Embedded filament surrounding structure of vertical semiconductor equipment
By replacing the thick electric heating wire with the embedded thin wire wrapping structure, combined with vacuum forming and telescopic sheet locking technology, the increase in volume and cost of vertical semiconductor equipment is solved, and more efficient heating and use convenience is achieved.
Patent Information
- Application Number
- CN202411332172.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2024-12-31
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
When existing vertical semiconductor equipment is heated using thick electric heating wire, it leads to problems such as increasing equipment volume and increasing cost.
The embedded filament wrapping structure is used instead of the thick electric heating wire. The first electric heating wire and the second electric heating wire are combined with vacuum forming to attach the blow molding sheet to simulate the thick wire structure, and multiple groups of heating sections are formed and the telescopic sheet is used to match the first electric heating wire and the second electric heating wire is combined with vacuum forming. and locking teeth to achieve positioning adjustment.
It reduces the cost of transformers, reduces the size of equipment, improves heating efficiency and use comfort, and solves the problem of increased equipment size and cost.
Smart Images
Figure CN119233458A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of vertical semiconductor equipment, and in particular to an embedded filament surrounding structure of the vertical semiconductor equipment. Background Art
[0002] The purpose of the PECVD process is to form a solid film on the surface of the silicon wafer. The process principle is to place the product on the cathode of the glow discharge under low pressure, use the heating body inside the vertical semiconductor equipment to heat the product to a predetermined temperature, and then introduce an appropriate amount of reaction gas. The gas undergoes a series of chemical changes and plasma reactions to form a solid film on the surface of the product. Under high temperature conditions, the characteristics of the movement of substances from high concentration to low concentration are used to incorporate atoms into the semiconductor with a certain controllability. After the product reaches the predetermined temperature, elements such as phosphorus and boron are diffused on the surface of the product. The existing PE process is mostly based on vertical semiconductor equipment (PECVD reactor). In the process of using the vertical semiconductor equipment, the thick heating wire needs to be used to heat the workpiece inside the equipment due to its strong heating performance. The setting of the thick heating wire often requires adding a transformer to the overall equipment to convert the voltage through the transformer to assist the use of the thick heating wire. However, the setting of the transformer often leads to an increase in the volume of the equipment, and also greatly increases the cost, thereby affecting the operating efficiency of the entire PE process. Summary of the invention
[0003] In order to overcome the problem that the existing vertical semiconductor equipment is used, a corresponding thick heating wire structure is usually set inside the equipment to heat the workpiece inside the equipment. However, the setting of the thick heating wire will cause the device to need to additionally set up a corresponding transformer, which will increase the size of the equipment and increase the cost of using the equipment.
[0004] The technical solution of the present invention is: an embedded filament winding structure of a vertical semiconductor device, comprising a barrel assembly; an inner frame assembly is installed on the inner side of the barrel assembly; a plurality of inner frame assemblies are provided; a filament assembly is provided at the front end of the inner frame assembly; an adjustment assembly is provided on the upper side of the inner frame assembly; a telescopic assembly is provided on the inner side of the adjustment assembly; locking assemblies are provided at the upper and lower ends of the adjustment assembly; the inner frame assembly comprises a connecting strip; a plurality of first electric heating filaments are installed on the connecting strip; the filament assembly comprises a wire winding column; a plurality of second electric heating filaments are provided on the outer side of the wire winding column; a blow molding sheet is provided at the front end of the second electric heating filament; a plurality of wire pasting grooves are provided on the blow molding sheet.
[0005] Preferably, a sliding block is slidably connected to the connecting strip; a second snap-fit sleeve is installed on the upper end of the sliding block; a fixing strip is fixedly connected to the upper end of the second snap-fit sleeve; a first snap-fit sleeve is fixedly connected to the upper end of the fixing strip; a connecting handle is installed on one side of the sliding block; adjustment grooves are provided on the upper and lower end surfaces of the fixing strip; a locking column is provided at the lower end of the adjustment groove; the locking column is connected to the fixing strip by bolts; the locking column is connected to the wire winding column by bolts; the blow-molded sheet and the fixing strip are arranged to be fixedly connected.
