Mask preparation device, control method thereof and preparation method of solar cell

Abstract

The invention provides a mask preparation device, a control method thereof and a preparation method of a solar cell, and the mask preparation device comprises a first conveying unit which is used for conveying a to-be-masked silicon wafer in a preset direction; the filling unit is used for filling mask slurry; and the roll coating unit is used for coating the mask slurry filled into the roll coating unit by the filling unit to at least one surface of the silicon wafer to be masked under the condition that the silicon wafer to be masked is conveyed to the roll coating unit through the first conveying unit. The problem that in the prior art, when a mask is prepared, hidden cracks and fragments are likely to happen to a product is solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a mask preparation device, a control method for the mask preparation device, and a preparation method for a solar cell. Background Art

[0002] In the prior art, masks are generally prepared by dry film lamination, wet film printing or inkjet printing. These mask preparation methods have the following disadvantages: there is pressure on the product surface, which is prone to defects such as hidden cracks and fragments; it is impossible to cover the product surface 100%, and margins need to be left on the four edges of the product; it is done on a single piece basis, and multiple pieces cannot be produced at the same time, resulting in low production capacity. Summary of the invention

[0003] The main purpose of the present application is to provide a mask preparation device, a control method for the mask preparation device and a method for preparing a solar cell, so as to at least solve the problem that hidden cracks and fragments are easily generated in the product when preparing the mask in the prior art.

[0004] In order to achieve the above-mentioned purpose, according to one aspect of the present application, a mask preparation device is provided, comprising: a first conveying unit, used to convey a silicon wafer to be masked along a predetermined direction; a filling unit, used to fill mask slurry; and a rolling unit, used to apply the mask slurry filled into the rolling unit by the filling unit to at least one surface of the silicon wafer to be masked when the silicon wafer to be masked is conveyed to the rolling unit by the first conveying unit.

[0005] Optionally, the mask preparation device also includes: a second conveying unit, used to convey the silicon wafer to be masked after the coating is completed along the predetermined direction; and a drying unit, used to dry and solidify the silicon wafer to be masked after the coating is completed when the silicon wafer to be masked is conveyed to the drying unit via the second conveying unit.

[0006] Optionally, the coating unit includes a first coating wheel and a second coating wheel, the first coating wheel and the second coating wheel are in contact, the filling unit is used to fill the mask slurry onto the surface of the first coating wheel and / or the surface of the second coating wheel, the coating unit is used to apply the mask slurry filled onto the surface of the first coating wheel and / or the surface of the second coating wheel to at least one surface of the silicon wafer to be masked, and the mask preparation device also includes: an extrusion unit, used to extrude the first coating wheel and the second coating wheel to adjust the pressure between the first coating wheel and the second coating wheel.

[0007] Optionally, the extrusion unit includes a first extrusion wheel and a second extrusion wheel, the first extrusion wheel contacts the first coating wheel, the second extrusion wheel contacts the second coating wheel, the first extrusion wheel is used to extrude the first coating wheel, and the second extrusion wheel is used to extrude the second coating wheel.

[0008] Optionally, the mask preparation device further includes: a collecting unit for collecting excess mask slurry that is not adhered to the rolling unit; and a conveying unit for conveying the mask slurry collected by the collecting unit to the filling unit.

[0009] Optionally, the first coating wheel comprises a first coating wheel body and a first groove, the first groove is used to store the mask slurry, and the second coating wheel comprises a second coating wheel body and a second groove, the second groove is used to store the mask slurry.

[0010] Optionally, the first conveying unit includes a plurality of conveying rollers arranged along the predetermined direction, and the second conveying unit includes a plurality of blade rollers arranged along the predetermined direction.

[0011] Optionally, the roller coating unit is used to apply the mask slurry filled into the roller coating unit by the filling unit to at least one surface of the silicon wafer to be masked.

[0012] Optionally, the roller coating unit is used to apply the mask slurry filled into the roller coating unit by the filling unit to at least one side surface of the silicon wafer to be masked.

[0013] Optionally, the roller coating unit is used to apply the mask slurry filled into the roller coating unit by the filling unit onto at least one surface and at least one side of the silicon wafer to be masked.

