UV photocuring disulfide bond-containing organic fluorine-silicon polymer, coating and preparation method of UV photocuring disulfide bond-containing organic fluorine-silicon polymer

Abstract

The invention relates to the field of organic silicon and fluorine-silicon high-molecular polymers, in particular to a UV-curable organic fluorine-silicon polymer, a coating and a preparation method. The problems that the surface of a cured material formed through a common technology is prone to buckling deformation, and compatibility is poor are solved. The disulfide bond-containing organic fluorosilicone polymer is prepared from fluorinated cyclic siloxane, a vinyl alkoxy silane compound, disulfide bond silane, a solvent, an acid catalyst and a neutralizer. The prepared UV photocuring disulfide bond-containing organic fluorosilicone polymer has good acid corrosion resistance, alkali corrosion resistance and salt corrosion resistance, the process of the prepared UV photocuring disulfide bond-containing organic fluorosilicone polymer is simple, and the problems that high-temperature curing operation is tedious and low-temperature curing performance is poor can be solved.

Description

Technical Field

[0001] The invention relates to the field of organic silicon and fluorosilicone macromolecular polymers, and in particular to an organic fluorosilicone polymer and a coating that can be cured by UV light, and a preparation method thereof. Background Art

[0002] UV light curing technology is an efficient, environmentally friendly, energy-saving, high-quality material surface treatment technology that allows materials to form a three-dimensional network structure at a curing speed thousands of times faster than traditional curing methods. At present, there are many UV light curing products on the market, such as UV light curing coatings, UV light curing oil films, UV light curing adhesives, photoresists, etc.

[0003] Traditional polysiloxane-based silicone coatings occupy an extremely important position in coatings due to their wide range of application products and fields. At present, there are two main curing methods for silicone coatings: condensation curing and thermal curing. These two traditional curing methods have some defects to a greater or lesser extent. For example, the condensation curing cycle is relatively long, about 2-3 days, and the thermal curing temperature required is relatively high, above 100°C, which results in silicone polymers being unable to be applied to some specific fields, such as substrates that require a short operating cycle or are sensitive to temperature. UV light curing can be cured at room temperature, and curing only takes tens of seconds. These advantages of UV light curing technology make it have great potential application value in the field of coatings. If UV light curing technology is introduced into silicone coatings, its application fields can be greatly expanded, such as electronic protective coatings.

[0004] Common UV light curing technology has disadvantages such as easy warping and deformation of the surface of the cured material and poor compatibility.

[0005] Therefore, it is urgent to propose a UV light-curable disulfide-bonded organic fluorosilicone polymer and coating and a preparation method to solve the above technical problems. Summary of the invention

[0006] The purpose of the present invention is to solve the problem that the surface of the cured material formed by the conventional technology is easy to warp and deform and has poor compatibility. A brief overview of the present invention is given below to provide a basic understanding of certain aspects of the present invention. It should be understood that this overview is not an exhaustive overview of the present invention. It is not intended to determine the key or important parts of the present invention, nor is it intended to limit the scope of the present invention.

[0007] The technical solution of the present invention:

[0008] A UV light-curable disulfide-bonded organic fluorine-silicone polymer, wherein the disulfide-bonded organic fluorine-silicone polymer is composed of a fluorinated cyclic siloxane, a vinyl alkoxysilane compound, a disulfide-bonded silane, a solvent, an acid catalyst and a neutralizer;

[0009] The mass fraction of the fluorinated cyclic siloxane is 10-80 parts, the mass fraction of the vinyl alkoxy silane compound is 10-80 parts, the mass fraction of the disulfide bond silane is 10-80 parts, and the mass fraction of the solvent is 0-50 parts.

[0010] Preferably, the fluorinated cyclic siloxane is one or more of trifluoropropylmethylcyclotrisiloxane, nonafluorohexylmethylcyclosiloxane and tridecafluorooctylmethylcyclosiloxane.

