Annealing apparatus and annealing method

Abstract

The invention discloses annealing equipment and an annealing method, and belongs to the technical field of solar cell preparation. The annealing equipment comprises a shell, an annealing device and a control device, wherein an annealing chamber is defined by the shell; the annealing table is arranged in the annealing chamber and is used for placing and heating a substrate containing a perovskite wet film; and the covering part is movably arranged in the annealing chamber and is configured to be in contact with the perovskite wet film so as to absorb the perovskite precursor solution in the perovskite wet film. Through the arrangement of the covering part, the covering part can selectively cover the substrate so as to allow the perovskite precursor solution in the perovskite wet film to permeate into the substrate, the evaporation speed of the perovskite precursor solution under the high temperature condition is obviously slowed down, the growth of crystal grains is promoted, meanwhile, the covering part enables the intermediate phase perovskite film to be homogenized again, and the uniformity of the intermediate phase perovskite film is improved. And defects and pinholes are reduced, so that the perovskite thin film with higher quality can be obtained, and the photoelectric conversion efficiency of the perovskite solar cell is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of solar cell preparation, and in particular relates to an annealing device and an annealing method. Background Art

[0002] Organic metal halide perovskite hybrid materials have the advantages of high absorption coefficient, adjustable band gap, long carrier diffusion length, high carrier mobility, and low exciton binding energy. They are widely used in the photovoltaic field. Perovskite solar cells are solar cells that use perovskite-type organic metal halide semiconductors as light-absorbing materials.

[0003] In the related art, when preparing perovskite thin films, it is necessary to perform high-temperature annealing on the perovskite wet film. However, the evaporation rate of the perovskite precursor solution is too fast during the annealing process, resulting in more defects and pinholes, which has a negative impact on the efficiency of perovskite solar cells. Summary of the invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes an annealing device and an annealing method, which significantly slow down the evaporation rate of the perovskite precursor solution under high temperature conditions, promote the growth of grains, make the intermediate phase perovskite film uniform again, reduce the generation of defects and pinholes, help to obtain a higher quality perovskite film, and improve the photoelectric conversion efficiency of the perovskite solar cell.

[0005] In a first aspect, the present application provides an annealing device for use in the preparation of a perovskite film, the annealing device comprising:

[0006] a housing defining an annealing chamber;

[0007] An annealing station, which is installed in the annealing chamber and is used to place and heat the substrate containing the perovskite wet film;

[0008] The cover is movably disposed in the annealing chamber and is configured to contact the perovskite wet film to absorb the perovskite precursor liquid in the perovskite wet film.

[0009] According to the annealing equipment of the present application, through the setting of the above-mentioned covering member, the covering member can be selectively covered on the substrate to allow the perovskite precursor liquid in the perovskite wet film to penetrate therein, which significantly slows down the evaporation rate of the perovskite precursor liquid under high temperature conditions and promotes the growth of grains. At the same time, the covering member makes the intermediate phase perovskite film uniform again, reduces the generation of defects and pinholes, thereby helping to obtain higher quality perovskite films, thereby improving the photoelectric conversion efficiency of perovskite solar cells.

[0010] According to one embodiment of the present application, the annealing equipment further includes:

[0011] A mounting member, the mounting member can be movably mounted in the annealing chamber, has a mounting position for mounting the cover member, and is used to drive the cover member to move relative to the annealing table;

[0012] A power source is used to drive the mounting member to move.

[0013] According to the annealing equipment of the present application, through the setting of the above-mentioned mounting parts and power source, the power source can drive the mounting parts to move relative to the annealing table. When moving, the mounting parts can drive the covering parts to switch back and forth between the state away from the perovskite wet film and the state covering the perovskite wet film, thereby eliminating the tediousness and errors of manual operation and improving the processing quality and efficiency.

[0014] According to one embodiment of the present application, the mounting member includes:

[0015] A moving member connected to an output end of the power source;

[0016] An assembly part is connected to the moving part and has the installation position.

[0017] According to the annealing equipment of the present application, through the arrangement of the above-mentioned moving parts and assembly parts, the moving parts are driven by a power source, thereby driving the assembly parts and the covering parts installed on the assembly parts to move. This design allows the movement process of the covering parts to be automated, thereby improving the convenience and efficiency of operation. At the same time, the power source can be precisely controlled by the control system to ensure that the covering parts can be accurately and stably covered on the perovskite wet film, which helps to reduce the relative displacement or collision between the covering parts and the perovskite wet film and optimize the covering effect. In addition, due to the separate design of the assembly parts and the moving parts, covering parts of different sizes or materials can be easily replaced to adapt to perovskite wet films of different specifications or process requirements.

[0018] According to one embodiment of the present application, the power source includes:

[0019] Driving mechanism;

[0020] A transmission member is dynamically connected to the driving mechanism and is rotatably mounted in the annealing chamber to drive the moving member to reciprocate in an up-and-down direction.

