Three-dimensional stacked ceramic packaging structure and preparation method thereof

Abstract

The invention provides a three-dimensional stacked ceramic packaging structure and a preparation method thereof. The structure comprises a ceramic shell and a ceramic cover plate, the upper surface of the ceramic shell is provided with at least one cavity, and at least one chip mounting area is arranged in the cavity; wherein the chip mounting area is used for mounting a chip; a plurality of first shell signal transmission holes are also formed in the outer side surface of the ceramic shell; the lower surface of the ceramic cover plate is provided with at least one chip mounting area; a plurality of cover plate signal transmission holes are formed in the side surface of the ceramic cover plate; the ceramic cover plate is arranged on the upper surface of the ceramic shell, and the plurality of cover plate signal transmission holes are in one-to-one correspondence with the plurality of first shell signal transmission holes. The integration level of the ceramic packaging structure can be further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic packaging, and in particular to a three-dimensional stacked ceramic packaging structure and a preparation method thereof. Background Art

[0002] As the demand for high isolation and high integration packaging of isolation transformers becomes increasingly urgent, ceramic packaging shells with good insulation performance and multi-chip packaging have become the preferred packaging form for isolation transformers.

[0003] In the related art, the chip packaging integration is mainly improved by arranging multiple chips in a ceramic base or a ceramic housing. The inventors found that the improvement of the integration in this way is mainly concentrated in the ceramic base or the ceramic housing, and the improvement of the packaging integration is limited. Summary of the invention

[0004] The embodiment of the present invention provides a three-dimensional stacked ceramic packaging structure and a preparation method thereof, so as to further improve the integration of the ceramic packaging structure.

[0005] In a first aspect, an embodiment of the present invention provides a three-dimensional stacked ceramic packaging structure, including a ceramic housing and a ceramic cover plate;

[0006] The upper surface of the ceramic housing is provided with at least one cavity, and at least one chip mounting area is provided in the cavity; wherein the chip mounting area is used to mount a chip; and the outer side surface of the ceramic housing is also provided with a plurality of first housing signal transmission holes;

[0007] The lower surface of the ceramic cover is provided with at least one chip mounting area; the side surface of the ceramic cover is provided with a plurality of cover signal transmission holes;

[0008] The ceramic cover is arranged on the upper surface of the ceramic shell, and the plurality of cover signal transmission holes correspond one-to-one to the plurality of first shell signal transmission holes.

[0009] In this embodiment, at least one chip mounting area is provided on the lower surface of the ceramic cover plate, and at least one chip can be provided on the lower surface of the ceramic cover plate, so that the ceramic shell and the ceramic cover plate can be used simultaneously to improve the integration of the package; and through the cover plate signal transmission hole and the first shell signal transmission hole, the signal of the chip provided on the lower surface of the ceramic cover plate is transmitted to the ceramic shell to ensure signal transmission.

[0010] In a possible implementation, the three-dimensional stacked ceramic packaging structure further includes a sealed housing;

[0011] The upper surface of the ceramic cover plate is provided with at least one chip mounting area;

[0012] The sealing shell is arranged above the ceramic cover plate and is used for sealing the chip arranged on the upper surface of the ceramic cover plate.

[0013] In this embodiment, by providing a chip mounting area on the upper surface of the ceramic cover plate and providing a sealing shell, a chip can be mounted on the upper surface of the ceramic cover plate and the chip can be sealed, thereby further improving the utilization rate of the ceramic cover plate.

[0014] In a possible implementation, the sealed housing is a ceramic sealed housing;

[0015] The lower surface of the ceramic sealing shell is provided with at least one chip mounting area;

[0016] The outer side surface of the ceramic sealing shell is provided with a plurality of second shell signal transmission holes, and the plurality of second shell signal transmission holes correspond one to one with the plurality of cover plate signal transmission holes.

[0017] In this embodiment, the sealed housing may be a ceramic sealed housing, and a chip may be arranged in the ceramic sealed housing, thereby increasing the number of chips that can be installed and improving the integration of chip packaging.

