Electroplating solution for electroplating cable conductor and preparation method thereof

Abstract

The invention relates to the technical field of electroplating liquid preparation, and discloses an electroplating liquid for cable conductor electroplating and a preparation method thereof, and the electroplating liquid comprises the following components by weight: 30-50 g / L of copper sulfate, 5-20 g / L of copper chloride, 5-20 g / L of sulfuric acid, 5-20 g / L of potassium chloride, 1-5 g / L of a brightener, 1-5 g / L of an antioxidant additive, and 1-5 g / L of a stress relieving agent. When a cable conductor and carbon steel are electroplated, 40 g / L of copper sulfate, 10 g / L of copper chloride, 20 g / L of sulfuric acid, 20 g / L of potassium chloride, 3 g / L of brightener, 3 g / L of antioxidant additive and 4 g / L of stress relieving agent are mixed, deionized water is added to dilute the mixture to the required concentration, and when copper is electroplated, the concentration of the mixture is adjusted to the required concentration. According to the method, 50g / L of copper sulfate, 20g / L of copper chloride, 10g / L of sulfuric acid, 10g / L of potassium chloride, 3g / L of brightener, 3g / L of antioxidant additive and 4g / L of stress relieving agent are mixed, deionized water is added for dilution to the required concentration, and the ratio of the electroplating liquid can be selected according to an electroplated base material, so that the subsequent electroplating work of the electroplating liquid on a cable conductor is facilitated; and the quality of the electroplating liquid for electroplating the cable conductor is improved.

Description

Technical Field

[0001] The invention relates to the technical field of electroplating solution preparation, in particular to an electroplating solution for cable conductor electroplating and a preparation method thereof. Background Art

[0002] The electroplating solution is a liquid used in the electroplating process. It is composed of a variety of chemical substances and is used to form a thin layer of deposits on the metal surface. These chemical substances usually include metal ions, acids and bases, solvents and additives to form a uniform and specific electroplating layer. The electroplating solution can expand the cathode current density range of the metal, improve the appearance of the coating, and increase the anti-oxidation stability of the solution. The electroplating solution refers to a liquid that can expand the cathode current density range of the metal, improve the appearance of the coating, and increase the anti-oxidation stability of the solution. There are countless types of electroplating solutions. There are more than ten types that have been used in manufacturing experiments. There are four commonly used plating solutions in production: cyanide zinc plating, zincate zinc plating, chloride zinc plating and sulfate zinc plating. According to the main salt and other components, many plating solutions have evolved, but they are just the same. When electroplating cable conductors, it is not convenient for the staff to perform electroplating according to the conductor material, which affects the quality of the electroplating of the cable conductor material by the electroplating solution. In the process of cable conductor electroplating, the electroplating solution for cable conductor electroplating and its preparation method are needed.

[0003] The inventors found that there are at least the following problems in the prior art that have not been solved: 1. When electroplating the cable conductor, it is inconvenient for the staff to perform electroplating according to the conductor material, which affects the quality of the electroplating of the cable conductor material by the electroplating solution; 2. When the electroplating solution is used to electroplate the cable conductor, the metal in the cable conductor loses its strength, which reduces the toughness of the coating and affects the quality of the coating. In addition, the electroplating process is accompanied by high temperature, which causes oxidation of the electroplating solution, requiring long-term electroplating work and reducing the efficiency of electroplating; 3. In the process of proportioning the electroplating solution, because the raw materials of the electroplating solution contain various hydrochloric acids, it will corrode the proportioning equipment, thereby reducing the service life of the stirring equipment. To this end, the present invention designs an electroplating solution for electroplating cable conductors and a preparation method thereof. Summary of the invention

[0004] The purpose of the present invention is to provide a plating solution for cable conductor electroplating and a preparation method thereof, so as to solve the problem raised in the above background technology that when the cable conductor is electroplated, it is inconvenient for the staff to perform the electroplating work according to the conductor material, which affects the quality of the electroplating of the cable conductor material by the plating solution, and when the cable conductor is electroplated by the plating solution, the metal in the cable conductor loses strength, which reduces the toughness of the coating and affects the quality of the coating. The electroplating process is accompanied by high temperature, which causes oxidation of the plating solution and reduces the quality of the electroplating. In the process of proportioning the plating solution, because the raw materials of the plating solution contain various hydrochloric acids, it will cause corrosion to the proportioning equipment, thereby reducing the service life of the stirring equipment. To this end, the present invention designs a plating solution for cable conductor electroplating and a preparation method thereof.

