Lithium tantalate wafer blackening process

Abstract

The invention belongs to the field of wafer processing, and particularly relates to a lithium tantalate wafer blackening process, which is characterized in that a lithium tantalate wafer is supported by a supporting block at the lower part in a heat treatment box body, the lower part of the lithium tantalate wafer is clamped by matching with a clamping block, and the clamping work of the lower part of the wafer is realized; after the wafer is downwards clamped and heated for a certain time by the clamping blocks at the lower part in the heat treatment box body, the clamping blocks at the upper part in the heat treatment box body move downwards to the upper part of the wafer and perform upper clamping work on the upper part of the wafer, and the wafer is heated again; after a lithium tantalate wafer is subjected to lower clamping heat treatment for a period of time by using a clamping block at the lower part in the heat treatment box body, a lithium carbonate wafer is subjected to upper clamping heat treatment for a period of time by using a clamping block at the upper part in the heat treatment box body, so that the clamping surface is prevented from being blocked by a clamp to a certain extent, and the clamping end surface cannot be fully heated; and the blackening effect of the clamping end face is influenced.

Description

Technical Field

[0001] The invention belongs to the field of wafer processing, in particular to a lithium tantalate wafer blackening process. Background Art

[0002] When lithium tantalate wafers are undergoing photolithography, diffuse reflection will occur, resulting in reduced accuracy of electrode lines. In order to change the surface properties of lithium tantalate wafers and enhance their ability to absorb light, the lithium carbonate wafers need to be blackened. Among them, heating the lithium tantalate wafer to form a black oxide layer on its surface is one way to blacken the lithium tantalate wafer.

[0003] The prior art also proposes some solutions. For example, a patent application with publication number CN211339743U discloses a lithium tantalate wafer blackening device, including a containing tube. In this solution, gaps are created between adjacent jigs through through grooves on the jig. The through grooves between adjacent jigs are staggered so that nitrogen enters the interior of the jig more dispersedly, ensuring that nitrogen is evenly distributed between each lithium tantalate wafer. The reducing agent is in full contact with the wafer, so that the reaction of the lithium tantalate wafer is uniform and sufficient, thereby ensuring the uniformity of blackening.

[0004] When the lithium tantalate wafer is undergoing a heated blackening reaction, a corresponding clamp is used to clamp and fix the lithium tantalate wafer. However, when the lithium tantalate wafer is clamped, the end face of the lithium tantalate wafer in contact with the clamp will be blocked by the clamp and cannot be fully heated, which will cause the blackening degree of this part of the wafer to be different from that of other heated parts. The clamped end face that is not fully heated may not achieve the expected blackening depth or properties, which will affect the optical, electrical or other related properties of the wafer and make it unable to meet the requirements of specific applications.

[0005] To this end, the present invention provides a lithium tantalate wafer blackening process. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve the technical problem is: a lithium tantalate wafer blackening process described in the present invention comprises the following steps:

[0008] S1: Clean the lithium tantalate wafer to remove surface impurities and contaminants:

[0009] S2: placing the lithium tantalate wafer in a heat treatment furnace and clamping and fixing it to ensure the stability of the lithium tantalate wafer during blackening;

[0010] S3: using a heat treatment furnace to heat the wafer to provide energy required for the blackening reaction. While heating, injecting a reducing agent into the heat treatment furnace, the reducing agent reacts chemically with the lithium tantalate wafer to blacken the wafer surface;

[0011] S4: After the blackening reaction using a heat treatment furnace, the temperature of the wafer is lowered to a suitable range;

[0012] S5: Perform subsequent processing steps, such as cleaning and annealing, as needed to further improve the performance of the wafer.