[0018] In a possible implementation manner, the sealed housing is a metal cover plate.

[0019] In a possible implementation, at least one step is provided in the cavity, and a surface of the step is lower than an upper surface of the ceramic shell;

[0020] A ceramic substrate is respectively arranged on the table surface of each step, and at least one chip mounting area is respectively arranged on the upper surface of each ceramic substrate.

[0021] In a possible implementation manner, at least one chip mounting area is respectively disposed on the lower surface of each ceramic substrate.

[0022] In this embodiment, a step is provided in the cavity of the ceramic shell, and a ceramic substrate is provided on the step, so that the cavity can be divided into multiple cavities. By installing chips on the upper and lower surfaces of the ceramic substrate, the number of chips provided in the cavity can be increased, thereby improving the integration of the packaged chips in the ceramic shell.

[0023] In a possible implementation, a metal pad is provided on the step;

[0024] The ceramic substrate is interconnected with the ceramic housing through metal pads on the corresponding steps.

[0025] In a possible implementation, a first sealing area is provided on the upper surface of the ceramic housing, and a second sealing area is provided on the lower surface of the ceramic cover plate;

[0026] The position of the first sealing area corresponds to the position of the second sealing area.

[0027] In a possible implementation manner, at least one resistor and capacitor element is disposed in the cavity.

[0028] In a second aspect, an embodiment of the present invention provides a method for preparing a three-dimensional stacked ceramic packaging structure, which is used to prepare the three-dimensional stacked ceramic packaging structure as described in the first aspect or any possible implementation of the first aspect; the method comprises:

[0029] Based on the high temperature co-fired ceramic technology, via holes and cavities are punched on a first preset number of first ceramic sheets, metallization slurry is filled in the holes, and signal lines are printed on the first ceramic sheets; via holes are punched on a second preset number of second ceramic sheets, metallization slurry is filled in the holes, and signal lines are printed on the second ceramic sheets;

[0030] Stacking and laminating a first preset number of first ceramic sheets to obtain a first green ceramic body, and stacking and laminating a second preset number of second ceramic sheets to obtain a second green ceramic body;

[0031] Slicing the side surfaces of the first green ceramic body and the second green ceramic body to form a transmission hole structure, metallizing the transmission hole structure, and sintering at a high temperature to obtain a first ceramic body and a second ceramic body;

[0032] The first ceramic body and the second ceramic body are electroplated with nickel and gold to obtain a ceramic shell and a ceramic cover plate; wherein the gold-plated area on the inner surface of the cavity of the ceramic shell is provided with at least one chip mounting area, and the gold-plated area on the lower surface of the ceramic cover plate is provided with at least one chip mounting area.

[0033] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0034] The embodiment of the present invention can arrange at least one chip mounting area in the cavity of the ceramic shell, so that at least one chip can be arranged in the cavity, and can arrange at least one chip mounting area on the lower surface of the ceramic cover plate, so that at least one chip can be arranged on the lower surface of the ceramic cover plate, and the ceramic shell and the ceramic cover plate can be used simultaneously to improve the integration of the package; and, by arranging a plurality of first shell signal transmission holes on the outer side surface of the ceramic shell, and a plurality of cover plate signal transmission holes on the side surface of the ceramic cover plate, the plurality of cover plate signal transmission holes correspond one-to-one to the plurality of first shell signal transmission holes, and the signal of the chip arranged on the lower surface of the ceramic cover plate can be transmitted to the ceramic shell through the cover plate signal transmission holes and the first shell signal transmission holes, thereby ensuring the transmission of the signal, so that the ceramic cover plate can not only play the role of airtight packaging, but also can weld the chip and transmit the signal, thereby further improving the integration of the package. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 is a structural schematic diagram of a three-dimensional stacked ceramic packaging structure provided by an embodiment of the present invention;

[0037] Figure 2 is a three-dimensional schematic diagram of a three-dimensional stacked ceramic packaging structure provided by an embodiment of the present invention;

[0038] Figure 3 is a signal schematic diagram of a three-dimensional stacked ceramic packaging structure provided by an embodiment of the present invention;

