Fixing tool for preparing semiconductor device

Abstract

The invention provides a fixing tool for preparing a semiconductor device. The semiconductor device comprises a conductive substrate and a plurality of connecting terminals. The fixing tool is used for fixing the multiple connecting terminals and aligning the multiple connecting terminals to a to-be-welded area of the conductive substrate before the connecting terminals are welded to the conductive substrate. The fixing tool comprises a first fixing plate, a connecting piece, a supporting piece and a plurality of elastic pieces. A plurality of first through holes are formed in the first fixing plate; the first through hole is used for the insertion of the connection terminal. The elastic piece is fixed on the first fixing plate, and when the connecting terminal is inserted into the first through hole, the elastic piece abuts against the connecting terminal and deforms, so that the connecting terminal is fixed on the first fixing plate. The supporting piece is located on the side, facing the conductive substrate, of the first fixing plate and supports the first fixing plate, and the supporting piece is connected with the first fixing plate through the connecting piece; the first fixing plate, the connecting piece, the elastic piece and the supporting plate are respectively made of metal or metal alloy.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a fixing tool for preparing semiconductor devices. Background Art

[0002] During the preparation of semiconductor devices such as IGBT (Insulated Gate Bipolar Transistor), it is necessary to weld the connection terminals (such as signal terminals and power terminals) to the DBC (Directed Bonding Copper) substrate. Before welding, a fixture is usually used to fix each terminal, and the position of the fixture is moved to align the connection terminal with the DBC area to be welded. After welding is completed, the fixture is removed.

[0003] The fixing fixture currently used includes a metal fixing plate provided with a first positioning hole and a polytetrafluoroethylene fixing plate provided with a second positioning hole, and the width of the first positioning hole is greater than the width of the second positioning hole. After the connecting terminal is fixed to the fixing fixture, part of the connecting terminal is located in the first positioning hole, and part of it is located in the second positioning hole. In order to prevent the polytetrafluoroethylene fixing plate from deforming at high temperatures during welding, the polytetrafluoroethylene fixing plate needs to be removed after the connecting terminal is aligned with the area to be welded of the DBC. In the process of removing the polytetrafluoroethylene fixing plate, the position of the metal fixing plate may shift, causing the connecting terminal to tilt and be misaligned with the area to be welded of the DBC, which in turn causes the product obtained after welding to be scrapped, affecting the product yield. Summary of the invention

[0004] The embodiment of the present application provides a fixing tool for preparing a semiconductor device. The semiconductor device includes a conductive substrate and a plurality of connecting terminals; the fixing tool is used to fix the plurality of connecting terminals and align them with the to-be-welded area of ​​the conductive substrate before the connecting terminals are welded to the conductive substrate;

[0005] The fixing tool includes a first fixing plate, a connecting member, a supporting member and a plurality of spring pieces; the first fixing plate is provided with a plurality of first through holes; the first through holes are used for inserting the connecting terminals; the spring pieces are fixed to the first fixing plate, and when the connecting terminals are inserted into the first through holes, the spring pieces abut against the connecting terminals and deform to fix the connecting terminals to the first fixing plate; the supporting member is located on the side of the first fixing plate facing the conductive substrate and supports the first fixing plate, and the connecting member connects the supporting member to the first fixing plate.

[0006] In one embodiment, the materials of the first fixing plate, the connecting member, the spring sheet and the supporting plate are metal or metal alloy respectively.

[0007] In one embodiment, the multiple spring sheets are divided into multiple groups, each group includes two oppositely arranged spring sheets; each of the first through holes corresponds to a group of spring sheets; both ends of the spring sheets are connected to the first fixing plate; and one of the spring sheets in a group of spring sheets protrudes toward another spring sheet.

[0008] In one embodiment, the two spring sheets of each group of spring sheets are located in the corresponding first through hole, and the ends of the two spring sheets are respectively connected to the side surfaces of the first through hole; or,

[0009] The spring pieces are located on the side of the first fixing plate facing toward or away from the conductive substrate, and the orthographic projection of the minimum gap between two spring pieces of a group of spring pieces on the plane where the surface of the first fixing plate is located falls within the corresponding through hole.

[0010] In one embodiment, the minimum distance between two spring sheets in each group of spring sheets is smaller than the thickness of the corresponding connecting terminal.

[0011] In one embodiment, the difference between the thickness of the connecting terminal and the minimum distance is in the range of 0.1 mm to 0.2 mm.

[0012] In one embodiment, the connecting terminal includes a first connecting terminal and a second connecting terminal, the length of the first connecting terminal is greater than the length of the second connecting terminal; the first fixing plate includes a first sub-fixing plate and a second sub-fixing plate; the first through hole of the first sub-fixing plate is used for inserting the first connecting terminal, and the first through hole of the second sub-fixing plate is used for inserting the second connecting terminal; the second sub-fixing plate is located on the side of the first sub-fixing plate facing the conductive substrate, and at least one supporting member is provided between the first sub-fixing plate and the second sub-fixing plate.

