Low-ice-adhesion surface, preparation method and low-ice-adhesion skin

Abstract

The invention provides a low-ice-adhesion surface, a preparation method and a low-ice-adhesion skin, and relates to the field of aviation ice prevention and removal, and the low-ice-adhesion surface comprises a base material with a coating surface; the bonding layer is arranged on the coating surface to form a bonding surface; the micro-particle layer comprises micro-particles, and the micro-particles are distributed on the bonding surface to form a rough surface; the soft elastic layer covers the rough surface, and the surface, deviating from the micro-particle layer, of the soft elastic layer is a flat surface; wherein the elastic modulus of the microparticle layer is greater than that of the soft elastic layer. Compared with the prior art, the aircraft has the advantages that by combining the dual effects of heating and the microstructure, an ice layer is easier to separate, the energy consumption of the aircraft in the deicing process is remarkably reduced, and the energy efficiency of the aircraft is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of surface anti-icing and deicing, and in particular to a low ice adhesion surface, a preparation method and a low ice adhesion skin. Background Art

[0002] During aviation flight, aircraft will encounter a variety of meteorological conditions, one of the most challenging problems is icing. When an aircraft is flying at high altitude, if it encounters supercooled water droplets (i.e., water temperature is below 0°C but not yet frozen), these water droplets will quickly freeze on the surface of the aircraft, especially in key areas such as wings, propellers, and air inlets. Icing will significantly increase the weight of the aircraft, change its aerodynamic characteristics, resulting in reduced lift, increased drag, and may even cause engine failure or inaccurate instrument readings. These factors will seriously affect the controllability and flight safety of the aircraft and increase the risk of accidents.

[0003] To deal with the icing problem, traditional deicing systems have been widely used in aviation, transportation and power facilities, mainly including gas-thermal deicing, electric-thermal deicing and mechanical deicing. These systems actively remove ice by heating, blowing or mechanical vibration. However, these methods have a significant disadvantage, namely high energy consumption. This will lead to reduced energy efficiency of the aircraft during long-term flight or in harsh environments. Summary of the invention

[0004] In order to solve the above problems, the present application provides a low ice adhesion surface, a preparation method and a low ice adhesion skin.

[0005] In a first aspect, the present application provides a low ice adhesion surface, which adopts the following technical solution: A low ice adhesion surface comprising: a substrate having a coated surface; An adhesive layer is provided on the coating surface to form an adhesive surface; a micro-particle layer, comprising micron particles, wherein the micron particles are sprayed on the bonding surface to form a rough surface; and A soft elastic layer covers the rough surface, and the surface of the soft elastic layer facing away from the micro-particle layer is a flat surface; Wherein, the elastic modulus of the micro-particle layer is greater than the elastic modulus of the soft elastic layer.

[0006] Preferably, the micro-particle layer comprises a thermally conductive solidified layer and a particle arrangement layer, and the particle arrangement layer is formed by arranging the micron particles on the bonding surface; The thermally conductive solidified layer is disposed on a surface of the particle arrangement layer away from the substrate.

[0007] Preferably, the thickness of the thermally conductive solidified layer is smaller than the particle size of the micron particles; And / or, thermally conductive nanoparticles are distributed in the thermally conductive solidified layer; and / or, the micron particles are sprayed on the bonding surface to form the particle arrangement layer; And / or, the thermally conductive solidified layer is sprayed and formed on the surface of the particle arrangement layer facing away from the substrate; And / or, the soft elastic layer is formed by coating on a surface of the thermal conductive solidified layer facing away from the micro-particle layer.

[0008] Preferably, the micro-particle layer is provided with at least two layers, and the adhesive layer is provided between adjacent micro-particle layers.

[0009] Preferably, among the particle sizes of the micron particles in adjacent micron particle layers, the particle size of the micron particles in the micron particle layer close to the substrate is smaller than the particle size of the micron particles in the micron particle layer far from the substrate.

[0010] Preferably, the microparticle layer close to the substrate has thermal conductivity; And / or, the microparticle layer away from the substrate has heat absorption.

[0011] In a second aspect, the present application provides a low ice adhesion skin, which adopts the following technical solution: A low ice adhesion skin comprises the low ice adhesion surface described in the above technical solution.