[0006] Preferably, the cylinder assembly includes an abutment block; the abutment block is connected to the connecting strip by manual arc welding; a cylinder plate is mounted on the abutment block; a first abutment piece is fixedly connected to one side of the cylinder plate; and a second abutment piece is fixedly connected to the other side of the cylinder plate.
[0007] Preferably, the first abutment sheet and the second abutment sheet are both provided with mounting holes; a mounting block is installed at the rear end of the second abutment sheet; a positioning groove is provided on one side of the mounting block; and a positioning plate is provided at the upper end of the positioning groove.
[0008] Preferably, a positioning block is fixed on the positioning plate; two positioning pieces are fixed on the inner wall of the cylinder plate; a plug-in block is arranged between the two positioning pieces; a block feed slot is opened on the plug-in block; a clamping block slot is arranged at the lower end of the block feed slot; and a connecting plate is arranged at the lower end of the plug-in block.
[0009] Preferably, the adjustment assembly includes a telescopic piece; two telescopic pieces are provided; the telescopic piece is connected to the fixing strip by bolts; a plurality of locking teeth are fixed to the telescopic piece; a limiting groove is provided on the telescopic piece; and a limiting block is provided on the inner side of the limiting groove.
[0010] Preferably, an anti-drop plate is installed on the limit block; a connecting back plate is installed at the rear end of the limit block; a lifting block is installed at the upper end of the connecting back plate; a fixed handle is installed on the lifting block; a combination block is arranged between the two telescopic plates; and a reinforcing plate is installed on the combination block.
[0011] Preferably, the telescopic assembly includes a second telescopic sleeve; the second telescopic sleeve is connected to the combination block by bolts; two second fixed columns are installed on the second telescopic sleeve; the outer side of the second fixed column at the upper end is rotatably connected to the second rotating arm; the second rotating arm is rotatably connected to the first rotating arm via a rotating shaft; the inner side of the first rotating arm is rotatably connected to the first fixed column; the first telescopic sleeve is installed on the outer side of the first fixed column; the first rotating arm is rotatably connected to the third rotating arm via a rotating shaft; the third rotating arm is rotatably connected to the fifth rotating arm via a rotating shaft; the fifth rotating arm is rotatably connected to the first fixed column at the lower end; the fifth rotating arm is rotatably connected to the sixth rotating arm via a rotating shaft; the outer side of the second fixed column at the lower end is rotatably connected to the fourth rotating arm; the fourth rotating arm and the third rotating arm are rotatably connected via a rotating shaft.
[0012] Preferably, the locking assembly includes a combination plate; the connecting back plate and the combination plate are connected by bolts; a limiting cylinder is installed on the combination plate; a fixing plate is installed on the inner side of the limiting cylinder; a second fixing head is fixedly connected to the lower end of the fixing plate; a return spring is fixedly connected to the outer side of the second fixing head.
[0013] Preferably, a first fixed head is fixedly connected to the inner side of the return spring; a limiting slide is fixedly connected to the first fixed head; the limiting slide and the limiting cylinder are arranged to be slidingly connected; two limiting slide grooves are provided on the limiting cylinder; a connecting column is installed at the lower end of the limiting slide; and a locking block is installed at the lower end of the connecting column.
