Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate; a light-emitting device layer on one side of the substrate, the light-emitting device layer including a plurality of light-emitting units emitting light of a single color; the light conversion layer is located on the side, away from the substrate, of the light emitting device layer, the light conversion layer comprises a plurality of quantum dot units, and the orthographic projection of the quantum dot units on the substrate and the orthographic projection of the light emitting units on the substrate are at least partially overlapped; and the first retaining wall structures are arranged between the adjacent quantum dot units so as to separate the adjacent light emitting units. According to the technical scheme, crosstalk between the light-emitting units can be reduced, and preparation of high-PPI products is facilitated; in addition, the thickness of the display panel is small, and manufacturing of light and thin electronic products is facilitated.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] In the display field, an organic light emitting diode (OLED) device is a device that uses a multi-layer organic thin film structure to generate electroluminescence and has the advantages of light weight, high brightness, low power consumption, fast response, and a wide viewing angle.

[0003] With the widespread application of OLED devices, higher requirements are placed on the display pixel density (Pixels Per Inch, PPI) of OLED devices. However, there are still some problems in the preparation of high PPI OLED devices. Summary of the invention

[0004] In order to solve the above problems, embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device.

[0005] In a first aspect, an embodiment of the present application provides a display panel, comprising: a substrate; a light-emitting device layer, located on one side of the substrate, the light-emitting device layer comprising a plurality of light-emitting units emitting a single color of light; a light conversion layer, located on a side of the light-emitting device layer away from the substrate, the light conversion layer comprising a plurality of quantum dot units, the orthographic projection of the quantum dot unit on the substrate at least partially overlapping with the orthographic projection of the light-emitting unit on the substrate; and a first retaining wall structure, arranged between adjacent quantum dot units to separate adjacent light-emitting units.

[0006] In combination with the first aspect, the display panel also includes: a protective layer, the protective layer is located between the light-emitting device layer and the light conversion layer, and the orthographic projection of the protective layer on the substrate at least covers the orthographic projection of the light-emitting unit on the substrate; preferably, the material of the protective layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; preferably, the light-emitting unit includes a blue light-emitting unit, and the quantum dot unit includes at least a red quantum dot unit and a green quantum dot unit; preferably, the light-emitting unit includes a white light-emitting unit or an ultraviolet light-emitting unit, and the quantum dot unit includes a red quantum dot unit, a green quantum dot unit and a blue quantum dot unit; preferably, the material of the first retaining wall structure includes a black material.

[0007] In combination with the first aspect, the display panel also includes: a pixel definition layer, located between the substrate and the first retaining wall structure, the pixel definition layer encloses a plurality of pixel openings, and at least part of the light-emitting unit is located in the pixel opening; preferably, the light-emitting unit includes a first electrode, a light-emitting functional unit and a second electrode stacked in sequence along a direction away from the substrate; the first electrode is located between the substrate and the pixel definition layer, and the pixel opening exposes part of the first electrode; the light-emitting functional unit at least partially covers the exposed first electrode; the second electrode covers the light-emitting functional unit; preferably, the display panel also includes an encapsulation layer, located on the side of the light conversion layer away from the substrate; preferably, the encapsulation layer includes a first encapsulation layer, a second encapsulation layer and a third encapsulation layer stacked in sequence along a direction away from the substrate; preferably, the first encapsulation layer and the third encapsulation layer include inorganic materials, and the second encapsulation layer includes organic materials.

[0008] In combination with the first aspect, the display panel also includes a color filter layer, which is located on the side of the light conversion layer away from the substrate, and the color filter layer includes a plurality of color resist units and a second retaining wall structure arranged between adjacent color resist units, and the orthographic projections of the plurality of color resist units on the substrate at least partially overlap with the orthographic projections of the light-emitting units on the substrate; preferably, the color resist units include a red color resist unit, a green color resist unit and a blue color resist unit; preferably, the material of the second retaining wall structure includes a black material; preferably, the display panel also includes a cover plate located on the side of the color filter layer away from the substrate.

[0009] In a second aspect, an embodiment of the present application provides a method for preparing a display panel, comprising: forming a first electrode layer on a substrate; forming an isolation structure layer on a side of the first electrode layer facing away from the substrate, patterning the isolation structure layer to form an isolation structure with a mesh structure and forming a plurality of isolation openings to expose a portion of the first electrode layer, wherein the orthographic projection of a first surface of the isolation structure close to the substrate on the substrate is located within the orthographic projection of a second surface of the isolation structure away from the substrate on the substrate; forming a light-emitting functional layer and a second electrode layer in sequence on a side of the first electrode layer facing away from the substrate, the first electrode layer, the light-emitting functional layer and the second electrode layer constitute a light-emitting device layer, the light-emitting device layer comprising a plurality of light-emitting units emitting light of a single color, and at least a portion of the light-emitting units being located within the isolation openings; removing the isolation structure; forming a light conversion layer on a side of the light-emitting device layer facing away from the substrate.

