Information processing apparatus

Abstract

The embodiment of the invention relates to the field of semiconductors, and provides an information processing device, which comprises a main connection structure, a second connection structure, a third connection structure and a fourth connection structure, the storage module is located on one side of the first surface, and at least one surface of the storage module is provided with a plurality of chips; the external connection structure is located on one side of the first surface and is configured to be electrically connected with the storage module and the information processing chip, and the information processing chip is configured to read and write data to each chip only through the external connection structure; the first supporting heat dissipation part is located on the first surface and arranged between the storage module and the main connecting structure. According to the information processing device provided by the embodiment of the invention, the number of wiring layers of the main connection structure can be reduced through the external connection structure, and the heat dissipation effect of the information processing device can be improved through the first supporting heat dissipation part.

Description

Technical Field

[0001] The present disclosure belongs to the field of semiconductors, and in particular relates to an information processing device. Background Art

[0002] Integrated Circuit (IC) is developing towards high integration, large capacity and multi-function. Especially in the field of storage modules, there is an increasing need for storage modules with high signal density and good signal integrity. The resulting problem is that the wiring between the storage module and the information processing chip is becoming more and more numerous and dense, resulting in an increasing number of wiring layers between the main connection structure used for wiring between the storage module and the information processing chip, and the thickness of the main connection structure is getting thicker. As the wiring density increases, the crosstalk between signals becomes more and more serious.

[0003] Therefore, there is an urgent need for an information processing device with a new architecture to reduce the number of wiring layers between the main connection structure between the storage module and the information processing chip. Summary of the invention

[0004] The disclosed embodiments provide an information processing device, which is at least beneficial to the number of routing layers of the main connection structure.

[0005] According to some embodiments of the present disclosure, the embodiments of the present disclosure provide an information processing device, which includes: a main connection structure, having a first surface, the first surface having an information processing chip electrically connected to the main connection structure; a storage module, located on one side of the first surface, at least one surface of the storage module having a plurality of chips; an external connection structure, located on one side of the first surface, configured to electrically connect the storage module and the information processing chip, the information processing chip being configured to read and write data to each of the chips only through the external connection structure; a first supporting heat dissipation component, located on the first surface, and arranged between the storage module and the main connection structure.

[0006] The technical solution provided by the embodiments of the present disclosure has at least the following advantages: on the one hand, the electrical connection between the storage module and the information processing chip is realized through an external connection structure independent of the main connection structure, that is, the information processing chip only realizes the reading and writing of data for each chip on the storage module through the external connection structure, that is, the wiring between the storage module and the information processing chip no longer passes through the main connection structure, thereby reducing the number of wiring layers of the main connection structure electrically connected to the information processing chip, reducing the thickness of the main connection structure, reducing the space volume occupied by the information processing device, or reducing the wiring density in the main connection structure, thereby reducing the crosstalk effect between signals; on the other hand, by arranging a first supporting heat dissipation component between the storage module and the main connection structure, it is beneficial to improve the heat dissipation effect of the information processing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0008] Figure 1 A front view of an information processing device provided by an embodiment of the present disclosure is shown.

[0009] Figure 2 A front view of an information processing device provided by another embodiment of the present disclosure is shown.

[0010] Figure 3 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0011] Figure 4 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0012] Figure 5 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0013] Figure 6 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0014] Figure 7 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0015] Figure 8 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0016] Fig. 9 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0017] Fig.10 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0018] Fig.11 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0019] Fig.12 A top view of an information processing device provided by an embodiment of the present disclosure is shown.

[0020] Fig.13 A top view of an information processing device provided by another embodiment of the present disclosure is shown.

[0021] Fig.14 A top view of an information processing device provided by yet another embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0022] In the related art, the signals required by the storage module (such as DIMM (Dual-Inline-Memory-Modules)) are led out from the SOC (System on Chip) controller end (i.e., the signal line is led out from the side of the SOC) and enters the storage module end through the system motherboard. The larger the capacity of the storage module, the denser the wiring of the system motherboard, the more serious the signal distortion caused by the crosstalk coupling between the signals, and the more layers there are in the system motherboard, the thicker the system motherboard, and the larger the space volume it occupies.

[0023] Figure 1 A front view of an information processing device provided by an embodiment of the present disclosure is shown.

[0024] like Figure 1 As shown, the information processing device 100 provided by the embodiment of the present disclosure may include a main connection structure 110 , a storage module 130 , an external connection structure 140 and a first supporting heat dissipation component 150 .

[0025] The main connection structure 110 has a first surface 111, and the first surface 111 has an information processing chip 120 electrically connected to the main connection structure 110. Figure 1 In the figure, it is assumed that the information processing chip 120 is located on the left side of the first surface 111 of the main connection structure 110, but the present disclosure is not limited thereto.

[0026] In the embodiment of the present disclosure, the main connection structure 110 may be a system mainboard, referred to as a mother board, and the main connection structure 110 and the information processing chip 120 may be electrically connected in any appropriate manner, such as welding or plugging, which is not limited in the present disclosure. The main connection structure 110 may be used to realize signal routing between the information processing chip 120 and other components, electronic components, modules, etc. other than the storage module 130, that is, different from the related art, the main connection structure 110 in the embodiment of the present disclosure no longer includes signal routing between the information processing chip 120 and the storage module 130.

