A large-size and high-precision die bonding machine

Abstract

The present application relates to a large-size, high-precision crystal bonding machine, including: an operating table, on which a gantry is provided; a vacuum adsorption platform, which is longitudinally slidably arranged on the operating table, and the vacuum adsorption platform supports and adsorbs film materials; a support assembly, which is arranged on the operating table on both sides corresponding to the vacuum adsorption platform; a pin assembly, which is arranged on the operating table; and a plurality of crystal bonding assemblies, which are arranged on the gantry, wherein the crystal bonding assembly close to the vacuum adsorption platform is laterally slidably arranged on the gantry, and a plurality of the crystal bonding assemblies cooperate to adsorb the wafer to the film material on the vacuum adsorption platform; and a glue dispensing assembly, which is installed on the gantry. The present application improves the efficiency of dispensing glue for loading large-size film materials and wafers, realizes efficient crystal bonding of large-size film materials, and improves production efficiency.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a large-size and high-precision die bonding machine. Background Art

[0002] Die bonding technology is a very important technology in the semiconductor packaging process, which involves accurately fixing the semiconductor chip on the film material or substrate. This process usually uses adhesives, such as conductive adhesives or insulating adhesives, to achieve the bonding between the chip and the film material, while forming a thermal or electrical path to provide conditions for subsequent wire bonding.

[0003] With the development of the semiconductor industry, the bonding technology has been continuously improving, but there are still problems with efficiency and precision for bonding large-size film materials. Most of the bonding equipment on the market is currently aimed at small-size materials, and conventional equipment often cannot meet the bonding needs of large-size film materials. At present, the conventional practice for bonding large-size film materials is to use multiple positioning and segmented bonding, or to use special large-size bonding equipment, but these methods have problems such as low efficiency and low precision. Multiple positioning and segmented bonding affect production efficiency and bonding accuracy, and special large-size bonding equipment is expensive, which is not conducive to widespread application.

[0004] Therefore, it is necessary to propose a large-size and high-precision die bonding machine to solve one of the above-mentioned technical problems. Summary of the invention

[0005] In order to improve the problems of low efficiency and low precision in die bonding of large-sized film materials, the present application provides a large-sized and high-precision die bonding machine.

[0006] The large-size and high-precision die bonding machine provided in this application adopts the following technical solution:

[0007] A large-size and high-precision die bonding machine, comprising:

[0008] An operating table, wherein a gantry is provided on the operating table;

[0009] A vacuum adsorption platform is longitudinally slidably arranged on the operating table, and the vacuum adsorption platform supports and adsorbs the film material;

[0010] Support components, which are arranged on the operating table corresponding to two sides of the vacuum adsorption platform, and are used to support the wafer and move the wafer longitudinally or laterally;

[0011] A pin assembly, disposed on the operating table, for lifting the wafer on the supporting assembly; and

[0012] A plurality of crystal-fixing components are arranged on the gantry, wherein the crystal-fixing component close to the vacuum adsorption platform is arranged on the gantry in a transverse sliding manner, and the plurality of crystal-fixing components cooperate to adsorb the wafer to the film material of the vacuum adsorption platform, and the crystal-fixing components include a mounting frame, an adjusting cylinder and a crystal-taking welding head, wherein the mounting frame is arranged on the gantry, the adjusting cylinder is arranged on the mounting frame, a disassembly plate is arranged at the output end of the adjusting cylinder, and the crystal-taking welding head is detachably arranged on the disassembly plate for picking up and placing the wafer;

[0013] The glue dispensing component is installed on the gantry and is used for dispensing glue on the wafer placement position on the film material.

