Optical module chip automatic test equipment

Abstract

The present application discloses a chip testing technology field, specifically an optical module chip automatic testing device, including a workbench, the workbench is connected with a feeding part for conveying a material tray, a positioning and grasping part for grasping a workpiece in the material tray, a camera 2 for correcting the position of the workpiece, a test alignment component for adjusting the test position of the workpiece, a test component for testing the workpiece, and a flipping component for turning the workpiece over; the automatic testing of the optical power of the optical module chip can be realized, the testing can be carried out continuously without human intervention, the dependence on highly skilled operators is reduced, the labor cost is reduced, the scrap rate caused by human errors is reduced, the testing speed and efficiency are greatly improved, and highly accurate and consistent test results are provided, which helps to ensure that the performance of each optical module chip meets the predetermined standards and improve the quality and reliability of the final product.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and specifically to automatic testing equipment for optical module chips. Background Art

[0002] Optical module chips are core components in optical communication equipment and are responsible for the conversion of optical and electrical signals.

[0003] After the production of the optical module is completed, the performance of the optical module needs to be tested. The prior art (Chinese invention patent with publication number CN114650665B) discloses an automatic testing mechanism for an optical module chip, which adjusts the angle of the chip through a large range of positive and negative bidirectional dynamic angles to meet the high requirements for accuracy in the optical communication chip mounting process, improves the success rate of one-time adsorption of the optical communication chip and further improves the accuracy of angle adjustment. The Chinese invention patent with publication number CN115728624A discloses a laser chip aging unit module and a laser chip testing device, which can be used for aging test of optical module chips. At the same time, a modular design is adopted, and the assembly and use are more flexible. Although the existing testing equipment can automatically test the absorption contact and aging of the chip, it cannot test the optical power of the optical module chip. The optical power test of the optical module chip is the process of evaluating the output optical power of the light source at its transmitting end, which is crucial to ensuring the performance and quality of the optical module. Summary of the invention

[0004] The purpose of this application is to provide an automatic testing device for optical module chips to solve the technical problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present application provides the following technical solutions: automatic testing equipment for optical module chips, including a workbench, to which is connected a feeding part for conveying a material tray, a positioning and grasping part for grasping a workpiece in the material tray, a second camera for correcting the position of the workpiece, a test alignment component for adjusting the test position of the workpiece, a test component for testing the workpiece, and a flipping component for turning over the workpiece.

[0006] The test assembly includes a position test part and a test part connected to the upper end of the workbench, and the test part includes an axial movable platform three connected to the upper end of the workbench, a support seat two fixedly connected to the movable end of the axial movable platform three, an axial movable platform four connected to the upper end of the support seat two, a connecting seat two fixedly connected to the movable end of the axial movable platform four, a cylinder three and a cross plate fixedly connected to one side of the connecting seat two, and a frame slidably connected to the upper end of the cross plate, and the telescopic end of the cylinder three is fixedly connected to one side of the frame, and the FAU is fixedly connected to the lower end of the frame.

[0007] Preferably, a bracket for supporting the FAU line is also fixedly connected to the lower end of the frame.

[0008] Preferably, the position testing part includes an axially movable platform 2 fixedly connected to the upper end of the workbench, a connecting seat 1 fixedly connected to the movable end of the axially movable platform 2, and a camera 3 fixed inside the connecting seat 1, and the photographing end of the camera 3 faces the test alignment component.

[0009] Preferably, the test alignment assembly includes an axial movable platform fixedly connected to the upper end of the workbench, a support seat fixedly connected to the movable end of the axial movable platform, a rotating part connected to the upper end of the support seat, and a suction nozzle connected to the inside of the rotating part.

