Polishing control method and device supporting silicon wafer size switching and silicon wafer

Abstract

The embodiment of the invention relates to the technical field of semiconductor manufacturing, and discloses a polishing control method and equipment supporting silicon wafer size switching and a silicon wafer. The method comprises the steps that after a silicon wafer size switching event is recognized, a diamond brush on a polishing head is controlled to rotate polishing cloth in the first direction, and meanwhile a fixed disc where the polishing cloth is located is controlled to rotate in the first direction; after the first duration is reached, a diamond brush on the polishing head is controlled to rotate the polishing cloth in the second direction, and meanwhile a fixed disc where the polishing cloth is located is controlled to rotate in the first direction; after the second duration is reached, a nylon brush is used for brushing the polishing cloth; and polishing the silicon wafer after controlling the size switching on a machine. According to the scheme, the polishing cloth does not need to be replaced, so that operation becomes easy and convenient, normal operation of a production line cannot be stopped, production efficiency is improved, compatibility of silicon wafers of different sizes in the polishing process can be improved, much labor cost and material resource cost do not need to be paid, and the method is suitable for production of various batches and scales.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a polishing control method, equipment and silicon wafer supporting silicon wafer size switching. Background Art

[0002] In recent years, with the rapid development of Internet technology, the field of semiconductor manufacturing has developed rapidly. In the semiconductor manufacturing process, chemical mechanical polishing (CMP) of wafers is an important step, which involves the use of polishing cloth and polishing liquid to flatten the wafer surface for subsequent lithography and etching processes. In the traditional CMP process, when it is necessary to switch to a wafer of a different size for processing, it is usually necessary to replace the polishing cloth of the corresponding size, which will lead to the following problems: increased operational complexity, the replacement of the polishing cloth requires stopping the production line and manually replacing it, which not only increases the operating steps, but also may introduce human errors. Reduced production efficiency, frequent replacement of polishing cloths leads to increased machine downtime, thereby reducing overall production efficiency. Increased costs, each replacement of polishing cloths will generate additional material consumption and labor costs, increasing production costs. Decreased equipment utilization, due to the need to stop the machine to replace the polishing cloth, the utilization rate of the equipment is reduced, affecting the return on investment of the equipment. Environmental impact, frequent replacement of polishing cloths generates a large amount of waste, which has a negative impact on the environment. Restricted flexibility, in a multi-variety, small batch production mode, frequent replacement of polishing cloths limits production flexibility. Summary of the invention

[0003] One purpose of the present application is to provide a polishing control method, device and silicon wafer that supports silicon wafer size switching, at least to solve the problems of complex operation, reduced production efficiency and increased cost. After identifying the silicon wafer size switching event, the present application controls the diamond brush on the polishing head to rotate the polishing cloth in the first direction, and controls the fixed plate where the polishing cloth is located to rotate in the first direction; after reaching the first time length, the diamond brush on the polishing head is controlled to rotate the polishing cloth in the second direction, and controls the fixed plate where the polishing cloth is located to rotate in the first direction; after reaching the second time length, the nylon brush is used to brush the polishing cloth; the silicon wafer after size switching is controlled to be polished on the machine. By adopting this solution, there is no need to replace the polishing cloth, so that the operation becomes simple, and the normal operation of the production line will not be stopped, which improves the production efficiency. At the same time, it can also improve the compatibility of silicon wafers of different sizes in the polishing process, without paying more manpower and material costs, and adapt to various batch production.

[0004] To achieve the above objectives, some embodiments of the present application provide the following aspects:

[0005] In a first aspect, some embodiments of the present application further provide a polishing control method supporting silicon wafer size switching, comprising:

[0006] After identifying a silicon wafer size switching event, controlling the diamond brush on the polishing head to rotate the polishing cloth in a first direction, and controlling the fixed plate where the polishing cloth is located to rotate in the first direction;

[0007] After the first time period is reached, the diamond brush on the polishing head is controlled to rotate the polishing cloth in the second direction, and at the same time, the fixed plate where the polishing cloth is located is controlled to rotate in the first direction;

[0008] After reaching the second time period, brushing the polishing cloth with a nylon brush;

[0009] The silicon wafer is polished on the machine after the size switching is controlled.