[0021] According to the annealing equipment of the present application, through the setting of the above-mentioned driving mechanism and transmission parts, the driving mechanism accurately controls the rotation of the transmission parts, thereby realizing the precise reciprocating motion of the moving parts in the up and down directions, so that the covering part can be accurately covered on the perovskite wet film, reducing unnecessary displacement and deviation. At the same time, by precisely controlling the movement and position of the covering part, ensuring that the covering part is in close contact with the perovskite wet film, it helps to slow down the evaporation rate of the perovskite precursor solution, promote grain growth, and improve the annealing quality.

[0022] According to an embodiment of the present application, the covering member is detachably connected to the assembly member.

[0023] According to the annealing equipment of the present application, the above-mentioned cover and assembly parts are detachably connected through the structural design, and due to the cleanliness requirements of the processing environment during the annealing process, the cover cannot be reused. The flexible and detachable assembly method of the cover provides great convenience for its frequent replacement.

[0024] According to one embodiment of the present application, the assembly comprises:

[0025] A supporting structure connected to the moving member;

[0026] A magnetic substrate is connected to a side of the support structure close to the annealing table, and the cover is magnetically adsorbed to a side of the magnetic substrate close to the annealing table.

[0027] According to the annealing equipment of the present application, through the setting of the above-mentioned supporting structure and the magnetic substrate, the magnetic adsorption method makes the replacement of the cover simple and quick, without the need for complicated disassembly and installation processes, which not only improves work efficiency but also reduces maintenance costs. At the same time, the magnetic substrate firmly adsorbs the cover through magnetic force, which can achieve precise positioning and fixation of the cover. Compared with traditional mechanical fixing methods, magnetic adsorption is not only easy to install, but also can ensure the stability of the cover during the annealing process, avoiding displacement caused by vibration or impact.

[0028] According to one embodiment of the present application, a size of the cover is not smaller than a size of the substrate.

[0029] According to the annealing equipment of the present application, by designing the size of the above-mentioned cover to be not less than the size of the substrate, the cover can completely cover the entire upper surface of the substrate as much as possible to prevent partial uncovering that causes excessive difference in solution evaporation rate in various areas of the perovskite wet film, which is beneficial to the re-homogenization of the intermediate phase perovskite film and further improves the quality of the perovskite film.

[0030] According to one embodiment of the present application, the annealing equipment further includes:

[0031] A plurality of anti-collision parts are arranged at intervals on the annealing table and are suitable for being distributed on at least two sides including the substrate. The height of the anti-collision parts is greater than the height of the substrate.

[0032] According to the annealing equipment of the present application, by setting the above-mentioned multiple anti-collision parts, the buffering effect on the residual kinetic energy of the mounting parts and the covering parts is achieved, effectively preventing the covering parts that have not yet come to rest from directly colliding with the perovskite wet film, thereby reducing the risk of damage to the perovskite wet film.

[0033] According to an embodiment of the present application, the anti-collision component is adapted to be distributed and spaced apart from the substrate.

[0034] According to the annealing equipment of the present application, the anti-collision part is designed to be spaced apart from the substrate to prevent direct contact between the anti-collision part and the perovskite wet film, so that the perovskite wet film will not be affected by the vibration and impact transmitted after the anti-collision part is buffered, thereby reducing the probability of physical damage to the perovskite wet film and maintaining the integrity and performance of the perovskite wet film during the annealing process.

[0035] According to an embodiment of the present application, the shell has an air suction port, and the air suction port is used to drive the air in the annealing chamber to be discharged.

[0036] According to one embodiment of the present application, the annealing station comprises:

[0037] A supporting platform, the supporting platform is used to place the substrate;

[0038] A heater is installed in the supporting platform and is used for heating the substrate.

[0039] In a second aspect, the present application provides an annealing method using any of the above-mentioned annealing devices, which is applied to the preparation of a perovskite film, and the annealing method comprises:

[0040] Placing a substrate including a perovskite film on the annealing station, wherein the perovskite film is a wet film;

[0041] Controlling the cover to move to a position in contact with the perovskite film;

[0042] The annealing station is controlled to heat the substrate.

[0043] According to the annealing method of the present application, through the above-mentioned logical design of controlling the contact between the cover and the substrate during the annealing process, the evaporation rate of the perovskite precursor solution under high temperature conditions is significantly slowed down, promoting the growth of grains. At the same time, the cover makes the intermediate phase perovskite film uniform again, reducing the generation of defects and pinholes, thereby helping to obtain higher quality perovskite films, thereby improving the photoelectric conversion efficiency of perovskite solar cells.

[0044] According to one embodiment of the present application, the annealing method further includes:

[0045] During the operation of the annealing station, the cover is always kept in contact with the perovskite film.