[0039] Figure 4 is a structural schematic diagram of another three-dimensional stacked ceramic packaging structure provided by an embodiment of the present invention;

[0040] Figure 5 It is a structural schematic diagram of a ceramic packaging structure provided with a sealed housing provided in an embodiment of the present invention;

[0041] Figure 6 is a structural schematic diagram of another ceramic packaging structure provided with a sealed housing provided in an embodiment of the present invention;

[0042] Figure 7 is a structural schematic diagram of a ceramic packaging structure with steps provided in an embodiment of the present invention;

[0043] Figure 8 is a schematic structural diagram of another ceramic packaging structure with steps provided in an embodiment of the present invention;

[0044] Fig. 9 It is a flow chart of the implementation of the method for preparing the three-dimensional stacked ceramic packaging structure provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0045] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present invention. However, it should be clear to those skilled in the art that the present invention may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present invention.

[0046] The inventors have found that in order to improve the integration of chip packaging, multiple chips are usually arranged in a ceramic housing, but the improvement of chip packaging integration in this way is limited. Therefore, it is necessary to consider a new chip packaging structure.

[0047] In order to further improve the integration of the ceramic packaging structure, the inventors found that conventional ceramic housings usually use metal cover plates, which are welded airtightly using gold-tin solder, and the cover plates here only play the role of airtight packaging. Based on this, in the embodiment of the present invention, a ceramic cover plate is provided, and a chip can also be provided on the lower surface of the ceramic cover plate, so that the ceramic cover plate not only plays the role of airtight packaging, but also can weld the chip, thereby increasing the number of chips that can be provided in the ceramic packaging structure, thereby improving the integration of the chip package.

[0048] In order to make the purpose, technical solutions and advantages of the present invention more clear, specific embodiments will be described below in conjunction with the accompanying drawings.

[0049] Figure 1 A schematic diagram of a three-dimensional stacked ceramic packaging structure provided by an embodiment of the present invention, Figure 2 A three-dimensional schematic diagram of a three-dimensional stacked ceramic packaging structure provided by an embodiment of the present invention, wherein Figure 1 and Figure 2 The arrangement of the upper surface of the ceramic housing shown is only one possible implementation mode, which is not limited here, and is described in detail as follows:

[0050] The three-dimensional stacked ceramic packaging structure includes a ceramic housing 11 and a ceramic cover plate 12 .

[0051] The upper surface of the ceramic housing 11 is provided with at least one cavity 111 , and at least one chip mounting area 112 is provided in the cavity 111 ; wherein the chip mounting area 112 is used to mount the chip 21 ; the outer side of the ceramic housing 11 is also provided with a plurality of first housing signal transmission holes 113 .

[0052] At least one chip mounting area 121 is disposed on the lower surface of the ceramic cover plate 12 ; and a plurality of cover plate signal transmission holes 122 are disposed on the side surface of the ceramic cover plate 12 .

[0053] The ceramic cover plate 12 is disposed on the upper surface of the ceramic housing 11 , and the plurality of cover plate signal transmission holes 122 correspond one-to-one to the plurality of first housing signal transmission holes 113 .

[0054] In this embodiment, the chip mounting area 112 in the cavity 111 of the ceramic housing 11 is used to mount the chip 21, and correspondingly, the chip mounting area 121 on the lower surface of the ceramic cover 12 is used to mount the chip 22 so as to seal the chip. The chip can be mounted by means of pads or bonding wires.

[0055] Here, at least one chip may be mounted in the chip mounting areas 112 and 121. Figure 1 The installation of the chip is only schematically shown and is not intended to be limiting.

[0056] In this embodiment, a plurality of first housing signal transmission holes 113 are provided on the outer side of the ceramic housing 11, and the chip 21 installed in the ceramic housing 11 can be connected to the first housing signal transmission holes through the internal signal wires in the ceramic housing 11 to achieve signal transmission. The plurality of first housing signal transmission holes 113 can be evenly distributed or unevenly distributed, that is, some of the first housing signal transmission holes 113 are close to each other, and some of the first housing signal transmission holes 113 are far from each other.