[0010] In a second aspect, some embodiments of the present application further provide a device for executing the polishing control method supporting silicon wafer size switching as described above.

[0011] In a third aspect, some embodiments of the present application further provide a silicon wafer, which is obtained by using the polishing control method supporting silicon wafer size switching as described above.

[0012] In a fourth aspect, some embodiments of the present application further provide an electronic device, comprising: one or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, cause the processor to perform the steps of the method described above.

[0013] In a fifth aspect, some embodiments of the present application further provide a computer-readable medium having computer program instructions stored thereon, wherein the computer program instructions can be executed by a processor to implement the method as described above.

[0014] In a sixth aspect, some embodiments of the present application further provide a computer program product, comprising a computer program / instruction, which implements the steps of the method described above when executed by a processor.

[0015] Compared with the related art, the solution provided by the embodiment of the present application controls the diamond brush on the polishing head to rotate the polishing cloth in the first direction after identifying the silicon wafer size switching event, and controls the fixed plate where the polishing cloth is located to rotate in the first direction; after reaching the first time length, controls the diamond brush on the polishing head to rotate the polishing cloth in the second direction, and controls the fixed plate where the polishing cloth is located to rotate in the first direction; after reaching the second time length, uses a nylon brush to brush the polishing cloth; controls the machine polishing of the silicon wafer after the size switching. By adopting this solution, there is no need to replace the polishing cloth, thereby simplifying the operation, and the normal operation of the production line will not be stopped, thereby improving production efficiency. At the same time, it can also improve the compatibility of silicon wafers of different sizes in the polishing process, without paying more manpower and material costs, and adapt to production of various batch sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0017] Figure 1 An exemplary flow chart of a polishing control method supporting silicon wafer size switching according to some embodiments of the present application;

[0018] Figure 2 A schematic diagram of a diamond brush according to some embodiments of the present application performing normal brushing;

[0019] Figure 3 A schematic diagram of reverse brushing of a diamond brush according to some embodiments of the present application;

[0020] Figure 4 An exemplary structural diagram of the electronic device is disclosed. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] First embodiment

[0023] The first embodiment of the present application relates to a polishing control method that supports silicon wafer size switching. Figure 1 As shown, the method may include the following steps:

[0024] Step S101, after identifying a silicon wafer size switching event, controlling a diamond brush on a polishing head to rotate the polishing cloth in a first direction, and controlling a fixed plate where the polishing cloth is located to rotate in the first direction;

[0025] The silicon wafer size switching event may be an event in which after polishing of a batch of silicon wafers is completed, another batch of silicon wafers of different sizes needs to be polished.

[0026] The diamond brush can be fixed on the polishing head and used to brush the polishing cloth after the current batch of silicon wafers is polished.

[0027] The first direction may be a counterclockwise direction from above the device to overlook the device. The polishing cloth is fixed on a fixed plate, and the polishing head above it can move up and down, and can also choose whether to apply pressure when in contact with the polishing cloth, which can be specifically controlled by a pressure regulating plate of the polishing head.

[0028] When the diamond brush is used to brush the polishing cloth, the polishing cloth can be controlled to rotate in the first direction, so that the marks left on the polishing cloth by the current batch of silicon wafers during the polishing process can be removed by the diamond brush.

[0029] Step S102, after the first time period is reached, the diamond brush on the polishing head is controlled to rotate the polishing cloth in the second direction, and at the same time, the fixed plate where the polishing cloth is located is controlled to rotate in the first direction;

[0030] The first duration may be set by the staff or may be a default value, such as 5 minutes.

[0031] After reaching the first time, the diamond brush on the polishing head can be controlled to rotate the polishing cloth in the second direction, while the fixed plate where the polishing cloth is located can be controlled to rotate in the first direction. This can completely eliminate the track left by the previous size wafer on the polishing cloth, and eliminate the adverse effect of excessive positive brushing on the longitudinal taper, which is beneficial to flatness control.