[0010] Preferably, the positioning and grasping part includes a three-axis mobile platform fixedly connected to the upper end of the workbench, a mounting plate fixedly connected to one side of the Z-axis mobile end of the three-axis mobile platform, two cylinders 2 and a camera 1 fixedly connected to one side of the mounting plate, two slides slidably connected to one side of the mounting plate, two motors 1 respectively fixedly connected to one side of the two slides, two suction cups respectively connected to the output shafts of the two motors 1, and the telescopic ends of the two cylinders 2 are respectively fixedly connected to the two slides.

[0011] Preferably, the flipping assembly includes a bracket fixedly connected to the upper end of the workbench, a column rotatably connected to the inside of the bracket, a flipping part fixedly connected to the outside of the column, a second suction nozzle connected to the inside of the flipping part, a rotary joint fixedly connected to one side of the bracket, and a second motor fixedly connected to the other side of the bracket, and the inner tube of the rotary joint is inserted into the column, a through groove connecting the inner tube of the rotary joint with the second suction nozzle is opened inside the column, the output shaft of the second motor passes through the bracket and is fixedly connected to one side of the column, a buffer part is also fixedly connected to one side of the bracket, and the first suction nozzle is connected inside the buffer part.

[0012] Preferably, the feeding part includes a conveying mechanism and a cylinder 1 fixedly connected to the upper end of the workbench, a cylinder clamp fixedly connected to the telescopic end of the cylinder 1, and two clamps respectively fixedly connected to the two clamping ends of the cylinder clamp.

[0013] Preferably, the two clamps are located inside the conveying mechanism, and a sensor is also fixedly connected to the inner wall of the conveying mechanism.

[0014] Compared with the prior art, the beneficial effects of this application are:

[0015] The present application sets a positioning and grasping part, a flipping component, a test alignment component and a test component. The positioning and grasping part can suck up the optical module chip to be tested and transport it to the flipping component, flip the optical module chip through the flipping component, adjust the angle of the flipped optical module chip through the test alignment component, correct the test angle, and finally provide a light source to the optical module chip and read the optical power of the optical module chip through the test component, so as to realize automatic testing of the optical power of the optical module chip, and can perform tests continuously without human intervention, reduce dependence on highly skilled operators, reduce labor costs, reduce scrap rate caused by human errors, greatly improve test speed and efficiency, provide highly accurate and consistent test results, help to ensure that the performance of each optical module chip meets the predetermined standards, and improve the quality and reliability of the final product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of this application.

[0017] Figure 2 This is a schematic diagram of the positioning and grabbing structure of this application.

[0018] Figure 3 This is a structural diagram of camera 2 of this application.

[0019] Figure 4 This is a schematic diagram of the feeding part structure of this application.

[0020] Figure 5 This is a schematic diagram of the flip component structure for this application.

[0021] Figure 6 This is a schematic diagram of the test component structure for this application.

[0022] Figure 7 Schematic diagram of the test alignment component structure for this application.

[0023] Figure 8 This is a schematic diagram of the position test unit and the test unit structure of this application.

[0024] In the figure: 1. workbench; 2. feeding part; 21. conveying mechanism; 22. cylinder 1; 23. cylinder clamp; 24. fixture; 25. sensor; 3. positioning and grasping part; 31. three-axis moving platform; 32. mounting plate; 33. cylinder 2; 34. slide; 35. motor 1; 36. suction cup; 37. camera 1; 4. flip assembly; 41. bracket; 42. motor 2; 43. buffer part; 44. nozzle 1; 45. flip part; 46. nozzle 2; 47. column; 48. rotary joint; 5. camera 2; 6. Test alignment component; 61. Axial moving platform 1; 62. Support seat 1; 63. Rotating part; 64. Suction nozzle 3; 7. Test component; 71. Position test part; 711. Axial moving platform 2; 712. Connecting seat 1; 713. Camera 3; 72. Test part; 721. Axial moving platform 3; 722. Support seat 2; 723. Axial moving platform 4; 724. Connecting seat 2; 725. Cylinder 3; 726. Frame; 727. Horizontal plate; 728. FAU; 729. Bracket. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0026] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0027] Example

[0028] See also Figure 1-Figure 8 The present application provides a technical solution: an automatic testing device for optical module chips, comprising a workbench 1, to which is connected a feeding portion 2 for conveying a material tray, a positioning and grasping portion 3 for grasping a workpiece in the material tray, a camera 5 for correcting the position of the workpiece, a test alignment component 6 for adjusting the test position of the workpiece, a test component 7 for testing the workpiece, and a flipping component 4 for turning over the workpiece.

