Circuit board constant temperature device and method
By dynamically adjusting the cooling fan and heating module in the constant temperature device of the circuit board, combined with the dynamic adjustment of the motor drive support board, the contradiction between the temperature control range and the change speed of the circuit board is solved, and a stable temperature in the range of 20℃~30℃ is achieved Control improves the performance and life of electronic components.
Patent Information
- Application Number
- CN202411063991.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-05
- Publication Date
- 2024-12-27
AI Technical Summary
There is a contradiction between the temperature protection measures of existing circuit boards between the temperature change speed and the control range, and it is difficult to work effectively within the temperature range of -40℃~+85℃ or -55℃~+125℃, resulting in the performance and life of electronic components. Decreased, costs increased.
A circuit board constant temperature device is designed, including target circuit board, support board, constant temperature circuit control board, motor, cooling fan, heating module and temperature acquisition module. By collecting temperature data in real time, dynamically adjust the start and start of the cooling fan and heating module. Close and the motor drive support plate close or away from each other, to achieve flexible regulation of heating and heat dissipation power, ensuring the temperature is stable within the range of 20℃ to 30℃.
It realizes rapid change and stable control of circuit board temperature, solves the contradiction between temperature change speed and control range, improves the performance and life of electronic components, and reduces costs.
Smart Images

Figure CN119200693A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of circuit board constant temperature, and in particular relates to a circuit board constant temperature device and method. Background Art
[0002] With the development of science and technology and industrial technology, the requirements for the working environment of circuit boards are getting higher and higher. The current industrial system requires that circuit boards can work in the temperature range of -40℃~+85℃, and the military weapon system requires that circuit boards can work in the temperature range of -55℃~+125℃. This is a huge test for the electronic components on the circuit board, especially the integrated circuits. Some electronic components cannot reach the required operating temperature, and even if they can reach the required operating temperature, the cost will increase several times.
[0003] Because the electronic components on the circuit board work under normal temperature (in the present invention, normal temperature refers to 20℃~30℃), their performance and life will be greatly improved, and thus the safe operation of the entire system in which the circuit board is located can be guaranteed. The existing measures for circuit board temperature protection include heating and cooling, but there is a contradiction between the temperature change rate and the temperature control range. Taking heating as an example (cooling is the same), when the temperature is below 20℃, it is easy to make the temperature rise rapidly by heating, but if the temperature rises too fast, it is easy to make the temperature exceed 30℃. If it is heated slowly, although it is easy to ensure that the temperature does not exceed 30℃, the temperature rise rate cannot be guaranteed. Summary of the invention
[0004] In view of this, the present invention provides a circuit board constant temperature device and method, which can rapidly change the temperature of the circuit board and maintain it in a temperature environment of 20°C to 30°C, effectively resolving the contradiction between the temperature change speed and the temperature control range.
[0005] The circuit board constant temperature device provided by the present invention adopts the following technical solutions:
[0006] A circuit board constant temperature device, comprising a target circuit board, a first support plate, a second support plate, a constant temperature circuit control board, a motor, a cooling fan, a heating module and a temperature acquisition module;
[0007] The first supporting plate is provided with a target circuit board and a temperature acquisition module;
[0008] A constant temperature circuit control board, a motor, a cooling fan, and a heating module are arranged on the second support plate; the constant temperature circuit control board can collect the ambient temperature of the target circuit board in real time according to the temperature collection module, control the cooling fan and the heating module to start and stop, and control the forward or reverse rotation of the motor to drive the second support plate to approach or move away from the target circuit board.
[0009] Further, it also includes a radiation panel;
[0010] The constant temperature circuit control board, the motor, and the cooling fan are all arranged on the top surface of the second supporting plate;
[0011] The radiation plate is disposed on the bottom surface of the second supporting plate, and the radiation plate is opposite to the target circuit board;
[0012] The second support plate and the radiation plate are provided with coaxial through holes, and the fan provides heat dissipation airflow to the target circuit board through the through holes;
[0013] The heating module is disposed on the radiation plate, and the radiation plate is used to radiate heat generated by the heating module to the target circuit board.
[0014] Furthermore, it also includes a distance measurement module;
[0015] The distance measuring module is arranged on the radiation board and is used to measure the distance between the radiation board and the target circuit board;
[0016] The constant temperature circuit control board can control the radiation board to approach or move away from the target circuit board by a set distance through the distance measurement module.
