large area, can achieve three-dimensional processing, can be processed on almost any material, and has almost all the advantages of other processing methods.

[0003] There are two main types of existing femtosecond laser processing systems. One is that a femtosecond beam generation module generates a femtosecond laser, which is focused on the surface of the workpiece through a reflector, a spatial mask, a lens, etc. The workpiece is placed on a translation stage that can perform XYZ three-dimensional movement. The focus is aligned by moving the translation stage up and down. By performing two-dimensional XY movement and Z-axis stepping, the processing of different three-dimensional spatial positions is achieved through linkage with the femtosecond beam generation module. The advantages of this processing scheme are high accuracy and repeatability, which is suitable for scientific research and convenient for modulating and converting light. However, the problem is that the processing efficiency is too low, and its laser utilization rate is very low, and the processing area is very limited. Although there are commercial systems based on this architecture, due to its high processing cost, it is currently widely used in the scientific research field of universities and basically does not have the ability for industrial processing.

[0004] Another laser processing system is a femtosecond laser generated by a femtosecond beam generation module. After passing through a reflector and a spatial mask, it passes through a pair of orthogonal galvanometers and is focused on the upper surface of the workpiece by a field lens. The workpiece is placed on a Z-axis translation stage and the focus is aligned by Z-axis movement. After the light beam passes through the orthogonal galvanometer, if the galvanometer is deflected, the laser angle is deflected, and finally the field lens is focused on different positions. Through the linkage of the orthogonal galvanometer and the beam generation module, any two-dimensional graphics can be processed. By introducing the Z-axis linkage of the workpiece, processing in three-dimensional space can be achieved. Since the galvanometer can vibrate at high speed, the focused light moves very fast, usually exceeding 1m / s, which is much greater than the general displacement system. The processing efficiency is significantly improved, and the time and money costs are reduced. Therefore, this solution is more common in the field of femtosecond laser industrialization, but the problem is that the single processing format is small, and an additional XY splicing axis needs to be introduced to achieve splicing processing. Although its processing efficiency is greatly improved, compared with the processing methods of photolithography and traditional mechanical processing, its efficiency is obviously much lower, and there is still room for further improvement.

[0005] In summary, the current processing cost of femtosecond laser-dedicated processing systems is relatively high, and it takes a long time to process large-area workpieces, making it impossible to achieve automated, low-cost, large-scale production in a short period of time. Summary of the invention

[0006] Based on this, it is necessary to provide an ultrafast laser parallel processing system to address the problems that the current femtosecond laser dedicated processing system has high processing costs and takes a long time to perform automated processing on large-area workpieces.

[0007] An ultrafast laser parallel processing system, the ultrafast laser parallel processing system comprises a main processing unit, the main processing unit comprises: a first lifting and conveying module, a double-layer conveying module, a second lifting and conveying module, a connecting conveying module, a two-way conveying line module, an identification module, a frame, a laser processing module and an image detection module connected in sequence along a first direction;

[0008] The first lifting conveying module, the double-layer conveying module, and the second lifting conveying module are connected to form an upper conveying line and a lower conveying line, the upper conveying line is used to convey the workpieces to be processed to the docking conveying module, and the lower conveying line is used to convey the processed workpieces from the docking conveying module to the first lifting conveying module;

[0009] The frame body is provided with a conveying hole along a first direction, and a processing hole is provided along the first direction from the top of the frame body along a second direction, and the processing hole is connected with the conveying hole;

[0010] The bidirectional conveyor line module is located in the conveying hole, and can convey the workpiece to be processed from the connecting conveying module to the processing hole along a first direction, or convey the processed workpiece from the processing hole to the connecting conveying module. An adjustment unit is provided on the bidirectional conveyor line module, and the adjustment unit is used to adjust the posture of the workpiece to be processed relative to the processing hole according to the signal of the recognition module;

[0011] The recognition module is arranged on the frame and faces the bidirectional conveyor line module, and is used to calibrate the position of the workpiece to be processed. The laser processing module is arranged on the processing hole and faces the bidirectional conveyor line module, and is used to process the workpiece to be processed. The image detection module faces the bidirectional conveyor line module, and is used to detect the processing process of the workpiece to be processed. The first direction is the conveying direction of the workpiece to be processed, and the second direction is a vertical direction and is perpendicular to the first direction.