[0005] To achieve the above object, the present invention provides the following technical solution: a plating solution for cable conductor electroplating, wherein the weight percentage of each component is:

[0006] Copper sulfate: 30-50g / L;

[0007] Copper chloride: 5-20g / L;

[0008] Sulfuric acid: 5-20g / L;

[0009] Potassium chloride: 5-20g / L;

[0010] Brightener: 1-5g / L;

[0011] Antioxidant additives: 1-5g / L;

[0012] Stress reliever: 1-5g / L.

[0013] Preferably, when carbon steel is used as the electroplating substrate, the components of the electroplating solution are copper sulfate: 40g / L, copper chloride: 10g / L, sulfuric acid: 20g / L, potassium chloride: 20g / L, brightener: 3g / L, antioxidant additive: 3g / L, and stress reliever: 4g / L.

[0014] Preferably, when copper is used as the electroplating substrate, the components of the electroplating solution are copper sulfate: 50 g / L, copper chloride: 20 g / L, sulfuric acid: 10 g / L, potassium chloride: 10 g / L, brightener: 3 g / L, antioxidant additive: 3 g / L, and stress reliever: 4 g / L.

[0015] Preferably, the brightener comprises 64% of the mixed solution, 20% of malic acid, 10% of disodium ethylenediaminetetraacetic acid, 5% of hexadecyltrimethylammonium bromide, and 1% of boric acid.

[0016] Preferably, the stress relieving agent contains 60% organic solvent, 20% phosphate, 10% nitride and thio compound, 5% surfactant and 5% stabilizer.

[0017] Preferably, the copper sulfate is used as the main component in the electroplating solution of carbon steel and copper, and is produced by reacting waste electrolyte with fine copper powder, separating and settling, cooling and crystallizing the clear liquid, separating, and drying.

[0018] Preferably, the sodium chloride is a conductive salt, and the electroplating solution is usually composed of a compound containing a plated metal, a conductive salt, a buffer, a pH adjuster and additive components.

[0019] Preferably, the sulfuric acid is a strong acidic substance, which can react chemically with oxides on the metal surface to generate soluble sulfates, and is added according to the needs of carbon steel and copper.

[0020] Preferably, the equivalent conductivity of the potassium chloride is 149.84Ω / cm.

[0021] A method for preparing an electroplating solution for cable conductor electroplating, the preparation method comprising the following steps:

[0022] S1. Determine the composition of the plating solution

[0023] 1. Select metal, ① carbon steel, ② copper, 2. Select electroplating solution, 3. Prepare materials, ① copper sulfate: 30-50g / L, ② copper chloride: 5-20g / L, ③ sulfuric acid: 5-20g / L, ④ potassium chloride: 5-20g / L, ⑤ brightener: 1-5g / L, ⑥ antioxidant additive: 1-5g / L, ⑦ stress reliever: 1-5g / L;

[0024] S2. Prepare solution

[0025] 1. When electroplating carbon steel, mix copper sulfate: 40g / L, copper chloride: 10g / L, sulfuric acid: 20g / L, potassium chloride: 20g / L, brightener: 3g / L, antioxidant additive: 3g / L and stress reliever: 4g / L, and add deionized water to dilute to the required concentration. When electroplating copper, mix copper sulfate: 50g / L, copper chloride: 20g / L, sulfuric acid: 10g / L, potassium chloride: 10g / L, brightener: 3g / L, antioxidant additive: 3g / L and stress reliever: 4g / L, and add deionized water to dilute to the required concentration. 2. Stir well. ① Use corrosion-resistant stirring equipment. ② Heat the stirring equipment.

[0026] S3. Adjust pH value

[0027] 1. Detect the pH value, ① use pH detection equipment, ② the pH value of the plating solution is 4.5-5.5, 2. Add sulfuric acid and sodium hydroxide, ① when the pH is lower than 4.5-5.5, add sodium hydroxide, ② when the pH is higher than 4.5-5.5, add sulfuric acid, 3. Detect the pH value again.