[0014] According to another aspect of the present application, a control method for any one of the mask preparation devices is provided, comprising: controlling a first conveying unit to convey a silicon wafer to be masked to a roller coating unit along a predetermined direction; controlling a filling unit to fill mask slurry into the roller coating unit; and controlling the roller coating unit to apply the mask slurry to at least one surface of the silicon wafer to be masked.

[0015] According to another aspect of the present application, a method for preparing a solar cell is provided, comprising: providing a substrate; forming a plurality of functional layers on the surface of the substrate, the plurality of functional layers being formed on the surface of the substrate, comprising: forming a preliminary functional layer on one side of the substrate; using any one of the mask preparation devices, or using the control method of the mask preparation device, to form a mask layer on the surface of the preliminary functional layer away from the substrate, wherein the viscosity of the mask slurry is 200 to 3000 cps; patterning the mask layer, and etching the preliminary functional layer through the patterned mask layer to obtain any one of the functional layers.

[0016] According to the technical solution of the present application, the mask preparation device includes a first conveying unit, a filling unit and a rolling unit, wherein the first conveying unit is used to convey the silicon wafer to be masked to the rolling unit in a predetermined direction, the filling unit is used to fill the mask slurry into the rolling unit, and the rolling unit is used to apply the mask slurry to at least one surface of the silicon wafer to be masked. Compared with the problem of the prior art that the mask is prepared by dry film lamination, wet film printing or inkjet printing, which leads to the problem that the product is prone to cracks and fragments, the present application uses the rolling unit to apply the mask slurry filled into the rolling unit by the filling unit to at least one surface of the silicon wafer to be masked when the silicon wafer to be masked is conveyed to the rolling unit by the first conveying unit, thereby ensuring that the pressure on the surface of the silicon wafer to be masked during the application process is small, thereby ensuring that the fragmentation rate is reduced during the application process, and ensuring that the product yield is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 A schematic structural diagram of a mask preparation device provided in an embodiment of the present application is shown;

[0019] Figure 2 A hardware structure block diagram of a mobile terminal for executing a control method for a mask preparation device provided in an embodiment of the present application is shown;

[0020] Figure 3 A schematic flow chart of a control method for a mask preparation device provided according to an embodiment of the present application is shown.

[0021] The above drawings include the following reference numerals:

[0022] 102. Processor; 104. Memory; 106. Transmission device; 108. Input / output device; 10. First transmission unit; 11. Silicon wafer to be masked; 12. Filling unit; 13. Rolling unit; 14. Second transmission unit; 131. First rolling wheel; 132. Second rolling wheel; 15. Extrusion unit; 121. First filling port; 122. Second filling port; 151. First extrusion wheel; 152. Second extrusion wheel; 16. Collection unit; 161. Slurry collection port; 162. Slurry tank; 101. Transmission roller; 141. Blade roller. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0025] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0026] As introduced in the background technology, in the prior art, hidden cracks and fragments are prone to occur in the product when preparing the mask. To solve the above problems, the embodiments of the present application provide a mask preparation device, a control method for the mask preparation device, and a method for preparing a solar cell.

[0027] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0028] The present application embodiment provides a mask preparation device, such as Figure 1 As shown, including:

[0029] A first conveying unit 10 is used to convey a silicon wafer 11 to be masked along a predetermined direction;

[0030] A filling unit 12, used for filling mask slurry;

[0031] The roller coating unit 13 is used to apply the mask slurry added by the filling unit 12 to at least one surface of the silicon wafer 11 to be masked when the silicon wafer 11 to be masked is transferred to the roller coating unit 13 via the first transfer unit 10.