[0057] See also Figure 3 The signal schematic diagram of the three-dimensional stacked ceramic packaging structure shown in the figure, in this embodiment, a plurality of cover plate signal transmission holes 122 are arranged on the outer side surface of the ceramic cover plate 12, and the chip 22 installed on the lower surface of the ceramic cover plate 12 can be connected to the cover plate signal transmission hole 122 through the internal signal line in the ceramic cover plate 12 to realize signal transmission.

[0058] In addition, multiple cover plate signal transmission holes 122 correspond one-to-one to multiple first shell signal transmission holes 113. The signal of the chip 22 installed under the ceramic cover plate 12 can be transmitted to the cover plate signal transmission hole 122 through the internal signal line in the ceramic cover plate 12, and then transmitted to the corresponding first shell signal transmission hole 113, thereby realizing signal interaction between the chip 22 installed on the lower surface of the ceramic cover plate 12 and the chip 21 installed in the ceramic shell 11.

[0059] In addition, a plurality of back solder pads 13 may be provided on the bottom surface of the ceramic shell 11, and the signals of the chip 22 mounted on the lower surface of the ceramic cover plate 12 and the chip 21 mounted in the ceramic shell 11 may be transmitted to the back solder pads 13 through the first shell signal transmission hole 113 to realize board-level signal interconnection.

[0060] The embodiment of the present invention can arrange at least one chip mounting area in the cavity of the ceramic shell, so that at least one chip can be arranged in the cavity, and can arrange at least one chip mounting area on the lower surface of the ceramic cover plate, so that at least one chip can be arranged on the lower surface of the ceramic cover plate, and the ceramic shell and the ceramic cover plate can be used simultaneously to improve the integration of the package; and, by arranging a plurality of first shell signal transmission holes on the outer side surface of the ceramic shell, and a plurality of cover plate signal transmission holes on the side surface of the ceramic cover plate, the plurality of cover plate signal transmission holes correspond one-to-one to the plurality of first shell signal transmission holes, and the signal of the chip arranged on the lower surface of the ceramic cover plate can be transmitted to the ceramic shell through the cover plate signal transmission holes and the first shell signal transmission holes, thereby ensuring the transmission of the signal, so that the ceramic cover plate can not only play the role of airtight packaging, but also can weld the chip and transmit the signal, thereby further improving the integration of the package.

[0061] Optional, such as Figure 1 As shown, in this embodiment, a first sealing area 114 is disposed on the upper surface of the ceramic housing 11 , and a second sealing area 123 is disposed on the lower surface of the ceramic cover plate 12 ; the position of the first sealing area 114 corresponds to the position of the second sealing area 123 .

[0062] In this embodiment, solder may be placed at the first sealing area 114 and the second sealing area 123 to weld the ceramic housing 11 and the ceramic cover plate 12 , thereby achieving airtight packaging of the chip.

[0063] Here, solder can also be placed at the first shell signal transmission hole 113 around the first sealing area 114 and at the cover signal transmission hole 122 around the second sealing area 123 to weld the first shell signal transmission hole 113 and the cover signal transmission hole 122 to achieve interconnection through the wetting and climbing action of the solder.

[0064] The solder may be gold-tin solder.

[0065] Optional, see Figure 4 As shown in the structural schematic diagram of another three-dimensional stacked ceramic packaging structure, at least one RC element 115 can be arranged in the cavity 111 of this embodiment. By setting the RC element 115, the integration of the device packaging can be improved and the size of the overall system after board-level installation can be reduced. Figure 4 The reference numeral 40 indicates a bonding wire.

[0066] In some embodiments, see Figure 5 A structural schematic diagram of a ceramic packaging structure provided with a sealed shell is shown, wherein the three-dimensional stacked ceramic packaging structure also includes a sealed shell 14; at least one chip mounting area 124 is provided on the upper surface of the ceramic cover plate 12; the sealed shell 14 is arranged above the ceramic cover plate 12, and is used to seal the chip 23 arranged on the upper surface of the ceramic cover plate 12.