[0017] Further, it also includes a telescopic rod;
[0018] One end of the telescopic rod is connected to the first support plate, and the other end is connected to the output shaft of the motor through a transmission mechanism;
[0019] The motor can control the extension or contraction of the telescopic rod through a transmission mechanism, so that the radiation plate is close to or away from the target circuit board.
[0020] Furthermore, the heating module includes a first heating module, a second heating module and a third heating module, the heating powers of which increase in sequence.
[0021] Furthermore, the heating module is a power resistor.
[0022] Furthermore, the first support plate and the second support plate are both made of non-metallic materials.
[0023] Furthermore, the radiation plate is a copper plate;
[0024] The distance measuring module is an infrared distance measuring module.
[0025] A circuit board constant temperature method provided by the present invention adopts the above-mentioned circuit board constant temperature device, comprising:
[0026] When the temperature of the target circuit board is lower than the set working temperature, the constant temperature circuit control board controls the heating module to start heating, turns off the cooling fan, and controls the motor to rotate forward, so that the radiation plate moves a set distance toward the target circuit board;
[0027] When the temperature of the target circuit board is higher than the set operating temperature, the constant temperature circuit control board controls the cooling fan to dissipate heat, turns off the heating module, and controls the motor to reverse, so that the radiation plate moves a set distance away from the target circuit board.
[0028] Further, when the temperature of the target circuit board is less than -20°C, the first heating module, the second heating module and the third heating module all start heating, the cooling fan is turned off, and the motor rotates forward, so that the radiation plate moves a set distance in a direction close to the target circuit board;
[0029] When the temperature of the target circuit board is greater than -20°C and less than 0°C, the first heating module and the second heating module start heating, the third heating module and the cooling fan are both turned off, and the motor rotates forward, so that the radiation plate moves a set distance toward the target circuit board;
[0030] When the temperature of the target circuit board is greater than 0°C and less than 20°C, the first heating module starts heating, the second heating module, the third heating module and the cooling fan are all turned off, and the motor is reversed to move the radiation plate away from the target circuit board by a set distance;
[0031] When the temperature of the target circuit board is greater than 20° C. and less than 30° C., the first heating module, the second heating module, the third heating module and the cooling fan are all turned off, and the motor is reversed to move the radiation plate away from the target circuit board by a set distance;
[0032] When the temperature of the target circuit board is greater than 30° C., the first heating module, the second heating module, and the third heating module are turned off, the cooling fan is started to dissipate heat, and the motor rotates forward to move the radiation plate toward the target circuit board by a set distance.
[0033] Beneficial effects:
[0034] 1. The circuit board constant temperature device comprises a target circuit board, a first support plate, a second support plate, a constant temperature circuit control board, a motor, a cooling fan, a heating module, and a temperature acquisition module; the first support plate is provided with a target circuit board and a temperature acquisition module; the second support plate is provided with a constant temperature circuit control board, a motor, a cooling fan, and a heating module; the constant temperature circuit control board can control the cooling fan and the heating module to start and stop according to the ambient temperature of the target circuit board collected in real time by the temperature acquisition module, and control the forward or reverse rotation of the motor to drive the second support plate to approach or move away from the target circuit board.
[0035] In this way, the constant temperature circuit control board can control the start and stop of the cooling fan and the heating module according to the ambient temperature of the target circuit board collected in real time by the temperature acquisition module, so as to realize heating and heat dissipation. Moreover, the distance between the second support plate and the target circuit board can be adjusted dynamically, that is, the distance between the heating module as the heat source and the cooling fan as the cold source and the target circuit board can be adjusted dynamically, thereby being able to flexibly adjust the heating and heat dissipation power, solve the contradiction between the temperature change speed and the temperature control range, and at the same time, be able to match target circuit boards of different heights.
[0036] 2. The constant temperature circuit control board, the motor, and the cooling fan are all arranged on the top surface of the second support plate; the radiation plate is arranged on the bottom surface of the second support plate, and the radiation plate is opposite to the target circuit board; coaxial through holes are arranged on the second support plate and the radiation plate, and the cooling fan provides cooling airflow to the target circuit board through the through holes; the heating module is arranged on the radiation plate, and the radiation plate is used to radiate the heat generated by the heating module to the target circuit board.