[0012] In a third aspect, the present application provides a method for preparing a low ice adhesion surface, using the following technical solution: A method for preparing a low ice adhesion surface comprises the following steps: Forming a bonding surface: covering the surface of the substrate with an adhesive layer to form a bonding surface; Forming a rough surface: when the adhesive layer is in a wet state, spraying micron particles on the adhesive surface, and forming a rough surface after the adhesive layer is dried; A soft elastic layer is formed on the rough surface, and the surface of the soft elastic layer away from the rough surface is made flat.

[0013] Preferably, the micron particles are sprayed onto the bonding surface in a gas-driven manner.

[0014] Preferably, the soft elastic layer is formed on the rough surface by scraping; And / or, after the adhesive layer is dried, the rough surface is purged with gas.

[0015] The present invention has the following advantages and beneficial effects: By forming a rough surface on the surface of the substrate (aircraft skin surface), covering it with a soft elastic layer, and keeping the surface of the soft elastic layer facing away from the rough surface flat, this structural design can effectively reduce the adhesion of the ice layer on the soft elastic layer, making it easier for the ice layer to fall off. The concave-convex microstructure of the rough surface can serve as a crack initiation point, promoting the crack extension between the ice layer and the soft elastic layer, thereby reducing the adhesion strength of the soft elastic layer and making it easier for the ice layer to fall off.

[0016] The present invention also has the following beneficial effects: the micro-particle layer can transfer the heat generated by the aircraft deicing system to the soft elastic layer, so that the temperature at the interface between the soft elastic layer and the ice layer rises rapidly, thereby further promoting the detachment of the ice layer. In addition, the micro-particle layer also has high toughness, which can avoid damage to the low-adhesion surface caused by external force impact during deicing. This solution can effectively promote the detachment of the ice layer during the deicing process, significantly reduce the deicing energy consumption of the aircraft, and is beneficial to improving the energy efficiency of the aircraft. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the structure when the micro-particle layer has three layers in an embodiment of the present application.

[0019] Figure 2 It is a schematic diagram of the structure of this embodiment.

[0020] Figure 3 Schematic diagram of the preparation process of the embodiment of the present application.

[0021] The markings in the figure are: 100, substrate; 110, coating surface; 200, bonding layer; 210, bonding surface; 300, micro-particle layer; 310, rough surface; 320, thermal conductive curing layer; 330, particle arrangement layer; 400, soft elastic layer. DETAILED DESCRIPTION

[0022] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0023] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0024] The applicant found that the existing technology requires high energy consumption when de-icing by heating the aircraft surface. The main reason is that during flight, the temperature of the aircraft surface is very low, so a high heat is required to melt the ice in contact with the aircraft surface. Only when the ice layer in contact with the aircraft surface melts can the ice layer separate from the surface and eventually fall off. This process results in a huge energy consumption during de-icing, which is not conducive to improving the energy efficiency of the aircraft.

[0025] The present application reduces de-icing energy consumption by optimizing the surface structure of the aircraft. Specifically, a rough surface is designed on the surface of the aircraft, and a soft elastic layer is covered on the rough surface, and it is ensured that the elastic modulus of the soft elastic layer is lower than the elastic modulus of the rough surface. This design forms a stress localization structure on the surface of the aircraft. Due to the concave and convex microstructure of the rough surface, the stress distribution on the surface of the soft elastic layer is uneven. The soft elastic layer in the raised part of the rough surface produces greater stress, while the soft elastic layer in the recessed part produces less stress. This uneven distribution of stress helps to induce cracks between the soft elastic layer and the ice layer, accelerating the detachment of the ice layer. Compared with the traditional method of relying solely on heating to detach the ice layer from the aircraft surface, this solution combines heating with a stress localization structure to make the ice layer easier to detach, and the energy required during the detachment process is lower, thereby improving the energy efficiency of the aircraft.

[0026] Combine the following Figures 1 to 3 A low ice adhesion surface, a preparation method and a low ice adhesion skin provided in the embodiments of the present application are described in detail through specific embodiments and their application scenarios.

