Solder paste steel mesh with combined structure

Abstract

The invention relates to the technical field of semiconductor bonding equipment, and discloses a solder paste steel mesh with a combined structure, which comprises a laser steel mesh frame, a laser steel mesh press-fitting plate positioned above the laser steel mesh frame, and a laser steel mesh pressed between the laser steel mesh frame and the laser steel mesh press-fitting plate through bolts, the device is simple in structure, convenient to install, low in maintenance cost and convenient to switch when being adapted to different products; the laser steel mesh prepared through the laser cutting technology has extremely high opening precision and consistency, and the requirements of a high-density and high-precision SMT production line are met; the solder paste steel mesh can be customized according to different PCB designs, and is suitable for different pin distances and the layout of our. The demolding spring needles are matched with the quick clamping hooks, so that the steel mesh is more convenient to mount and dismount, and the production efficiency is further improved; through the design of the frame positioning needle sealing ring and the demoulding spring needle sealing ring, good sealing performance is provided, and solder paste leakage and pollution are prevented.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip bonding equipment, in particular to a composite structure solder paste steel mesh. Background Art

[0002] Currently, all die-bonding machines and clamp-on devices on the market can only dispense glue onto bare lead frames or the surface of die-bonded lead frames. Because a single lead frame often contains hundreds of components, meeting increasingly stringent UPH requirements requires multiple machines connected in parallel or multiple dispensing mechanisms installed on a single machine. This inevitably increases costs. Furthermore, dispensing glue onto hundreds of components on a single lead frame can be difficult to control, both in terms of placement accuracy and consistent size.

[0003] To implement the solder paste application process, a printed stencil is required to be matched with the paste application mechanism. Printed stencils generally come in two structural types: a printed stencil carved from a single piece of material or an aluminum frame stencil.

[0004] The printing steel mesh that is carefully carved from a whole piece of material has very high requirements for processing machine tools, processing technology, steel mesh material, surface treatment technology, etc., and is very expensive.

[0005] Although aluminum frame steel mesh is inexpensive, each aluminum frame steel mesh can only be used for different products. When the product model is changed, a different steel mesh model must be replaced. If the aluminum frame steel mesh is damaged, a new one must be made. This not only makes the large number of steel meshes inconvenient to manage, but also leads to corresponding increased costs.

[0006] The above scheme, therefore we need to propose a combined structure solder paste steel mesh, which is installed on the solder paste printing mechanism to realize the solder paste printing process, and solve the defects of the whole piece of material precision carving steel mesh and aluminum frame steel mesh. Summary of the Invention

[0007] The purpose of the present invention is to provide a combined structure solder paste steel mesh with a simple structure, easy installation, low maintenance cost, and easy switching when adapting to different products; the laser steel mesh prepared by laser cutting technology has extremely high opening accuracy and consistency, meeting the needs of high-density, high-precision SMT production lines; through the design of the combined structure, the solder paste steel mesh can be customized according to different PCB board designs to adapt to different pin spacing and layouts; through the cooperation of the demolding spring pin and the quick clamping hook, the installation and disassembly of the steel mesh is more convenient, further improving production efficiency; through the design of the frame positioning pin sealing ring and the demolding spring pin sealing ring, good sealing performance is provided, preventing solder paste leakage and contamination, so as to solve the problems raised in the above background technology.

[0008] To achieve the above-mentioned object, the present invention provides the following technical solutions: a composite structure solder paste stencil, comprising a laser stencil frame, a laser stencil pressing plate located above the laser stencil frame, and a laser stencil pressed between the laser stencil frame and the laser stencil pressing plate by bolts; The laser stencil frame is provided with a plurality of demoulding spring pins for assisting demoulding and limiting the position of the laser stencil. The laser stencil frame is also provided with a demoulding spring pin sealing ring which is sleeved on the periphery of the demoulding spring pins and prevents solder paste leakage. The laser steel mesh frame is also equipped with a frame positioning pin sealing ring for preventing solder paste from leaking between the laser steel mesh and the PCB board.

[0009] Preferably, a threaded blind hole is provided on the laser steel mesh frame, a through hole is provided on the laser steel mesh, a second countersunk hole is provided on the laser steel mesh pressing plate, and one end of the bolt passes through the second countersunk hole and the through hole and is threadedly connected to the inside of the threaded blind hole.

