Thermal stress simulation method and device, computer equipment and storage medium

Abstract

The invention relates to the technical field of stress analysis, and discloses a thermal stress simulation method and device, computer equipment and a storage medium, and the thermal stress simulation method comprises the steps: obtaining a structure model needing thermal stress simulation, and importing the structure model into a thermal stress simulation model according to a preset path; the first material information, the first constraint information and the first temperature information in the structure model are converted into a thermal stress simulation model; performing material assignment on the thermal stress simulation model according to the second material information; according to the second constraint information, adding a fixed constraint in a structure statics simulation module of the thermal stress simulation model; according to the second temperature information, adding a test temperature to a steady-state thermal simulation module of the thermal stress simulation model; and performing a simulation test according to the set test target. Therefore, the threshold of thermal stress simulation analysis can be reduced, and the effect of enabling personnel without a simulation foundation to perform thermal stress simulation is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of stress analysis, and in particular to a thermal stress simulation method, device, computer equipment and storage medium. Background Art

[0002] When the gas wall-mounted boiler is working, its cover plate structure has the problem of thermal deformation. However, the temperature of the cover plate structure of the gas wall-mounted boiler is relatively high, and it is difficult to obtain its deformation through actual measurement. Therefore, it is necessary to analyze its deformation through thermal stress simulation. At present, thermal stress simulation analysis has a certain technical threshold, which requires technicians to have both industry foundation and simulation experience, and also has high requirements for the operation of simulation software. Therefore, for enterprise technicians, the learning cycle is long and the entry difficulty is high, which affects the product development progress of structural designers. Summary of the invention

[0003] In view of this, the present invention provides a thermal stress simulation method, apparatus, computer equipment and storage medium to solve the problem that the current thermal stress simulation technology has a high threshold and affects the product development progress of structural designers.

[0004] In a first aspect, the present invention provides a thermal stress simulation method, comprising the following steps: obtaining a structural model that needs to be thermally stressed, wherein the structural model includes first material information, first constraint information and first temperature information; importing the structural model into the thermal stress simulation model according to a preset path, and converting the first material information, first constraint information and first temperature information in the structural model into the thermal stress simulation model to obtain second material information, second constraint information and second temperature information; wherein the thermal stress simulation model has a material database, and the material database includes a plurality of materials and performance parameters corresponding to each material; assigning materials to the thermal stress simulation model according to the second material information; adding fixed constraints to a structural statics simulation module of the thermal stress simulation model according to the second constraint information; adding a test temperature to a steady-state thermal simulation module of the thermal stress simulation model according to the second temperature information; and performing a simulation test according to the set test target.

[0005] The thermal stress simulation method provided by the present invention obtains a structural model that needs to be simulated for thermal stress, imports the structural model into the thermal stress simulation model according to a preset path, and converts the first material information, the first constraint information and the first temperature information in the structural model into the thermal stress simulation model; assigns materials to the thermal stress simulation model according to the second material information; adds fixed constraints to the structural statics simulation module of the thermal stress simulation model according to the second constraint information; adds a test temperature to the steady-state thermal simulation module of the thermal stress simulation model according to the second temperature information; and performs simulation testing according to the set test target. In this way, the threshold for thermal stress simulation analysis can be lowered, and the effect of allowing personnel without simulation foundation to perform thermal stress simulation can be achieved.

[0006] In an optional embodiment, before obtaining the structural model that needs to be subjected to thermal stress simulation, it also includes: removing some structural features in the structural model; naming the material of the structural model to obtain first material information; naming the area in the structural model where fixed constraints exist to obtain first constraint information; naming the temperature detection area in the structural model to obtain first temperature information.

[0007] Thereby, the thermal stress simulation model can identify the structural model and automatically complete the setting of the material, the fixed constraint and the temperature according to the first material information, the first constraint information and the first temperature information carried in the structural model.