[0037] In this way, the heat generated by the heating module can be radiated to the target circuit board more efficiently through the radiation plate, thereby increasing the heating speed of the target circuit board. At the same time, the cooling fan can provide directional cooling airflow to the target circuit board through the through hole.
[0038] 3. The distance measuring module is arranged on the radiation board to measure the distance between the radiation board and the target circuit board; the constant temperature circuit control board can control the radiation board to approach or move away from the target circuit board to a set distance through the distance measuring module.
[0039] In this way, a distance measuring module is introduced to measure the distance between the radiation plate and the target circuit board, so that the constant temperature circuit control board can more accurately control the position of the radiation plate to keep the target circuit board within a suitable operating temperature range.
[0040] 4. One end of the telescopic rod is connected to the first support plate, and the other end is connected to the output shaft of the motor through a transmission mechanism; the motor can control the extension or shortening of the telescopic rod through the transmission mechanism to make the radiation plate approach or move away from the target circuit board.
[0041] In this way, by setting the telescopic rod and the transmission mechanism, the distance between the radiation plate and the target circuit board can be dynamically adjusted, and the structure is simple and compact.
[0042] 5. The heating module includes a first heating module, a second heating module and a third heating module with increasing heating powers. In this way, by setting heating modules with different heating powers, heating modules with different powers can be selectively started according to the actual temperature requirements of the target circuit board to achieve more precise temperature control.
[0043] 6. The heating module is a power resistor. Using a power resistor as a heating module provides a simple, reliable and easy-to-control heating method.
[0044] 7. Both the first support plate and the second support plate are made of non-metallic materials. Using non-metallic materials as the first and second support plates helps to improve the thermal insulation performance of the device and prevent the thermostatic circuit control board, motor, and cooling fan on the second support plate from being damaged by the high temperature generated by the heating module.
[0045] 8. The radiation plate is a copper plate; the distance measuring module is an infrared distance measuring module. In this way, the copper plate is used as the radiation plate. Due to its good thermal conductivity, it can more effectively transfer the heat generated by the heating module to the target circuit board; the infrared distance measuring module provides high-precision distance measurement to ensure the accuracy of constant temperature control.
[0046] 9. When the temperature of the target circuit board is lower than the set working temperature, the constant temperature circuit control board controls the heating module to start heating, the cooling fan is turned off, and the motor is controlled to rotate forward, so that the second support plate moves a set distance toward the target circuit board; when the temperature of the target circuit board is higher than the set working temperature, the constant temperature circuit control board controls the cooling fan to dissipate heat, the heating module is turned off, and the motor is controlled to reverse, so that the radiation plate moves a set distance away from the target circuit board.
[0047] In this way, a circuit board constant temperature method is provided. By controlling the start and stop of the heating module and the cooling fan, as well as the forward and reverse rotation of the motor, the distance between the radiation plate and the target circuit board is dynamically adjusted to maintain the circuit board within the set operating temperature range, thereby resolving the contradiction between the temperature change rate and the temperature control range. BRIEF DESCRIPTION OF THE DRAWINGS
[0048] Figure 1 A schematic diagram of the three-dimensional structure of a circuit board thermostat provided in Embodiment 1 of the present invention;
[0049] Figure 2 for Figure 1 Bottom view of the middle radiation panel;
[0050] Figure 3A system block diagram of a circuit board constant temperature method provided in Embodiment 2 of the present invention;
[0051] Figure 4 A control flow chart of a circuit board constant temperature method provided in Embodiment 2 of the present invention;
[0052] Among them, 1 is a cooling fan, 2 is a constant temperature circuit control board, 3 is a second support plate, 4 is a motor, 5 is a radiation plate, 6 is an infrared ranging sensor, 7 is a telescopic rod, 8 is a target circuit board, 9 is a first support plate, 10 is a first heating module, 11 is a second heating module, and 12 is a third heating module. DETAILED DESCRIPTION
[0053] The present invention is described in detail below with reference to the accompanying drawings and embodiments.
[0054] Embodiment 1:
[0055] Reference Figure 1-2 The present embodiment provides a circuit board constant temperature device, including a target circuit board 8, a first support plate 9, a second support plate 3, a constant temperature circuit control board 2, a motor 4, a cooling fan 1, a heating module, and a temperature acquisition module (not shown), wherein:
[0056] A target circuit board 8 and two temperature acquisition modules are arranged on the first support plate 9; a constant temperature circuit control board 2, a motor 4, a cooling fan 1, and a heating module are arranged on the second support plate 3; the constant temperature circuit control board 2 can collect the ambient temperature of the target circuit board 8 in real time according to the temperature acquisition module, control the cooling fan 1 and the heating module to start and stop, and control the forward or reverse rotation of the motor 4 to drive the second support plate 3 to approach or move away from the target circuit board 8.