[0032] Step S103, after reaching the second time period, brushing the polishing cloth with a nylon brush;

[0033] The second duration may be the same as or different from the first duration, and may be set by the staff or a default value, such as 4 minutes.

[0034] After using the diamond brush to brush the cloth in forward and reverse rotation, the diamond brush can be controlled to move away, and the nylon brush can be controlled to brush the polishing cloth. After the diamond brush brushing is finished, the nylon brush can be used to brush the cloth normally to process the subsequent products.

[0035] Step S104, controlling the size-switched silicon wafer to be polished on a machine.

[0036] After the cloth is brushed, the flatness of the polishing cloth and the polishing requirements can be ensured, and the next batch of silicon wafers can be controlled to be polished on the machine.

[0037] This solution uses diamond brushes to pre-treat the polishing cloth to eliminate the impact of the previous size on the polishing cloth, making it compatible with other wafer sizes. By optimizing the cloth brushing process, the adverse impact of excessive cloth brushing on wafer flatness is prevented. It is achieved that there is no need to change the polishing cloth when switching between wafers of different sizes, thereby simplifying the operation process, improving production efficiency, and reducing costs.

[0038] In one embodiment, during the process of controlling the diamond brush on the polishing head to rotate the polishing cloth in a first direction and controlling the diamond brush on the polishing head to rotate the polishing cloth in a second direction, the polishing head is not pressurized.

[0039] This solution uses a pressure-reducing brush cloth, that is, the polishing head does not apply pressure but only relies on the weight of the polishing head and the diamond brush to apply pressure, which can prevent the polishing cloth from being excessively damaged by the diamond brush and improve the service life and utilization rate of the polishing cloth.

[0040] In one embodiment, the first duration is 8 minutes.

[0041] This solution uses a diamond brush to brush forward for 8 minutes to preliminarily process the track left by the previous size wafer on the polishing cloth and reduce the track marks.

[0042] In one embodiment, the second duration is 7 minutes.

[0043] This solution uses a diamond brush to brush in the reverse direction for 7 minutes to completely eliminate the track left by the previous size wafer on the polishing cloth, while eliminating the adverse effects of excessive forward brushing on the longitudinal taper, which is beneficial to flatness control.

[0044] Figure 2 This is a schematic diagram of the diamond brush being brushed according to some embodiments of the present application. Figure 3 Schematic diagram of reverse brushing of a diamond brush according to some embodiments of the present application. Figure 2 and Figure 3 As shown in the figure, when the product size needs to be switched, the pressure relief diamond brush is first used for 8 minutes, and the rotation direction of the fixed plate is consistent with that of the polishing head. After the forward rotation is completed, the pressure relief diamond brush is used for 7 minutes in the reverse direction, and the rotation direction of the polishing head is changed so that the direction of the polishing head is opposite to that of the fixed plate. After the diamond brush brushing is completed, the nylon brush is used for normal brushing to process the subsequent products.

[0045] The technical solution provided in this embodiment, after identifying the silicon wafer size switching event, controls the diamond brush on the polishing head to rotate the polishing cloth in the first direction, and controls the fixed plate where the polishing cloth is located to rotate in the first direction; after reaching the first time length, controls the diamond brush on the polishing head to rotate the polishing cloth in the second direction, and controls the fixed plate where the polishing cloth is located to rotate in the first direction; after reaching the second time length, uses a nylon brush to brush the polishing cloth; controls the machine polishing of the silicon wafer after the size switching. By adopting this solution, there is no need to replace the polishing cloth, so that the operation becomes simple, and the normal operation of the production line will not be stopped, which improves the production efficiency. At the same time, it can also improve the compatibility of silicon wafers of different sizes in the polishing process, without paying more manpower and material costs, and adapt to various batch production.

[0046] Second embodiment

[0047] The second embodiment of the present application relates to a device, which is used to execute the polishing control method supporting silicon wafer size switching as described in the above embodiments.