[0010] In combination with the second aspect, an isolation structure layer is formed on the side of the first electrode layer away from the substrate, and the patterned isolation structure layer forms an isolation structure with a mesh structure and forms multiple isolation openings to expose part of the first electrode layer, including: forming a first film layer material and a second film layer material in sequence on the side of the first electrode layer away from the substrate, the first film layer material includes a non-photosensitive material, and the second film layer material includes a photosensitive material; using a mask template, the second film layer material is exposed; the second film layer material and the first film layer material are developed to obtain an isolation structure, the isolation structure includes a first film layer and a second film layer stacked in sequence in a direction away from the substrate, and the orthographic projection of the second film layer on the substrate covers the orthographic projection of the first film layer on the substrate; preferably, the second film layer material and the first film layer material are developed using a developer, wherein the dissolution rate of the first film layer material in the developer is greater than the dissolution rate of the second film layer material in the developer; preferably, the first film layer material includes a non-photosensitive resin glue, and the second film layer material includes a photosensitive glue.

[0011] In combination with the second aspect, removing the isolation structure includes: removing the isolation structure using a stripping process; preferably, the stripping process includes chemical stripping; preferably, before removing the isolation structure, the method also includes: forming a protective layer on the side of the light-emitting device layer away from the substrate, the protective layer at least covering the light-emitting unit.

[0012] In combination with the second aspect, a light conversion layer is formed on the side of the light-emitting device layer facing away from the substrate, including: preparing a first retaining wall structure on the side of the light-emitting device layer facing away from the substrate, the orthographic projection of the first retaining wall structure on the substrate surrounds the orthographic projection of the light-emitting unit on the substrate; preparing a quantum dot unit on the side of the light-emitting unit facing away from the substrate, the orthographic projection of the quantum dot unit on the substrate at least partially overlaps with the orthographic projection of the light-emitting unit on the substrate.

[0013] In combination with the second aspect, before the step of forming an isolation structure layer on the side of the first electrode layer facing away from the substrate, patterning the isolation structure layer to form an isolation structure with a mesh structure and forming multiple isolation openings to expose part of the first electrode layer, the method also includes: forming a pixel definition layer on the side of the first electrode layer facing away from the substrate, the pixel definition layer enclosing multiple pixel openings, and the orthographic projection of the isolation opening on the substrate surrounds the orthographic projection of the pixel opening on the substrate; preferably, the method also includes: forming a color filter layer on the side of the light conversion layer facing away from the substrate; preferably, before the step of forming the color filter layer on the side of the light conversion layer facing away from the substrate, the method also includes: forming an encapsulation layer on the side of the light conversion layer facing away from the substrate; preferably, the encapsulation layer includes a first encapsulation layer, a second encapsulation layer and a third encapsulation layer; preferably, the first encapsulation layer and the third encapsulation layer include inorganic materials, and the second encapsulation layer includes organic materials; preferably, the first encapsulation layer and the third encapsulation layer are prepared by chemical vapor deposition, and the second encapsulation layer is prepared by inkjet printing; preferably, the method also includes: forming a cover plate on the side of the color filter layer facing away from the substrate.

[0014] In a third aspect, an embodiment of the present application provides a display device, comprising the above-mentioned display panel, or comprising a display panel prepared by the above-mentioned method.

[0015] Through the above technical solution, the first retaining wall structure is used to separate adjacent light-emitting units, which can reduce crosstalk between adjacent light-emitting units and is conducive to the preparation of high PPI products; in addition, the thickness of the display panel is relatively thin, which is conducive to the preparation of light and thin electronic products; in addition, the light-emitting unit is combined with the light conversion layer to improve color purity and further enhance the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the cross-sectional structure of a display panel provided in one embodiment of the present application.

[0017] Figure 2 It is a schematic diagram of the cross-sectional structure of a display panel provided in yet another embodiment of the present application.

[0018] Figure 3 It is a schematic diagram of the cross-sectional structure of a display panel provided in yet another embodiment of the present application.

[0019] Figure 4 It is a schematic diagram of the cross-sectional structure of a display panel provided in yet another embodiment of the present application.

[0020] Figure 5 It is a schematic diagram of a process of manufacturing a display panel provided in one embodiment of the present application.