[0028] S4. Add additives

[0029] 1. The ingredients of the added brightener include 64% of the mixed solution, 20% of malic acid, 10% of disodium ethylenediaminetetraacetic acid, 5% of hexadecyltrimethylammonium bromide, and 1% of boric acid. 2. The ingredients of the added stress reliever include 60% of organic solvents, 20% of phosphates, 10% of nitrides or thio compounds, 5% of surfactants, and 5% of stabilizers. 3. Antioxidant additives.

[0030] S5. Electroplating solution impurity removal

[0031] 1. Filter the plating solution. 2. Store the plating solution. ① Select a storage bottle. ② Store in a cool place. 3. Transport the plating solution.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] The present invention electroplates the cable conductor and the carbon steel, mixes 40g / L of copper sulfate, 10g / L of copper chloride, 20g / L of sulfuric acid, 20g / L of potassium chloride, 3g / L of brightener, 3g / L of antioxidant additive and 4g / L of stress reliever, and adds deionized water to dilute to the required concentration; when electroplating copper, mixes 50g / L of copper sulfate, 20g / L of copper chloride, 10g / L of sulfuric acid, 10g / L of potassium chloride, 3g / L of brightener, 3g / L of antioxidant additive and 4g / L of stress reliever, and adds deionized water to dilute to the required concentration; the proportion of the electroplating solution can be selected according to the substrate to be electroplated, so that the subsequent electroplating solution is convenient for electroplating the cable conductor, and the quality of the electroplating solution when electroplating the cable conductor is improved; then, when the electroplating solution is electroplated on the cable conductor, because the cable conductor contains a certain amount of metal stress reliever, the electroplating solution is prepared. When the electroplating solution is mixed, a stress reliever with an added content of 60% organic solvent, 20% phosphate, 10% nitride and thio compound, 5% surfactant and 5% stabilizer is added to eliminate the stress on the conductor, and an antioxidant additive is added when the electroplating solution is mixed, which reduces the oxidative effect of high temperature on the electroplating solution during the electroplating process, reduces the electroplating time, and thus improves the work efficiency of the electroplating. The electroplating solution is then stirred and mixed using a stirring device to avoid the problem of uneven preparation of the electroplating solution caused by manual mixing. Then, when the electroplating solution is prepared, a heating device is added to the stirring device to accelerate the rapid fusion of different components in the electroplating solution, thereby improving the work efficiency of the preparation of the electroplating solution. In addition, the anti-oxidation film and the corrosion-resistant film are set inside the stirring device to reduce the erosion of the stirring device during the mixing of the electroplating solution, thereby increasing the service life of the stirring device. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a graph of the composition content of each group of electroplating solutions of the present invention;

[0035] Figure 2 is a brightener component content diagram of the present invention;

[0036] Figure 3 is a diagram of the content of the stress relieving agent of the present invention;

[0037] Figure 4 The present invention is a flow chart for preparing the electroplating solution. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] See also Figure 1-Figure 4 The present invention provides a technical solution: a plating solution for cable conductor electroplating, wherein the weight percentage of each component is:

[0040] Copper sulfate: 30-50g / L;

[0041] Copper chloride: 5-20g / L;

[0042] Sulfuric acid: 5-20g / L;

[0043] Potassium chloride: 5-20g / L;

[0044] Brightener: 1-5g / L;

[0045] Antioxidant additives: 1-5g / L;

[0046] Stress reliever: 1-5g / L.

[0047] Embodiment 1:

[0048] The weight percentage of each component is:

[0049] Copper sulfate: 30-50g / L;

[0050] Copper chloride: 5-20g / L;

[0051] Sulfuric acid: 5-20g / L;

[0052] Potassium chloride: 5-20g / L;

[0053] Brightener: 1-5g / L;

[0054] Antioxidant additives: 1-5g / L;

[0055] Stress reliever: 1-5g / L.

[0056] In this embodiment, when carbon steel is used as the electroplating substrate, the composition content of the electroplating solution is copper sulfate: 40g / L, copper chloride: 10g / L, sulfuric acid: 20g / L, potassium chloride: 20g / L, brightener: 3g / L, antioxidant additive: 3g / L, stress reliever: 4g / L.