[0027] In the embodiment of the present disclosure, the information processing chip 120 can be any one or more of SOC, CPU (Central Processing Unit), GPU (graphics processing unit), etc. The present disclosure does not limit the type of information processing chip, as long as it can be a chip with information processing function.

[0028] Figure 1 In the embodiment, the first surface 111 of the main connection structure 110 is taken as an example to be the upper surface relative to the Z axis, but the present disclosure is not limited thereto. Figure 1 In the three-dimensional coordinate axes shown in , the X-axis and the Y-axis form a horizontal plane, and the Z-axis is perpendicular to the horizontal plane formed by the X-axis and the Y-axis.

[0029] The storage module 130 may be located on one side of the first surface 111 of the main connection structure 110. The storage module 130 may include a chip placement member 132, and at least one surface of the chip placement member 132 may have a plurality of chips 131. The chip placement member 132 may be a PCB board or an FPC board, which is not limited in the present disclosure. The first surface (e.g., the upper surface) of the chip placement member 132 may serve as the first surface of the storage module 130, and the second surface (e.g., the lower surface) of the chip placement member 132 may serve as the second surface of the storage module 130.

[0030] Figure 1 The first surface of the storage module 130 (for example, the upper surface of the storage module 130, assuming that the upper surface of the storage module 130 is far from the main connection structure 110 and the lower surface of the storage module 130 is close to the main connection structure 110) is shown in the figure, and multiple chips 131 are provided on the first surface of the storage module 130, and each chip is a storage chip such as a DRAM (Dynamic Random Access Memory) chip for illustration, but the present disclosure does not limit the number and type of chips on each surface of the storage module. It is understandable that although Figure 1 In the figure, only the upper surface of the storage module 130 is shown to have multiple chips 131. In other embodiments, the lower surface of the storage module 130 may also have multiple chips 131. In the embodiments of the present disclosure, "multiple" means two or more than two.

[0031] In an exemplary embodiment, the storage module 130 may be a compression attached memory module (CAMM). CAMM is a memory module different from DIMM. Compared with DIMM, CAMM is thinner and utilizes Z-axis spatial structure optimization. The memory capacity can support 16GB (Gigabyte), 32GB, 64GB, 128GB and above, and can be applied to DDR5 (a computer memory specification) memory type.

[0032] In an exemplary embodiment, the compressed additional memory module may have a plurality of chips 131 on one of its surfaces along a direction perpendicular to the first surface 111 of the main connection structure 110; or, the compressed additional memory module may have a plurality of chips 131 on two opposite surfaces (for example, the upper surface and the lower surface of the storage module 130) along a direction perpendicular to the first surface 111 of the main connection structure 110.

[0033] For example, a CAMM memory module can fix a DDR5 chip in a PCB (Printed Circuit Board). A double-sided CAMM with a chip can support a capacity of 64GB or 128GB. A single-sided CAMM with a chip can support a capacity of 16GB or 32GB. CAMM memory abandons the fixing method of slots and gold fingers and uses a contact type (the contact can be located on the first surface and / or second surface of the chip placement component 132 except for the area where the chip 131 is placed, for example Figure 1 The left side of the upper surface of the memory module 130 shown in the figure realizes the circuit connection and fixation with the external connection structure 140. The contact-type circuit connection solves a series of problems such as the exposed wires, poor contact, and too long wiring of the DIMM slot. This design improves the stability of the electrical signal between the memory module 130 and the external connection structure 140, which is conducive to further improving the memory frequency of the server and terminal (such as a laptop computer, etc.) using the information processing device 100. In addition, the CAMM is thin, has a good heat dissipation effect, and has a shorter wiring, so it has lower power consumption and provides better protection for the chip, so it can be used in ultra-thin laptop computers.

[0034] The external connection structure 140 may also be located on one side of the first surface 111 of the main connection structure 110, that is, the external connection structure 140, the information processing chip 120, and the storage module 130 are all located on the same side of the main connection structure 110. The external connection structure 140 is configured to electrically connect the storage module 130 and the information processing chip 120 at the same time, so as to realize the electrical connection between the storage module 130 and the information processing chip 120 through the external connection structure 140. The information processing chip 120 is configured to read and write data to each chip 131 of the storage module 130 only through the external connection structure 140. That is, in the embodiment of the present disclosure, when the information processing chip 120 reads and writes data in the chip in the storage module 130, the read and write instructions, address instructions, data signals, etc. issued by the information processing chip 120 are all implemented through the external connection structure 140 independent of the main connection structure 110, thereby reducing the signal routing in the main connection structure 110, thereby reducing the number of signal routing layers in the main connection structure 110, reducing the thickness h1 of the main connection structure 110 along the Z axis, or reducing the signal routing density in the main connection structure 110, and avoiding distortion caused by signal interference. h1 is a real number greater than 0.

[0035] In an exemplary embodiment, the external connection structure 140 and / or the main connection structure 110 may be a flexible printed circuit (FPC). In other embodiments, the external connection structure 140 and / or the main connection structure 110 may also be a PCB. In the following embodiments, the external connection structure 140 is an FPC and the main connection structure 110 is a PCB for illustration. In the disclosed embodiment, the FPC is more flexible and can be very thin, thereby further reducing the space volume occupied by the information processing device. At the same time, by using an FPC independent of the PCB to realize the signal routing between the information processing chip and the storage module, the difficulty of PCB layout can be reduced and the PCB area can be reduced.