[0021] Figures 6a to 6g It is a structural schematic diagram of a method for preparing a display panel provided in one embodiment of the present application.

[0022] Figure 7 It is a schematic diagram of the structure of a display device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0024] In existing solutions, fine metal mask (FMM) technology is usually used to prepare light-emitting devices. However, the mold opening cost of FMM is high, and the aperture ratio of the light-emitting device is low. There is crosstalk between adjacent light-emitting units, so it is difficult to prepare high PPI display products.

[0025] In view of the above technical problems, on the first aspect, the embodiment of the present application provides a display panel, which can reduce the crosstalk between adjacent light-emitting units and improve the display PPI, and the thickness of the display panel is relatively thin, which is conducive to the preparation of light and thin electronic products. The display panel includes: a substrate; a light-emitting device layer, located on one side of the substrate, the light-emitting device layer includes a plurality of light-emitting units emitting a single color of light; a light conversion layer, located on the side of the light-emitting device layer away from the substrate, the light conversion layer includes a plurality of quantum dot units, the orthographic projection of the quantum dot unit on the substrate and the orthographic projection of the light-emitting unit on the substrate at least partially overlap; and a first retaining wall structure, which is arranged between adjacent quantum dot units to separate adjacent light-emitting units. In the embodiment of the present application, the use of the first retaining wall structure to separate adjacent light-emitting units can reduce the crosstalk between adjacent light-emitting units, which is conducive to the preparation of high PPI products. In addition, the thickness of the display panel is relatively thin, which is conducive to the preparation of light and thin electronic products. In addition, the light-emitting unit combined with the light conversion layer can improve the color purity and further enhance the display effect.

[0026] Figure 1 is a schematic diagram of a cross-sectional structure of a display panel provided by an embodiment of the present application. Figure 1 As shown, the display panel includes a substrate 10 , a light emitting device layer 20 , a light conversion layer 30 and a pixel definition layer 40 .

[0027] In an embodiment of the present application, the substrate 10 includes a rigid substrate, such as a glass substrate; or, the substrate 10 includes a flexible substrate, such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc.

[0028] The pixel definition layer 40 is located between the substrate 10 and the light conversion layer 30 (for example, the first retaining wall structure 320), and the pixel definition layer 40 encloses a plurality of pixel openings 401, and at least a portion of the light emitting unit 210 is located in the pixel opening 401. In the embodiment of the present application, the pixel definition layer 40 includes an organic material or an inorganic material, which is not limited in the present application. For the convenience of explaining the present application, Figure 1 Only three pixel openings 401 are shown in the figure. It can be understood that the display panel of the present application includes multiple pixel openings 401.

[0029] The light-emitting device layer 20 is located on one side of the substrate 10, and the light-emitting device layer 20 includes a plurality of light-emitting units 210 that emit a single color of light. The light-emitting unit 210 includes a first electrode 211, a light-emitting functional unit 212, and a second electrode 213 that are stacked in sequence in a direction away from the substrate 10. The first electrode 211 is located between the substrate 10 and the pixel definition layer 40, the pixel opening 401 exposes part of the first electrode 211, the light-emitting functional unit 212 at least partially covers the exposed first electrode 211, and the second electrode 213 covers the light-emitting functional unit 212. In the embodiment of the present application, the first electrode 211 is an anode and the second electrode 213 is a cathode; or, the first electrode 211 is a cathode and the second electrode 213 is an anode. Optionally, the light-emitting functional unit 212 includes a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer that are stacked in sequence.

[0030] The light conversion layer 30 is located on the side of the light emitting device layer 20 away from the substrate. The light conversion layer 30 includes a plurality of quantum dot units 310 and a first retaining wall structure 320 disposed between adjacent quantum dot units 310. The orthographic projection of the quantum dot unit 310 on the substrate 10 at least partially overlaps with the orthographic projection of the light emitting unit 210 on the substrate 10. The first retaining wall structure 320 separates adjacent light emitting units 210. In the embodiment of the present application, the light emitting unit 210 may or may not contact the side wall of the first retaining wall structure 320, which does not affect the light emitting effect. Optionally, the light emitting unit 210 contacts the side wall of the first retaining wall structure 320, such as Figure 1 Optionally, the light emitting unit 210 does not contact the side wall of the first retaining wall structure 320 , and in this case, the quantum dot unit 310 is filled between the light emitting unit 210 and the side wall of the first retaining wall structure 320 .