[0057] In this embodiment, when copper is used as the electroplating substrate, the components of the electroplating solution are copper sulfate: 50g / L, copper chloride: 20g / L, sulfuric acid: 10g / L, potassium chloride: 10g / L, brightener: 3g / L, antioxidant additive: 3g / L, and stress reliever: 4g / L.

[0058] In this embodiment, the brightener comprises 64% of the mixed solution, 20% of malic acid, 10% of disodium ethylenediaminetetraacetic acid, 5% of hexadecyltrimethylammonium bromide, and 1% of boric acid.

[0059] In this embodiment, the composition of the stress relieving agent includes 60% organic solvent, 20% phosphate, 10% nitride and thio compound, 5% surfactant and 5% stabilizer.

[0060] In this embodiment, copper sulfate is used as the main component of the electroplating solution of carbon steel and copper. The waste electrolyte is reacted with fine copper powder, separated and settled, and the clear liquid is cooled, crystallized, separated, and dried to produce copper sulfate.

[0061] In this embodiment, sodium chloride is a conductive salt, and the electroplating solution is usually composed of a compound containing a plating metal, conductive salts, a buffer, a pH adjuster, and additive components.

[0062] In this embodiment, sulfuric acid is a strong acidic substance that can chemically react with oxides on the metal surface to generate soluble sulfates, which are added according to the needs of carbon steel and copper.

[0063] In this embodiment, the equivalent conductivity of potassium chloride is 149.84Ω / cm.

[0064] The preparation method of this embodiment comprises the following steps:

[0065] S1. Determine the composition of the plating solution

[0066] 1. Select metal, ① carbon steel, ② copper, 2. Select electroplating solution, 3. Prepare materials, ① copper sulfate: 30-50g / L, ② copper chloride: 5-20g / L, ③ sulfuric acid: 5-20g / L, ④ potassium chloride: 5-20g / L, ⑤ brightener: 1-5g / L, ⑥ antioxidant additive: 1-5g / L, ⑦ stress reliever: 1-5g / L, because the cable conductor is electroplated, the corresponding electroplating substrate is carbon steel and copper. When electroplating carbon steel, copper sulfate: 40g / L, copper chloride 10g / L, sulfuric acid: 20g / L, potassium chloride: 20g / L, brightener: 3g / L, antioxidant additive: 3g / L and stress reliever: 4g / L are mixed, and deionized water is added to dilute to the required concentration. When copper is electroplated, copper sulfate: 50g / L, copper chloride 20g / L, sulfuric acid: 10g / L, potassium chloride: 10g / L, brightener: 3g / L, antioxidant additive: 3g / L and stress reliever: 4g / L are mixed, and deionized water is added to dilute to the required concentration. The ratio of the plating solution can be selected according to the substrate to be electroplated, so as to facilitate the subsequent electroplating of the cable conductor with the electroplating solution, and improve the quality of the electroplating solution when the cable conductor is electroplated;

[0067] S2. Prepare solution

[0068] 1. When electroplating carbon steel, mix copper sulfate: 40g / L, copper chloride: 10g / L, sulfuric acid: 20g / L, potassium chloride: 20g / L, brightener: 3g / L, antioxidant additive: 3g / L and stress reliever: 4g / L, and add deionized water to dilute to the required concentration. When electroplating copper, mix copper sulfate: 50g / L, copper chloride: 20g / L, sulfuric acid: 10g / L, potassium chloride: 10g / L, brightener: 3g / L, antioxidant additive: 3g / L and stress reliever: 4g / L, and add deionized water to dilute to the required concentration. 2. Stirring work, ① using corrosion-resistant stirring equipment, ② heating the stirring equipment, and stirring and proportioning the electroplating solution through the stirring equipment, avoiding the problem of uneven preparation of the electroplating solution caused by manual stirring, and then when preparing the electroplating solution, by adding a heating device to the stirring equipment, the rapid fusion of different components in the electroplating solution is accelerated, thereby improving the work efficiency of the preparation of the electroplating solution, and by providing an anti-oxidation film and a corrosion-resistant film inside the stirring equipment, the erosion of the stirring equipment in the process of proportioning the electroplating solution is reduced, thereby increasing the service life of the stirring equipment;

