Blade height measuring device and scribing machine for semiconductor processing

Abstract

The invention discloses a blade height measuring device and a scribing machine for semiconductor processing in the technical field of semiconductor processing, and the device comprises a lower installation plate, an upper installation plate is arranged above the lower installation plate, a rotating ring is rotatably installed between the lower installation plate and the upper installation plate, and an upper supporting frame is fixedly installed on the upper surface of the upper installation plate. A cutting knife is fixedly installed at the upper end of the rotating ring, a movable plate is arranged at the bottom of the rotating ring, a plurality of through grooves are formed in the movable plate, an infrared distance sensor is fixedly installed at the position, corresponding to the cutting knife, of the upper surface of the movable plate, and clamping assemblies are arranged at the positions, corresponding to the two sides of the cutting knife, of the upper surface of the movable plate; the distance between the blade and the upper end of the wafer is detected before each division, uneven division of the wafer can be ensured, the accuracy of each division thickness is ensured, interference caused by blade abrasion and position movement is avoided, powder after cutting can be automatically cleaned, abrasion of the blade by the powder is reduced, and the cutting efficiency is improved. The service life of the blade is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, in particular to a blade height measuring device and a semiconductor processing dicing machine. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors.

[0003] Semiconductor wafer dicing has two slicing methods: laser and blade. The existing blade cutting method is prone to blade position errors and blade wear during long-term cutting operations. The changes in blade position and thickness can easily lead to inaccurate cutting thickness of the wafer. Most dicing machines can only slice the wafer evenly and cannot perform multiple uneven divisions on the wafer. The powder generated by cutting will also affect the next cutting, which can easily increase blade wear and make the blade more easily damaged. Summary of the invention

[0004] The technical problem of the present invention is to provide a blade height measuring device and a dicing machine for semiconductor processing, so as to provide a method for detecting the distance between the blade and the upper end of the wafer before each division, thereby ensuring that the wafer can be unevenly divided and the thickness of each division is accurate, avoiding interference caused by blade wear and position movement, and automatically cleaning the powder after cutting, reducing the wear of the powder on the blade and increasing the service life of the blade.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a blade height measuring device, comprising a lower mounting plate, an upper mounting plate is arranged above the lower mounting plate, a rotating ring is rotatably installed between the lower mounting plate and the upper mounting plate, an upper support frame is fixedly installed on the upper surface of the upper mounting plate, a cutting knife is fixedly installed on the upper end of the rotating ring, a movable plate is arranged at the bottom of the rotating ring, a plurality of through grooves are arranged on the movable plate, an infrared distance sensor is fixedly installed on the upper surface of the movable plate for the position of the cutting knife, a clamping assembly is arranged on the upper surface of the movable plate for both sides of the cutting knife, and an infrared distance sensor is also fixedly installed on the lower surface of the upper support frame at the position corresponding to the clamping assembly.

[0006] As a further solution of the present invention, the clamping assembly includes an internal threaded rod, which is rotatably installed above the movable plate and corresponds to the two sides of the infrared distance sensor. Both ends of the internal threaded rod are threadedly connected with clamping plates, and an internal transmission member is arranged between the internal threaded rods on the same side. An intermediate gear is rotatably installed on the movable plate, and a main gear is rotatably installed on the movable plate. A limiting gear is fixedly installed on the main gear, and the limiting gear is sleeved with a transmission chain, which is meshed with the intermediate gear. A slave gear is rotatably installed on one side of the internal transmission member, and the slave gear is meshed with the main gear.

[0007] A semiconductor processing dicing machine comprises a main connecting plate and a side fixing plate, a threaded member is rotatably mounted on the lower surface of the lower mounting plate, a lower threaded rod is internally threadedly connected to the threaded member, the upper end of the lower threaded rod is fixedly connected to the movable plate, a gear ring is rotatably mounted on the lower surface of the lower mounting plate, an internal gear is fixedly mounted on the threaded member, the internal gear meshes with the internal teeth of the gear ring, a driving gear is rotatably mounted on the lower surface of the lower mounting plate, the driving gear meshes with the external teeth of the gear ring, the main connecting plate and the side fixing plate are both fixedly mounted on the upper supporting frame, and a discharge assembly is arranged between the main connecting plate and the side fixing plate.

