Liquid cooling vapor chamber heat dissipation module

Abstract

The invention discloses a liquid cooling vapor chamber heat dissipation module which comprises a liquid cooling cover, a metal upper cover plate and a metal lower cover plate. The liquid cooling cover is provided with a top, a side wall and a containing space, and the side wall is provided with a liquid inlet and a liquid outlet. The heat dissipation outer surface of the metal upper cover plate is provided with a plurality of columnar heat dissipation structures. The evaporation inner surface of the metal lower cover plate is provided with a plurality of lower grooves arranged in parallel and a plurality of supporting structures protruding among the lower grooves. The metal upper cover plate and the metal lower cover plate are connected to form an integrated vapor chamber, the liquid cooling cover is connected to the heat dissipation outer surface of the metal upper cover plate, and the columnar heat dissipation structures are arranged in the containing space, so that cooling liquid enters the containing space from the liquid inlet, flows through the columnar heat dissipation structures and flows out from the liquid outlet.

Description

Technical Field

[0001] The invention relates to a vapor chamber heat dissipation module, in particular to a liquid cooling vapor chamber heat dissipation module. Background Art

[0002] The explosive development of Generative Artificial Intelligence (Generative AI) or AI Generated Content (AIGC) has greatly increased the demand for the development of high-speed computing power and high-end computing chip modules. The huge amount of data and processing speed that AIGC applications need to process continue to drive the demand for high-end AI servers. High-end AI servers use a large number of central processing units (CPUs) and graphics processing units (GPUs) at the same time, and in order to meet the high-speed and large-scale computing requirements of generative artificial intelligence (for example: ChatGPT), the number of transistors contained in the high-end chips used has reached 175 billion. Corresponding to the high efficiency and high power consumption of AI server chips, the accompanying large and high-density heat sources have become a major challenge to heat dissipation capabilities. For example, in 2018, the power consumption of server processors was only about 180W to 280W, but it is currently estimated that it will double to more than 500W after 2023. For example, the 5nm Genoa processor from AMD and the A100 chip from GPU giant NVIDIA in 2022 consume 400W of power, which is about 40% to 50% higher than the previous generation of processors. In 2023, the Bergamo processor will consume more than 500W of power; NVIDIA's new generation of high-end GPU H100 chip, designed specifically for AI servers, has a maximum power of 700W. As more and more chips are used in servers, the power consumption is further increased, and the module design complexity of the cooling solution is also increased.

[0003] With the upgrade of the new generation of GPUs and CPUs, server computing, AI image generation and e-sports applications will become the main growth drivers of the cooling industry. From the perspective of server cooling technology, it is mainly divided into air cooling, liquid cooling and immersion cooling. At present, general mid-range computing servers mainly use air cooling.

[0004] ChatGPT or higher-end AI servers must have a cooling capacity of at least 700W to cope with the ever-increasing computing power. For example, NVIDIA A100 or H100 AI servers are usually equipped with 4 to 8 GPUs, and each GPU will generate an additional 300W to 700W of heat energy. It is estimated that the thermal power consumption of the entire AI server will exceed 3000W. In view of the fact that traditional air cooling cannot provide such efficient cooling capacity, the industry currently uses traditional single-phase immersion cooling technology to solve the cooling problem of high-density heat-generating server parts, but there is still an upper limit of 600W.

[0005] In order to solve the heat dissipation problems of high-speed computing components, such as high heat consumption, insufficient heat dissipation capacity, and excessive wattage, the introduction of "liquid cooling" technology has become a new trend in heat dissipation. Liquid cooling introduces a liquid cooling system into the server, and uses the property that liquid is more easily conductive than gas to quickly transfer the high-density heat energy generated by the heating element to the cooling liquid through the liquid cooling host. The cooling liquid after absorbing heat is then guided to the outdoor cooling tower or heat dissipation module to further dissipate the heat energy into the atmosphere, achieving the effect of rapid cooling and reducing energy consumption.

[0006] Common liquid cooling heat dissipation modules usually cover the heat dissipation structure of the radiator with a liquid cooling cover, and use screws to lock the liquid cooling cover and the radiator together to form a cavity. The liquid cooling cover has a liquid inlet and a liquid outlet. The cooling liquid can enter the cavity formed by the liquid cooling cover and the radiator from the liquid inlet, flow through the heat dissipation structure, and then flow out from the liquid outlet, and then flow to the external heat dissipation system through the pipeline to dissipate the heat carried by the cooling liquid. Through the continuous and rapid circulation of the above-mentioned cooling liquid, a large amount of heat generated by the heating element is quickly taken away to achieve a rapid heat dissipation effect. However, when the metal base plate of the radiator contacts the heating element, the large amount of heat quickly generated by the heating element cannot be efficiently transversely conducted to the metal base plate of the entire radiator because the lateral heat conduction speed of the metal base plate is limited by the cross-sectional area, causing a large amount of heat to accumulate in the local area where the radiator and the heating element are in contact. Even with liquid cooling, the heat dissipation capacity that can be improved is very limited.