[0057] In this way, the constant temperature circuit control board 2 can collect the ambient temperature of the target circuit board 8 in real time according to the temperature acquisition module, control the start and stop of the cooling fan 1 and the heating module, and realize the heating and heat dissipation of the target circuit board 8. Moreover, the distance between the second support plate 3 and the target circuit board 8 can be dynamically adjusted, that is, the distance between the heating module as the heat source and the cooling fan 1 as the cold source and the target circuit board 8 can be dynamically adjusted, thereby being able to flexibly adjust the heating and heat dissipation power, solve the contradiction between the temperature change speed and the temperature control range, and at the same time, be able to match target circuit boards 8 of different heights.
[0058] It is understandable that the forward or reverse rotation of the motor 4 drives the second support plate 3 to approach or move away from the target circuit board 8 in various ways, for example, it can be realized by a screw nut transmission mechanism, a gear rack mechanism, a slide rail mechanism, a telescopic rod mechanism or an electric push rod mechanism, etc. The heating module has various ways of realization, for example, it can be realized by an electric heating wire, a ceramic heater, a thermal film heater, a quartz heater, a PTC heater or an electric heating tube, etc.
[0059] As an improvement, in this embodiment, refer to Figure 1 and Figure 2 The circuit board constant temperature device also includes a radiation plate 5; the constant temperature circuit control board 2, the motor 4, and four cooling fans 1 are all arranged on the top surface of the second support plate 3; the radiation plate 5 is arranged on the bottom surface of the second support plate 3, and the radiation plate 5 is opposite to the target circuit board 8, and the radiation plate 5 and the second support plate 3 are a whole that can move together; the second support plate 3 and the radiation plate 5 are provided with coaxial through holes, and the cooling fan 1 provides a cooling airflow to the target circuit board 8 through the through holes; the heating module is arranged on the radiation plate 5, and the radiation plate 5 is used to radiate the heat generated by the heating module to the target circuit board 8.
[0060] In this way, the heat generated by the heating module can be more efficiently radiated to the target circuit board 8 through the radiation plate 5, thereby increasing the heating rate of the target circuit board 8. At the same time, the cooling fan 1 can provide directional cooling airflow to the target circuit board 8 through the through hole.
[0061] As a further improvement, in this embodiment, refer to Figure 1 and Figure 2 The circuit board constant temperature device also includes a distance measuring module; the distance measuring module is arranged on the radiation plate 5, and is used to measure the distance between the radiation plate 5 and the target circuit board 8; the constant temperature circuit control board 2 can control the radiation plate 5 to approach or move away from the target circuit board 8 by a set distance through the distance measuring module. In this way, the distance measuring module is introduced to measure the distance between the radiation plate 5 and the target circuit board 8, so that the constant temperature circuit control board 2 can more accurately control the position of the radiation plate 5 to keep the target circuit board 8 within a suitable working temperature range.
[0062] In this embodiment, the distance between the second support plate 3 and the target circuit board 8 is adjusted by the telescopic rod 7. Specifically, refer to Figure 1 One end of the telescopic rod 7 is connected to the first support plate 9, and the other end is connected to the output shaft of the motor 4 through a transmission mechanism (not shown); the motor 4 can control the extension or contraction of the telescopic rod 7 through the transmission mechanism to make the radiation plate 5 approach or move away from the target circuit board 8. In this way, through the arrangement of the telescopic rod 7 and the transmission mechanism, the distance between the radiation plate 5 and the target circuit board 8 is dynamically adjusted, and the structure is simple and compact.
[0063] Specifically, in this embodiment, refer to Figure 1 and Figure 2 The heating module includes a first heating module 10, a second heating module 11 and a third heating module 12, the heating powers of which increase in sequence. The first heating module 10 is arranged in the middle of the radiation plate 5, the second heating module 11 is arranged around the outer periphery of the first heating module 10, and the third heating module 12 is evenly arranged on the four corners of the radiation plate 5. In this way, by setting heating modules with different heating powers, heating modules with different powers can be selectively started according to the actual temperature requirements of the target circuit board 8 to achieve more precise temperature control.