[0011] Preferably, the vinyl alkoxysilane compound is one or more of vinyl methyl dimethoxy silane, vinyl methyl diethoxy silane, vinyl trimethoxy silane and vinyl triethoxy silane.

[0012] Preferably, the disulfide silane is one or more of bis-[3-(triethoxysilyl)propyl]-disulfide and bis-[γ-(triethoxysilyl)propyl]tetrasulfide.

[0013] Preferably, the solvent is one or more of methanol, ethanol, acetone, butanone, methyl ethyl ketone and ethyl acetate.

[0014] Preferably, the acid catalyst is one or more of hydrochloric acid, sulfuric acid, acetic acid, phosphoric acid and trifluoromethanesulfonic acid.

[0015] Preferably, the neutralizing agent is one or more of sodium hydroxide, potassium hydroxide, sodium bicarbonate and sodium carbonate.

[0016] Preferably, the photoinitiator is one or more of a free radical photoinitiator, 2,2-dimethyl-2-phenylacetophenone and diphenyl-(2,4,6-trimethylbenzoyl)phosphine oxide.

[0017] A method for preparing a UV-curable disulfide-bonded organic fluorosilicone polymer comprises the following steps:

[0018] Step 1: Add fluorinated cyclic siloxane and vinyl alkoxysilane compound into a reactor, then add water and solvent, add trifluoromethanesulfonic acid at 25-70° C., and react for 0.5-72 hours;

[0019] Step 2: dropwise adding disulfide silane, reacting for 0.5-72 hours, adding a neutralizing agent after the reaction, neutralizing for 1-72 hours, and obtaining a mixed solution;

[0020] Step 3: Filter the mixed solution, collect the filtrate, and then reduce the pressure at 70-120°C to -0.09MPa, and remove the low boiling point for 1-3h to obtain a colorless, transparent to light yellow liquid, which is an organic fluorosilicone polymer containing disulfide bonds.

[0021] A UV light-curable disulfide-bond-containing organic fluorine silicon polymer coating, characterized in that the disulfide-bond-containing organic fluorine silicon polymer coating is composed of a disulfide-bond-containing organic fluorine silicon polymer and a photoinitiator;

[0022] The mass fraction of the disulfide bond-containing organic fluorine silicon polymer is 10-80 parts, and the mass fraction of the photoinitiator is 0.1-10 parts.

[0023] A method for preparing a UV-curable disulfide-bonded organic fluorosilicone polymer coating comprises the following steps:

[0024] Step 1: uniformly mixing the hyperbranched organosilicon polymer containing disulfide bonds and the photoinitiator until a stable and uniform mixed solution is formed;

[0025] Step 2: coating the mixed solution on a substrate, and then curing it by UV light for 45 seconds to obtain an organic fluorosilicone polymer coating containing disulfide bonds.

[0026] The present invention has the following beneficial effects:

[0027] The UV light-curable disulfide-bonded organic fluorosilicone polymer prepared by the present invention has good acid, alkali and salt corrosion resistance;

[0028] The UV light-curing disulfide-bond-containing organic fluorosilicone polymer prepared by the present invention has a simple process and can solve the problems of complicated high-temperature curing operation and poor low-temperature curing performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the structure of a disulfide bonded organic fluorine-silicon polymer;

[0030] Figure 2 This is a schematic diagram of the reaction mechanism of sulfur radical attacking a double bond;

[0031] Figure 3 is the infrared spectrum of the fluorinated polysiloxane containing disulfide bonds prepared in Example 3;

[0032] Figure 4 is the water contact angle of the UV light-cured coating measured in Example 1;

[0033] Figure 5 is the water contact angle of the UV light-cured coating measured in Example 2;

[0034] Figure 6 is the water contact angle of the UV light-cured coating measured in Example 3;

[0035] Figure 7 is the water contact angle of the UV light-cured coating measured in Example 4;

[0036] Figure 8 is the water contact angle of the UV light-cured coating measured in Example 5;

[0037] Fig. 9 It is a schematic diagram of the acid, alkali and salt corrosion resistance test of a series of hyperbranched fluorosilicone polymers prepared by the preparation method in Example 1, coated on a tinplate substrate and UV-cured to prepare a fluorosilicone coating. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is described below by the specific embodiments shown in the accompanying drawings. However, it should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present invention. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present invention.