[0013] Preferably, the heat treatment furnace of S in the blackening process of lithium tantalate wafers includes a heat treatment box, an air intake valve and a pressure relief valve installed on the top of the heat treatment box, a temperature detector installed on the outer wall of the heat treatment box, a driving component is arranged at the middle position of the back of the heat treatment box, the driving component is used to provide driving force, clamping components are arranged at the middle positions of the upper and lower ends of the heat treatment box, the clamping components are used to clamp the lithium tantalate wafer, a linkage component is arranged on the clamping component, the linkage component is used to apply force to the clamping component to clamp it, a pushing component is arranged at the middle position of the upper and lower ends of the heat treatment box, the pushing component is used to push the clamping component to move, and resistance wires are installed on both sides of the inside of the heat treatment box, and the resistance wires are used to heat the lithium tantalate wafer.

[0014] Preferably, the drive assembly includes a casing fixed at the middle position of the back of the heat treatment box, a dual-axis motor is installed at the middle position inside the casing, driving shafts are fixed to the rotating shafts at both ends of the dual-axis motor, and active bevel gears are fixed to the ends of the driving shafts. The active bevel gears are located at the upper and lower ends inside the casing.

[0015] Preferably, the clamping assembly includes a bracket arranged at the middle position of the upper and lower ends of the heat treatment box, two support blocks are fixed on the bracket, two corresponding clamping blocks are hinged on both sides of the support block, four return springs are arranged under the support block, and the two return springs are fixed between the corresponding two clamping blocks.

[0016] Preferably, the two support blocks are symmetrical on both sides of the midline of the bracket, and the two clamping blocks are symmetrical on both sides of the midline of the support blocks.

[0017] Preferably, the linkage assembly includes a linkage rod that passes through the bracket horizontally, an elliptical wheel is fixed to the outside of the linkage rod, the elliptical wheel is placed between two corresponding clamping blocks, and connecting grooves are provided at the upper and lower ends of the middle position on the back of the heat treatment box. One end of the linkage rod extends through the connecting groove to the casing where a driven bevel gear is fixed.

[0018] Preferably, two return springs are located on both sides of the elliptical wheel disc, the size of the linkage rod is matched with the size of the connecting groove, and the linkage rod can move up and down in the connecting groove.

[0019] Preferably, the pushing assembly includes a hydraulic telescopic rod installed at the middle position of the upper and lower ends of the heat treatment box, one end of the hydraulic telescopic rod extends to the interior of the heat treatment box and is fixedly connected to the bracket, both ends of the hydraulic telescopic rod are provided with guide grooves, the guide grooves are opened on the heat treatment box, and a guide rod is longitudinally penetrated inside the guide groove, and one end of the guide rod is fixedly connected to the bracket.

[0020] Preferably, the outer diameter of the guide rod matches the inner diameter of the guide groove, and the guide rod can slide up and down in the guide groove.

[0021] Preferably, two resistance wires are provided, and the two resistance wires are symmetrical on both sides of the center line inside the heat treatment box.

[0022] The beneficial effects of the present invention are as follows:

[0023] The blackening process of lithium tantalate wafers described in the present invention supports the lithium tantalate wafer by means of a support block at the lower part of the heat treatment box, and clamps the lower part of the lithium tantalate wafer with a clamping block, so as to complete the clamping work of the lower part of the lithium tantalate wafer. After the lithium tantalate wafer is clamped and heated by the clamping block at the lower part of the heat treatment box for a certain period of time, the clamping block at the upper part of the heat treatment box moves down to the upper part of the lithium tantalate wafer under the action of the hydraulic telescopic rod at the top of the heat treatment box and performs the upper clamping work on the upper part of the lithium tantalate wafer. At the same time, the clamping block at the lower part of the heat treatment box moves back under the action of the hydraulic telescopic rod at the bottom of the heat treatment box. Retreat to the initial position and stop clamping the lithium tantalate wafer. At this time, the lithium tantalate wafer is heated again. The lithium tantalate wafer is subjected to lower clamping heat treatment for a period of time using the clamping block at the bottom of the heat treatment box. Then, the lithium carbonate wafer is subjected to upper clamping heat treatment for a period of time using the clamping block at the top of the heat treatment box. This prevents the clamping surface from being blocked by the fixture to a certain extent, causing the blackening degree of this part of the wafer to be different from that of other heated parts, resulting in the insufficiently heated clamping end face failing to achieve the expected blackening depth or properties, thereby affecting the optical, electrical or other related properties of the wafer, making it unable to meet the requirements of specific applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below in conjunction with the accompanying drawings.