[0069] S3. Adjust pH value

[0070] 1. Detect pH value, ① use pH detection equipment, ② the pH value of the plating solution is 4.5-5.5, 2. Add sulfuric acid and sodium hydroxide, ① when the pH is lower than 4.5-5.5, add sodium hydroxide, ② when the pH is higher than 4.5-5.5, add sulfuric acid, 3. Detect pH value again, when preparing the plating solution, sample the plating solution through the sampling equipment, and then detect the pH value of the plating solution through pH test paper, when the pH is lower than 4.5-5.5, add sodium hydroxide to increase the pH, when the pH is higher than 4.5-5.5, add sulfuric acid to reduce the pH, and then detect again until the pH meets the set standard;

[0071] S4. Add additives

[0072] 1. Add brightener with a mixed liquid content of 64%, malic acid 20%, disodium ethylenediaminetetraacetic acid 10%, hexadecyltrimethylammonium bromide 5%, boric acid 1%, 2. Add stress reliever with a content of 60% organic solvent, 20% phosphate, 10% nitride or thio compound, 5% surfactant, and 5% stabilizer. 3. Antioxidant additive. When the cable conductor is electroplated by the electroplating solution, because the cable conductor contains a certain amount of metal stress reliever, when the electroplating solution is proportioned, the stress reliever with a content of 60% organic solvent, 20% phosphate, 10% nitride and thio compound, 5% surfactant and 5% stabilizer is added to the conductor to relieve stress. When the electroplating solution is proportioned, the antioxidant additive is added to reduce the oxidation effect of high temperature on the electroplating solution during the electroplating process, reduce the electroplating time, and thus improve the working efficiency of electroplating;

[0073] S5. Electroplating solution impurity removal

[0074] 1. Filter the plating solution. 2. Store the plating solution. ① Select a storage bottle. ② Store it in a cool place. 3. Transport the plating solution. After the plating solution is prepared, filter the plating solution to remove impurities, thereby improving the quality of the plating solution. Then select a light-proof storage bottle to store the plating solution. When needed, transport and use the plating solution. Refer to ( Figure 1 , Figure 2 , Figure 3 and Figure 4 ).

[0075] Embodiment 2:

[0076] The difference from the first embodiment is that:

[0077] Copper sulfate: 30-50g / L;

[0078] Copper chloride: 5-20g / L;

[0079] Sulfuric acid: 5-20g / L;

[0080] Potassium chloride: 5-20g / L;

[0081] Brightener: 1-5g / L.

[0082] In this embodiment, the composition of the electroplating solution is 50 g / L copper sulfate, 20 g / L copper chloride, 20 g / L sulfuric acid, and 10 g / L potassium chloride.

[0083] In this embodiment, the electroplating solution is used for electroplating cable conductors.

[0084] In this embodiment, the brightener comprises 60% of the mixed solution, 20% of malic acid, 10% of disodium ethylenediaminetetraacetate, 5% of hexadecyltrimethylammonium bromide, and 5% of boric acid.

[0085] The purification method of this embodiment comprises the following steps:

[0086] S1. Prepare solution

[0087] When electroplating carbon steel, mix 50g / L copper sulfate, 20g / L copper chloride, 20g / L sulfuric acid, and 10g / L potassium chloride, add deionized water to dilute to the required concentration, and then stir the solution by staff;

[0088] S2. Adjust pH value

[0089] 1. Detect pH value, ① use pH detection equipment, ② the pH value of the plating solution is 4.5-5.5, 2. Add sulfuric acid and sodium hydroxide, ① when the pH is lower than 4.5-5.5, add sodium hydroxide, ② when the pH is higher than 4.5-5.5, add sulfuric acid, 3. Detect pH value again, when preparing the plating solution, sample the plating solution through the sampling equipment, and then detect the pH value of the plating solution through pH test paper, when the pH is lower than 4.5-5.5, add sodium hydroxide to increase the pH, when the pH is higher than 4.5-5.5, add sulfuric acid to reduce the pH, and then detect again until the pH meets the set standard;

[0090] S3. Add additives

[0091] In order to improve the quality of electroplating, some additives need to be added, such as brighteners, inhibitors, and stabilizers. These additives need to be added strictly according to the instructions.

