Multi-compatibility hole wall metallization printing workbench

Abstract

The invention relates to the technical field of multi-layer ceramic device production, in particular to a multi-compatibility hole wall metallization printing workbench, the top of a confluence plate is connected with a cover plate, the cover plate is provided with a rectangular through hole, and the rectangular through hole is divided into four large-area vacuum areas through a cross beam; an outer table is fixed on the cover plate, small-area vacuum areas are arranged on the outer table, and first array adsorption holes are formed in the top surface of the outer table around each small-area vacuum area; a positioning pin hole is formed in the top surface of the outer table, and a spring positioning pin hole is formed in the positioning pin hole; and a second array of adsorption holes are formed in the outer table. When a product batch is replaced or a green ceramic chip hole wall metallization pattern is changed, a corresponding supporting bushing plate does not need to be replaced any more, the tool replacement time is shortened, the tool replacement difficulty is reduced, and the machining cost and the production cost are reduced; the production efficiency is improved, abrasion of the workbench caused by frequent replacement of the supporting plate can be avoided, and uniform metallization and stable quality of hole walls among different products are further guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of multilayer ceramic device production, in particular to a multi-compatible hole wall metallization printing workbench. Background Art

[0002] With the rapid development of microelectronics technology, the precision of the internal structure and the reliability of interconnection of multilayer ceramic shells as key packaging components are becoming increasingly important. The hole wall metallization process of multilayer ceramic shells is one of the key technologies in electronic packaging and microelectronic device manufacturing, especially in applications that require high reliability and excellent electrical performance. The main purpose of this process is to form a continuous and conductive metal layer on the hole wall of the ceramic shell, thereby realizing electrical interconnection between the internal layers.

[0003] Traditional ceramic tube shell hole wall metallization mechanisms mostly use the principle of printing slurry, adopt the one-to-one correspondence between the raw ceramic sheet through-hole pattern and the mask plate and support plate through-hole pattern, and use the vacuum negative pressure source adsorption function set under the support plate to realize the flow of slurry in the raw ceramic sheet hole wall, thereby completing the hole wall metallization process. Since a product pattern must correspond to a mask plate and support plate pattern to produce, in the actual multi-type product pattern hole wall metallization process, a large number of support plates with corresponding patterns need to be processed to correspond to the corresponding product patterns, which is difficult to process and has high processing costs. In addition, the process of replacing support plates between different products is relatively complicated, resulting in low production efficiency; there is a problem of inconsistent processing accuracy of support plates between different batches, and frequent replacement of support plates will cause accumulated wear on the workbench, resulting in uneven hole wall metallization and unstable effects between different products, which is difficult to meet the increasingly stringent dimensional accuracy and electrical performance requirements. Therefore, there is an urgent need for an economical printing workbench that can be compatible with multiple product patterns and has stable hole wall metallization effects to improve actual production efficiency and product quality performance. Summary of the invention

[0004] In order to overcome the technical defects that when the existing printing workbench is working, a large number of support plates with corresponding patterns need to be processed to correspond to the corresponding product patterns, which has great processing difficulty and high processing cost; and frequent replacement of support plates will cause cumulative wear and tear on the workbench, the present invention provides a multi-compatible hole wall metallization printing workbench.

[0005] The present invention provides a multi-compatible hole wall metallization printing workbench, including a manifold, a vacuum pipeline, and an eddy current fan. A rectangular manifold is opened on the top of the manifold, and a large-diameter outlet is arranged downwardly in the rectangular manifold. The large-diameter outlet is fixedly connected to one end of the vacuum pipeline through a pipeline flange, and the other end of the vacuum pipeline is connected to the eddy current fan. A cover plate is fixedly connected to the top of the manifold, and a rectangular through hole corresponding to the area of ​​the rectangular reflux groove is arranged on the cover plate. A cross beam is integrally formed in the middle of the rectangular through hole, and the cross beam divides the rectangular through hole into four large-area vacuum areas; an outer platform is fixedly and sealingly connected to the cover plate, and four small-area vacuum areas corresponding to and connected to the four large-area vacuum areas are arranged on the outer platform, and the top surface of the outer platform around each small-area vacuum area is provided with a first array of vacuum The outer platform has an attached hole, and a first air duct connecting all the first array adsorption holes is arranged on the bottom surface of the outer platform. After the outer platform is sealed and connected to the cover plate, the first air duct is sealed and connected to the top surface of the cover plate. The bottom of the cover plate is connected to a first negative pressure joint, and the first negative pressure joint is connected to the first air duct; the four small vacuum areas of the outer platform form a field-shaped through hole, and positioning pin holes are respectively arranged on the top surface of the outer platform corresponding to the four corners of the field-shaped through hole. Spring positioning pins are arranged in the positioning pin holes, and the spring positioning pins are adapted to the mask plate and the raw porcelain piece; second array adsorption holes are arranged around the field-shaped through hole along the top surface of the outer platform, the first array adsorption holes are located on the inner side of the second array adsorption holes, and the second array adsorption holes are connected through the second air duct in the middle of the outer platform, and at least two second negative pressure joints connected to the second air duct are connected to the bottom surface of the outer platform.

