Micro-display wafer and head-mounted display device

Abstract

The invention relates to the field of display, and discloses a micro-display wafer and a head-mounted display device. A display surface of the micro-display wafer is provided with a pixel array area, the pixel array area comprises a display light-emitting area and an eye-controlled device area, the eye-controlled device area comprises an infrared emission area and an infrared receiving area, and the micro-display wafer comprises a plurality of display micro light-emitting diodes which are arranged in the display light-emitting area and used for image display; the at least one infrared light source device is located in the infrared emission region; the at least one infrared acquisition device is located in the infrared receiving area, and the infrared light emitted by the infrared light source device is received by the infrared acquisition device after being reflected by the human eyes so as to be used for acquiring the sight line of the human eyes. According to the micro-display wafer, the device for acquiring the sight line of the human eyes is integrated in the micro-display wafer for displaying, so that the portability and the high availability of components are improved.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a micro display chip and a head-mounted display device. Background Art

[0002] Micro Light Emitting Diode (Micro-LED) display chips are considered to be the most suitable display modules for head-mounted display devices due to their high stability and high brightness.

[0003] Some head-mounted display devices need to have an eye control function, which is based on the acquisition of the line of sight of the human eye. At present, the estimation of the line of sight of the human eye can be achieved through the cooperation of the infrared light source component and the infrared receiving component with the human eye. In the prior art, the infrared light source component and the infrared receiving component used for acquiring the line of sight of the human eye are arranged outside the micro display chip used for display, and a component with eye control function and display function is obtained, but the volume of the component is relatively large. Summary of the invention

[0004] The present application provides a micro-display chip and a head-mounted display device, which integrates a device for obtaining a person's line of sight into a micro-display chip for display, thereby improving the lightness of the components.

[0005] In a first aspect, an embodiment of the present application provides a micro-display chip, wherein a display surface of the micro-display chip has a pixel array area, wherein the pixel array area includes a display light-emitting area and an eye control device area, wherein the eye control device area includes an infrared emitting area and an infrared receiving area, and the micro-display chip includes: a plurality of display micro-light-emitting diodes arranged in the display light-emitting area for displaying images; at least one infrared light source device located in the infrared emitting area; and at least one infrared collection device located in the infrared receiving area, wherein the infrared light emitted by the infrared light source device is reflected by the human eye and then received by the infrared collection device for acquiring the line of sight of the human eye.

[0006] According to any of the aforementioned implementations of the first aspect of the present application, the infrared emitting area and the infrared receiving area in each eye control device area are arranged adjacent to each other.

[0007] According to any of the aforementioned embodiments of the first aspect of the present application, the microdisplay chip further includes: an optical mixing component covering the infrared emitting area and the infrared receiving area within each of the eye control device areas, the optical mixing component being used to converge the infrared light emitted by the infrared light source device and to disperse the infrared light reflected by the human eye and directed toward the infrared collection device.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the number of the eye control device areas is more than two.

[0009] According to any of the aforementioned implementations of the first aspect of the present application, the eye control device area is located at an edge position of the pixel array area.

[0010] According to any of the aforementioned implementations of the first aspect of the present application, the eye control device area is located at a corner position of the pixel array area.

[0011] According to any of the aforementioned implementations of the first aspect of the present application, the infrared emitting area and the infrared receiving area are separated by the display light-emitting area.

[0012] According to any of the aforementioned implementations of the first aspect of the present application, the total area of ​​the infrared emitting regions is greater than the total area of ​​the infrared receiving regions.

[0013] According to any of the aforementioned implementations of the first aspect of the present application, the micro display chip further includes: an infrared filter, which at least covers the infrared receiving area.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the pixel array area also includes a photosensitive area, and the micro display chip also includes: a plurality of photosensitive devices arranged in the photosensitive area, and the plurality of photosensitive devices can acquire human eye iris images for iris recognition.

[0015] According to any of the aforementioned implementations of the first aspect of the present application, at least part of the photosensitive devices are reused as the infrared collection devices.

[0016] In a second aspect, an embodiment of the present application provides a head-mounted display device, which includes a micro-display chip according to any of the aforementioned embodiments of the first aspect of the present application.