[0013] In one embodiment, the fixing tool also includes a second fixing plate; the first fixing plate and the second fixing plate are arranged at an interval, and the first fixing plate and the second fixing plate are opposite to each other, and at least one of the supporting members is located between the first fixing plate and the second fixing plate; the first fixing plate and the second fixing plate are connected by the connecting member; the second fixing plate is provided with a plurality of second through holes, and one of the first through holes is opposite to one of the second through holes; the second through holes are used for inserting the connecting terminals; the material of the second fixing plate is metal or metal alloy.

[0014] In one embodiment, the connecting terminal includes a first connecting terminal and a second connecting terminal, the length of the first connecting terminal is greater than the length of the second connecting terminal; the first fixing plate includes a first sub-fixing plate and a second sub-fixing plate; the first through hole of the first sub-fixing plate is used for inserting the first connecting terminal, and the first through hole of the second sub-fixing plate is used for inserting the second connecting terminal; the first sub-fixing plate and the second sub-fixing plate are both located on the side of the second fixing plate away from the conductive substrate, and the second sub-fixing plate is located between the first sub-fixing plate and the second fixing plate, and at least one of the supporting members is located between the second sub-fixing plate and the second fixing plate.

[0015] In one embodiment, the orthographic projection of the second sub-fixing plate on the plane where the surface of the first sub-fixing plate is located falls within the surface of the first sub-fixing plate and is located outside the first through hole of the first sub-fixing plate; the orthographic projection of the first sub-fixing plate on the plane where the surface of the second fixing plate is located falls within the surface of the second fixing plate; at least one of the connecting members passes through the first sub-fixing plate, the second sub-fixing plate and the second fixing plate, and at least one of the connecting members passes through the area of ​​the first sub-fixing plate that is not opposite to the second sub-fixing plate and the second fixing plate.

[0016] In one embodiment, the first through holes on the first fixing plate are divided into N groups; a group of first through holes is used to fix a connecting terminal corresponding to the conductive substrate; and N is an integer greater than or equal to 2.

[0017] The main technical effects achieved by the embodiments of the present application are:

[0018] The fixing tool for preparing semiconductor devices provided in the embodiment of the present application has a spring sheet arranged on the first fixing plate. When the connecting terminal is inserted into the first through hole, the spring sheet fixes the connecting terminal on the first fixing plate, thereby preventing the connecting terminal from shifting relative to the area to be welded when the connecting terminal is aligned with the area to be welded of the conductive substrate, thereby improving the product yield. The fixing tool does not need to be provided with a polytetrafluoroethylene fixing plate for fixing the connecting terminal, thereby avoiding the situation in which the connecting terminal is shifted relative to the area to be welded during the removal of the polytetrafluoroethylene fixing plate, thereby causing the product to be scrapped, thereby effectively improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a top view of a first sub-fixing plate of a fixing tool provided by an exemplary embodiment of the present application;

[0020] Figure 2 is a top view of a second sub-fixing plate of a fixing tool provided by an exemplary embodiment of the present application;

[0021] Figure 3is a top view of a first sub-fixing plate of a fixing tool provided by an exemplary embodiment of the present application when a connecting terminal is fixed thereto;

[0022] Figure 4 is a top view of a second sub-fixing plate of a fixing tool provided by an exemplary embodiment of the present application when a connecting terminal is fixed thereto;

[0023] Figure 5 is a cross-sectional view of a fixing tool provided by an exemplary embodiment of the present application;

[0024] Figure 6 is a cross-sectional view of a fixing tool provided by another exemplary embodiment of the present application;

[0025] Figure 7 is a cross-sectional view of a connecting terminal provided by an exemplary embodiment of the present application being fixed to a fixing tool;

[0026] Figure 8 is a cross-sectional view of a connecting terminal fixed to a fixing tool provided by another exemplary embodiment of the present application;

[0027] Fig. 9 is a schematic diagram of a three-dimensional structure of a support member provided by an exemplary embodiment of the present application;

[0028] Fig.10 is a schematic diagram of a three-dimensional structure of a support member provided by another exemplary embodiment of the present application;

[0029] Fig.11 is a schematic diagram of a three-dimensional structure of a support member provided by another exemplary embodiment of the present application;

[0030] Fig.12 is a schematic diagram of a three-dimensional structure of a connecting piece provided by an exemplary embodiment of the present application;

[0031] Fig.13 is a top view of a second fixing plate of a fixing tool provided by an exemplary embodiment of the present application;

