Flexible circuit board, light-emitting module and display device

Abstract

The embodiment of the invention provides a flexible circuit board which comprises a bending area, the flexible circuit board comprises a circuit board body, the circuit board body comprises a first side and a second side which are oppositely arranged, and the first side of the circuit board body is provided with a first binding part located in an area outside the bending area; the first protection layer is positioned on the first side of the circuit board body and is positioned in an area outside the first binding part; the second protection layer is located on the second side of the circuit board body and located in the area outside the bending area; and the third protection layer is located on the second side of the circuit board body and located in the bending area, and the third protection layer comprises a plurality of protection bodies which are arranged at intervals. According to the technical scheme, after the flexible circuit board is bent towards one side of the first protection layer along the bending area, the plurality of protection bodies arranged at intervals on the outer side of the bending area can play a role in protecting the outer side of the bending area, the outer side of the bending area is prevented from being damaged and scratched, the scratch resistance of the flexible circuit board is improved, and the product yield is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a flexible circuit board, a light-emitting module and a display device. Background Art

[0002] The liquid crystal display device can use a backlight module of a light emitting diode (LED), and a flexible printed circuit board (FPC) is bound and connected to the LED light emitting substrate through a binding process. The flexible printed circuit board is bent to the back side of the light emitting substrate. The bending area of ​​the flexible printed circuit board is easily damaged and scratched after being bent, resulting in a decrease in product yield. Summary of the invention

[0003] The embodiments of the present disclosure provide a flexible circuit board, a light-emitting module and a display device to solve or alleviate one or more technical problems in the prior art.

[0004] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a flexible circuit board, including a bending area, the flexible circuit board including:

[0005] The circuit board body comprises a first side and a second side which are arranged opposite to each other, wherein the first side of the circuit board body is provided with a first binding portion, and the first binding portion is located in an area outside the bending area;

[0006] A first protective layer is located on the first side of the circuit board body and is located in an area outside the first binding portion;

[0007] A second protective layer is located on the second side of the circuit board body and is located outside the bending area;

[0008] The third protective layer is located on the second side of the circuit board body and in the bending area. The third protective layer includes a plurality of protective bodies arranged at intervals.

[0009] In some embodiments, the protective body is strip-shaped and extends along the second direction. Multiple protective bodies are arranged in sequence along the first direction. The second direction is perpendicular to the first direction. The first direction is the direction from the first binding portion to the bending area.

[0010] In some embodiments, a dimension of the protection body in a direction perpendicular to the second direction is 0.3 mm to 0.5 mm.

[0011] In some embodiments,

[0012] In the first direction, from the edge of the bending area toward the center, the size of the protection body in the first direction gradually decreases; or,

[0013] In the first direction, the sizes of the protection bodies in the first direction are the same.

[0014] In some embodiments, in the first direction, the distances between two adjacent protection bodies are the same.

[0015] In some embodiments, the distance between two adjacent protection bodies is greater than 0 and less than or equal to 0.05 mm.

[0016] In some embodiments, a size of the third protection layer in a direction perpendicular to the circuit board body is the same as a size of the second protection layer in a direction perpendicular to the circuit board body.

[0017] In some embodiments, a dimension of the third protection layer in a direction perpendicular to the circuit board body is 50 μm to 100 μm.

[0018] In some embodiments, the material of the third protection layer includes polyimide or ink.

[0019] In some embodiments, the circuit board body includes a first flexible substrate layer, a metal layer, and a second flexible substrate layer stacked in sequence. The first flexible substrate layer and the second flexible substrate layer are both made of resin material, and the metal layer is made of copper.

[0020] As a second aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a light-emitting module, comprising a light-emitting substrate and any one of the flexible circuit boards of the present disclosure;

[0021] The light-emitting substrate includes a light-emitting area and a second binding portion located at one side of the light-emitting area. The first binding portion of the flexible circuit board is bound and connected with the second binding portion. The flexible circuit board is bent to the backlight side of the light-emitting substrate through the bending area.