[0014] Beneficial effects of the present invention: 1. By setting a special embedded thin wire structure to replace the original thick wire structure, the qualified rate of the product can be improved to reduce the additional transformer cost, so as to solve the problem that the existing vertical semiconductor equipment is mostly used to heat the workpiece inside the equipment by setting a corresponding thick heating wire structure inside the equipment. However, the setting of the thick heating wire will cause the device to need to set up an additional transformer corresponding to it, which will increase the size of the equipment and increase the cost of equipment use; 2. By arranging the first electric heating filament to cooperate with the second electric heating filament, a plurality of heating sections are formed inside the vertical semiconductor device, and a blow molding sheet is attached to the outside of the second electric heating filament by vacuum forming, so that the thick filament structure is simulated by the filament structure, and the electric heating filaments with corresponding parameters are formed and combined on the inner frame component, so that the working efficiency of the embedded filament surrounding structure can be improved to a certain extent, thereby greatly reducing the transformer cost and reducing the size of the equipment, so that the temperature rises faster; 3. By pulling the two connecting handles, the two fixing bars can be displaced following the user's operation, and the locking column installed on the fixing bar can pull the wire winding column to move, so that the user can wrap the second electric heating filament corresponding to the semiconductor device around the two wire winding columns. At the same time, during the movement of the wire winding column, the first rotating arm, the second rotating arm, the third rotating arm, the fourth rotating arm, the fifth rotating arm and the sixth rotating arm can be driven to rotate to achieve smooth movement of the telescopic sheet on the limit block, so as to achieve positioning adjustment of telescopic between the two wire winding columns, thereby improving the comfort of use of the entire embedded filament surrounding structure to a certain extent; 4. The positioning of the telescopic piece during movement is achieved by cooperating with the locking block through the multiple locking teeth arranged on the telescopic piece, and by the mutual fit between the locking block and the locking teeth. At the same time, the reset spring can also be arranged so that during the movement of the telescopic piece, the locking block can be pushed to move by the locking teeth, and the connecting column fixed to the locking block is forced to drive the reset spring to contract, so that the locking block can slide in different locking teeth. At the same time, through the arrangement of the limiting slide, the limiting slide can also allow the connecting column to move vertically up and down through the limiting slide groove, so as to improve the convenience of use of the entire embedded filament surrounding structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 Shown is a schematic diagram of the three-dimensional structure of the embedded filament surrounding structure of the present invention; Figure 2 The figure shows a three-dimensional structure schematic diagram of the first cylinder assembly of the embedded filament surrounding structure of the present invention; Figure 3 The figure shows a three-dimensional structure schematic diagram of the second cylinder assembly of the embedded filament surrounding structure of the present invention; Figure 4 Shown is a schematic diagram of the three-dimensional structure of the first inner frame component of the embedded filament surrounding structure of the present invention; Figure 5 Shown is a schematic diagram of the three-dimensional structure of the second inner frame component of the embedded filament surrounding structure of the present invention; Figure 6 The diagram shows a three-dimensional structure of the third cylinder assembly of the embedded filament surrounding structure of the present invention; Figure 7 Shown is a schematic diagram of the three-dimensional structure of the third inner frame component of the embedded filament surrounding structure of the present invention; Figure 8 Shown is a schematic diagram of the three-dimensional structure of the first adjustment component of the embedded filament surrounding structure of the present invention; Fig. 9 Shown is a schematic diagram of the three-dimensional structure of the second adjustment component of the embedded filament surrounding structure of the present invention; Fig.10Shown is a schematic diagram of the three-dimensional structure of the telescopic component of the embedded filament surrounding structure of the present invention; Fig.11 What is shown is a schematic diagram of the three-dimensional structure of the embedded filament surrounding structure locking component of the present invention.