[0031] exist Figure 1 In the display panel shown, the light-emitting unit 210 includes a blue light-emitting unit, that is, the material of the light-emitting unit 210 includes a blue organic light-emitting material, which can emit blue light under voltage drive. The quantum dot unit 310 includes at least a red quantum dot unit 311 and a green quantum dot unit 312, which are respectively arranged on the side of the corresponding light-emitting unit 310 away from the substrate 10. The red quantum dot unit 311 is formed by a red quantum dot material, and the green quantum dot unit 312 is formed by a green quantum dot material. The red quantum dot material and / or the green quantum dot material are conventional materials in the field and are not limited here. In an embodiment of the present application, the first retaining wall structure 320 is a black material, for example, a black organic material or a black metal material, etc. When a black material is used to separate the light-emitting unit 210, light crosstalk can be better reduced.

[0032] The blue light emitted by the light-emitting unit 210 emits red light after passing through the red quantum dot unit 311, and the blue light emitted by the light-emitting unit 210 emits green light after passing through the green quantum dot unit 312. Some light-emitting units 210 are not provided with quantum dot units, and the light-emitting units 210 without quantum dot units directly emit blue light. Optionally, the side of the light-emitting unit 210 without quantum dot units facing away from the substrate 10 is filled with a subsequent film layer (for example, an encapsulation layer 50), or is filled with other transparent materials, for example, PI, PET, PEN, epoxy resin, etc., which is not limited in this application.

[0033] Continue to refer Figure 1 , the display panel further includes an encapsulation layer 50. The encapsulation layer 50 is located on the side of the light conversion layer 30 away from the substrate 10. Optionally, the encapsulation layer 60 fills the light-emitting unit 210 without a quantum dot unit. In an embodiment of the present application, the encapsulation layer 50 includes a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer stacked in sequence in a direction away from the substrate 10, the first encapsulation layer and the third encapsulation layer include inorganic materials, and the second encapsulation layer includes organic materials. Optionally, the materials of the first encapsulation layer and the third encapsulation layer include at least one of silicon oxide, silicon nitride, and silicon oxynitride.

[0034] In the embodiment of the present application, the first retaining wall structure 320 separates adjacent light-emitting units 210, which can reduce the crosstalk between the light-emitting units; and the thickness of the display panel is thin, which is conducive to the preparation of light and thin electronic products. In addition, the light-emitting unit is combined with the light conversion layer to improve the color purity and further enhance the display effect. In addition, the light conversion layer is directly formed on the light-emitting unit, which can also reduce the signal crosstalk between the light-emitting units.

[0035] Figure 2 It is a schematic diagram of the cross-sectional structure of a display panel provided in yet another embodiment of the present application. Figure 2 The display panel shown is Figure 1 The difference of the display panel shown is that the display panel also includes a protective layer 80. The protective layer 80 is located between the light-emitting device layer 20 and the light conversion layer 30, and the orthographic projection of the protective layer 80 on the substrate 10 at least covers the orthographic projection of the light-emitting unit 210 on the substrate 10. In the embodiment of the present application, when preparing the light-emitting functional unit 212 and the second electrode 213, an isolation structure needs to be used. After the preparation is completed, the isolation structure needs to be peeled off and removed. Since the light-emitting unit 210 is sensitive to water vapor, in order to avoid damage to the light-emitting unit 210, a protective layer 80 is provided on the side of the light-emitting unit 210 away from the substrate 10. In addition, when preparing the light conversion layer 30, the protective layer 80 can also protect the light-emitting unit 210 to avoid damage to the light-emitting unit 210. Optionally, the material of the protective layer 80 includes at least one of silicon nitride, silicon oxide, and silicon oxynitride, that is, the protective layer 80 is a transparent material and will not affect the light extraction efficiency.

[0036] Figure 3 It is a schematic diagram of the cross-sectional structure of a display panel provided in yet another embodiment of the present application. Figure 3 The display panel shown is Figure 2 The difference of the display panel shown is that the light emitting unit 210 includes a white light emitting unit or an ultraviolet light emitting unit, and the quantum dot unit 310 includes a red quantum dot unit 311, a green quantum dot unit 312, and a blue quantum dot unit 313. Compared with white light emitting materials and ultraviolet light emitting materials, the luminous efficiency and life of the blue light emitting material are relatively low. Therefore, white light emitting materials and / or ultraviolet light emitting materials can be selected as the materials of the light emitting functional unit, so that the life of the display panel can be improved. At this time, the quantum dot unit 310 needs to be provided with a red quantum dot unit 311, a green quantum dot unit 312, and a blue quantum dot unit 313 respectively.