[0017] According to the micro-display chip of the embodiment of the present application, the display surface of the micro-display chip has a pixel array area, and the pixel array area includes a display light-emitting area and an eye control device area, and the eye control device area includes an infrared emitting area and an infrared receiving area. The display micro-light-emitting diodes for image display are arranged in the display light-emitting area. The infrared light source device is located in the infrared emitting area, and the infrared collection device is located in the infrared receiving area. The infrared light emitted by the infrared light source device is reflected by the human eye and received by the infrared collection device for acquiring the line of sight of the human eye, and the acquisition of the line of sight of the human eye can be used to realize the eye control function. Therefore, the infrared light source device and the infrared collection device for acquiring the line of sight of the human eye are integrated in the micro-display chip. Compared with the components obtained by arranging the infrared light source component and the infrared receiving component outside the micro-display chip, the micro-display chip with both image display function and human eye line of sight acquisition function occupies a smaller volume, improves the lightness of the components, and is more conducive to realizing the lightness and high availability of the head-mounted display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0019] Figure 1 This is a schematic top view of a first embodiment of a micro display chip of the present application;

[0020] Figure 2 This is a cross-sectional schematic diagram of a first embodiment of a micro display chip of the present application;

[0021] Figure 3 It is a side view schematic diagram of a first embodiment of the micro display chip of the present application;

[0022] Figure 4 This is a schematic top view of a second embodiment of the micro display chip of the present application;

[0023] Figure 5 This is a schematic top view of a third embodiment of the micro display chip of the present application;

[0024] Figure 6 This is a schematic top view of a fourth embodiment of the micro display chip of the present application;

[0025] Figure 7 It is a side view schematic diagram of a fourth embodiment of the micro display chip of the present application;

[0026] Figure 8 This is a schematic top view of a fifth embodiment of the micro display chip of the present application;

[0027] Fig. 9 It is a cross-sectional schematic diagram of a fifth embodiment of the micro display chip of the present application.

[0028] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0030] It should be noted that all directional indications in the embodiments of the present application, such as up, down, left, right, front, back, etc., are only used to explain the relative position relationship, movement, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly. When describing the structure of a component, when a layer or an area is referred to as being "above" or "above" another layer or another area, it may refer to being directly above another layer or another area, or containing other layers or areas between it and another layer or another area. Furthermore, if the component is turned over, the layer or the area will be "below" or "below" another layer or another area.

[0031] In addition, the descriptions of "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. The terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that the combination of such technical solutions does not exist and is not within the scope of protection required by this application.

[0032] An embodiment of the present application provides a micro display chip. Figure 1 This is a top view of the first embodiment of the micro display chip of the present application. Herein, "micro display chip" refers to a display component that mainly uses micro light emitting diodes (Micro-LED) as light-emitting pixels.

[0033] Herein, "micro" light emitting diodes and other "micro" devices refer to the size of light emitting diodes and devices. In some embodiments, the term "micro" refers to the size of the device at a scale of 1 micron to 100 microns. However, it is understood that the embodiments of the present application may not be limited thereto, and certain aspects of the embodiments may be applicable to larger or smaller sizes.

[0034] The display surface of the micro display chip 100 has a pixel array area A1 , which includes a display light emitting area A11 and an eye control device area A12 , and the eye control device area A12 includes an infrared emitting area A121 and an infrared receiving area A122 .

[0035] The micro display chip 100 includes a plurality of display micro light emitting diodes 110, at least one infrared light source device 120, and at least one infrared collection device 130. The plurality of display micro light emitting diodes 110 are arranged in the display light emitting area A11 for image display. At least one infrared light source device 120 is located in the infrared emission area A121. At least one infrared collection device 130 is located in the infrared receiving area A122. The infrared light emitted by the infrared light source device 120 is reflected by the human eye and received by the infrared collection device 130 for obtaining the human eye's line of sight.

