Antenna array surface of active phased array radar
The active phased array radar antenna array addresses weight, profile, and heat dissipation challenges by integrating T/R modules and cooling channels, achieving lightweight, low-profile, and reliable operation with efficient heat dissipation and simplified design.
Patent Information
- Application Number
- CN202411210241.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2024-12-27
AI Technical Summary
Traditional brick-like antenna arrays for active phased array radars have complex packaging structures, numerous interconnecting cables, and transition connection modules, leading to issues with weight, profile, heat dissipation, cost, and reliability, while panel arrays require further research on structural form to meet telecommunications specifications.
An active phased array radar antenna array with a panel layout featuring integrated feed multifunction boards and T/R modules on both sides of an antenna frame, using elastic connectors, SMP connectors, and cooling channels for efficient heat dissipation, along with a microstrip patch antenna and a four-channel chip structure for lightweight and low-profile design.
The antenna array achieves lightweight, low-profile, and efficient heat dissipation, simplifying system design and improving reliability through vertical interconnection and closed cooling channels, enabling two-dimensional expansion and reduced design workload.
Smart Images

Figure CN119209031A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of radar technology and relates to a phased array radar, specifically an active phased array radar antenna array. Background Art
[0002] With the rapid development of electronic information technology, phased array radar has placed increasingly stringent requirements on the lightweight and low profile of active phased array antennas. Traditional antenna arrays, which are mainly based on a brick-like architecture, typically have each subsystem module designed and debugged independently, resulting in drawbacks such as complex packaging structures and numerous interconnecting cables and transition connection modules.
[0003] Compared to brick-type antenna arrays, panel arrays, characterized by their modular, flat design, stacked installation, and vertical blind-connection technology, offer significant advantages such as low profile, low weight, and high integration, while also being easily expandable in two dimensions. However, antenna arrays not only need to meet certain telecommunications specifications but also require comprehensive consideration of factors such as heat dissipation, low cost, and reliability. Therefore, further research is needed on the overall structural form of panel arrays. Summary of the Invention
[0004] To address the technical problems existing in the background art, this invention proposes an antenna array for an active phased array radar. Based on the layout of the panel array, the antenna array achieves lightweight and low profile, while the antenna array achieves efficient integration and rapid heat dissipation through reasonable layout.
[0005] The purpose of the present invention can be achieved through the following technical solutions:
[0006] An active phased array radar antenna array includes: an antenna frame and an integrated feed multifunction board and multiple T / R modules respectively mounted on both sides of the antenna frame. One side of the antenna frame is provided with a limiting groove for mounting multiple T / R modules. Multiple elastic connectors corresponding to multiple T / R modules are evenly distributed in the limiting groove. The multiple elastic connectors are nested in multiple corresponding through holes on the antenna frame to interconnect signals between the integrated feed multifunction board and the multiple T / R modules. Multiple antenna elements are correspondingly mounted on the multiple T / R modules. The antenna elements are interconnected with the T / R modules through SMP connectors.
[0007] Furthermore, the antenna frame is made of a metal material with high thermal conductivity and is processed into an integrated flat shape. Multiple cooling channels / cooling air ducts are integrated inside the antenna frame to dissipate the heat generated by the T / R components and the integrated feed multi-function board through thermal conduction. The cooling channels / cooling air ducts are equipped with fins to enhance heat dissipation.
[0008] Furthermore, the mounting surfaces of the T / R assembly and the integrated feed multifunction board are covered with thermal interface material, which is disposed between the T / R assembly and the antenna frame, and between the integrated feed multifunction board and the antenna frame.
[0009] Furthermore, the antenna unit adopts a microstrip patch antenna, including an antenna layer and a feeder layer. The antenna layer is mounted on one side of the antenna board, and the feeder layer is connected to an SMP male connector soldered to the other side of the antenna board. The antenna board is made of high-frequency composite material and prepreg through a lamination process.