[0032] Through the above-mentioned embodiment, the mask preparation device includes a first conveying unit, a filling unit and a rolling unit, wherein the first conveying unit is used to convey the silicon wafer to be masked to the rolling unit in a predetermined direction, the filling unit is used to fill the mask slurry into the rolling unit, and the rolling unit is used to apply the mask slurry to at least one surface of the silicon wafer to be masked. Compared with the problem that the product is prone to cracking and fragmentation by using dry film lamination, wet film printing or inkjet printing to prepare the mask in the prior art, the present application uses the rolling unit to apply the mask slurry filled into the rolling unit by the filling unit to at least one surface of the silicon wafer to be masked when the silicon wafer to be masked is conveyed to the rolling unit by the first conveying unit, thereby ensuring that the pressure on the surface of the silicon wafer to be masked during the application process is small, thereby ensuring that the fragmentation rate during the application process is reduced and ensuring that the product yield is good.

[0033] In addition, when the silicon wafer to be masked is transferred to the roller coating unit, the roller coating unit applies the mask slurry to at least one surface of the silicon wafer to be masked, and through the horizontal roller coating method, it is ensured that the edge of the silicon wafer to be masked can also be covered and coated, thereby reducing the edge plating problem in the subsequent electroplating process. At the same time, the coating device of the present application has low requirements for the alignment accuracy of the silicon wafer to be masked.

[0034] Specifically, the predetermined direction is a direction perpendicular to the thickness of the silicon wafer to be masked. The filling unit is used to fill the mask slurry at a uniform speed.

[0035] Specifically, the filling unit can be used to fill the mask slurry while the silicon wafer to be masked is transferred to the roller coating unit. The filling unit can also be used to fill the mask slurry into the roller coating unit before the silicon wafer to be masked is transferred to the roller coating unit. In this case, the roller coating unit can store the filled mask slurry, and the present application does not impose any specific restrictions on this.

[0036] Specifically, the viscosity of the mask slurry is 200-3000 cps, and the material of the mask slurry includes a mixture of various phenolic resins, polyester resins, polyamide resins and solvents.

[0037] In one alternative, Figure 1As shown, the mask preparation device further includes: a second conveying unit 14, which is used to convey the silicon wafer to be masked 11 after the smearing is completed along the predetermined direction; and a drying unit (not shown), which is used to dry and solidify the silicon wafer to be masked 11 after the smearing is completed when the silicon wafer to be masked 11 after the smearing is conveyed to the drying unit via the second conveying unit 14. In this embodiment, the second conveying unit is used to convey the silicon wafer to be masked after the smearing is completed to the drying unit for drying and solidification, so that the mask slurry covering the silicon wafer to be masked forms a solid thin film layer, thereby ensuring that the quality of the prepared mask is good.

[0038] In other embodiments, Figure 1 As shown, the above-mentioned rolling unit 13 includes a first rolling wheel 131 and a second rolling wheel 132, and the first rolling wheel 131 is in contact with the second rolling wheel 132. The above-mentioned filling unit 12 is used to fill the above-mentioned mask slurry onto the surface of the above-mentioned first rolling wheel 131 and / or the surface of the above-mentioned second rolling wheel 132. The above-mentioned rolling unit 13 is used to apply the above-mentioned mask slurry filled onto the surface of the above-mentioned first rolling wheel 131 and / or the surface of the above-mentioned second rolling wheel 132 to at least one surface of the above-mentioned silicon wafer 11 to be masked. The above-mentioned mask preparation device also includes: an extrusion unit 15, which is used to extrude the above-mentioned first rolling wheel 131 and the above-mentioned second rolling wheel 132 to adjust the pressure between the above-mentioned first rolling wheel 131 and the above-mentioned second rolling wheel 132. In this embodiment, the coating unit includes a first coating wheel and a second coating wheel in contact, the filling unit is used to fill the mask slurry onto the surface of the first coating wheel and / or the surface of the second coating wheel, the coating unit is used to apply the mask slurry added to the surface of the first coating wheel and / or the surface of the second coating wheel to at least one surface of the silicon wafer to be masked, thereby ensuring that the mask slurry on the surface of the silicon wafer to be masked is applied more evenly, and the extrusion unit is used to extrude the first coating wheel and the second coating wheel to adjust the pressure between the first coating wheel and the second coating wheel, so as to adjust the thickness of the mask slurry applied on the surface of the silicon wafer to be masked, thereby further ensuring that the quality of the obtained mask is good.