[0036] The acquisition of human eye line of sight is, for example, based on corneal reflection, with eye features such as the eye corner point or corneal reflection point (Purkinje spot) as reference points for eye movement. Line of sight estimation is achieved by analyzing the mapping relationship between the vector formed by the eye corner or corneal reflection point and the pupil center position and the line of sight vector, thereby acquiring the human eye line of sight to facilitate the realization of eye control function.

[0037] According to the micro display chip 100 of the embodiment of the present application, the display surface of the micro display chip 100 has a pixel array area A1, which includes a display light emitting area A11 and an eye control device area A12, and the eye control device area A12 includes an infrared emission area A121 and an infrared receiving area A122. The display micro light emitting diodes 110 for image display are arranged in the display light emitting area A11. The infrared light source device 120 is located in the infrared emission area A121, and the infrared collection device 130 is located in the infrared receiving area A122. The infrared light emitted by the infrared light source device 120 is reflected by the human eye and received by the infrared collection device 130 for acquiring the line of sight of the human eye. The acquisition of the line of sight of the human eye can be used to realize the eye control function. Therefore, the infrared light source device 120 and the infrared collection device 130 for acquiring the line of sight of the human eye are integrated into the micro display chip 100. Compared with a component obtained by arranging an infrared light source component and an infrared receiving component outside a microdisplay chip, the microdisplay chip 100 having both image display function and human eye sight acquisition function occupies a smaller volume and improves the lightness of the component, thereby being more conducive to achieving the lightness and high availability of a head-mounted display device.

[0038] In the embodiment of the present application, the shape of the pixel array area A1 can be set as needed. The array shape of the display micro-LEDs 110 can be set as needed. In some embodiments, each display micro-LED 110 is rectangular, in some embodiments, each display micro-LED 110 is hexagonal, and in other embodiments, each display micro-LED 110 can be other shapes.

[0039] Figure 2 Schematic diagram of the cross section of the first embodiment of the micro display chip of the present application. In some embodiments, the micro display chip 100 includes a circuit substrate 140, and the circuit substrate 140 has a circuit structure inside. The display micro light emitting diode 110, the infrared light source device 120, and the infrared collection device 130 are formed on the side where the display surface of the circuit substrate 140 is located. In some embodiments, the display micro light emitting diode 110 is electrically connected to the circuit structure in the circuit substrate 140 through the first via H1, the infrared light source device 120 is electrically connected to the circuit structure in the circuit substrate 140 through the second via H2, and the infrared collection device 130 is electrically connected to the circuit structure in the circuit substrate 140 through the third via H3.

[0040] The circuit structure may include a light-emitting driving circuit and an infrared collection circuit, wherein the display micro-LED 110 and the infrared light source device 120 are electrically connected to the light-emitting driving circuit, and the infrared collection device 130 is electrically connected to the infrared collection circuit. In some embodiments, the light-emitting driving circuit and the infrared collection circuit are both complementary metal oxide semiconductor (CMOS) circuits.

[0041] In this embodiment, the display micro-LED 110 is a colored light Micro-LED, for example, including a red Micro-LED, a green Micro-LED, and a blue Micro-LED. In this embodiment, the infrared collection device 130 is an infrared Micro-LED. In this embodiment, the infrared collection device 130 is a photodiode.

[0042] The infrared collection device 130 can convert the optical signal into an electrical signal. The infrared collection device 130 converts the collected infrared light stimulus into an electrical signal, which is transmitted to the infrared collection circuit through the third via H3 and stored through the peripheral storage circuit for subsequent analysis.

[0043] In some embodiments, a single infrared light source device 120 is provided in each infrared emitting area A121, and a single infrared collection device 130 is provided in each infrared receiving area A122. In some embodiments, a plurality of infrared light source devices 120 are provided in each infrared emitting area A121, and a plurality of infrared collection devices 130 are provided in each infrared receiving area A122.

[0044] The number of eye control device areas A12 can be single or multiple.

[0045] like Figure 1 In some embodiments, in each eye control device area A12, the infrared emitting area A121 and the infrared receiving area A122 are arranged adjacent to each other.

[0046] In some embodiments, the number of eye control device areas A12 is more than two. Figure 1 For example, in this embodiment, the number of eye control device areas A12 is four.