[0022] As a third aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display device, including the flexible circuit board in the embodiments of the present disclosure, or including the light-emitting module in the embodiments of the present disclosure.

[0023] In the flexible circuit board of the disclosed embodiment, when the flexible circuit board is bent along the bending area toward the first protective layer, the multiple spaced protective bodies on the outside of the bending area can protect the outside of the bending area, preventing the outside of the bending area from being damaged and scratched, thereby improving the scratch resistance of the flexible circuit board and improving the product yield. In addition, during the bending process of the flexible circuit board along the bending area, the multiple spaced protective bodies are in an open shape, and the gaps between adjacent protective bodies are in an open shape, which can release the stress generated by the bending, realize the bending radius, improve the bending resistance of the flexible circuit board, and ensure the adhesion effect of the flexible circuit board to the back side of the light-emitting substrate.

[0024] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0026] Figure 1 It is a schematic diagram of the partial structure of a light-emitting module;

[0027] Figure 2 A schematic diagram of a flexible circuit board in the related art;

[0028] Figure 3 A schematic diagram of a process of binding a flexible circuit board and a light-emitting substrate in the related art;

[0029] Figure 4 A physical schematic diagram of a flexible circuit board and a light-emitting substrate after being bound and connected in the related art;

[0030] Figure 5 is a cross-sectional schematic diagram of a flexible circuit board in one embodiment of the present disclosure;

[0031] Figure 6 for Figure 5 A schematic diagram of an A-direction plane of the flexible circuit board shown;

[0032] Fig. 7A It is a schematic diagram of a flexible circuit board and a light-emitting substrate after being connected in an embodiment of the present disclosure;

[0033] Figure 7B for Fig. 7A An enlarged schematic diagram of part B in FIG.

[0034] Figure 8 for Figure 5 Another A-direction plan view of the flexible circuit board shown.

[0035] Description of reference numerals:

[0036] 10. Luminescent substrate;

[0037] 20. Flexible circuit board; 21. Bending area; 22. Circuit board body; 23. First protective layer; 24. Second protective layer; 25. First binding part; 26. Third protective layer; 261. Protective body. DETAILED DESCRIPTION

[0038] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure, and different embodiments may be combined arbitrarily without conflict. Therefore, the drawings and descriptions are considered to be illustrative in nature and not restrictive.

[0039] The light emitting diode (LED) in the present disclosure may be a sub-millimeter light emitting diode (Mini Light Emitting Diode, referred to as Mini LED), or may be a micro light emitting diode (Micro Light Emitting Diode, referred to as Micro LED).

[0040] Figure 1 The figure is a partial structural diagram of a light-emitting module. The light-emitting module includes a light-emitting substrate 10 and a flexible circuit board 20. One end of the flexible circuit board 20 is bound and connected to the light-emitting surface of the light-emitting substrate 10, and the other end is located on the non-light-emitting surface of the light-emitting substrate 10. The flexible circuit board 20 is arranged in a U shape as a whole, and the opening of the U shape faces the light-emitting substrate 10. The flexible circuit board 20 includes a bending area 21, and the bending area has a bending radius R.

[0041] Figure 2 FIG. 1 is a schematic diagram of a flexible circuit board in the related art. Figure 2 As shown, the flexible circuit board 20 includes a circuit board body 22, and a first protective layer 23 and a second protective layer 24 located on opposite sides of the circuit board body 22. A first binding portion 25 is provided on one side of the circuit board body 22 facing the first protective layer 23, and the first protective layer 23 is located in an area outside the first binding portion 25. The first binding portion 25 is used to bind and connect with the light-emitting substrate 10. In order to ensure the bending radius of the bending area 21 of the flexible circuit board 20 when bending and the adhesion effect with the light-emitting substrate 10, the second protective layer 24 is located in an area outside the bending area 21, so that on the side of the flexible circuit board 20 facing the second protective layer 24, the second protective layer 24 is hollowed out in an area corresponding to the bending area 21.