[0008] As a further solution of the present invention, side gears are rotatably installed on both sides of the upper surface of the upper mounting plate, an intermediate gear ring is fixedly installed on the upper end of the rotating ring, the intermediate gear ring is meshed with the side gears, a connecting shaft is fixedly installed on the lower end of the side gear, an upper connecting rod is fixedly installed on the upper end of the side gear, and a lower transmission member is arranged between the connecting shafts.

[0009] As a further solution of the present invention, upper rotating shafts are rotatably installed on both sides of the upper end of the upper support frame, a rotating fan is fixedly installed on the lower end of the upper rotating shaft, an upper bevel gear is fixedly installed on the upper end of the upper rotating shaft, an upper transmission rod is rotatably installed on the position of the upper support frame corresponding to the upper bevel gear, a lower bevel gear is fixedly installed on the upper end of the upper transmission rod, the lower bevel gear is meshed with the upper bevel gear, and an upper transmission member is arranged between the upper transmission rod and the upper connecting rod.

[0010] As a further solution of the present invention, the unloading assembly includes a transmission member, a secondary connecting plate is arranged on the side of the upper support frame close to the main connecting plate, the transmission member is arranged between the main connecting plate and the secondary connecting plate, a rotating rod is rotatably installed between the upper support frames, a vacuum pumping member is fixedly installed on the rotating rod at a position corresponding to the clamping assembly, an adsorption member is fixedly and slidably installed on the lower end of the vacuum pumping member, a suction pipe is arranged between the adsorption member and the vacuum pumping member, and driven gears are fixedly installed on both ends of the rotating rod.

[0011] As a further solution of the present invention, an active rod is rotatably installed between the side fixed plates, active disks are fixedly installed at both ends of the active rod, a toggle rod is fixedly installed on the active disk, a connecting piece is rotatably installed on the upper support frame, a half-width gear is fixedly installed on one side of the connecting piece, and the toggle rod is introduced into the connecting piece.

[0012] As a further solution of the present invention, a side transmission member is arranged between one end of the transmission member close to the upper support frame and the active rod.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. The infrared distance sensor on the movable plate in the present invention can be used to measure the distance between the movable plate and the cutting knife, and the infrared distance sensor on the support can be used to measure the distance between the upper end of the wafer fixed between the support and the clamping assembly. Since the distance between the cutting blade and the upper support frame is fixed, the upper and lower sets of infrared distance sensor data can be used to obtain the distance between the upper end of the wafer and the cutting blade. The infrared distance sensor performs one-side distance measurement after each cut, and can perform one-side distance positioning after each cut to ensure the accuracy of the thickness of each cut, avoid the influence of blade position movement and thickness change on the cutting thickness, ensure the accuracy of the thickness, and can adjust the size of each cutting thickness by moving the movable plate to perform uneven cutting of the wafer.

[0014] 2. When the present invention is cutting, the wafer is fixed on the movable plate, and a group of connecting shafts are driven to rotate by a rotating motor. The rotation of the connecting shaft drives the side gears to rotate, and the rotation of the side gears drives the middle gear ring to rotate. The rotation of the middle gear ring drives the cutting knife to rotate, and the cutting knife rotates to cut the wafer. As the movable plate continues to move upward, the wafer is gradually cut, and the upper end of the wafer is adsorbed by the unloading component. After cutting, the unloading component automatically transports the diced slices to avoid the trouble of manual transportation. The timely transportation of the diced slices can clean the cutting powder on the surface of the wafer. The powder residue generated by cutting on the surface of the wafer causes wear to the cutting knife, thereby increasing the service life of the cutting knife. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0016] Figure 1 This is a schematic diagram of the rear side viewing angle structure of the present invention; Figure 2 For the present invention Figure 1 A partial schematic diagram of the structure at A in the middle; Figure 3 This is a schematic diagram of the structure of the present invention from a front side perspective; Figure 4 For the present invention Figure 3 A partial schematic diagram of the structure at B in the middle; Figure 5 This is a schematic diagram of the structure of the present invention when viewed from the bottom up; Figure 6 It is a structural cross-sectional view of the present invention; Figure 7 For the present invention Figure 6 Partial schematic diagram of the structure at point C in the middle.