[0036] The information processing device provided by the embodiment of the present disclosure utilizes the space advantage of the Z axis, introduces solder ball connection or direct plug-in connection, connects the information processing chip and the storage module through FPC, and makes the wiring between the storage module and the information processing chip independent of the system motherboard, thereby reducing the number of layers of the system motherboard (i.e., the main connection structure), and further reducing the space volume of the server, terminal (such as a laptop computer), etc. using the information processing device. The information processing device provided by the embodiment of the present disclosure can realize a large-capacity storage module. The signal line of the storage module is connected through the FPC from the Z axis direction of the CAMM.

[0037] The first support column 150 may be located on the first surface 111 of the main connection structure 110 and may be disposed between the storage module 130 and the main connection structure 110. The first support column 150 may have a supporting function, that is, support the storage module 130, and may also have a heat dissipation function.

[0038] In the embodiment of the present disclosure, the first supporting heat dissipation component 150 may be made of a material with high thermal conductivity, for example, any one or more of silicon or metal, so as to facilitate the heat dissipation of the main connection structure upward.

[0039] Continue to refer Figure 1 , the main connection structure 110, the storage module 130, the information processing chip 120, the external connection structure 140 and the first supporting heat dissipation component 150 are surrounded to form a cavity structure 160. In the embodiment of the present disclosure, on the one hand, the signal routing between the information processing chip and the storage module is realized through an independent external connection structure, which can make the main connection structure thinner and make it easier to dissipate heat. On the other hand, the first supporting heat dissipation component itself can serve as a heat dissipation channel to allow the heat of the main connection structure to dissipate upward. At the same time, the cavity structure between the main connection structure and the external connection structure can increase air convection and form a better heat dissipation channel.

[0040] In an exemplary embodiment, the external connection structure 140 may be parallel to the first surface 111 of the main connection structure 110. In the embodiment of the present disclosure, when the thickness of the information processing chip 120 and the storage module 130 are inconsistent, the thickness of the information processing chip 120 and the storage module 130 may be adjusted by the first support heat dissipation component 150, so that the upper surface of the information processing chip 120 and the upper surface of the storage module 130 are parallel, thereby making the external connection structure 140 parallel to the first surface 111 of the main connection structure 110, so that the structure of the information processing device formed is more stable. Specifically, when the storage module 130 is electrically connected to the external connection structure 140 through the contact, the thickness of the first support heat dissipation component 150 plus the thickness of the chip placement member 132 plus the thickness of the contact is equal to or approximately equal to the thickness of the information processing chip 120 plus the thickness of the contact on the information processing chip 120. It can be understood that the parallel here means substantially parallel, and a certain deviation is allowed. Especially when the external connection structure adopts a flexible FPC, a slight imbalance is also possible.

[0041] In the embodiment of the present disclosure, the thickness of the contacts on the storage module 130 may be greater than, equal to, or less than the thickness of the chip 131, and the present disclosure does not limit this. The external connection structure 140 may be disposed above the contacts of the storage module 130 and electrically connected to the contacts, and electrically connected to the contacts on the information processing chip 120, and the external connection structure 140 is parallel or approximately parallel to the first surface 111 of the main connection structure 110.

[0042] The information processing device provided by the embodiment of the present disclosure, on the one hand, the electrical connection between the storage module and the information processing chip is realized by an external connection structure independent of the main connection structure, that is, the information processing chip only realizes the reading and writing of data for each chip on the storage module through the external connection structure, that is, the wiring between the storage module and the information processing chip no longer passes through the main connection structure, thereby reducing the number of wiring layers of the main connection structure electrically connected to the information processing chip, reducing the thickness of the main connection structure, reducing the space volume occupied by the information processing device, or reducing the wiring density in the main connection structure, thereby reducing the crosstalk effect between signals; on the other hand, by arranging a first supporting heat dissipation component between the storage module and the main connection structure, it is beneficial to improve the heat dissipation effect of the information processing device.

[0043] Figure 2 A front view of an information processing device provided by another embodiment of the present disclosure is shown.

[0044] like Figure 2 As shown, the information processing device 100 provided by the embodiment of the present disclosure is compared with Figure 1 The embodiment is different in that a first contact component 121 (which can serve as a contact of the information processing chip 120 ) may be provided on a surface of the information processing chip 120 away from the main connection structure 110 , and the first contact component 121 is used to achieve electrical connection with the external connection structure 140 .

[0045] Figure 2 In the embodiment, the surface of the information processing chip 120 away from the main connection structure 110 may be the upper surface of the information processing chip 120, the upper surface of the information processing chip 120 is away from the first surface 111 of the main connection structure 110, and the lower surface of the information processing chip 120 is close to the first surface 111 of the main connection structure 110. A first contact component 121 is provided on at least a portion of the upper surface of the information processing chip 120 to achieve electrical connection with the external connection structure 140.

[0046] Continue to refer Figure 2 The storage module 130 may be provided with a second contact component 133 on a surface away from the main connection structure 110 , and the second contact component 133 may be used to achieve electrical connection with the external connection structure 140 .

[0047] Figure 2 In the embodiment, the surface of the storage module 130 away from the main connection structure 110 may be the upper surface of the storage module 130, the upper surface of the storage module 130 is away from the first surface 111 of the main connection structure 110, and the lower surface of the storage module 130 is close to the first surface 111 of the main connection structure 110. A second contact component 133 is provided on at least a part of the upper surface of the storage module 130 to achieve electrical connection with the external connection structure 140. Specifically, the second contact component 133 may be provided on the first surface of the chip placement component 132 of the storage module 130, and may serve as a contact of the storage module 130.