[0012] In one embodiment, the adjustment unit includes a first adjustment module and a second adjustment module, the first adjustment module is arranged on the bidirectional conveyor line module, the bidirectional conveyor line module drives the first adjustment module to move along the first direction, the second adjustment module is arranged on the first adjustment module, the first adjustment module adjusts the position of the second adjustment module along the third direction, the workpiece to be processed is arranged on the second adjustment module, the second adjustment module is used to drive the workpiece to be processed to rotate around the second direction, and the first direction, the second direction and the third direction are perpendicular to each other.

[0013] In one embodiment, the laser processing module includes a plurality of beam generating modules, each of which is capable of splitting a plurality of processing laser beams, and the processing laser beams are emitted toward the workpiece to be processed.

[0014] In one embodiment, the beam generating module comprises a sealed optical path component, a galvanometer, a field lens, a height meter and a dust extraction device arranged in a housing;

[0015] The processing light beam of the sealed optical path component is projected toward the workpiece to be processed through a galvanometer and a field mirror. The altimeter is used to measure the distance from the position where the workpiece needs to be processed to the light beam generating module. The dust extraction device is used to extract granular waste during the processing.

[0016] In one embodiment, the beam generating module further comprises a power spectral density meter and a dimming element, wherein the dimming element is sealed in the optical path element and is used to adjust the shape of the processing beam, and the power spectral density meter is connected to the housing and is used to measure the power spectral density of the processing beam.

[0017] In one embodiment, the laser processing module also includes a plurality of position adjustment devices corresponding one-to-one to the plurality of beam generating modules, the beam generating modules are arranged on the position adjustment devices, the position adjustment devices are arranged at the openings of the processing holes of the frame, and the position adjustment devices are used to drive the beam generating modules to approach or move away from the workpiece to be processed.

[0018] In one embodiment, the identification module includes: a rough calibration device and a fine calibration device;

[0019] The rough calibration device includes a first displacement platform and a first camera, wherein the first displacement platform is disposed at one end of the frame body close to the docking conveying module, and the first camera is disposed on the first displacement platform, and the first displacement platform drives the first camera to approach or move away from the bidirectional conveying line module;

[0020] The precision calibration device includes a second translation stage and a second camera. The second translation stage is arranged on the frame and located at the side wall or opening of the processing hole. The second camera is arranged on the second translation stage. The second translation stage drives the second camera to approach or move away from the bidirectional conveyor line module.

[0021] In one embodiment, the main body processing unit further includes a monitoring unit, the monitoring unit includes a first moving module, a second moving module, and a three-dimensional microscope module and a laser rangefinder arranged on the second moving module, the first moving module is arranged at one end of the frame close to the docking and conveying module, the second moving module is arranged on the first moving module, the first moving module drives the second moving module to move along the third direction, and the second moving module drives the three-dimensional microscope module and the laser rangefinder to move along the second direction;

[0022] The first direction, the second direction and the third direction are perpendicular to each other.

[0023] In one embodiment, the ultrafast laser parallel processing system further includes an auxiliary unit disposed next to the main processing unit, the auxiliary unit including: a chiller array, an electric control cabinet, and a dust removal tower, the dust removal tower being used to remove granular waste during the processing of the main processing unit;

[0024] The chiller array is used to cool the main processing unit, and the electric control cabinet is connected to the main processing unit to control the conveying and processing process of the main processing unit.

[0025] In one embodiment, the docking and conveying module includes a base, a lifting device, a roller conveying line, a power motor and an adjusting motor;

[0026] The lifting device is arranged on the base, the roller conveyor line is arranged on the lifting device, the power motor is used to drive the roller conveyor line to convey the workpiece to be processed and the processed workpiece, and the adjustment motor is used to adjust the conveying speed of the roller conveyor line.