[0007] In view of the above problems, the present invention replaces the metal base plate of the above-mentioned radiator with a copper heat spreader, and integrates the heat dissipation structure of the radiator with the heat dissipation surface of the heat spreader in an integrated manner. When the heating element attached to the heat absorption surface of the heat spreader generates a large amount of heat source, the heat will be quickly transferred to the heat spreader. At this time, the working fluid in the internal space of the heat spreader will quickly absorb the heat and quickly vaporize to form steam. Because the heat dissipation surface of the heat spreader is connected to the radiator, when the steam rises rapidly and contacts the colder metal surface connected to the radiator, the steam will recondense into a working fluid, and quickly absorb and release a large amount of heat through this liquid-gas-liquid phase change cycle. Compared with the traditional use of a copper base plate, the heat spreader can more quickly diffuse a large amount of concentrated heat source to a larger area of ​​the radiator, so as to obtain a larger effective heat dissipation area and faster heat dissipation.

[0008] The vapor chamber uses the phase change of the working fluid in its closed working chamber to quickly dissipate heat. It is the most efficient heat dissipation method at present. It uses the large amount of latent heat of vaporization involved in the rapid vaporization and condensation process of the working fluid in the near-vacuum chamber to achieve the purpose of rapid heat dissipation. The thermal conductivity of the vapor chamber can reach 10000W / (m 2 ·℃) or above, which is dozens of times higher than the thermal conductivity of traditional air convection or liquid convection. When the above-mentioned heat sink is integrated into the heat dissipation surface of the heat spreader in an integrated manner, a large amount of heat from the inside of the heat spreader can be more quickly and effectively conducted and dispersed to the heat dissipation structure, greatly improving the heat dissipation efficiency.

[0009] However, even so, since the above-mentioned AI servers are equipped with more chip modules with higher energy consumption, and these AI servers are often arranged in a computer room with a high density, the temperature of the surrounding environment is often high, which will easily lead to the air cooling method being unable to effectively dissipate a large amount of heat from the radiator, making the heat dissipation efficiency of the heat dissipation module insufficient to meet the demand. Summary of the invention

[0010] In view of the above problems, an object of the present invention is to provide a liquid-cooled vapor chamber heat dissipation module, which is a high-efficiency liquid-cooled vapor chamber heat dissipation module composed of a liquid-cooling cover and an integrated vapor chamber.

[0011] In order to achieve the above-mentioned purpose, the present invention provides a liquid-cooled heat spreader heat dissipation module, including: a liquid cooling cover, an integrated heat spreader. The liquid cooling cover includes a top and a side wall connected to the top, the side wall surrounds the top to form a accommodating space, and the side wall is provided with at least one liquid inlet and at least one liquid outlet, and the liquid inlet and the liquid outlet are connected to the accommodating space. The integrated heat spreader includes: a metal upper cover plate, a metal lower cover plate, a working space, an exhaust channel, a capillary structure and a working fluid. The metal upper cover plate includes a heat dissipation outer surface and a condensation inner surface. The heat dissipation outer surface has a plurality of columnar heat dissipation structures. An upper frame of appropriate height is provided around the condensation inner surface, and an upper channel groove is provided on the upper frame. The condensation inner surface also has a plurality of upper grooves arranged parallel to each other. The metal lower cover plate includes a heat-absorbing outer surface and an evaporation inner surface. The heat-absorbing outer surface is used to contact the heat-releasing electronic component. The evaporation inner surface is provided with a lower frame of appropriate height around it, and a lower channel groove is provided on the lower frame. The evaporation inner surface has a plurality of lower grooves arranged in parallel with each other and a plurality of supporting structures protruding between the lower grooves. Among them, the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate are mutually engaged to form a working space, and the condensation inner surface of the metal upper cover plate and the evaporation inner surface of the metal lower cover plate are opposite to each other, and the arrangement of the upper grooves and the lower grooves can be mapped and overlapped with each other. The plurality of supporting structures extend from the evaporation inner surface and abut between the upper grooves of the condensation inner surface to support the working space. The exhaust channel is formed by the corresponding engagement of the upper channel groove and the lower channel groove, and can be used to exhaust the working space. The capillary structure is arranged in the lower groove or in the upper groove and the lower groove. The working fluid exists in the working space and the capillary structure. The metal upper cover plate as a whole includes the columnar heat dissipation structure which is integrally formed from a metal sheet, and the metal lower cover plate as a whole includes the support structure which is integrally formed from a metal sheet. In addition, the liquid cooling cover is connected to the heat dissipation outer surface of the metal upper cover plate, and the columnar heat dissipation structure is arranged in the accommodation space, so that a cooling liquid enters the accommodation space from the liquid inlet, flows through the columnar heat dissipation structure and flows out from the liquid outlet.