[0016] Description of reference numerals: 1, cylinder assembly; 2, inner frame assembly; 3, filament assembly; 4, adjustment assembly; 5, telescopic assembly; 6, locking assembly; 101, cylinder plate; 102, first abutment sheet; 103, second abutment sheet; 104, mounting hole; 105, abutment block; 106, mounting block; 107, positioning sheet; 108, positioning groove; 109, positioning plate; 110, positioning block; 111, Plug-in block; 112, block feed slot; 113, block slot; 114, connecting plate; 201, connecting strip; 202, first electric heating filament; 203, fixing strip; 204, first clamping sleeve; 205, second clamping sleeve; 206, sliding block; 207, connecting handle; 208, adjusting slot; 209, locking column; 301, wire winding column; 302, second electric heating filament; 303, blow molding sheet; 30 4. Wire pasting groove; 401. Telescopic piece; 402. Limiting groove; 403. Limiting block; 404. Anti-slip sheet; 405. Connecting back plate; 406. Lifting block; 407. Fixed handle; 408. Combination block; 409. Reinforcement sheet; 410. Locking tooth; 501. First telescopic sleeve; 502. First fixed column; 503. First rotating arm; 504. Second rotating arm; 505. Second fixed column; 506. Second telescopic sleeve; 507. Third rotating arm; 508. Fourth rotating arm; 509. Fifth rotating arm; 510. Sixth rotating arm; 601. Combination plate; 602. Limiting cylinder; 603. Limiting slide groove; 604. Limiting slide; 605. First fixed head; 606. Return spring; 607. Second fixed head; 608. Fixed sheet; 609. Connecting column; 610. Locking block. DETAILED DESCRIPTION
[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0018] Example 1 An embedded filament surrounding structure of a vertical semiconductor device, according to Figure 1-11As shown, it includes a barrel assembly 1; an inner frame assembly 2 is installed on the inner side of the barrel assembly 1; the inner frame assembly 2 is provided with multiple components; a filament assembly 3 is provided at the front end of the inner frame assembly 2; an adjustment assembly 4 is provided on the upper side of the inner frame assembly 2; a telescopic assembly 5 is provided on the inner side of the adjustment assembly 4; locking assemblies 6 are provided at the upper and lower ends of the adjustment assembly 4; the inner frame assembly 2 includes a connecting strip 201; multiple first electric heating filaments 202 are installed on the connecting strip 201; the filament assembly 3 includes a wire winding column 301; multiple second electric heating filaments 302 are provided on the outer side of the wire winding column 301; a blow molding sheet 303 is provided at the front end of the second electric heating filament 302; and multiple wire sticking grooves 304 are provided on the blow molding sheet 303.
[0019] A sliding block 206 is slidably connected to the connecting strip 201; a second snap-fit sleeve 205 is installed on the upper end of the sliding block 206; a fixing strip 203 is fixedly connected to the upper end of the second snap-fit sleeve 205; a first snap-fit sleeve 204 is fixedly connected to the upper end of the fixing strip 203; a connecting handle 207 is installed on one side of the sliding block 206; adjustment grooves 208 are provided on the upper and lower end surfaces of the fixing strip 203; a locking column 209 is provided at the lower end of the adjusting groove 208; the locking column 209 is connected to the fixing strip 203 by bolts; the locking column 209 is connected to the wire winding column 301 by bolts; the blow-molded sheet 303 is arranged to be fixedly connected to the fixing strip 203.
[0020] The cylinder assembly 1 includes an abutment block 105; the abutment block 105 is connected to the connecting strip 201 by manual arc welding; a cylinder plate 101 is installed on the abutment block 105; a first abutment piece 102 is fixedly connected to one side of the cylinder plate 101; and a second abutment piece 103 is fixedly connected to the other side of the cylinder plate 101.
[0021] The first abutment sheet 102 and the second abutment sheet 103 are both provided with mounting holes 104 ; a mounting block 106 is installed at the rear end of the second abutment sheet 103 ; a positioning groove 108 is provided on one side of the mounting block 106 ; a positioning plate 109 is provided at the upper end of the positioning groove 108 .
[0022] A positioning block 110 is fixedly connected to the positioning plate 109; two positioning pieces 107 are fixedly connected to the inner wall of the cylinder plate 101; a plug-in block 111 is arranged between the two positioning pieces 107; a block entry slot 112 is opened on the plug-in block 111; a clamping block slot 113 is arranged at the lower end of the block entry slot 112; a connecting plate 114 is arranged at the lower end of the plug-in block 111.