[0017] In the accompanying drawings, the components represented by the reference numerals are listed as follows: 1. Lower mounting plate; 2. Upper mounting plate; 3. Rotating ring; 4. Upper support frame; 5. Side gear; 6. Connecting shaft; 7. Main connecting plate; 8. Limiting gear; 9. Intermediate gear ring; 10. Cutting knife; 11. Adsorption member; 12. Upper rotating shaft; 13. Rotating fan; 14. Upper connecting rod; 15. Secondary connecting plate; 16. Lower threaded rod; 17. Upper bevel gear; 18. Lower bevel gear; 19. Upper transmission member; 20. Upper transmission rod; 21. Rotating rod; 22. Driven gear; 23. Transmission member; 24. Active rod ; 25. Side fixing plate; 26. Half-width gear; 27. Active disk; 28. Transmission chain; 29. ​​Side transmission member; 30. Connecting member; 31. Toggle rod; 32. Vacuum member; 33. Suction tube; 34. Movable plate; 35. Lower transmission member; 36. Gear ring; 37. Threaded member; 38. Internal gear; 39. Driving gear; 40. Infrared distance sensor; 41. Internal threaded rod; 42. Clamping plate; 43. Internal transmission member; 44. Slave gear; 45. Main gear; 46. Intermediate gear; 47. Through groove. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] See also Figure 1-Figure 7The present invention provides a technical solution: a blade height measuring device, comprising a lower mounting plate 1, an upper mounting plate 2 is arranged above the lower mounting plate 1, a rotating ring 3 is rotatably installed between the lower mounting plate 1 and the upper mounting plate 2, an upper supporting frame 4 is fixedly installed on the upper surface of the upper mounting plate 2, a cutting knife 10 is fixedly installed on the upper end of the rotating ring 3, a movable plate 34 is arranged at the bottom of the rotating ring 3, a plurality of through grooves 47 are arranged on the movable plate 34, an infrared distance sensor 40 is fixedly installed on the upper surface of the movable plate 34 for the position of the cutting knife 10, a clamping assembly is arranged on the upper surface of the movable plate 34 for both sides of the cutting knife 10, and an infrared distance sensor 40 is also fixedly installed on the lower surface of the upper supporting frame 4 at the position corresponding to the clamping assembly.

[0020] During operation, the infrared distance sensor on the movable plate 34 of the present invention can be used to measure the distance between the movable plate 34 and the cutting knife 10, and the infrared distance sensor 40 on the support can be used to measure the distance between the upper end of the wafer fixed between the support and the clamping assembly. Since the distance between the cutting knife 10 and the upper support frame 4 is fixed, the data of the upper and lower groups of infrared distance sensors 40 can be used to obtain the distance between the upper end of the wafer and the cutting knife 10. The infrared distance sensor 40 performs one-side distance measurement after each cutting, and can perform one-side distance positioning after each cutting to ensure that the thickness of each cutting is The accuracy of the degree can be ensured, and the influence of blade position movement and thickness change on the cutting thickness can be avoided to ensure the accuracy of the thickness. The size of each cutting thickness can be adjusted by moving the movable plate 34 (the driving gear 39 rotates through the external teeth to drive the gear ring 36 to rotate, and the gear ring 36 rotates through the internal teeth to drive the internal gear 38 to rotate, and the internal gear 38 rotates to drive the threaded member 37 to rotate, and the threaded member 37 rotates and interacts with the lower threaded rod, thereby driving the lower threaded rod to move upward, and then driving the movable plate 34 to move upward, and the movable plate 34 moves upward to drive the wafer thereon to move upward) to perform uneven cutting of the wafer.