[0042] The first protective layer 23 and the second protective layer 24 can protect the circuit board body 22 and increase the strength of the flexible circuit board 20. When the flexible circuit board 20 is bent into a U-shape, since the bending area 21 is not covered by the second protective layer 24, the area is very easy to be damaged or scratched, resulting in a decrease in product yield.

[0043] Figure 3 It is a schematic diagram of the binding process between the flexible circuit board and the light-emitting substrate in the related art. Figure 4The figure is a physical schematic diagram of a flexible circuit board and a light-emitting substrate after being bound and connected in the related art. The method of connecting two binding parts by using a conductive adhesive and a hot pressing process is called a binding connection. Figure 3 As shown, in the binding process, conductive glue is applied between the first binding part 25 of the flexible circuit board 20 and the second binding part 11 of the light-emitting substrate 10, and then the light-emitting substrate and the flexible circuit board are aligned; the hot pressing tool moves toward the light-emitting substrate and the flexible circuit board in a direction perpendicular to the plane where the light-emitting substrate is located, and the temperature of the hot pressing tool is usually around 175°C. While the hot pressing tool applies pressure to the light-emitting substrate and the flexible circuit board, the high temperature will be transferred to the flexible circuit board 20 to cause it to expand due to heat; when the expansion deformation of the flexible circuit board 20 is too large, so that the expansion deformation force of the flexible circuit board 20 is greater than the adhesion between the flexible circuit board 20 and the light-emitting substrate 10, the flexible circuit board 20 will be misaligned along the X direction and the Y direction. Since the size of the conductive glue in the Y direction is smaller, the misalignment offset in the Y direction is larger than the misalignment offset in the X direction. This results in an offset between the first binding part 25 and the second binding part 11 after the flexible circuit board 20 is bound and connected to the light-emitting substrate 10, as shown in FIG. Figure 4 As shown, the offset Δ between the two in the Y direction can reach about 100 μm, so that the first binding portion 25 and the second binding portion 11 cannot be accurately connected, further resulting in a loss of product yield.

[0044] Figure 5 is a cross-sectional schematic diagram of a flexible circuit board in one embodiment of the present disclosure, Figure 6 for Figure 5 A schematic diagram of a plane of the flexible circuit board shown in FIG. Figure 5 and Figure 6 As shown, the flexible circuit board 20 includes a bending area 21, and the flexible circuit board 20 includes a circuit board body 22, a first protective layer 23, a second protective layer 24 and a third protective layer 26. The circuit board body 22 can be flexible. The circuit board body 22 includes a first side and a second side that are arranged opposite to each other. The first side of the circuit board body 22 is provided with a first binding portion 25, and the first binding portion 25 is located in an area outside the bending area 21. The flexible circuit board 20 can be used in a light-emitting module, such as Figure 1 As shown, the first binding portion 25 of the flexible circuit board 20 is used to bind and connect with the light-emitting surface of the light-emitting substrate 10. After the bending area 21 of the flexible circuit board 20 is bent, the other end of the flexible circuit board 20 is located on the non-light-emitting surface of the light-emitting substrate 10. The flexible circuit board 20 is arranged in a U shape as a whole in the light-emitting module, and the U-shaped opening faces the light-emitting substrate 10.

[0045] The first protective layer 23 is located on the first side of the circuit board body 22 and is located outside the first binding portion 25. That is, after the first protective layer 23 is formed on the first side of the circuit board body 22, the first binding portion 25 is exposed. When the flexible circuit board 20 is used in a light-emitting module, the first protective layer 23 faces one side of the light-emitting substrate 10.

[0046] The second protective layer 24 is located on the second side of the circuit board body 22 and outside the bending area 21 . Thus, the second protective layer 24 is hollowed out in the area corresponding to the bending area 21 , so that the bending area 21 of the circuit board body 22 has no second protective layer 24 .

[0047] The third protective layer 26 is located on the second side of the circuit board body 22 and in the bending area 21. The third protective layer 26 includes a plurality of protective bodies 261 arranged at intervals. The third protective layer 26 and the second protective layer 24 are located on the same side surface of the circuit board body 22. The third protective layer 26 is located in the bending area 21, and the second protective layer 24 is located in the area outside the bending area 21. The third protective layer 26 includes a plurality of protective bodies 261 arranged at intervals, such as Figure 5 and Figure 6 shown.