[0012] According to an embodiment of the present invention, a liquid-cooled vapor chamber heat dissipation module is proposed, in which a liquid-cooling cover is joined to the heat dissipation outer surface of a metal upper cover plate, and a columnar heat dissipation structure is arranged in the accommodation space, so that the accommodation space forms a closed liquid-cooling chamber, so that the cooling liquid can enter the accommodation space from the liquid inlet, and flow through the columnar heat dissipation structure for accelerated cooling, and then flow out from the liquid outlet, and guide the cooling liquid after absorbing heat to the external heat dissipation system through an external pipeline, so that the heat dissipates, the cooling liquid is cooled down, and then recirculated. The liquid-cooled vapor chamber heat dissipation module of the present invention is formed by combining a liquid-cooling cover with an integrated vapor chamber (formed by joining a metal upper cover plate and a metal lower cover plate), so that liquid cooling heat dissipation of the cooling liquid circulation can be utilized to provide a more efficient heat dissipation solution, and liquid cooling heat dissipation can improve the problem of poor air-cooling heat dissipation efficiency of high-end servers and large server rooms. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The figure is a schematic structural diagram of a liquid-cooled vapor chamber heat dissipation module according to an embodiment of the present invention.

[0014] Figure 2 It is a schematic side cross-sectional structure diagram of a liquid-cooled vapor chamber heat dissipation module according to an embodiment of the present invention.

[0015] Figure 3 The figure is a schematic diagram of the metal upper cover structure of a liquid-cooled heat spreader heat dissipation module according to an embodiment of the present invention.

[0016] Figure 4 The figure is a schematic diagram of the metal lower cover structure of a liquid-cooled heat spreader heat dissipation module according to an embodiment of the present invention.

[0017] Figure 5 It is a schematic diagram of the structure of a liquid cooling cover of a liquid cooling vapor chamber heat dissipation module according to another embodiment of the present invention.

[0018] Figure 6 The figure is a schematic diagram of the structure of a liquid cooling cover of a liquid cooling vapor chamber heat dissipation module according to another embodiment of the present invention.

[0019] Figure 7 The figure is a schematic diagram of the structure of a liquid cooling cover of a liquid cooling vapor chamber heat dissipation module according to another embodiment of the present invention.

[0020] Explanation of the accompanying drawings: 10-liquid cooling heat spreader module; 100-metal upper cover; 110-heat dissipation outer surface; 111-columnar heat dissipation structure; 120-condensation inner surface; 121-upper groove; 122-upper frame; 123-upper channel groove; 200-metal lower cover; 210-heat absorption outer surface; 211-working space; 220-evaporation inner surface; 221-lower groove; 222-lower frame; 223-lower channel groove; 224-support structure; 300, 310, 320, 330-liquid cooling cover; 301-top; 302-side wall; 303-accommodation space; 304-liquid inlet; 305-liquid outlet; 3201, 3301-guide plate; 400-exhaust channel; 500-capillary structure; 1010-welding groove. DETAILED DESCRIPTION

[0021] The following will refer to the relevant drawings to illustrate the embodiments of the liquid cooling vapor chamber heat dissipation module of the present invention. For the sake of clarity and convenience of the illustration, the components in the drawings may be exaggerated or reduced in size and proportion. In the following description and / or claims, the technical terms used should be interpreted in the sense commonly used by ordinary technicians with common knowledge in the technical field. For ease of understanding, the same elements in the following embodiments are illustrated with the same symbols. As described in this specification, the word "about" generally refers to the actual value within plus or minus 10%, 5%, 1% or 0.5% of a specific value or range. The word "about" in this article means that the actual value falls within the acceptable standard error of the mean value, depending on the consideration of ordinary technicians with common knowledge in the technical field to which the present invention belongs. Except for the embodiments, or unless otherwise explicitly stated, it should be understood that the ranges, quantities, values ​​and percentages used herein are all modified by "about". Therefore, unless otherwise stated, the values ​​or parameters disclosed in this specification and claims are approximate values ​​and can be changed as needed.