[0048] Figure 2 In the embodiment, by adjusting the thickness h2 of the first supporting heat dissipation component 150, the external connection structure 140 can be substantially parallel to the first surface 111 of the main connection structure 110. h2 is a real number greater than 0.

[0049] The information processing device provided by the embodiment of the present disclosure performs Z-axis upgrade iterations on the storage module based on the optimization of the Z-axis spatial structure of the storage module, and makes the signal routing between the storage module and the information processing chip independent of the external connection structure above the information processing chip and the storage module. On the one hand, the number of main connection structure layers can be effectively reduced, and on the other hand, the signal routing density within the main connection structure and the external connection structure can be reduced, thereby reducing the crosstalk distortion between signals, ensuring better signal propagation quality, and meeting the needs of increasingly higher frequency domains and storage fields with high signal distortion risks. At the same time, excellent heat dissipation performance can be provided through the first supporting heat dissipation component.

[0050] Figure 3 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0051] like Figure 3 As shown, the information processing device 100 provided by the embodiment of the present disclosure is compared with Figure 2 The embodiment is different in that the storage module 130 is provided with a second contact component 133 on the surface close to the main connection structure 110, and the second contact component 133 can be used to achieve electrical connection with the external connection structure 140. Specifically, the second contact component 133 can be provided on the second surface of the chip placement component 132 of the storage module 130, and can serve as a contact point of the storage module 130.

[0052] Figure 3In the embodiment, the surface of the storage module 130 away from the main connection structure 110 may be the upper surface of the storage module 130, the upper surface of the storage module 130 is away from the first surface 111 of the main connection structure 110, and the lower surface of the storage module 130 is close to the first surface 111 of the main connection structure 110. A second contact component 133 is disposed on at least a portion of the upper surface of the storage module 130 to achieve electrical connection with the external connection structure 140.

[0053] Figure 3 In the embodiment, by increasing the thickness of the first supporting heat dissipation component 150, that is, h3 is greater than the above-mentioned h2, the storage module 130 can be located above the external connection structure 140, that is, the information processing chip 120 and the storage module 130 are respectively located on both sides of the external connection structure 140, thereby further increasing the spatial volume of the cavity structure 160 formed around the main connection structure 110, the external connection structure 140, the information processing chip 120 and the first supporting heat dissipation component 150, thereby further increasing air convection and forming a better heat dissipation channel.

[0054] Above Figure 2 and Figure 3 In the embodiment, the first contact component 121 and the external connection structure 140 can be electrically connected by welding. The second contact component 133 and the external connection structure 140 can also be electrically connected by welding.

[0055] Figure 2 In the embodiment, the information processing chip 120 grows a signal pin on the upper surface away from the main connection structure 110, the storage module 130 grows a signal pin on the upper surface away from the main connection structure 110, and a solder ball is formed on the lower surface of the external connection structure 140 close to the main connection structure 110. Then, the signal pin on the upper surface of the information processing chip 120 and the signal pin on the upper surface of the storage module 130 are respectively welded to the corresponding solder balls on the lower surface of the external connection structure 140, so as to realize the electrical connection between the information processing chip 120 and the storage module 150.

[0056] Figure 3In the embodiment, the information processing chip 120 grows signal pins on the upper surface away from the main connection structure 110, and the storage module 130 grows signal pins on the lower surface close to the main connection structure 110. Solder balls are formed on the lower surface of the external connection structure 140 close to the main connection structure 110 and on the upper surface away from the main connection structure 110, respectively. Then, the signal pins on the upper surface of the information processing chip 120 are welded to the corresponding solder balls on the lower surface of the external connection structure 140, and the signal pins on the lower surface of the storage module 130 are welded to the corresponding solder balls on the upper surface of the external connection structure 140, so as to realize the electrical connection between the information processing chip 120 and the storage module 150.

[0057] Continue to refer Figure 3 , a plurality of chips 131 are also arranged on the second surface of the chip placement component 132 of the storage module 130. The first support and heat dissipation component 150 can be arranged between the main connection structure 110 and the storage module 130, and the first support and heat dissipation component 150 does not contact any chip 131 and the second contact component 133 on the second surface of the storage module 130, that is, the first support and heat dissipation component 150 contacts the area on the second surface of the chip placement component 132 that does not include the chip 131 and the second contact component 133.

[0058] In some embodiments, the chip 131 can be arranged around the first supporting heat dissipation component 150, which is conducive to the heat generated by the chip 131 being dissipated through the first supporting heat dissipation component 150. However, the present disclosure is not limited thereto. In other embodiments, the first supporting heat dissipation component 150 can also be arranged on two sides opposite to the second contact component 133, for example Figure 3 In the embodiment, the second contact member 133 is disposed on the left side, the first support and heat dissipation member 150 may be disposed on the opposite right side, and the chip 131 is disposed between the second contact member 133 and the first support and heat dissipation member 150 .

[0059] The information processing device provided in the embodiment of the present disclosure utilizes the advantage of the Z-axis space and introduces a solder ball connection method to connect the information processing chip and the storage module, and to separate the wiring between the storage module and the information processing chip from the system motherboard (i.e., the main connection structure), thereby reducing the number of layers of the system motherboard and further reducing the space volume of servers, terminals (such as laptop computers), etc. that use the information processing device.