[0006] Specifically, the large-area vacuum area is larger than the small-area vacuum area. Here, large or small is only relative, and does not limit the specific size of the area. The large-area vacuum area of ​​the cover plate is connected to the small-area vacuum area of ​​the outer platform, and the busbar is connected to the large-area vacuum area of ​​the cover plate. The busbar is connected to the vortex fan through a large-caliber outlet, and the vortex fan is used to provide negative pressure. The outer platform, the cover plate, and the busbar are connected and fixed in sequence from top to bottom, at least to ensure that the large-area vacuum area of ​​the cover plate is not smaller than the small-area vacuum area of ​​the outer platform. The mask plate and the raw ceramic sheet are sequentially inserted into the four spring positioning pins of the outer platform to ensure that the mask plate pattern corresponds to the metallized pattern of the raw ceramic sheet hole wall. The positions of the first array adsorption holes and the second array adsorption holes correspond to the sizes of the mask plate and the raw ceramic sheet. The first negative pressure joint and the second negative pressure joint are connected to the negative pressure system so that the first array adsorption holes and the second array adsorption holes provide adsorption force for the raw ceramic sheet and the mask plate. The large vacuum area and the small vacuum area are connected with the mask plate and the green ceramic sheet, so that the metallized area of ​​the green ceramic sheet hole wall is all connected through the mask plate, the outer stage, the cover plate and the busbar, thereby adsorbing the mask plate and the green ceramic sheet close to the outer stage, ensuring that the green ceramic sheet and the mask plate will not shift during the hole wall metallization process, and achieving the effect of uniform hole wall metallization. The spring positioning pin can be used to fix the mask plate and the green ceramic sheet on the one hand, and on the other hand, during the green ceramic sheet printing process, the protruding pin can be retracted to the same plane as the green ceramic sheet under the pressure of the scraper to avoid scratching or breaking the screen printing screen.

[0007] During specific use, the complete vacuum passage is connected. When performing the hole wall metallization operation, after completing the precise calibration of the silk screen screen and the raw ceramic sheet through the silk screen printing equipment, the printing workbench is controlled to move to the bottom of the silk screen screen, and the printing scraper is driven to squeeze the metal slurry on the silk screen screen into the through-hole pattern of the raw ceramic sheet. During this process, the spring positioning pin can be retracted under a slight pressure, effectively protecting the silk screen screen from being scratched or broken by the positioning pin. After the printing scraper fills the metallization area of ​​the hole wall of the raw ceramic sheet with metal slurry, turn on the vortex fan so that the metal slurry in the through-hole of the raw ceramic sheet is evenly sucked away under the action of vacuum, completing the hole wall metallization operation. Specifically, after replacing the metallization pattern of the hole wall of the raw ceramic sheet, it is only necessary to make and replace the corresponding mask plate to quickly complete the tooling switch, which is convenient and efficient.

[0008] Compared with the prior art, the technical solution provided by the present invention has the following technical effects: in the process of product pattern hole wall metallization by the device described in the present invention, when the product batch is changed or the hole wall metallization pattern of the raw ceramic sheet is changed, it is no longer necessary to replace the corresponding supporting leak plate, and only the mask plate of the corresponding pattern needs to be replaced to meet the hole wall metallization production process, which greatly shortens the time and difficulty of replacing tooling, and reduces processing costs and production costs; in addition, it avoids the complicated process of replacing the supporting plate between different products, thereby improving production efficiency, and can avoid frequent replacement of the supporting plate to cause wear on the workbench, further ensuring uniform hole wall metallization and stable quality between different products, and improving actual production efficiency and product stability; it can meet increasingly stringent dimensional accuracy and electrical performance requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0010] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0011] Figure 1 It is a schematic diagram of the overall structure of a multi-compatible hole wall metallization printing workbench described in an embodiment of the present invention; Figure 2 It is a schematic diagram of the exploded structure of the raw ceramic sheet, mask plate, outer platform, cover plate, manifold and pipeline flange in a certain embodiment of the present invention; Figure 3 It is a schematic diagram of the top surface of the inner and outer platforms in a certain embodiment of the present invention; Figure 4 A schematic diagram of the structure of a raw ceramic sheet in an embodiment of the present invention; Figure 5 It is a structural schematic diagram of a mask plate in a certain embodiment of the present invention; Figure 6 It is a schematic diagram of the structure of the inner and outer platforms and the cover plate in a certain embodiment of the present invention.