[0046] According to one embodiment of the present application, the annealing method further includes:

[0047] The working process of the annealing station is divided into a first stage and a second stage. In the first stage, the cover is kept in a position in contact with the perovskite film, and in the second stage, the cover is separated from the perovskite film.

[0048] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0050] Figure 1 It is a structural schematic diagram of the annealing equipment provided in the embodiment of the present application;

[0051] Figure 2 It is a schematic flow chart of the annealing method provided in the embodiment of the present application.

[0052] Reference numerals:

[0053] Annealing equipment 10;

[0054] Shell 11, annealing chamber 111, air suction port 112;

[0055] Annealing table 12, supporting platform 121, heater 122;

[0056] Cover 13;

[0057] Mounting member 14, moving member 141, assembly member 142, supporting structure 1421, magnetic substrate 1422;

[0058] Transmission member 15, anti-collision member 16;

[0059] Substrate 20. DETAILED DESCRIPTION

[0060] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0061] The present application discloses an annealing device 10, which is used for preparing perovskite thin films.

[0062] Reference below Figure 1 An annealing apparatus 10 according to an embodiment of the present application is described.

[0063] In some embodiments, Figure 1As shown, the annealing device 10 includes a housing 11 , an annealing table 12 and a cover 13 .

[0064] The shell 11 defines an annealing chamber 111; the annealing table 12 is installed in the annealing chamber 111, and the annealing table 12 is used to place and heat the substrate 20 containing the perovskite wet film; the cover 13 is movably disposed in the annealing chamber 111, and the cover 13 is configured to contact with the perovskite wet film to absorb the perovskite precursor liquid in the perovskite wet film.

[0065] It is understandable that in order to allow more perovskite precursor liquid to penetrate into the covering member 13, the covering member 13 may select a solvent permeable covering. Specifically, the covering member 13 may include but is not limited to cotton, polytetrafluoroethylene membrane, inherent microporous polymer or single-layer graphene, etc., which is not limited here.

[0066] For example, in some embodiments, the cover 13 is a polytetrafluoroethylene film.

[0067] The movement of the cover 13 can be achieved by a mechanical arm, a pneumatic system, an electric push rod, a lead screw structure or a guide rail structure.

[0068] For example, in some embodiments, the movement of the cover 13 can be achieved by a screw structure.

[0069] For example, in other embodiments, the movement of the cover 13 can be achieved by an electric push rod.

[0070] For example, in some other embodiments, the movement of the cover 13 can be achieved by a robotic arm.

[0071] In actual implementation, the annealing station 12 has a fixed annealing station, and the substrate 20 containing the perovskite wet film is placed in the annealing station for processing. During the annealing process, the annealing station 12 heats the substrate 20 placed in the annealing station at a high temperature, and the cover 13 can move to the top of the substrate 20. At this time, the lower surface of the cover 13 contacts the upper surface of the perovskite wet film, and the cover 13 forms a comprehensive coverage on the upper surface of the perovskite wet film. Based on the high permeability of the cover 13, the cover 13 can allow The perovskite precursor in the perovskite wet film penetrates into it to create an ultra-close space annealing environment to slow down the evaporation rate of the perovskite precursor under high temperature conditions. During the slow release of the perovskite precursor, the content of the perovskite precursor remaining inside the intermediate phase perovskite film is properly controlled to merge adjacent crystals to promote grain growth, thereby forming larger grains of perovskite. The cover 13 soaked with a large amount of perovskite precursor keeps covering the intermediate phase perovskite film, so that the intermediate phase perovskite film is homogenized again.

[0072] It should be noted that the cover 13 can keep covering the perovskite wet film throughout the entire annealing process until the annealing process is completed; or, the cover 13 can keep covering the perovskite wet film only when the perovskite precursor solution is in a highly volatile state during the annealing process, which is not limited here.

[0073] The annealing device 10 provided in the embodiment of the present application, through the setting of the above-mentioned cover 13, realizes that the cover 13 can be selectively covered on the substrate 20 to allow the perovskite precursor liquid in the perovskite wet film to penetrate therein, which significantly slows down the evaporation rate of the perovskite precursor liquid under high temperature conditions and promotes the growth of grains. At the same time, the cover 13 makes the intermediate phase perovskite film uniform again, reduces the generation of defects and pinholes, thereby helping to obtain higher quality perovskite films, thereby improving the photoelectric conversion efficiency of perovskite solar cells.

[0074] In some embodiments, Figure 1 As shown, the annealing device 10 further includes a mounting member 14 and a power source.

[0075] The mounting member 14 is movably mounted in the annealing chamber 111 . The mounting member 14 has a mounting position for mounting the cover member 13 . The mounting member 14 is used to drive the cover member 13 to move relative to the annealing table 12 . The power source is used to drive the mounting member 14 to move.

[0076] The driving mode of the power source may include but is not limited to motor start, pneumatic drive or hydraulic drive, etc., which is not limited here.

[0077] For example, in some embodiments, the driving mode of the power source is motor start.