[0039] Specific implementation method 1: Combination Figure 1-Figure 9 The present embodiment is described. The present embodiment is a UV light-curable disulfide bond-containing organic fluorine silicon polymer, wherein the disulfide bond-containing organic fluorine silicon polymer is composed of a fluorinated cyclic siloxane, a vinyl alkoxy silane compound, a disulfide bond silane, a solvent, an acid catalyst and a neutralizing agent;

[0040] The mass fraction of the fluorinated cyclic siloxane is 10-80 parts, the mass fraction of the vinyl alkoxy silane compound is 10-80 parts, the mass fraction of the disulfide bond silane is 10-80 parts, and the mass fraction of the solvent is 0-50 parts.

[0041] Specific implementation method 2: Combination Figure 1-Figure 9 The present embodiment is described as a UV light-curable disulfide bond-containing organic fluorine silicon polymer, wherein the fluorinated cyclic siloxane is one or more of trifluoropropylmethylcyclotrisiloxane, nonafluorohexylmethylcyclosiloxane and tridecafluorooctylmethylcyclosiloxane.

[0042] Specific implementation method three: Combination Figure 1-Figure 9 The present embodiment is described as a UV light-curable disulfide bond-containing organic fluorosilicone polymer, wherein the vinyl alkoxysilane compound is one or more of vinyl methyl dimethoxy silane, vinyl methyl diethoxy silane, vinyl trimethoxy silane, and vinyl triethoxy silane.

[0043] Specific implementation method four: Combination Figure 1-Figure 9 The present embodiment is described as a UV light-curable disulfide-bonded organic fluorosilicone polymer, wherein the disulfide bond silane is one or more of bis-[3-(triethoxysilyl)propyl]-disulfide and bis-[γ-(triethoxysilyl)propyl]tetrasulfide.

[0044] Specific implementation method five: Combination Figure 1-Figure 9The present embodiment is described. In the present embodiment, a UV light-curable organic fluorosilicone polymer containing disulfide bonds is prepared, and the solvent is one or more of methanol, ethanol, acetone, butanone, methyl ethyl ketone, and ethyl acetate.

[0045] Specific implementation method six: Combination Figure 1-Figure 9 The present embodiment is described. The present embodiment is a UV light-curable disulfide bond-containing organic fluorine silicon polymer, the acid catalyst is one or more of hydrochloric acid, sulfuric acid, acetic acid, phosphoric acid and trifluoromethanesulfonic acid, and the neutralizer is one or more of sodium hydroxide, potassium hydroxide, sodium bicarbonate and sodium carbonate.

[0046] Specific implementation method seven: Combination Figure 1-Figure 9 The present embodiment is described. The present embodiment is a UV light-curable disulfide bond-containing organic fluorosilicone polymer, and the photoinitiator is one or more of a free radical photoinitiator, 2,2-dimethyl-2-phenylacetophenone and diphenyl-(2,4,6-trimethylbenzoyl)phosphine oxide.

[0047] Specific implementation method eight: Combination Figure 1-Figure 9 This embodiment is described. A method for preparing a UV light-curable disulfide-bonded organic fluorosilicone polymer in this embodiment comprises the following steps:

[0048] Step 1: Add fluorinated cyclic siloxane and vinyl alkoxysilane compound into a reactor, then add water and solvent, add trifluoromethanesulfonic acid at 25-70° C., and react for 0.5-72 hours;

[0049] Step 2: dropwise adding disulfide silane, reacting for 0.5-72 hours, adding a neutralizing agent after the reaction, neutralizing for 1-72 hours, and obtaining a mixed solution;

[0050] Step 3: Filter the mixed solution, collect the filtrate, and then reduce the pressure at 70-120°C to -0.09MPa, and remove the low boiling point for 1-3h to obtain a colorless, transparent to light yellow liquid, which is an organic fluorosilicone polymer containing disulfide bonds.