[0064] More specifically, in this embodiment, the heating module is a power resistor. Using a power resistor as the heating module provides a heating method that is simple in structure, reliable, and easy to control.
[0065] As a further improvement, in this embodiment, the first support plate 9 and the second support plate 3 are both made of non-metallic materials. Using non-metallic materials as the first support plate 9 and the second support plate 3 helps to improve the thermal insulation performance of the device. For example, a plastic plate with good thermal insulation performance can be selected to prevent the constant temperature circuit control board 2, the motor 4, and the cooling fan 1 on the second support plate 3 from being damaged due to the high temperature generated by the heating module.
[0066] In particular, in this embodiment, the radiation plate 5 is a copper plate; the distance measuring modules are four infrared distance measuring modules 6 arranged on the four corners of the radiation plate 5. Thus, the use of the copper plate as the radiation plate 5 can more effectively transfer the heat generated by the heating module to the target circuit board 8 due to its good thermal conductivity; the infrared distance measuring module 6 provides high-precision distance measurement to ensure the accuracy of constant temperature control.
[0067] Embodiment 2:
[0068] Reference Figure 3 and Figure 4 Based on the above-mentioned embodiment 1, this embodiment provides a circuit board constant temperature control method, wherein Figure 3 The cooling module in the circuit board can refer to the cooling fan 1, the main control module can refer to the constant temperature circuit control board 2, and the power protection module is a protection element in the hardware circuit. Its function is to protect the constant temperature circuit and prevent excessive current from causing safety accidents. Specifically, a current sensor can be used to collect the real-time current of the circuit. The invention concept of the circuit board constant temperature control method is as follows:
[0069] When the temperature of the target circuit board 8 is lower than the set operating temperature (20℃ψ30℃), the constant temperature circuit control board 2 controls the heating module to start heating, the cooling fan 1 is turned off, and the motor 4 is controlled to rotate forward, so that the second support plate 3 moves a set distance in the direction close to the target circuit board 8; when the temperature of the target circuit board 8 is higher than the set operating temperature, the constant temperature circuit control board 2 controls the cooling fan 1 to dissipate heat, the heating module is turned off, and the motor 4 is controlled to reverse, so that the second support plate 3 moves a set distance in the direction away from the target circuit board 8.
[0070] In this way, a circuit board constant temperature method is provided, which dynamically adjusts the distance between the second support plate 3 and the target circuit board 8 by controlling the start and stop of the heating module and the cooling fan 1, and the forward and reverse rotation of the motor 4, so as to maintain the target circuit board 8 within the set operating temperature range, thereby resolving the contradiction between the temperature change rate and the temperature control range.
[0071] More specifically, refer to Figure 4 Based on the inventive concept of the above constant temperature control method, the following control process can be used:
[0072] When the temperature of the target circuit board 8 is lower than -20°C, the first heating module 10, the second heating module 11 and the third heating module 12 all start heating, the cooling fan 1 is turned off, and the motor 4 rotates forward, so that the radiation plate 5 moves a set distance toward the target circuit board 8;
[0073] When the temperature of the target circuit board 8 is greater than -20°C and less than 0°C, the first heating module 10 and the second heating module 11 start heating, the third heating module 12 and the cooling fan 1 are both turned off, and the motor 4 rotates forward, so that the radiation plate 5 moves a set distance toward the target circuit board 8;
[0074] When the temperature of the target circuit board 8 is greater than 0°C and less than 20°C, the first heating module 10 starts heating, the second heating module 11, the third heating module 12 and the cooling fan 1 are all turned off, and the motor 4 is reversed to move the radiation plate 5 away from the target circuit board 8 by a set distance;
[0075] When the temperature of the target circuit board 8 is greater than 20°C and less than 30°C, the first heating module 10, the second heating module 11, the third heating module 12 and the cooling fan 1 are all turned off, and the motor 4 is reversed to move the radiation plate 5 away from the target circuit board 8 by a set distance;
[0076] When the temperature of the target circuit board 8 is greater than 30°C, the first heating module 10, the second heating module 11, and the third heating module 12 are turned off, the cooling fan 1 starts to dissipate heat, and the motor 4 rotates forward, so that the radiation plate 5 moves a set distance toward the target circuit board 8.