[0037] Figure 4 It is a schematic diagram of the cross-sectional structure of a display panel provided in yet another embodiment of the present application. Figure 4 The display panel shown is Figure 2 The difference of the display panel shown is that the display panel further includes a color filter layer 60, the color filter layer 60 is located on the side of the encapsulation layer 50 away from the substrate 10, and the color filter layer 60 includes a plurality of color resist units 610 and a second retaining wall structure 620 disposed between adjacent color resist units 610. The second retaining wall structure 620 includes a black material, for example, a black organic material or a black metal material. Optionally, the material of the second retaining wall structure 620 may be the same as or different from the material of the first retaining wall structure 320.

[0038] The orthographic projections of the plurality of color resist units 610 on the substrate 10 at least partially overlap with the orthographic projections of the light emitting unit 210 on the substrate 10. The color of the color resist unit 610 is consistent with the color of the emitted light of the quantum dot unit 310. Specifically, the color resist unit 610 includes a red color resist unit 611, a green color resist unit 612, and a blue color resist unit 613. The red color resist unit 611 corresponds to the red quantum dot unit 311, the green color resist unit 612 corresponds to the green quantum dot unit 312, and the blue color resist unit 613 corresponds to the light emitting unit 210 without a quantum dot unit or corresponds to a blue quantum dot unit. By providing the color filter layer 60, the light crosstalk of different light emitting units can be reduced, and the color saturation of the light can be improved.

[0039] Continue to refer Figure 4 The display panel further includes a cover plate 70 located on the side of the color filter layer 60 away from the substrate 10. Exemplarily, the cover plate 70 includes a glass cover plate.

[0040] In a second aspect, an embodiment of the present application provides a method for preparing a display panel, which is used to prepare the above-mentioned display panel.

[0041] Figure 5It is a schematic diagram of a process of manufacturing a display panel provided in one embodiment of the present application. Figures 6a to 6g FIG. 1 is a schematic diagram of a method for manufacturing a display panel according to an embodiment of the present application. Figure 5 As shown, the method includes the following steps.

[0042] Step S510: forming a first electrode layer on a substrate.

[0043] The present application does not limit the method for preparing the first electrode layer, as long as the first electrode layer can be obtained. Optionally, the first electrode material layer is prepared by coating on one side of the substrate, and the first electrode material layer is patterned to obtain the first electrode layer; or, the first electrode layer is prepared on one side of the substrate by magnetron sputtering using a mask.

[0044] like Figure 6a As shown, the first electrode layer includes a plurality of first electrodes 211 arranged at intervals, and the first electrodes 211 are connected to the pixel circuit in the substrate 10 through via holes ( Figure 6a not shown).

[0045] In step S520 , an isolation structure layer is formed on a side of the first electrode layer facing away from the substrate, and the isolation structure layer is patterned to form an isolation structure with a grid structure and a plurality of isolation openings are formed to expose a portion of the first electrode layer.

[0046] In the embodiment of the present application, the orthographic projection of the first surface of the isolation structure close to the substrate on the substrate is located within the orthographic projection of the second surface of the isolation structure away from the substrate on the substrate.

[0047] Optionally, a first film layer material and a second film layer material are sequentially formed on the side of the first electrode layer facing away from the substrate. The first film layer material includes a non-photosensitive material, and the second film layer material includes a photosensitive material. Exemplarily, the first film layer material includes a non-photosensitive resin glue (e.g., Bark glue), and the second film layer material includes a photosensitive glue (e.g., PR glue). The second film layer material is exposed using a mask; the second film layer material and the first film layer material are developed to obtain an isolation structure. Optionally, the second film layer material and the first film layer material are developed using a developer, wherein the dissolution rate of the first film layer material in the developer is greater than the dissolution rate of the second film layer material in the developer, so that an isolation structure with an undercut morphology can be obtained. Specifically, as Figure 6b As shown, the isolation structure 90 includes a first film layer 910 and a second film layer 920 stacked in sequence in a direction away from the substrate 10, and the orthographic projection of the second film layer 920 on the substrate 10 covers the orthographic projection of the first film layer 910 on the substrate 10. The isolation structure 90 encloses a plurality of isolation openings 901, and the isolation openings 901 expose a portion of the first electrode layer (i.e., a portion of the first electrode 211).

[0048] Optionally, before step S520, the method further includes: forming a pixel definition layer on the side of the first electrode layer facing away from the substrate. The present application does not limit the method for preparing the pixel definition layer, as long as the pixel definition layer can be obtained. Optionally, an insulating material layer is formed on the side of the first electrode layer facing away from the substrate, and the insulating material layer is patterned to obtain the pixel definition layer. Figure 6b As shown, the isolation structure 90 is located on a portion of the surface of the pixel definition layer 40 away from the substrate 10. The pixel definition layer 40 encloses a plurality of pixel openings 401, and the orthographic projection of the isolation openings 901 on the substrate 10 surrounds the orthographic projection of the pixel openings 401 on the substrate 10, and the pixel openings 401 expose a portion of the first electrode layer (i.e., a portion of the first electrode 211).