[0051] Specific implementation method nine: Combination Figure 1-Figure 9 The present embodiment is described. The present embodiment is a UV light-curable disulfide bond-containing organic fluorine silicon polymer coating. The disulfide bond-containing organic fluorine silicon polymer coating is composed of a disulfide bond-containing organic fluorine silicon polymer and a photoinitiator.

[0052] The mass fraction of the disulfide bond-containing organic fluorine silicon polymer is 10-80 parts, and the mass fraction of the photoinitiator is 0.1-10 parts.

[0053] Specific implementation method ten: Combination Figure 1-Figure 9This embodiment is described. A method for preparing a UV light-curable disulfide-bonded organic fluorosilicone polymer coating in this embodiment comprises the following steps:

[0054] Step 1: uniformly mixing the hyperbranched organosilicon polymer containing disulfide bonds and the photoinitiator until a stable and uniform mixed solution is formed;

[0055] Step 2: coating the mixed solution on a substrate, and then curing it by UV light for 45 seconds to obtain an organic fluorosilicone polymer coating containing disulfide bonds.

[0056] Example 1

[0057] 0.24 mol of trifluoropropylmethylcyclotrisiloxane and 0.23 mol of vinylmethyldimethoxysilane compound were added to the reactor, followed by 1.6 mol of excess deionized water and 100 g of mixed solvent (acetone: ethanol mass ratio = 1:1), 0.32 g of trifluoromethanesulfonic acid was added at 25°C, reacted for 0.5 h, and then 0.04 mol of bis-[3-(triethoxysilyl)propyl]-disulfide was added dropwise; after the addition, the temperature was raised to 70°C and reacted for 2 h; then 32 g of sodium carbonate was added and neutralized for 2 h. Then, the mixture was filtered and the filtrate was collected, and then the pressure was reduced to above -0.09 MPa at 70°C, and the low boiling temperature was removed for 1-3 h to obtain an organic fluorine silicon polymer containing disulfide bonds;

[0058] Then the prepared organic fluorosilicone polymer containing disulfide bonds and photoinitiator 1173 were mixed in a mixing ratio of organic fluorosilicone polymer containing disulfide bonds: photoinitiator mass ratio = 100:5, and stirred evenly until a stable and uniform mixed liquid was formed. The mixture was coated on a PET film and tinplate, and photocured for 45 seconds using a UV light curing machine to obtain an organic fluorosilicone coating containing disulfide bonds.

[0059] Example 2

[0060] 0.24 mol of trifluoropropylmethylcyclotrisiloxane and 0.23 mol of vinylmethyldimethoxysilane compound were added to the reactor, followed by 1.6 mol of excess deionized water and 100 g of mixed solvent (acetone: ethanol mass ratio = 1:1), 0.32 g of trifluoromethanesulfonic acid was added at 25°C, reacted for 0.5 h, and then 0.08 mol of bis-[3-(triethoxysilyl)propyl]-disulfide was added dropwise; after the addition was completed, the temperature was raised to 70°C and reacted for 2 h; then 32 g of sodium carbonate was added and neutralized for 2 h. Then the mixture was filtered and the filtrate was collected, and then the pressure was reduced to above -0.09 MPa at 70°C, and the low boiling temperature was removed for 1-3 h to obtain an organic fluorine silicon polymer containing disulfide bonds;

[0061] Then the prepared organic fluorosilicone polymer containing disulfide bonds and photoinitiator 1173 were mixed in a mixing ratio of organic fluorosilicone polymer containing disulfide bonds: photoinitiator mass ratio = 100:5, and stirred evenly until a stable and uniform mixed liquid was formed. The mixture was coated on a PET film and tinplate, and photocured with a UV light curing machine to obtain an organic fluorosilicone coating containing disulfide bonds.