[0014] By adopting the above technical scheme, according to the actual situation, the required film material size is selected, placed on the vacuum adsorption platform and adsorbed to maintain the stability of the film material, and two loading stations are formed on the operating table corresponding to the two sides of the vacuum adsorption platform to improve the efficiency of loading and dispensing of large-size film material wafers. The wafer is supported by the support component and can be moved longitudinally or laterally. After the wafer position is adjusted, the wafer is lifted from the support component by the ejector pin component so as to be adsorbed by the corresponding solid crystal component above, and the wafer is transferred linearly to the film material through the movable solid crystal component. For large-size film materials, bidirectional multi-station transfer of the wafer to the film material is realized, and the dispensing component is used to dispense glue at the corresponding position of the film material to achieve efficient solid crystal of large-size film materials and improve production efficiency.

[0015] Optionally, the vacuum adsorption platform includes a negative pressure suction plate and a mounting base, the negative pressure suction plate is provided with a plurality of adsorption holes, the negative pressure suction plate can be divided into two areas, and the adsorption holes in the two areas can perform vacuum adsorption individually or simultaneously, the mounting base is installed on both sides of the bottom of the negative pressure suction plate, the operating table is provided with a longitudinal track, and the mounting base is slidably connected to the longitudinal track.

[0016] By adopting the above technical solution, the negative pressure suction plate is connected to an external negative pressure device to generate negative pressure adsorption, and by dividing the negative pressure suction plate into a double-zone vacuum platform design, stable use of membranes of different sizes is achieved, thereby ensuring the stability of the membrane during crystal solidification.

[0017] Optionally, the support assembly includes a longitudinal seat, a transverse seat, a connecting frame and a support ring, the longitudinal seats are respectively arranged on both sides of the operating table, the transverse seat is movably arranged on the longitudinal seat, the connecting frame is movably arranged on the transverse seat, and the support ring is fixedly connected to the connecting frame and supports the wafer.

[0018] By adopting the above technical solution, the support ring fits the wafer size and supports the wafer on the connecting frame. The position of the wafer is adjusted by the longitudinal movement of the transverse seat or the lateral movement of the connecting frame, so as to facilitate efficient loading operations.

[0019] Optionally, the ejector pin assembly includes a carrier frame, a lifting cylinder, a fixed block and a needle body, the carrier frame is arranged on the operating table, the lifting cylinder is arranged on the carrier frame, the bottom of the fixed block is connected to the output end of the lifting cylinder, and the fixed block slides on the carrier frame, and the needle body is detachably arranged on the fixed block for wafer lifting.

[0020] By adopting the above technical solution, the lifting cylinder is inside the carrier and drives the needle body on the fixed block to move up and down through its output end, thereby realizing the lifting of the wafer and the telescopic adjustment of its own height.

[0021] Optionally, the dispensing assembly includes a dispensing rack, a glue tray for holding glue liquid and a dispensing arm, the dispensing rack is installed on the gantry, the glue tray can be rotatably set on the dispensing rack, the tail end of the dispensing arm can be rotatably set on the dispensing rack, and a dipping needle is set at the front end of the dispensing arm. The dipping needle is set corresponding to the top of the glue tray, and the dipping needle is used for positioning and dispensing glue on the chip on the film material.

[0022] By adopting the above technical solution, the dispensing arm rotates from the dispensing rack to the glue tray, and contacts the glue liquid through the dipping needle, picks up the glue liquid, and rotates to the required dispensing position of the film material for dispensing. The operation is repeated according to the required dispensing position and quantity, thereby improving the efficiency of fixing the dispensing on the film material chip.

[0023] Optionally, a driving assembly is provided on the glue dispensing rack, and the driving assembly is used for horizontal rotation of the glue disc. The driving assembly includes a driving motor, a driving gear, a driven gear and a rotating rod. The driving motor is arranged on the glue dispensing rack, the driving gear is arranged on the output end of the driving motor, the rotating rod is rotatably arranged on the glue dispensing rack, the glue disc is arranged at the bottom of the rotating rod, the driven gear is arranged at the top of the rotating rod, and the driving gear and the driven gear are meshed with each other.

[0024] Optionally, a scraper is provided on the dispensing rack corresponding to the glue disc, for scraping the glue liquid when the glue disc rotates.