[0021] In the present invention, the infrared distance sensor on the movable plate 34 can be used to measure the distance between the movable plate 34 and the cutting knife 10, and the infrared distance sensor 40 on the support can be used to measure the distance between the upper end of the wafer fixed between the support and the clamping assembly. Since the distance between the cutting knife 10 and the upper support frame 4 is fixed, the data of the upper and lower groups of infrared distance sensors 40 can be used to obtain the distance between the upper end of the wafer and the cutting knife 10. The infrared distance sensor 40 performs one-side distance measurement after each cutting, and can perform one-side distance positioning after each cutting to ensure the accuracy of the thickness of each cutting, avoid the influence of blade position movement and thickness change on the cutting thickness, ensure the accuracy of the thickness, and can adjust the size of each cutting thickness by moving the movable plate 34 to perform uneven cutting of the wafer.

[0022] As a further solution of the present invention, the clamping assembly includes an internal threaded rod 41, which is rotatably installed above the movable plate 34 and corresponds to the two sides of the infrared distance sensor 40. Both ends of the internal threaded rod 41 are threadedly connected with the clamping plates 42, and an internal transmission member 43 is arranged between the internal threaded rods 41 on the same side. An intermediate gear 46 is rotatably installed on the movable plate 34, and a main gear 45 is rotatably installed on the movable plate 34. A limiting gear 8 is fixedly installed on the main gear 45, and the limiting gear 8 is sleeved with a transmission chain 28, which is meshed with the intermediate gear 46. A slave gear 44 is rotatably installed on one side of the internal transmission member 43, and the slave gear 44 is meshed with the main gear 45.

[0023] During operation, the wafer of the present invention is placed between the internal threaded rods 41 on the movable plate 34, and the internal micro motor drives the intermediate gear 46 to rotate. The rotation of the intermediate gear 46 drives the limit gear 8 to rotate through the transmission chain 28. The rotation of the limit gear 8 drives the main gear 45 to rotate. The rotation of the main gear 45 drives the slave gear 44 to rotate. The rotation of the slave gear 44 drives the internal transmission member 43 to rotate. The rotation of the internal transmission member 43 drives the internal threaded rod 41 to rotate. The rotation of the internal threaded rod 41 drives the clamping plates 42 to approach each other, and the position of the wafer is fixed by the clamping plates 42.

[0024] A semiconductor processing dicing machine includes a main connecting plate 7 and a side fixing plate 25, a threaded member 37 is rotatably mounted on the lower surface of the lower mounting plate 1, the inner thread of the threaded member 37 is connected to a lower threaded rod 16, the upper end of the lower threaded rod 16 is fixedly connected to a movable plate 34, a gear ring 36 is rotatably mounted on the lower surface of the lower mounting plate 1, an internal gear 38 is fixedly mounted on the threaded member 37, the internal gear 38 meshes with the inner teeth of the gear ring 36, a driving gear 39 is rotatably mounted on the lower surface of the lower mounting plate 1, the driving gear 39 meshes with the outer teeth of the gear ring 36, the main connecting plate 7 and the side fixing plate 25 are both fixedly mounted on an upper support frame 4, and a discharge assembly is arranged between the main connecting plate 7 and the side fixing plate 25.