[0047] In some embodiments, the eye control device area A12 is located at an edge position of the pixel array area A1, for example, at an edge position or a corner position of the pixel array area A1. In this embodiment, the eye control device area A12 is located at a corner position of the pixel array area A1. In this embodiment, the pixel array area A1 is rectangular, and the four eye control device areas A12 are correspondingly located at the four corner positions of the pixel array area A1.

[0048] Figure 3 This is a side view schematic diagram of the first embodiment of the micro display chip of the present application. In some embodiments, the micro display chip 100 further includes an optical mixing component 150. The optical mixing component 150 covers the infrared emission area A121 and the infrared receiving area A122 in each eye control device area A12. The optical mixing component 150 is used to converge the infrared light emitted by the infrared light source device 120 and disperse the infrared light reflected by the human eye E1 and directed to the infrared collection device 130.

[0049] The optical mixing component 150 includes at least one micro lens, through which the infrared light emitted by the infrared light source device 120 is converged, and the shape of the optical mixing component 150 can change the emission direction of the infrared light emitted by the infrared light source device 120 after passing through the optical mixing component 150, thereby increasing the proportion of infrared light entering the human eye E1. In addition, when the infrared light enters the human eye E1 and is reflected, the reflected infrared light can also be dispersed by the optical mixing component 150 and enter the infrared collection device 130.

[0050] In some embodiments, the micro display chip 100 further includes an infrared filter, which at least covers the infrared receiving area A122. The infrared filter can filter out external ambient light and resist interference of external ambient light on the infrared collection device 130.

[0051] In some embodiments, the total area of ​​the infrared emitting areas A121 is equal to the total area of ​​the infrared receiving areas A122.

[0052] Since light is attenuated during transmission, in some embodiments, the total area of ​​the infrared emitting area A121 is larger than the total area of ​​the infrared receiving area A122, thereby increasing the intensity of the infrared light emitted by the infrared light source device 120 and further increasing the sensitivity of the entire module.

[0053] In the first embodiment described above, the infrared emitting area A121 and the infrared receiving area A122 are arranged adjacent to each other in each eye control device area A12. The four eye control device areas A12 are located at the four corners of the pixel array area A1, and the four eye control device areas A12 are spaced apart from each other. In some other embodiments, the arrangement of the eye control device areas A12 may be in other forms.

[0054] Figure 4 Schematic diagram of a top view of the second embodiment of the micro display chip of the present application. In the second embodiment, the number of eye control device areas A12 is two or more, for example, four. In the second embodiment, more than two eye control device areas A12 are arranged adjacent to each other in sequence. For example, four eye control device areas A12 are arranged adjacent to each other in sequence and are located at one of the corner positions of the pixel array area A1. In each eye control device area A12, an infrared emitting area A121 is adjacent to an infrared receiving area A122.

[0055] Figure 5 It is a top view schematic diagram of the third embodiment of the micro display chip of the present application. In the third embodiment, the number of eye control device areas A12 is more than two, for example, four. In the third embodiment, a part of the eye control device areas A12 are arranged adjacent to each other in sequence, and a part of the eye control device areas A12 are spaced apart. For example, the four eye control device areas A12 are divided into two groups, each group including two eye control devices arranged adjacent to each other. The two groups of eye control devices are arranged at opposite ends of one of the edges of the pixel array area A1. In each eye control device area A12, the infrared emitting area A121 and the infrared receiving area A122 are arranged adjacent to each other.

[0056] In some embodiments, the infrared emitting area A121 and the infrared receiving area A122 may not be arranged adjacent to each other. Figure 6 It is a top view schematic diagram of the fourth embodiment of the micro display chip of the present application. In the fourth embodiment, the infrared emitting area A121 and the infrared receiving area A122 are separated by the display light-emitting area A11. In this embodiment, the infrared emitting area A121 and the infrared receiving area A122 are respectively located at the edge positions of the pixel array area A1, for example, at the edge position or the corner position of the pixel array area A1. In this embodiment, the infrared emitting area A121 and the infrared receiving area A122 are respectively located at the corner positions of the pixel array area A1. In this embodiment, the pixel array area A1 is rectangular, and the infrared emitting area A121 and the infrared receiving area A122 are respectively located at different corner positions of the pixel array area A1.