[0027] A first aspect of the present embodiment provides a low ice adhesion surface in detail.

[0028] Reference Figure 1 , Figure 2The present application provides a low ice adhesion surface, comprising a substrate 100, an adhesive layer 200, a micro-particle layer 300 and a soft elastic layer 400 arranged in sequence. Among them, the substrate 100 can conduct heat, and illustratively, the substrate 100 has high thermal conductivity. Exemplarily, the substrate 100 is the skin of an aircraft. In some embodiments, the substrate 100 is in contact with a heating device of the aircraft, that is, the heating device of the aircraft generates heat and can transfer the generated heat to the substrate 100. In some schemes, the outer wall of the substrate 100 is a coating surface 110, that is, the side of the substrate 100 facing away from the interior of the aircraft is the coating surface 110.

[0029] In some embodiments, the adhesive layer 200 is provided on the coating surface 110, and the adhesive layer 200 has a certain adhesive force. The adhesive layer 200 can adhere to the coating surface 110 by its own adhesive force, so that the adhesive layer 200 can also firmly adhere to the coating surface 110 when the aircraft is in flight. Exemplarily, the adhesive layer 200 can be formed by spraying an adhesive on the coating surface 110. In some embodiments, the side of the adhesive layer 200 facing away from the coating surface 110 is the adhesive surface 210, and the adhesive surface 210 has a certain adhesive force, and the required structure can be adhered to the adhesive surface 210, so that the required structure can be kept outside the substrate 100 when the aircraft is in flight.

[0030] In some embodiments, the microparticle layer 300 includes micron particles. Exemplarily, the micron particles are granular structures with a size unit of micrometers. It is understandable that the appearance of the micron particles can be regular or irregular. The preferred appearance of the micron particles is an irregular appearance, which can make the concave-convex microstructure on the surface of the particles more uneven and form a more complex concave-convex gradient structure. Among them, the irregular appearance of the micron particles means that the appearance of the micron particles has an irregular shape. In some embodiments, the micron particles are one or more of carbon micron particles, ferroferric oxide particles, aluminum nitride and copper particles. The material of the micron particles can be selected according to actual needs, and this embodiment does not specifically limit the material of the micron particles.

[0031] Reference Figure 1 , Figure 2In some embodiments, the micron particles are distributed on the bonding surface 210 to form a rough surface 310. Exemplarily, the micron particles are irregularly arranged or distributed on the bonding surface 210 to form a more complex concave-convex microstructure. For example, the micron particles are adhered to the bonding surface 210 by spraying. It is understandable that since the spraying method itself has certain irregularities, the micron particles will form an irregular distribution on the bonding surface 210, thereby increasing the unevenness of the concave-convex microstructure. This unevenness makes the stress distribution formed more uneven, which helps the ice layer to fall off more easily. When the micron particles are attached to the bonding surface 210, since the micron particles have no stickiness, the micron particles can only adhere to the bonding layer 200, so that the micron particles cannot be laminated and adhered, so that the micron particles adhered to the adhesive layer are only one layer, that is, the thickness of the micron particles adhered to the adhesive layer is roughly the same as the particle size of the micron particles.

[0032] It is understandable that when the micron particles are arranged on the bonding surface 210, gaps will be formed between the micron particles, so that the area covered with micron particles is convex, while the gap area is concave. By spraying the micron particles, these gaps are not easily blocked by excess particles, so that a good concave-convex microstructure can be formed. This uneven concave-convex microstructure helps to generate unevenly distributed stress, making it easier for the ice layer to fall off. It is understandable that compared with the concave-convex microstructure produced by etching, 3D printing and other methods in the prior art, the spraying method adopted in this scheme can produce a more uneven concave-convex microstructure, while having lower manufacturing costs and significantly improved manufacturing efficiency. In addition, due to the irregular surface of the micron particles themselves and the uneven force exerted on the micron particles during the spraying process, the embedding depth of the micron particles on the bonding surface 210 is inconsistent, so that the concave-convex microstructure formed has very good unevenness. The concave-convex microstructures usually generated by etching or 3D printing methods used in the prior art are relatively consistent, which leads to weaker stress distribution unevenness, higher cost, and is not conducive to the detachment of the ice layer.