[0048] The first protective layer 23 and the second protective layer 24 can play a protective role to prevent the flexible circuit board 20 from being scratched. In addition, the first protective layer 23 and the second protective layer 24 can increase the strength of the flexible circuit board 20 and improve the performance and life of the flexible circuit board 20.

[0049] Fig. 7A is a schematic diagram of a flexible circuit board and a light-emitting substrate connected in accordance with an embodiment of the present disclosure, Figure 7B for Fig. 7A An enlarged schematic diagram of part B in FIG. Fig. 7A and Figure 7B As shown, the light-emitting substrate 10 includes a light-emitting area and a binding area located on one side of the light-emitting area, and a plurality of second binding portions 11 ( Fig. 7A The first binding parts 25 (not shown) of the flexible circuit board 20 Fig. 7A The flexible circuit board 20 is bent to the backlight side of the light-emitting substrate 10 through the bending area 21, and the bending area 21 of the flexible circuit board 20 is U-shaped, and the U-shaped opening faces the light-emitting substrate 10. The flexible circuit board 20 can be attached to the backlight side of the light-emitting substrate 10 through the adhesive material T, and the light-emitting substrate 10 and the back plate 30 are fixed by the pressure-sensitive adhesive PSA, and the back plate is also provided with a mechanical structure such as an adhesive frame F.

[0050] In related technologies, such as Figure 1 and Figure 2In the flexible circuit board 20, in order to ensure the bending radius of the bending area 21 and the adhesion effect of the flexible circuit board 20 and the light-emitting substrate 10, the second protective layer 24 is located in the area outside the bending area 21. Therefore, on the side of the flexible circuit board 20 facing the second protective layer 24, the second protective layer 24 is hollowed out in the area corresponding to the bending area 21, so that there is no second protective layer in the bending area 21 on the side of the circuit board body 22 facing the second protective layer 24. This makes the bending area 21 located on the outside very easy to be damaged or scratched, resulting in a decrease in product yield.

[0051] The flexible circuit board 20 of the embodiment of the present disclosure, the first binding portion 25 is used to bind and connect with the light emitting substrate 10, and the flexible circuit board 20 is bent through the bending area 21, such as Figure 7B As shown, the first protective layer 23 is located on the inner side of the U-shaped opening, the second protective layer 24 is located on the outer side of the U-shaped opening, and the third protective layer 26 is arranged on the outer side of the bending area 21. The third protective layer 26 includes a plurality of protective bodies 261 arranged at intervals.

[0052] In the flexible circuit board 20 of the embodiment of the present disclosure, when the flexible circuit board 20 is bent along the bending area 21 toward the first protective layer 23, the plurality of protective bodies 261 arranged at intervals outside the bending area 21 can protect the outside of the bending area 21, preventing the outside of the bending area 21 from being damaged or scratched, thereby improving the anti-scratch ability of the flexible circuit board 20 and improving the product yield. In addition, if Figure 7B As shown, after the flexible circuit board 20 is bent along the bending area 21, the stress generated by the bending can be released through the gap 28 between adjacent protective bodies 261, thereby achieving a bending radius, improving the bending resistance of the flexible circuit board 20, and ensuring the adhesion effect between the flexible circuit board 20 and the back side of the light-emitting substrate 10.

[0053] It has been proved through experiments that when a protective layer is provided on one side of the flexible circuit board 20 and no protective layer is provided on the other side, the expansion amount of the flexible circuit board 20 at high temperature is about 1000PPM; when protective layers are provided on both sides of the flexible circuit board 20, the expansion amount of the flexible circuit board 20 at high temperature is about 400PPM, that is, providing protective layers on both sides of the flexible circuit board 20 can effectively reduce the expansion amount of the flexible circuit board 20 at high temperature. It can be understood that 1PPM means that the expansion amount per degree Celsius is one millionth of the total length.