[0022] See also Figures 1 to 4 , Figure 1 Schematic diagram of a liquid cooling vapor chamber heat dissipation module structure 10 according to an embodiment of the present invention. Figure 2 for Figure 1 Schematic diagram of the side cross-sectional structure. Figure 3 This is a schematic diagram of the structure of a metal upper cover plate 100 of a liquid-cooled heat sink module according to an embodiment of the present invention. Figure 4 This is a schematic diagram of the structure of the metal lower cover plate 200 of the liquid cooling heat sink module according to an embodiment of the present invention. Figure 1 and Figure 2 As shown in the figure, the liquid cooling heat sink module 10 of the present invention includes: a liquid cooling cover 300, a metal upper cover plate 100 and a metal lower cover plate 200. The liquid cooling cover 300 includes: a top 301 and a side wall 302 connected to the top, the side wall 302 surrounds the top 301 to form an accommodating space 303, and the side wall 302 is provided with at least one liquid inlet 304 and at least one liquid outlet 305, and the liquid inlet 304 and the liquid outlet 305 are connected to the accommodating space 303. The metal upper cover plate 100 (see Figures 1 to 3 ), including: a heat dissipation outer surface 110 and a condensation inner surface 120, the heat dissipation outer surface 110 has a plurality of columnar heat dissipation structures 111, and the condensation inner surface 120 is provided with an upper frame 122 of appropriate height around the periphery, and an upper channel groove 123 is provided on the upper frame, and the condensation inner surface 120 also has a plurality of upper grooves 121 arranged in parallel with each other, wherein the metal upper cover plate 100 as a whole including the columnar heat dissipation structure 111 is manufactured by integrally forming a metal sheet. The metal lower cover plate 200 (please refer to Figure 1 , Figure 2 and Figure 4), including: a heat-absorbing outer surface 210 and an evaporation inner surface 220, the heat-absorbing outer surface 210 is used to contact a heat-releasing electronic component, and a lower frame 222 of appropriate height is arranged around the evaporation inner surface 220, and a lower channel groove 223 is arranged on the lower frame 222, and the evaporation inner surface 220 has a plurality of lower grooves 221 arranged in parallel with each other and a plurality of support structures 224 protruding between the lower grooves 221, wherein the metal lower cover plate 200 as a whole including the support structure 224 is made of a metal sheet in one piece; wherein the upper frame 122 of the metal upper cover plate 100 and the lower frame 222 of the metal lower cover plate 200 are mutually joined to form a working space 211; and the metal The condensation inner surface 120 of the metal upper cover plate 100 and the evaporation inner surface 220 of the metal lower cover plate 200 are opposite to each other, and the arrangement of the upper groove 121 and the lower groove 221 can be aligned with each other in an overlapping manner. A plurality of support structures 224 protrude from the evaporation inner surface 220 and abut between the upper grooves 121 of the condensation inner surface 120 to support the working space 211; the exhaust channel 400 is composed of the corresponding connection between the upper channel groove 123 and the lower channel groove 223 to exhaust the working space 211; the capillary structure 500 is arranged in the lower groove 221 or in the upper groove 121 and the lower groove 221; the working fluid exists in the working space 211 and the capillary structure 500. The liquid cooling cover 300 is connected to the heat dissipation outer surface 110 of the metal upper cover plate 100 , and the columnar heat dissipation structure 111 is disposed in the accommodating space 303 , so that the cooling liquid enters the accommodating space 303 from the liquid inlet 304 and flows out from the liquid outlet 305 through the columnar heat dissipation structure 111 .

[0023] It should be understood that after the metal upper cover plate 100 and the metal lower cover plate 200 are joined, a vapor chamber is formed, wherein the vapor chamber is an integrated vapor chamber that integrates the columnar heat dissipation structure 111 and the metal upper cover plate 100 into one body.

[0024] In one embodiment, the upper frame 122 and the lower frame 222 of the liquid-cooled vapor chamber heat dissipation module 10 of the present invention further have a welding groove 1010 for welding and joining the metal upper cover plate 100 and the metal lower cover plate 200 .

[0025] See also Figure 2 and Figure 3In one embodiment, the shape and columnar heat dissipation structure 111 included in the metal upper cover plate 100 of the liquid-cooled heat-spreading heat dissipation module 10 of the present invention are directly formed by integrally forming the same metal sheet (or metal block) rather than being externally connected. In other words, the metal upper cover plate 100 as a whole is integrally formed by a metal sheet (or metal block) to form the shape and structural features. Further explanation: the plurality of columnar heat dissipation structures 111 on the heat dissipation outer surface 110 of the metal upper cover plate 100 of the liquid-cooled heat-spreading heat dissipation module 10 of this embodiment are directly formed on the heat dissipation outer surface 110, and are inseparable from the heat dissipation outer surface 110 of the metal upper cover plate 100, and there is no heterogeneous or homogeneous interface. It is not like the common prior art that the radiator is adhered to the heat dissipation surface of the heat-spreading plate with heat dissipation paste, nor is the heat dissipation structure formed on the heat dissipation surface of the heat-spreading plate by welding or sintering. In other words, the heat dissipation structure 111 is directly formed on the heat dissipation outer surface 110 of the metal upper cover plate 100 of the vapor chamber, thereby eliminating the heterogeneous interface between the heat sink and the vapor chamber and its thermal resistance, so as to improve the heat dissipation efficiency.