[0033] Reference Figure 1 , Figure 2In some embodiments, the soft elastic layer 400 covers the rough surface 310, and the surface of the soft elastic layer 400 facing away from the micro-particle layer 300 is a flat surface. The surface of the soft elastic layer 400 facing away from the micro-particle layer 300 is a flat surface, which means that the side of the soft elastic layer 400 facing away from the inside of the aircraft is a flat surface. It is understandable that the side of the soft elastic layer 400 facing away from the inside of the aircraft is the outermost side of the aircraft, that is, the ice layer on the aircraft will adhere to the surface of the soft elastic layer 400. The flat surface means that there is no uneven microstructure on the side of the soft elastic layer 400 facing away from the aircraft. It is understandable that the flat surface of the soft elastic layer 400 can reduce the adhesion of the ice layer, so that the ice layer can easily detach from the soft elastic layer 400. Exemplarily, the soft elastic layer 400 includes a polydimethylsiloxane layer or a transparent resin layer. The polydimethylsiloxane layer facilitates light to enter the micro-particle layer 300, which is beneficial for the micron particles to absorb sunlight and increase the temperature of the micron particles. When the temperature of the micron particles rises, the heat will be transferred to the soft elastic layer 400, which helps to separate the ice layer from the soft elastic layer 400 and reduce energy consumption during the de-icing process of the aircraft.

[0034] In some embodiments, the elastic modulus of the micro-particle layer 300 is greater than that of the soft elastic layer 400. The elastic modulus of the micro-particle layer 300 is greater than that of the soft elastic layer 400, which helps to generate uneven stress on the flat surface of the soft elastic layer 400, thereby making the ice layer easier to fall off.

[0035] Reference Figure 1 , Figure 2 According to an optional embodiment, the micro-particle layer 300 includes a thermally conductive curing layer 320 and a particle arrangement layer 330, wherein the particle arrangement layer 330 is formed by arranging the micron particles on the bonding surface 210, and the thermally conductive curing layer 320 is disposed on the surface of the particle arrangement layer 330 away from the substrate 100. It can be understood that the appearance of the micron particles is irregular, and the micron particles only adhere to the bonding layer 200, so after being arranged on the bonding surface 210, there may be a problem that some particles have a small bonding force with the bonding layer 200 and are easy to fall off. In order to solve this problem, a thermally conductive curing layer 320 can be formed on the particle arrangement layer 330. The thermally conductive curing layer 320 can cure and adhere the particle arrangement layer 330 to form a whole, thereby enhancing the stability of the particle arrangement layer 330. This makes it difficult for the micron particles to fall off. Exemplarily, the particle arrangement layer 330 is formed by spraying on the bonding surface 210 , and the thermal conductive curing layer 320 is formed by spraying on the side of the particle arrangement layer 330 facing away from the bonding surface 210 .

[0036] Exemplarily, the thermally conductive curing layer 320 includes a resin layer, for example, the thermally conductive curing layer 320 includes a polyurethane resin layer, and the polyurethane resin can provide good elastic support and adhesion, so that the micron particles are tightly combined with the adhesive layer 200, thereby reducing the possibility of particles falling off from the adhesive layer 200.

[0037] According to an optional embodiment, the thickness of the thermally conductive solidified layer 320 is smaller than the particle size of the micron particles. This avoids the situation where the concave-convex microstructure formed by the micron particles is filled when the thermally conductive solidified layer 320 is thick. That is, after the thermally conductive solidified layer 320 is disposed on the particle arrangement layer 330, the side of the thermally conductive solidified layer 320 that is away from the particle arrangement layer 330 is a rough surface 310 with uneven surfaces.