[0027] In the process of processing the workpiece by the above-mentioned ultrafast laser parallel processing system, the workpiece is transported to the connecting conveying module through the upper conveying line formed by the first lifting and conveying module, the double-layer conveying module and the second lifting and conveying module. In this process, the first lifting and conveying module lifts the workpiece to be processed to the double-layer conveying module for the first time, and then it is lifted for the second time by the second lifting and conveying module and transported to the connecting conveying module. The connecting conveying module receives the workpiece to be processed on the upper conveying line, and the recognition module takes a picture to locate the workpiece to be processed. Then the adjustment unit provided on the bidirectional conveying line module adjusts the posture of the workpiece to be processed relative to the processing hole according to the signal of the recognition module. Then the bidirectional conveying line module transports the workpiece to be processed to the bottom of the processing hole, and the laser processing module located above the workpiece to be processed processes the workpiece to be processed in the second direction. If it is necessary to process the workpiece in different directions, it can be processed according to the recognition module. The block and adjustment unit adjust the posture of the workpiece to be processed, and then re-transport it to the bottom of the processing hole, and process the workpiece to be processed in another posture through the laser processing module. After the processing is completed, the two-way conveyor line module transports the processed workpiece to the docking conveying module, and the docking conveying module transports the processed workpiece to the lower conveyor line, and successively passes through the second lifting conveying module, the double-layer conveying module, and the first lifting conveying module to the end of the first lifting conveying module away from the laser processing module, so that the processing of one workpiece to be processed is completed. During the processing of one of the workpieces to be processed, the other workpiece to be processed can be transported to the upper conveyor line for waiting, and at the same time, the laser processing module can be used to process the surface of the whole workpiece perpendicular to the second direction, thereby realizing the improvement of the efficiency of the processing line and saving time. At the same time, the efficiency during processing is also improved, thereby realizing automated low-cost and large-scale production. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] FIG. 1 is a schematic diagram of an ultrafast laser parallel processing system according to an embodiment.

[0029] FIG. 2 is a schematic diagram of a first lifting and conveying module, a double-layer conveying module, and a second lifting and conveying module.

[0030] FIG. 3 is an enlarged view of the frame in FIG. 1 .

[0031] FIG. 4 is a schematic structural diagram of the ultrafast laser parallel processing system at the conveying hole in FIG. 1 .

[0032] FIG. 5 is a schematic structural diagram of the laser processing module in FIG. 1 .

[0033] FIG. 6 is a schematic structural diagram of five beam generating modules arranged in parallel along a third direction in FIG. 1 .

[0034] FIG. 7 is a schematic diagram of an identification module.

[0035] FIG. 8 is a schematic diagram of a docking and conveying module.

[0036] Description of Figure Numbers:

[0037] 10-Ultrafast laser parallel processing system;

[0038] 100-main processing unit;

[0039] 110-first lifting and conveying module;

[0040] 120-double-layer conveying module; 121-upper conveying line; 122-lower conveying line; 123-monitoring unit; 124-first moving module; 125-second moving module; 126-three-dimensional microscope module; 127-laser rangefinder;

[0041] 130- second lifting and conveying module;

[0042] 140-connection conveying module; 141-base; 142-lifting device; 143-roller conveying line; 144-power motor; 145-adjusting motor; 146-needle bearing guide mechanism;

[0043] 150-bidirectional conveyor line module; 151-adjustment unit; 152-first adjustment module; 153-second adjustment module;

[0044] 160-recognition module; 161-rough calibration device; 162-fine calibration device; 163-first translation stage; 164-first camera; 165-second translation stage; 166-second camera;

[0045] 170-frame; 171-transport hole; 172-processing hole;

[0046] 180-laser processing module; 181-beam generation module; 1811-position adjustment device; 1812-laser; 1813-optical cavity; 1814-leakage detector; 182-housing; 183-sealed optical path component; 184-galvanometer; 185-field mirror; 186-altimeter; 187-dust extraction device; 188-power spectrum density measuring instrument; 189-dimming component;

[0047] 190-image detection module;

[0048] 200- auxiliary unit; 201- chiller array; 202- electric control cabinet; 203- dust removal tower; 204- laser water cooler; 205- galvanometer water cooler;

[0049] 210-workpiece to be processed; 211-workpiece completed;

[0050] OX-first direction; OY-second direction; OZ-third direction. DETAILED DESCRIPTION

[0051] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0052] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0053] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0054] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0055] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0056] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0057] Refer to Figure 1, which shows a structural schematic diagram of an ultrafast laser parallel processing system 10 in an embodiment of the present application. The ultrafast laser parallel processing system 10 includes a main processing unit 100, and the main processing unit 100 includes: an identification module 160, a laser processing module 180, and an image detection module 190. At the same time, the main processing unit 100 also includes a first lifting and conveying module 110, a double-layer conveying module 120, a second lifting and conveying module 130, a connecting conveying module 140, a bidirectional conveying line module 150 and a frame 170 connected in sequence along a first direction OX.