[0057] Figure 7This is a side view of the fourth embodiment of the microdisplay chip of the present application. When the microdisplay chip 100 is used in a head-mounted display device, the head-mounted display device may further include an optical engine 200. The infrared light emitted from the infrared light source device 120 enters the human eye E1 through the optical engine 200, and then enters the infrared collection device 130 through the optical engine 200 after being reflected by the human eye E1.

[0058] Figure 8 , Fig. 9 They are respectively a top view and a cross-sectional view of the fifth embodiment of the microdisplay chip of the present application. The display surface of the microdisplay chip 100 has a pixel array area A1, which includes a display light-emitting area A11 and an eye control device area A12, and the eye control device area A12 includes an infrared emission area A121 and an infrared receiving area A122. In some embodiments, the pixel array area A1 also includes a photosensitive area A13.

[0059] The micro-display chip 100 includes a plurality of display micro-LEDs 110, at least one infrared light source device 120, and at least one infrared collection device 130. The plurality of display micro-LEDs 110 are arranged in the display light-emitting area A11 for image display. At least one infrared light source device 120 is located in the infrared emission area A121. At least one infrared collection device 130 is located in the infrared receiving area A122. The infrared light emitted by the infrared light source device 120 is reflected by the human eye and received by the infrared collection device 130 for obtaining the line of sight of the human eye. In this embodiment, the micro-display chip 100 also includes a plurality of photosensitive devices 170. The plurality of photosensitive devices 170 are arranged in the photosensitive area A13. The plurality of photosensitive devices 170 can obtain the iris image of the human eye for iris recognition.

[0060] The photosensitive device 170 is, for example, a photosensitive element that is sensitive to infrared light. The cornea, iris, and pupil in the human eye absorb and reflect infrared light differently. Each person's iris contains unique texture information that remains unchanged throughout life, making the iris a highly reliable biometric feature. A human iris image can be obtained through multiple photosensitive devices 170, and the iris image can be used as a data basis for biometric identification.

[0061] According to the micro display chip 100 of the above embodiment, the photosensitive device 170 for acquiring the human eye iris image for iris recognition is arranged in the photosensitive area A13. The micro display chip 100 integrates the photosensitive device 170 for iris recognition into the micro display chip 100 for display, thereby further improving the integration of the micro display chip 100, realizing more functions while occupying a smaller volume, improving the portability of the components, and thus being more conducive to realizing the portability of the head mounted display device.

[0062] In some embodiments, the number of photosensitive devices 170 is greater than 200 to ensure the accuracy of iris recognition.

[0063] In some embodiments, the photosensitive area A13 is disposed around the display light emitting area A11.

[0064] In some embodiments, the photosensitive area A13 is located at an edge of the pixel array area A1.

[0065] In this embodiment, the display light emitting area A11 is located at the center of the pixel array area A1, and the photosensitive area A13 completely surrounds the display light emitting area A11.

[0066] like Fig. 9 In some embodiments, the micro display chip 100 further includes a circuit substrate 140. The circuit substrate 140 has a circuit structure inside, and the circuit structure also includes a photosensitive driving circuit. The photosensitive device 170 is electrically connected to the photosensitive driving circuit through the fourth via H4.

[0067] In some embodiments, at least part of the photosensitive device 170 is reused as the infrared collection device 130. For example, Figure 8 In the fifth embodiment, all the infrared collection devices 130 may be multiplexed by the photosensitive devices 170 , that is, at least a part of the photosensitive devices 170 also serve as the infrared collection devices 130 , thereby further improving the utilization rate of the devices on the micro display chip 100 .

[0068] The embodiment of the present application also provides a head-mounted display device, which includes any of the aforementioned embodiments of the microdisplay chip 100. The head-mounted display device can be an augmented reality (AR) head-mounted display device, a virtual reality (VR) head-mounted display device, or a mixed reality (MR) head-mounted display device.