[0012] In the figure: 1. manifold; 2. vacuum pipeline; 3. vortex fan; 4. rectangular manifold; 5. large-diameter outlet; 6. pipeline flange; 7. cover plate; 8. rectangular through hole; 9. cross beam; 10. large-area vacuum area; 11. outer platform; 12. small-area vacuum area; 13. first array adsorption holes; 14. first negative pressure joint; 15. positioning pin hole; 16. spring positioning pin; 17. raw porcelain sheet; 18. mask plate; 19. second array adsorption holes; 20. second negative pressure joint; 21. clamp; 22. silk screen; 23. printing scraper. DETAILED DESCRIPTION

[0013] In order to more clearly understand the above-mentioned objectives, features and advantages of the present invention, the scheme of the present invention will be further described below. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0014] In the description, it should be noted that the terms "first" and "second" are only used for descriptive purposes and should not be understood as indicating or implying relative importance. It should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0015] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present invention, rather than all of the embodiments.

[0016] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0017] In one embodiment, Figure 1As shown, a multi-compatible hole wall metallization printing workbench includes a manifold 1, a vacuum pipeline 2, and a vortex fan 3. A rectangular manifold 4 is opened on the top of the manifold 1. The rectangular manifold 4 is downwardly provided with a large-diameter outlet 5. The large-diameter outlet 5 is fixedly connected to one end of the vacuum pipeline 2 through a pipeline flange 6. Another multi-compatible hole wall metallization printing workbench includes a manifold 1, a vacuum pipeline 2, and a vortex fan 3. A rectangular manifold 4 is opened on the top of the manifold 1. The rectangular manifold 4 is downwardly provided with a large-diameter outlet 5. The large-diameter outlet 5 is fixedly connected to one end of the vacuum pipeline 2 through a pipeline flange 6, and the other end of the vacuum pipeline 2 is connected to the vortex fan 3. The top of the manifold 1 is fixedly connected to a cover plate 7, and a rectangular through hole 8 corresponding to the area of ​​the rectangular reflux groove is provided on the cover plate 7. A cross beam 9 is integrally formed in the middle of the rectangular through hole 8, and the cross beam 9 divides the rectangular through hole 8 into four large-area vacuum areas 10; the cover plate 7 is fixedly and sealedly connected to an outer platform 11, and four positions of the four large-area vacuum areas 10 are provided on the outer platform 11. The outer platform 11 has a first array of adsorption holes 13 arranged on the top surface of each small vacuum area 12, and a first airway connecting all the first array adsorption holes 13 is arranged on the bottom surface of the outer platform 11. After the outer platform 11 is sealed and connected to the cover plate 7, the first airway is sealed and connected to the top surface of the cover plate 7. The bottom of the cover plate 7 is connected to a first negative pressure connector 14, and the first negative pressure connector 14 is connected to the first airway; the four small vacuum areas 12 of the outer platform 11 form a field-shaped through hole, which is connected to the four fields of the field-shaped through hole. Positioning pin holes 15 are respectively provided on the top surface of the outer platform 11 corresponding to the corners, and spring positioning pins 16 are provided in the positioning pin holes 15. The spring positioning pins 16 are adapted to the mask plate 18 and the raw porcelain sheet 17; second array adsorption holes 19 are provided around the top surface of the outer platform 11 along the field-shaped through hole, the first array adsorption holes 13 are located on the inner side of the second array adsorption holes 19, and the second array adsorption holes 19 are connected through the second air channel in the middle of the outer platform 11. At least two second negative pressure connectors 20 connected to the second air channel are connected to the bottom surface of the outer platform 11.

[0018] Specifically, the large-area vacuum area 10 is larger than the small-area vacuum area 12. Here, large or small is only relative, and does not limit the specific size of the area. The large-area vacuum area 10 of the cover plate 7 is connected to the small-area vacuum area 12 of the outer platform 11, and the busbar 1 is connected to the large-area vacuum area 10 of the cover plate 7. The busbar 1 is connected to the vortex fan 3 through the large-diameter outlet 5, and the vortex fan 3 is used to provide negative pressure. The outer platform 11, the cover plate 7, and the busbar 1 are connected and fixed in sequence from top to bottom, at least to ensure that the large-area vacuum area 10 of the cover plate 7 is not smaller than the small-area vacuum area 12 of the outer platform 11. The mask plate 18 and the raw ceramic sheet are sequentially inserted into the four spring positioning pins 16 of the outer platform 11 to ensure that the pattern of the mask plate 18 corresponds to the pattern of the metallization of the hole wall of the raw ceramic sheet. The positions of the first array adsorption holes 13 and the second array adsorption holes 19 correspond to the sizes of the mask plate and the raw ceramic sheet 17. The first negative pressure joint 14 and the second negative pressure joint 20 are connected to the negative pressure system so that the first array adsorption holes 13 and the second array adsorption holes 19 provide adsorption force for the raw ceramic sheet 17 and the mask plate. The large area vacuum area 10 and the small area vacuum area 12 are connected with the mask plate 18 and the raw ceramic sheet, so that the metallized area of ​​the raw ceramic sheet hole wall is all connected through the mask plate 18, the outer stage 11, the cover plate 7 and the busbar 1, thereby adsorbing the mask plate 18 and the raw ceramic sheet close to the outer stage 11, while ensuring that the raw ceramic sheet and the mask plate 18 will not shift during the hole wall metallization process, and achieving the effect of uniform hole wall metallization. The spring positioning pin 16 can be used to fix the mask plate 18 and the raw ceramic sheet on the one hand, and on the other hand, during the printing process of the raw ceramic sheet, the protruding pin can be retracted to the same plane as the raw ceramic sheet under the pressure of the scraper to avoid scratching or breaking the silk screen 22.