[0025] Figure 1 The overall structure of the present invention Figure 1 ;

[0026] Figure 2 The overall structure of the present invention Figure 2 ;

[0027] Figure 3 The overall structure of the present invention Figure 3 ;

[0028] Figure 4 The overall structure of the present invention is a cross-sectional view Figure 1 ;

[0029] Figure 5 The overall structure of the present invention is a cross-sectional view Figure 2 ;

[0030] Figure 6 It is a local structure in the present invention Figure 1 ;

[0031] Figure 7 It is a local structure in the present invention Figure 2 ;

[0032] In the figure: 1. heat treatment box; 2. intake valve; 3. pressure relief valve; 4. temperature detector; 5. drive assembly; 51. housing; 52. dual-axis motor; 53. drive shaft; 54. active bevel gear; 6. linkage assembly; 61. linkage rod; 62. elliptical wheel; 63. driven bevel gear; 64. connecting groove; 7. clamping assembly; 71. bracket; 72. support block; 73. clamping block; 74. reset spring; 8. push assembly; 81. hydraulic telescopic rod; 82. guide rod; 83. guide groove; 9. resistance wire. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0034] like Figures 1 to 7 As shown, a lithium tantalate wafer blackening process according to an embodiment of the present invention comprises the following steps:

[0035] S1: Clean the lithium tantalate wafer to remove surface impurities and contaminants:

[0036] S2: placing the lithium tantalate wafer in a heat treatment furnace and clamping and fixing it to ensure the stability of the lithium tantalate wafer during blackening;

[0037] S3: using a heat treatment furnace to heat the wafer to provide energy required for the blackening reaction. While heating, injecting a reducing agent into the heat treatment furnace, the reducing agent reacts chemically with the lithium tantalate wafer to blacken the wafer surface;

[0038] S4: After the blackening reaction using a heat treatment furnace, the temperature of the wafer is lowered to a suitable range;

[0039] S5: Perform subsequent processing steps, such as cleaning and annealing, as needed to further improve the performance of the wafer.

[0040] like Figures 1 to 7As shown, the heat treatment furnace of S2 in the blackening process of lithium tantalate wafers includes a heat treatment box 1, an air intake valve 2 and a pressure relief valve 3 installed on the top of the heat treatment box 1, a temperature detector 4 is installed on the outer wall of the heat treatment box 1, a driving component 5 is arranged at the middle position of the back of the heat treatment box 1, and the driving component 5 is used to provide a driving force. Clamping components 7 are arranged at the middle positions of the upper and lower ends of the heat treatment box 1, and the clamping components 7 are used to clamp the lithium tantalate wafer. A linkage component 6 is arranged on the clamping component 7, and the linkage component 6 is used to apply force to the clamping component 7 to clamp it. A pushing component 8 is arranged at the middle position of the upper and lower ends of the heat treatment box 1, and the pushing component 8 is used to push the clamping component 7 to move. Resistance wires 9 are installed on both sides of the heat treatment box 1, and the resistance wires 9 are used to heat the lithium tantalate wafer. Open the box door, put the lithium tantalate wafer into the heat treatment box 1, use the clamping assembly 7 to clamp the lithium tantalate wafer, close the box door, start the resistance wire 9, the resistance wire 9 heats the clamped lithium tantalate wafer, the temperature detector 4 monitors the temperature inside the heat treatment box 1, and uses the air intake valve 2 to inject reducing agent gas into the interior of the heat treatment box 1, and uses the pressure relief valve 3 to relieve the pressure to ensure the pressure inside the heat treatment box 1. After the preset time is reached, open the box door and take out the blackened lithium tantalate wafer in the heat treatment box 1.

