Temperature and pressure sensor and temperature and pressure detection device

Abstract

The invention provides a temperature and pressure sensor and a temperature and pressure detection device, and relates to the technical field of sensors. In the temperature and pressure sensor, a shell is provided with a first assembly space, a first channel and a second channel; the first channel and the second channel are spaced and communicate with the first assembly space. The base is arranged in the first assembly space; and a second assembly space and a third channel are formed in the first assembly body and communicate with each other. And the third channel is correspondingly communicated with the first channel. The pressure sensitive element is arranged in the second assembly space. The circuit board structure is arranged in the first assembly space and is electrically connected with the pressure sensitive element. The temperature sensitive element is arranged in the second channel; the temperature sensitive element is electrically connected with the circuit board structure. The output assembly is electrically connected with the circuit board structure. The temperature and pressure detection device provided by the invention adopts the temperature and pressure sensor. According to the temperature and pressure sensor and the temperature and pressure detection device provided by the invention, the technical problem that a temperature and pressure integrated sensor is difficult to package can be solved.

Description

Technical Field

[0001] The present invention relates to the field of sensor technology, and in particular to a temperature and pressure sensor and a temperature and pressure detection device. Background Art

[0002] The integrated temperature and pressure sensor is an integrated pressure sensor that senses pressure and a temperature sensor (usually NTC) that senses temperature, and outputs temperature and pressure signals to the control end. This integrated sensor can solve the problems that independent temperature sensors and pressure sensors are difficult to ensure the identity of the measured point position, and that separate installation requires two sets of electrical harnesses and media channels, occupies a large space, is not convenient for installation, and has high separate procurement costs.

[0003] However, in the prior art, since the temperature sensitive element needs to extend a certain length into the measured fluid, the packaging of the temperature and pressure integrated sensor is relatively complicated, resulting in an increase in the overall cost of the temperature and pressure integrated sensor. Summary of the invention

[0004] The technical problem solved by the present invention is how to improve the technical problem of difficulty in packaging the temperature and pressure integrated sensor in the prior art.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] The present invention provides a temperature and pressure sensor, comprising:

[0007] A shell, wherein one side of the shell is provided with a first assembly space, and the other side of the shell is provided with a first channel and a second channel; the first channel and the second channel are spaced apart, and both the first channel and the second channel are connected to the first assembly space;

[0008] A base is arranged in the first assembly space; a second assembly space is opened on one side thereof, and a third channel is opened on the other side thereof, wherein the third channel is connected to the second assembly space; and the third channel is correspondingly connected to the first channel;

[0009] A pressure sensitive element is arranged in the second assembly space;

[0010] A circuit board structure is disposed in the first assembly space and is located on a side of the pressure sensitive element away from the third channel; the circuit board structure is electrically connected to the pressure sensitive element;

[0011] A temperature sensitive element is disposed inside the second channel; the temperature sensitive element is electrically connected to the circuit board structure via a terminal on the base;

[0012] An output component partially extends into the first assembly space and is electrically connected to the circuit board structure.

[0013] Optionally, the temperature and pressure sensor further includes a first sealing ring, which is disposed inside the second assembly space and is pressed between the pressure sensitive element and the base; the first sealing ring encloses a sealed space, and the sealed space is connected to the third channel.

[0014] Optionally, the temperature and pressure sensor further includes a second sealing ring, which is disposed between the housing and the base, and is disposed around a connecting point between the first channel and the third channel.

[0015] Optionally, a protrusion is provided on the base, and the third channel passes through the protrusion; a groove matching the protrusion is provided on the bottom wall of the first assembly space; the protrusion extends into the groove; the second sealing ring is sleeved on the protrusion and is pressed between the protrusion and the side wall of the groove.

[0016] Optionally, a positioning groove is further provided on the bottom wall of the groove, and the end of the protrusion extends into the positioning groove.