[0010] Preferably, a first countersunk hole is provided on the laser steel mesh frame, and the demoulding spring pin is installed inside the first countersunk hole.

[0011] Preferably, two laser steel meshes are stacked and provided with demoulding spring pin limiting holes aligned with the first countersunk hole. The top of the demoulding spring pin passes through the first countersunk hole and the demoulding spring pin limiting hole.

[0012] Preferably, two countersunk grooves are provided on the laser steel mesh frame near the first countersunk hole, and the frame positioning needle sealing ring is installed inside the countersunk grooves.

[0013] Preferably, the laser steel mesh is provided with two clearance holes for avoiding the positioning pins and preventing the positioning pins from contacting the laser steel mesh, and the clearance holes are aligned with the countersunk grooves.

[0014] Preferably, two quick clamping hooks are symmetrically installed at both ends of the laser steel mesh frame for realizing quick replacement of the quick clamp on the printing mechanism and the laser steel mesh frame.

[0015] Preferably, the demoulding spring needle includes a needle seat, and an elastic floating needle is movably provided on the top end of the needle seat.

[0016] Preferably, the top end of the elastic floating needle passes through the demoulding spring needle sealing ring and the demoulding spring needle limiting hole.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention has a simple structure, is easy to install, has low maintenance cost, and is easy to switch when adapting to different products; 2. The laser steel mesh prepared by the laser cutting technology of the present invention has extremely high opening accuracy and consistency, meeting the requirements of high-density and high-precision SMT production lines; 3. Through the design of modular structure, the present invention can be customized according to different PCB board designs to adapt to different pin spacing and layout; 4. The present invention makes the installation and removal of the steel mesh more convenient through the cooperation of the demoulding spring pin and the quick clamping hook, further improving the production efficiency; 5. The present invention provides good sealing performance through the design of the frame positioning pin sealing ring and the demoulding spring pin sealing ring, thereby preventing leakage and contamination of solder paste. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the front structure of the present invention; Figure 2 It is a schematic diagram of the back structure of the present invention; Figure 3 An exploded view of the present invention; Figure 4 This is a schematic structural diagram of the demoulding spring pin and the demoulding spring pin sealing ring of the present invention.

[0019] In the figure: 1. Laser steel mesh frame; 11. Threaded blind hole; 12. First countersunk hole; 13. Countersunk groove; 2. Laser steel mesh pressing plate; 21. Second countersunk hole; 3. Laser steel mesh; 31. Through hole; 32. Demolding spring pin limit hole; 33. Clearance hole; 4. Quick clamping hook; 5. Demolding spring pin; 51. Needle seat; 52. Elastic floating pin; 6. Frame positioning pin sealing ring; 7. Demolding spring pin sealing ring. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0021] See also Figure 1-4 The present invention provides a technical solution: a composite structure solder paste stencil, comprising a laser stencil frame 1, a laser stencil pressing plate 2 located above the laser stencil frame 1, and a laser stencil 3 compressed between the laser stencil frame 1 and the laser stencil pressing plate 2 by bolts; Laser Stencil 3 is made with high-precision laser cutting technology, with extremely high opening accuracy and consistency, and can meet the needs of high-density, high-precision SMT (surface mount technology) production lines.

[0022] The modular structure of the solder paste stencil allows it to be customized according to different PCB board designs to accommodate different pin spacings and component layouts. Each component can be easily disassembled and replaced, making it easy to maintain and upgrade.

[0023] The laser steel mesh 3 is made of high-strength cold-rolled steel plate or stainless steel plate, has high hardness and wear resistance, and is not easily deformed or damaged.

[0024] The laser stencil frame 1 is provided with a plurality of demoulding spring pins 5 for assisting demoulding and limiting the position of the laser stencil 3. The laser stencil frame 1 is also provided with a demoulding spring pin sealing ring 7 which is sleeved on the outer periphery of the demoulding spring pins 5 and prevents solder paste leakage. The release pins 5 have a certain degree of elasticity and restorative force. After solder paste printing is complete, they help the stencil to be smoothly removed from the PCB, ensuring the integrity and accuracy of the solder paste pattern. During this process, the release pins provide cushioning and support, preventing potential damage to the PCB and components caused by hard demolding.