[0069] The display surface of the micro display chip 100 has a pixel array area A1 , which includes a display light emitting area A11 and an eye control device area A12 , and the eye control device area A12 includes an infrared emitting area A121 and an infrared receiving area A122 .

[0070] The micro display chip 100 includes a plurality of display micro light emitting diodes 110, at least one infrared light source device 120, and at least one infrared collection device 130. The plurality of display micro light emitting diodes 110 are arranged in the display light emitting area A11 for image display. At least one infrared light source device 120 is located in the infrared emission area A121. At least one infrared collection device 130 is located in the infrared receiving area A122. The infrared light emitted by the infrared light source device 120 is reflected by the human eye and received by the infrared collection device 130 for obtaining the line of sight of the human eye.

[0071] According to the head-mounted display device of the embodiment of the present application, the head-mounted display device includes a micro-display chip 100, and the display surface of the micro-display chip 100 has a pixel array area A1, and the pixel array area A1 includes a display light-emitting area A11 and an eye control device area A12, and the eye control device area A12 includes an infrared emission area A121 and an infrared receiving area A122. The display micro-light-emitting diodes 110 for image display are arranged in the display light-emitting area A11. The infrared light source device 120 is located in the infrared emission area A121, and the infrared collection device 130 is located in the infrared receiving area A122. The infrared light emitted by the infrared light source device 120 is reflected by the human eye and received by the infrared collection device 130, so as to obtain the line of sight of the human eye, and the acquisition of the line of sight of the human eye can be used to realize the eye control function. Therefore, the infrared light source device 120 and the infrared collection device 130 for obtaining the line of sight of the human eye are integrated in the micro-display chip 100. Compared with a component obtained by arranging an infrared light source component and an infrared receiving component outside a microdisplay chip, the microdisplay chip 100 having both image display function and human eye sight acquisition function occupies a smaller volume and improves the lightness of the component, thereby being more conducive to achieving the lightness and high availability of a head-mounted display device.

[0072] The present application also provides a method for manufacturing a micro display chip 100, which is, for example, the method for manufacturing a micro display chip 100 of some of the above-mentioned embodiments. In this embodiment, the method for manufacturing a micro display chip 100 includes steps S110 to S140.

[0073] In step S110, a circuit substrate 140 is provided, and a circuit structure is provided inside the circuit substrate 140. In some embodiments, the circuit structure includes a light-emitting driving circuit and an infrared collection circuit. Both the light-emitting driving circuit and the infrared collection circuit are CMOS circuits.

[0074] In some embodiments, the circuit substrate 140 further includes a first via hole H1, a second via hole H2, and a third via hole H3. The first via hole H1 and the second via hole H2 are connected to the light-emitting driving circuit, and the third via hole H3 is connected to the infrared collection circuit.

[0075] The circuit substrate 140 has a pixel array area A1 , which includes a display light-emitting area A11 and an eye control device area A12 , and the eye control device area A12 includes an infrared emitting area A121 and an infrared receiving area A122 .

[0076] In step S120, a plurality of display micro light emitting diodes 110 are formed in the display light emitting area A11 of the circuit substrate 140. The plurality of display micro light emitting diodes 110 are used for image display.

[0077] In some embodiments, a plurality of display micro light emitting diodes 110 are formed in the display light emitting area A11 of the circuit substrate 140 by a monolithic bonding process.

[0078] In step S130 , the infrared light source device 120 is formed in the infrared emission area A121 of the circuit substrate 140 .

[0079] In an optional implementation, an infrared light source device 120 is formed in the infrared emission area A121 of the circuit substrate 140 by a mass transfer process, and the infrared light source device 120 is a Micro-LED.

[0080] In an optional implementation, the infrared light source device 120 may also be formed in the infrared emission area A121 of the circuit substrate 140 by a monolithic bonding process.

[0081] In an optional implementation, a first micro-LED may be formed in the infrared emission area A121 of the circuit substrate 140, and then a color conversion layer may be formed on the first micro-LED to convert the light emitted by the first micro-LED into infrared light. Optionally, forming the first micro-LED in the infrared emission area A121 of the circuit substrate 140 may be performed simultaneously with the above step S120.