[0048] It can be understood that the device protected by this solution has the corresponding beneficial effects of the above-mentioned polishing control method supporting silicon wafer size switching, which will not be described in detail here.

[0049] Third embodiment

[0050] The third embodiment of the present application relates to a silicon wafer, which is obtained by using the polishing control method supporting silicon wafer size switching as described in the above embodiments.

[0051] It can be understood that the silicon wafer protected by this solution has the corresponding beneficial effects of the above-mentioned polishing control method supporting silicon wafer size switching, which will not be described in detail here.

[0052] In addition, some embodiments of the present application also provide an electronic device. The electronic device may be a digital computer in various forms, such as a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, etc. The electronic device may also be a mobile device in various forms, such as a personal digital assistant, a cellular phone, a smart phone, a wearable device, and other similar computing devices.

[0053] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor executes the steps of the method provided in any one or more of the above embodiments. Figure 4 An exemplary structural diagram of the electronic device is disclosed. Figure 4As shown, the electronic device includes: one or more processors 401, memory 402, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only used as examples, and are not intended to limit the implementation of the present application described and / or required herein.

[0054] The electronic device may further include: an input device 403 and an output device 404. The processor 401, the memory 402, the input device 403 and the output device 404 may be connected via a bus or other means. Figure 4 The example of connecting through bus is taken in the following.

[0055] The input device 403 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 404 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.

[0056] To provide interaction with a user, the electronic device may be a computer. The computer has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0057] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the method provided by any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0058] The memory 402 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 401 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 402, so as to implement the program instructions / modules corresponding to the method provided by any one or more of the above embodiments in the embodiments of the present application.

[0059] The memory 402 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 402 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory 402 may optionally include a memory remotely arranged relative to the processor 401, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0060] It should be noted that the computer-readable medium described in the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device.

[0061] Computer readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, modules of programs or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission medium that can be used to store information that can be accessed by a computing device.

[0062] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0063] In the above-described embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. For example, it can be implemented by using an application specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device. In certain embodiments, the software program of the present application can be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including relevant data structures) can be stored in a computer-readable recording medium, for example, a RAM memory, a magnetic or optical drive or a floppy disk and similar devices. In addition, some steps or functions of the present application can be implemented by hardware, for example, as a circuit that cooperates with a processor to perform each step or function.

[0064] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from a computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid state disk (SSD)), etc.

[0065] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of a code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0066] The scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the device claim may also be implemented by one unit or device through software or hardware. The words "first", "second", etc. are only used to distinguish the description, and do not indicate any particular order, nor can they be understood as indicating or implying relative importance.

[0067] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily mention changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.

Claims

1. A polishing control method supporting silicon wafer size switching, characterized in that: The method comprises: After identifying a silicon wafer size switching event, controlling the diamond brush on the polishing head to rotate the polishing cloth in a first direction, and controlling the fixed plate where the polishing cloth is located to rotate in the first direction; After the first time period is reached, the diamond brush on the polishing head is controlled to rotate the polishing cloth in the second direction, and at the same time, the fixed plate where the polishing cloth is located is controlled to rotate in the first direction; After reaching the second time period, brushing the polishing cloth with a nylon brush; The silicon wafer is polished on the machine after the size switching is controlled.

2. The method according to claim 1, characterized in that During the process of controlling the diamond brush on the polishing head to rotate the polishing cloth in a first direction and controlling the diamond brush on the polishing head to rotate the polishing cloth in a second direction, the polishing head is not pressurized.

3. The method according to claim 1, characterized in that The first duration is 8 minutes.

4. The method according to claim 1, characterized in that: The second duration is 7 minutes.

5. A device, characterized in that: The device is used to execute the polishing control method supporting silicon wafer size switching as described in any one of claims 1-4.

6. A silicon wafer, characterized in that: The silicon wafer is obtained by using the polishing control method supporting silicon wafer size switching as described in any one of claims 1 to 4.

Images