[0062] Example 3

[0063] 0.24 mol of trifluoropropylmethylcyclotrisiloxane and 0.23 mol of vinylmethyldimethoxysilane compound were added to the reactor, followed by 1.6 mol of deionized water and 100 g of mixed solvent (acetone: ethanol mass ratio = 1:1), 0.32 g of trifluoromethanesulfonic acid was added at 25°C, reacted for 0.5 h, and then 0.12 mol of bis-[3-(triethoxysilyl)propyl]-disulfide was added dropwise; after the addition was completed, the temperature was raised to 70°C and reacted for 2 h; then 32 g of sodium carbonate was added and neutralized for 2 h. Then the mixture was filtered and the filtrate was collected, and then the pressure was reduced to above -0.09 MPa at 70°C, and the low boiling temperature was removed for 1-3 h to obtain an organic fluorine silicon polymer containing disulfide bonds;

[0064] Then the prepared organic fluorosilicone polymer containing disulfide bonds and photoinitiator 1173 were mixed in a mixing ratio of organic fluorosilicone polymer containing disulfide bonds: photoinitiator mass ratio = 100:5, and stirred evenly until a stable and uniform mixed liquid was formed. The mixture was coated on a PET film and tinplate, and photocured with a UV light curing machine to obtain an organic fluorosilicone coating containing disulfide bonds.

[0065] Example 4

[0066] 0.24 mol of trifluoropropylmethylcyclotrisiloxane and 0.23 mol of vinylmethyldimethoxysilane compound were added to the reactor, followed by 1.6 mol of deionized water and 100 g of mixed solvent (acetone: ethanol mass ratio = 1:1), 0.32 g of trifluoromethanesulfonic acid was added at 25°C, reacted for 0.5 h, and then 0.16 mol of bis-[3-(triethoxysilyl)propyl]-disulfide was added dropwise; after the addition was completed, the temperature was raised to 70°C and reacted for 2 h; then 32 g of sodium carbonate was added and neutralized for 2 h. Then the mixture was filtered and the filtrate was collected, and then the pressure was reduced to above -0.09 MPa at 70°C, and the low boiling temperature was removed for 1-3 h to obtain an organic fluorine silicon polymer containing disulfide bonds;

[0067] Then the prepared organic fluorosilicone polymer containing disulfide bonds and photoinitiator 1173 were mixed in a mixing ratio of organic fluorosilicone polymer containing disulfide bonds: photoinitiator mass ratio = 100:5, and stirred evenly until a stable and uniform mixed liquid was formed. The mixture was coated on a PET film and tinplate, and photocured with a UV light curing machine to obtain an organic fluorosilicone coating containing disulfide bonds.

[0068] Example 5

[0069] 0.24 mol of trifluoropropylmethylcyclotrisiloxane and 0.23 mol of vinylmethyldimethoxysilane compound were added to the reactor, followed by 1.6 mol of deionized water and 100 g of mixed solvent (acetone: ethanol mass ratio = 1:1), 0.32 g of trifluoromethanesulfonic acid was added at 25°C, reacted for 0.5 h, and then 0.20 mol of bis-[3-(triethoxysilyl)propyl]-disulfide was added dropwise; after the addition was completed, the temperature was raised to 70°C and reacted for 2 h; then 32 g of sodium carbonate was added and neutralized for 2 h. Then the mixture was filtered and the filtrate was collected, and then the pressure was reduced to above -0.09 MPa at 70°C, and the low boiling temperature was removed for 1-3 h to obtain an organic fluorine silicon polymer containing disulfide bonds;

[0070] Then the prepared organic fluorosilicone polymer containing disulfide bonds and photoinitiator 1173 were mixed in a mixing ratio of organic fluorosilicone polymer containing disulfide bonds: photoinitiator mass ratio = 100:5, and stirred evenly until a stable and uniform mixed liquid was formed. The mixture was coated on a PET film and tinplate, and photocured with a UV light curing machine to obtain an organic fluorosilicone coating containing disulfide bonds.