[0029] The test assembly 7 includes a position test part 71 and a test part 72 connected to the upper end of the workbench 1, wherein the test part 72 includes an axial movable platform 3 721 connected to the upper end of the workbench 1, a support seat 2 722 fixedly connected to the movable end of the axial movable platform 3 721, an axial movable platform 4 723 connected to the upper end of the support seat 2 722, a connecting seat 2 724 fixedly connected to the movable end of the axial movable platform 4 723, a cylinder 3 725 and a cross plate 727 fixedly connected to one side of the connecting seat 2 724, and a frame 726 slidably connected to the upper end of the cross plate 727, and the telescopic end of the cylinder 3 725 is fixedly connected to one side of the frame 726, and the lower end of the frame 726 is fixedly connected with FAU 728 (FAU fiber array unit (Fiber Array Unit) is a precision optical device. It forms an array by arranging and fixing multiple optical fibers at a certain interval to accurately connect with optoelectronic components (such as lasers, detectors, etc.). In this application, one end of FAU728 is connected to the test light source and the optical power reading device through multiple optical fibers. By inserting FAU728 into the optical module chip, a light source is provided for the optical module chip test, and the optical power of the optical module chip is read by the optical power reading device). The lower end of the frame 726 is also fixed with a bracket 729 for supporting the FAU728 line (optical fiber line).

[0030] By setting the above scheme, when the test alignment component 6 drives the optical module chip to move to the bottom of FAU728, the axial moving platform four 723 works and drives the connecting seat two 724, the frame 726 and FAU728 to descend, the cylinder three 725 works and extends to drive the frame 726 to move, the frame 726 slides on the horizontal plate 727 and drives FAU728 to move, and the FAU728 is inserted into the socket of the optical module chip. The test light source (model JW8001) connected to FAU728 provides light source for the optical module chip test, and the optical power reading device (model JW8102) connected to FAU728 works to read the optical power of the optical module chip to realize the automated optical power test of the optical module chip. The axial moving platform three 721 is used to adjust the position of the support seat two 722 and the axial moving platform four 723, so that the support seat two 722 and the axial moving platform four 723 can be closer to the test alignment component 6.

[0031] like Figure 6-Figure 8 As shown, the position testing part 71 includes an axially movable platform 2 711 fixedly connected to the upper end of the workbench 1, a connecting seat 1 712 fixedly connected to the movable end of the axially movable platform 2 711, and a camera 3 713 fixedly connected inside the connecting seat 1 712, and the photographing end of the camera 3 713 faces the test alignment component 6.

[0032] The test alignment component 6 includes an axial movable platform 61 fixedly connected to the upper end of the workbench 1, a support seat 62 fixedly connected to the movable end of the axial movable platform 61, a rotating part 63 connected to the upper end of the support seat 62, and a suction nozzle 3 64 connected to the inside of the rotating part 63.

[0033] By setting the above scheme, after the positioning and grasping part 3 places the optical module chip on the rotating part 63, the suction nozzle three 64 adsorbs the optical module chip on the rotating part 63, and the axial moving platform one 61 can drive the support seat one 62 and the rotating part 63 to move, and the optical module chip on the rotating part 63 is moved to the bottom of the camera three 713. The optical module chip on the rotating part 63 can be photographed by the camera three 713, and the plug direction of the optical module chip is identified to determine whether the socket orientation angle of the optical module chip is offset. If offset occurs, the rotating part 63 rotates and drives the optical module chip to rotate, and adjusts and corrects the socket orientation angle of the optical module chip to avoid the situation where the FAU728 cannot be inserted into the optical module chip socket due to the offset of the socket angle of the optical module chip. The rotating part 63 is composed of a motor, a gear and a rotating disk with a toothed key. The suction nozzle three 64 is installed in the rotating disk, and the optical module chip is adsorbed on the rotating disk by the suction nozzle three 64. The motor output shaft is connected to the gear, and the rotation of the gear drives the rotating disk to rotate, which belongs to a common rotation method in the prior art and will not be repeated here.