[0008] In an optional embodiment, before the structural model is imported into the thermal stress simulation model according to a preset path, it also includes: sharing the simulation parameters in the steady-state thermal simulation module in the thermal stress simulation model with the structural statics simulation module in the thermal stress simulation model; wherein the simulation parameters include: engineering data, geometric structure, model structure and solution.

[0009] In this way, the steady-state thermal simulation module and the structural statics simulation module in the thermal stress simulation model can be linked to each other, and the thermal stress analysis can be automatically completed.

[0010] In an optional implementation, before the structural model is imported into the thermal stress simulation model according to a preset path, the method further includes: constructing a material database in the thermal stress simulation model, wherein the material data includes a plurality of materials and performance parameters corresponding to each material.

[0011] This allows the material assignment to be completed in the thermal stress simulation model.

[0012] In an optional embodiment, assigning material to the thermal stress simulation model according to the second material information includes: determining whether there is a material corresponding to the second material information in the material database; when there is a material corresponding to the second material information in the material database, assigning material to the thermal stress simulation model according to the material database.

[0013] This allows the material assignment to be completed in the thermal stress simulation model.

[0014] In an optional implementation, performing simulation testing according to the set test target includes: taking temperature distribution as the test target of the steady-state thermal simulation module, and taking stress and deformation as the test target of the structural statics simulation module for simulation.

[0015] That is to say, simulation can be automatically performed by setting test targets in the thermal stress simulation module.

[0016] In an optional implementation, before performing simulation testing according to the set test target, the method further includes: meshing the thermal stress simulation model.

[0017] This allows automatic simulation in the thermal stress simulation module.

[0018] In a second aspect, the present invention also provides a thermal stress simulation device, which includes an acquisition module, an import module, a first processing module, a second processing module, a third processing module and a simulation module; the acquisition module is used to acquire a structural model that needs to be thermally simulated, wherein the structural model includes first material information, first constraint information and first temperature information; the import module is used to import the structural model into the thermal stress simulation model according to a preset path, and convert the first material information, first constraint information and first temperature information in the structural model into the thermal stress simulation model to obtain second material information, second constraint information and second temperature information; wherein the thermal stress simulation model has a material database, and the material database includes multiple materials and performance parameters corresponding to each material; the first processing module is used to assign materials to the thermal stress simulation model according to the second material information; the second processing module is used to add fixed constraints in the structural statics simulation module of the thermal stress simulation model according to the second constraint information; the third processing module is used to add a test temperature in the steady-state thermal simulation module of the thermal stress simulation model according to the second temperature information; the simulation module is used to perform simulation testing according to the set test target.

[0019] In a third aspect, the present invention provides a computer device, comprising: a memory and a processor, the memory and the processor being communicatively connected to each other, the memory storing computer instructions, and the processor executing the thermal stress simulation method of the first aspect or any corresponding embodiment thereof by executing the computer instructions.

[0020] In a fourth aspect, the present invention provides a computer-readable storage medium having computer instructions stored thereon, the computer instructions being used to enable a computer to execute the thermal stress simulation method of the first aspect or any corresponding embodiment thereof.

[0021] In a fifth aspect, the present invention provides a computer program product, comprising computer instructions for causing a computer to execute the thermal stress simulation method of the first aspect or any corresponding embodiment thereof.

[0022] The thermal stress simulation method, device, computer equipment and storage medium provided by the present invention have the following beneficial effects: by obtaining a structural model that needs to be subjected to thermal stress simulation, the structural model is imported into the thermal stress simulation model according to a preset path, and the first material information, the first constraint information and the first temperature information in the structural model are converted into the thermal stress simulation model; the thermal stress simulation model is assigned a material value according to the second material information; according to the second constraint information, a fixed constraint is added to the structural statics simulation module of the thermal stress simulation model; according to the second temperature information, a test temperature is added to the steady-state thermal simulation module of the thermal stress simulation model; and a simulation test is performed according to the set test target. In this way, the threshold for thermal stress simulation analysis can be lowered, and the effect of enabling personnel without simulation foundation to perform thermal stress simulation can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 is a flow chart of a thermal stress simulation method according to an embodiment of the present invention;