[0017] Optionally, one end of the temperature sensitive element extends out of the second channel.

[0018] Optionally, the temperature sensitive element includes a mounting portion, a lead terminal, a detection terminal and a housing; the detection terminal is arranged at one end of the lead terminal, and the mounting portion is connected to the other end of the lead terminal through a glass sintering sealing process; the housing is wrapped around the lead terminal, and the two ends are respectively connected to the mounting portion and the detection terminal; the mounting portion and the housing are installed in the second channel, and the detection terminal extends out of the second channel.

[0019] Optionally, the mounting portion is interference fit with the second channel.

[0020] Optionally, the circuit board structure is bent into a U shape, one end of which is electrically connected to the pressure sensitive element, and the other end of which is electrically connected to the output component.

[0021] The beneficial effects of the temperature and pressure sensor provided by the present invention compared with the prior art include:

[0022] In the temperature and pressure sensor, since the first channel and the second channel, which are spaced apart and independent from each other, are provided on the shell, the fluid is introduced to the pressure sensitive element through the first channel to detect the pressure; and the temperature sensitive element is provided through the second channel, so that the temperature sensitive element can directly contact the fluid to detect the temperature. Thus, the temperature sensitive element and the pressure sensitive element can be separated from each other, so that the independent sealing of the pressure sensitive element and the independent sealing of the temperature sensitive element can be facilitated, the packaging difficulty is reduced, and the technical problem of the difficulty of packaging the temperature and pressure integrated sensor in the prior art is improved.

[0023] Furthermore, by providing a first sealing ring and a second sealing ring, the fluid introduced from the first channel and the third channel can be prevented from entering the area where the circuit board structure is located, thereby achieving independent sealing of the pressure sensitive element; and the connection between the mounting part and the lead terminal is achieved by means of a glass sintering sealing process, and then the independent sealing of the temperature sensitive element is achieved by the interference fit between the mounting part and the second channel, which can not only improve the sealing performance but also reduce the difficulty of operation, thereby achieving the purpose of improving the technical problem of difficult packaging of temperature and pressure integrated sensors in the prior art.

[0024] A temperature and pressure detection device comprises the temperature and pressure sensor mentioned above.

[0025] The temperature and pressure detection device provided by the present invention adopts the above-mentioned temperature and pressure sensor. The beneficial effects of the temperature and pressure detection device relative to the prior art are the same as the beneficial effects of the above-mentioned temperature and pressure sensor relative to the prior art, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 This is a schematic diagram of the structure of the temperature and pressure sensor provided in the embodiment of the present application;

[0028] Figure 2 A schematic diagram of the explosion structure of the temperature and pressure sensor provided in an embodiment of the present application;

[0029] Figure 3 A cross-sectional view of a temperature and pressure sensor provided in an embodiment of the present application;

[0030] Figure 4 This is a schematic diagram of the explosion structure of the temperature sensitive element provided in the embodiment of the present application.

[0031] Icon: 10-temperature and pressure sensor; 100-shell; 110-first assembly space; 111-groove; 112-positioning groove; 120-first channel; 130-second channel; 200-base; 210-second assembly space; 220-third channel; 230-protrusion; 300-pressure sensitive element; 400-circuit board structure; 500-temperature sensitive element; 510-installation part; 520-lead terminal; 530-detection terminal; 540-shell; 600-output component; 710-first sealing ring; 720-second sealing ring. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0035] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0036] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0037] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0038] See also Figure 1In an embodiment of the present application, a temperature and pressure sensor 10 is provided, which can be used to simultaneously detect the temperature and pressure of a fluid, and the temperature and pressure sensor 10 can improve the technical problem of difficulty in packaging an integrated temperature and pressure sensor in the prior art.