[0025] By adopting the above technical solution, the gradually decreasing glue liquid can be gathered so that the dipping needle can better dip into the glue liquid. The output end of the driving motor drives the driving gear to mesh the driving gear with the driven gear, so that the glue disc rotates relative to the scraper. The scraper scrapes and gathers the glue liquid, so that the glue liquid can better contact with the dipping needle.

[0026] Optionally, a swing motor is provided on the dispensing frame corresponding to the dispensing arm, and an output end of the swing motor is connected to a rear end of the dispensing arm.

[0027] By adopting the above technical solution, the output end of the swing motor drives the dispensing arm to swing, so that the dipping needle can contact the glue liquid at the glue tray and can swing back to the required dispensing position to perform the dispensing operation.

[0028] Optionally, a calibration table is arranged on the operating table below the solid crystal assembly, and a calibration adjustment seat is arranged at the bottom of the calibration table, through which the calibration table can be adjusted longitudinally or transversely, so that the calibration table can move laterally in a straight line following the support assembly, and a bottom visual inspection device is arranged on the operating table and close to the side of the calibration table.

[0029] By adopting the above technical solution, after the initial position of the chip is adsorbed, the support ring is moved laterally, and the calibration table is moved to under the chip at the initial position, the crystal fixing component places the chip on the calibration table, and returns to the initial position of the calibration table, and performs calibration and detection on the chip. After completion, the chip is adsorbed by the movable crystal fixing component and moved to the film material for placement, thereby improving the efficiency of adjusting the chip position angle, realizing linear movement adjustment, and improving the crystal fixing efficiency of the chip.

[0030] Optionally, a dispensing monitoring camera is provided on the gantry and close to the dispensing assembly for observing the dispensing status.

[0031] By adopting the above technical solution, the glue dispensing monitoring camera monitors the accuracy of glue dispensing alignment and the quality of glue dispensing, thereby ensuring the quality of the glue dispensing component during glue dispensing.

[0032] In summary, the present application includes at least one of the following beneficial technical effects:

[0033] 1. Select the required film size and place it on the vacuum adsorption platform for adsorption to maintain the stability of the film. Two loading stations are formed on the operating table corresponding to the two sides of the vacuum adsorption platform to improve the efficiency of loading and dispensing large-size film wafers. The wafer is supported by the support component and transferred to the film material in a straight line by the movable solid crystal component. For large-size film materials, bidirectional multi-station transfer of the wafer to the film material is realized, which increases the operating distance and is more suitable for the processing of large-size materials, realizing efficient solid crystal of large-size film materials and improving production efficiency.

[0034] 2. The calibration table, bottom visual inspection device and dispensing monitoring camera are equipped to effectively improve the accuracy and quality of solid crystal. The flexible configuration of vacuum adsorption platform and dispensing components enables it to adapt to different production environments and dispensing requirements, and has a wide range of applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a three-dimensional view of a large-size and high-precision die-bonding machine in this application.

[0036] Figure 2 This is a front view of a large-size, high-precision die-bonding machine (with a dispensing monitoring camera) in this application.

[0037] Figure 3 It is a three-dimensional view of a die bonding component of a large-size and high-precision die bonding machine in the present application.

[0038] Figure 4 yes Figure 1 A schematic diagram of the enlarged structure at point A in the middle.

[0039] Figure 5 yes Figure 1 A magnified schematic diagram of the structure at point B in the middle.