[0078] like Figure 1 As shown, the mounting position on the mounting member 14 can be arranged opposite to the annealing position on the annealing table 12, and the mounting member 14 can move back and forth between a first position and a second position. Specifically, when the mounting member 14 is in the first position, the cover member 13 is away from the substrate 20 on the annealing table 12, and when the mounting member 14 is in the second position, the cover member 13 covers the upper surface of the perovskite wet film. The power source drives the mounting member 14 to move back and forth between the first position and the second position, thereby driving the cover member 13 to switch back and forth between a state away from the perovskite wet film and a state covering the perovskite wet film.

[0079] The annealing equipment 10 provided in the embodiment of the present application, through the arrangement of the above-mentioned mounting member 14 and the power source, the power source can drive the mounting member 14 to move relative to the annealing table 12, and the mounting member 14 can drive the covering member 13 to switch back and forth between a state away from the perovskite wet film and a state covering the perovskite wet film when moving, thereby eliminating the tediousness and errors of manual operation and improving processing quality and efficiency.

[0080] In some embodiments, Figure 1 As shown, the mounting member 14 includes a moving member 141 and an assembling member 142 .

[0081] The moving part 141 is connected to the output end of the power source; the assembly part 142 is connected to the moving part 141, and the assembly part 142 has a mounting position.

[0082] The connection method between the assembly part 142 and the moving part 141 may include but is not limited to bolt connection, snap connection or pin connection, etc., which is not limited here.

[0083] For example, in some embodiments, the connection between the assembly part 142 and the moving part 141 is a snap connection.

[0084] In this embodiment, if Figure 1 As shown, the moving part 141 can be designed as a block structure, the assembly part 142 can be designed as a plate structure, the mounting position can be located on the side of the assembly part 142 close to the annealing table 12, and the moving part 141 can be connected to the end of the assembly part 142. Specifically, two moving parts 141 can be provided, and the two moving parts 141 can be respectively connected to the opposite ends of the assembly part 142, and the two moving parts 141 move synchronously under the drive of the power source.

[0085] In other embodiments, one moving member 141 may be provided, and the moving member 141 may be connected to one end of the assembly member 142 .

[0086] The annealing equipment 10 provided in the embodiment of the present application, through the arrangement of the above-mentioned moving part 141 and the assembly part 142, drives the moving part 141 through the power source, thereby driving the assembly part 142 and the cover 13 installed on the assembly part 142 to move. This design allows the movement process of the cover 13 to be automated, thereby improving the convenience and efficiency of operation. At the same time, the power source can be precisely controlled by the control system to ensure that the cover 13 can be accurately and stably covered on the perovskite wet film, which helps to reduce the relative displacement or collision between the cover 13 and the perovskite wet film and optimize the covering effect. In addition, due to the split design of the assembly part 142 and the moving part 141, the cover 13 of different sizes or materials can be easily replaced to adapt to perovskite wet films of different specifications or process requirements.

[0087] In some embodiments, Figure 1 As shown, the power source includes: a driving mechanism and a transmission member 15.

[0088] The transmission member 15 is connected to the driving mechanism in a power manner. The transmission member 15 is rotatably mounted in the annealing chamber 111 . The transmission member 15 is used to drive the moving member 141 to reciprocate in the up-and-down direction.

[0089] The transmission method of the transmission member 15 and the moving member 141 may include but is not limited to screw transmission, worm gear transmission or crank slider transmission, etc., which is not limited here.

[0090] For example, in some embodiments, the transmission member 15 and the moving member 141 are driven by a screw.

[0091] In this embodiment, if Figure 1 As shown, the driving mechanism can be a motor, and the transmission member 15 can be a lead screw. The transmission member 15 and the movable member 141 are driven by a lead screw. In other words, the transmission member 15 and the movable member 141 are threadedly connected, and the axis of the transmission member 15 is parallel to the vertical direction. A spiral groove is engraved on the transmission member 15. When the driving mechanism drives the transmission member 15 to rotate, the movable member 141 cooperating with the transmission member 15 will move back and forth along the axis direction of the transmission member 15, that is, the movable member 141 performs a lifting motion along the vertical direction, thereby realizing the conversion from rotation to sliding.

[0092] The annealing equipment 10 provided in the embodiment of the present application, through the arrangement of the above-mentioned driving mechanism and the transmission member 15, the driving mechanism accurately controls the rotation of the transmission member 15, thereby realizing the precise reciprocating motion of the moving member 141 in the up and down directions, so that the cover 13 can be accurately covered on the perovskite wet film, reducing unnecessary displacement and deviation. At the same time, by accurately controlling the movement and position of the cover 13, it is ensured that the cover 13 is in close contact with the perovskite wet film, which helps to slow down the evaporation rate of the perovskite precursor solution, promote grain growth, and improve the annealing quality.