[0039] Specifically, the mask thickness can be adjusted by the slurry viscosity and the pressure between the first coating wheel and the second coating wheel, and the pressure between the first coating wheel and the second coating wheel can be adjusted by the distance between the first coating wheel and the second coating wheel; the distance between the first coating wheel and the second coating wheel is -5mm to 0mm, and the corresponding mask thickness range can be 1um to 20um, and the mask uniformity can be ±1.5um. Specifically, the first coating wheel and the second coating wheel will be slightly deformed when squeezed.

[0040] Specifically, Figure 1As shown, the filling unit 12 includes a first filling port 121 and a second filling port 122. The first filling port 121 is close to the first coating wheel 131, and the second filling port 122 is close to the second coating wheel 132. The first filling port 121 is used to fill the mask slurry into the first coating wheel 131, and the second filling port 122 is used to fill the mask slurry into the second coating wheel 132.

[0041] Specifically, the first coating wheel is located on one side of the upper surface of the silicon wafer to be masked, and the second coating wheel is located on one side of the lower surface of the silicon wafer to be masked. When it is necessary to apply a mask to the upper surface of the silicon wafer to be masked, the mask slurry is added to the surface of the first coating wheel through the first filling port, and the mask slurry on the surface of the first coating wheel is applied to the upper surface of the silicon wafer to be masked through the coating unit; when it is necessary to apply a mask to the lower surface of the silicon wafer to be masked, the mask slurry is added to the surface of the second coating wheel through the second filling port, and the mask slurry on the surface of the second coating wheel is applied to the lower surface of the silicon wafer to be masked through the coating unit; when it is necessary to apply a mask to the upper and lower surfaces of the silicon wafer to be masked, the mask slurry is added to the surface of the first coating wheel and the surface of the second coating wheel through the first filling port and the second filling port respectively, and the mask slurry on the surface of the first coating wheel and the surface of the second coating wheel is applied to the upper and lower surfaces of the silicon wafer to be masked through the coating unit.

[0042] According to some exemplary embodiments of the present application, Figure 1 As shown, the extrusion unit 15 includes a first extrusion wheel 151 and a second extrusion wheel 152. The first extrusion wheel 151 contacts the first coating wheel 131, and the second extrusion wheel 152 contacts the second coating wheel 132. The first extrusion wheel 151 is used to extrude the first coating wheel 131, and the second extrusion wheel 152 is used to extrude the second coating wheel 132. In this embodiment, the first extrusion wheel extrudes the first coating wheel, and the second extrusion wheel extrudes the second coating wheel, which further ensures that the mask slurry can be evenly applied to the surface of the silicon wafer to be masked, and further ensures that the quality of the prepared mask is good.

[0043] Specifically, the first extrusion wheel and the second extrusion wheel are both smooth metal extrusion wheels.

[0044] According to other exemplary embodiments of the present application, Figure 1As shown, the mask preparation device further includes: a collecting unit 16, for collecting the excess mask slurry that is not adhered to the roller coating unit 13; and a conveying unit (not shown), for conveying the mask slurry collected by the collecting unit 16 to the filling unit 12. In this embodiment, the excess mask slurry that is not adhered to the roller coating unit can be collected by the collecting unit, and the collected mask slurry can be conveyed to the filling unit by the conveying unit, thereby ensuring that the excess mask slurry can be recycled and the preparation cost is low.

[0045] Specifically, Figure 1 As shown, the collecting unit 16 includes a slurry collecting port 161 and a slurry tank 162. The excess mask slurry after being squeezed by the squeezing wheel flows through both sides of the coating wheels (the first coating wheel and the second coating wheel), flows into the slurry collecting port, flows back to the slurry tank, and is pumped to the slurry filling ports (the first filling port and the second filling port) again through the pump (transporting unit) to form a closed loop.

[0046] In some other optional solutions of the present application, the first coating wheel includes a first coating wheel body and a first groove, the first groove is used to store the mask slurry, and the second coating wheel includes a second coating wheel body and a second groove, the second groove is used to store the mask slurry. In this embodiment, the first coating wheel stores the mask slurry through the first groove, and the second coating wheel stores the mask slurry through the second groove, so as to prepare for the subsequent application of the mask slurry to the surface of the silicon wafer to be masked.