[0010] Furthermore, the T / R module is a four-channel chip structure, which is laid out in a chip layout and mounted in a flat manner in the limiting groove of the antenna frame. Multiple positioning bosses are evenly distributed in the limiting groove. The T / R module has a cubic shape, and the four top corners of the T / R module are respectively provided with cut edges that cooperate with the four positioning bosses to position the T / R module between the four positioning bosses, thereby achieving a good positioning effect for the T / R module.
[0011] Furthermore, the T / R assembly includes a housing, within which a highly integrated ceramic substrate is housed. Chips and components that perform functions such as signal amplification, phase shifting, and attenuation are mounted on the surface of the ceramic substrate. An SMP female connector adapted to an SMP male connector is located at the front end of the housing. An interconnect interface is formed by exposed pads on the ceramic substrate at the rear end of the housing. The housing is made of a lightweight packaging composite material with high thermal conductivity. The housing and the SMP male connector are hermetically sealed by laser soldering to ensure a good working environment for the internal components.
[0012] Furthermore, a structural pressure plate is fixedly installed on the antenna frame, and multiple T / R assemblies are clamped between the structural pressure plate and the antenna frame. The structural pressure plate has multiple mounting holes corresponding to multiple antenna elements. The SMP male connector on the antenna element passes through the mounting holes and is adapted to connect with the SMP female connector on the T / R assembly.
[0013] Furthermore, multiple weight-reducing grooves are provided on the structural pressure plate to reduce its weight.
[0014] Furthermore, the integrated power supply multifunction board is a multi-layer high- and low-frequency mixed voltage printed circuit board, and various components are assembled on both sides of the printed circuit board to distribute and process radio frequency, control and power signals. One side of the integrated power supply multifunction board is arranged with multiple circuit interfaces corresponding to multiple flexible connectors and high heat dissipation components, while the other side of the integrated power supply multifunction board is arranged with other various components and multiple external interfaces.
[0015] Furthermore, the flexible connector adopts a high- and low-frequency mixed electrical connector, which can transmit radio frequency, control and power signals synchronously. The core of the flexible connector is a button device, and the two ends of the button are equipped with metal end caps for encapsulation and protection. One end of the flexible connector is connected to the interconnection interface of the T / R component, and the other end is connected to the corresponding circuit interface on the integrated power supply multi-function board.
[0016] The beneficial effects of this invention are as follows: The active phased array radar antenna array provided in this application achieves lightweight and low profile antenna arrays by installing integrated feed multifunction boards and multiple T / R modules on both sides of the antenna frame. The multiple T / R modules are adapted and installed in limiting slots on one side of the antenna frame, and multiple antenna elements are correspondingly installed on the multiple T / R modules. Utilizing a sheet-like array layout, the antenna array achieves lightweight design and low profile. Furthermore, each module is designed in a flat manner, enabling the antenna array to have two-dimensional expansion capabilities, which helps simplify system design and reduce design and debugging workload. The T / R modules are connected to the integrated feed multifunction boards via flexible connectors, and the antenna elements are connected to the T / R modules via SMP connectors. This design achieves efficient integration of the antenna array by stacking the modules and using vertical interconnection technology between layers for signal transmission. By placing the heat-dissipating T / R components and the integrated feed multifunction board on either side of the antenna frame, and utilizing the cooling channels within the antenna frame to simultaneously force-cool the T / R components and the integrated feed multifunction board, the environmental adaptability of the antenna array is effectively improved, and rapid heat dissipation is achieved. The T / R components and the integrated feed multifunction board directly conduct heat to the antenna frame via thermal conduction. The cooling channels within the antenna frame are closed structures, thus avoiding the risk of leakage caused by liquid-cooled connectors and improving the reliability of the antenna array. Attached Figure Description
[0017] Figure 1 It is a structural schematic diagram of the present invention.
[0018] Figure 2 This is an exploded view of the present invention.
[0019] Figure 3 This is a schematic diagram of the structure of the T / R component of the present invention. Detailed Implementation
[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.