[0067] In this embodiment, a chip mounting area 124 may be provided on the upper surface of the ceramic cover plate 12 to mount the chip 23. In order to hermetically package the chip 23 on the upper surface of the ceramic cover plate 12, a sealing housing 14 may be provided on the ceramic cover plate 12.

[0068] Here, the chip 23 can be transmitted to the cover plate signal transmission hole 122 through the internal signal line in the ceramic cover plate 12 to achieve signal interaction with the chip 21 and the chip 22 .

[0069] Optionally, the sealed housing 14 in this embodiment may be a metal cover plate, through which the chip 23 disposed on the upper surface of the ceramic cover plate 12 is hermetically packaged.

[0070] Here, an inner cavity or a groove may be provided on the lower surface of the metal cover plate to ensure a space for arranging the chip 23 on the upper surface of the ceramic cover plate 12 .

[0071] As another alternative implementation, see Figure 6 The structural schematic diagram of another ceramic packaging structure with a sealed shell is shown. In this embodiment, the sealed shell 14 can also be a ceramic sealed shell; the lower surface of the ceramic sealed shell is provided with at least one chip mounting area 141; the outer side surface of the ceramic sealed shell is provided with a plurality of second shell signal transmission holes 142, and the plurality of second shell signal transmission holes 142 correspond one-to-one to the plurality of cover plate signal transmission holes 122.

[0072] In this embodiment, the sealed housing 14 may also be a ceramic sealed housing, and the chip 24 may be installed in the chip mounting area 141 in the ceramic sealed housing, further increasing the number of airtightly packaged chips. The plurality of second housing signal transmission holes 142 correspond one to one with the plurality of cover plate signal transmission holes 122, and the chip 24 may be connected to the second housing signal transmission holes 142 through the internal signal wires in the ceramic sealed housing, thereby realizing signal interaction with the chips 21, 22, and 23 through the second housing signal transmission holes 142 and the corresponding cover plate signal transmission holes 122.

[0073] Here, a cavity may be provided on the lower surface of the ceramic sealing case, and the chip mounting area 141 may be provided in the cavity.

[0074] In addition, a chip mounting area and a corresponding ceramic sealing shell or metal cover plate may be further arranged above the ceramic sealing shell to seal more chips. The number of layers of the ceramic sealing shell may be set as required and is not limited here.

[0075] In some embodiments, see Figure 7 A structural schematic diagram of a ceramic packaging structure with steps shown in FIG. Figure 8As shown in the structural schematic diagram of another ceramic packaging structure with steps, at least one layer of steps 116 is arranged in the cavity 111 of the ceramic shell 11, and the table surface of the steps 116 is lower than the upper surface of the ceramic shell 11; a ceramic substrate 117 is respectively arranged on the table surface of each step 116, and at least one chip mounting area 118 is respectively arranged on the upper surface of each ceramic substrate 117.

[0076] In this embodiment, a plurality of cavities may be provided in the cavity 111 of the ceramic housing 11, and the cavities may be divided by the ceramic substrate 117, so that the cavity 111 and the ceramic substrate 117 form a plurality of cavities. By providing a chip mounting area 112 in the cavity 111 of the ceramic housing 11, and providing a chip mounting area 118 on the upper surface of the ceramic substrate 117, chips may be provided at different heights and cavities in the ceramic housing 11, respectively, and the number of chips provided in the ceramic housing 11 may be increased, thereby improving the integration of the chip package.

[0077] Here, a plurality of substrate signal transmission holes 119 may be provided on the side of the ceramic substrate 117 , and the chip 25 provided on the ceramic substrate 117 may be connected to the substrate signal transmission hole 119 through internal signal lines in the ceramic substrate 117 , and then connected to the ceramic housing 11 .

[0078] Optionally, in this embodiment, the lower surface of each ceramic substrate 117 can also be respectively provided with at least one chip mounting area (not shown in the figure) for setting the chip, so that chips can be set on the upper and lower surfaces of each ceramic substrate 117, thereby increasing the number of packaged chips and improving the packaging integration.