[0058] Referring to Figures 2 to 5, in the above-mentioned ultrafast laser parallel processing system 10, the first lifting and conveying module 110, the double-layer conveying module 120, and the second lifting and conveying module 130 are connected to form an upper conveying line 121 and a lower conveying line 122. The upper conveying line 121 is used to convey the workpiece 210 to be processed to the docking conveying module 140, and the lower conveying line 122 is used to convey the processed workpiece 211 from the docking conveying module 140 to the first lifting and conveying module 110.

[0059] The frame 170 is provided with a conveying hole 171 along the first direction OX, and a processing hole 172 is provided at the top of the frame 170 along the second direction OY, and the processing hole 172 is connected to the conveying hole 171. The bidirectional conveying line module 150 is located in the conveying hole 171, and can convey the workpiece 210 to be processed from the connecting conveying module 140 to the processing hole 172 along the first direction OX, or convey the processed workpiece 211 from the processing hole 172 to the connecting conveying module 140. The bidirectional conveying line module 150 is provided with an adjustment unit 151, and the adjustment unit 151 is used to adjust the posture of the workpiece 210 to be processed relative to the processing hole 172 according to the signal of the recognition module 160. The recognition module 160 is set on the frame 170 and faces the bidirectional conveyor line module 150, so as to identify the posture of the workpiece 210 to be processed. The laser processing module 180 is set on the processing hole 172 and faces the bidirectional conveyor line module 150, so as to process the workpiece 210 to be processed. The image detection module 190 is set on the frame 170 and faces the bidirectional conveyor line module 150 through the processing hole 172, so as to detect the processing process of the workpiece 210 to be processed. The first direction OX is the conveying direction of the workpiece 210 to be processed, and the second direction OY is the vertical direction and is perpendicular to the first direction OX.

[0060] In the process of processing the workpiece 210 by the above-mentioned ultrafast laser parallel processing system 10, the workpiece 210 is transported to the docking conveying module 140 through the upper conveying line 121 formed by the connection of the first lifting and conveying module 110, the double-layer conveying module 120, and the second lifting and conveying module 130. In this process, the first lifting and conveying module 110 lifts the workpiece 210 to the double-layer conveying module 120 for the first time, and then it is lifted for the second time by the second lifting and conveying module 130 and transported to the docking conveying module. The docking conveying module receives the workpiece 210 on the upper conveying line 121, and the recognition module 160 takes a picture to locate the workpiece 210, and then the adjustment unit 151 provided on the bidirectional conveying line module 150 adjusts the posture of the workpiece 210 relative to the processing hole 172 according to the signal of the recognition module 160. Then the bidirectional conveyor line module 150 conveys the workpiece 210 to the bottom of the processing hole 172, and the laser processing module 180 located above the workpiece 210 processes the workpiece 210 in the second direction OY. If the workpiece 210 needs to be processed in different directions, the posture of the workpiece 210 can be adjusted according to the recognition module 160 and the adjustment unit 151, and then it is re-conveyed to the bottom of the processing hole 172, and the workpiece 210 in another posture is processed by the laser processing module 180, and the processing process of the workpiece 210 is detected in real time by the image detection module 190. After the processing is completed, the bidirectional conveyor line module 150 conveys the processed workpiece 211 to the docking conveyor module, and the docking conveyor module conveys the processed workpiece 211 to the lower conveyor line 122, and is successively conveyed to the end of the first lifting conveyor module 110 away from the laser processing module 180 through the second lifting conveyor module 130, the double-layer conveyor module 120, and the first lifting conveyor module 110, thereby completing the processing of one workpiece 210 to be processed. During the processing of one of the workpieces 210 to be processed, the other workpiece 210 to be processed can be conveyed to the upper conveyor line 121 for waiting. At the same time, the laser processing module 180 can be used to perform surface processing perpendicular to the second direction OY on the entire workpiece 210 to be processed, thereby improving the efficiency of the processing line and saving time. At the same time, the efficiency during processing is also improved, thereby realizing automated low-cost, large-scale production.