[0071] Comparative Example 1

[0072] 0.24 mol of trifluoropropylmethylcyclotrisiloxane compound was added to the reactor, followed by 1.6 mol of excess deionized water and 100 g of mixed solvent (acetone: ethanol mass ratio = 1:1), 0.32 g of trifluoromethanesulfonic acid was added at 25°C, reacted for 0.5 h, and then 0.12 mol of bis-[3-(triethoxysilyl)propyl]-disulfide was added dropwise; the temperature was raised to 70°C and reacted for 2 h; then 32 g of sodium carbonate was added and neutralized for 2 h. Then the mixture was filtered and the filtrate was collected, and then the pressure was reduced to above -0.09 MPa at 70°C, and the low boiling temperature was removed for 1-3 h to obtain an organic fluorine silicon polymer containing disulfide bonds;

[0073] Then the prepared disulfide bond-containing organic fluorosilicone polymer and photoinitiator 1173 were mixed in a mixing ratio of disulfide bond-containing organic fluorosilicone polymer: photoinitiator mass ratio = 100:5, and stirred evenly until a stable uniform mixed liquid was formed. The mixture was coated on a PET film and photocured with a UV light curing machine. The sample was not cured.

[0074] Comparative Example 2

[0075] 0.24 mol of trifluoropropylmethylcyclotrisiloxane and 0.23 mol of vinylmethyldimethoxysilane compound were added to the reactor, followed by 1.6 mol of deionized water and 100 g of mixed solvent (acetone: ethanol mass ratio = 1:1), 0.32 g of trifluoromethanesulfonic acid was added at 25°C, reacted for 0.5 h, then heated to 70°C and reacted for 2 h; then 32 g of sodium carbonate was added and neutralized for 2 h. Then filtered, the filtrate was collected, and then the pressure was reduced to above -0.09 MPa at 70°C, and the low boiling point was removed for 1-3 h to obtain an organic fluorine silicon polymer containing disulfide bonds:

[0076] Then the prepared disulfide bond-containing organic fluorosilicone polymer and photoinitiator 1173 were mixed in a mixing ratio of disulfide bond-containing organic fluorosilicone polymer: photoinitiator mass ratio = 100:5, and stirred evenly until a stable uniform mixed liquid was formed. The mixture was coated on a PET film and photocured with a UV light curing machine. The sample was not cured.

[0077] Test standard: Hardness test standard: GB / T 6379-1996; Adhesion test standard: GB / T1720-79(89); Corrosion resistance test: First, the UV-curable fluorosilicone coating prepared in the embodiment is coated on the tinplate, and then UV-cured for 45 seconds. Then, two drops of 5wt% hydrochloric acid, 5wt% sodium hydroxide and 5wt% sodium chloride aqueous solution are taken and dropped on the tinplate area not coated with the fluorosilicone coating and the tinplate area coated with the light-cured fluorosilicone coating, respectively. The corrosion state of the tinplate at different times is observed to evaluate the corrosion resistance of the prepared fluorosilicone coating, such as Fig. 9 shown.

[0078] The test results are as follows:

[0079]

[0080] The fluorosilicone coating prepared in the example can greatly hinder the corrosion resistance process of acid, alkali and salt solutions. Therefore, it can be concluded that the light-cured fluorosilicone coating prepared in this patent has good acid, alkali and salt corrosion resistance.

[0081] It should be noted that in the above embodiments, as long as the technical solutions are not contradictory, they can be arranged and combined, and those skilled in the art can exhaust all possibilities based on the mathematical knowledge of arrangement and combination. Therefore, the present invention will no longer describe the technical solutions after arrangement and combination one by one, but it should be understood that the technical solutions after arrangement and combination have been disclosed by the present invention.