[0021] like Figure 1-2As shown, the present invention provides an antenna array for an active phased array radar, comprising: an antenna frame 1, an integrated feed multifunction board 2, 16 T / R assemblies 3, 32 flexible connectors 4, and 64 antenna elements 5. The antenna frame 1 is the structural mounting base of the antenna array and is an integrated flat plate structure made of high-strength, high-thermal-conductivity aluminum alloy material through welding and machining. The integrated feed multifunction board 2 and the T / R assemblies 3 are respectively mounted on both sides of the antenna frame 1 and connected by the flexible connectors 4. The antenna elements 5 are correspondingly connected to the T / R assemblies 3 and connected to the T / R assemblies 3 by SMP connectors.
[0022] Specifically, a limiting groove 11 is provided on one side of the antenna frame 1. Sixteen T / R components 3 are arranged in a sheet-like layout and are mounted in the limiting groove 11 of the antenna frame 1 in a flat manner. Multiple positioning bosses 12 are evenly distributed in the limiting groove 11. The T / R component 3 has a cubic structure and cut edges at the four top corners of the T / R component 3 so that when four T / R components 3 are assembled together, a positioning hole that matches the positioning boss 12 is formed in the middle. Thus, when the 16 T / R components 3 are sequentially positioned and mounted between the multiple positioning bosses 12, each T / R component 3 is positioned and mounted between four positioning bosses 12, achieving a good positioning effect for the T / R components 3.
[0023] On the other side of the antenna frame 1, there are positioning and installation structural features corresponding to the integrated feed multifunction board 2. The integrated feed multifunction board 2 is fixedly installed on the antenna frame 1 by bolts. The antenna frame 1 also has 32 through holes corresponding to 32 elastic connectors 4 respectively. The 32 elastic connectors 4 are nested in the corresponding 32 through holes on the antenna frame 1 to interconnect the integrated feed multifunction board 2 with 16 T / R components 3. Each T / R component 3 is interconnected with the integrated feed multifunction board 2 through two corresponding elastic connectors 4.
[0024] Since a large number of power-consuming devices are integrated on the integrated feed multifunction board 2 and the T / R assembly 3, forced heat dissipation is required. This is achieved by using the antenna frame 1 located between the two to simultaneously force-cool both the integrated feed multifunction board 2 and the T / R assembly 3. Specifically, the antenna frame 1 is made of aluminum alloy with high thermal conductivity. Multiple cooling channels / air ducts are integrated inside the antenna frame 1 through machining and welding of cover plates to dissipate the heat generated by the T / R assembly 3 and the integrated feed multifunction board 2 via thermal conduction. Simultaneously, heat-enhancing fins are arranged within the cooling channels / air ducts. The position and shape of the cooling channels / air ducts, as well as the distribution of the internal heat dissipation fins, can be determined based on the specific heat source distribution. Furthermore, the cooling channels / air ducts within the antenna frame 1 are a closed structure, thus avoiding the risk of leakage caused by liquid-cooled connectors and improving the reliability of the antenna array. To further improve heat dissipation, thermal interface materials such as thermal pads or thermal grease are attached to the mounting surfaces of the T / R assembly 3 and the integrated feed multifunction board 2. The thermal interface materials are placed between the T / R assembly 3 and the antenna frame 1, and between the integrated feed multifunction board 2 and the antenna frame 1.
[0025] Antenna element 5 employs a microstrip patch antenna, which offers advantages such as low profile, low cost, and ease of integration. Antenna element 5 includes an antenna layer and a feed layer. The antenna layer is mounted on one side of the antenna board 51, and the feed layer is connected to an SMP male connector 52 soldered to the other side of the antenna board 51. The antenna board 51 is manufactured using a lamination process between a high-frequency composite substrate and a prepreg.
[0026] like Figure 3 As shown, the T / R assembly 3 is a four-channel chip structure. Each T / R assembly 3 can connect to four antenna elements 5 simultaneously. The T / R assembly 3 includes a housing 31, inside which is a highly integrated ceramic substrate. Chips and components that perform signal amplification, phase shifting, and attenuation are mounted on the surface of the ceramic substrate. The front end of the housing 31 has four SMP female connectors 32 that are compatible with the SMP male connectors 52. The rear end of the housing 31 has two interconnect interfaces formed by exposed pads on the ceramic substrate. The housing 31 is made of a lightweight packaging composite material with high thermal conductivity. The housing 31 and the SMP male connectors 32 are hermetically sealed by laser welding to ensure a good working environment for the internal components of the housing 31.