[0093] In some embodiments, Figure 1 As shown, the cover 13 and the assembly part 142 are detachably connected.

[0094] It is understandable that, since there are strict requirements on the processing environment of each step in the preparation process of the perovskite film, if the same cover 13 is recycled, impurities from the external environment will inevitably be mixed into the cover 13. These impurities are very likely to be mixed into the perovskite wet film, hindering the normal growth of subsequent perovskite crystals and causing defects such as cracks or holes on the surface of the perovskite film.

[0095] In this embodiment, the cover 13 is a disposable consumable, that is, after each use, the old cover 13 needs to be removed and replaced with a new cover 13, and the flexible combination between the cover 13 and the assembly part 142 is convenient for removing and replacing the cover 13.

[0096] The annealing equipment 10 provided in the embodiment of the present application has a structural design in which the cover 13 and the assembly part 142 are detachably connected. Due to the cleanliness requirements for the processing environment during the annealing process, the cover 13 cannot be reused. The flexible and detachable assembly method of the cover 13 provides great convenience for its frequent replacement.

[0097] In some embodiments, Figure 1 As shown, the assembly 142 includes: a support structure 1421 and a magnetic substrate 1422 .

[0098] The support structure 1421 is connected to the moving part 141 ; the magnetic substrate 1422 is connected to the side of the support structure 1421 close to the annealing table 12 , and the cover 13 is magnetically adsorbed to the side of the magnetic substrate 1422 close to the annealing table 12 .

[0099] Considering that the cover 13 is usually in the form of a soft film, it is difficult to fix the cover 13 using common detachable connection methods such as buckles and bolts, so a magnetic attraction method that can be attached over a large area is adopted in the design.

[0100] In this embodiment, the magnetic substrate 1422 can be installed on the supporting structure 1421 by means of bolts or snaps, and the supporting structure 1421 and the magnetic substrate 1422 can be designed as a plate structure. The upper surface of the cover 13 can be fully adsorbed on the magnetic substrate 1422, and the lower surface of the cover 13 faces the annealing table 12. The magnetic substrate 1422 and the cover 13 can be separated without consuming too much effort and time during disassembly.

[0101] In other embodiments, the cover 13 may also be detachably mounted on the assembly part 142 via Velcro.

[0102] It should be noted that, in order to further improve the cleanliness of the annealing chamber 111 , the magnetic substrate 1422 or other components may be cleaned regularly.

[0103] The annealing equipment 10 provided in the embodiment of the present application, through the arrangement of the above-mentioned support structure 1421 and the magnetic substrate 1422, makes the replacement of the cover 13 simple and quick by means of magnetic adsorption, without the need for complicated disassembly and installation processes, which not only improves work efficiency but also reduces maintenance costs. At the same time, the magnetic substrate 1422 firmly adsorbs the cover 13 through magnetic force, and can achieve precise positioning and fixation of the cover 13. Compared with traditional mechanical fixing methods, magnetic adsorption is not only easy to install, but also can ensure the stability of the cover 13 during the annealing process, and avoid displacement caused by vibration or impact.

[0104] In some embodiments, Figure 1 As shown, the size of the cover 13 is not smaller than the size of the substrate 20 .

[0105] It can be understood that the size of the cover 13 can be equal to the size of the substrate; or, the size of the cover 13 can be slightly larger than the size of the substrate.

[0106] The annealing device 10 provided in the embodiment of the present application is designed so that the size of the above-mentioned cover 13 is not less than the size of the substrate 20, so that the cover 13 can completely cover the entire upper surface of the substrate 20 as much as possible, thereby preventing local uncovered areas from causing excessive differences in the evaporation rates of the solution in various areas of the perovskite wet film, which is beneficial to the re-homogenization of the intermediate phase perovskite film and further improves the quality of the perovskite film.

[0107] In some embodiments, Figure 1 As shown, the annealing device 10 further includes a plurality of anti-collision members 16 .

[0108] A plurality of anti-collision members 16 are disposed at intervals on the annealing station 12 , and the plurality of anti-collision members 16 are suitable for being distributed on at least two sides of the substrate 20 , and the height of the anti-collision members 16 is greater than the height of the substrate 20 .

[0109] Here, “a plurality” means two or more than two. For example, in some embodiments, four anti-collision members 16 are disposed at intervals on the annealing station 12 , and the four anti-collision members 16 are distributed on four sides of the substrate 20 .

[0110] For example, in some embodiments, Figure 1 As shown, two anti-collision members 16 are disposed at intervals on the annealing station 12 , and the two anti-collision members 16 are distributed on two opposite sides of the substrate 20 .

[0111] For example, in some embodiments, three anti-collision members 16 are disposed at intervals in the annealing station 12 , and the three anti-collision members 16 are distributed on any three sides of the substrate 20 .