[0039] In this embodiment, please refer to Figure 1 and Figure 2 The temperature and pressure sensor 10 includes a housing 100, a base 200, a pressure sensitive element 300, a circuit board structure 400, a temperature sensitive element 500 and an output component 600. A first assembly space 110 is provided on one side of the housing 100, and a first channel 120 and a second channel 130 are provided on the other side; the first channel 120 and the second channel 130 are spaced apart, and both the first channel 120 and the second channel 130 are connected to the first assembly space 110. The base 200 is disposed in the first assembly space 110; a second assembly space 210 is provided on one side of the housing 200, and a third channel 220 is provided on the other side, and the third channel 220 is connected to the second assembly space 210; the third channel 220 is connected to the first channel 120 correspondingly. As can be seen from Figure X, the upper side of the housing 100 is provided with a first assembly space 110, while the lower side is provided with a first channel 120 and a second channel 130; similarly, the upper side of the base 200 is provided with a second assembly space 210, while the lower side is provided with a third channel 220. The pressure sensitive element 300 is arranged in the second assembly space 210. The circuit board structure 400 is arranged in the first assembly space 110, and is located on the side of the pressure sensitive element 300 away from the third channel 220; the circuit board structure 400 is electrically connected to the pressure sensitive element 300. The temperature sensitive element 500 is arranged inside the second channel 130; the temperature sensitive element 500 is electrically connected to the circuit board structure 400 through the wiring terminals on the base 200. The output component 600 partially extends into the first assembly space 110 and is electrically connected to the circuit board structure 400.

[0040] Among them, when the temperature and pressure sensor 10 is placed in the measured fluid, the temperature sensitive element 500 can directly contact the measured fluid, and can directly react, and can accurately and quickly complete the temperature detection; it is worth noting that the electrical signal generated by the temperature sensitive element 500 is transmitted from the wiring terminal on the base 200 to the circuit board structure 400, and then after being processed by the electrical components on the circuit board structure 400, it is sent to the output component 600 to output the signal. In addition, the fluid can be introduced into the second assembly space 210 from the first channel 120 and the third channel 220 to act on the pressure sensitive element 300, so as to prompt the pressure sensitive element 300 to react to complete the pressure detection. It is worth noting that the electrical signal generated by the pressure sensitive element 300 can be directly transmitted to the circuit board structure 400, and after being processed by the circuit board structure 400, it is sent to the output component 600 to output the signal.

[0041] As described above, since the first channel 120 and the second channel 130 which are spaced apart and independent from each other are provided on the housing 100, the fluid is introduced to the pressure sensitive element 300 through the first channel 120 to detect the pressure; and the temperature sensitive element 500 is provided through the second channel 130, so that the temperature sensitive element 500 can directly contact the fluid to detect the temperature. Therefore, the temperature sensitive element 500 and the pressure sensitive element 300 can be separated from each other, so that the independent sealing of the pressure sensitive element 300 and the independent sealing of the temperature sensitive element 500 can be facilitated, the packaging difficulty is reduced, and the technical problem of the difficulty of packaging the temperature and pressure integrated sensor in the prior art is improved.

[0042] In this embodiment, the temperature and pressure sensor 10 further includes a first sealing ring 710, which is disposed inside the second assembly space 210 and is pressed between the pressure sensitive element 300 and the base 200; the first sealing ring 710 encloses a sealed space, and the sealed space is connected to the third channel 220. When the first channel 120 and the third channel 220 introduce the measured fluid into the second assembly space 210, the measured fluid is introduced into the sealed space enclosed by the first sealing ring 710; because the first sealing ring 710 is pressed, the measured fluid located inside the first sealing ring 710 can only act on the pressure sensitive element 300, which can prevent the measured fluid from leaking from the gap between the pressure sensitive element 300 and the peripheral wall of the second assembly space 210, and can protect the circuit board structure 400.

[0043] It should be understood that in other embodiments of the present application, sealing can also be achieved by the close fit between the outer periphery of the pressure sensitive element 300 and the second assembly space 210 , that is, in some embodiments, the first sealing ring 710 can be eliminated.