[0040] In the figure: 1. operating table; 11. gantry; 12. longitudinal track; 2. vacuum adsorption platform; 21. negative pressure suction plate; 22. mounting base; 23. adsorption hole; 3. support assembly; 31. longitudinal seat; 32. transverse seat; 33. connecting frame; 34. support ring; 4. ejector assembly; 41. bearing frame; 42. jacking cylinder; 43. fixing block; 44. needle body; 5. solid crystal assembly; 51. mounting frame; 52. adjustment Throttle cylinder; 53, crystal welding head; 54, disassembly and assembly tray; 6, dispensing assembly; 61, dispensing rack; 62, glue tray; 63, dispensing arm; 64, dipping needle; 65, driving assembly; 651, driving motor; 652, driving gear; 653, driven gear; 654, rotating rod; 66, scraper; 67, swing motor; 7, calibration table; 71, calibration adjustment seat; 8, bottom visual inspection device; 9, dispensing monitoring camera. DETAILED DESCRIPTION

[0041] The following is combined with the accompanying drawings Figure 1-Figure 5 This application is described in further detail.

[0042] refer to Figure 1-Figure 5 The embodiment of the present application discloses a large-size and high-precision die-bonding machine, including: an operating table 1, a vacuum adsorption platform 2, a support component 3, a pin component 4, a plurality of die-bonding components 5 and a glue dispensing component 6.

[0043] The operating table 1 is provided with a gantry 11; a vacuum adsorption platform 2 is longitudinally slidably arranged on the operating table 1, and the vacuum adsorption platform 2 supports and adsorbs the film material; support components 3 are arranged on the operating table 1 at two sides corresponding to the vacuum adsorption platform 2, and the support components 3 are used to support the wafer and move the wafer longitudinally or laterally; a pin component 4 is arranged on the operating table 1, and is used to lift the wafer on the support component 3; and

[0044] A plurality of crystal fixing components 5 are arranged on the gantry 11, wherein the crystal fixing component 5 close to the vacuum adsorption platform 2 is arranged on the gantry 11 for horizontal sliding, and the plurality of crystal fixing components 5 cooperate to adsorb the wafer to the film material of the vacuum adsorption platform 2, and the crystal fixing component 5 includes a mounting frame 51, an adjusting cylinder 52 and a crystal retrieval welding head 53, the mounting frame 51 is arranged on the gantry 11, the adjusting cylinder 52 is arranged on the mounting frame 51, and a disassembly plate 54 is arranged at the output end of the adjusting cylinder 52, and the crystal retrieval welding head 53 can be disassembled and arranged on the disassembly plate 54 for picking up and placing the wafer; the glue dispensing component 6 is installed on the gantry 11, and is used for glue dispensing at the wafer placement position on the film material.

[0045] According to the actual situation, the required film material size is selected, placed on the vacuum adsorption platform 2 and adsorbed to maintain the stability of the film material. Two loading stations are formed on the operating table 1 on both sides of the vacuum adsorption platform 2 to improve the efficiency of loading and dispensing of large-size film material wafers. The wafer is supported by the support component 3 and can be moved longitudinally or laterally. After the wafer position is adjusted, the wafer is lifted from the support component 3 by the ejector pin component 4 so that it can be adsorbed by the corresponding solid crystal component 5 above, and the wafer is transferred linearly to the film material through the movable solid crystal component 5. For large-size film materials, bidirectional multi-station transfer of the wafer to the film material is realized, and dispensing is performed at the corresponding position of the film material through the dispensing component 6 to achieve efficient solid crystal of large-size film materials and improve production efficiency.

[0046] In this embodiment, more specifically, the vacuum adsorption platform 2 includes a negative pressure suction plate 21 and a mounting base 22. The negative pressure suction plate 21 is provided with a plurality of adsorption holes 23. The negative pressure suction plate 21 can be divided into two areas, and the adsorption holes 23 in the two areas can perform vacuum adsorption individually or simultaneously. The mounting base 22 is installed on both sides of the bottom of the negative pressure suction plate 21. A longitudinal track 12 is provided on the operating table 1. The mounting base 22 is slidably connected to the longitudinal track 12. The negative pressure suction plate 21 is externally connected to a negative pressure device to generate negative pressure adsorption. By dividing the negative pressure suction plate 21 into a dual-zone vacuum platform design, the stable use of membrane materials of different sizes can be achieved, thereby ensuring the stability of the membrane material during solid crystal bonding.