[0060] Figure 4 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0061] like Figure 4 As shown, the information processing device 100 provided by the embodiment of the present disclosure is compared with Figure 2The embodiment is different in that the first contact component 121 and the external connection structure 140 can be electrically connected by plugging. The second contact component 133 and the external connection structure 140 can also be electrically connected by plugging.

[0062] Figure 4 The embodiment provides another connection method between the information processing chip 120, the storage module 130 and the external connection structure 140. Pads (solder pads) can be generated on the upper surface of the information processing chip 120 and the upper surface of the storage module 130 respectively, and the lower surface of the external connection structure 140 can be connected in a direct plug-in manner.

[0063] Figure 5 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0064] like Figure 5 As shown, the information processing device 100 provided by the embodiment of the present disclosure is compared with Figure 3 The embodiment is different in that the first contact component 121 and the external connection structure 140 can be electrically connected by plugging, and the first contact component 121 can be called a first plug connector. The second contact component 133 and the external connection structure 140 can also be electrically connected by plugging, and the second contact component 133 can be called a second plug connector.

[0065] Figure 5 In an embodiment, pads (solder pads) can be generated on the upper surface of the information processing chip 120 and the lower surface of the storage module 130 respectively, and the lower surface of the external connection structure 140 is directly connected to the upper surface of the information processing chip 120, and the upper surface of the external connection structure 140 is directly connected to the lower surface of the storage module 130.

[0066] In some embodiments, the first contact component 121 and the external connection structure 140 may be electrically connected by welding, and the second contact component 133 and the external connection structure 140 may be electrically connected by plugging. In other embodiments, the first contact component 121 and the external connection structure 140 may be electrically connected by plugging, and the second contact component 133 and the external connection structure 140 may be electrically connected by welding. This disclosure is not limited to this.

[0067] The information processing device provided by the embodiment of the present disclosure utilizes the space advantage of the Z axis and introduces a plug-in connection method to connect the information processing chip and the storage module, and to separate the wiring between the storage module and the information processing chip from the system mainboard, thereby reducing the number of system mainboard layers, and further reducing the space volume of the server, terminal, etc. using the information processing device. At the same time, the use of the plug-in connection method facilitates the disassembly of the storage module, the external connection structure, and the information processing chip, and facilitates the removal of the storage module to be replaced when replacing the storage module.

[0068] In the above Figures 1 to 5 In the embodiments, the information processing device 100 includes a first supporting heat dissipation component 150, and the first supporting heat dissipation component 150 is disposed at a middle position or approximately at a middle position of the storage module 130. The width of the first supporting heat dissipation component 150 along the X direction is smaller than the width of the storage module 130. However, the present disclosure is not limited thereto.

[0069] The information processing device provided by the embodiment of the present disclosure sets the first supporting heat dissipation component in the middle position of the storage module 130 so that there is flowing air on the left and right sides of the lower surface of the storage module 130, which is beneficial to the heat dissipation of the storage module and the main connection structure.

[0070] like Figure 6 As shown, the information processing device 100 provided by the embodiment of the present disclosure may include two first supporting heat dissipation components 150, and the two first supporting heat dissipation components 150 are respectively located on the left and right sides of the storage module 130. The two first supporting heat dissipation components 150 arranged in this way and the storage module 130 and the main connection structure 110 can surround and form another cavity structure 170.

[0071] It is understandable that although Figures 1 to 5 An example of a first supporting heat dissipation component is given. Figure 6 The embodiment cites two first supporting heat dissipation components, but the present disclosure does not limit the number of first supporting heat dissipation components. The size of the first supporting heat dissipation components is smaller than the storage module. Multiple first supporting heat dissipation components can be arranged between the storage module and the main connection structure as long as they can play a supporting and heat dissipation role.

[0072] The information processing device provided by the embodiment of the present disclosure is provided with two or more first supporting heat dissipation components arranged between the storage module and the main connection structure to form another cavity structure, so that the heat dissipation effect of the main connection structure and the storage module can be further improved through the other cavity structure.

[0073] In the above Figures 1 to 6In the embodiments, the first supporting heat dissipation component 150 is illustrated as a hollow structure. However, the present disclosure is not limited thereto. The information processing device provided by the embodiments of the present disclosure sets the first supporting heat dissipation component as a hollow structure, and the hollow structure can be used as a heat dissipation channel of the main connection structure, thereby further improving the heat dissipation performance of the main connection structure.

[0074] The first supporting heat dissipation component in the embodiment of the present disclosure may be rectangular or cylindrical, and the present disclosure does not limit the shape of the first supporting heat dissipation component.

[0075] like Figure 7 As shown, the first support heat dissipation component 150 may also be a solid structure. Filler particles may also be arranged in the first support heat dissipation component 150, so as to have a better heat dissipation effect and avoid heat accumulation in the main connection structure.

[0076] Figure 8 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0077] like Figure 8 As shown, the information processing device 100 provided by the embodiment of the present disclosure is Figure 2 The difference between the embodiments is that it may further include an adapter plate 180 .

[0078] The adapter board 180 may be disposed on a surface of the information processing chip 120 away from the main connection structure 110 , and the first contact component 121 on the information processing chip 120 may be electrically connected to the external connection structure 140 through the adapter board 180 .