[0038] Reference Figure 1 , Figure 2 According to an optional embodiment, thermally conductive nanoparticles are distributed in the thermally conductive solidified layer 320. The thermal conductivity of the thermally conductive solidified layer 320 is improved by the thermally conductive nanoparticles, so that heat is more easily transferred to the soft elastic layer 400, thereby accelerating the speed at which the ice layer is detached from the soft elastic layer 400. Exemplarily, the thermally conductive nanoparticles are particles such as carbon nanotubes, graphene, aluminum oxide, boron nitride, and the particle size of these particles is in the nanometer level. It is understandable that thermally conductive nanoparticles can be added to the polyurethane resin layer, and these nanoparticles can be evenly distributed in the thermally conductive solidified layer 320 by stirring and ultrasonic dispersion technology. Exemplarily, the volume of the added thermally conductive nanoparticles accounts for 5% of the total volume of the polyurethane resin layer. Adding too many thermally conductive nanoparticles may cause the thermally conductive nanoparticles to agglomerate, thereby affecting the overall performance of the thermally conductive solidified layer 320, thereby controlling the amount of the added thermally conductive nanoparticles, thereby improving the thermal conductivity of the thermally conductive solidified layer 320 while keeping the performance of the thermally conductive solidified layer 320 basically unchanged.

[0039] Reference Figure 1 , Figure 2 According to an optional embodiment, micron particles are sprayed on the bonding surface 210 to form a particle arrangement layer 330. The concave-convex microstructure formed by spraying has higher irregularity, which is conducive to generating uneven stress distribution on the soft elastic layer 400. Exemplarily, the micron particles use gas as a driving force to drive the micron particles to fly on the bonding layer 200 and allow the micron particles to adhere to the bonding layer 200. The gas-driven method can more efficiently complete the attachment of micron particles. The airflow can also blow off the micron particles with insufficient adhesion, so that the formed particle arrangement layer 330 is more stable. In addition, the airflow can also accelerate the drying process of the bonding layer 200, so that it can cure the micron particles on the surface of the substrate 100 faster, thereby improving production efficiency.

[0040] According to an optional embodiment, the soft elastic layer 400 is formed by coating on the surface of the thermally conductive solidified layer 320 away from the micro-particle layer 300. The coating method can effectively cover the concave-convex microstructure of the rough surface 310 with the soft elastic layer 400, which helps to form a flat surface on the side of the soft elastic layer 400 away from the micro-particle layer 300.

[0041] According to an optional embodiment, the micro-particle layer 300 is provided with at least two layers, and an adhesive layer 200 is provided between adjacent micro-particle layers 300. The multi-layer micro-particle structure can form a more complex and uneven concave-convex microstructure, which helps to generate uneven stress on the soft elastic layer 400, so that the ice layer is easier to fall off. In some embodiments, the previous micro-particle layer 300 is required to solidify before spraying each layer of micro-particle layer 300. Exemplarily, before spraying the second layer of micro-particle layer 300, the first layer of micro-particle layer 300 sprayed needs to solidify, and before spraying the third layer of micro-particle layer 300, the second layer of micro-particle layer 300 sprayed needs to solidify. In this way, the coating quality can be improved, and the bonding force between the coatings can be ensured to be stronger, thereby improving the integrity and durability of the entire coating. It can also avoid problems such as plastic deformation, cracking or peeling caused by the coating not being completely dry. In addition, the protective effect can be enhanced. The multi-layer cured coating can form a thicker and more uniform protective layer to better resist external impact, wear, corrosion and other damage.

[0042] In some embodiments, in order to accelerate the solidification or curing of the micro-particle layer 300, the sprayed micro-particle layer 300 may be placed in a room at 100 degrees Celsius for curing for about 5 hours.

[0043] Reference Figure 1 , Figure 2 In some embodiments, after the first micro-particle layer 300 is formed, the spraying amount of the second micro-particle layer 300 needs to be adjusted according to the roughness of the first micro-particle layer 300. Exemplarily, when the surface roughness of the first micro-particle layer 300 is too large, the amount of micron particles in the second micro-particle layer 300 can be reduced to reduce the roughness. It is understandable that when the surface roughness of the first micro-particle layer 300 is too small, the amount of micron particles in the second micro-particle layer 300 can be increased. It is understandable that when there are three or more layers of micron particles, by analogy, the content of micron particles in the micro-particle layer 300 to be sprayed next time is dynamically adjusted according to the roughness of the micro-particle layer 300 formed in the previous layer. Through dynamic adjustment, it is beneficial to improve the flatness of the surface formed by multiple spraying, so that the thickness of the surface formed by spraying is kept basically consistent, and avoid the situation of local thick or thin.