[0025] Figure 2 is a flow chart of another thermal stress simulation method according to an embodiment of the present invention;

[0026] Figure 3 is a flow chart of an example of a thermal stress simulation method according to an embodiment of the present invention;

[0027] Figure 4 is a schematic diagram of thermal stress automation simulation according to an embodiment of the present invention;

[0028] Figure 5 is a stress cloud diagram obtained by the thermal stress simulation method according to an embodiment of the present invention;

[0029] Figure 6 is a deformation cloud diagram obtained by the thermal stress simulation method according to an embodiment of the present invention;

[0030] Figure 7 is a structural block diagram of a thermal stress simulation device according to an embodiment of the present invention;

[0031] Figure 8 It is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0033] According to an embodiment of the present invention, an embodiment of a thermal stress simulation method is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0034] In this embodiment, a thermal stress simulation method is provided, which can be used in computer equipment. Figure 1 is a flow chart of a thermal stress simulation method according to an embodiment of the present invention. Figure 1 As shown, the process includes the following steps:

[0035] Step S101: obtaining a structural model that needs to be subjected to thermal stress simulation, wherein the structural model includes first material information, first constraint information and first temperature information.

[0036] The structural model can be understood as the product that needs thermal stress simulation, which is obtained by drawing using drawing software. The first material information is used to reflect the material used by the product that needs thermal stress simulation; the first constraint information is used to reflect the area where the product that needs thermal stress simulation has fixed constraints when in use; the first temperature information is used to reflect the area where the product that needs thermal stress simulation is measured during operation and the temperature value of the area.

[0037] Step S102: importing the structural model into the thermal stress simulation model according to a preset path, and converting the first material information, the first constraint information and the first temperature information in the structural model into the thermal stress simulation model to obtain the second material information, the second constraint information and the second temperature information.

[0038] The thermal stress simulation model has a material database, which includes a variety of materials and performance parameters corresponding to each material.

[0039] Specifically, an import path of the structural model may be predefined, and the structural model may be imported into the thermal stress simulation model according to the predefined import path.

[0040] Step S103: assigning material values ​​to the thermal stress simulation model according to the second material information.

[0041] Step S104: adding fixed constraints in the structural statics simulation module of the thermal stress simulation model according to the second constraint information.

[0042] Step S105: adding a test temperature to the steady-state thermal simulation module of the thermal stress simulation model according to the second temperature information.

[0043] Step S106: Perform simulation test according to the set test target.

[0044] The thermal stress simulation method provided in this embodiment obtains a structural model that needs to be simulated for thermal stress, imports the structural model into the thermal stress simulation model according to a preset path, and converts the first material information, the first constraint information and the first temperature information in the structural model into the thermal stress simulation model; assigns materials to the thermal stress simulation model according to the second material information; adds fixed constraints to the structural statics simulation module of the thermal stress simulation model according to the second constraint information; adds test temperatures to the steady-state thermal simulation module of the thermal stress simulation model according to the second temperature information; and performs simulation tests according to the set test targets. This can lower the threshold for thermal stress simulation analysis and achieve the effect of allowing people without simulation foundation to perform thermal stress simulation.

[0045] In this embodiment, a thermal stress simulation method is provided, which can be used in computer equipment. Figure 2 is a flow chart of another thermal stress simulation method according to an embodiment of the present invention, Figure 3 is a flow chart of an example of a thermal stress simulation method according to an embodiment of the present invention. The thermal stress simulation method according to the embodiment of the present invention can be implemented by a compiled .py file, and the compiled .py file contains a thermal stress simulation process code, such as Figure 2 and Figure 3 As shown, the process includes the following steps:

[0046] Step S201: specifying a thermal stress simulation model version.

[0047] Step S202: specifying the import path of the structural model.