[0025] During operation, when the present invention is cutting, the wafer is fixed on the movable plate 34, and a group of connecting shafts 6 are driven to rotate by a rotating motor. The connecting shaft 6 rotates to drive the side gear 5 to rotate, and the side gear 5 rotates to drive the middle gear ring 9 to rotate. The middle gear ring 9 rotates to drive the cutting knife 10 to rotate, and the cutting knife 10 rotates to cut the wafer. As the movable plate 34 is continuously moved upward, the wafer is gradually cut. The upper end of the wafer is adsorbed by the unloading component. After cutting, the unloading component automatically transports the diced wafer to avoid the trouble of manual transportation (the adsorption member 11 is adsorbed on the upper end of the wafer through the vacuum member 32 and the suction pipe 33. After the rotating ring 3 drives the cutting knife 10 to rotate, the upper end of the wafer is diced and cut off, and the rotating rod 21 rotates to drive the wafer on the adsorption member 11 to move toward the transmission member 23. The vacuum member 32 disconnects the adsorption of the adsorption member 11 on the diced wafer, so that the diced wafer falls onto the transmission member 23). The timely transportation of the diced wafer can clean the cutting powder on the surface of the wafer (the rotating ring 3 rotates and the side gear 5 rotates to drive the upper connecting rod 14 to rotate. The upper connecting rod 14 rotates through the upper transmission member 19 to drive the lower bevel gear 18 to rotate. The lower bevel gear 18 rotates to drive the upper bevel gear 17 to rotate. The upper bevel gear 17 rotates to drive the upper rotating shaft 12 to rotate. The upper rotating shaft 12 rotates to drive the rotating fan 13 to rotate. The rotating fan 13 rotates to blow away the powder after the wafer is cut, so that the powder is discharged from the through groove 47 on the movable plate 34). The powder residue generated by cutting on the surface of the wafer causes wear on the cutting knife 10, thereby increasing the service life of the cutting knife 10.

[0026] When cutting, the present invention fixes the wafer on the movable plate 34, and drives a group of connecting shafts 6 to rotate by rotating the motor. The rotation of the connecting shaft 6 drives the side gear 5 to rotate, and the rotation of the side gear 5 drives the middle gear ring 9 to rotate. The rotation of the middle gear ring 9 drives the cutting knife 10 to rotate, and the cutting knife 10 rotates to cut the wafer. As the movable plate 34 is continuously moved upward, the wafer is gradually cut, and the upper end of the wafer is adsorbed by the unloading component. After cutting, the unloading component automatically transports the diced wafers to avoid the trouble of manual transportation. The timely transportation of the diced wafers can clean the cutting powder on the surface of the wafer, and the powder residue generated by cutting on the surface of the wafer causes wear to the cutting knife 10, thereby increasing the service life of the cutting knife 10.

[0027] As a further solution of the present invention, side gears 5 are rotatably installed on both sides of the upper surface of the upper mounting plate 2, an intermediate gear ring 9 is fixedly installed on the upper end of the rotating ring 3, the intermediate gear ring 9 is meshed with the side gear 5, a connecting shaft 6 is fixedly installed on the lower end of the side gear 5, an upper connecting rod 14 is fixedly installed on the upper end of the side gear 5, and a lower transmission member 35 is arranged between the connecting shafts 6.

[0028] During operation, the lower transmission member 35 can drive the connecting shafts 6 on both sides to rotate simultaneously.

[0029] As a further solution of the present invention, upper rotating shafts 12 are rotatably installed on both sides of the upper end of the upper support frame 4, a rotating fan 13 is fixedly installed on the lower end of the upper rotating shaft 12, an upper bevel gear 17 is fixedly installed on the upper end of the upper rotating shaft 12, and an upper transmission rod 20 is rotatably installed at a position corresponding to the upper bevel gear 17 on the upper support frame 4, a lower bevel gear 18 is fixedly installed on the upper end of the upper transmission rod 20, the lower bevel gear 18 is meshed with the upper bevel gear 17, and an upper transmission member 19 is arranged between the upper transmission rod 20 and the upper connecting rod 14.

[0030] During operation, the rotating ring 3 rotates and the side gear 5 rotates to drive the upper connecting rod 14 to rotate. The upper connecting rod 14 rotates and drives the lower bevel gear 18 to rotate through the upper transmission member 19. The lower bevel gear 18 rotates and drives the upper bevel gear 17 to rotate. The upper bevel gear 17 rotates and drives the upper rotating shaft 12 to rotate. The upper rotating shaft 12 rotates and drives the rotating fan 13 to rotate. The rotating fan 13 rotates to blow away the powder after the wafer is cut, so that the powder is discharged from the through groove 47 on the movable plate 34.