[0044] According to an optional embodiment, the particle sizes of the micron particles in adjacent micron particle layers 300 are different, and the particle size of the micron particles in the micron particle layer 300 close to the substrate 100 is smaller than the particle size of the micron particles in the micron particle layer 300 far away from the substrate 100. That is, the particle sizes of the micron particles in different micron particle layers 300 are different, and the particle size of the micron particles farther away from the substrate 100 is larger.

[0045] Reference Figure 1 , Figure 2, illustratively, the micro-particle layer 300 is provided with three layers. First, a first micro-particle layer 300 is formed on the substrate 100; then, an adhesive layer 200 is coated on the first micro-particle layer 300, and then a second micro-particle layer 300 is formed on the adhesive layer 200; then, the adhesive layer 200 is coated on the second micro-particle layer 300 again, and a third micro-particle layer 300 is formed thereon; finally, a soft elastic layer 400 is coated on the third micro-particle layer 300. Through this multi-layer design, a more complex and uneven concave-convex microstructure can be constructed. It can be understood that the particle size of the micron particles in the first micro-particle layer 300 is smaller than the particle size of the micron particles in the second micro-particle layer 300, and the particle size of the micron particles in the second micro-particle layer 300 is smaller than the particle size of the micron particles in the third micro-particle layer 300.

[0046] In some embodiments, the total volume ratio of the micron particles in the first micro-particle layer 300, the second micro-particle layer 300, and the third micro-particle layer is 3:2:1. It can be understood that by first spraying to form a micro-particle layer 300 with a smaller particle size, and then spraying to form a micro-particle layer with a larger particle size, the concave-convex microstructure in the first sprayed micro-particle layer 300 can be exposed, thereby forming a gradient difference structure. Exemplarily, the micro-particles in the later sprayed micro-particle layer 300 have larger particle sizes, and the gaps formed between adjacent micro-particles are larger. These larger gaps can accommodate the concave-convex microstructures formed by the smaller micro-particles in the multiple first sprayed micro-particle layers 300, thereby enhancing the gradient difference of the overall concave-convex microstructure.

[0047] In some embodiments, the particle size of the micron particles in the first microparticle layer 300 is [8, 15] microns, the particle size of the micron particles in the second microparticle layer 300 is [40, 55] microns, and the particle size of the micron particles in the third microparticle layer 300 is [130, 155] microns.

[0048] In some embodiments, the thickness of the first microparticle layer 300 is 10-20 microns, the thickness of the second microparticle layer 300 is 50-60 microns, and the thickness of the third microparticle layer 300 is 150-160 microns.

[0049] exist Figure 2 In the second micro-particle layer 300, some micro-particles in the first micro-particle layer 300 are exposed between the micro-particles, and in the third micro-particle layer 300, some micro-particles in the first and second micro-particle layers 300 are exposed between some micro-particles. Through the design of the multi-layer micro-particle layer 300, the rough surface formed has different gradients of roughness, thereby providing a more complex concave-convex microstructure, making the surface stress distribution of the soft elastic layer 400 more uneven, and making it easier to cause the ice layer to fall off.

[0050] It is understandable that when the thermal conductive curing layer 320 is sprayed, due to its certain fluidity, the sprayed thermal conductive curing layer 320 will flow to the bottom of the micron particles, thereby forming a Figure 2 The structure shown in FIG. 3 is shown in FIG. 3 . In the middle and upper part of the micron particle, the thermally conductive solidified layer 320 is relatively thin, while at the bottom of the micron particle, there is an accumulation of the thermally conductive solidified layer 320. After solidification, the thermally conductive solidified layer 320 accumulated at the bottom can provide better support and fixation for the micron particle, making the formed rough surface 310 more stable, thereby giving the micron particle layer 300 a higher toughness, and effectively preventing damage to the micron particle layer 300 caused by external impact.