[0027] A structural pressure plate 6 is fixedly mounted on the antenna frame 1. Sixteen T / R assemblies 3 are clamped between the structural pressure plate 6 and the antenna frame 1. The structural pressure plate 6 is made of aluminum alloy and is flat. The structural pressure plate 6 is fixed to the antenna frame 1 by bolts. In addition to its own mounting structure, the structural pressure plate 6 also provides mounting interfaces for the antenna elements 5. Specifically, the structural pressure plate 6 has 64 mounting holes 61 corresponding to 64 antenna elements 5. The SMP male connector 52 on the antenna element 1 passes through the mounting holes 61 and is matched with the corresponding SMP female connector 32 on the T / R assembly 3 to achieve blind mating interconnection of the SMP connectors. The antenna plate 51 is fixed to the structural pressure plate 6 by bolts. The structural pressure plate 6 needs to be designed with reasonable dimensional tolerances to ensure good crimping effect on the T / R assemblies 3 and proper mating of the SMP connectors. In addition, while meeting the usage requirements, some areas of the structural pressure plate 6 can be machined with weight-reduction grooves to reduce the weight of the structural pressure plate 6 and achieve lightweight design.
[0028] The integrated power supply multifunction board 2 is a multi-layer high- and low-frequency mixed-voltage printed circuit board. Various components are assembled on both sides of the printed circuit board to distribute and process radio frequency, control and power signals. One side of the integrated power supply multifunction board 2 is arranged with 32 circuit interfaces corresponding to 32 flexible connectors 4 and some high heat dissipation components. The high heat dissipation components transfer heat to the antenna frame 1 through thermal interface materials. The other side of the integrated power supply multifunction board 2 is arranged with other components and multiple external interfaces.
[0029] The flexible connector 4 is a high- and low-frequency mixed electrical connector that can synchronously transmit radio frequency, control, and power signals. The core of the flexible connector 4 is a button device, and both ends of the button are equipped with metal end caps for encapsulation and protection. One end of the flexible connector 4 is connected to the interconnection interface of the T / R component 3, and the other end is connected to the corresponding circuit interface on the integrated power supply multifunction board 2.
[0030] The assembly process of this invention is as follows:
[0031] The first step is to install the elastic connectors 4 into the corresponding through holes of the antenna frame 1.
[0032] The second step is to cut thermally conductive pads of appropriate size and thickness and attach them to the high heat dissipation components on the integrated feed multifunction board 2. Then, the integrated feed multifunction board 2 is installed on the antenna frame 1 from the rear and fixed with bolts, so that the elastic connector 4 is connected to the corresponding circuit interface on the integrated feed multifunction board 2.
[0033] The third step is to evenly apply thermal grease to the thermally conductive surfaces of multiple T / R components 3, taking care to avoid the interconnection interface positions. Then, from the front, position and attach multiple T / R components 3 between multiple positioning bosses 12 in the limiting groove 11 of the antenna frame 1, so that the elastic connector 4 is connected to the interconnection interface of the corresponding T / R component 3.
[0034] Fourth step, continue to install the structural pressure plate 2 on the upper end of the T / R assembly 3, apply pre-tightening force to the T / R assembly 3 to tighten it, and use bolts to connect and fix the structural pressure plate 6 to the antenna frame 1.
[0035] The fifth step is to install the SMP male connector 52 onto the antenna board 51 and connect it to the corresponding antenna unit 5. Then, use bolts to fix the antenna board 51 onto the structural pressure plate 6, so that the SMP male connector 52 on the antenna board 51 passes through the mounting hole 61 and is adapted to connect with the SMP female connector 32 on the corresponding T / R component 3, thus completing the insertion of the SMP connector.
[0036] The above content is merely an example and explanation of the structure of the present invention. Those skilled in the art may make various modifications or additions to the described specific embodiments or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the claims, they should all fall within the scope of protection of the present invention.