[0047] In this embodiment, more specifically, the support assembly 3 includes a longitudinal seat 31, a transverse seat 32, a connecting frame 33 and a support ring 34. The longitudinal seats 31 are respectively arranged on both sides of the operating table 1, the transverse seat 32 is movably arranged on the longitudinal seat 31, the connecting frame 33 is movably arranged on the transverse seat 32, and the support ring 34 is fixedly connected to the connecting frame 33 and supports the wafer. The support ring 34 fits the size of the wafer and supports the wafer on the connecting frame 33. The position of the wafer is adjusted by the longitudinal movement of the transverse seat 32 or the transverse movement of the connecting frame 33 to facilitate convenient and efficient loading operations.

[0048] In this embodiment, more specifically, the ejector assembly 4 includes a carrier frame 41, a lifting cylinder 42, a fixed block 43 and a needle body 44. The carrier frame 41 is arranged on the operating table 1, the lifting cylinder 42 is arranged on the carrier frame 41, the bottom of the fixed block 43 is connected to the output end of the lifting cylinder 42, and the fixed block 43 slides on the carrier frame 41, and the needle body 44 is detachably arranged on the fixed block 43 for lifting the wafer. The lifting cylinder 42 is in the carrier frame 41, and drives the needle body 44 on the fixed block 43 to rise and fall through its output end, so as to realize the lifting of the wafer and the telescopic adjustment of its own height.

[0049] In this embodiment, more specifically, the glue dispensing assembly 6 includes a glue dispensing rack 61, a glue tray 62 for containing glue liquid and a glue dispensing arm 63. The glue dispensing rack 61 is installed on the gantry 11, the glue tray 62 can be rotatably set at the glue dispensing rack 61, the tail end of the glue dispensing arm 63 can be rotatably set on the glue dispensing rack 61, and a dipping needle 64 is set at the front end of the glue dispensing arm 63. The dipping needle 64 is set above the glue tray 62, and the dipping needle 64 is used for positioning glue dispensing on the chip on the film material. The glue dispensing arm 63 rotates from the glue dispensing rack 61 to the glue tray 62, and contacts the glue liquid through the dipping needle 64, picks up the glue liquid, and rotates to the required glue dispensing position of the film material for glue dispensing. According to the required glue dispensing position and quantity, the operation is repeated to improve the efficiency of fixing the glue dispensing on the film material chip.

[0050] In this embodiment, more specifically, a driving assembly 65 is provided on the dispensing frame 61, and the driving assembly 65 is used for horizontal rotation of the glue disc 62. The driving assembly 65 includes a driving motor 651, a driving gear 652, a driven gear 653 and a rotating rod 654. The driving motor 651 is provided on the dispensing frame 61, the driving gear 652 is provided on the output end of the driving motor 651, the rotating rod 654 is rotatably provided on the dispensing frame 61, the glue disc 62 is provided at the bottom of the rotating rod 654, and the driven gear 653 is provided at the top of the rotating rod 654. The driving gear 652 and the driven gear 653 are meshed with each other. A scraper 66 is arranged in the corresponding glue disc 62 on the glue dispensing frame 61, which is used to scrape the glue when the glue disc 62 rotates, and can gather the gradually decreasing glue so that the dipping needle 64 can better dip the glue. The output end of the driving motor 651 drives the driving gear 652, and the driving gear 652 is meshed with the driven gear 653, so that the glue disc 62 rotates relative to the scraper 66, and the glue is scraped and gathered by the scraper 66, so that the glue can better contact with the dipping needle 64.

[0051] In this embodiment, more specifically, a swing motor 67 is provided on the dispensing frame 61 corresponding to the dispensing arm 63, and the output end of the swing motor 67 is connected to the rear end of the dispensing arm 63. The output end of the swing motor 67 drives the dispensing arm 63 to swing, so that the dipping needle 64 can contact the glue liquid at the glue disk 62 and can swing back to the desired dispensing position to perform the dispensing operation.