[0026] See also Figure 2 and Figure 4 In one embodiment, the shape and structural features of the metal lower cover plate 200 of the liquid-cooled heat sink module 10 of the present invention are directly made of the same metal sheet (or metal block) as a whole. In other words, the plurality of support structures 224 on the evaporation inner surface 220 of the metal lower cover plate 200 of the liquid-cooled heat sink module 10 of this embodiment are directly formed on the evaporation inner surface 220, and are made of the same metal as the evaporation inner surface 220 of the metal lower cover plate 200 and cannot be separated, and there is no heterogeneous or homogeneous interface, unlike the common prior art that sinters the support structures 224 to the evaporation inner surface 220 by sintering.

[0027] Generally speaking, the method for making the one-piece metal upper cover plate 100 and the metal lower cover plate 200 of the liquid-cooled heat sink heat dissipation module 10 of the present invention as described above can adopt an etching process or a composite processing process (for example: integrating a milling machine and a stamping or extrusion process). The advantage of the etching process is that it can etch out more complex structures, which are generally used for products that are not easy to make with traditional processing processes. The advantage of the composite processing process is that most of the manufacturing methods used are mature and can be produced without much development. However, the etching process is time-consuming, and there will be problems with uneven processing surfaces and the need for secondary processing, while the composite processing process requires more steps and time for production.

[0028] In one embodiment, the integrated heat dissipation module structure 10 of the present invention is a cold forging method to produce the shape and structure of the metal upper cover plate 100 and the metal lower cover plate 200, which can be modified in conjunction with a CNC process. The difference from the etching process or the composite processing process is that the cold forging method is to place the metal sheet (or metal block) to be processed in a female mold, and then continuously forge the metal sheet with a male mold at room temperature to form it. A general technician with common knowledge in this technical field should understand that the cold forging method does not require the metal to be pre-heated, softened and annealed during the forging process as in a general stamping process, so the internal grain structure of the forged metal will not cause holes or tissue hypertrophy due to annealing, thereby reducing the thermal conductivity coefficient. After the cold forging process, the metal has not undergone a heating process, so its internal grain structure can still maintain a fairly dense structure and can reduce internal defects such as pores. The metal surface after forging is smoother, and has the advantages of improved rigidity and density and is not easy to deform. According to tests, the thermal conductivity and thermal diffusion coefficient of the metal after forging are higher than those before forging. That is, in this embodiment, the heat dissipation efficiency of the integrated heat dissipation module structure of the present invention is higher than that of the general traditional process.

[0029] In one embodiment, the metal upper cover plate 100 of the liquid-cooled heat spreader heat dissipation module 10 of the present invention is manufactured by cold forging, wherein the shape and structural features included in the metal upper cover plate 100 are directly formed on the same metal sheet by cold forging, including a plurality of columnar heat dissipation structures 111 on the heat dissipation outer surface 110 of the metal upper cover plate 100.

[0030] In one embodiment, the metal lower cover plate 200 of the liquid-cooled heat sink module 10 of the present invention is made by cold forging, wherein the shape and structural features of the metal lower cover plate 200 are directly formed on the same metal sheet by cold forging, including a plurality of raised support structures 224 on the evaporation inner surface 220 of the metal lower cover plate 200, that is, like the metal upper cover plate 100, the plurality of raised support structures 224 on the evaporation inner surface 220 of the metal lower cover plate 200 are not generated by external connection or by known sintering methods, but are forged integrally with the metal lower cover plate 200. In one embodiment, the plurality of raised support structures 224 are columnar structures.

[0031] In any embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the liquid cooling vapor chamber heat dissipation module 10 of the present invention are formed by cold forging a metal sheet with high thermal conductivity and thermal diffusion coefficient (e.g., pure copper) to form the above structure. In one embodiment, the metal sheet is pure copper.

[0032] A person skilled in the art with common knowledge in the art should be able to understand that in the above-mentioned embodiment, when pure copper is used as the material and the metal upper cover plate 100 and the metal lower cover plate 200 are manufactured by cold forging, since the pure copper material is formed by continuous forging in the mold at room temperature, the physical properties of the obtained metal upper cover plate 100 and the metal lower cover plate 200, such as Vickers hardness, thermal conductivity and thermal diffusion coefficient, will be higher than the pure copper material without cold forging, and will also be higher than the metal upper cover plate 100 and the metal lower cover plate 200 manufactured by other manufacturing methods (such as etching, stamping, extrusion or general forging processes). In other words, when the pure copper material is cold forged, it will have higher physical properties such as Vickers hardness, thermal conductivity and thermal diffusion coefficient, and these physical properties will be different from the material properties obtained by other processing methods.