[0092] S4. Electroplating solution impurity removal

[0093] 1. Filter the plating solution. 2. Store the plating solution. ① Select a storage bottle. ② Store in a cool place. 3. Transport the plating solution. After the plating solution is prepared, filter the plating solution to remove impurities, thereby improving the quality of the plating solution. Refer to ( Figure 1 , Figure 2 , Figure 3 and Figure 4 ).

[0094] Embodiment three:

[0095] The difference between the first embodiment and the second embodiment is that:

[0096] The weight percentage of each component is:

[0097] Copper sulfate: 30-50g / L;

[0098] Copper chloride: 10-20g / L;

[0099] Sulfuric acid: 10-20 g / L;

[0100] Potassium chloride: 10-20g / L

[0101] Antioxidant additive: 1-10g / L.

[0102] In this embodiment, the composition of the electroplating solution is copper sulfate: 40 g / L, copper chloride: 20 g / L, sulfuric acid: 20 g / L, potassium chloride: 10 g / L, and antioxidant additive: 10 g / L.

[0103] The preparation method of this embodiment comprises the following steps:

[0104] S1. First, prepare the ingredients:

[0105] Prepare copper sulfate: 40g / L, copper chloride 20g / L, sulfuric acid: 20g / L, potassium chloride: 10g / L, and antioxidant additive: 10g / L for standby use;

[0106] S2, then mix:

[0107] A certain amount of copper sulfate, copper chloride, sulfuric acid, potassium chloride and antioxidant additives are put into the mixing box for mixing.

[0108] S4. Sample the electroplating solution using a sampling device, and then test the pH value of the electroplating solution using pH test paper.

[0109] S5. After the electroplating solution is prepared, the electroplating solution is filtered to remove impurities therein. Figure 1 , Figure 2 , Figure 3 and Figure 4 ).

[0110] In summary: By referring to ( Figure 1 , Figure 2 , Figure 3 and Figure 4 ) By comparing the first embodiment, the second embodiment and the third embodiment, it is concluded that the present invention proposes a plating solution for cable conductor electroplating and a preparation method thereof. When electroplating the cable conductor, the proportion of the plating solution can be selected according to the substrate to be electroplated, so as to facilitate the subsequent electroplating of the cable conductor by the plating solution, and improve the quality of the electroplating of the cable conductor by the plating solution. Then, when the plating solution is used to electroplate the cable conductor, because the cable conductor contains a certain amount of metal stress relief, when the plating solution is proportioned, an organic solvent accounting for 60%, a phosphate accounting for 20%, a nitride and a thio compound accounting for 10%, a surfactant accounting for 5% and a stabilizer accounting for 5% of the stress relief agent is added to the conductor to relieve the stress. , and adding antioxidant additives when proportioning the electroplating solution reduces the oxidative effect of high temperature on the electroplating solution during the electroplating process, reduces the electroplating time, and thus improves the electroplating work efficiency. The electroplating solution is then stirred and proportioned using a stirring device, avoiding the problem of uneven preparation of the electroplating solution caused by manual stirring. Then, when preparing the electroplating solution, a heating device is added to the stirring device to accelerate the rapid fusion of different components in the electroplating solution, thereby improving the work efficiency of the electroplating solution preparation. Moreover, by arranging an antioxidant film and a corrosion-resistant film inside the stirring device, the erosion of the stirring device during the proportioning of the electroplating solution is reduced, thereby increasing the service life of the stirring device.

[0111] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, technique, article or equipment including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, technique, article or equipment.

[0112] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A plating solution for cable conductor electroplating, characterized in that: The weight percentage of each component is: Copper sulfate: 30-50g / L; Copper chloride: 5-20g / L; Sulfuric acid: 5-20g / L; Potassium chloride: 5-20g / L; Brightener: 1-5g / L; Antioxidant additives: 1-5g / L; Stress reliever: 1-5g / L.

2. The electroplating solution for cable conductor electroplating according to claim 1, characterized in that: When carbon steel is used as the electroplating substrate, the composition of the electroplating solution is copper sulfate: 40g / L, copper chloride: 10g / L, sulfuric acid: 20g / L, potassium chloride: 20g / L, brightener: 3g / L, antioxidant additive: 3g / L, stress reliever: 4g / L.