[0052] In this embodiment, more specifically, a calibration table 7 is arranged below the operating table 1 corresponding to the solid crystal component 5, and a calibration adjustment seat 71 is arranged at the bottom of the calibration table 7. The calibration table 7 can be adjusted longitudinally or transversely through the calibration adjustment seat 71, so that the calibration table 7 can move laterally and linearly with the support component 3. A bottom visual inspection device 8 is arranged on the operating table 1 and on the side close to the calibration table 7 to perform bottom inspection to detect whether there is a defective or upside-down chip at the bottom. After the initial position adsorption is completed, the support ring 34 is moved laterally, and the calibration table 7 is moved to below the chip at the initial position. The solid crystal component 5 places the chip on the calibration table 7 and returns to the initial position of the calibration table 7 to perform calibration inspection on the chip. After completion, the chip is adsorbed by the movable solid crystal component 5 and moved to the film material for placement, thereby improving the efficiency of adjusting the chip position angle, and realizing linear movement adjustment, thereby improving the solid crystal efficiency of the chip.

[0053] In this embodiment, more specifically, a dispensing monitoring camera 9 is provided on the gantry 11 and near the dispensing component 6 for observing the dispensing status. The dispensing monitoring camera 9 monitors the accuracy of dispensing alignment and the quality of dispensing to ensure the quality of the dispensing component 6 during dispensing.

[0054] The implementation principle of a large-size and high-precision crystal bonding machine in the embodiment of the present application is as follows: select the required film material size, place it on the vacuum adsorption platform 2 and adsorb it to maintain the stability of the film material, form two loading stations on the operating table 1 corresponding to the two sides of the vacuum adsorption platform 2, support the wafer through the support component 3, and be able to move the wafer longitudinally or laterally. After the wafer position is adjusted, lift the wafer from the support component 3 through the ejector pin component 4, and transfer the wafer linearly to the film material through the movable crystal bonding component 5, and perform glue dispensing at the corresponding position of the film material through the glue dispensing component 6, so as to achieve efficient crystal bonding of large-size film materials.

[0055] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A large-size and high-precision die-bonding machine, characterized in that: include: An operating platform (1), wherein a gantry (11) is provided on the operating platform (1); A vacuum adsorption platform (2) is longitudinally slidably arranged on the operating table (1), the vacuum adsorption platform (2) supports and adsorbs the film material, the vacuum adsorption platform (2) comprises a negative pressure adsorption plate (21), the negative pressure adsorption plate (21) is provided with a plurality of adsorption holes (23), the negative pressure adsorption plate (21) can be divided into two areas, and the adsorption holes (23) in the two areas can perform vacuum adsorption independently or simultaneously; Support components (3) are arranged on the operating table (1) corresponding to the two sides of the vacuum adsorption platform (2), and the support components (3) are used to support the wafer and move the wafer longitudinally or laterally; A pin assembly (4) is arranged on the operating table (1) and is used to lift the wafer on the supporting assembly (3); and A plurality of crystal fixing components (5) are arranged on the gantry (11), wherein the crystal fixing component (5) close to the vacuum adsorption platform (2) is arranged on the gantry (11) in a transversely sliding manner, and the plurality of crystal fixing components (5) cooperate to adsorb the wafer onto the film material of the vacuum adsorption platform (2), and the crystal fixing component (5) comprises a mounting frame (51), an adjusting cylinder (52) and a crystal taking welding head (53), wherein the mounting frame (51) is arranged on the gantry (11), the adjusting cylinder (52) is arranged on the mounting frame (51), and a disassembly plate (54) is arranged at the output end of the adjusting cylinder (52), and the crystal taking welding head (53) is detachably arranged on the disassembly plate (54) for picking up and placing the wafer; A glue dispensing assembly (6) is mounted on the gantry (11) and is used for dispensing glue on the wafer placement location on the film material. The glue dispensing assembly (6) comprises a glue dispensing frame (61), a glue tray (62) for containing glue liquid, and a glue dispensing arm (63). The glue dispensing frame (61) is mounted on the gantry (11), the glue tray (62) is rotatably arranged on the glue dispensing frame (61), the tail end of the glue dispensing arm (63) is rotatably arranged on the glue dispensing frame (61), and the front end of the glue dispensing arm (63) is rotatably arranged on the glue dispensing frame (61). A dipping needle (64) is provided, and the dipping needle (64) is provided above the glue disc (62). The dipping needle (64) is used for positioning and dispensing glue on the wafer on the film material. A scraper (66) is provided on the glue dispensing frame (61) corresponding to the glue disc (62) and is used for scraping glue liquid when the glue disc (62) rotates. A swing motor (67) is provided on the glue dispensing frame (61) corresponding to the glue dispensing arm (63). The output end of the swing motor (67) is connected to the rear end of the glue dispensing arm (63).