[0034] like Figure 1 , Figure 2 and Figure 4 As shown, the feeding part 2 includes a conveying mechanism 21 and a cylinder 22 fixedly connected to the upper end of the workbench 1, a cylinder clamp 23 fixedly connected to the telescopic end of the cylinder 22, and two clamps 24 respectively fixedly connected to the two clamping ends of the cylinder clamp 23. The two clamps 24 are located inside the conveying mechanism 21, and a sensor 25 is also fixedly connected to the inner wall of the conveying mechanism 21.

[0035] The positioning and grasping part 3 includes a three-axis mobile platform 31 fixedly connected to the upper end of the workbench 1, a mounting plate 32 fixedly connected to one side of the Z-axis mobile end of the three-axis mobile platform 31, two cylinders 2 33 and a camera 1 37 fixedly connected to one side of the mounting plate 32, two slides 34 slidably connected to one side of the mounting plate 32, two motors 1 35 respectively fixedly connected to one side of the two slides 34, and two suction cups 36 respectively connected to the output shafts of the two motors 1 35, and the telescopic ends of the two cylinders 2 33 are respectively fixedly connected to the two slides 34.

[0036] By setting the above scheme, after the conveying mechanism 21 (conveyor belt) conveys the material sheet to the position of the sensor 25, the sensor 25 detects the material sheet and controls the conveying mechanism 21 to stop passing, the cylinder 22 works to extend and drives the cylinder clamp 23 to rise, the cylinder clamp 23 rises and drives the two clamps 24 to rise, so that the two clamps 24 can be located on the left and right sides of the material sheet, the cylinder clamp 23 works to clamp and drive the two clamps 24 to move towards each other, the two clamps 24 clamp the material sheet and position it, then the three-axis mobile platform 31 works to drive the installation plate 32 to move, first move the camera 37 to the upper end of the material sheet, and perform the optical module chip on the material sheet. After performing image acquisition and determining the position of the optical module chip (used to align the position of the optical module chip to ensure that the suction cup 36 can accurately absorb the optical module chip), the suction cup 36 on the left is moved to the top of the optical module chip, and one of the cylinders 33 extends out and drives the suction cup 36 to descend, sucks the optical module chip on the tray, and then drives the sucked optical module chip to move and place it in the flip component 4. It is also used to move the optical module chip flipped by the flip component 4 and place it on the rotating part 63, and is also used to move the optical module chip on the rotating part 63 that has been tested by FAU728 and put it back on the tray.

[0037] like Figure 5 As shown, the flip assembly 4 includes a bracket 41 fixedly connected to the upper end of the workbench 1, a column 47 rotatably connected to the inside of the bracket 41, a flip part 45 fixedly connected to the outside of the column 47, a suction nozzle 46 connected to the inside of the flip part 45, a rotary joint 48 fixedly connected to one side of the bracket 41, and a motor 42 fixedly connected to the other side of the bracket 41, and the inner tube of the rotary joint 48 is inserted into the column 47, and a through groove is opened inside the column 47 to connect the inner tube of the rotary joint 48 with the suction nozzle 46, the output shaft of the motor 42 passes through the bracket 41 and is fixedly connected to one side of the column 47, and a buffer part 43 is also fixedly connected to one side of the bracket 41, and a suction nozzle 44 is connected inside the buffer part.