[0032] Fig.14 It is a partial structural schematic diagram of a fixing fixture, a connecting terminal, a conductive substrate and a positioning frame provided by an exemplary embodiment of the present application. Specific embodiments

[0033] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0034] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0035] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0036] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0037] The embodiment of the present application provides a fixing tool for preparing a semiconductor device. The semiconductor device includes a conductive bottom plate, a conductive substrate and a plurality of connecting terminals; the conductive substrate is welded to the conductive bottom plate, and the connecting terminals are welded to the area to be welded on the side of the conductive substrate away from the conductive bottom plate. The fixing tool is used to fix the plurality of connecting terminals and align them with the area to be welded of the conductive substrate before the connecting terminals are welded to the conductive substrate.

[0038] In some embodiments, the semiconductor device is an IGBT, and the conductive substrate is a DBC substrate, including two ceramic substrates and copper film layers located on opposite sides of the ceramic substrates. The conductive bottom plate can be a copper plate.

[0039] In some embodiments, the area to be welded of the conductive substrate may be provided with solder, and the solder is used for welding with the connecting terminal.

[0040] like Figures 1 to 6As shown, the fixing fixture includes a first fixing plate 10, a connecting member 20, a supporting member 30 and a plurality of spring pieces 40. The first fixing plate 10 is provided with a plurality of first through holes 11; the first through holes 11 are used for inserting the connecting terminals. The spring pieces 40 are fixed on the first fixing plate 10, and when the connecting terminals are inserted into the first through holes 11, the spring pieces 40 abut against the connecting terminals and deform to fix the connecting terminals on the first fixing plate 10. The supporting member 30 is located on the side of the first fixing plate 10 facing the conductive substrate and supports the first fixing plate 10, and the connecting member 20 connects the supporting member 30 to the first fixing plate 10. The side of the first fixing plate facing the conductive substrate refers to the side of the first fixing plate facing the conductive substrate when the connecting terminals fixed on the fixing fixture are aligned with the area to be welded of the conductive substrate.

[0041] The fixing tool for preparing semiconductor devices provided in the embodiment of the present application has a spring sheet arranged on the first fixing plate. When the connecting terminal is inserted into the first through hole, the spring sheet fixes the connecting terminal on the first fixing plate, which can prevent the connecting terminal from shifting relative to the area to be welded when the connecting terminal is aligned with the area to be welded of the conductive substrate, thereby improving the product yield; the fixing tool does not need to be provided with a polytetrafluoroethylene fixing plate for fixing the connecting terminal, which can avoid the situation in which the connecting terminal is shifted relative to the area to be welded during the removal of the polytetrafluoroethylene fixing plate, resulting in the product being scrapped, thereby effectively improving the product yield; the spring sheet is easy to deform, and after the connecting terminal is welded to the conductive substrate, it is easy to separate the fixing tool from the connecting terminal.

[0042] In one embodiment, the materials of the first fixing plate 10, the connecting member 20, the spring piece 40 and the supporting plate 30 are respectively made of metal or metal alloy. By setting the materials of the first fixing plate 10, the connecting member 20, the supporting member 30 and the spring piece 40 to be respectively made of metal or metal alloy, these parts of the fixing tool will not be affected during the welding process of the connecting terminal and the conductive substrate, and there is no need to remove any part before welding, so as to ensure that the connecting terminal is fixed firmly on the first fixing plate during the welding process, avoid the moving or tilting of the connecting terminal during the welding process, and further improve the product yield.

[0043] The size of the end of the semiconductor device's connecting terminal used for welding with the conductive substrate is larger than the end thereof away from the conductive substrate. The process of using the fixing tool for preparing semiconductor devices provided in the embodiment of the present application to assist in welding the connecting terminal with the conductive substrate is as follows:

[0044] First, insert the connection terminal into the fixing fixture. To facilitate the insertion of the connection terminal into the fixing fixture, first turn the fixing fixture upwards with the side facing the conductive substrate, and then insert the smaller end of the connection terminal into the fixing fixture so that the smaller end of the connection terminal enters the first through hole of the first fixing plate.

[0045] Then, the fixture is turned over so that the end of the connection terminal used for welding with the conductive substrate faces the conductive substrate. Figure 7 and Figure 8 As shown, the connection terminal 50 is in contact with the solder 90 provided on the conductive substrate 60 .

[0046] Subsequently, the connection terminal is soldered together with the solder provided in the to-be-soldered region of the conductive substrate.

[0047] Then, separate the fixing fixture from the connection terminal.