[0082] Optionally, after step S130, step S140 is further included. In step S140, a conductive member is grown at the infrared light source device 120, so that the chip height of the infrared light source device 120 after the conductive member is grown is the same as the chip height of the display micro-LED 110; both sides of the infrared light source device 120 are passivated by insulating materials. The conductive member can be a conductive metal, for example, one or more of Al, Au, Pt, and Pt.

[0083] In step S150 , the infrared collecting device 130 is formed in the infrared receiving area A122 of the circuit substrate 140 .

[0084] In some embodiments, the infrared collection device 130 is formed in the infrared receiving area A122 of the circuit substrate 140 by a monolithic bonding process.

[0085] Thereafter, the method for manufacturing the micro display wafer 100 may further include other known steps, such as a step of forming a common electrode, and other module process steps.

[0086] According to the method for manufacturing the microdisplay chip 100 of the embodiment of the present application, the obtained microdisplay chip 100 has a pixel array area A1, which includes a display light-emitting area A11 and an eye control device area A12, and the eye control device area A12 includes an infrared emission area A121 and an infrared receiving area A122. The display micro-light-emitting diode 110 for image display is arranged in the display light-emitting area A11. The infrared light source device 120 is located in the infrared emission area A121, and the infrared collection device 130 is located in the infrared receiving area A122. The infrared light emitted by the infrared light source device 120 is reflected by the human eye E1 and received by the infrared collection device 130, so as to obtain the line of sight of the human eye E1, and the acquisition of the line of sight of the human eye E1 can be used to realize the eye control function. Therefore, the infrared light source device 120 and the infrared collection device 130 for obtaining the line of sight of the human eye E1 are integrated in the microdisplay chip 100. Compared with a component obtained by arranging the infrared light source component and the infrared receiving component outside the micro-display chip, the micro-display chip 100 which has both the image display function and the human eye E1 line of sight acquisition function occupies a smaller volume and improves the lightness of the component, thereby being more conducive to realizing the lightness of the head-mounted display device.

[0087] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural changes made under the concept of the present application using the contents of the present application specification and drawings, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A micro display chip, characterized in that: The display surface of the micro display chip has a pixel array area, the pixel array area includes a display light emitting area and an eye control device area, the eye control device area includes an infrared emitting area and an infrared receiving area, and the micro display chip includes: A plurality of display micro light emitting diodes are arranged in the display light emitting area and are used for image display; At least one infrared light source device, located in the infrared emission area; At least one infrared collection device is located in the infrared receiving area. The infrared light emitted by the infrared light source device is reflected by the human eye and then received by the infrared collection device, so as to acquire the line of sight of the human eye.

2. The micro display chip according to claim 1, characterized in that: The infrared emitting area and the infrared receiving area in each eye control device area are arranged adjacent to each other.

3. The micro display chip according to claim 2, characterized in that: Also includes: An optical mixing component covers the infrared emitting area and the infrared receiving area in each eye control device area, and is used to converge the infrared light emitted by the infrared light source device and disperse the infrared light reflected by the human eye and directed toward the infrared collection device.

4. The micro display chip according to claim 1, characterized in that: The eye control device area is located at the edge of the pixel array area.

5. The micro display chip according to claim 1, characterized in that: The infrared emitting area and the infrared receiving area are separated by the display light emitting area.

6. The micro display chip according to claim 1, characterized in that: The total area of ​​the infrared emitting area is greater than the total area of ​​the infrared receiving area.

7. The micro display chip according to claim 1, characterized in that: Also includes: The infrared filter at least covers the infrared receiving area.

8. The micro display chip according to claim 1, characterized in that: The pixel array area also includes a photosensitive area, and the micro display chip also includes: A plurality of photosensitive devices are arranged in the photosensitive area, and the plurality of photosensitive devices can obtain human iris images for iris recognition.

9. The micro display chip according to claim 8, characterized in that: At least part of the photosensitive devices are reused as the infrared collection devices.

10. A head mounted display device, characterized in that: The micro display chip comprises the micro display chip as claimed in any one of claims 1 to 9.

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