[0033] For example, in another embodiment of the present invention, the metal upper cover plate and the metal lower cover plate of the heat spreader are made by cold forging, and the material properties after cold forging are commissioned to a third-party measurement unit (Yuanhe Company; YUANHE) to measure physical properties such as Vickers hardness, thermal conductivity and thermal diffusion coefficient, and the obtained values ​​are compared with the material properties after the traditional composite processing process (combined with traditional stamping and CNC processes), as shown in the following table (I). A general technician with common knowledge in this field should understand that the cold forging method will give the material higher physical properties such as Vickers hardness, thermal conductivity and thermal diffusion coefficient due to the characteristics of its process. It should be understood that the degree of improvement of these physical properties is related to the number of forging times and force that the material needs to undergo during the cold forging process. The more the number of forging times and the greater the force, the higher the above values ​​will be. Therefore, after cold forging, the above values ​​will be better than those of unprocessed or generally traditionally processed materials, and have more significant advantages compared with traditional composite processing methods.

[0034] Table (I):

[0035] Cold forging method Traditional composite processing Vickers hardness (HV) 115～117 85～87 Thermal conductivity (W / m·K) Approx. 430 Approx. 395 <![CDATA[Thermal diffusivity (mm 2 / sec)]]> 115～117 85～87

[0036] In one embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of pure copper with high thermal conductivity and thermal diffusion coefficient, and the metal upper cover plate 100 and the metal lower cover plate 200 manufactured after cold forging have a Vickers hardness of not less than 90HV, 95HV, 100HV or 105HV.

[0037] In another embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the liquid-cooled heat spreader heat dissipation module 10 of the present invention are made of pure copper with high thermal conductivity and thermal diffusion coefficient, and the metal upper cover plate 100 and the metal lower cover plate 200 manufactured after cold forging have a thermal conductivity of not less than 400W / (m·K), 405W / (m·K), 408W / (m·K) or 410W / (m·K).

[0038] In another embodiment, the metal upper cover plate 100 and the metal lower cover plate 200 of the integrated heat dissipation module structure 10 of the present invention are made of pure copper with high thermal conductivity and thermal diffusion coefficient, and the metal upper cover plate 100 and the metal lower cover plate 200 manufactured by cold forging have a thermal diffusion coefficient of not less than 90 mm 2 / sec、95mm 2 / sec、100mm 2 / sec or 105mm 2 / sec.

[0039] In any of the above embodiments, in the liquid-cooled vapor chamber heat dissipation module 10, the metal upper cover plate 100 and the metal lower cover plate 200 are joined to each other and then combined by welding.

[0040] In any of the above embodiments, the working fluid used in the integrated heat dissipation module structure 10 of the present invention is pure water.

[0041] In any of the above embodiments, the working space 211 of the integrated heat dissipation module structure 10 of the present invention is evacuated and sealed through the evacuation channel 400, and the air pressure is less than 1x10 -3 torr, 1x10 -4 torr or 1x10- 5 It should be understood that the sealing after the above-mentioned evacuation is a common existing technology and is not limited here. For example, after the working space 211 is evacuated to a set pressure through a metal evacuation pipe, the evacuation pipe can be pressed, sintered or welded to seal with a jig.

[0042] See also Figure 1 In one embodiment, the liquid-cooled heat sink module 10 of the present invention, wherein the liquid-cooling cover 300 has at least one liquid inlet 304 and at least one liquid outlet 305, and the liquid inlet 304 and the liquid outlet 305 are arranged on different sides of the side wall. As shown in the figure, in this embodiment, the liquid inlet 304 and the liquid outlet 305 are arranged on opposite sides of the side wall 302.

[0043] See also Figure 5, which is another embodiment of the liquid-cooled heat sink module 10 of the present invention, wherein the liquid cooling cover 310 has at least one liquid inlet 304 and at least one liquid outlet 305, and the liquid inlet 304 and the liquid outlet 305 are arranged on the same side of the side wall 302 of the liquid cooling cover 310.

[0044] It should be understood that, in order to match the arrangement or stacking of server machines, the liquid cooling cover 300 or 310 described in the liquid cooling vapor chamber heat dissipation module 10 of the present invention has at least one liquid inlet 304 and at least one liquid outlet 305, and the liquid inlet 304 and the liquid outlet 305 can be arranged on the same side or different sides of the side wall 302 according to customer needs. In another embodiment, in order to accelerate the flow of cooling liquid and improve cooling efficiency, the number of liquid inlets 304 is 2 or more, and the number of liquid outlets 305 is also 2 or more, the number of liquid inlets 304 and the number of liquid outlets 305 can be equal or unequal, and the liquid inlets 304 and the liquid outlets 305 can be arranged on the side wall 302 in a manner of partially on the same side and partially on different sides, which is not limited here.