[0031] As a further solution of the present invention, the unloading assembly includes a transmission member 23, a secondary connecting plate 15 is provided on the side of the upper support frame 4 close to the main connecting plate 7, the transmission member 23 is arranged between the main connecting plate 7 and the secondary connecting plate 15, and a rotating rod 21 is rotatably installed between the upper support frames 4, a vacuum pumping member 32 is fixedly installed at the position corresponding to the clamping assembly on the rotating rod 21, an adsorption member 11 is fixedly and slidably installed at the lower end of the vacuum pumping member 32, a suction pipe 33 is arranged between the adsorption member 11 and the vacuum pumping member 32, and a driven gear 22 is fixedly installed at both ends of the rotating rod 21.

[0032] During operation, the adsorption component 11 is adsorbed on the upper end of the wafer through the vacuum component 32 and the suction tube 33. After the rotating ring 3 drives the cutting knife 10 to rotate, the upper end of the wafer is diced and cut off. The rotating rod 21 rotates to drive the wafer on the adsorption component 11 to move toward the transmission component 23. The vacuum component 32 disconnects the adsorption of the adsorption component 11 on the diced wafer, so that the diced wafer falls onto the transmission component 23.

[0033] As a further solution of the present invention, an active rod 24 is rotatably installed between the side fixed plates 25, active disks 27 are fixedly installed at both ends of the active rod 24, and a toggle rod 31 is fixedly installed on the active disk 27. A connecting member 30 is rotatably installed on the upper support frame 4, a half-width gear 26 is fixedly installed on one side of the connecting member 30, and the toggle rod 31 is introduced into the connecting member 30.

[0034] During operation, the first motor drives the active rod to rotate, the rotation of the active rod drives the active disk to rotate, the rotation of the active disk drives the toggle rod to rotate in the connecting part, thereby driving the connecting part to swing up and down, the swing of the connecting part drives the half-width gear to rotate reciprocatingly, the rotation of the half-width gear drives the driven gear to rotate, thereby making the driven gear rotate reciprocatingly, and the reciprocating rotation of the driven gear drives the adsorption part to move back and forth on the upper end of the wafer and the transmission part through the rotating rod.

[0035] As a further solution of the present invention, a side transmission member 29 is provided between one end of the transmission member 23 close to the upper support frame 4 and the active rod 24 .

[0036] During operation, the side transmission member 29 drives the transmission member 23 to rotate continuously to realize dicing and transportation.

Claims

1. A blade height measuring device, comprising a lower mounting plate (1), characterized in that: An upper mounting plate (2) is arranged above the lower mounting plate (1), a rotating ring (3) is rotatably mounted between the lower mounting plate (1) and the upper mounting plate (2), an upper support frame (4) is fixedly mounted on the upper surface of the upper mounting plate (2), a cutting knife (10) is fixedly mounted on the upper end of the rotating ring (3), a movable plate (34) is arranged at the bottom of the rotating ring (3), a plurality of through slots (47) are arranged on the movable plate (34), an infrared distance sensor (40) is fixedly mounted on the upper surface of the movable plate (34) at the position of the cutting knife (10), a clamping assembly is arranged on both sides of the upper surface of the movable plate (34) for the cutting knife (10), and an infrared distance sensor (40) is also fixedly mounted on the lower surface of the upper support frame (4) at the position corresponding to the clamping assembly.

2. A blade height measuring device according to claim 1, characterized in that: The clamping assembly comprises an internal threaded rod (41), the internal threaded rod (41) being rotatably mounted above the movable plate (34) and corresponding to two sides of the infrared distance sensor (40), both ends of the internal threaded rod (41) being threadedly connected to a clamping plate (42), an internal transmission member (43) being arranged between the internal threaded rods (41) on the same side, an intermediate gear (46) being rotatably mounted on the movable plate (34), a main gear (45) being rotatably mounted on each of the movable plates (34), a limit gear (8) being fixedly mounted on each of the main gears (45), the limit gear (8) being sleeved with a transmission chain (28), the transmission chain (28) being meshed with the intermediate gear (46), a slave gear (44) being rotatably mounted on one side of the internal transmission member (43), the slave gear (44) being meshed with the main gear (45).