[0041] like Figure 2 , Figures 4 to 6 As shown, the driving assembly 5 includes a housing 51 fixed at the middle position of the back of the heat treatment box 1, a double-shaft motor 52 is installed at the middle position inside the housing 51, a driving shaft 53 is fixed to the rotating shaft at both ends of the double-shaft motor 52, and an active bevel gear 54 is fixed to the end of the driving shaft 53, and the active bevel gear 54 is located at the upper and lower ends of the housing 51. When the double-shaft motor 52 is started, the double-shaft motor 52 drives the active bevel gear 54 to rotate through the driving shaft 53, and the active bevel gears 54 placed at the upper and lower ends of the double-shaft motor 52 rotate simultaneously.

[0042] like Figures 3 to 7 As shown, the clamping assembly 7 includes a bracket 71 arranged at the middle position of the upper and lower ends of the heat treatment box 1, two support blocks 72 are fixed on the bracket 71, two corresponding clamping blocks 73 are hinged on both sides of the support block 72, four return springs 74 are arranged below the support block 72, and the two return springs 74 are fixed between the two corresponding clamping blocks 73. The two support blocks 72 are symmetrical on both sides of the center line of the bracket 71, and the two clamping blocks 73 are symmetrical on both sides of the center line of the support block 72. The clamping block 73 is divided into a clamping part and a force-bearing part. The return spring 74 is arranged at the force-bearing part of the clamping block 73. In the default state, the return spring 74 does not undergo elastic deformation, the clamping part of the clamping block 73 is opened, and the lithium tantalate wafer is placed on the top of the support block 72, and the force-bearing part of the clamping block 73 is pushed outward. The clamping part of the clamping block 73 is close to the lithium tantalate wafer, and the clamping block 73 can be clamped.

[0043] like Figures 3 to 7 As shown, the linkage assembly 6 includes a linkage rod 61 that runs transversely through the bracket 71, an elliptical wheel 62 is fixed to the outside of the linkage rod 61, and the elliptical wheel 62 is placed between two corresponding clamping blocks 73. A coupling groove 64 is provided at the upper and lower ends of the middle position of the back of the heat treatment box 1. One end of the linkage rod 61 extends through the coupling groove 64 to the housing 51 where a driven bevel gear 63 is fixed. Two return springs 74 are located on both sides of the elliptical wheel 62. The size of the linkage rod 61 matches the size of the coupling groove 64, and the linkage rod 61 can move up and down in the coupling groove 64. The rotation of the linkage rod 61 drives the elliptical wheel 62 to rotate, and the wider part of the rotating elliptical wheel 62 pushes the force-bearing part of the clamping block 73 outward, so that the clamping parts of the clamping block 73 are close to each other for clamping operation.

[0044] like Figures 3 to 7 As shown, the push assembly 8 includes a hydraulic telescopic rod 81 installed at the middle position of the upper and lower ends of the heat treatment box 1, one end of the hydraulic telescopic rod 81 extends to the inside of the heat treatment box 1 and is fixedly connected to the bracket 71, and both ends of the hydraulic telescopic rod 81 are provided with a guide groove 83, the guide groove 83 is opened on the heat treatment box 1, and the inside of the guide groove 83 is longitudinally penetrated by a guide rod 82, and one end of the guide rod 82 is fixedly connected to the bracket 71. When the hydraulic telescopic rod 81 is started, the hydraulic telescopic rod 81 pushes the bracket 71 to move, so that each component on the bracket 71 moves up or down, and the guide rod 82 moves inside the guide groove 83, thereby improving the stability of the movement of the bracket 71.

[0045] like Figures 3 to 7 As shown, the outer diameter of the guide rod 82 matches the inner diameter of the guide groove 83 , and the guide rod 82 can slide up and down in the guide groove 83 . Two resistance wires 9 are provided, and the two resistance wires 9 are symmetrical on both sides of the center line inside the heat treatment box 1 .