[0048] The fixing tool for preparing semiconductor devices provided in the embodiment of the present application has a spring sheet that fixes the connecting terminal firmly on the first fixing plate, and can prevent the connecting terminal from falling off during the flipping of the fixing tool; the fixing tool for preparing semiconductor devices does not need to use a polytetrafluoroethylene fixing plate, which can lower the center of gravity of the fixing tool, help improve the stability of the fixing tool, and prevent the fixing tool from tipping over during the process of transferring the fixing tool to the top of the conductive substrate and during the flipping of the fixing tool.

[0049] In one embodiment, Figures 1 to 4 As shown, the multiple spring pieces 40 are divided into multiple groups, each group includes two spring pieces 40 arranged opposite to each other; each of the first through holes 11 corresponds to a group of spring pieces; both ends of the spring pieces 40 are connected to the first fixing plate 10; one of the spring pieces 40 in a group of spring pieces protrudes toward another spring piece 40. With such a configuration, after the connecting terminal is inserted into the first through hole 11, the connecting terminal part is stuck between the two spring pieces 40, so that the connecting terminal is firmly fixed on the first fixing plate 10, preventing the connecting terminal from tilting and causing the connecting terminal to deviate relative to the area to be welded.

[0050] In one embodiment, Figures 1 to 4 As shown, the two spring pieces 40 of each group of spring pieces are located in the corresponding first through hole 11, and the ends of the two spring pieces 40 are connected to the side of the first through hole 11. That is, the first through hole 11 is opposite to the two sides connected to the two spring pieces 40 located therein. In this way, the part of the connecting terminal located in the first through hole 11 is stuck between the two spring pieces 40. In some embodiments, the two ends of the spring piece 40 can be connected to the side of the first through hole 11 by an adhesive, or can be connected to the side of the first through hole 11 by a connecting structure such as a screw. Figures 1 to 4In the embodiment shown, the first through hole 11 is a rectangular hole. In other embodiments, the first through hole 11 may be circular.

[0051] In another embodiment, the spring sheet 40 is located on the side of the first fixing plate 10 facing or away from the conductive substrate, and the orthographic projection of the minimum gap between two spring sheets 40 of a group of spring sheets on the plane where the surface of the first fixing plate 10 is located falls within the corresponding through hole 11. In this way, the spring sheet 40 is located outside the first through hole 11, which facilitates the installation of the spring sheet 40 on the first fixing plate 10. In some embodiments, the first fixing plate 10 may be provided with a plurality of protruding structures, and a protruding structure is respectively provided on both sides of each first through hole 11, and the spring sheet 40 may be connected to the protruding structure.

[0052] Furthermore, the minimum distance between two spring sheets 40 in each group of spring sheets is less than the thickness of the corresponding connecting terminal. In this way, when the connecting terminal is inserted into the gap between the two spring sheets 40, the spring sheet 40 is deformed, so that the spring sheet 40 exerts a force on the connecting terminal, so that the connecting terminal is firmly stuck between the two spring sheets 40.

[0053] Furthermore, the difference between the thickness of the connecting terminal and the minimum distance is in the range of 0.1mm to 0.2mm. This arrangement can avoid the difference between the thickness of the connecting terminal and the minimum distance being too small, resulting in poor fixing of the connecting terminal by the spring 40, and the connecting terminal may be separated from the fixing tool or tilted when the connecting terminal is aligned with the area to be welded of the conductive substrate; it can also avoid the difference between the thickness of the connecting terminal and the minimum distance being too large, and it is not easy to separate the connecting terminal from the fixing tool after the connecting terminal and the conductive substrate are welded together. In some embodiments, the difference between the thickness of the connecting terminal and the minimum distance can be 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, etc.

[0054] In other embodiments, a first through hole 11 may correspond to a spring sheet 40, the spring sheet 40 is located in the corresponding first through hole 11 and connected to the side of the first through hole 11, and the spring sheet 40 protrudes in the direction away from the side connected thereto. After the connecting terminal passes through the first through hole 11, it is stuck between the spring sheet 40 and the side of the first through hole 11 opposite to the spring sheet 40, so that the connecting terminal is fixed. In this embodiment, the minimum distance between the side of the first through hole 11 opposite to the spring sheet 40 and the spring sheet 40 is less than the thickness of the corresponding connecting terminal. Further, the difference between the thickness of the connecting terminal and the minimum distance ranges from 0.1 mm to 0.2 mm.

[0055] In one embodiment, the material of the spring sheet 40 is copper. This makes the spring sheet 40 more elastic and less likely to break, making it easy to fix the connecting terminal on the first fixing plate 10 and to separate the connecting terminal from the first fixing plate 10. In some embodiments, the spring sheet 40 may be arc-shaped.