[0049] Step S530: forming a light-emitting functional layer and a second electrode layer in sequence on a side of the first electrode layer facing away from the substrate.

[0050] In the embodiment of the present application, the first electrode layer, the light-emitting functional layer and the second electrode layer constitute a light-emitting device layer. The light-emitting device layer includes a plurality of light-emitting units emitting single-color light, at least part of which is located in the isolation opening (or pixel opening), and the isolation structure separates adjacent light-emitting units.

[0051] On the side of the first electrode layer (or pixel definition layer) away from the substrate, a light-emitting functional material layer and a second electrode material layer are sequentially deposited on the entire surface. Figure 6c As shown, since the isolation structure 90 has an undercut shape, the light-emitting functional material layer and the second electrode material layer will be disconnected at the isolation structure, thereby forming a plurality of spaced light-emitting functional units 212 and second electrodes 213, and a plurality of first electrodes 211, light-emitting functional units 212 and second electrodes 213 constitute a plurality of light-emitting units.

[0052] Step S540: removing the isolation structure.

[0053] Alternatively, if Figure 6d As shown, in order to protect the light-emitting unit, before step S540 , a protective layer 80 is formed on the side of the light-emitting device layer 20 away from the substrate 10 , and the protective layer 80 at least covers the light-emitting unit 210 .

[0054] In the embodiment of the present application, the isolation structure is removed by a stripping process to obtain Figure 6e The structure shown. A stripping process commonly used in the art can be selected to remove the isolation structure, and this application does not limit it. Exemplarily, the stripping process includes chemical stripping.

[0055] Step S550: forming a light conversion layer on the side of the light emitting device layer facing away from the substrate.

[0056] In the embodiment of the present application, a first retaining wall structure is prepared on the side of the light-emitting device layer away from the substrate; and a quantum dot unit is prepared on the side of the light-emitting unit away from the substrate. The first retaining wall structure and the quantum dot unit can be prepared by conventional processes in the art, and the present application does not limit this. Exemplarily, the first retaining wall structure is prepared by exposure and development. The quantum dot unit is prepared by exposure and development; or, the quantum dot unit is prepared by inkjet printing.

[0057] like Figure 6f As shown, the orthographic projection of the first retaining wall structure 320 on the substrate 10 surrounds the orthographic projection of the light-emitting unit 210 on the substrate 10. The orthographic projection of the quantum dot unit 310 on the substrate 10 at least partially overlaps with the orthographic projection of the light-emitting unit 210 on the substrate 10. It can be understood that in the embodiment of the present application, the light-emitting unit 210 may or may not contact the side wall of the first retaining wall structure 320, which will not affect the light emitting effect of the display panel. Optionally, the light-emitting unit 210 contacts the side wall of the first retaining wall structure 320, such as Figure 6f In other embodiments, the light emitting unit 210 may not contact the side wall of the first retaining wall structure 320 , for example, the quantum dot layer 210 is filled between the light emitting unit 210 and the side wall of the first retaining wall structure 320 .

[0058] exist Figure 6f In the structure shown, the light emitting unit includes a blue light emitting unit, and the quantum dot unit 310 includes a red quantum dot unit 311 and a green quantum dot unit 312. In other embodiments, the light emitting unit includes a white light emitting unit or an ultraviolet light emitting unit, and the quantum dot unit includes a red quantum dot unit, a green quantum dot unit, and a blue quantum dot unit.

[0059] Optionally, the method further comprises forming a color filter layer on the side of the light conversion layer away from the substrate. The color filter layer comprises a plurality of color resist units and a second retaining wall structure arranged between adjacent color resist units, wherein the orthographic projection of the color resist unit on the substrate at least partially overlaps with the orthographic projection of the light emitting unit on the substrate.

[0060] Optionally, before the step of forming a color filter layer on the side of the light conversion layer away from the substrate, the method further includes: forming an encapsulation layer on the side of the light conversion layer away from the substrate. The encapsulation layer fills the light-emitting unit without the quantum dot unit. The encapsulation layer includes a first encapsulation layer, a second encapsulation layer and a third encapsulation layer. The first encapsulation layer and the third encapsulation layer include inorganic materials, and the second encapsulation layer includes organic materials. Optionally, the first encapsulation layer and the third encapsulation layer are prepared by chemical vapor deposition, and the second encapsulation layer is prepared by inkjet printing.