3. The electroplating solution for cable conductor electroplating according to claim 1, characterized in that: When copper is used as the electroplating substrate, the composition content of the electroplating solution is copper sulfate: 50g / L, copper chloride: 20g / L, sulfuric acid: 10g / L, potassium chloride: 10g / L, brightener: 3g / L, antioxidant additive: 3g / L, stress reliever: 4g / L.

4. The electroplating solution for cable conductor electroplating according to claim 1, characterized in that: The brightener comprises 64% of the mixed solution, 20% of malic acid, 10% of disodium ethylenediaminetetraacetate, 5% of hexadecyltrimethylammonium bromide and 1% of boric acid.

5. The electroplating solution for cable conductor electroplating according to claim 1, characterized in that: The stress relieving agent contains 60% organic solvent, 20% phosphate, 10% nitride and thio compound, 5% surfactant and 5% stabilizer.

6. The electroplating solution for cable conductor electroplating according to claim 1, characterized in that: The copper sulfate is used as the main component in the electroplating solution of carbon steel and copper. The copper sulfate is prepared by reacting waste electrolyte with fine copper powder, separating and settling, cooling and crystallizing the clear liquid, separating and drying.

7. The electroplating solution for cable conductor electroplating according to claim 1, characterized in that: The sodium chloride is a conductive salt, and the electroplating solution is usually composed of a compound containing a plated metal, conductive salts, a buffer, a pH adjuster and additive components.

8. The electroplating solution for cable conductor electroplating according to claim 1, characterized in that: The sulfuric acid is a strong acidic substance that can react chemically with oxides on the metal surface to generate soluble sulfates, which are added according to the needs of carbon steel and copper.

9. The electroplating solution for cable conductor electroplating according to claim 1, characterized in that: The equivalent conductivity of the potassium chloride is 149.84Ω / cm.

10. A method for preparing a plating solution for cable conductor electroplating, based on the plating solution for cable conductor electroplating according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. Determine the composition of the plating solution 1. Select metal, ① carbon steel, ② copper, 2. Select electroplating solution, 3. Prepare materials, ① copper sulfate: 30-50g / L, ② copper chloride: 5-20g / L, ③ sulfuric acid: 5-20g / L, ④ potassium chloride: 5-20g / L, ⑤ brightener: 1-5g / L, ⑥ antioxidant additive: 1-5g / L, ⑦ stress reliever: 1-5g / L; S2. Prepare solution 1. When electroplating carbon steel, mix copper sulfate: 40g / L, copper chloride: 10g / L, sulfuric acid: 20g / L, potassium chloride: 20g / L, brightener: 3g / L, antioxidant additive: 3g / L and stress reliever: 4g / L, and add deionized water to dilute to the required concentration. When electroplating copper, mix copper sulfate: 50g / L, copper chloride: 20g / L, sulfuric acid: 10g / L, potassium chloride: 10g / L, brightener: 3g / L, antioxidant additive: 3g / L and stress reliever: 4g / L, and add deionized water to dilute to the required concentration.

2. Stir well. ① Use corrosion-resistant stirring equipment. ② Heat the stirring equipment. S3. Adjust pH value 1. Detect pH value, ① use pH detection equipment, ② the pH value of the plating solution is 4.5-5.5, 2. Add sulfuric acid and sodium hydroxide, ① when the pH is lower than 4.5-5.5, add sodium hydroxide, ② when the pH is higher than 4.5-5.5, add sulfuric acid, 3. Detect pH value again; S4. Add additives 1. The ingredients of the brightener added are 64% of the mixed solution, malic acid 20%, disodium ethylenediaminetetraacetic acid 10%, hexadecyltrimethylammonium bromide 5%, boric acid 1%, 2. The ingredients of the stress reliever added are 60% of organic solvent, 20% of phosphate, 10% of nitride or thio compound, 5% of surfactant, and 5% of stabilizer, 3. Antioxidant additives; S5. Electroplating solution impurity removal 1. Filter the plating solution.

2. Store the plating solution. ① Select a storage bottle. ② Store in a cool place.

3. Transport the plating solution.

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