[0061] Specifically, the double-layer conveying module 120 is a roller friction conveying structure, and both the upper and lower layers of the double-layer conveying module 120 can feed or return materials. The conveying range of the first lifting conveying module 110 and the second lifting conveying module 130 is 0.1-2m from the ground where the equipment is installed.

[0062] Specifically, the material of the workpiece 210 to be processed includes but is not limited to processed metals, semiconductors, inorganic materials, organic materials, and thin film materials. The ultrafast laser parallel processing system 10 is used to add certain special functions to the surface of the workpiece 210 to be processed. The processing process is mainly surface black bodying, and the black body emissivity is between 0.7-0.9999, and the wavelength covers 0.3-16um; the shape of the surface to be processed includes but is not limited to rectangle, square, circle, irregular shape, the maximum processing side length is 1m-3m, and the weight of the workpiece 210 to be processed is 1kg-1t.

[0063] In some embodiments, the ultrafast laser parallel processing system 10 can also be used to manufacture, including but not limited to, surface hydrophobic structures, surface drag reduction structures, or to process the surface of solar cells; the ultrafast laser parallel processing system 10 can be used not only for planar surface processing, but also for slightly undulating curved surface processing.

[0064] Referring to Figure 4, in one embodiment, the adjustment unit 151 includes a first adjustment module 152 and a second adjustment module 153. The first adjustment module 152 is arranged on the bidirectional conveyor line module 150. The bidirectional conveyor line module 150 drives the first adjustment module 152 to move along the first direction OX. The second adjustment module 153 is arranged on the first adjustment module 152. The first adjustment module 152 adjusts the position of the second adjustment module 153 along the third direction OZ. The workpiece 210 to be processed is arranged on the second adjustment module 153. The second adjustment module 153 is used to drive the workpiece 210 to be processed to rotate around the second direction OY. The first direction OX, the second direction OY and the third direction OZ are perpendicular to each other, so that the posture of the workpiece 210 to be processed can be adjusted and calibrated, thereby improving the processing accuracy. At the same time, the workpiece 210 to be processed can be rotated, and the second adjustment module 153 can drive the workpiece 210 to be processed to rotate around the axis of the second direction OY, so that multi-directional processing can be performed, thereby improving automation efficiency.

[0065] Specifically, after the workpiece 210 is processed for the first time along the first direction OX, the second adjustment module 153 rotates the workpiece 210 around the second direction OY by 90°, and then processes at another angle.

[0066] Specifically, the running length of the bidirectional conveyor line module 150 is 1-5m, and the precision is 1-10um. The moving length of the first adjustment module 152 is 0-1m, and the precision is 1-10um. The rotation precision of the second adjustment module 153 is 0.1 second-1 minute.

[0067] Referring to Figures 5 and 6, in one embodiment, the laser processing module 180 includes multiple beam generating modules 181, each of which can split multiple beams of processing lasers. The processing lasers are emitted to the workpiece 210 to be processed. The multiple beam generating modules 181 split the multiple beams into multiple beams of processing lasers, thereby shortening the processing time of a single workpiece 210 to be processed, thereby improving the processing efficiency.

[0068] Referring to Figures 5 and 6, in one embodiment, the light beam generating module 181 includes a sealed optical path component 183, a galvanometer 184, a field lens 185, an altimeter 186 and a dust extraction device 187, which are arranged in a housing 182, wherein the sealed optical path component 183 is filled with positive pressure to ensure the cleanliness and safety of the light path to the greatest extent; the processing light beam of the sealed optical path component 183 passes through the galvanometer 184 and the field lens 185 and is emitted to the workpiece 210 to be processed; the altimeter 186 is used to measure the distance from the position where the workpiece 210 to be processed needs to be processed to the light beam generating module 181, thereby improving production stability; the dust extraction device 187 is used to extract granular waste during the processing process, thereby improving process stability and ensuring a clean and safe production environment.