[0023] The adjustment component 4 includes a telescopic piece 401; two telescopic pieces 401 are provided; the telescopic piece 401 is connected to the fixing strip 203 by bolts; a plurality of locking teeth 410 are fixed to the telescopic piece 401; a limiting groove 402 is provided on the telescopic piece 401; a limiting block 403 is provided inside the limiting groove 402.
[0024] An anti-drop sheet 404 is installed on the limit block 403; a connecting back plate 405 is installed at the rear end of the limit block 403; a lifting block 406 is installed on the upper end of the connecting back plate 405; a fixed handle 407 is installed on the lifting block 406; a combination block 408 is provided between the two telescopic sheets 401; a reinforcing sheet 409 is installed on the combination block 408.
[0025] The telescopic assembly 5 includes a second telescopic sleeve 506; the second telescopic sleeve 506 is connected to the combination block 408 by bolts; two second fixed columns 505 are installed on the second telescopic sleeve 506; the outer side of the second fixed column 505 at the upper end is rotatably connected to the second rotating arm 504; the second rotating arm 504 is rotatably connected to the first rotating arm 503 through a rotating shaft; the inner side of the first rotating arm 503 is rotatably connected to the first fixed column 502; the first telescopic sleeve 501 is installed on the outer side of the first fixed column 502; the first rotating arm 503 is rotatably connected to the third rotating arm 507 through a rotating shaft; the third rotating arm 507 is rotatably connected to the fifth rotating arm 509 through a rotating shaft; the fifth rotating arm 509 is rotatably connected to the first fixed column 502 at the lower end; the sixth rotating arm 510 is rotatably connected to the fifth rotating arm 509 through a rotating shaft; the outer side of the second fixed column 505 at the lower end is rotatably connected to the fourth rotating arm 508; the fourth rotating arm 508 and the third rotating arm 507 are rotatably connected through a rotating shaft.
[0026] The locking assembly 6 includes a combination plate 601; the connecting back plate 405 is connected to the combination plate 601 by bolts; a limiting cylinder 602 is installed on the combination plate 601; a fixing plate 608 is installed on the inner side of the limiting cylinder 602; the lower end of the fixing plate 608 is fixedly connected to a second fixing head 607; the outer side of the second fixing head 607 is fixedly connected to a return spring 606.
[0027] A first fixed head 605 is fixedly connected to the inner side of the return spring 606; a limiting slide 604 is fixedly connected to the first fixed head 605; the limiting slide 604 and the limiting cylinder 602 are set to be slidingly connected; two limiting slide grooves 603 are provided on the limiting cylinder 602; a connecting column 609 is installed at the lower end of the limiting slide 604; and a locking block 610 is installed at the lower end of the connecting column 609.
[0028] During operation, a plurality of cylinder plates 101 are spliced together by the first abutment sheet 102 and the second abutment sheet 103, and adjacent cylinder plates 101 are connected by bolts. After the installation is confirmed to be completed, the first electric heating filament 202 and the second electric heating filament 302 are used to heat the interior of the cylinder assembly 1. During use, the embedded filament surrounding structure can form multiple groups of heating sections inside the vertical semiconductor device by arranging the first electric heating filament 202 and the second electric heating filament 302 to cooperate with each other, and by attaching a blow molding sheet 303 to the outside of the second electric heating filament 302 through vacuum forming to simulate a thick filament structure through a filament structure, so that the electric heating filaments with corresponding parameters are formed on the inner frame assembly 2 and combined, thereby improving the working efficiency of the embedded filament surrounding structure to a certain extent, and thus significantly reducing the cost of the transformer, while reducing the size of the equipment to make the temperature rise faster.
[0029] At the same time, the two connecting handles 207 can also be pulled so that the two fixing bars 203 can be displaced following the user's operation, and the locking column 209 installed on the fixing bar 203 can pull the wire winding column 301 to move, so that the user can wrap the second electric heating filament 302 corresponding to the semiconductor device around the two wire winding columns 301. At the same time, in the process of moving the wire winding column 301, the first rotating arm 503, the second rotating arm 504, the third rotating arm 507, the fourth rotating arm 508, the fifth rotating arm 509 and the sixth rotating arm 510 can be driven to rotate to achieve smooth movement of the telescopic piece 401 on the limit block 403, so as to achieve the positioning adjustment of the telescopic between the two wire winding columns 301, thereby improving the comfort of use of the entire embedded filament winding structure to a certain extent.