[0079] In the information processing device provided by the embodiment of the present disclosure, when the height of the information processing chip 120 is relatively small, resulting in the upper surface of the information processing chip 120 not being flush with the upper surface of the storage module 130, an adapter board 180 can be added to the upper surface of the information processing chip 120 away from the main connection structure 110, and the first contact component 121 on the information processing chip 120 is electrically connected to the external connection structure 140 through the adapter board 180. The information processing chip 120 and the adapter board 180 can be electrically connected by any appropriate method such as welding or plugging, and the present disclosure does not limit this. In this way, the upper surface of the adapter board 180 is flush with the upper surface of the storage module 130, and the external connection structure 140 can be made parallel or substantially parallel to the first surface of the main connection structure 110, thereby ensuring the stability of the structure.

[0080] Fig. 9 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0081] like Fig. 9As shown, the information processing device 100 provided by the embodiment of the present disclosure is Figure 3 The difference between the embodiments is that it may further include an adapter plate 180 .

[0082] The adapter board 180 may be disposed on a surface of the information processing chip 120 away from the main connection structure 110 , and the first contact component 121 on the information processing chip 120 may be electrically connected to the external connection structure 140 through the adapter board 180 .

[0083] Fig.10 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0084] like Fig.10 As shown, the information processing device 100 provided by the embodiment of the present disclosure is the same as the above Figure 2 The difference of the embodiment is that two storage modules 130 may be included, the first storage module 130 is arranged on the first support heat dissipation component 150 and contacts the first support heat dissipation component 150, the second storage module 130 may be arranged on the first storage module 130, and the first storage module 130 has a second contact component 133 on the first surface, and the second storage module 130 has a second contact component 133 on the second surface, that is, the first storage module and the second storage module have a second contact component 133 between their two opposite surfaces. An external connection structure 140 is arranged between the first storage module 130 and the second storage module 130, the first storage module 130 is electrically connected to the external connection structure 140 through the second contact component 133 on its first surface, and the second storage module 130 is electrically connected to the external connection structure 140 through the second contact component 133 on its second surface.

[0085] Continue to refer Fig.10 , a plurality of chips 131 may be further included on the first surface of the first storage module 130, and a plurality of chips 131 may be further included on the second surface of the second storage module 130. A second supporting heat dissipation component 190 may be further provided between the first storage module and the second storage module. The second supporting heat dissipation component 190 may be in contact with a region on the first surface of the first storage module that does not include the chips 131 and the second contact component 133, and in contact with a region on the second surface of the second storage module that does not include the chips 131 and the second contact component 133.

[0086] In some embodiments, the second supporting heat dissipation component 190 may be disposed between or near the middle of the first storage module and the second storage module, and the chip 131 may be disposed around the second supporting heat dissipation component 190, which is conducive to the heat of the upper and lower storage modules being dissipated through the second supporting heat dissipation component 190. However, the present disclosure is not limited thereto, and in other embodiments, the second supporting heat dissipation component 190 and the second contact component 133 on the storage module may be disposed on opposite sides of the first surface of the first storage module and on opposite sides of the second surface of the second storage module.

[0087] In the disclosed embodiment, the second support heat dissipation component 190 can play a supporting role between two adjacent storage modules, and can also serve as a heat dissipation channel between two adjacent storage modules to improve the heat dissipation performance between the storage modules. The second support heat dissipation component 190 can be made of a material with high thermal conductivity. The size of the second support heat dissipation component 190 can be smaller than the size of the storage module, and one or more second support heat dissipation components 190 can be set between two adjacent storage modules. When a second support heat dissipation component 190 is set between two adjacent storage modules, the second support heat dissipation component 190 can be set in the middle position of the storage module, or approximately in the middle position, so that there is air convection between the two sides of the adjacent two storage modules, which is conducive to heat dissipation. When multiple second support heat dissipation components 190 are set between two adjacent storage modules, the multiple second support heat dissipation components 190 can be set on the sides of the two adjacent storage modules, so as to enclose another cavity structure between the two adjacent storage modules, and increase the heat dissipation channel through the another cavity structure. The second support heat dissipation component 190 can be hollow or solid, and the hollow structure in the hollow structure of the second support heat dissipation component 190 can serve as a heat dissipation channel. The second support heat dissipation component 190 can be cylindrical or rectangular, and the present disclosure does not limit the shape of the second support heat dissipation component 190.

[0088] Fig.10 In the embodiment, the thickness of the first storage module 130 plus the thickness of the second contact component 133 on the first storage module 130 plus the thickness of the first supporting heat dissipation component 150 is equal to or approximately equal to the thickness of the information processing chip 120 plus the thickness of the first contact component 121 on the information processing chip 120, so that the external connection structure 140 is parallel or approximately parallel to the first surface 111 of the main connection structure 110, thereby ensuring the stability of the structure.

[0089] In an exemplary embodiment, an external connection structure may be placed between two adjacent storage modules, and the electrical connection between the two adjacent storage modules may be realized through the external connection structure, so as to realize the electrical connection between an information processing chip and multiple storage modules. Furthermore, one or more second supporting heat dissipation components may be placed between two adjacent storage modules, and the thickness of the second supporting heat dissipation components is equal to or approximately equal to the sum of the thickness of the external connection structure placed between the two adjacent storage modules and the thickness of the second contact components of the two adjacent storage modules, so as to support and dissipate heat for the two adjacent storage modules.

[0090] Fig.11 A front view of an information processing device provided by yet another embodiment of the present disclosure is shown.