[0112] In this embodiment, if Figure 1 As shown, the anti-collision member 16 can be designed to be columnar. When the cover 13 moves to be about to contact with the perovskite wet film, the cover 13 has a certain speed at this time, and multiple anti-collision members 16 can stop at the magnetic substrate 1422, thereby buffering the residual kinetic energy of the mounting member 14 and the cover 13, and at the same time does not affect the contact between the lower surface of the cover 13 and the upper surface of the perovskite wet film.

[0113] The annealing equipment 10 provided in the embodiment of the present application achieves a buffering effect on the residual kinetic energy of the mounting member 14 and the covering member 13 through the arrangement of the above-mentioned multiple anti-collision members 16, effectively preventing the covering member 13 that has not yet come to rest from directly colliding with the perovskite wet film, thereby reducing the risk of damage to the perovskite wet film.

[0114] In some embodiments, Figure 1 As shown, the bumper 16 is adapted to be spaced apart from the base plate 20 .

[0115] It can be understood that when the anti-collision component 16 is distributed at a certain distance from the substrate 20, when the anti-collision component 16 stops at the magnetic substrate 1422, it forms a buffering effect on the mounting component 14 and the covering component 13 that have not yet come to rest, and the impact force cannot be transmitted to the perovskite wet film through direct contact. In other words, the perovskite wet film will not be affected by vibration and impact from the anti-collision component 16.

[0116] The annealing equipment 10 provided in the embodiment of the present application, through the structural design of the above-mentioned anti-collision member 16 being suitable for being distributed apart from the substrate 20, prevents the anti-collision member 16 from directly contacting the perovskite wet film, so that the perovskite wet film will not be affected by the vibration and impact transmitted after the anti-collision member 16 buffers, thereby reducing the probability of physical damage to the perovskite wet film and maintaining the integrity and performance of the perovskite wet film during the annealing process.

[0117] In some embodiments, Figure 1 As shown, the housing 11 has an air suction port 112 , and the air suction port 112 is used to drive the air in the annealing chamber 111 to be discharged.

[0118] It is understandable that during the annealing process, a large amount of perovskite precursor solution will naturally evaporate, and the suction port 112 can continuously absorb the volatilized gas, effectively improving the air quality in the annealing chamber 111, and reducing pollutants and impurities that may have an adverse effect on the perovskite wet film. At the same time, the operation of the suction port 112 can help maintain specific environmental conditions in the annealing chamber 111, such as temperature, humidity, etc., which is crucial for uniform annealing and high-quality preparation of perovskite films.

[0119] The annealing equipment 10 provided in the embodiment of the present application can continuously discharge the air in the annealing chamber 111 through the setting of the above-mentioned air suction port 112, effectively improve the air quality in the chamber, reduce pollutants and impurities that may have an adverse effect on the perovskite wet film, and help maintain specific environmental conditions in the annealing chamber 111, such as temperature, humidity, etc., which is crucial for uniform annealing and high-quality preparation of perovskite films.

[0120] In some embodiments, Figure 1 As shown, the annealing station 12 includes a supporting platform 121 and a heater 122 .

[0121] The supporting platform 121 is used to place the substrate 20 ; the heater 122 is installed in the supporting platform 121 , and the heater 122 is used to heat the substrate 20 .

[0122] The heating method of the heater 122 may include, but is not limited to, microwave heating, electromagnetic heating, infrared heating, or resistance heating, etc., which is not limited here.

[0123] In this embodiment, if Figure 1 As shown, the annealing station 12 can heat the substrate 20 at a high temperature by electric heating. The supporting platform 121 can be designed as a hollow structure. The heater 122 is accommodated inside the supporting platform 121. The perovskite wet film is subjected to uniform heat radiation during the heating process. The heater 122 is usually connected to a temperature control system and can accurately control the heating temperature according to process requirements to ensure that the perovskite wet film is annealed under optimal temperature conditions. The supporting platform 121 provides a stable and flat placement surface for the perovskite wet film so that the perovskite wet film will not slide or deform during the heating process. The supporting platform 121 is usually designed to be suitable for wet films of different sizes and shapes to meet the needs of different preparation processes.

[0124] In other embodiments, the annealing station 12 can heat the perovskite wet film at a high temperature by microwave heating.

[0125] In some other embodiments, the annealing station 12 can heat the perovskite wet film at a high temperature by infrared radiation heating.

[0126] The annealing device 10 provided in the embodiment of the present application, through the arrangement of the above-mentioned supporting platform 121 and heater 122, the heater 122 is installed in the supporting platform 121, and can directly heat the substrate 20 placed on the supporting platform 121, thereby reducing the heat transfer path and loss. The supporting platform 121 provides a flat and stable heating surface, and the heater 122, through its design and layout, makes the heat evenly distributed on the supporting platform 121, thereby preventing local overheating or uneven temperature from causing performance degradation of the perovskite film.

[0127] The present application also discloses an annealing method using any of the annealing devices 10 described above, which is applied to the preparation of perovskite thin films.