[0047] Specifically, the mask slurry filled by the filling unit is evenly distributed in the engraved grooves (first groove and second groove) of the coating wheels (first coating wheel and second coating wheel) after being squeezed by the extrusion wheels (first coating wheel and second coating wheel). When the mask silicon wafer passes through the coating wheels (first coating wheel and second coating wheel), the mask slurry is evenly applied on the surface of the silicon wafer to be masked.

[0048] In other embodiments, Figure 1 As shown, the first conveying unit 10 includes a plurality of conveying rollers 101 arranged along the predetermined direction, and the second conveying unit 14 includes a plurality of blade rollers 141 arranged along the predetermined direction. In this embodiment, the first conveying unit includes a plurality of conveying rollers, and the second conveying unit includes a plurality of blade rollers. The blade rollers are used to convey the silicon wafers to be masked after the coating is completed, so that the silicon wafers to be masked after the coating is completed can be conveyed more stably, and the mask on the surface of the silicon wafer to be masked that reaches the drying unit is better, and the quality of the prepared mask is further ensured to be better.

[0049] Specifically, the conveying roller is a solid conveying roller, and the blade roller is a blade conveying roller.

[0050] Specifically, the masked silicon wafer is placed on the transmission roller and is transferred to the coating unit (the first coating wheel and the second coating wheel) via the transfer roller; after the masked silicon wafer passes through the coating wheels (the first coating wheel and the second coating wheel), the mask slurry is evenly distributed on the surface and is transferred to the drying unit through the blade roller.

[0051] In some further optional schemes of the present application, the above-mentioned roller coating unit is used to apply the above-mentioned mask slurry added to the above-mentioned roller coating unit by the above-mentioned filling unit to at least one surface of the above-mentioned silicon wafer to be masked.

[0052] Specifically, in the embodiment of the present application, the roller coating unit is used to apply the mask slurry to the upper surface and the lower surface of the silicon wafer to be masked.

[0053] In other embodiments, the roller coating unit is used to apply the mask slurry added to the roller coating unit by the filling unit to at least one side surface of the silicon wafer to be masked.

[0054] Specifically, in the embodiment of the present application, the roller coating unit is used to apply the mask slurry to the four sides of the silicon wafer to be masked.

[0055] In other embodiments, the roller coating unit is used to apply the mask slurry added to the roller coating unit by the filling unit to at least one surface and at least one side of the silicon wafer to be masked.

[0056] Specifically, in the embodiment of the present application, the roller coating unit is used to apply the mask slurry to the two surfaces (upper surface and lower surface) and four side surfaces of the silicon wafer to be masked. The mask preparation device of the present application can evenly apply the mask slurry to the four side surfaces and two surfaces of the silicon wafer to be masked, ensuring that the silicon wafer to be masked can be 100% covered, reducing the edge plating problem in the subsequent electroplating process.

[0057] Specifically, the structure of the mask preparation device of the present application is relatively simple, ensuring low investment cost.

[0058] The method embodiments provided in the embodiments of the present application can be executed in a mobile terminal, a computer terminal or a similar computing device. Taking running on a mobile terminal as an example, Figure 2 FIG. 1 is a hardware structure block diagram of a mobile terminal of a control method for a mask preparation device according to an embodiment of the present invention. Figure 2 As shown, the mobile terminal may include one or more ( Figure 2 Only one is shown in the figure) a processor 102 (the processor 102 may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data, wherein the mobile terminal may also include a transmission device 106 and an input / output device 108 for communication functions. It can be understood by those skilled in the art that Figure 2 The structure shown is only for illustration and does not limit the structure of the mobile terminal. Figure 2 More or fewer components as shown, or with Figure 2 Different configurations are shown.