[0030] Finally, the multiple locking teeth 410 arranged on the telescopic piece 401 can cooperate with the locking block 610, and the locking block 610 and the locking teeth 410 can be fitted together to achieve the positioning of the telescopic piece 401 during movement. At the same time, the reset spring 606 can also be set so that during the movement of the telescopic piece 401, the locking block 610 can be pushed to move by the locking teeth 410, and the connecting column 609 fixed to the locking block 610 is forced to drive the reset spring 606 to contract, so that the locking block 610 can slide in different locking teeth 410. At the same time, through the setting of the limiting slide 604, the limiting slide 604 can also allow the connecting column 609 to move vertically up and down through the limiting slide groove 603, so as to improve the convenience of use of the entire embedded filament surrounding structure.
[0031] Through the above steps, a special embedded thin wire structure is set to replace the original thick wire structure to improve the product qualification rate and reduce the additional transformer cost, which can to a certain extent solve the problem that when the existing vertical semiconductor equipment is in use, the workpiece inside the equipment is heated by setting a corresponding thick heating wire structure inside the equipment. However, the setting of the thick heating wire will cause the device to need to additionally set a corresponding transformer, which will increase the size of the equipment and increase the cost of using the equipment.
[0032] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the spirit of the present invention.
Claims
1. An embedded filament winding structure of a vertical semiconductor device, comprising a barrel assembly (1); characterized in that: An inner frame assembly (2) is installed on the inner side of the barrel assembly (1); a plurality of the inner frame assemblies (2) are provided; a filament assembly (3) is provided at the front end of the inner frame assembly (2); an adjustment assembly (4) is provided on the upper side of the inner frame assembly (2); a telescopic assembly (5) is provided on the inner side of the adjustment assembly (4); locking assemblies (6) are provided at the upper and lower ends of the adjustment assembly (4); the inner frame assembly (2) comprises a connecting strip (201); a plurality of first electric heating filaments (202) are installed on the connecting strip (201); the filament assembly (3) comprises a wire winding column (301); a plurality of second electric heating filaments (302) are provided on the outer side of the wire winding column (301); a blow molding sheet (303) is provided at the front end of the second electric heating filament (302); and a plurality of wire attachment grooves (304) are provided on the blow molding sheet (303).
2. The embedded filament surrounding structure of a vertical semiconductor device according to claim 1, characterized in that: A sliding block (206) is slidably connected to the connecting strip (201); a second locking sleeve (205) is installed on the upper end of the sliding block (206); a fixing strip (203) is fixedly connected to the upper end of the second locking sleeve (205); a first locking sleeve (204) is fixedly connected to the upper end of the fixing strip (203); a connecting handle (207) is installed on one side of the sliding block (206); adjustment grooves (208) are provided on the upper and lower end surfaces of the fixing strip (203); a locking column (209) is provided at the lower end of the adjustment groove (208); the locking column (209) is connected to the fixing strip (203) by bolts; the locking column (209) is connected to the wire winding column (301) by bolts; and the blow-molded sheet (303) is fixedly connected to the fixing strip (203).
3. The embedded filament surrounding structure of a vertical semiconductor device according to claim 1, characterized in that: The cylinder assembly (1) comprises an abutment block (105); the abutment block (105) is connected to a connection strip (201) by manual arc welding; a cylinder plate (101) is mounted on the abutment block (105); a first abutment sheet (102) is fixedly connected to one side of the cylinder plate (101); and a second abutment sheet (103) is fixedly connected to the other side of the cylinder plate (101).