[0044] Furthermore, the temperature and pressure sensor 10 further includes a second sealing ring 720, which is disposed between the housing 100 and the base 200, and is disposed around the connection between the first channel 120 and the third channel 220. In other words, the measured fluid introduced into the first channel 120 will first pass through the gap at the connection between the first channel 120 and the third channel 220 before entering the third channel 220, and the gap is formed by the base 200 and the housing 100. By disposing the second sealing ring 720, the measured fluid in the above-mentioned gap can be prevented from leaking into the first assembly space 110, thereby preventing the measured fluid from flowing to the location of the circuit board structure 400, and providing a stable protection for the circuit board structure 400.

[0045] In this embodiment, by providing the first sealing ring 710 and the second sealing ring 720 , the fluid introduced from the first channel 120 and the third channel 220 can be prevented from entering the area where the circuit board structure 400 is located, thereby achieving independent sealing of the pressure sensitive element 300 .

[0046] It is worth noting that after the second sealing ring 720 is assembled, the second channel 130 is located at the outer periphery of the second sealing ring 720, which means that the independent sealing of the pressure sensitive element 300 is achieved through the arrangement of the first sealing ring 710 and the second sealing ring 720. At the same time, the pressure sensitive element 300 and the temperature sensitive element 500 are separated from each other, and the leakage of the measured fluid can be prevented from affecting the circuit formed by the temperature sensitive element 500.

[0047] In addition, due to the arrangement of the base 200, a connection terminal (not shown) can be arranged on the base 200, thereby reducing the difficulty of electrical connection between the temperature sensitive element 500 and the circuit board structure 400. On this basis, only the arrangement of the second sealing ring 720 is required to achieve sealing of the measured fluid flowing into the pressure sensitive element 300. In other words, not only can the pressure sensitive element 300 and the temperature sensitive element 500 be sealed separately, but also the difficulty of connecting the temperature sensitive element 500 to the circuit board structure 400 can be reduced, which can greatly reduce the overall design difficulty of the temperature and pressure sensor 10 and reduce the manufacturing cost.

[0048] Optionally, in order to facilitate the assembly of the second sealing ring 720, a protrusion 230 is convexly provided on the base 200, and the third channel 220 is arranged to penetrate the protrusion 230; a groove 111 adapted to the protrusion 230 is opened on the bottom wall of the first assembly space 110; the protrusion 230 extends into the groove 111; the second sealing ring 720 is sleeved on the protrusion 230 and is pressed between the protrusion 230 and the side wall of the groove 111. When assembling the second sealing ring 720, it is only necessary to sleeve the second sealing ring 720 on the protrusion 230 and install the protrusion 230 into the groove 111 to realize the sealing function of the second sealing ring 720, which reduces the difficulty of assembly and improves the assembly efficiency.

[0049] Furthermore, due to the arrangement of the protrusion 230 and the groove 111, it is only necessary to ensure that the second sealing ring 720 is located on the outer periphery of the protrusion 230 and inside the groove 111, so that the second sealing ring 720 can exert its stable sealing function, thereby improving the stability of the sealing of the second sealing ring 720 and preventing the second sealing ring 720 from falling out and causing sealing failure.

[0050] In addition, a positioning groove 112 is also provided on the bottom wall of the groove 111, and the end of the protrusion 230 extends into the positioning groove 112. When the protrusion 230 is extended into the positioning groove 112, the positioning groove 112 can be used to realize the positioning of the protrusion 230, thereby improving the assembly accuracy of the protrusion 230, thereby improving the assembly accuracy of the second sealing ring 720, and effectively realizing the sealing function of the second sealing ring 720; in addition, the positioning groove 112 can also prevent the protrusion 230 from moving, thereby ensuring the overall stability of the protrusion 230, thereby ensuring the overall stability of the base 200.