[0059] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the control method of the mask preparation device in the embodiment of the present invention. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, the above method is implemented. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 may further include a memory remotely arranged relative to the processor 102, and these remote memories can be connected to the mobile terminal via a network. Examples of the above-mentioned network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The transmission device 106 is used to receive or send data via a network. The specific example of the above-mentioned network may include a wireless network provided by a communication provider of the mobile terminal. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, referred to as NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 106 may be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0060] In this embodiment, a control method for a mask preparation device running on a mobile terminal, a computer terminal or a similar computing device is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0061] Figure 3 FIG. 1 is a flow chart of a control method of a mask preparation device according to an embodiment of the present application. Figure 3 As shown, the method comprises the following steps:

[0062] Step S201, controlling the first conveying unit to convey the silicon wafer to be masked to the roller coating unit along a predetermined direction;

[0063] Specifically, the predetermined direction is a direction perpendicular to the thickness of the silicon wafer to be masked.

[0064] Step S202, controlling the filling unit to fill the mask slurry into the roller coating unit;

[0065] Step S203, controlling the roller coating unit to apply the mask slurry to at least one surface of the silicon wafer to be masked.

[0066] Through the above embodiment, the first conveying unit is controlled to convey the silicon wafer to be masked to the roller coating unit along a predetermined direction, and the filling unit is controlled to fill the mask slurry into the roller coating unit, and then the roller coating unit is controlled to apply the mask slurry to at least one surface of the silicon wafer to be masked. Compared with the problem of the product being prone to cracks and fragments caused by the conventional use of dry film lamination, wet film printing or inkjet printing to prepare the mask in the prior art, the present application controls the first conveying unit to convey the silicon wafer to be masked to the roller coating unit along a predetermined direction, and controls the filling unit to fill the mask slurry into the roller coating unit, and then controls the roller coating unit to apply the mask slurry to at least one surface of the silicon wafer to be masked, thereby ensuring that the pressure on the silicon wafer to be masked during the coating process is small, thereby ensuring that the fragmentation rate during the coating process is reduced, and ensuring that the product yield is good.

[0067] In addition, when the silicon wafer to be masked is transferred to the roller coating unit, the roller coating unit applies the mask slurry to at least one surface of the silicon wafer to be masked, and through the horizontal roller coating method, it is ensured that the edge of the silicon wafer to be masked can also be covered and coated, thereby reducing the edge plating problem in the subsequent electroplating process. At the same time, the coating device of the present application has low requirements for the alignment accuracy of the silicon wafer to be masked.

[0068] Specifically, the filling unit is controlled to fill the mask slurry into the roller coating unit at a uniform speed.

[0069] Specifically, the filling unit can be controlled to fill the mask slurry while the silicon wafer to be masked is transferred to the roller coating unit, or the filling unit can be controlled to fill the mask slurry into the roller coating unit before the silicon wafer to be masked is transferred to the roller coating unit. In this case, the roller coating unit can store the filled mask slurry, and the present application does not impose any specific restrictions on this.

[0070] An embodiment of the present application also provides a method for preparing a solar cell, comprising: providing a substrate; forming a plurality of functional layers on the surface of the substrate, the plurality of functional layers formed on the surface of the substrate comprising: forming a preliminary functional layer on one side of the substrate; using any one of the mask preparation devices or the control method of the mask preparation device to form a mask layer on the surface of the preliminary functional layer away from the substrate, wherein the viscosity of the mask slurry is 200 to 3000 cps; patterning the mask layer, and etching the preliminary functional layer through the patterned mask layer to obtain any one of the functional layers.

[0071] Specifically, a mask layer may also be formed on the side surface of the preliminary functional layer.

[0072] In the above embodiment, the preparation method of the solar cell comprises: providing a substrate, and forming a multi-layer functional layer on the surface of the substrate, wherein the multi-layer functional layer is formed on the surface of the substrate, comprising: forming a preliminary functional layer on one side of the substrate, and using the above mask preparation device, or the control method of the mask preparation device, forming a mask layer on the surface of the preliminary functional layer away from the substrate, wherein the viscosity of the mask slurry is 200-3000cps, and then patterning the mask layer, and etching the preliminary functional layer through the patterned mask layer to obtain any one of the multi-layer functional layers. Compared with the problem that the product is prone to hidden cracks and fragments by using dry film lamination, wet film printing or inkjet printing to prepare the mask in the prior art, the present application uses a roller coating unit to apply the mask slurry added by the filling unit to the roller coating unit to at least one surface of the preliminary functional layer when the preliminary functional layer is transferred to the roller coating unit via the first conveying unit, thereby ensuring that the pressure on the surface of the preliminary functional layer during the coating process is small, thereby ensuring that the fragmentation rate during the coating process is reduced, and ensuring that the yield of the obtained solar cell is good.