[0046] Working principle: First, open the box door and start the hydraulic telescopic rod 81 at the bottom of the heat treatment box 1. The hydraulic telescopic rod 81 pushes up the bracket 71 at the bottom of the heat treatment box 1. The linkage rod 61 that runs horizontally through the bracket 71 and the various components of the bracket 71 move up accordingly. One end of the linkage rod 61 located at the bottom of the heat treatment box 1 moves up in the connecting groove 64 until the linkage rod 61 moves up to the uppermost position in the connecting groove 64 and stops. At this time, the driven bevel gear 63 at the end of the linkage rod 61 is meshed with the active bevel gear 54 at the end of the drive shaft 53 fixed at the lower end of the dual-axis motor 52. The driven bevel gear 63 and the active bevel gear 54 can use gears with sharper teeth to ensure the stable connection of the driven bevel gear 63 when meshing with the active bevel gear 54. Then put the lithium tantalate wafer into the heat treatment box 1 to place the lithium tantalate wafer in the heat treatment box. On the support block 72 at the top of the bracket 71 at the bottom of the treatment box 1, the double-axis motor 52 is started, the double-axis motor 52 drives the active bevel gear 54 to rotate, the active bevel gear 54 drives the driven bevel gear 63 to rotate, the driven bevel gear 63 drives the linkage rod 61 to rotate, the rotating linkage rod 61 drives the elliptical wheel 62 outside it to rotate, the wider part of the elliptical wheel 62 gradually pushes the force-bearing part of the clamping block 73 outward, the clamping part of the clamping block 73 moves toward the lithium tantalate wafer placed on the support block 72 and clamps it. At the same time, when the force-bearing part of the clamping block 73 is expanded outward by the pressure of the elliptical wheel 62, the force-bearing part of the clamping block 73 will pull the reset spring 74 to extend it, and the lithium tantalate wafer is supported by the support block 72 at the bottom of the heat treatment box 1, and the lower part of the lithium tantalate wafer is clamped with the clamping block 73, so that the clamping work of the lower part of the lithium tantalate wafer can be completed;

[0047] Secondly, the box door is closed, and the resistance wire 9 is started. The resistance wire 9 heats the clamped lithium tantalate wafer, and the temperature detector 4 monitors the temperature inside the heat treatment box 1. The reducing agent gas is injected into the heat treatment box 1 by using the air inlet valve 2, and the pressure relief valve 3 is used to release the pressure to ensure the pressure inside the heat treatment box 1;

[0048] After that, after heating for a certain period of time, the hydraulic telescopic rod 81 on the top of the heat treatment box 1 is started, and the hydraulic telescopic rod 81 pushes down the bracket 71 on the upper part of the heat treatment box 1, and the linkage rod 61 that runs horizontally through the bracket 71 and the various components of the bracket 71 move downward accordingly, and one end of the linkage rod 61 located at the upper part of the heat treatment box 1 moves downward in the connecting groove 64 until the linkage rod 61 moves down to the lowest position in the connecting groove 64 and stops. At this time, the driven bevel gear 63 at the end of the linkage rod 61 is meshed with the active bevel gear 54 at the end of the drive shaft 53 fixed at the upper end of the double-axis motor 52, and the linkage rod 61 located in the heat treatment box 1 is engaged with the active bevel gear 54 at the end of the drive shaft 53 fixed at the upper end of the double-axis motor 52. The clamp block 73 above the heat treatment box 1 moves to the upper part of the lithium tantalate wafer, and the dual-axis motor 52 and the hydraulic telescopic rod 81 at the bottom of the heat treatment box 1 are started at the same time. The hydraulic telescopic rod 81 at the bottom of the heat treatment box 1 drives the bracket 71 at the bottom of the heat treatment box 1 to move downward, so that the driven bevel gear 63 at the end of the linkage rod 61 is separated from the active bevel gear 54 below the dual-axis motor 52. The driven bevel gear 63 is no longer subject to the self-locking effect of the active bevel gear 54. The force-bearing part of the clamp block 73 at the bottom of the heat treatment box 1 loses the pressure of the elliptical wheel 62, and the extended reset spring 74 drives the clamp block 73 at the bottom of the heat treatment box 1 by its own elastic force. 3, the clamping portion of the clamp block 73 moves away from the lithium tantalate wafer, the clamp block 73 stops clamping the bottom of the lithium tantalate wafer and moves away from the bottom of the lithium tantalate wafer. At the same time, the dual-axis motor 52 drives the driven bevel gear 63 to rotate through the active bevel gear 54 to rotate the linkage rod 61 above the inside of the heat treatment box 1, and the linkage rod 61 drives the elliptical wheel 62 outside it to rotate. The wider part of the elliptical wheel 62 gradually pushes the force-bearing part of the clamp block 73 outward, and the clamping part of the clamp block 73 moves toward the position of the lithium tantalate wafer and clamps it. At this time, the force-bearing part of the clamp block 73 is outwardly pushed by the pressure of the elliptical wheel 62. The force-bearing part of the clamp block 73 will pull the reset spring 74 to extend it. In summary, after the lithium tantalate wafer is clamped and heated for a certain period of time by the clamp block 73 at the bottom of the heat treatment box 1, the clamp block 73 at the top of the heat treatment box 1 moves down to the upper position of the lithium tantalate wafer and clamps the upper part of the lithium tantalate wafer. At the same time, the clamp block 73 at the bottom of the heat treatment box 1 moves back to the initial position under the action of the hydraulic telescopic rod 81 at the bottom of the heat treatment box 1 and stops clamping the lithium tantalate wafer. At this time, the lithium tantalate wafer is heated again.