[0051] In order to facilitate the detection of the temperature of the measured fluid, in this embodiment, one end of the temperature sensitive element 500 extends out of the second channel 130. Extending the temperature sensitive element 500 out of the second channel 130 can make the temperature sensitive element 500 directly exposed to the fluid, so as to directly contact the measured fluid and achieve the best response time.

[0052] In this embodiment, please refer to Figure 3 and Figure 4 The temperature sensitive element 500 includes a mounting portion 510, a lead terminal 520, a detection terminal 530 and a housing 540; the detection terminal 530 is arranged at one end of the lead terminal 520, and the mounting portion 510 is connected to the other end of the lead terminal 520 through a glass sintering sealing process; the housing 540 is wrapped around the lead terminal 520, and the two ends are respectively connected to the mounting portion 510 and the detection terminal 530; the mounting portion 510 and the housing 540 are installed in the second channel 130, and the detection terminal 530 extends out of the second channel 130. Among them, the detection terminal 530 can be a thermistor. The housing 540 can be made of plastic.

[0053] The lead terminal 520 passes through the mounting portion 510 to be electrically connected to the connection terminal on the base 200 , thereby achieving electrical connection with the circuit board structure 400 .

[0054] Optionally, the mounting portion 510 is interference fit with the second channel 130. The mounting portion 510 may be made of metal material. When the temperature sensitive element 500 is assembled with the second channel 130, the mounting portion 510 may be pressed into the second channel 130 by hard pressing, thereby achieving interference fit with the second channel 130, and further achieving sealing of the second channel 130.

[0055] It is worth noting that the connection between the mounting portion 510 and the lead terminal 520 is achieved by means of a glass sintering sealing process, and then the independent sealing of the temperature sensitive element 500 is achieved by the interference fit between the mounting portion 510 and the second channel 130. This can not only improve the sealing performance, but also reduce the difficulty of operation, thereby achieving the purpose of improving the technical problem of the difficulty in packaging the temperature and pressure integrated sensor in the prior art.

[0056] In this embodiment, the circuit board structure 400 is bent into a U shape, one end of which is electrically connected to the pressure sensitive element 300, and the other end is electrically connected to the output component 600. The space occupied by the circuit board structure 400 in the first assembly space 110 can be reduced, thereby facilitating the reduction of the overall volume of the temperature and pressure sensor 10, while also meeting the wire binding requirements with the pressure sensitive element 300.

[0057] Based on the temperature and pressure sensor 10 provided above, a temperature and pressure detection device is also provided in this embodiment. The temperature and pressure detection device adopts the temperature and pressure sensor 10 provided above. Therefore, the temperature and pressure detection device can improve the technical problem of difficulty in packaging the integrated temperature and pressure sensor in the prior art.

[0058] In summary, in the temperature and pressure sensor 10, since the first channel 120 and the second channel 130 which are spaced apart and independent from each other are provided on the housing 100, the fluid is introduced to the pressure sensitive element 300 through the first channel 120 for pressure detection; and the temperature sensitive element 500 is provided through the second channel 130, so that the temperature sensitive element 500 can directly contact the fluid for temperature detection. Therefore, the temperature sensitive element 500 and the pressure sensitive element 300 can be separated from each other, so that the independent sealing of the pressure sensitive element 300 and the independent sealing of the temperature sensitive element 500 can be facilitated, the packaging difficulty is reduced, and the technical problem of the difficulty of packaging the temperature and pressure integrated sensor in the prior art is improved. Furthermore, by providing a first sealing ring 710 and a second sealing ring 720, it is possible to prevent the fluid introduced from the first channel 120 and the third channel 220 from entering the area where the circuit board structure 400 is located, thereby achieving independent sealing of the pressure sensitive element 300; and by using a glass sintering sealing process to achieve connection between the mounting portion 510 and the lead terminal 520, and then achieving independent sealing of the temperature sensitive element 500 through interference fit between the mounting portion 510 and the second channel 130, which can not only improve the sealing performance but also reduce the difficulty of operation, thereby achieving the purpose of improving the technical problem of difficulty in packaging the temperature and pressure integrated sensor in the prior art.