[0128] In some embodiments, Figure 2 As shown, the annealing method includes: step 310 , step 320 and step 330 .

[0129] Step 310 : placing the substrate 20 including the perovskite film on the annealing station 12 , where the perovskite film is a wet film.

[0130] In some embodiments, the substrate 20 including the perovskite film may be transferred from the previous station to the annealing station by a conveyor belt or other transfer mechanism.

[0131] In other embodiments, the substrate 20 including the perovskite film may be placed on the annealing table manually.

[0132] Step 320 , controlling the cover 13 to move to a position in contact with the perovskite film.

[0133] In this embodiment, if Figure 1 As shown, the driving mechanism can drive the transmission member 15 to move, and then drive the covering member to move. Specifically, the driving mechanism can be a motor, and the transmission member 15 can be a lead screw. Lead screw transmission is performed between the transmission member 15 and the moving member 141. In other words, the transmission member 15 and the moving member 141 are threadedly connected, and the axis of the transmission member 15 is parallel to the vertical direction. A spiral groove is engraved on the transmission member 15. When the driving mechanism drives the transmission member 15 to rotate, the moving member 141 cooperating with the transmission member 15 will move back and forth along the axial direction of the transmission member 15, that is, the moving member 141 performs a lifting motion along the vertical direction, thereby realizing the conversion from rotation to sliding.

[0134] In other embodiments, a robotic arm may be used to precisely control the position of the cover 13 , and the motion trajectory of the robotic arm may be set by programming so that the cover 13 can accurately reach a predetermined position.

[0135] In some other embodiments, the cover 13 may be driven to move by a cylinder or other pneumatic elements, so that a fast and repeatable covering action can be achieved.

[0136] It should be noted that in addition to the screw structure, robotic arm and pneumatic system listed above, the movement of the cover 13 can also be achieved by electric push rods, guide rail structures, hydraulic systems, gear rack structures or other mechanical and automated methods, which are not limited here.

[0137] Step 330 : Control the annealing station 12 to heat the substrate.

[0138] Exemplarily, a heater 122 may be integrated in the annealing station 12 to provide the required heat, and the heater may include but is not limited to an electric heating wire, a ceramic heater, a quartz heater, or a heating plate, etc., which is not limited here.

[0139] In actual implementation, the annealing table 12 has a fixed annealing station, and the substrate 20 containing the perovskite wet film is placed in the annealing station for processing. Before turning on the heater 122 in the annealing table 12, the substrate 20 to be annealed can be placed in the annealing station on the annealing table 12, and then the cover 13 is controlled to move above the substrate 20 so that the lower surface of the cover 13 can just contact the perovskite wet film on the substrate 20. Based on the high permeability of the cover 13, the cover 13 can allow the perovskite precursor liquid in the perovskite wet film to penetrate into it, creating an ultra-close space annealing environment. During the annealing process, the annealing table 12 heats the substrate 20 placed in the annealing station at a high temperature. The cover member soaked with a portion of the perovskite precursor liquid can better lock the perovskite precursor liquid under high temperature conditions, thereby slowing down the evaporation rate of the perovskite precursor liquid under high temperature conditions. During the slow release of the perovskite precursor liquid, the content of the perovskite precursor liquid remaining inside the intermediate phase perovskite film is properly controlled to achieve the merging of adjacent crystals to promote the growth of grains, thereby forming larger grains of perovskite. The cover member 13 soaked with a large amount of perovskite precursor liquid maintains coverage of the intermediate phase perovskite film, so that the intermediate phase perovskite film is homogenized again.

[0140] The annealing method provided in the embodiment of the present application significantly slows down the evaporation rate of the perovskite precursor solution under high temperature conditions and promotes the growth of grains through the above-mentioned logical design of controlling the contact between the cover 13 and the substrate 20 during the annealing process. At the same time, the cover 13 makes the intermediate phase perovskite film uniform again, reducing the generation of defects and pinholes, thereby helping to obtain higher quality perovskite films and further improving the photoelectric conversion efficiency of perovskite solar cells.

[0141] In some embodiments, the annealing method further comprises: during the operation of the annealing station 12 , keeping the cover 13 in contact with the perovskite film.

[0142] It is understandable that, on the one hand, in a high temperature environment, the perovskite film is easily contaminated and oxidized by oxygen, moisture and other impurities in the air, and the continuous coverage of the cover 13 provides a relatively closed and stable environment for the perovskite film, reducing the chance of contact with the external environment, thereby reducing the risk of contamination and oxidation; on the other hand, during the annealing process, there is no need to frequently adjust the position of the cover 13, which simplifies the operation process, reduces the difficulty of operation and the error rate. At the same time, it also reduces the adverse effects on the quality of the perovskite film caused by improper operation.