[0045] In order to further improve the heat dissipation efficiency of the liquid-cooled heat spreader module 10 of the present invention, the present invention proposes another embodiment of the liquid cooling cover 320 and 330, wherein the accommodating space 303 is further provided with at least one guide plate, so that the cooling liquid can be quickly and evenly guided to between the plurality of columnar heat dissipation structures 111 after entering the accommodating space 303 from the liquid inlet 304, and quickly take away the heat distributed on the surface of the columnar heat dissipation structure, and then quickly flow out from the liquid outlet 305 to the external heat dissipation system, so as to avoid the cooling liquid from forming turbulence or uneven temperature in the accommodating space, thereby further improving the heat dissipation efficiency. Please refer to Figure 6 In one embodiment, the liquid cooling cover 320 described in the liquid cooling vapor chamber heat dissipation module 10 of the present invention, wherein the liquid inlet 304 and the liquid outlet 305 are respectively arranged on opposite sides of the side wall 302, and a pair of guide plates 3201 are respectively arranged at the liquid inlet 304 and the liquid outlet 305 in the accommodating space 303, wherein the pair of guide plates 3201 extend to both sides with the liquid inlet 304 and the liquid outlet 305 as the center, forming a V-shaped arrangement. It should be understood that in the case where the guide plates 3201 are not provided, when the density of the columnar heat dissipation structures 111 is high and concentrated in the middle area of ​​the heat dissipation outer surface 110, after the cooling liquid enters the accommodating space 303 from the liquid inlet 304, its flow will be hindered by the columnar heat dissipation structure and flow to both sides, so that the cooling liquid between the columnar heat dissipation structures 111 will flow slowly, resulting in the cooling liquid in the middle area having a high temperature and cannot be quickly taken away, and the high efficiency of liquid cooling heat dissipation cannot be exerted. Therefore, by providing a pair of guide plates 3201 at the liquid inlet 304 and the liquid outlet 305, the cooling liquid is guided from the liquid inlet 304 to the columnar heat dissipation structure 111 to improve the heat dissipation efficiency. Figure 7In another embodiment, when the liquid inlet 304 and the liquid outlet 305 are arranged on the same side of the side wall 302 of the liquid cooling cover 330, a guide plate 3301 can be set between the liquid inlet 304 and the liquid outlet 305 to ensure that the cooling liquid can flow quickly and evenly through the columnar heat dissipation structure 111, quickly take away the heat, and smoothly flow out from the liquid outlet 305 to the external heat dissipation system.

[0046] It should be understood that the liquid cooling covers 300, 310, 320 and 330 provided in any of the above embodiments are exemplary illustrations and are not intended to limit the scope of the liquid cooling vapor chamber heat dissipation module 10 of the present invention. A person skilled in the art with ordinary knowledge in the technical field of the present invention should be able to set different numbers, positions, sizes and shapes of guide plates according to actual application conditions after referring to the embodiments of the present invention to improve the flow pattern of the cooling liquid, so that the flow of the cooling liquid can be smoother and the heat dissipation efficiency can be improved.

[0047] In any of the above embodiments, in the liquid-cooled vapor chamber heat dissipation module 10 of the present invention, the liquid covers 300 , 310 , 320 and 330 are joined to the heat dissipation outer surface 110 of the metal upper cover plate 100 by welding.

[0048] The above embodiments are only used for illustration and are not intended to limit the scope of the present invention. Any equivalent modifications or changes made to the liquid-cooled vapor chamber heat dissipation module according to the above embodiments should still be included in the protection scope of the present invention.

[0049] It is worth mentioning that most of the existing heat dissipation modules use external radiators. Such a combination will add a thermal resistance of the heat conduction interface in front of the radiator, thereby reducing the heat dissipation efficiency. The liquid-cooled heat spreader heat dissipation module of the present invention, in addition to integrating the upper cover plate of the heat spreader with the radiator into an integral molding, allows the ultra-high heat dissipation efficiency of the heat spreader to no longer be limited by the thermal resistance of the conduction interface, and further introduces a liquid cooling cover, so that the original ultra-high heat dissipation efficiency of the heat spreader can be matched with more efficient liquid cooling, which can further improve the heat dissipation efficiency. In addition, the setting of large server rooms and high-density high-end chip modules often causes the peripheral air temperature to be too high, resulting in low air-cooled heat dissipation efficiency. The liquid-cooled heat spreader heat dissipation module of the present invention introduces liquid cooling, and the heat dissipation efficiency is not affected by the peripheral air temperature of the room or the machine. At the same time, the setting of the liquid inlet and outlet can also be changed in position and quantity as the machine or chip module is stacked, making the overall heat dissipation solution more systematic and more efficient. Furthermore, the metal upper cover plate and the metal lower cover plate of the liquid-cooled heat spreader heat dissipation module of the present invention can be manufactured by an etching process or a composite processing process (for example, casting, forging, milling machine, stamping or extrusion processes), or by a cold forging method, so that the grain structure of the material is finer and the internal pore defects are reduced. The material can thus obtain excellent mechanical properties such as higher strength, deformation resistance and fatigue resistance, and can improve the thermal conductivity and heat diffusion efficiency of the material. The manufactured liquid-cooled heat spreader heat dissipation module will also be superior to general heat dissipation modules with similar structures in terms of heat dissipation efficiency, durability and reliability.