Claims
1. An antenna array of an active phased array radar, characterized in that: include: An antenna frame (1) and an integrated power feeding multifunctional board (2) and a plurality of T / R components (3) respectively mounted on both sides of the antenna frame (1); a limiting groove (11) adapted to mount the plurality of T / R components (3) is provided on one side of the antenna frame (1); a plurality of elastic connectors (4) respectively corresponding to the plurality of T / R components (3) are evenly distributed in the limiting groove (11); the plurality of elastic connectors (4) are respectively nested in a plurality of corresponding through holes on the antenna frame (1) to interconnect signals between the integrated power feeding multifunctional board (2) and the plurality of T / R components (3); a plurality of antenna units (5) are correspondingly mounted on the plurality of T / R components (3); and the antenna units (5) realize signal interconnection with the T / R components (3) via SMP connectors.
2. The antenna array according to claim 1, characterized in that: The antenna frame (1) is made of a metal material with high thermal conductivity. A plurality of cooling channels / cooling air channels are integrated inside the antenna frame (1) to dissipate heat generated by the T / R component (3) and the integrated feed multifunctional board (2) in a heat conduction manner. Fins for enhancing heat dissipation are arranged inside the cooling channels / cooling air channels.
3. The antenna array according to claim 2, characterized in that: Thermal interface materials are attached to the mounting surfaces of the T / R component (3) and the integrated power feeding multifunctional board (2), and the thermal interface materials are arranged between the T / R component (3) and the antenna frame (1) and between the integrated power feeding multifunctional board (2) and the antenna frame (1).
4. The antenna array according to claim 1, characterized in that: The antenna unit (5) adopts a microstrip patch antenna, comprising an antenna layer and a feeder layer. The antenna layer is mounted on one side of the antenna board (51), and the feeder layer is connected to an SMP male connector (52) welded on the other side of the antenna board (51).
5. The antenna array according to claim 4, characterized in that: The T / R components (3) are arranged in a sheet-like manner and are mounted in a flat manner in a limiting groove (11) of the antenna frame (1); a plurality of positioning bosses (12) are evenly distributed in the limiting groove (11) so that a plurality of T / R components (3) can be positioned and mounted between the plurality of positioning bosses (12) respectively.
6. The antenna array according to claim 5, characterized in that: The T / R assembly (3) comprises a shell (31), a ceramic substrate for mounting chips and components is arranged inside the shell (31), an SMP female connector (32) adapted to the SMP male connector (52) is arranged at the front end of the shell (31), and a soldering pad of the ceramic substrate is exposed at the rear end of the shell (31) to form an interconnection interface.
7. The antenna array according to claim 6, characterized in that: A structural pressure plate (6) is fixedly mounted on the antenna frame (1), and a plurality of T / R components (3) are clamped between the structural pressure plate (6) and the antenna frame (1). A plurality of mounting holes (61) corresponding to the plurality of antenna units (5) are provided on the structural pressure plate (6), and the SMP male connector (52) on the antenna unit (1) passes through the mounting hole (61) and is adapted to be connected to the SMP female connector (32) on the T / R component (3).
8. The antenna array according to claim 7, characterized in that: A plurality of weight-reducing grooves are provided on the structural pressing plate (6) to reduce the weight of the structural pressing plate (6).
9. The antenna array according to claim 7, characterized in that: The integrated power feeding multifunctional board (2) distributes and processes radio frequency, control and power supply signals; a plurality of circuit interfaces corresponding to the plurality of elastic connectors (4) are arranged on one side of the integrated power feeding multifunctional board (2); and a plurality of external interfaces are arranged on the other side of the integrated power feeding multifunctional board (2).
10. The antenna array according to claim 9, characterized in that: The core inside the elastic connector (4) is a wool button device, and metal end caps are configured at both ends of the wool button for packaging and protection. One end of the elastic connector (4) is connected to the interconnection interface of the T / R component (3), and the other end is connected to the corresponding circuit interface on the integrated feed multifunctional board (2).