[0048] Step S203: sharing the simulation parameters in the steady-state thermal simulation module in the thermal stress simulation model with the structural statics simulation module in the thermal stress simulation model; wherein the simulation parameters include: engineering data, geometric structure, model structure and solution method.

[0049] For example, Steady-State Thermal (steady-state thermal simulation module) and Static Structural (structural statics simulation module) are called, and the Engineering Data, Geometry, Model, and Solution of the Steady-State Thermal module are shared with the Engineering Data, Geometry, Model, and Setup of the Static Structural module respectively.

[0050] Sharing means assigning the settings of the Engineering Data, Geometry, Model, and Solution submodules of the Steady-State Thermal module to the corresponding submodules of the Static Structural module. For example, sharing the Geometry of the Steady-State Thermal module with the Geometry of the Static Structural module means that the geometric models of the two modules are the same.

[0051] Step S204: constructing a material database in the thermal stress simulation model, wherein the material database includes a plurality of materials and performance parameters corresponding to each material.

[0052] Specifically, the performance parameters corresponding to each material include: name, density, Young's modulus, Poisson's ratio, thermal expansion coefficient and thermal conductivity.

[0053] Step S205: Obtain a structural model that needs to be subjected to thermal stress simulation, wherein the structural model includes first material information, first constraint information, and first temperature information. Import the structural model into the thermal stress simulation model according to a preset path, and transform the first material information, first constraint information, and first temperature information in the structural model into the thermal stress simulation model to obtain second material information, second constraint information, and second temperature information.

[0054] For example, the import path is written in the .py file. When the .py file runs to this step, the structural model under the import path will be read according to the import path. The .py file needs to be run on the workbench platform under the ANSYS simulation software, which can be understood as importing the structural model into the workbench platform.

[0055] For example, the first material information, first constraint information and first temperature information in the structural model can be converted into the thermal stress simulation model through the Mechanical setting to obtain the second material information, second constraint information and second temperature information. The Mechanical setting is to convert the first material information, first constraint information and first temperature information in the structural model into the second material information, second constraint information and second temperature information required by the thermal stress simulation model. Only when the second material information, second constraint information and second temperature information are set can the thermal stress simulation model be calculated.

[0056] Step S206: assigning material values ​​to the thermal stress simulation model according to the second material information.

[0057] In an optional embodiment, assigning materials to the thermal stress simulation model according to the second material information includes the following steps: determining whether there is a material corresponding to the second material information in the material database; when there is a material corresponding to the second material information in the material database, assigning materials to the thermal stress simulation model according to the material database.

[0058] For example, if there is a material corresponding to the second material information in the material database, such as 08AL in the thermal stress simulation model and 08AL in the material database, the 08AL region in the thermal stress simulation model is assigned to the 08AL material.

[0059] Step S207: meshing the thermal stress simulation model.

[0060] Step S208: adding fixed constraints in the structural statics simulation module of the thermal stress simulation model according to the second constraint information.

[0061] For example, identify the fixed (constraint area) in the thermal stress simulation model name and add fixed constraints to the area in the Static Structural simulation module.

[0062] Step S209: adding a test temperature to the steady-state thermal simulation module of the thermal stress simulation model according to the second temperature information.

[0063] For example, identify the names of thermal stress simulation models that start with T+temperature value, save the temperature value separately, add Temperature boundary conditions to the area in the Steady-State Thermal module, and set the temperature value.

[0064] Step S210: Perform simulation test according to the set test target.

[0065] In an optional implementation, performing simulation testing according to the set test target includes: taking temperature distribution as the test target of the steady-state thermal simulation module, and taking stress and deformation as the test target of the structural statics simulation module for simulation.