[0079] Optionally, in this embodiment, a metal pad is provided on the step 116 ; the ceramic substrate 117 is interconnected with the ceramic housing 11 via the corresponding metal pad on the step 116 .

[0080] In this embodiment, the ceramic substrate 117 can be fixed by providing a metal pad to ensure the stability of the ceramic substrate 117. The signal of the chip provided on the ceramic substrate 117 can be transmitted to the substrate signal transmission hole 119 through the internal signal line in the ceramic substrate 117, and then transmitted to the ceramic housing 11 through the connected metal pad.

[0081] The embodiment of the present invention can arrange at least one chip mounting area in the cavity of the ceramic shell, so that at least one chip can be arranged in the cavity, and can arrange at least one chip mounting area on the lower surface of the ceramic cover plate, so that at least one chip can be arranged on the lower surface of the ceramic cover plate, and the ceramic shell and the ceramic cover plate can be used simultaneously to improve the integration of the package; and, by arranging a plurality of first shell signal transmission holes on the outer side surface of the ceramic shell, and a plurality of cover plate signal transmission holes on the side surface of the ceramic cover plate, the plurality of cover plate signal transmission holes correspond one-to-one to the plurality of first shell signal transmission holes, and the signal of the chip arranged on the lower surface of the ceramic cover plate can be transmitted to the ceramic shell through the cover plate signal transmission holes and the first shell signal transmission holes, thereby ensuring the transmission of the signal, so that the ceramic cover plate can not only play the role of airtight packaging, but also can weld the chip and transmit the signal, thereby further improving the integration of the package. In addition, a chip is arranged on the upper surface of the ceramic cover plate, and an additional sealing shell is provided to seal the chip on the upper surface of the ceramic cover plate, so that the number of chips that can be installed can be further increased; at least one step is provided in the cavity of the ceramic shell, and a ceramic substrate is provided on the table of each step, and chips can be respectively arranged on the upper and lower surfaces of the ceramic substrate, so that the number of chips that can be installed is increased, thereby improving the integration of chip packaging.

[0082] It should be understood that the order of execution of the steps in the above embodiment does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0083] The following is a method embodiment of the present invention. For details not described in detail, reference can be made to the corresponding structural embodiments described above.

[0084] Fig. 9 The following is a flowchart of a method for preparing a three-dimensional stacked ceramic packaging structure provided by an embodiment of the present invention. The method is used to prepare a three-dimensional stacked ceramic packaging structure in any possible implementation manner in the above structural embodiments. For ease of explanation, only the parts related to the embodiments of the present invention are shown, which are described in detail as follows:

[0085] Step S901, based on high-temperature co-fired ceramic technology, punching vias and cavities on a first preset number of first ceramic sheets, filling the holes with metallization slurry, and printing signal lines on the first ceramic sheets; punching vias on a second preset number of second ceramic sheets, filling the holes with metallization slurry, and printing signal lines on the second ceramic sheets.

[0086] Step S902 , stacking and laminating a first preset number of first ceramic sheets to obtain a first green ceramic body, and stacking and laminating a second preset number of second ceramic sheets to obtain a second green ceramic body.

[0087] Step S903, cutting the side surfaces of the first green ceramic body and the second green ceramic body to form a transmission hole structure, metallizing the transmission hole structure, and sintering at a high temperature to obtain a first ceramic body and a second ceramic body.

[0088] Step S904, electroplating nickel and gold on the first ceramic body and the second ceramic body to obtain a ceramic shell and a ceramic cover; wherein the gold-plated area on the inner surface of the cavity of the ceramic shell is provided with at least one chip mounting area, and the gold-plated area on the lower surface of the ceramic cover is provided with at least one chip mounting area.

[0089] In this embodiment, scribing may be performed by a high-power ultraviolet laser.

[0090] In addition, the chip to be packaged can be installed in the chip mounting area of ​​the ceramic shell and the ceramic cover plate. Afterwards, solder can be placed in the first sealing area, the first shell signal transmission hole, the second sealing area and the cover plate signal transmission hole to weld the ceramic shell and the ceramic cover plate to achieve airtight packaging of the chip.