[0143] The annealing method provided in the embodiment of the present application provides a relatively closed and stable environment for the perovskite film through the design that the cover 13 is always covered during the operation of the annealing table 12, reducing the chance of contact with the external environment, thereby reducing the risk of contamination and oxidation. At the same time, there is no need to frequently adjust the position of the cover 13 during the annealing process, which simplifies the operation process, reduces the difficulty of operation and the error rate. At the same time, it also reduces the adverse effects on the quality of the perovskite film caused by improper operation.

[0144] In some embodiments, the annealing method further includes: the working process of the annealing station 12 is divided into a first stage and a second stage, in which the cover 13 is kept in contact with the perovskite film in the first stage, and the cover 13 is separated from the perovskite film in the second stage.

[0145] It can be understood that, due to the high wettability of the perovskite film in the first stage, the evaporation rate of the perovskite precursor liquid is relatively fast. After entering the second stage, the perovskite film is basically in a semi-dry state. The evaporation rate of the perovskite precursor liquid has tended to be slow and stable. Therefore, the cover 13 is maintained in contact with the perovskite film only in the first stage.

[0146] Exemplarily, the working process of the annealing station can be set to 20 minutes, the first stage can be set to 15 minutes, and the second stage can be set to 5 minutes.

[0147] The annealing method provided in the embodiment of the present application can more finely control the crystallization process of the perovskite film through the design that the above-mentioned cover 13 covers part of the time during the operation of the annealing table 12. The first stage slows down evaporation and promotes initial crystallization, and the second stage further promotes grain growth and rearrangement, which helps to reduce defects and pinholes in the perovskite film and improve the uniformity and density of the perovskite film.

[0148] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0149] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0150] In the description of this application, "first feature" or "second feature" may include one or more of the features.

[0151] In the description of the present application, “plurality” means two or more.

[0152] In the description of the present application, a first feature being “on” or “under” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact with each other but are in contact with each other via another feature therebetween.

[0153] In the description of the present application, “above”, “over” and “above” a first feature to a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0154] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0155] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An annealing device, used for preparing perovskite thin film, characterized in that: include: a housing defining an annealing chamber; An annealing station, which is installed in the annealing chamber and is used to place and heat the substrate containing the perovskite wet film; The cover is movably disposed in the annealing chamber and is configured to contact the perovskite wet film to absorb the perovskite precursor liquid in the perovskite wet film.

2. The annealing equipment according to claim 1, characterized in that: Also includes: A mounting member, the mounting member can be movably mounted in the annealing chamber, has a mounting position for mounting the cover member, and is used to drive the cover member to move relative to the annealing table; A power source is used to drive the mounting member to move.

3. The annealing equipment according to claim 2, characterized in that: The mounting member comprises: A moving member connected to an output end of the power source; An assembly part is connected to the moving part and has the installation position.

4. The annealing equipment according to claim 3, characterized in that: The power source comprises: Driving mechanism; A transmission member is dynamically connected to the driving mechanism and is rotatably mounted in the annealing chamber to drive the moving member to reciprocate in an up-and-down direction.

5. The annealing equipment according to claim 3, characterized in that: The covering member is detachably connected to the assembling member.

6. The annealing equipment according to claim 4, characterized in that: The assembly includes: A supporting structure connected to the moving member; A magnetic substrate is connected to a side of the support structure close to the annealing table, and the cover is magnetically adsorbed to a side of the magnetic substrate close to the annealing table.

7. The annealing equipment according to claim 1, characterized in that: The size of the cover is not smaller than the size of the substrate.

8. The annealing equipment according to claim 1, characterized in that: Also includes: A plurality of anti-collision members are arranged at intervals on the annealing table and are suitable for being distributed on at least two sides of the substrate. The height of the anti-collision members is greater than the height of the substrate.

9. The annealing equipment according to claim 8, characterized in that: The anti-collision component is adapted to be spaced apart from the base plate.

10. The annealing equipment according to any one of claims 1 to 9, characterized in that: The shell has an air suction port, and the air suction port is used to drive the air in the annealing chamber to be discharged.

11. The annealing equipment according to any one of claims 1 to 9, characterized in that: The annealing station comprises: A supporting platform, the supporting platform is used to place the substrate; A heater is installed in the supporting platform and is used for heating the substrate.

12. An annealing method using the annealing device according to any one of claims 1 to 11, applied to the preparation of a perovskite film, characterized in that: include: Placing a substrate including a perovskite film on the annealing station, wherein the perovskite film is a wet film; Controlling the cover to move to a position in contact with the perovskite film; The annealing station is controlled to heat the substrate.

13. The annealing method according to claim 12, characterized in that: Also includes: During the operation of the annealing station, the cover is always kept in contact with the perovskite film.

14. The annealing method according to claim 12, characterized in that: Also includes: The working process of the annealing station is divided into a first stage and a second stage. In the first stage, the cover is kept in a position in contact with the perovskite film, and in the second stage, the cover is separated from the perovskite film.

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