[0091] like Fig.11 As shown, the information processing device 100 provided by the embodiment of the present disclosure is Figure 2 The difference of the embodiment is that the two surfaces of the storage module 130 have a plurality of chips 131 respectively. Fig.12 In the figure, an example is given in which a plurality of chips 131 are respectively disposed on the upper and lower surfaces of the storage module 130 .

[0092] Continue to refer Fig.11 For a storage module 130 having a plurality of chips 131 on the upper and lower surfaces relative to each other, if the sum of the thickness of the storage module 130 (including the sum of the thickness of the chip placement component 132 and the thickness of the second contact component 133) and the thickness of the first supporting heat dissipation component 150 exceeds the sum of the thickness of the information processing chip 130 and the thickness of the first contact component 121 thereon, then an adapter plate 180 may be added to the upper surface of the information processing chip 120, and the sum of the thickness of the adapter plate 180, the information processing chip 120 and the first contact component 121 thereon is equal to or approximately equal to the sum of the thickness of the storage module 130 and the first supporting heat dissipation component 150, so that the external connection structure 140 is parallel or substantially parallel to the first surface 111 of the main connection structure 110, thereby ensuring the stability of the structure.

[0093] In the above Figures 1 to 11 In the embodiment, the upper surface of the information processing chip 120 and the side close to the storage module 130 (eg Figures 1 to 12 A first contact member 121 is provided on the right side of the storage module 130, and a side of the upper surface of the storage module 130 close to the information processing chip 120 (for example Figures 1 to 12 The second contact part 133 is arranged on the left side of the circuit board 100, and such an arrangement can make it easier to connect the information processing chip with the external connection structure, and between the external connection structure and the storage module, and the signal routing inside the external connection structure can be shorter, thereby reducing power consumption. However, the present disclosure is not limited to this.

[0094] In some embodiments, the first contact component 121 may be evenly or unevenly arranged on the entire upper surface of the information processing chip 120 except for the area where the information processing chip 120 is placed, and / or the second contact component 133 may be evenly or unevenly arranged on the entire upper surface of the storage module 130 except for the chip 131. Such an arrangement can make the distribution spacing between the first contact component and / or the second contact component larger, and the routing density between the external connection structures lower, when the area of ​​the upper surface of the information processing chip and the storage module remains unchanged, and the number of the first contact component and the second contact component remains unchanged, thereby reducing the interference between signals.

[0095] In some embodiments, the first contact component 121 on the upper surface of the information processing chip 120 may be distributed in the middle area of ​​the upper surface of the information processing chip 120, and the second contact component 133 on the upper surface or lower surface of the storage module 130 may be distributed in the middle area of ​​the upper surface or lower surface of the storage module 130. In other embodiments, the first contact component 121 on the upper surface of the information processing chip 120 may be distributed in the middle area of ​​the upper surface of the information processing chip 120, and the second contact component 133 on the upper surface or lower surface of the storage module 130 may be distributed on the left / right side of the upper surface or lower surface of the storage module 130. In still other embodiments, the first contact component 121 on the upper surface of the information processing chip 120 may be distributed on the left / right side of the upper surface of the information processing chip 120, and the second contact component 133 on the upper surface or lower surface of the storage module 130 may be distributed in the middle area of ​​the upper surface or lower surface of the storage module 130. That is, the first contact component 121 of the information processing chip 120 can be distributed in any area of ​​the upper surface of the information processing chip 120 , and the second contact component 133 of the storage module 130 can be distributed in any area of ​​the upper surface or lower surface of the storage module 130 .

[0096] Fig.12 A top view of an information processing device provided by an embodiment of the present disclosure is shown.

[0097] like Fig.12As shown, a row of first contact members 121 may be provided on the right side of the upper surface of the information processing chip 120, and a row of second contact members 133 may be provided on the left side of the upper surface of the storage module 130. Correspondingly, a row of third contact members 141 is provided on the left side of the lower surface of the external connection structure 140, and the third contact members 141 are electrically connected to the first contact members 121 in a one-to-one correspondence. A row of fourth contact members 142 is provided on the right side of the lower surface of the external connection structure 140, and the fourth contact members 142 are electrically connected to the second contact members 133 in a one-to-one correspondence. The third contact members 141 and the fourth contact members 142 are electrically connected in a one-to-one correspondence through the wiring 143 in the external connection structure 140.

[0098] In the disclosed embodiment, the information processing chip 120 and the storage module 130 can respectively connect the internal wiring to the TOP layer (upper surface) through the PTH (Physical Layer), and form a BGA (Ball Grid Array) Pad on the TOP layer. BGA is a high-density surface mounting packaging technology. The memory packaged with BGA technology can increase the memory capacity by two to three times without changing the volume of the memory, and the BGA packaging method has a fast and effective heat dissipation path.

[0099] Fig.13 A top view of an information processing device provided by another embodiment of the present disclosure is shown.

[0100] like Fig.13 As shown, two rows of first contact members 121 may be provided on the right side of the upper surface of the information processing chip 120, and two rows of second contact members 133 may be provided on the left side of the upper surface of the storage module 130. Correspondingly, two rows of third contact members 141 are provided on the left side of the lower surface of the external connection structure 140, and the third contact members 141 are electrically connected to the first contact members 121 in a one-to-one correspondence. Two rows of fourth contact members 142 are provided on the right side of the lower surface of the external connection structure 140, and the fourth contact members 142 are electrically connected to the second contact members 133 in a one-to-one correspondence. The third contact members 141 and the fourth contact members 142 are electrically connected in a one-to-one correspondence through the wiring 143 in the external connection structure 140.