[0054] In related technologies, such as Figure 3 and Figure 4As shown, in the bending area 21, the first side of the circuit board body 22 is provided with a first protective layer 23 and the second side has no protective layer, which causes the flexible circuit board 20 to expand too much during the binding process, resulting in a large misalignment of the flexible circuit board 20 along the Y direction. In the flexible circuit board 20 of the disclosed embodiment, in the bending area 21, the first side of the circuit board body 22 is provided with a first protective layer 23 and the second side is provided with a third protective layer 26, so that the first side of the circuit board body 22 is provided with a first protective layer 23 in the bending area 21 and the second side is provided with a plurality of spaced protective bodies 261 in the bending area 21. After experimental verification, the expansion of the flexible circuit board 20 of the disclosed embodiment in the binding process is greatly reduced compared with the related art, thereby reducing the misalignment of the flexible circuit board 20 along the Y direction, and further improving the product yield.

[0055] Therefore, the flexible circuit board 20 of the embodiment of the present disclosure improves the Y-direction misalignment during the binding process, and enhances the bending and scratch resistance of the flexible circuit board 20 .

[0056] In one embodiment, Figure 6 As shown, the shape of the protection body 261 can be strip-shaped, or the positive projection of the protection body 261 on the circuit board body 22 is rectangular. The protection body 261 extends along the second direction X, and multiple protection bodies 261 are arranged in sequence along the first direction Y. Among them, the first direction is the direction from the first binding portion 25 to the bending area 21, and the second direction is perpendicular to the first direction. It can be understood that the first direction Y is the direction where the bending length is located.

[0057] A plurality of protective bodies 261 are arranged in sequence along the first direction Y, so that there are gaps between adjacent protective bodies 261 in the first direction Y, so that when the flexible circuit board 20 is bent through the bending area 21, it can pass through the gaps 28 between adjacent protective bodies 261, which is conducive to releasing the stress generated by the bending.

[0058] Figure 6 In the embodiment, the protection body 261 is an integral strip in the second direction X. In other embodiments, there may be a plurality of protection bodies 261 in the second direction X, and the shape of the protection body 261 may be strip. In other embodiments, the orthographic projection of the protection body 261 on the circuit board body 22 is not limited to a rectangle, and may also be a circle, an ellipse, a polygon or other shapes.

[0059] It is understandable that the third protective body 261 can be formed by a patterning process. Setting the protective body 261 as a strip body can not only achieve the effect of releasing bending stress, but also simplify the mask structure and reduce costs.

[0060] like Figure 6As shown, the dimension W of the protection body 261 perpendicular to the second direction X is 0.3 mm to 0.5 mm, that is, the dimension W of the protection body 261 perpendicular to its extension direction is 0.3 mm to 0.5 mm. For example, W may be 0.3 mm, 0.4 mm or 0.5 mm.

[0061] Exemplarily, in the first direction Y, the sizes of the protection bodies 261 in the first direction Y are the same.

[0062] Figure 8 for Figure 5 Another A-direction plan view of the flexible circuit board is shown. In another embodiment, in the first direction Y, from the edge of the bending area 21 toward the center, the size of the protection body 261 in the first direction Y gradually decreases. For example, Figure 8 In the embodiment, the protection body 261a is located at the center of the bending area 21, wherein W2 is greater than W1.

[0063] When the flexible circuit board 20 is bent through the bending area 21, the bending radius at the center of the bending area 21 is the largest, so that the bending stress of the bending area 21 gradually increases from the edge to the center. In the first direction Y, from the edge to the center of the bending area 21, the size of the protective body 261 in the first direction Y gradually decreases, so that the ability of the protective body 261 to release the bending stress gradually increases from the edge to the center of the bending area 21, which can not only effectively release the bending stress, but also increase the coverage area of ​​the third protective layer 26, and more effectively reduce scratches and damage.