[0073] Specifically, the plurality of functional layers include: a hole transport layer, a light absorption layer and an electron transport layer stacked in sequence. The mask layer can be prepared by the mask preparation device or the control method of the mask preparation device in the preparation process of any layer of the functional layer.

[0074] It should be noted that the steps shown in the flowcharts of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and that, although a logical order is shown in the flowcharts, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0075] Obviously, those skilled in the art should understand that the above modules or steps of the present invention can be implemented by a general computing device, they can be concentrated on a single computing device, or distributed on a network composed of multiple computing devices, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be executed in a different order than here, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. Thus, the present invention is not limited to any specific combination of hardware and software.

[0076] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented in one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that include computer-usable program code.

[0077] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0078] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0079] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0080] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0081] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0082] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0083] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0084] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:

[0085] 1) In the mask preparation device of the present application, the mask preparation device includes a first conveying unit, a filling unit and a rolling unit, wherein the first conveying unit is used to convey the silicon wafer to be masked to the rolling unit in a predetermined direction, the filling unit is used to fill the mask slurry into the rolling unit, and the rolling unit is used to apply the mask slurry to at least one surface of the silicon wafer to be masked. Compared with the problem of the product being prone to cracks and fragments caused by the dry film lamination, wet film printing or inkjet printing commonly used in the prior art to prepare the mask, the present application uses the rolling unit to apply the mask slurry filled into the rolling unit by the filling unit to at least one surface of the silicon wafer to be masked when the silicon wafer to be masked is conveyed to the rolling unit by the first conveying unit, thereby ensuring that the pressure on the surface of the silicon wafer to be masked during the application process is small, thereby ensuring that the fragmentation rate is reduced during the application process, and ensuring that the product yield is good.

[0086] 2) In the control method of the mask preparation device of the present application, the first conveying unit is controlled to convey the silicon wafer to be masked to the roller coating unit along a predetermined direction, and the filling unit is controlled to fill the mask slurry into the roller coating unit, and then the roller coating unit is controlled to apply the mask slurry to at least one surface of the silicon wafer to be masked. Compared with the problem of the product being prone to cracks and fragments by preparing masks using dry film lamination, wet film printing or inkjet printing in the prior art, the present application controls the first conveying unit to convey the silicon wafer to be masked to the roller coating unit along a predetermined direction, and controls the filling unit to fill the mask slurry into the roller coating unit, and then controls the roller coating unit to apply the mask slurry to at least one surface of the silicon wafer to be masked, thereby ensuring that the pressure on the silicon wafer to be masked during the coating process is small, thereby ensuring that the fragmentation rate during the coating process is reduced, and ensuring that the product yield is good.

[0087] 3) In the preparation method of the solar cell of the present application, the preparation method of the solar cell comprises: providing a substrate, and forming a multi-layer functional layer on the surface of the substrate, wherein the multi-layer functional layer is formed on the surface of the substrate, comprising: forming a preliminary functional layer on one side of the substrate, and using the above-mentioned mask preparation device, or the control method of the mask preparation device, to form a mask layer on the surface of the preliminary functional layer away from the substrate, wherein the viscosity of the mask slurry is 200-3000cps, and then the mask layer is patterned, and the preliminary functional layer is etched through the patterned mask layer to obtain any one of the multi-layer functional layers. Compared with the problem that the product is prone to cracking and fragmentation by using dry film lamination, wet film printing or inkjet printing to prepare the mask in the prior art, the present application uses a roller coating unit to apply the mask slurry added by the filling unit to the roller coating unit to at least one surface of the preliminary functional layer when the preliminary functional layer is transferred to the roller coating unit via the first conveying unit, thereby ensuring that the pressure on the surface of the preliminary functional layer during the coating process is small, thereby ensuring that the fragmentation rate during the coating process is reduced, and ensuring that the yield of the obtained solar cell is good.