[0069] 5 and 6 , in one embodiment, the light beam generating module 181 further includes a power spectral density meter 188 and a dimming element 189. The dimming element 189 is located in the sealed optical path element 183 and is used to adjust the shape of the processing light beam. The power spectral density meter 188 is connected to the housing 182 and is used to measure the power spectral density of the processing light beam to facilitate the collection of light beam deviation data.

[0070] Referring to Figures 5 and 6, in one embodiment, the laser processing module 180 also includes a plurality of position adjustment devices 1811 corresponding one-to-one to the plurality of beam generating modules 181. The beam generating module 181 is disposed on the position adjustment device 1811. The position adjustment device 1811 is disposed at the opening of the processing hole 172 of the frame 170. The position adjustment device 1811 is used to drive the beam generating module 181 to approach or move away from the workpiece 210 to be processed so that it can pass through the position adjustment device 1811.

[0071] Referring to FIG. 7 , in one embodiment, the recognition module 160 includes: a rough calibration device 161 and a fine calibration device 162. The rough calibration device 161 includes a first displacement platform 163 and a first camera 164. The first displacement platform 163 is disposed at one end of the frame 170 close to the docking and conveying module 140. The first camera 164 is disposed on the first displacement platform 163. The first displacement platform 163 drives the first camera 164 to approach or move away from the bidirectional conveying line module 150, so as to enable the docking and conveying module 140 to perform position and posture calibration on the workpiece 210 through the image signal of the first camera 164.

[0072] The precision calibration device 162 includes a second displacement platform 165 and a second camera 166. The second displacement platform 165 is arranged on the frame 170 and is located on the side wall or opening of the processing hole 172. The second camera 166 is arranged on the second displacement platform. The second displacement platform drives the second camera 166 to approach or move away from the bidirectional conveyor line module 150. When the second camera 166 of the precision calibration module detects that the position or posture of the workpiece 210 to be processed is offset, the workpiece 210 to be processed can be returned to the docking conveying module 140 for correction, or the posture of the workpiece 210 to be processed can be adjusted by the first adjustment module 152 and the second adjustment module 153 of the adjustment unit 151 in cooperation with the bidirectional conveyor line module 150.

[0073] Referring to FIG. 4 , in one embodiment, the main body processing unit 100 further includes a monitoring unit 123, which includes a first moving module 124, a second moving module 125, and a three-dimensional microscope module 126 and a laser rangefinder 127 disposed on the second moving module 125. The first moving module 124 is disposed at one end of the frame 170 close to the docking and conveying module 140, and the second moving module 125 is disposed on the first moving module 124. The first moving module 124 drives the second moving module 125 to move along the third direction OZ, and the second moving module 125 drives the three-dimensional microscope module 126 and the laser rangefinder 127 to move along the second direction OY. The first direction OX, the second direction OY and the third direction OZ are perpendicular to each other. The first moving module 124 and the second moving module 125 of the detection unit drive the three-dimensional microscope module 126 and the laser rangefinder 127 to move along the second direction OY and the third direction OZ respectively, so that the three-dimensional microscope module 126 and the laser rangefinder 127 can cooperate with the movement of the workpiece 210 to be processed along the first direction OX, perform system calibration on the ultrafast laser parallel processing system 10, measure the thickness of the workpiece 210 to be processed, and measure the surface morphology of the workpiece 210 to be processed.

[0074] Referring to FIG. 1 , in one embodiment, the ultrafast laser parallel processing system 10 further includes an auxiliary unit 200 disposed next to the main processing unit 100, and the auxiliary unit 200 includes: a chiller array 201, an electric control cabinet 202, and a dust removal tower 203, and the dust removal tower 203 is used to remove granular waste during the processing of the main processing unit 100. The chiller array 201 is used to cool the main processing unit 100, and the electric control cabinet 202 is connected to the main processing unit 100 through a cable to control the transportation and processing process of the main processing unit 100.