[0038] By setting up the above scheme, the optical module chip to be tested is placed on the flipping part 45 through the positioning and grasping part 3, the suction nozzle 2 46 works to generate negative pressure to suck the optical module chip onto the flipping part 45, and then the motor 2 42 works to drive the column 47 to rotate, so that the flipping part 45 rotates 180° to turn the optical module chip over, and then the suction nozzle 2 46 stops working, and the suction nozzle 1 44 works to suck the flipped optical module chip onto the cache part 43, and the positioning and grasping part 3 sucks the flipped optical module chip in the cache part 43 and moves it to be placed on the rotating part 63.

[0039] Working principle: After the conveying mechanism 21 (conveyor belt) conveys the material sheet to the position of the sensor 25, the sensor 25 detects the material sheet and controls the conveying mechanism 21 to stop passing, the cylinder 22 works to extend and drive the cylinder clamp 23 to rise, the cylinder clamp 23 rises and drives the two clamps 24 to rise, so that the two clamps 24 can be located on the left and right sides of the material sheet, the cylinder clamp 23 works to clamp and drive the two clamps 24 to move towards each other, the two clamps 24 clamp the material sheet and position it, then the three-axis mobile platform 31 works to drive the mounting plate 32 to move, first move the camera 37 to the upper end of the material sheet, and collect the image of the optical module chip on the material sheet, after determining the position of the optical module chip (used to align the position of the optical module chip , ensure that the suction cup 36 can accurately absorb the optical module chip), and then move the suction cup 36 on the left side to the top of the optical module chip, one of the cylinders 2 33 works to extend and drive the suction cup 36 to descend, absorb the optical module chip on the tray, and then drive the absorbed optical module chip to move to the top of the camera 2 5, and use the camera 2 5 to detect the position of the optical module chip on the suction cup 36. After detection, the optical module chip is placed on the flip part 45, and the suction nozzle 2 46 works to generate negative pressure to suck the optical module chip onto the flip part 45, and then the motor 2 42 works to drive the column 47 to rotate, so that the flip part 45 rotates 180°, and the optical module chip is turned over, and then the suction nozzle 2 46 stops working, and the suction nozzle 1 44 works to turn the flipped optical module chip The optical module chip is sucked on the buffer part 43, the positioning and grasping part 3 sucks the flipped optical module chip in the buffer part 43 and moves it to the top of the camera 2 5, detects the position of the flipped optical module chip and then moves and places the optical module chip on the rotating part 63, the suction nozzle 3 64 adsorbs the optical module chip on the rotating part 63, and the axial moving platform 1 61 can drive the support seat 1 62 and the rotating part 63 to move, and move the optical module chip on the rotating part 63 to the bottom of the camera 3 713, and the optical module chip on the rotating part 63 can be photographed by the camera 3 713, and the plug direction of the optical module chip can be identified to determine whether the socket direction angle of the optical module chip is offset. If offset occurs, the rotating part 63 is rotated. And drive the optical module chip to rotate, adjust the direction angle of the socket of the optical module chip, after the correction is completed, the axial moving platform four 723 works and drives the connecting seat two 724, the frame 726 and the FAU728 to descend, the cylinder three 725 works and extends to drive the frame 726 to move, the frame 726 slides on the horizontal plate 727 and drives the FAU728 to move, and the FAU728 is inserted into the socket of the optical module chip. The test light source (model JW8001) connected to FAU728 provides light source for the optical module chip test, and the optical power reading device (model JW8102) connected to FAU728 works to read the optical power of the optical module chip, so as to realize the automated optical power test of the optical module chip.

[0040] The above shows and describes the basic principles and main features of the present application and the advantages of the present application. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or basic features of the present application; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present application is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present application, and any figure marks in the claims should not be regarded as limiting the claims involved.