[0061] Optionally, the method further comprises forming a cover plate on the side of the color filter layer facing away from the substrate, so as to obtain Figure 6g The display panel shown.

[0062] In an embodiment of the present application, when preparing the light-emitting functional layer and the second electrode layer, the light-emitting functional layer and the second electrode layer are separated by an isolation structure to obtain a plurality of disconnected light-emitting functional units and second electrodes, and the plurality of first electrodes, light-emitting functional units and second electrodes form a plurality of light-emitting units; then the isolation structure is removed by a stripping process. Since the isolation structure is removed, the height of the display panel is reduced, which is conducive to the preparation of light and thin electronic products; in addition, adjacent light-emitting units are separated by a first retaining wall structure in the light conversion layer, so that crosstalk between the light-emitting units can be reduced, which is conducive to the preparation of high display PPI products.

[0063] In a third aspect, an embodiment of the present application provides a display device, which includes the display panel described in the above embodiment.

[0064] Figure 7 is a schematic diagram of the structure of a display device provided by another embodiment of the present application. Figure 7 As shown, the display device 700 is a product with an image display function. For example, the display device 700 can be used to display static images, such as pictures or photos. The display device 700 can also be used to display dynamic images, such as videos.

[0065] The display device 700 may be a laptop computer, a mobile phone, a handheld or portable computer, a camera, a camcorder, a vehicle-mounted smart central control screen, a calculator, a smart watch, a GPS navigator, an electronic photo, an electronic billboard or sign, a projector, etc.

[0066] The display device 700 includes a display panel provided by any of the above embodiments, which may be an organic light emitting diode display panel or a quantum dot electroluminescent display panel.

[0067] In addition, the display device 700 may also have functions such as taking pictures, recording, fingerprint recognition, face recognition, etc. Accordingly, the display device 700 also includes at least one functional module for realizing the above functions, such as an under-screen camera, an under-screen fingerprint recognition sensor, etc.

[0068] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0069] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0070] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0071] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0072] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A display panel, characterized in that: include: substrate; A light-emitting device layer, located on one side of the substrate, the light-emitting device layer comprising a plurality of light-emitting units emitting light of a single color; a light conversion layer, located on a side of the light-emitting device layer away from the substrate, the light conversion layer comprising a plurality of quantum dot units, the orthographic projection of the quantum dot unit on the substrate at least partially overlapping with the orthographic projection of the light-emitting unit on the substrate; and The first retaining wall structure is arranged between adjacent quantum dot units to separate adjacent light-emitting units.

2. The display panel according to claim 1, characterized in that: Also includes: A protective layer, the protective layer is located between the light-emitting device layer and the light conversion layer, and the orthographic projection of the protective layer on the substrate at least covers the orthographic projection of the light-emitting unit on the substrate; Preferably, the material of the protective layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; Preferably, the light emitting unit comprises a blue light emitting unit, and the quantum dot unit comprises at least a red quantum dot unit and a green quantum dot unit; Preferably, the light-emitting unit comprises a white light-emitting unit or an ultraviolet light-emitting unit, and the quantum dot unit comprises a red quantum dot unit, a green quantum dot unit and a blue quantum dot unit; Preferably, the material of the first retaining wall structure includes black material.

3. The display panel according to claim 1 or 2, characterized in that: Also includes: A pixel definition layer, located between the substrate and the first retaining wall structure, the pixel definition layer encloses a plurality of pixel openings, and at least a portion of the light-emitting unit is located within the pixel openings; Preferably, the light-emitting unit comprises a first electrode, a light-emitting functional unit and a second electrode which are sequentially stacked in a direction away from the substrate; The first electrode is located between the substrate and the pixel definition layer, the pixel opening exposes a portion of the first electrode; the light emitting functional unit at least partially covers the exposed first electrode; The second electrode covers the light-emitting functional unit; Preferably, the display panel further comprises an encapsulation layer, which is located on a side of the light conversion layer away from the substrate; Preferably, the encapsulation layer comprises a first encapsulation layer, a second encapsulation layer and a third encapsulation layer which are sequentially stacked in a direction away from the substrate; Preferably, the first encapsulation layer and the third encapsulation layer include inorganic materials, and the second encapsulation layer includes organic materials.