[0019] During specific use, the complete vacuum passage is connected. When the hole wall metallization operation is performed, after the accurate calibration of the silk screen 22 and the raw ceramic sheet is completed by the silk screen printing equipment, the printing table is controlled to move to the bottom of the silk screen 22, and the printing scraper 23 is driven to squeeze the metal slurry on the silk screen 22 into the through-hole pattern of the raw ceramic sheet. During this process, the spring positioning pin 16 can be retracted under a small pressure, effectively protecting the silk screen 22 from being scratched or broken by the positioning pin. After the printing scraper 23 fills the metallization area of ​​the hole wall of the raw ceramic sheet with metal slurry, the vortex fan 3 is turned on so that the metal slurry in the through hole of the raw ceramic sheet is evenly sucked away under the action of vacuum, completing the hole wall metallization operation. Specifically, after replacing the metallization pattern of the hole wall of the raw ceramic sheet, it is only necessary to make and replace the corresponding mask plate to quickly complete the tooling switching, which is convenient and efficient.

[0020] The above is only a specific implementation of the present invention, which enables those skilled in the art to understand or implement the present invention. Although detailed descriptions are given with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments, and they should all be covered by the protection scope of the claims.

Claims

1. A multi-compatible hole wall metallization printing workbench, comprising a manifold (1), a vacuum pipeline (2), and a vortex fan (3), wherein a rectangular manifold groove (4) is provided on the top of the manifold (1), and a large-diameter outlet (5) is provided downwardly on the rectangular manifold groove (4), and the large-diameter outlet (5) is fixedly connected to one end of the vacuum pipeline (2) through a pipeline flange (6), and the other end of the vacuum pipeline (2) is connected to the vortex fan (3), characterized in that: The top of the manifold (1) is fixedly connected to a cover plate (7), and a rectangular through hole (8) corresponding to the area of ​​the rectangular reflow groove is provided on the cover plate (7), and a cross beam (9) is integrally formed in the middle of the rectangular through hole (8), and the cross beam (9) divides the rectangular through hole (8) into four large-area vacuum areas (10); the cover plate (7) is fixedly and sealedly connected to an outer platform (11), and four small-area vacuum areas (12) corresponding to the positions of the four large-area vacuum areas (10) are provided on the outer platform (11), and each small-area vacuum area (12) is provided with a first array of adsorption holes (13) on the top surface of the outer platform (11) around each small-area vacuum area (12), and a first air duct connecting all the first array of adsorption holes (13) is provided on the bottom surface of the outer platform (11), and after the outer platform (11) is sealedly connected to the cover plate (7), the first air duct is sealedly connected to the top surface of the cover plate (7). The bottom of the cover plate (7) is connected to a first negative pressure joint (14), and the first negative pressure joint (14) is connected to the first air channel; four small vacuum areas (12) of the outer platform (11) form a field-shaped through hole, and positioning pin holes (15) are respectively arranged on the top surface of the outer platform (11) corresponding to the four corners of the field-shaped through hole, and spring positioning pins (16) are arranged in the positioning pin holes (15), and the spring positioning pins (16) are adapted to the mask plate (18) and the raw porcelain sheet (17); second array adsorption holes (19) are arranged on the top surface of the outer platform (11) along the four sides of the field-shaped through hole, the first array adsorption holes (13) are located inside the second array adsorption holes (19), and the second array adsorption holes (19) are connected through a second air channel in the middle of the outer platform (11), and at least two second negative pressure joints (20) connected to the second air channel are connected to the bottom surface of the outer platform (11).

2. A multi-compatible hole wall metallization printing workbench according to claim 1, characterized in that: A clamp (21) is provided at the connection between the pipeline flange (6) and the vacuum pipeline (2).

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