[0056] In one embodiment, Figure 7 and Figure 8 As shown, the connection terminal 50 includes a first connection terminal 51 and a second connection terminal 52, and the length of the first connection terminal 51 is greater than the length of the second connection terminal 52. For example, the first connection terminal is a power terminal, and the second connection terminal is a signal terminal. Figure 3 , Figure 4 , Figure 7 and Figure 8 As shown, the first fixing plate 10 includes a first sub-fixing plate 101 and a second sub-fixing plate 102; the first through hole 11 of the first sub-fixing plate 101 is used for inserting the first connecting terminal 51, and the first through hole 11 of the second sub-fixing plate 102 is used for inserting the second connecting terminal 52; the second sub-fixing plate 102 is located on the side of the first sub-fixing plate 101 facing the conductive substrate 60, and at least one supporting member 30 is provided between the first sub-fixing plate 101 and the second sub-fixing plate 102. The supporting member 30 provided between the first sub-fixing plate 101 and the second sub-fixing plate 102 can keep the distance between the first sub-fixing plate 101 and the second sub-fixing plate 102 unchanged, preventing the distance between the two from changing and affecting the fixing of the connecting terminal. By setting a first sub-fixing plate 101 with a larger distance from the conductive substrate 60 for fixing the first connecting terminal 51 with a larger length, and a second sub-fixing plate 102 with a smaller distance from the conductive substrate 60 for fixing the second connecting terminal 52 with a smaller length, the ratio of the distance between the first sub-fixing plate 101 and the end of the first connecting terminal 51 for welding with the conductive substrate to the length of the first connecting terminal 51 and the ratio of the distance between the second sub-fixing plate 102 and the end of the second connecting terminal 52 for welding with the conductive substrate to the length of the second connecting terminal 52 can be made equal. By adjusting the length ratio, the first connecting terminal 51 and the second connecting terminal 52 can be firmly fixed to the fixing tooling.

[0057] Furthermore, the orthographic projection of the second sub-fixing plate 102 on the plane where the surface of the first sub-fixing plate 101 is located falls within the surface of the first sub-fixing plate 101 and is located outside the first through hole 11 of the first sub-fixing plate 101. In this way, the first sub-fixing plate 101 and the second sub-fixing plate 102 can be connected by the connecting member 20, and the second sub-fixing plate 102 does not affect the first connection terminal from entering the first through hole 11 of the first sub-fixing plate 101.

[0058] Furthermore, if Figure 1 and Figure 2 As shown, the first sub-fixing plate 101 is provided with a connection hole 12, and the second sub-fixing plate 102 is provided with a connection hole 13, and each connection hole 13 is opposite to a connection hole 12. The connecting member 20 penetrates the connection holes 12 and the connection holes 13 to connect the first sub-fixing plate 101 with the second sub-fixing plate 102.

[0059] In one embodiment, Figures 9 to 11 As shown, the support member 30 is provided with a channel 301 penetrating the support member 30 in the length direction. Multiple support members 30 may be provided on the side of each connection hole 12 facing the conductive substrate, and the connection hole 12 is connected to the channel 301 of the corresponding support member 30. The connection member 20 is provided with the connection hole 12 and the channel 301 of each support member 30 corresponding to the connection hole.

[0060] In one embodiment, Fig.12 As shown, the connecting member 20 includes an abutting portion 21 and a connecting rod 22 connected to the abutting portion 21. The abutting portion 21 of the connecting member 20 abuts against the first sub-fixing plate 101. The end of the connecting rod 22 away from the abutting portion 21 may be provided with a thread. The inner surface of the channel 301 of the supporting member 30 corresponding to the connecting hole 12 and closest to the conductive substrate may be provided with a thread, and the connecting rod 22 is threadedly connected to the supporting member 30 where the channel 31 is located, thereby connecting multiple parts of the fixing tool together.

[0061] In one embodiment, Figure 5 and Figure 6 As shown, a support member 31 and a support member 35 are provided on the side of the conductive substrate that is not opposite to the second sub-fixed plate 102 in the area of ​​the first sub-fixed plate 101, the support member 31 is in contact with the first sub-fixed plate 101, and the support member 35 is located on the side of the support member 31 that is away from the first sub-fixed plate; a support member 33 is provided between the first sub-fixed plate 101 and the second sub-fixed plate 102, and a support member 36 is provided on the side of the second sub-fixed plate 102 that is away from the first sub-fixed plate 101. The support members 31 and 33 can be Fig.10 The support members shown, support members 35 and support members 36 may be Fig.11 Support shown.