[0088] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A mask preparation device, characterized in that: include: A first conveying unit, used for conveying the silicon wafer to be masked along a predetermined direction; A filling unit, used for filling mask slurry; The roller coating unit is used to apply the mask slurry added to the roller coating unit by the filling unit to at least one surface of the silicon wafer to be masked when the silicon wafer to be masked is transferred to the roller coating unit by the first transfer unit.

2. The mask preparation device according to claim 1, characterized in that: The mask preparation device also includes: A second conveying unit, used for conveying the silicon wafer to be masked after coating along the predetermined direction; The drying unit is used to dry and solidify the silicon wafer to be masked after the coating is completed, when the silicon wafer to be masked is transferred to the drying unit via the second transfer unit.

3. The mask preparation device according to claim 1, characterized in that: The coating unit comprises a first coating wheel and a second coating wheel, wherein the first coating wheel is in contact with the second coating wheel. The filling unit is used to fill the mask slurry onto the surface of the first coating wheel and / or the surface of the second coating wheel, and the coating unit is used to apply the mask slurry filled onto the surface of the first coating wheel and / or the surface of the second coating wheel to at least one surface of the silicon wafer to be masked. The mask preparation device also includes: an extrusion unit, which is used to extrude the first coating wheel and the second coating wheel to adjust the pressure between the first coating wheel and the second coating wheel.

4. The mask preparation device according to claim 3, characterized in that: The extrusion unit comprises a first extrusion wheel and a second extrusion wheel, the first extrusion wheel contacts the first rolling wheel, the second extrusion wheel contacts the second rolling wheel, the first extrusion wheel is used to extrude the first rolling wheel, and the second extrusion wheel is used to extrude the second rolling wheel.

5. The mask preparation device according to claim 1, characterized in that: The mask preparation device also includes: A collecting unit, used for collecting the excess mask slurry that is not adhered to the roller coating unit; A conveying unit is used to convey the mask slurry collected by the collecting unit to the filling unit.

6. The mask preparation device according to claim 3, characterized in that: The first coating wheel comprises a first coating wheel body and a first groove, wherein the first groove is used to store the mask slurry. The second coating wheel includes a second coating wheel body and a second groove, and the second groove is used for storing the mask slurry.

7. The mask preparation device according to claim 2, characterized in that: The first conveying unit includes a plurality of conveying rollers arranged along the predetermined direction, and the second conveying unit includes a plurality of blade rollers arranged along the predetermined direction.

8. The mask preparation device according to claim 1, characterized in that: The roller coating unit is used to apply the mask slurry filled into the roller coating unit by the filling unit to at least one surface of the silicon wafer to be masked.

9. The mask preparation device according to claim 1, characterized in that: The roller coating unit is used to apply the mask slurry filled into the roller coating unit by the filling unit to at least one side surface of the silicon wafer to be masked.

10. The mask preparation device according to claim 1, characterized in that: The rolling unit is used to apply the mask slurry filled into the rolling unit by the filling unit to at least one surface and at least one side of the silicon wafer to be masked.

11. A method for controlling a mask preparation device according to any one of claims 1 to 10, characterized in that: include: Controlling the first conveying unit to convey the silicon wafer to be masked to the roller coating unit along a predetermined direction; Controlling the filling unit to fill the mask slurry into the roller coating unit; The roller coating unit is controlled to apply the mask slurry to at least one surface of the silicon wafer to be masked.

12. A method for preparing a solar cell, characterized in that: include: providing a substrate; forming a plurality of functional layers on the surface of the substrate, A multi-layer functional layer is formed on the surface of the substrate, comprising: forming a preliminary functional layer on one side of the substrate; Using the mask preparation device according to any one of claims 1 to 10, or using the control method of the mask preparation device according to claim 11, a mask layer is formed on the surface of the preliminary functional layer away from the substrate, wherein the viscosity of the mask slurry is 200 to 3000 cps; The mask layer is patterned, and the preliminary functional layer is etched through the patterned mask layer to obtain any one of the functional layers.

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