[0082] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A UV light-curable disulfide-bonded organic fluorine-silicon polymer, characterized in that: The disulfide bond-containing organic fluorine silicon polymer is composed of fluorinated cyclic siloxane, vinyl alkoxy silane compound, disulfide bond silane, solvent, acid catalyst and neutralizer; The mass fraction of the fluorinated cyclic siloxane is 10-80 parts, the mass fraction of the vinyl alkoxy silane compound is 10-80 parts, the mass fraction of the disulfide bond silane is 10-80 parts, and the mass fraction of the solvent is 0-50 parts.

2. The UV light-curable disulfide-bonded organic fluorine-silicon polymer according to claim 1, characterized in that: The fluorinated cyclic siloxane is one or more of trifluoropropylmethylcyclotrisiloxane, nonafluorohexylmethylcyclosiloxane and tridecafluorooctylmethylcyclosiloxane.

3. The UV light-curable disulfide-bonded organic fluorosilicone polymer according to claim 1, characterized in that: The vinyl alkoxysilane compound is one or more of vinyl methyl dimethoxy silane, vinyl methyl diethoxy silane, vinyl trimethoxy silane and vinyl triethoxy silane.

4. The UV light-curable disulfide-bonded organic fluorine-silicon polymer according to claim 1, characterized in that: The disulfide silane is one or more of bis-[3-(triethoxysilyl)propyl]-disulfide and bis-[γ-(triethoxysilyl)propyl]tetrasulfide.

5. The UV light-curable disulfide-bonded organic fluorosilicone polymer according to claim 1, characterized in that: The solvent is one or more of methanol, ethanol, acetone, butanone, methyl ethyl ketone and ethyl acetate.

6. The UV light-curable disulfide-bonded organic fluorine-silicon polymer according to claim 1, characterized in that: The acid catalyst is one or more of hydrochloric acid, sulfuric acid, acetic acid, phosphoric acid and trifluoromethanesulfonic acid, and the neutralizing agent is one or more of sodium hydroxide, potassium hydroxide, sodium bicarbonate and sodium carbonate.

7. The UV light-curable disulfide-bonded organic fluorine-silicon polymer according to claim 1, characterized in that: The photoinitiator is one or more of a free radical photoinitiator, 2,2-dimethyl-2-phenylacetophenone and diphenyl-(2,4,6-trimethylbenzoyl)phosphine oxide.

8. A method for preparing a UV-curable disulfide-bonded organic fluorine-silicon polymer, characterized in that: The steps include: Step 1: Add fluorinated cyclic siloxane and vinyl alkoxysilane compound into a reactor, then add water and solvent, add trifluoromethanesulfonic acid at 25-70° C., and react for 0.5-72 hours; Step 2: dropwise adding disulfide silane, reacting for 0.5-72 hours, adding a neutralizing agent after the reaction, neutralizing for 1-72 hours, and obtaining a mixed solution; Step 3: Filter the mixed solution, collect the filtrate, and then reduce the pressure at 70-120°C to -0.09MPa, and remove the low boiling point for 1-3h to obtain a colorless, transparent to light yellow liquid, which is an organic fluorosilicone polymer containing disulfide bonds.

9. A UV light-curable disulfide-bonded organic fluorine-silicon polymer coating, characterized in that: The disulfide bond-containing organic fluorine silicon polymer coating is composed of a disulfide bond-containing organic fluorine silicon polymer and a photoinitiator; The mass fraction of the disulfide bond-containing organic fluorine silicon polymer is 10-80 parts, and the mass fraction of the photoinitiator is 0.1-10 parts.

10. A method for preparing a UV-curable disulfide-bonded organic fluorosilicone polymer coating, characterized in that: The steps include: Step 1: uniformly mixing the hyperbranched organosilicon polymer containing disulfide bonds and the photoinitiator until a stable and uniform mixed solution is formed; Step 2: coating the mixed solution on a substrate, and then curing it by UV light for 45 seconds to obtain an organic fluorosilicone polymer coating containing disulfide bonds.

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