3. A semiconductor processing dicing machine, comprising a blade height measuring device according to any one of claims 1 to 2, characterized in that: The invention also comprises a main connecting plate (7) and a side fixing plate (25); a threaded member (37) is rotatably mounted on the lower surface of the lower mounting plate (1); the threaded member (37) is internally threadedly connected to a lower threaded rod (16); the upper end of the lower threaded rod (16) is fixedly connected to the movable plate (34); a gear ring (36) is rotatably mounted on the lower surface of the lower mounting plate (1); an internal gear (38) is fixedly mounted on the threaded member (37); the internal gear (38) meshes with the internal teeth of the gear ring (36); a driving gear (39) is rotatably mounted on the lower surface of the lower mounting plate (1); the driving gear (39) meshes with the external teeth of the gear ring (36); the main connecting plate (7) and the side fixing plate (25) are both fixedly mounted on the upper support frame (4); and a discharge assembly is provided between the main connecting plate (7) and the side fixing plate (25).

4. A semiconductor processing dicing machine according to claim 3, characterized in that: Side gears (5) are rotatably mounted on both sides of the upper surface of the upper mounting plate (2); an intermediate gear ring (9) is fixedly mounted on the upper end of the rotating ring (3); the intermediate gear ring (9) is meshed with the side gears (5); a connecting shaft (6) is fixedly mounted on the lower end of the side gear (5); an upper connecting rod (14) is fixedly mounted on the upper end of the side gear (5); and a lower transmission member (35) is arranged between the connecting shafts (6).

5. A semiconductor processing dicing machine according to claim 4, characterized in that: An upper rotating shaft (12) is rotatably mounted on both sides of the upper end of the upper support frame (4), a rotating fan (13) is fixedly mounted on the lower end of the upper rotating shaft (12), an upper bevel gear (17) is fixedly mounted on the upper end of the upper rotating shaft (12), an upper transmission rod (20) is rotatably mounted on a position corresponding to the upper bevel gear (17) on the upper support frame (4), a lower bevel gear (18) is fixedly mounted on the upper end of the upper transmission rod (20), the lower bevel gear (18) is meshed with the upper bevel gear (17), and an upper transmission member (19) is provided between the upper transmission rod (20) and the upper connecting rod (14).

6. A semiconductor processing dicing machine according to claim 5, characterized in that: The unloading assembly comprises a transmission member (23); a secondary connection plate (15) is arranged on one side of the upper support frame (4) close to the main connection plate (7); the transmission member (23) is arranged between the main connection plate (7) and the secondary connection plate (15); a rotating rod (21) is rotatably mounted between the upper support frame (4); a vacuum pumping member (32) is fixedly mounted on the rotating rod (21) at a position corresponding to the clamping assembly; an adsorption member (11) is fixedly and slidably mounted on the lower end of the vacuum pumping member (32); a suction pipe (33) is arranged between the adsorption member (11) and the vacuum pumping member (32); and driven gears (22) are fixedly mounted on both ends of the rotating rod (21).

7. A semiconductor processing dicing machine according to claim 6, characterized in that: An active rod (24) is rotatably mounted between the side fixing plates (25), active disks (27) are fixedly mounted on both ends of the active rod (24), a toggle rod (31) is fixedly mounted on each of the active disks (27), a connecting piece (30) is rotatably mounted on the upper support frame (4), a half-width gear (26) is fixedly mounted on one side of the connecting piece (30), and the toggle rod (31) is introduced into the connecting piece (30).

8. A semiconductor processing dicing machine according to claim 7, characterized in that: A side transmission member (29) is provided between one end of the transmission member (23) close to the upper support frame (4) and the active rod (24).

Images