4. The display panel according to claim 1 or 2, characterized in that: It also includes a color filter layer, which is located on the side of the light conversion layer away from the substrate, and includes a plurality of color resist units and a second retaining wall structure arranged between adjacent color resist units, and the orthographic projections of the plurality of color resist units on the substrate at least partially overlap with the orthographic projections of the light-emitting unit on the substrate; Preferably, the color resistance unit includes a red color resistance unit, a green color resistance unit and a blue color resistance unit; Preferably, the material of the second retaining wall structure includes black material; Preferably, the display panel further comprises a cover plate located on a side of the color filter layer away from the substrate.

5. A method for preparing a display panel, characterized in that: include: forming a first electrode layer on the substrate; forming an isolation structure layer on a side of the first electrode layer away from the substrate, patterning the isolation structure layer to form an isolation structure with a mesh structure and forming a plurality of isolation openings to expose a portion of the first electrode layer, wherein the orthographic projection of a first surface of the isolation structure close to the substrate on the substrate is located within the orthographic projection of a second surface of the isolation structure away from the substrate on the substrate; A light-emitting functional layer and a second electrode layer are sequentially formed on a side of the first electrode layer away from the substrate, wherein the first electrode layer, the light-emitting functional layer and the second electrode layer constitute a light-emitting device layer, wherein the light-emitting device layer includes a plurality of light-emitting units emitting light of a single color, and at least a portion of the light-emitting units is located in the isolation opening; removing the isolation structure; A light conversion layer is formed on a side of the light emitting device layer facing away from the substrate.

6. The method according to claim 5, characterized in that The step of forming an isolation structure layer on a side of the first electrode layer away from the substrate, patterning the isolation structure layer to form an isolation structure with a mesh structure and forming a plurality of isolation openings to expose a portion of the first electrode layer comprises: Forming a first film layer material and a second film layer material in sequence on a side of the first electrode layer away from the substrate, wherein the first film layer material includes a non-photosensitive material, and the second film layer material includes a photosensitive material; Using a mask, performing an exposure process on the second film layer material; Performing a development process on the second film layer material and the first film layer material to obtain the isolation structure, wherein the isolation structure comprises a first film layer and a second film layer stacked in sequence in a direction away from the substrate, and an orthographic projection of the second film layer on the substrate covers an orthographic projection of the first film layer on the substrate; Preferably, the second film layer material and the first film layer material are developed using a developer, wherein the dissolution rate of the first film layer material in the developer is greater than the dissolution rate of the second film layer material in the developer; Preferably, the first film layer material includes non-photosensitive resin glue, and the second film layer material includes photosensitive glue.

7. The method according to claim 5, characterized in that The removing the isolation structure comprises: removing the isolation structure by a stripping process; Preferably, the stripping process comprises chemical stripping; Preferably, before removing the isolation structure, the method further comprises: forming a protective layer on a side of the light-emitting device layer facing away from the substrate, wherein the protective layer at least covers the light-emitting unit.

8. The method according to claim 5, characterized in that The step of forming a light conversion layer on a side of the light emitting device layer away from the substrate comprises: A first retaining wall structure is prepared on a side of the light-emitting device layer away from the substrate, wherein the orthographic projection of the first retaining wall structure on the substrate surrounds the orthographic projection of the light-emitting unit on the substrate; A quantum dot unit is prepared on a side of the light-emitting unit away from the substrate, and an orthographic projection of the quantum dot unit on the substrate at least partially overlaps with an orthographic projection of the light-emitting unit on the substrate.

9. The method according to any one of claims 5 to 8, characterized in that: Before the steps of forming an isolation structure layer on the side of the first electrode layer away from the substrate, patterning the isolation structure layer to form an isolation structure with a mesh structure and forming a plurality of isolation openings to expose a portion of the first electrode layer, the method further comprises: forming a pixel definition layer on the side of the first electrode layer away from the substrate, the pixel definition layer enclosing a plurality of pixel openings, the orthographic projections of the isolation openings on the substrate surrounding the orthographic projections of the pixel openings on the substrate; Preferably, the method further comprises: forming a color filter layer on a side of the light conversion layer away from the substrate; Preferably, before the step of forming a color filter layer on the side of the light conversion layer away from the substrate, the method further comprises: forming an encapsulation layer on the side of the light conversion layer away from the substrate; Preferably, the encapsulation layer comprises a first encapsulation layer, a second encapsulation layer and a third encapsulation layer; Preferably, the first encapsulation layer and the third encapsulation layer include inorganic materials, and the second encapsulation layer includes organic materials; Preferably, the first encapsulation layer and the third encapsulation layer are prepared by chemical vapor deposition, and the second encapsulation layer is prepared by inkjet printing; Preferably, the method further comprises: forming a cover plate on a side of the color filter layer facing away from the substrate.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 4, or a display panel prepared by the method according to any one of claims 5 to 9.

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