[0066] It can be seen that the embodiment of the present invention adopts a thermal stress automatic simulation method based on ANSYS secondary development, and by compiling a .py file instead of the simulation steps that need to be manually set, it achieves the effect of lowering the threshold of thermal stress simulation analysis and allowing personnel without simulation foundation to perform thermal stress simulation. That is, through the thermal stress automatic simulation based on ANSYS secondary development, the simulation process can be customized to form a standardized professional simulation system. The user only needs to modify the model file path in the compiled .py file to perform simulation, thereby improving simulation efficiency and shortening the product development cycle.

[0067] The thermal stress simulation method provided in this embodiment obtains a structural model that needs to be simulated for thermal stress, imports the structural model into the thermal stress simulation model according to a preset path, and converts the first material information, the first constraint information and the first temperature information in the structural model into the thermal stress simulation model; assigns materials to the thermal stress simulation model according to the second material information; adds fixed constraints to the structural statics simulation module of the thermal stress simulation model according to the second constraint information; adds test temperatures to the steady-state thermal simulation module of the thermal stress simulation model according to the second temperature information; and performs simulation tests according to the set test targets. This can lower the threshold for thermal stress simulation analysis and achieve the effect of allowing people without simulation foundation to perform thermal stress simulation.

[0068] Figure 4 is a schematic diagram of thermal stress automation simulation according to an embodiment of the present invention, such as Figure 4 As shown, in order to enable the structural model to be automatically simulated in the thermal stress simulation model, the structural model needs to be processed. Specifically, the structural model needs to be processed as follows: remove some structural features in the structural model; name the material of the structural model to obtain the first material information; name the area with fixed constraints in the structural model to obtain the first constraint information; name the temperature detection area in the structural model to obtain the first temperature information.

[0069] For example, the structural model that needs to be simulated by thermal stress is preprocessed in SCDM to remove small holes, small faces, chamfers and other features in the model to facilitate subsequent meshing; the material of the structural model is named, such as 08AL; the area with fixed constraints in the structural model is selected and named, such as fixed; the temperature measurement point area is selected in the structural model and named with T+temperature value, such as T100.

[0070] Import the processed structural model into the thermal stress simulation model containing the .py file, and the simulation can be automatically performed to obtain the simulation results. Figure 5 is a stress cloud diagram obtained by the thermal stress simulation method according to an embodiment of the present invention; Figure 6 This is a deformation cloud diagram obtained by the thermal stress simulation method according to an embodiment of the present invention.

[0071] It should be noted that the present invention is an automated simulation method proposed based on the problem of thermal stress simulation of the cover plate on a zero-cold-water gas wall-mounted boiler product. In addition to being applied to this product, the method can also be applied to other products with thermal stress and thermal deformation, such as disinfection cabinets, steam ovens, etc.

[0072] In this embodiment, a thermal stress simulation device is also provided, which is used to implement the above-mentioned embodiments and preferred implementation modes, and the descriptions that have been made will not be repeated. As used below, the term "module" can implement a combination of software and / or hardware of a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0073] This embodiment provides a thermal stress simulation device, such as Figure 7 As shown, including:

[0074] The acquisition module 701 is used to acquire a structural model that needs to be subjected to thermal stress simulation, wherein the structural model includes first material information, first constraint information and first temperature information.

[0075] The import module 702 is used to import the structural model into the thermal stress simulation model according to a preset path, and transform the first material information, the first constraint information and the first temperature information in the structural model into the thermal stress simulation model to obtain the second material information, the second constraint information and the second temperature information; wherein the thermal stress simulation model has a material database, and the material database includes a plurality of materials and performance parameters corresponding to each material.

[0076] The first processing module 703 is used to assign material values ​​to the thermal stress simulation model according to the second material information.

[0077] The second processing module 704 is used to add fixed constraints in the structural statics simulation module of the thermal stress simulation model according to the second constraint information.

[0078] The third processing module 705 is used to add a temperature boundary condition to the steady-state thermal simulation module of the thermal stress simulation model according to the second temperature information, and set a temperature value.

[0079] The simulation module 706 is used to perform simulation testing according to the set test targets.