[0059] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A temperature and pressure sensor, characterized in that: include: A shell (100), wherein one side is provided with a first assembly space (110), and the other side is provided with a first channel (120) and a second channel (130); the first channel (120) and the second channel (130) are spaced apart, and the first channel (120) and the second channel (130) are both connected to the first assembly space (110); A base (200) is arranged in the first assembly space (110); a second assembly space (210) is opened on one side thereof, and a third channel (220) is opened on the other side thereof, wherein the third channel (220) is communicated with the second assembly space (210); and the third channel (220) is correspondingly communicated with the first channel (120); A pressure sensitive element (300) is disposed in the second assembly space (210); A circuit board structure (400) is disposed in the first assembly space (110) and is located on a side of the pressure sensitive element (300) away from the third channel (220); the circuit board structure (400) is electrically connected to the pressure sensitive element (300); A temperature sensitive element (500) is disposed inside the second channel (130); the temperature sensitive element (500) is electrically connected to the circuit board structure (400) via a connection terminal on the base (200); An output component (600) partially extends into the first assembly space (110) and is electrically connected to the circuit board structure (400).

2. The temperature and pressure sensor according to claim 1, characterized in that: The temperature and pressure sensor (10) further comprises a first sealing ring (710), wherein the first sealing ring (710) is arranged inside the second assembly space (210) and is pressed between the pressure sensitive element (300) and the base (200); the first sealing ring (710) encloses a sealed space, and the sealed space is connected to the third channel (220).

3. The temperature and pressure sensor according to claim 1 or 2, characterized in that: The temperature and pressure sensor (10) further comprises a second sealing ring (720), wherein the second sealing ring (720) is arranged between the housing (100) and the base (200), and the second sealing ring (720) is arranged around a connecting point between the first channel (120) and the third channel (220).

4. The temperature and pressure sensor according to claim 3, characterized in that: A protruding portion (230) is provided on the base (200), and the third channel (220) is arranged to penetrate the protruding portion (230); a groove (111) adapted to the protruding portion (230) is provided on the bottom wall of the first assembly space (110); the protruding portion (230) extends into the groove (111); and the second sealing ring (720) is sleeved on the protruding portion (230) and is pressed between the protruding portion (230) and the side wall of the groove (111).

5. The temperature and pressure sensor according to claim 4, characterized in that: A positioning groove (112) is also provided on the bottom wall of the groove (111), and the end of the protrusion (230) extends into the positioning groove (112).

6. The temperature and pressure sensor according to claim 1, characterized in that: One end of the temperature sensitive element (500) extends out of the second channel (130).

7. The temperature and pressure sensor according to claim 6, characterized in that: The temperature sensitive element (500) comprises a mounting portion (510), a lead terminal (520), a detection terminal (530) and a housing (540); the detection terminal (530) is arranged at one end of the lead terminal (520), and the mounting portion (510) is connected to the other end of the lead terminal (520) through a glass sintering sealing process; the housing (540) is wrapped around the lead terminal (520), and the two ends are respectively connected to the mounting portion (510) and the detection terminal (530); the mounting portion (510) and the housing (540) are installed in the second channel (130), and the detection terminal (530) extends out of the second channel (130).

8. The temperature and pressure sensor according to claim 7, characterized in that: The mounting portion (510) and the second channel (130) are interference fit.

9. The temperature and pressure sensor according to claim 1, characterized in that: The circuit board structure (400) is bent into a U shape, one end of which is electrically connected to the pressure sensitive element (300), and the other end of which is electrically connected to the output component (600).

10. A temperature and pressure detection device, characterized in that: It comprises a temperature and pressure sensor (10) as claimed in any one of claims 1 to 9.

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