[0091] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0092] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention.

Claims

1. A three-dimensional stacked ceramic packaging structure, characterized in that: including a ceramic housing and a ceramic cover; The upper surface of the ceramic housing is provided with at least one cavity, and at least one chip mounting area is provided in the cavity; wherein the chip mounting area is used to mount a chip; and the outer side surface of the ceramic housing is also provided with a plurality of first housing signal transmission holes; The lower surface of the ceramic cover is provided with at least one chip mounting area; the side surface of the ceramic cover is provided with a plurality of cover signal transmission holes; The ceramic cover is arranged on the upper surface of the ceramic shell, and the plurality of cover signal transmission holes correspond one-to-one to the plurality of first shell signal transmission holes.

2. The three-dimensional stacked ceramic packaging structure according to claim 1, characterized in that: The three-dimensional stacked ceramic packaging structure also includes a sealed housing; The upper surface of the ceramic cover plate is provided with at least one chip mounting area; The sealing shell is arranged above the ceramic cover plate and is used for sealing the chip arranged on the upper surface of the ceramic cover plate.

3. The three-dimensional stacked ceramic packaging structure according to claim 2, characterized in that: The sealed shell is a ceramic sealed shell; The lower surface of the ceramic sealing shell is provided with at least one chip mounting area; The outer side surface of the ceramic sealing shell is provided with a plurality of second shell signal transmission holes, and the plurality of second shell signal transmission holes correspond one to one with the plurality of cover plate signal transmission holes.

4. The three-dimensional stacked ceramic packaging structure according to claim 2, characterized in that: The sealed housing is a metal cover plate.

5. The three-dimensional stacked ceramic packaging structure according to any one of claims 1 to 4, characterized in that: At least one step is provided in the cavity, and the surface of the step is lower than the upper surface of the ceramic shell; A ceramic substrate is respectively arranged on the table surface of each step, and at least one chip mounting area is respectively arranged on the upper surface of each ceramic substrate.

6. The three-dimensional stacked ceramic packaging structure according to claim 5, characterized in that: At least one chip mounting area is disposed on the lower surface of each ceramic substrate.

7. The three-dimensional stacked ceramic packaging structure according to claim 5, characterized in that: A metal pad is provided on the step; The ceramic substrate is interconnected with the ceramic housing through metal pads on the corresponding steps.

8. The three-dimensional stacked ceramic packaging structure according to any one of claims 1 to 4, characterized in that: The upper surface of the ceramic shell is provided with a first sealing area, and the lower surface of the ceramic cover plate is provided with a second sealing area; The position of the first sealing area corresponds to the position of the second sealing area.

9. The three-dimensional stacked ceramic packaging structure according to any one of claims 1 to 4, characterized in that: At least one resistor and capacitor element is arranged in the cavity.

10. A method for preparing a three-dimensional stacked ceramic packaging structure, characterized in that: For preparing a three-dimensional stacked ceramic packaging structure as described in any one of claims 1 to 9 above; the method comprises: Based on the high temperature co-fired ceramic technology, via holes and cavities are punched on a first preset number of first ceramic sheets, metallization slurry is filled in the holes, and signal lines are printed on the first ceramic sheets; via holes are punched on a second preset number of second ceramic sheets, metallization slurry is filled in the holes, and signal lines are printed on the second ceramic sheets; Stacking and laminating a first preset number of first ceramic sheets to obtain a first green ceramic body, and stacking and laminating a second preset number of second ceramic sheets to obtain a second green ceramic body; Slicing the side surfaces of the first green ceramic body and the second green ceramic body to form a transmission hole structure, metallizing the transmission hole structure, and sintering at a high temperature to obtain a first ceramic body and a second ceramic body; The first ceramic body and the second ceramic body are electroplated with nickel and gold to obtain a ceramic shell and a ceramic cover plate; wherein the gold-plated area on the inner surface of the cavity of the ceramic shell is provided with at least one chip mounting area, and the gold-plated area on the lower surface of the ceramic cover plate is provided with at least one chip mounting area.

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