[0051] According to an optional embodiment, the micro-particle layer 300 close to the substrate 100 has thermal conductivity. It is beneficial to transfer the heat on the substrate 100 to the soft elastic layer 400 side, and avoid the situation where the heat is blocked by at least two layers of micro-particle layers 300 and cannot be effectively transferred to the soft elastic layer 400. Exemplarily, the thermally conductive solidified layer 320 and / or micron particles in the micro-particle layer 300 close to the substrate 100 have thermal conductivity. For example, the micron particles are aluminum nitride or copper particles.

[0052] According to an optional embodiment, the micro-particle layer 300 away from the substrate 100 has heat absorption. The micro-particle layer 300 away from the substrate 100 refers to the micro-particle layer 300 farthest from the substrate 100. Exemplarily, when the micro-particle layer 300 has three layers, the micro-particle layer 300 away from the substrate 100 is the third micro-particle layer 300. It can be understood that when the micro-particle layer 300 has multiple layers, the micro-particle layer 300 away from the substrate 100 refers to the last micro-particle layer 300, and the last micro-particle layer 300 refers to the micro-particle layer 300 formed by the last spraying. In some embodiments, the thermally conductive cured layer 320 in the micro-particle layer 300 away from the substrate 100 has heat absorption, and / or the micron particles have heat absorption.

[0053] A second aspect of the present embodiment provides detailed description of a low ice adhesion skin.

[0054] A low ice adhesion skin includes the low ice adhesion surface in the above embodiment. In this way, the skin has the beneficial effects of the above low ice adhesion surface, which will not be described in detail here. The skin referred to in the embodiment of the present application refers to the skin of an aircraft.

[0055] The third aspect of this embodiment provides a detailed description of a method for preparing a low ice adhesion surface.

[0056] Reference Figure 3 , a method for preparing a low ice adhesion surface comprises the following steps: S10 , forming an adhesive surface 210 : covering the surface of the substrate 100 with an adhesive layer 200 to form an adhesive surface 210 .

[0057] It is understood that a bonding layer can be formed by coating or spraying a material having an adhesive effect on the surface of the substrate 100. For example, the bonding layer 200 can be formed by spraying an adhesive.

[0058] S20, forming a rough surface 310: when the adhesive layer 200 is in a wet state, spraying micron particles on the adhesive surface 210, and after the adhesive layer 200 is dried, a rough surface 310 is formed; It is understood that the adhesive layer 200 is in a wet state, which means that the adhesive layer 200 is in an uncured or solidified state. Exemplarily, the adhesive layer 200 is an adhesive sprayed on the surface of the substrate 100. When the adhesive is not cured or solidified, micron particles are sprayed on the adhesive layer 200 so that the micron particles are adhered to the adhesive layer 200 after impacting the adhesive layer 200.

[0059] S30 , forming a soft elastic layer 400 covering the rough surface 310 , and making the surface of the soft elastic layer 400 away from the rough surface 310 a flat surface.

[0060] Exemplarily, the soft elastic layer 400 is scraped onto the rough surface 310 , so that the soft elastic layer 400 fills the concave-convex microstructure of the rough surface 310 , and the surface of the soft elastic layer 400 facing away from the rough surface 310 is flat.

[0061] In some embodiments, step S20 further includes the following steps: S21 , after the adhesive layer 200 is dried, the micron particles are solidified with the adhesive layer 200 to form a particle arrangement layer 330 .

[0062] S22 , spraying a thermally conductive curing layer 320 on the side of the particle arrangement layer 330 away from the adhesive layer 200 , and forming a rough surface 310 after the thermally conductive curing layer 320 is cured.

[0063] Exemplarily, the thermal conductive curing layer 320 may be formed by resin spraying. For example, the thermal conductive curing layer 320 is formed by spraying polyurethane resin onto the particle arrangement layer 330 .

[0064] In some embodiments, if the micro-particle layer 300 is at least two layers, steps S20, S21 and S22 are repeated until a desired number of micro-particle layers 300 are formed, and then step S30 is performed.

[0065] According to an optional embodiment, the micron particles are sprayed onto the bonding surface 210 in a gas-driven manner.

[0066] It is understood that the micron particles are sprayed onto the adhesive layer 200 by a spraying device, and the spraying device uses gas as a driving force to spray the micron particles onto the adhesive layer 200. For example, the gas may be a dry clean gas such as nitrogen.