[0050] It can be seen that the present invention has indeed achieved the desired improved effect by breaking through the existing technology, and it is also not easy for those familiar with the art to think of.

[0051] The above description is for illustrative purposes only and is not intended to be limiting. Any other equivalent modifications or changes made thereto without departing from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A liquid-cooled heat sink module, characterized in that: include: A liquid cooling cover, comprising a top and a side wall connected to the top, the side wall surrounds the top to form a containing space, and the side wall is provided with at least one liquid inlet and at least one liquid outlet, the liquid inlet and the liquid outlet are connected to the containing space; A metal upper cover plate, including a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface has a plurality of columnar heat dissipation structures, and an upper frame of appropriate height is arranged around the condensation inner surface, an upper channel groove is arranged on the upper frame, and the condensation inner surface has a plurality of upper grooves arranged parallel to each other, wherein the metal upper cover plate as a whole including the plurality of columnar heat dissipation structures is integrally formed by a metal sheet; A metal lower cover plate, comprising a heat-absorbing outer surface and an evaporation inner surface, the heat-absorbing outer surface is used to contact a heat-releasing electronic component, a lower frame of appropriate height is arranged around the evaporation inner surface, a lower channel groove is arranged on the lower frame, and the evaporation inner surface has a plurality of lower grooves arranged in parallel with each other and a plurality of supporting structures protruding between the plurality of lower grooves, wherein the metal lower cover plate as a whole including the plurality of supporting structures is integrally formed by a metal sheet, wherein the upper frame of the metal upper cover plate and the lower frame of the metal lower cover plate are mutually joined to form a working space; and the condensation inner surface of the metal upper cover plate and the evaporation inner surface of the metal lower cover plate are opposite to each other, the arrangement of the upper groove and the lower groove are mutually overlapped and aligned, and the plurality of supporting structures protrude from the evaporation inner surface and abut between the plurality of upper grooves of the condensation inner surface to support the working space; An exhaust channel, formed by the corresponding connection of the upper channel groove and the lower channel groove, for exhausting air from the working space; a capillary structure disposed in the plurality of lower grooves or in the plurality of upper grooves and the plurality of lower grooves; and A working fluid exists in the working space and the capillary structure; The liquid cooling cover is connected to the heat dissipation outer surface of the metal upper cover plate, and the plurality of columnar heat dissipation structures are arranged in the accommodating space so that a cooling liquid enters the accommodating space from the liquid inlet, flows through the plurality of columnar heat dissipation structures and flows out from the liquid outlet.

2. The liquid cooling vapor chamber heat dissipation module according to claim 1, characterized in that: The metal upper cover plate as a whole includes the plurality of columnar heat dissipation structures which are forged from a metal sheet in one piece by cold forging, and the metal lower cover plate as a whole includes the plurality of support structures which are forged from a metal sheet in one piece by cold forging.

3. The liquid cooling vapor chamber heat dissipation module according to claim 1, characterized in that: The metal sheet is pure copper.

4. The liquid-cooled heat sink module according to claim 2, characterized in that: The metal sheet is made of pure copper, and the metal upper cover plate and the metal lower cover plate have a Vickers hardness of not less than 90 HV.

5. The liquid cooling vapor chamber heat dissipation module according to claim 2, characterized in that: The metal sheet is made of pure copper, and the metal upper cover plate and the metal lower cover plate have a thermal conductivity of not less than 400 W / (m·K).

6. The liquid-cooled heat sink module according to claim 2, characterized in that: The metal sheet is made of pure copper, and the metal upper cover plate and the metal lower cover plate have a thermal diffusion coefficient of not less than 90 mm 2 / sec.

7. The liquid-cooled heat sink module according to claim 2, characterized in that: The plurality of supporting structures are columnar structures.

8. The liquid-cooled heat sink module according to claim 2, characterized in that: The metal upper cover plate is joined with the metal lower cover plate by welding.

9. The liquid-cooled vapor chamber heat dissipation module according to claim 2, characterized in that: The working fluid is pure water.

10. The liquid cooling vapor chamber heat dissipation module according to claim 2, characterized in that: The air pressure in this working space is less than 1x10 -3 torr.

11. The liquid cooling vapor chamber heat dissipation module according to claim 2, characterized in that: The liquid inlet and the liquid outlet are arranged on the same side or different sides of the side wall.

12. The liquid cooling vapor chamber heat dissipation module according to claim 2, characterized in that: The liquid inlet and the liquid outlet are male threaded joints protruding from the side wall or threaded holes penetrating the side wall.

13. The liquid cooling vapor chamber heat dissipation module according to claim 2, characterized in that: The accommodating space is provided with at least one guide plate.

14. The liquid cooling vapor chamber heat dissipation module according to claim 2, characterized in that: The liquid cooling cover is joined to the heat dissipation outer surface of the metal upper cover plate by welding.

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