[0062] Figure 5 and Figure 7In the illustrated embodiment, the fixing plate of the fixing fixture only includes the first sub-fixing plate 101 and the second sub-fixing plate 102. The distances between the first sub-fixing plate 101 and the opposite ends of the first connection terminal 51 can be substantially the same, and the distances between the second sub-fixing plate 102 and the opposite ends of the second connection terminal 52 can be substantially the same. This can simplify the structure of the fixing fixture, and prevent the distances between the first sub-fixing plate 101 and the second sub-fixing plate 102 and the conductive substrate 60 from being too large or too small, causing the ends of the first connection terminal 51 and the second connection terminal 52 facing the conductive substrate to be offset relative to the conductive substrate 60.

[0063] In another embodiment, if Figure 6 and Figure 8 As shown, the fixing fixture further includes a second fixing plate 70; the first fixing plate 10 and the second fixing plate 70 are arranged at intervals, and the first fixing plate 10 and the second fixing plate 70 are opposite to each other, and at least one of the supporting members 30 is located between the first fixing plate 10 and the second fixing plate 70; the first fixing plate 10 and the second fixing plate 70 are connected by the connecting member 20. Fig.11 As shown, the second fixing plate 70 is provided with a plurality of second through holes 71, one of the first through holes 11 is opposite to one of the second through holes 71; the second through holes 71 are used for inserting the connecting terminals; the material of the second fixing plate 70 is metal or metal alloy. By providing the second fixing plate 70, the connecting terminals can be further positioned, and the connecting terminals can be more effectively prevented from deviating from the area to be welded of the conductive substrate. The width of the second through hole 71 can be greater than the thickness of the corresponding connecting terminal, so that the connecting terminal can enter the second through hole 71 and the connecting terminal can be separated from the second fixing plate 70.

[0064] In one embodiment, Figure 6 and Figure 8As shown, the first sub-fixing plate 101 and the second sub-fixing plate 102 are both located on the side of the second fixing plate 70 facing the conductive substrate 60, and the second sub-fixing plate 102 is located between the first sub-fixing plate 101 and the second fixing plate 70, and at least one of the support members 30 is located between the second sub-fixing plate 102 and the second fixing plate 70. Since the first sub-fixing plate 101 and the second sub-fixing plate 102 are both located on the side of the second fixing plate 70 facing the conductive substrate, during the process of inserting the first connecting terminal into the fixing tool, the end of the first connecting terminal first passes through the second through hole 71 of the second fixing plate 70, and then enters the first through hole 11 of the first sub-fixing plate 101. Since the resistance applied by the second fixing plate 70 to the first connecting terminal is relatively small, the difficulty of inserting the first connecting terminal into the fixing tool can be reduced; during the process of inserting the second connecting terminal into the fixing tool, the end of the second connecting terminal first passes through the second through hole 71 of the second fixing plate 70, and then enters the first through hole 11 of the second sub-fixing plate 102. Since the resistance applied by the second fixing plate 70 to the second connecting terminal is relatively small, the difficulty of inserting the second connecting terminal into the fixing tool can be reduced.

[0065] In one embodiment, Figure 8 As shown, the distance between the end of the first connection terminal 51 away from the conductive substrate 60 and the first sub-fixing plate 101 is less than half of its length, and the distance between the end of the first connection terminal away from the first sub-fixing plate 101 and the second fixing plate 70 is less than half of its length. In this way, the first sub-fixing plate 101 and the second fixing plate 70 are respectively fixed to the parts of the first connection terminal 51 close to both ends, so that the first connection terminal can be fixed more firmly.

[0066] In one embodiment, Figure 6 and Figure 8 As shown, the distance between the end of the second connection terminal 52 facing the first sub-fixing plate 101 and the second sub-fixing plate 102 is less than half of its length, and the distance between the end of the second connection terminal 52 facing away from the first sub-fixing plate 101 and the second fixing plate 70 is less than half of its length. In this way, the second sub-fixing plate 102 and the second fixing plate 70 are respectively fixed to the parts of the second connection terminal 52 close to both ends, so that the second connection terminal 52 can be fixed more firmly.

[0067] Furthermore, if Figures 5 to 8As shown, the orthographic projection of the second sub-fixed plate 102 on the plane where the surface of the first sub-fixed plate 101 is located falls within the surface of the first sub-fixed plate 101 and is located outside the first through hole 11 of the first sub-fixed plate 101; the orthographic projection of the first sub-fixed plate 101 on the plane where the surface of the second fixing plate 70 is located falls within the surface of the second fixing plate 70; at least one of the connecting members 20 penetrates the first sub-fixed plate 101, the second sub-fixed plate 102 and the second fixing plate 70, and at least one of the connecting members 20 penetrates the area where the first sub-fixed plate 101 is not opposite to the second sub-fixed plate and the second fixing plate 70. In this way, the area where the first sub-fixed plate 101 is opposite to the second sub-fixed plate 102 is connected to the second sub-fixed plate 102 and the second fixing plate 70, and the area where the first sub-fixed plate 101 is not opposite to the second sub-fixed plate 102 is connected to the second fixing plate 70, which can make the connection between the various components of the fixing tool more firmly, and prevent the fixing tool from falling apart or the relative movement between different components due to loose connection.