[0067] According to an optional embodiment, the soft elastic layer 400 is formed on the rough surface 310 by scraping.

[0068] A relatively smooth surface can be formed by scraping, and the concave-convex microstructure formed by the micro-particle layer 300 can be effectively filled, thereby improving the surface strength of the skin.

[0069] According to an optional embodiment, after the adhesive layer 200 is dried, the rough surface 310 is purged with gas.

[0070] Some micron particles may not have a strong bond strength with the bonding layer 200 . Therefore, by blowing the particle arrangement layer 330 with gas, particles with weaker bond strength can be blown off, thereby improving the stability of the rough surface 310 .

[0071] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A low ice adhesion surface, characterized in that: include: A substrate (100) having a coating surface (110); An adhesive layer (200) is provided on the coating surface (110) to form an adhesive surface (210); A micro-particle layer (300) comprising micron particles, wherein the micron particles are sprayed on the bonding surface (210) to form a rough surface (310); as well as, A soft elastic layer (400) covers the rough surface (310), and a surface of the soft elastic layer (400) facing away from the micro-particle layer (300) is a flat surface; Wherein, the elastic modulus of the micro-particle layer (300) is greater than the elastic modulus of the soft elastic layer (400).

2. A low ice adhesion surface according to claim 1, characterized in that: The micro-particle layer (300) comprises a heat-conducting solidification layer (320) and a particle arrangement layer (330), wherein the particle arrangement layer (330) is formed by arranging the micron particles on the bonding surface (210); The thermally conductive solidified layer (320) is disposed on a surface of the particle arrangement layer (330) that is away from the substrate (100).

3. A low ice adhesion surface according to claim 2, characterized in that: The thickness of the thermally conductive solidified layer (320) is smaller than the particle size of the micron particles; And / or, thermally conductive nanoparticles are distributed in the thermally conductive solidified layer (320); and / or, the micronized particles are sprayed onto the bonding surface (210) to form the particle arrangement layer (330); And / or, the thermally conductive solidified layer (320) is sprayed and formed on a surface of the particle arrangement layer (330) facing away from the substrate (100); And / or, the soft elastic layer (400) is formed by coating on a surface of the thermal conductive solidified layer (320) facing away from the micro-particle layer (300).

4. A low ice adhesion surface according to claim 1 or 2, characterized in that: The micro-particle layer (300) is provided with at least two layers, and the adhesive layer (200) is provided between adjacent micro-particle layers (300).

5. A low ice adhesion surface according to claim 4, characterized in that: Among the particle sizes of the micron particles in adjacent micron particle layers (300), the particle size of the micron particles in the micron particle layer (300) close to the substrate (100) is smaller than the particle size of the micron particles in the micron particle layer (300) far from the substrate (100).

6. A low ice adhesion surface according to claim 4, characterized in that: The micro-particle layer (300) close to the substrate (100) has thermal conductivity; And / or, the microparticle layer (300) away from the substrate (100) has heat absorption.

7. A low ice adhesion skin, characterized in that: The low ice adhesion surface comprising any one of claims 1 to 6.

8. A method for preparing a low ice adhesion surface, characterized in that: A method for preparing a low ice adhesion surface according to any one of claims 1 to 6, comprising the following steps: Forming a bonding surface (210): Covering the surface of the substrate (100) with a bonding layer (200) to form a bonding surface (210); Forming a rough surface (310): when the adhesive layer (200) is in a wet state, spraying micron particles on the adhesive surface (210), and forming a rough surface (310) after the adhesive layer (200) is dried; A soft elastic layer (400) is formed on the rough surface (310) and the surface of the soft elastic layer (400) facing away from the rough surface (310) is made flat.

9. The method for preparing a low ice adhesion surface according to claim 8, characterized in that: The micron particles are sprayed onto the bonding surface (210) in a gas-driven manner.

10. The method for preparing a low ice adhesion surface according to claim 8, characterized in that: The soft elastic layer (400) is formed on the rough surface (310) by scraping; And / or, after the adhesive layer (200) is dried, the rough surface (310) is purged with gas.

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