[0077] Experiments have shown that, according to the above constant temperature control method, at a temperature of -55°C, the temperature of the target circuit board 8 can be raised to about 0°C in a few seconds.
[0078] In summary, the above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A circuit board constant temperature device, characterized in that: It includes a target circuit board, a first support board, a second support board, a constant temperature circuit control board, a motor, a cooling fan, a heating module and a temperature acquisition module; The first supporting plate is provided with a target circuit board and a temperature acquisition module; A constant temperature circuit control board, a motor, a cooling fan, and a heating module are arranged on the second support plate; the constant temperature circuit control board can collect the ambient temperature of the target circuit board in real time according to the temperature collection module, control the cooling fan and the heating module to start and stop, and control the forward or reverse rotation of the motor to drive the second support plate to approach or move away from the target circuit board.
2. A circuit board constant temperature device according to claim 1, characterized in that: Also included are radiant panels; The constant temperature circuit control board, the motor, and the cooling fan are all arranged on the top surface of the second supporting plate; The radiation plate is disposed on the bottom surface of the second supporting plate, and the radiation plate is opposite to the target circuit board; The second support plate and the radiation plate are provided with coaxial through holes, and the fan provides heat dissipation airflow to the target circuit board through the through holes; The heating module is disposed on the radiation plate, and the radiation plate is used to radiate heat generated by the heating module to the target circuit board.
3. A circuit board constant temperature device according to claim 2, characterized in that: Also includes ranging module; The distance measuring module is arranged on the radiation board and is used to measure the distance between the radiation board and the target circuit board; The constant temperature circuit control board can control the radiation board to approach or move away from the target circuit board by a set distance through the distance measurement module.
4. A circuit board constant temperature device according to claim 3, characterized in that: Also includes telescoping pole; One end of the telescopic rod is connected to the first support plate, and the other end is connected to the output shaft of the motor through a transmission mechanism; The motor can control the extension or contraction of the telescopic rod through a transmission mechanism, so that the radiation plate is close to or away from the target circuit board.
5. A circuit board constant temperature device according to claim 4, characterized in that: The heating module comprises a first heating module, a second heating module and a third heating module, the heating powers of which increase in sequence.
6. A circuit board constant temperature device according to claim 5, characterized in that: The heating module is a power resistor.
7. A circuit board constant temperature device according to claim 1ψ6, characterized in that: The first support plate and the second support plate are both made of non-metallic materials.
8. A circuit board constant temperature device according to any one of claims 3 and 6, characterized in that: The radiation plate is a copper plate; The distance measuring module is an infrared distance measuring module.
9. A circuit board constant temperature method, characterized in that: A circuit board constant temperature device according to claim 6, comprising: When the temperature of the target circuit board is lower than the set working temperature, the constant temperature circuit control board controls the heating module to start heating, turns off the cooling fan, and controls the motor to rotate forward, so that the radiation plate moves a set distance toward the target circuit board; When the temperature of the target circuit board is higher than the set operating temperature, the constant temperature circuit control board controls the cooling fan to dissipate heat, turns off the heating module, and controls the motor to reverse, so that the radiation plate moves a set distance away from the target circuit board.
10. A circuit board constant temperature method according to claim 9, characterized in that: include: When the temperature of the target circuit board is less than -20°C, the first heating module, the second heating module and the third heating module all start heating, the cooling fan is turned off, and the motor rotates forward, so that the radiation plate moves a set distance toward the target circuit board; When the temperature of the target circuit board is greater than -20°C and less than 0°C, the first heating module and the second heating module start heating, the third heating module and the cooling fan are both turned off, and the motor rotates forward to move the radiation plate toward the target circuit board by a set distance; When the temperature of the target circuit board is greater than 0°C and less than 20°C, the first heating module starts heating, the second heating module, the third heating module and the cooling fan are all turned off, and the motor is reversed to move the radiation plate away from the target circuit board by a set distance; When the temperature of the target circuit board is greater than 20° C. and less than 30° C., the first heating module, the second heating module, the third heating module and the cooling fan are all turned off, and the motor is reversed to move the radiation plate away from the target circuit board by a set distance; When the temperature of the target circuit board is greater than 30° C., the first heating module, the second heating module, and the third heating module are turned off, the cooling fan is started to dissipate heat, and the motor rotates forward to move the radiation plate toward the target circuit board by a set distance.