[0025] The design of the release spring pins 5 simplifies the stencil removal and replacement process, thereby improving production efficiency. In SMT production lines, time is money, and any design that can shorten production cycles is highly sought after. The release spring pin design makes stencil installation and removal more convenient, reducing waiting time during production and improving overall production efficiency. By adjusting the position and number of the release spring pins 5, PCBs with different pin spacing and component layouts can be accommodated, meeting diverse production needs.

[0026] The laser steel mesh frame 1 is also equipped with a frame positioning pin sealing ring 6 for preventing solder paste from leaking between the laser steel mesh 3 and the PCB board.

[0027] The design of the frame positioning pin seal 6 and the mold release spring pin seal 7 ensures that the stencil fits tightly to the PCB, ensuring that the solder paste is accurately transferred to the corresponding position. The mold release spring pin 5 facilitates smooth demolding after solder paste printing, avoiding damage to the PCB and components.

[0028] The frame positioning pin seal 6 plays a key role in positioning the solder paste stencil. It ensures that the stencil can be accurately aligned with the target position on the PCB board, thereby achieving accurate printing of the solder paste, helping to reduce errors in the printing process and improve product quality and reliability. It can also effectively prevent solder paste or other liquids from leaking out of the gap between the stencil and the PCB board. Helps keep the printing area clean and dry, avoiding adverse effects on printing quality and subsequent processes.

[0029] The frame positioning pin sealing ring 6 provides stable support for the solder paste steel mesh, so that it can remain stable and firm during the printing process, which helps to reduce printing errors caused by vibration or displacement and improve printing accuracy and consistency.

[0030] The demoulding spring pin seal 7 assists in demoulding after solder paste printing. It provides a certain degree of elasticity and recovery force, allowing the stencil to be smoothly separated from the PCB, helping to avoid damage to the PCB and components during the demoulding process. It also ensures the integrity and accuracy of the solder paste pattern, reducing downtime caused by demoulding difficulties, making the production line run more efficiently, helping to reduce production costs and improve overall production benefits.

[0031] A threaded blind hole 11 is provided on the laser steel mesh frame 1, a through hole 31 is provided on the laser steel mesh 3, and a second countersunk hole 21 is provided on the laser steel mesh pressing plate 2. One end of the bolt passes through the second countersunk hole 21 and the through hole 31 and is threadedly connected to the inside of the threaded blind hole 11.

[0032] When assembling this device, place the laser steel mesh 3 on the laser steel mesh frame 1, align the threaded blind hole 11 with the through hole 31, then press the laser steel mesh pressing plate 2 onto the laser steel mesh 3, and align the second countersunk hole 21 with the through hole 31, and then position the three with bolts.

[0033] The laser steel mesh frame 1 is provided with a first countersunk hole 12, and the demoulding spring pins 5 are installed inside the first countersunk hole 12. Eight demoulding spring pins 5 are arranged in a matrix.

[0034] Two laser steel meshes 3 are stacked and provided with demoulding spring pin limiting holes 32 aligned with the first countersunk holes 12 . The tops of the demoulding spring pins 5 pass through the first countersunk holes 12 and the demoulding spring pin limiting holes 32 .

[0035] Optionally, eight demoulding spring pin limiting holes 32 are arranged in a matrix.

[0036] Two countersunk grooves 13 are formed on the laser steel mesh frame 1 near the first countersunk hole 12 , and the frame positioning needle sealing ring 6 is installed inside the countersunk grooves 13 .

[0037] The laser steel mesh 3 is provided with two clearance holes 33 for avoiding the positioning pins and preventing the positioning pins from contacting the laser steel mesh 3 . The clearance holes 33 are aligned with the countersunk grooves 13 .

[0038] Two quick clamping hooks 4 for realizing quick replacement of the quick clamp on the printing mechanism and the laser steel mesh frame 1 are symmetrically installed at both ends of the laser steel mesh frame 1. The design of the quick clamping hooks 4 further improves the production efficiency.

[0039] The demoulding spring needle 5 includes a needle seat 51, and a spring floating needle 52 is movably provided at the top of the needle seat 51. The demoulding process of the laser steel mesh 3 is achieved by the up and down movement of the spring floating needle 52.