[0041] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. An optical module chip automatic testing device, comprising a workbench (1), characterized in that: The workbench (1) is connected to a feeding portion (2) for conveying a material tray, a positioning and grabbing portion (3) for grabbing a workpiece in the material tray, a second camera (5) for correcting the position of the workpiece, a test alignment component (6) for adjusting the test position of the workpiece, a test component (7) for testing the workpiece, and a flipping component (4) for turning over the workpiece; The test assembly (7) comprises a position test part (71) and a test part (72) connected to the upper end of the workbench (1), wherein the test part (72) comprises an axial movable platform three (721) connected to the upper end of the workbench (1), a support seat two (722) fixedly connected to the movable end of the axial movable platform three (721), an axial movable platform four (723) connected to the upper end of the support seat two (722), a connecting seat two (724) fixedly connected to the movable end of the axial movable platform four (723), a cylinder three (725) and a cross plate (727) fixedly connected to one side of the connecting seat two (724), and a frame (726) slidably connected to the upper end of the cross plate (727), wherein the telescopic end of the cylinder three (725) is fixedly connected to one side of the frame (726), and the lower end of the frame (726) is fixedly connected to the FAU (728); The position testing section (71) comprises an axially movable platform 2 (711) fixedly connected to the upper end of the workbench (1), a connecting seat 1 (712) fixedly connected to the movable end of the axially movable platform 2 (711), and a camera 3 (713) fixedly connected inside the connecting seat 1 (712), wherein the photographing end of the camera 3 (713) faces the test alignment component (6); The test alignment assembly (6) comprises an axial movable platform (61) fixedly connected to the upper end of the workbench (1), a support seat (62) fixedly connected to the movable end of the axial movable platform (61), a rotating part (63) connected to the upper end of the support seat (62), and a suction nozzle (64) connected to the inside of the rotating part (63); The positioning and grasping part (3) comprises a three-axis mobile platform (31) fixedly connected to the upper end of the workbench (1), a mounting plate (32) fixedly connected to one side of the Z-axis mobile end of the three-axis mobile platform (31), two cylinders (33) and a camera (37) fixedly connected to one side of the mounting plate (32), two slide seats (34) slidably connected to one side of the mounting plate (32), two motors (35) respectively fixedly connected to one side of the two slide seats (34), and two suction cups (36) respectively connected to the output shafts of the two motors (35), and the telescopic ends of the two cylinders (33) are respectively fixedly connected to the two slide seats (34).

2. The optical module chip automatic testing equipment according to claim 1, characterized in that: The lower end of the frame (726) is also fixedly connected to a bracket (729) for supporting the FAU (728) line body.

3. The optical module chip automatic testing equipment according to claim 2, characterized in that: The flip assembly (4) comprises a bracket (41) fixedly connected to the upper end of the workbench (1), a column (47) rotatably connected to the inside of the bracket (41), a flip part (45) fixedly connected to the outside of the column (47), a second suction nozzle (46) connected to the inside of the flip part (45), a rotary joint (48) fixedly connected to one side of the bracket (41), and a second motor (42) fixedly connected to the other side of the bracket (41), wherein the inner tube of the rotary joint (48) is inserted into the column (47), a through groove is provided inside the column (47) to connect the inner tube of the rotary joint (48) and the second suction nozzle (46), an output shaft of the second motor (42) passes through the bracket (41) and is fixedly connected to one side of the column (47), a buffer part (43) is also fixedly connected to one side of the bracket (41), and a first suction nozzle (44) is connected inside the buffer part.

4. The optical module chip automatic testing equipment according to claim 3 is characterized in that: The feeding part (2) comprises a conveying mechanism (21) and a cylinder (22) fixedly connected to the upper end of the workbench (1), a cylinder clamp (23) fixedly connected to the telescopic end of the cylinder (22), and two clamps (24) respectively fixedly connected to the two clamping ends of the cylinder clamp (23).

5. The optical module chip automatic testing equipment according to claim 4, characterized in that: The two clamps (24) are located inside the conveying mechanism (21), and a sensor (25) is also fixedly connected to the inner wall of the conveying mechanism (21).

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