[0101] In the disclosed embodiment, the routing 143 in the external connection structure 140 includes routing of all signals between the information processing chip and the storage module. If one layer of routing cannot be completed, it can be divided into multiple layers of routing in the external connection structure 140 .

[0102] It is understandable that although Fig.12 The embodiment shows a row of first contact members and a row of second contact members, Fig.13The embodiment shows two rows of first contact parts and two rows of second contact parts, but the present disclosure is not limited to this. The first contact parts and the second contact parts can be arranged according to the area of ​​the upper surface of the information processing chip and the storage module, and the number of signal lines between the information processing chip and the storage module. For example, there can be three or more rows of first contact parts and second contact parts.

[0103] Fig.12 and Fig.13 In the embodiment, the third contact component 141 and the first contact component 121 , and the fourth contact component 142 and the second contact component 133 are connected by welding, for example, by solder ball welding.

[0104] Fig.14 In the embodiment, the third contact component 141 and the first contact component 121 , and the fourth contact component 142 and the second contact component 133 are connected by plugging.

[0105] exist Figure 12 to Figure 14 In the embodiment, each row of the first contact components of the information processing chip 120 may include N pins, for example, pins 1 to pins N, where N is a positive integer greater than or equal to 1, and each row of the second contact components of the storage module 130 may also include N pins. Correspondingly, each row of the third contact components and the fourth contact components in the external connection structure 140 respectively include N solder balls or connectors, and each pin in a row of the first contact components in the information processing chip 120 may be paired with each solder ball in a corresponding row of the third contact components in the external connection structure 140. The pins in the second contact component in the storage module 130 are welded one by one with the solder balls in the fourth contact component in the corresponding row in the external connection decoupling strand 140, or are plugged one by one with the solder balls in the fourth contact component in the corresponding row; the solder balls or connectors welded or plugged with the corresponding pins of the information processing chip 120 and the solder balls or connectors welded or plugged with the corresponding pins of the storage module 130 are electrically connected one by one using the wiring 143. For example, assuming that a solder ball on the left side of the external connection structure 140 is welded with pin 1 of the information processing chip 120, and a solder ball on the right side of the external connection structure 140 is welded with pin 1 of the storage module 130, the solder ball on the left side of the external connection structure 140 and the solder ball on the right side are electrically connected by a wiring.

[0106] In the description of this specification, the description with reference to the terms "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0107] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and cannot be construed as limitations on the present disclosure. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present disclosure. Therefore, any changes or modifications made in accordance with the claims and specification of the present disclosure shall fall within the scope covered by the patent of the present disclosure.

Claims

1. An information processing device, characterized in that: include: A main connection structure having a first surface, wherein the first surface has an information processing chip electrically connected to the main connection structure; A storage module, located on one side of the first surface, at least one surface of the storage module having a plurality of chips; An external connection structure, located on one side of the first surface, is configured to electrically connect the storage module and the information processing chip, and the information processing chip is configured to read and write data to each of the chips only through the external connection structure; The first supporting heat dissipation component is located on the first surface and is arranged between the storage module and the main connecting structure.

2. The information processing device according to claim 1, characterized in that The information processing chip is provided with a first contact component on a surface away from the main connection structure, and the first contact component is electrically connected to the external connection structure.

3. The information processing device according to claim 2, characterized in that: The storage module is provided with a second contact component on a surface away from the main connection structure, and the second contact component is electrically connected to the external connection structure.

4. The information processing device according to claim 2, characterized in that The storage module is provided with a second contact component on a surface close to the main connection structure, and the second contact component is electrically connected to the external connection structure.

5. The information processing device according to any one of claims 3 or 4, characterized in that: The first contact component and the external connection structure are electrically connected by welding or plugging; The second contact component and the external connection structure are electrically connected by welding or plugging.

6. The information processing device according to claim 1, characterized in that The first supporting heat dissipation component is disposed in the middle position of the storage module.

7. The information processing device according to claim 1, characterized in that: The first supporting heat dissipation component is a hollow structure.

8. The information processing device according to claim 1, characterized in that The device also includes: The adapter board is arranged on a surface of the information processing chip away from the main connection structure, and the electrical connection between the first contact component and the external connection structure is realized through the adapter board.

9. The information processing device according to claim 1, characterized in that: The external connection structure is parallel to the first surface of the main connection structure.

10. The information processing device according to claim 1, characterized in that There are two storage modules, the two storage modules are stacked in a direction perpendicular to the first surface, and the two storage modules are electrically connected to the information processing chip via the same external connection structure.

11. The information processing device according to claim 10, characterized in that: Also includes: A second supporting heat dissipation component is located between the two storage modules.

12. The information processing device according to claim 1, characterized in that: The external connection structure and / or the main connection structure is a flexible circuit board.

13. The information processing device according to claim 1, characterized in that: The storage module is a compressed additional memory module.

14. According to the information processing device of claim 13, the compressed additional memory module has the multiple chips on one of the surfaces along a direction perpendicular to the first surface; or, the compressed additional memory module has the multiple chips on two opposite surfaces along a direction perpendicular to the first surface.

15. The information processing device according to claim 1, characterized in that: The main connection structure, the storage module, the information processing chip, the external connection structure and the first supporting heat dissipation component surround and form a cavity structure.

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