[0040] The top end of the elastic floating needle 52 passes through the demoulding spring needle sealing ring 7 and the demoulding spring needle limiting hole 32.

[0041] When using, select a laser stencil 3 that precisely corresponds to the pads on the PCB board, and clean the laser stencil 3 to ensure that its surface is free of impurities and contaminants (the composition, viscosity, and metal content of the solder paste will affect the printing effect and subsequent soldering quality). Then select the appropriate solder paste; Then place the laser stencil 3 on the workbench, align it with the conveyor belt of the printer, and place and position the PCB board on the printer to avoid displacement during the printing process. Then evenly apply solder paste on the upper surface of the laser stencil 3 to ensure that the solder paste fills all the openings of the laser stencil 3. Among them, the frame positioning pin sealing ring 6 and the demoulding spring pin sealing ring 7 can effectively prevent the leakage of solder paste. The solder paste on the laser stencil 3 is printed onto the pad of the PCB board through the scraper or roller of the printer. After printing is completed, demoulding is carried out through the demoulding spring pin 5. The demoulding spring pin 5 provides a certain elasticity and restoring force to make the laser stencil 3 detached from the PCB board.

[0042] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A composite structure solder paste steel mesh, characterized by: It comprises a laser steel mesh frame (1), a laser steel mesh pressing plate (2) located above the laser steel mesh frame (1), and a laser steel mesh (3) compressed between the laser steel mesh frame (1) and the laser steel mesh pressing plate (2) by bolts; The laser steel mesh frame (1) is provided with a plurality of demoulding spring pins (5) for assisting demoulding and limiting the position of the laser steel mesh (3); the laser steel mesh frame (1) is also provided with demoulding spring pin sealing rings (7) which are sleeved on the periphery of the demoulding spring pins (5) and prevent solder paste leakage; The laser steel mesh frame (1) is also provided with a frame positioning pin sealing ring (6) for preventing solder paste from leaking between the laser steel mesh (3) and the PCB board.

2. The combined structure solder paste steel mesh according to claim 1, characterized in that: The laser steel mesh frame (1) is provided with a threaded blind hole (11), the laser steel mesh (3) is provided with a through hole (31), the laser steel mesh pressing plate (2) is provided with a second countersunk hole (21), and one end of the bolt passes through the second countersunk hole (21) and the through hole (31) and is threadedly connected to the inside of the threaded blind hole (11).

3. The combined structure solder paste steel mesh according to claim 1, characterized in that: The laser steel mesh frame (1) is provided with a first countersunk hole (12), and the demoulding spring pin (5) is installed inside the first countersunk hole (12).

4. The combined structure solder paste steel mesh according to claim 3, characterized in that: Two laser steel meshes (3) are stacked and provided, and the two laser steel meshes (3) are provided with demoulding spring pin limiting holes (32) aligned with the first countersunk hole (12), and the top of the demoulding spring pin (5) passes through the first countersunk hole (12) and the demoulding spring pin limiting hole (32).

5. The combined structure solder paste steel mesh according to claim 4, characterized in that: Two countersunk grooves (13) are provided on the laser steel mesh frame (1) near the first countersunk hole (12), and the frame positioning needle sealing ring (6) is installed inside the countersunk grooves (13).

6. The combined structure solder paste steel mesh according to claim 5, characterized in that: The laser steel mesh (3) is provided with two clearance holes (33) for avoiding the positioning needle and preventing the positioning needle from contacting the laser steel mesh (3), and the clearance holes (33) are aligned with the countersunk groove (13).

7. The combined structure solder paste steel mesh according to claim 1, characterized in that: Two quick clamping hooks (4) for realizing quick replacement of the quick clamp on the printing mechanism and the laser steel mesh frame (1) are symmetrically mounted at both ends of the laser steel mesh frame (1).

8. The combined structure solder paste steel mesh according to claim 1, characterized in that: The demoulding spring needle (5) comprises a needle seat (51), and a spring-loaded floating needle (52) is movably provided at the top end of the needle seat (51).

9. The combined structure solder paste steel mesh according to claim 8, characterized in that: The top end of the elastic floating needle (52) passes through the demoulding spring needle sealing ring (7) and the demoulding spring needle limiting hole (32).

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