[0080] In some optional embodiments, the thermal stress simulation device further includes a structural model preprocessing module. The structural model preprocessing module is used to: remove some structural features in the structural model; name the material of the structural model to obtain first material information; name the area with fixed constraints in the structural model to obtain first constraint information; name the temperature detection area in the structural model to obtain first temperature information.

[0081] In some optional embodiments, the thermal stress simulation device further includes a thermal stress simulation model preprocessing module. Before the structural model is imported into the thermal stress simulation model according to a preset path, the thermal stress simulation model preprocessing module is used to: share the simulation parameters in the steady-state thermal simulation module in the thermal stress simulation model with the structural statics simulation module in the thermal stress simulation model; wherein the simulation parameters include: engineering data, geometric structure, model structure and solution.

[0082] In some optional embodiments, the first processing module 703 is specifically used to: determine whether there is a material corresponding to the second material information in the material database; when there is a material corresponding to the second material information in the material database, assign material values ​​to the thermal stress simulation model according to the material database.

[0083] In some optional implementations, the simulation module 706 is specifically used to perform simulation using temperature distribution as a test target of a steady-state thermal simulation module and using stress and deformation as test targets of a structural statics simulation module.

[0084] In some optional implementations, the thermal stress simulation device further includes a meshing module. Before performing a simulation test according to a set test target, the meshing module is used to: mesh the thermal stress simulation model.

[0085] The further functional description of each of the above modules and units is the same as that of the above corresponding embodiments and will not be repeated here.

[0086] The thermal stress simulation device in this embodiment is presented in the form of a functional unit, where the unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that executes one or more software or fixed programs, and / or other devices that can provide the above functions.

[0087] The embodiment of the present invention also provides a computer device having the above Figure 7 The thermal stress simulation device shown.

[0088] See also Figure 8 , Figure 8is a schematic diagram of the structure of a computer device provided by an optional embodiment of the present invention, such as Figure 8 As shown, the computer device includes: one or more processors 10, a memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. Various components are connected to each other using different buses for communication, and can be installed on a common mainboard or installed in other ways as needed. The processor can process the instructions executed in the computer device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as, a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple computer devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Figure 8 A processor 10 is taken as an example.

[0089] The processor 10 may be a central processing unit, a network processor or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be a dedicated integrated circuit, a programmable logic device or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic or any combination thereof.

[0090] The memory 20 stores instructions executable by at least one processor 10, so that at least one processor 10 executes the method shown in the above embodiment.

[0091] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the computer device, etc. In addition, the memory 20 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may optionally include a memory remotely arranged relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0092] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid state drive; the memory 20 may also include a combination of the above types of memory.

[0093] The computer device also includes an input device 30 and an output device 70. The processor 10, the memory 20, the input device 30 and the output device 70 may be connected via a bus or other means. Figure 8 The example of connecting through bus is taken in the following.

[0094] The input device 30 can receive input digital or character information, and generate key signal input related to the user settings and function control of the computer device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick, etc. The output device 70 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The above-mentioned display device includes but is not limited to a liquid crystal display, a light emitting diode, a display and a plasma display. In some optional embodiments, the display device can be a touch screen.

[0095] The embodiment of the present invention also provides a computer-readable storage medium. The method according to the embodiment of the present invention can be implemented in hardware, firmware, or can be implemented as a computer code that can be recorded in a storage medium, or can be implemented as a computer code that is originally stored in a remote storage medium or a non-temporary machine-readable storage medium and will be stored in a local storage medium through a network download, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only storage memory, a random access memory, a flash memory, a hard disk or a solid-state hard disk, etc.; further, the storage medium can also include a combination of the above types of memories. It can be understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by a computer, a processor, or hardware, the method shown in the above embodiment is implemented.