[0075] Specifically, the beam generating module 181 also includes a laser 1812, an optical cavity 1813, and a water leakage detector 1814. The laser 1812 is placed near the frame 170 and emits a laser to the optical cavity 1813 placed on the side of the frame 170 facing away from the ground. The optical cavity 1813 transmits the laser to the sealed optical path component 183. The water leakage detector 1814 is connected to the laser 1812 and is used to detect whether the laser 1812 is leaking. The chiller array 201 includes a laser water chiller 204 and a galvanometer water chiller 205. The laser 1812 water chiller is connected to the laser 1812 for cooling the laser 1812. The galvanometer 184 water chiller is connected to the galvanometer 184 for cooling the galvanometer 184.

[0076] Specifically, the number of lasers 1812 is 1-20, which are femtosecond lasers 1812. The optical cavity 1813 has the functions of optical parameter monitoring and light beam deflection. All devices of the main processing unit 100 are placed on a marble machine tool, and the bottom steel base is embedded under the marble machine tool to support the entire ultrafast laser parallel processing system 10.

[0077] Specifically, as shown in FIG1 , the frame is assembled from large blocks of marble, and conveying holes and processing holes are formed through assembly. Compared with opening processing holes and conveying holes in a whole block of material, disassembly and installation are more convenient, and the assembly cost and raw material cost of the frame substrate are lower.

[0078] Referring to FIG8 , in one embodiment, the docking and conveying module 140 includes: a base 141, a lifting device 142, a roller conveyor line 143, a power motor 144 and an adjustment motor 145. The lifting device 142 is arranged on the base 141, the roller conveyor line 143 is arranged on the lifting device 142, the power motor 144 is used to drive the roller conveyor line 143 to convey the workpiece 210 to be processed and the finished workpiece 211, and the adjustment motor 145 is used to adjust the conveying speed of the roller conveyor line 143. Thus, the lifting docking and stable conveying speed are achieved, and the posture of the workpiece 210 to be processed is guaranteed to be stable during the conveying and docking process, so as to ensure that the processing accuracy meets the standard, and the posture of the finished workpiece 211 can also be guaranteed during the docking, so that the entire automated processing is more stable and neat. Among them, the power motor 144 is a servo motor, and can also be a power module such as a cylinder, and the adjustment motor 145 is a variable frequency reduction motor, and can also be other power modules for adjusting the conveying speed.

[0079] Specifically, the docking conveying module 140 also includes a needle bearing guide mechanism 146 disposed on the roller conveying line 143 for guiding and correcting the conveying posture of the workpiece 210 to be processed.

[0080] Specifically, the first camera 164 is a CCD camera with a calibration accuracy of 10 um-1 mm.

[0081] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0082] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An ultrafast laser parallel processing system, characterized in that: The ultrafast laser parallel processing system includes a main processing unit, which includes: an identification module, a laser processing module, an image detection module, a first lifting and conveying module, a double-layer conveying module, a second lifting and conveying module, a connecting conveying module, a bidirectional conveying line module and a frame connected in sequence along a first direction; The first lifting and conveying module, the double-layer conveying module, and the second lifting and conveying module are connected to form an upper conveying line and a lower conveying line; the upper conveying line is used to convey the workpieces to be processed to the docking conveying module, and the lower conveying line is used to convey the processed workpieces from the docking conveying module to the first lifting and conveying module; The frame body is provided with a conveying hole along a first direction, and a processing hole is provided at the top of the frame body along a second direction, wherein the processing hole is connected to the conveying hole; The bidirectional conveyor line module is located in the conveying hole, and can convey the workpiece to be processed from the connecting conveying module to the processing hole along a first direction, or convey the processed workpiece from the processing hole to the connecting conveying module; The recognition module is arranged on the frame and faces the bidirectional conveyor line module, and is used to recognize the posture of the workpiece to be processed; the bidirectional conveyor line module is provided with an adjustment unit, and the adjustment unit is used to adjust the posture of the workpiece to be processed relative to the processing hole according to the signal of the recognition module; The laser processing module is arranged at the processing hole and faces the bidirectional conveyor line module for processing the workpiece to be processed. The image detection module is arranged on the frame and faces the bidirectional conveyor line module through the processing hole for detecting the processing process of the workpiece to be processed. The first direction is the conveying direction of the workpiece to be processed, and the second direction is a vertical direction and is perpendicular to the first direction.