[0049] After the preset time is reached, the box door is opened, and the hydraulic telescopic rod 81 on the top of the heat treatment box 1 drives the bracket 71 on the upper part of the heat treatment box 1 to move upward, so that the driven bevel gear 63 at the end of the linkage rod 61 is separated from the active bevel gear 54 on the upper part of the dual-axis motor 52, and the force-bearing part of the clamp block 73 on the upper part of the heat treatment box 1 loses the pressure of the elliptical wheel 62, and the extended return spring 74 drives the force-bearing part of the clamp block 73 to approach each other by its own elastic force, and the clamping part of the clamp block 73 is away from the lithium tantalate wafer, and the clamp block 73 stops clamping the top of the lithium tantalate wafer, and the lithium tantalate wafer that has been blackened in the heat treatment box 1 is taken out to complete the blackening treatment of the lithium tantalate wafer;

[0050] By clamping the lithium tantalate wafer up and down, the clamping surface is prevented from being blocked by the fixture to a certain extent, so that the blackening degree of this part of the wafer is different from that of other heated parts, resulting in the insufficiently heated clamping end face failing to achieve the expected blackening depth or properties, thereby affecting the optical, electrical or other related properties of the wafer, making it unable to meet the requirements of specific applications.

[0051] Another technical solution proposed by the present invention is to provide a lithium tantalate wafer blackening process, comprising the following steps:

[0052] S1: Clean the lithium tantalate wafer to remove surface impurities and contaminants:

[0053] S2: placing the lithium tantalate wafer in a heat treatment furnace and clamping and fixing it to ensure the stability of the lithium tantalate wafer during blackening;

[0054] S3: using a heat treatment furnace to heat the wafer to provide energy required for the blackening reaction. While heating, injecting a reducing agent into the heat treatment furnace, the reducing agent reacts chemically with the lithium tantalate wafer to blacken the wafer surface;

[0055] S4: After the blackening reaction using a heat treatment furnace, the temperature of the wafer is lowered to a suitable range;

[0056] S5: Perform subsequent processing steps, such as cleaning and annealing, as needed to further improve the performance of the wafer.

[0057] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A lithium tantalate wafer blackening process, characterized in that: The following steps are involved: S1: Clean the lithium tantalate wafer to remove surface impurities and contaminants: S2: placing the lithium tantalate wafer in a heat treatment furnace and clamping and fixing it to ensure the stability of the lithium tantalate wafer during blackening; S3: using a heat treatment furnace to heat the wafer to provide energy required for the blackening reaction. While heating, injecting a reducing agent into the heat treatment furnace, the reducing agent reacts chemically with the lithium tantalate wafer to blacken the wafer surface; S4: After the blackening reaction using a heat treatment furnace, the temperature of the wafer is lowered to a suitable range; S5: Perform subsequent processing steps, such as cleaning and annealing, as needed to further improve the performance of the wafer.