4. The embedded filament surrounding structure of a vertical semiconductor device according to claim 3, characterized in that: Both the first abutment sheet (102) and the second abutment sheet (103) are provided with mounting holes (104); a mounting block (106) is mounted at the rear end of the second abutment sheet (103); a positioning groove (108) is provided on one side of the mounting block (106); and a positioning plate (109) is provided at the upper end of the positioning groove (108).
5. The embedded filament surrounding structure of a vertical semiconductor device according to claim 4, characterized in that: A positioning block (110) is fixedly connected to the positioning plate (109); two positioning pieces (107) are fixedly connected to the inner wall of the cylinder plate (101); a plug-in block (111) is arranged between the two positioning pieces (107); a block entry groove (112) is provided on the plug-in block (111); a clamping block groove (113) is provided at the lower end of the block entry groove (112); and a connecting plate (114) is provided at the lower end of the plug-in block (111).
6. The embedded filament surrounding structure of a vertical semiconductor device according to claim 2, characterized in that: The adjustment assembly (4) comprises a telescopic piece (401); two telescopic pieces (401) are provided; the telescopic piece (401) is connected to a fixing strip (203) via bolts; a plurality of locking teeth (410) are fixedly connected to the telescopic piece (401); a limiting groove (402) is provided on the telescopic piece (401); and a limiting block (403) is provided on the inner side of the limiting groove (402).
7. The embedded filament surrounding structure of a vertical semiconductor device according to claim 6, characterized in that: An anti-drop sheet (404) is installed on the limit block (403); a connecting back plate (405) is installed at the rear end of the limit block (403); a lifting block (406) is installed at the upper end of the connecting back plate (405); a fixed handle (407) is installed on the lifting block (406); a combination block (408) is provided between the two telescopic sheets (401); and a reinforcing sheet (409) is installed on the combination block (408).
8. The embedded filament surrounding structure of a vertical semiconductor device according to claim 7, characterized in that: The telescopic assembly (5) comprises a second telescopic sleeve (506); the second telescopic sleeve (506) is connected to the assembly block (408) by bolts; two second fixing columns (505) are installed on the second telescopic sleeve (506); the outer side of the second fixing column (505) at the upper end is rotatably connected to a second rotating arm (504); the second rotating arm (504) is rotatably connected to a first rotating arm (503) via a rotating shaft; the inner side of the first rotating arm (503) is rotatably connected to a first fixing column (502); the outer side of the first fixing column (502) is installed with a first telescopic sleeve (501 ); the first rotating arm (503) is rotatably connected to a third rotating arm (507) via a rotating shaft; the third rotating arm (507) is rotatably connected to a fifth rotating arm (509) via a rotating shaft; the fifth rotating arm (509) is rotatably connected to the first fixed column (502) at the lower end; the fifth rotating arm (509) is rotatably connected to a sixth rotating arm (510) via a rotating shaft; the outer side of the second fixed column (505) at the lower end is rotatably connected to a fourth rotating arm (508); the fourth rotating arm (508) is rotatably connected to the third rotating arm (507) via a rotating shaft.
9. The embedded filament surrounding structure of a vertical semiconductor device according to claim 7, characterized in that: The locking assembly (6) comprises a combination plate (601); the connecting back plate (405) is connected to the combination plate (601) by bolts; a limiting cylinder (602) is installed on the combination plate (601); a fixing plate (608) is installed on the inner side of the limiting cylinder (602); a second fixing head (607) is fixedly connected to the lower end of the fixing plate (608); and a return spring (606) is fixedly connected to the outer side of the second fixing head (607).
10. The embedded filament surrounding structure of a vertical semiconductor device according to claim 9, characterized in that: A first fixed head (605) is fixedly connected to the inner side of the return spring (606); a limit slide (604) is fixedly connected to the first fixed head (605); the limit slide (604) and the limit cylinder (602) are arranged to be slidably connected; two limit slide grooves (603) are provided on the limit cylinder (602); a connecting column (609) is installed at the lower end of the limit slide (604); and a locking block (610) is installed at the lower end of the connecting column (609).