2. The ultrafast laser parallel processing system according to claim 1, characterized in that: The adjustment unit includes a first adjustment module and a second adjustment module. The first adjustment module is arranged on the bidirectional conveying line module, and the bidirectional conveying line module drives the first adjustment module to move along the first direction. The second adjustment module is arranged on the first adjustment module, and the first adjustment module adjusts the position of the second adjustment module along the third direction. The workpiece to be processed is arranged on the second adjustment module, and the second adjustment module is used to drive the workpiece to be processed to rotate around the second direction. The first direction, the second direction and the third direction are perpendicular to each other.

3. The ultrafast laser parallel processing system according to claim 1, characterized in that: The laser processing module includes a plurality of beam generating modules, each of which is capable of splitting a plurality of processing laser beams, and the processing laser beams are emitted toward the workpiece to be processed.

4. The ultrafast laser parallel processing system according to claim 3, characterized in that: The beam generating module comprises a sealed optical path component, a galvanometer, a field mirror, a height meter and a dust extraction device arranged in a housing; The processing light beam of the sealed optical path component is projected toward the workpiece to be processed through a galvanometer and a field mirror. The altimeter is used to measure the distance from the position where the workpiece needs to be processed to the light beam generating module. The dust extraction device is used to extract granular waste during the processing.

5. The ultrafast laser parallel processing system according to claim 4, characterized in that: The light beam generating module further comprises a power spectrum density meter and a dimming element. The dimming element is located in the sealed optical path element and is used to adjust the shape of the processing light beam. The power spectrum density meter is connected to the housing and is used to measure the power spectrum density of the processing light beam.

6. The ultrafast laser parallel processing system according to claim 4, characterized in that: The laser processing module also includes multiple position adjustment devices corresponding to the multiple beam generating modules one by one. The beam generating modules are arranged on the position adjustment devices. The position adjustment devices are arranged at the openings of the processing holes of the frame. The position adjustment devices are used to drive the beam generating modules to approach or move away from the workpiece to be processed.

7. The ultrafast laser parallel processing system according to claim 1, characterized in that: The identification module includes: a rough calibration device and a fine calibration device; The rough calibration device includes a first displacement platform and a first camera, wherein the first displacement platform is disposed at one end of the frame body close to the docking conveying module, and the first camera is disposed on the first displacement platform, and the first displacement platform drives the first camera to approach or move away from the bidirectional conveying line module; The precision calibration device includes a second translation stage and a second camera. The second translation stage is arranged on the frame and located at the side wall or opening of the processing hole. The second camera is arranged on the second translation stage. The second translation stage drives the second camera to approach or move away from the bidirectional conveyor line module.

8. The ultrafast laser parallel processing system according to claim 1, characterized in that: The main body processing unit also includes a monitoring unit, which includes a first moving module, a second moving module, and a three-dimensional microscope module and a laser rangefinder arranged on the second moving module. The first moving module is arranged at one end of the frame close to the docking and conveying module, and the second moving module is arranged on the first moving module. The first moving module drives the second moving module to move along the third direction, and the second moving module drives the three-dimensional microscope module and the laser rangefinder to move along the second direction. The first direction, the second direction and the third direction are perpendicular to each other.

9. The ultrafast laser parallel processing system according to claim 1, characterized in that: The ultrafast laser parallel processing system further includes an auxiliary unit disposed next to the main processing unit, the auxiliary unit including: a chiller array, an electric control cabinet and a dust removal tower, the dust removal tower being used to remove granular waste during the processing of the main processing unit; The chiller array is used to cool the main processing unit, and the electric control cabinet is connected to the main processing unit to control the conveying and processing process of the main processing unit.

10. The ultrafast laser parallel processing system according to claim 1, characterized in that: The docking and conveying module includes a base, a lifting device, a roller conveying line, a power motor and an adjusting motor; The lifting device is arranged on the base, the roller conveyor line is arranged on the lifting device, the power motor is used to drive the roller conveyor line to convey the workpiece to be processed and the processed workpiece, and the adjustment motor is used to adjust the conveying speed of the roller conveyor line.

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