2. A lithium tantalate wafer blackening process according to claim 1, characterized in that: The heat treatment furnace S2 in the blackening process of lithium tantalate wafers comprises a heat treatment box (1), an air intake valve (2) and a pressure relief valve (3) installed on the top of the heat treatment box (1), a temperature detector (4) installed on the outer wall of the heat treatment box (1), a driving component (5) is arranged at the middle position of the back of the heat treatment box (1), and the driving component (5) is used to provide a driving force. The middle positions of the upper and lower ends of the heat treatment box (1) are both provided with clamping components (7), and the clamping components (7) are used to clamp the lithium tantalate wafer. The clamping components (7) are provided with a linkage component (6), and the linkage component (6) is used to apply force to the clamping components (7) to clamp it. The middle positions of the upper and lower ends of the heat treatment box (1) are provided with a push component (8), and the push component (8) is used to push the clamping component (7) to move. Resistance wires (9) are installed on both sides of the heat treatment box (1), and the resistance wires (9) are used to heat the lithium tantalate wafer.

3. A lithium tantalate wafer blackening process according to claim 2, characterized in that: The driving assembly (5) comprises a casing (51) fixed at the middle position of the back of the heat treatment box (1); a double-shaft motor (52) is installed at the middle position inside the casing (51); driving shafts (53) are fixed to the rotating shafts at both ends of the double-shaft motor (52); active bevel gears (54) are fixed to the ends of the driving shafts (53); and the active bevel gears (54) are located at the upper and lower ends inside the casing (51).

4. A lithium tantalate wafer blackening process according to claim 3, characterized in that: The clamping assembly (7) comprises a bracket (71) arranged at the middle position between the upper and lower ends of the heat treatment box (1), two support blocks (72) are fixed on the bracket (71), two corresponding clamping blocks (73) are hinged on both sides of the support block (72), four return springs (74) are arranged below the support block (72), and the two return springs (74) are fixed between the corresponding two clamping blocks (73).

5. A lithium tantalate wafer blackening process according to claim 4, characterized in that: The two support blocks (72) are symmetrical on both sides of the midline of the bracket (71), and the two clamping blocks (73) are symmetrical on both sides of the midline of the support block (72).

6. A lithium tantalate wafer blackening process according to claim 4, characterized in that: The linkage assembly (6) comprises a linkage rod (61) which runs transversely through the bracket (71); an elliptical wheel disc (62) is fixed to the outside of the linkage rod (61); the elliptical wheel disc (62) is placed between two corresponding clamping blocks (73); a connection groove (64) is provided at the upper and lower ends of the middle position of the back of the heat treatment box (1); one end of the linkage rod (61) extends through the connection groove (64) to the housing (51) where a driven bevel gear (63) is fixed.

7. A lithium tantalate wafer blackening process according to claim 6, characterized in that: Two return springs (74) are located on both sides of the elliptical wheel disc (62). The size of the linkage rod (61) matches the size of the connection groove (64). The linkage rod (61) can move up and down in the connection groove (64).

8. A lithium tantalate wafer blackening process according to claim 4, characterized in that: The push assembly (8) comprises a hydraulic telescopic rod (81) installed at the middle position of the upper and lower ends of the heat treatment box (1), one end of the hydraulic telescopic rod (81) extends to the inside of the heat treatment box (1) and is fixedly connected to the bracket (71), both ends of the hydraulic telescopic rod (81) are provided with guide grooves (83), the guide groove (83) is opened on the heat treatment box (1), a guide rod (82) is longitudinally penetrated inside the guide groove (83), and one end of the guide rod (82) is fixedly connected to the bracket (71).

9. A lithium tantalate wafer blackening process according to claim 8, characterized in that: The outer diameter of the guide rod (82) matches the inner diameter of the guide groove (83), and the guide rod (82) can slide up and down in the guide groove (83).

10. A lithium tantalate wafer blackening process according to claim 2, characterized in that: Two resistance wires (9) are provided, and the two resistance wires (9) are symmetrically arranged on both sides of the center line inside the heat treatment box (1).

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