[0068] In one embodiment, Fig.13 As shown, the second fixing plate 70 is provided with a connecting hole 72, and at least one connecting member passes through the connecting hole 12 of the first sub-fixing plate 101, the connecting hole 13 of the second sub-fixing plate 102 and the connecting hole 72 of the second fixing plate 70 to connect the first sub-fixing plate 101, the second sub-fixing plate 102 and the second fixing plate 70; at least one connecting member passes through the connecting hole 12 of the first sub-fixing plate 101 and the connecting hole 72 of the second fixing plate 70 to connect the first sub-fixing plate 101 and the second fixing plate 70.

[0069] Figure 6 and Figure 8 In the embodiment shown, the support member 35 and the support member 36 are both located on the side of the second fixing plate 70 away from the first sub-fixing plate 101, and abut against the second fixing plate 70. The fixing tool for preparing semiconductor devices also includes a support member 32 and a support member 34. The support member 32 is located between the support member 31 and the second fixing plate 70, and its channel is connected to the channel of the support member 31 and the channel of the support member 35; the support member 34 is located between the second sub-fixing plate 102 and the second fixing plate 70, and its channel is connected to the channel of the support member 33 and the channel of the support member 36. The support members 32 and 34 can be Fig. 9 Of the supports shown, the height of support member 32 is greater than the height of support member 34 .

[0070] In one embodiment, Figure 1 As shown, two opposite edge regions of the first sub-fixing plate 101 are respectively provided with a plurality of connection holes 12; Fig.13As shown, two opposite edge regions of the second fixing plate 70 are respectively provided with a plurality of connection holes 72. In this way, the first sub-fixing plate 101 and the two opposite edge regions of the second fixing plate 70 are respectively connected to the connecting pieces, so that the forces on both sides of the fixing tool are relatively uniform, which helps to improve the stability of the fixing tool.

[0071] In one embodiment, Figures 5 to 8 As shown, among the support members connected to each connecting member 20, the support member with the largest distance from the first sub-fixing plate 101 is provided with a positioning boss 301 on the side away from the first sub-fixing plate 101. The positioning boss 301 is used to be inserted into the positioning hole 61 of the conductive substrate 60 to prevent the fixing tool from moving relative to the conductive substrate as a whole.

[0072] In one embodiment, the first through holes on the first fixing plate 10 are divided into N groups, and one group of first through holes is used to fix a connection terminal corresponding to the conductive substrate; N is an integer greater than or equal to 2. With such a configuration, the fixing tool can fix the connection terminals corresponding to multiple conductive substrates at the same time, which helps to improve the manufacturing efficiency of semiconductor devices.

[0073] In one embodiment, when the first fixing plate 10 includes a first sub-fixing plate 101 and a second sub-fixing plate 102 , the group of first through holes includes at least one first through hole provided in the first sub-fixing plate 101 and at least one first through hole provided in the second sub-fixing plate 102 .

[0074] In one embodiment, the second through holes on the second fixing plate 70 are divided into N groups, a group of second through holes corresponds to a group of first through holes, and a group of first through holes and a group of second through holes are simultaneously used to fix the connection terminals corresponding to the same conductive substrate.

[0075] In one embodiment, Fig.14 As shown, the fixing fixture can fix the connection terminals 50 corresponding to the two conductive substrates 60. In other embodiments, the fixing fixture can fix the connection terminals 50 corresponding to more than two conductive substrates 60. Fig.14 In the illustrated embodiment, a group of first through holes includes three first through holes 11 provided on the first sub-fixed plate 101 and four first through holes 11 provided on the second sub-fixed plate 102, and a group of second through holes includes seven second through holes 71; and a connecting terminal corresponding to a conductive substrate 60 includes three first connecting terminals 51 and four second connecting terminals 52.

[0076] In one embodiment, Fig.14 As shown, the conductive substrate 60 is positioned in the limiting space 81 of the positioning frame 80 , and the positioning frame 80 can prevent the conductive substrate 60 from moving during the welding process, thereby improving the welding accuracy. One positioning frame 80 can accommodate multiple conductive substrates 60 .

[0077] In one embodiment, the materials of the first fixing plate 10 , the second fixing plate 70 and the connecting member 20 may all be aluminum alloy; and the material of the supporting member 30 may be stainless steel.