[0096] A part of the present invention may be applied as a computer program product, such as a computer program instruction, which, when executed by a computer, can call or provide the method and / or technical solution according to the present invention through the operation of the computer. Those skilled in the art should understand that the existence of the computer program instruction in a computer-readable medium includes, but is not limited to, a source file, an executable file, an installation package file, etc., and accordingly, the way in which the computer program instruction is executed by the computer includes, but is not limited to: the computer directly executes the instruction, or the computer compiles the instruction and then executes the corresponding compiled program, or the computer reads and executes the instruction, or the computer reads and installs the instruction and then executes the corresponding installed program. Here, the computer-readable medium may be any available computer-readable storage medium or communication medium accessible to the computer.

[0097] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A thermal stress simulation method, characterized in that: include: Acquire a structural model that needs to be subjected to thermal stress simulation, wherein the structural model includes first material information, first constraint information, and first temperature information; The structural model is imported into a thermal stress simulation model according to a preset path, and the first material information, the first constraint information and the first temperature information in the structural model are converted into the thermal stress simulation model to obtain second material information, second constraint information and second temperature information; wherein the thermal stress simulation model has a material database, and the material database includes a plurality of materials and performance parameters corresponding to each material; Assigning material to the thermal stress simulation model according to the second material information; According to the second constraint information, a fixed constraint is added in a structural statics simulation module of the thermal stress simulation model; adding a test temperature in a steady-state thermal simulation module of the thermal stress simulation model according to the second temperature information; Perform simulation tests according to the set test objectives.

2. The method according to claim 1, characterized in that Before obtaining the structural model required for thermal stress simulation, it also includes: removing some structural features in the structural model; Naming the material of the structural model to obtain the first material information; Naming the region where the fixed constraint exists in the structural model to obtain the first constraint information; The temperature detection area in the structural model is named to obtain the first temperature information.

3. The method according to claim 1, characterized in that Before the structural model is imported into the thermal stress simulation model according to a preset path, the method further includes: The simulation parameters in the steady-state thermal simulation module in the thermal stress simulation model are shared with the structural statics simulation module in the thermal stress simulation model; wherein the simulation parameters include: engineering data, geometric structure, model structure and solution.

4. The method according to claim 1, characterized in that Assigning material to the thermal stress simulation model according to the second material information includes: Determine whether there is a material corresponding to the second material information in the material database; When the material database contains a material corresponding to the second material information, the thermal stress simulation model is assigned a material value according to the material database.

5. The method according to claim 1, characterized in that: The simulation test according to the set test target includes: The temperature distribution is used as the test target of the steady-state thermal simulation module, and the stress and deformation are used as the test targets of the structural statics simulation module for simulation.

6. The method according to claim 1, characterized in that Before conducting simulation tests according to the set test objectives, it also includes: The thermal stress simulation model is meshed.

7. A thermal stress simulation device, characterized in that: The device comprises: An acquisition module, used for acquiring a structural model that needs to be subjected to thermal stress simulation, wherein the structural model includes first material information, first constraint information and first temperature information; An import module, used to import the structural model into the thermal stress simulation model according to a preset path, and transform the first material information, the first constraint information and the first temperature information in the structural model into the thermal stress simulation model to obtain second material information, second constraint information and second temperature information; wherein the thermal stress simulation model has a material database, and the material database includes a plurality of materials and performance parameters corresponding to each material; A first processing module, configured to assign material values ​​to the thermal stress simulation model according to the second material information; A second processing module is used to add a fixed constraint in a structural statics simulation module of the thermal stress simulation model according to the second constraint information; A third processing module, configured to add a temperature boundary condition to a steady-state thermal simulation module of the thermal stress simulation model and set a temperature value according to the second temperature information; The simulation module is used to perform simulation tests according to the set test objectives.

8. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the thermal stress simulation method according to any one of claims 1 to 6 by executing the computer instructions.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the thermal stress simulation method according to any one of claims 1 to 6.

10. A computer program product, characterized in that The method comprises computer instructions, wherein the computer instructions are used to cause a computer to execute the thermal stress simulation method according to any one of claims 1 to 6.

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