2. A large-size and high-precision die bonding machine according to claim 1, characterized in that: The vacuum adsorption platform (2) comprises a mounting base (22), wherein the mounting base (22) is mounted on both sides of the bottom of the negative pressure suction plate (21), and a longitudinal track (12) is arranged on the operating table (1), and the mounting base (22) is slidably connected to the longitudinal track (12).

3. A large-size and high-precision die bonding machine according to claim 1, characterized in that: The support assembly (3) comprises a longitudinal seat (31), a transverse seat (32), a connecting frame (33) and a supporting ring (34); the longitudinal seat (31) is respectively arranged on both sides of the operating table (1); the transverse seat (32) is movably arranged on the longitudinal seat (31); the connecting frame (33) is movably arranged on the transverse seat (32); and the supporting ring (34) is fixedly connected to the connecting frame (33) and supports the wafer.

4. The large-size and high-precision die bonding machine according to claim 1, characterized in that: The ejector pin assembly (4) comprises a carrier frame (41), an ejection cylinder (42), a fixed block (43) and a needle body (44); the carrier frame (41) is arranged on the operating table (1); the ejection cylinder (42) is arranged on the carrier frame (41); the bottom of the fixed block (43) is connected to the output end of the ejection cylinder (42); the fixed block (43) slides on the carrier frame (41); and the needle body (44) is detachably arranged on the fixed block (43) for wafer ejection.

5. The large-size and high-precision die bonding machine according to claim 1, characterized in that: The glue dispensing frame (61) is provided with a driving assembly (65), and the driving assembly (65) is used for horizontally rotating the glue disc (62). The driving assembly (65) comprises a driving motor (651), a driving gear (652), a driven gear (653) and a rotating rod (654). The driving motor (651) is arranged on the glue dispensing frame (61), the driving gear (652) is arranged on the output end of the driving motor (651), the rotating rod (654) is rotatably arranged on the glue dispensing frame (61), the glue disc (62) is arranged at the bottom of the rotating rod (654), the driven gear (653) is arranged at the top of the rotating rod (654), and the driving gear (652) and the driven gear (653) are meshed with each other.

6. The large-size and high-precision die bonding machine according to claim 1, characterized in that: A calibration platform (7) is arranged on the operating table (1) below the die-bonding assembly (5), and a calibration adjustment seat (71) is arranged at the bottom of the calibration platform (7). The calibration platform (7) can be adjusted longitudinally or transversely through the calibration adjustment seat (71), so that the calibration platform (7) can move laterally in a straight line following the support assembly (3). A bottom visual inspection device (8) is arranged on the operating table (1) and on the side close to the calibration platform (7).

7. The large-size and high-precision die bonding machine according to claim 1, characterized in that: A glue dispensing monitoring camera (9) is arranged on the gantry (11) and close to the glue dispensing component (6) for observing the glue dispensing state.

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