[0078] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0079] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0080] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A fixture for preparing a semiconductor device, characterized in that: The semiconductor device comprises a conductive substrate and a plurality of connecting terminals; the fixing tool is used to fix the plurality of connecting terminals and align them with the to-be-welded area of ​​the conductive substrate before the connecting terminals are welded to the conductive substrate; The fixing fixture comprises a first fixing plate, a connecting member, a supporting member and a plurality of spring pieces; the first fixing plate is provided with a plurality of first through holes; the first through holes are used for inserting the connecting terminals; the spring pieces are fixed to the first fixing plate, and when the connecting terminals are inserted into the first through holes, the spring pieces abut against the connecting terminals and deform to fix the connecting terminals to the first fixing plate; The support member is located on a side of the first fixing plate facing the conductive substrate and supports the first fixing plate, and the connecting member connects the support member to the first fixing plate.

2. The fixture for preparing semiconductor devices according to claim 1, characterized in that: The materials of the first fixing plate, the connecting member, the spring sheet and the supporting plate are respectively metal or metal alloy.

3. The fixture for preparing semiconductor devices according to claim 1, characterized in that: The multiple spring sheets are divided into multiple groups, each group includes two spring sheets arranged opposite to each other; each of the first through holes corresponds to a group of spring sheets; both ends of the spring sheets are connected to the first fixing plate; and one spring sheet in a group of spring sheets protrudes toward another spring sheet.

4. The fixture for preparing semiconductor devices according to claim 3, characterized in that: The two spring sheets of each group of spring sheets are located in the corresponding first through hole, and the ends of the two spring sheets are respectively connected to the side surfaces of the first through hole; or, The spring pieces are located on the side of the first fixing plate facing toward or away from the conductive substrate, and the orthographic projection of the minimum gap between two spring pieces of a group of spring pieces on the plane where the surface of the first fixing plate is located falls within the corresponding through hole.

5. The fixture for preparing semiconductor devices according to claim 3, characterized in that: The minimum distance between two spring sheets in each group of spring sheets is smaller than the thickness of the corresponding connecting terminal; The difference between the thickness of the connecting terminal and the minimum distance is in the range of 0.1 mm to 0.2 mm.

6. The fixture for preparing a semiconductor device according to claim 1, characterized in that: The connecting terminal includes a first connecting terminal and a second connecting terminal, and the length of the first connecting terminal is greater than that of the second connecting terminal; the first fixing plate includes a first sub-fixing plate and a second sub-fixing plate; the first through hole of the first sub-fixing plate is used for inserting the first connecting terminal, and the first through hole of the second sub-fixing plate is used for inserting the second connecting terminal; the second sub-fixing plate is located on a side of the first sub-fixing plate facing the conductive substrate, and at least one supporting member is provided between the first sub-fixing plate and the second sub-fixing plate.

7. The fixture for preparing a semiconductor device according to claim 1, characterized in that: The fixing tool also includes a second fixing plate; the first fixing plate and the second fixing plate are arranged at an interval and opposite to each other, and at least one of the supporting members is located between the first fixing plate and the second fixing plate; the first fixing plate and the second fixing plate are connected by the connecting member; the second fixing plate is provided with a plurality of second through holes, and one of the first through holes is opposite to one of the second through holes; the second through holes are used for inserting the connecting terminals; the material of the second fixing plate is metal or metal alloy.

8. The fixture for preparing a semiconductor device according to claim 7, characterized in that: The connecting terminal includes a first connecting terminal and a second connecting terminal, and the length of the first connecting terminal is greater than that of the second connecting terminal; the first fixing plate includes a first sub-fixing plate and a second sub-fixing plate; the first through hole of the first sub-fixing plate is used for inserting the first connecting terminal, and the first through hole of the second sub-fixing plate is used for inserting the second connecting terminal; the first sub-fixing plate and the second sub-fixing plate are both located on the side of the second fixing plate away from the conductive substrate, and the second sub-fixing plate is located between the first sub-fixing plate and the second fixing plate, and at least one of the supporting members is located between the second sub-fixing plate and the second fixing plate.

9. The fixture for preparing a semiconductor device according to claim 8, characterized in that: The orthographic projection of the second sub-fixing plate on the plane where the surface of the first sub-fixing plate is located falls within the surface of the first sub-fixing plate and is located outside the first through hole of the first sub-fixing plate; the orthographic projection of the first sub-fixing plate on the plane where the surface of the second fixing plate is located falls within the surface of the second fixing plate; at least one of the connecting members passes through the first sub-fixing plate, the second sub-fixing plate and the second fixing plate, and at least one of the connecting members passes through the area of ​​the first sub-fixing plate that is not opposite to the second sub-fixing plate and the second fixing plate.

10. The fixture for preparing a semiconductor device according to claim 1, characterized in that: The first through holes on the first fixing plate are divided into N groups; a group of first through holes is used to fix a connecting terminal corresponding to the conductive substrate; N is an integer greater than or equal to 2.

Images