[0064] In one embodiment, in the first direction Y, the size of the protection body 261 in the first direction Y gradually increases from the edge of the bending area 21 toward the center. When the bending area 21 can meet the bending radius, the size of the protection body 261 in the first direction Y is set to gradually increase from the edge of the bending area 21 toward the center, so that the center of the bending area 21 can be better protected to avoid scratches and damages in the center with a larger bending radius.

[0065] In one embodiment, in the first direction, the spacing between two adjacent protection bodies 261 is the same. The spacing d between two adjacent protection bodies 261 is greater than 0 and less than or equal to 0.05 mm. For example, the spacing d may be 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, or 0.05 mm.

[0066] like Figure 5 As shown, the size of the third protective layer 26 in the direction perpendicular to the circuit board body 22 is the same as the size of the second protective layer 24 in the direction perpendicular to the circuit board body 22. Therefore, the third protective layer 26 and the second protective layer 24 can be formed simultaneously using a single mask patterning process, simplifying the process.

[0067] In other embodiments, the size of the third protection layer 26 in the direction perpendicular to the circuit board body 22 may be different from the size of the second protection layer 24 in the direction perpendicular to the circuit board body 22 .

[0068] The material of the third protection layer 26 can be the same as that of the second protection layer 24 .

[0069] The dimension h of the third protective layer 26 in the direction perpendicular to the circuit board body 22 may be 50 μm to 100 μm, for example, h may be 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm. The specific value of H may be set as required.

[0070] The materials of the first protective layer 23, the second protective layer 24 and the third protective layer 26 can all be organic materials. For example, the material of the first protective layer 23 can include polyimide or ink; the material of the second protective layer 24 can include polyimide or ink; the material of the third protective layer 26 can include polyimide or ink.

[0071] like Figure 5 As shown, the circuit board body 22 may include a first flexible substrate layer 221, a metal layer 223 and a second flexible substrate layer 222 stacked in sequence. The first flexible substrate layer 221 and the second flexible substrate layer 222 are both made of resin material, and the metal layer 223 is made of copper.

[0072] The first flexible substrate layer 221 and the second flexible substrate layer 222 can play an insulating role and increase the strength of the flexible circuit board 20. The material of the first flexible substrate layer 221 and the second flexible substrate layer 222 may include polyimide (PI). In other embodiments, the material of the first flexible substrate layer 221 and the second flexible substrate layer 222 may include other resin materials.

[0073] The metal layer 223 can realize signal transmission, and the material of the metal layer 223 can include copper.

[0074] Exemplarily, the thickness of the metal layer 223 may be 15 μm to 20 μm. For example, the thickness of the metal layer 223 may be 15 μm, 18 μm or 20 μm.

[0075] The thickness of the first flexible substrate layer 221 may be 20 μm to 30 μm. For example, the thickness of the first flexible substrate layer 221 may be 20 μm, 25 μm or 30 μm.

[0076] The thickness of the second flexible substrate layer 222 may be 20 μm to 30 μm. For example, the thickness of the second flexible substrate layer 222 may be 20 μm, 25 μm or 30 μm.

[0077] The thickness of the first protective layer 23 may be 50 μm to 100 μm. For example, the thickness of the first protective layer 23 may be 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm.

[0078] The thickness of the second protective layer 24 may be 50 μm to 100 μm. For example, the thickness of the second protective layer 24 may be 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm.

[0079] It should be noted that the thickness of the film layer refers to the dimension of the film layer in a direction perpendicular to the circuit board body 22 .

[0080] The present disclosure also provides a light-emitting module, such as Fig. 7A As shown, the light-emitting module may include a light-emitting substrate 10 and a flexible circuit board 20 in any embodiment of the present disclosure.

[0081] The light-emitting substrate 10 includes a light-emitting area and a second binding portion located at one side of the light-emitting area. The first binding portion 25 of the flexible circuit board 20 is bound and connected to the second binding portion. The flexible circuit board 20 is bent to the backlight side of the light-emitting substrate 10 through the bending area 21.

[0082] like Fig. 7A As shown, the backlight module further includes a back plate 30 located on the backlight side of the light-emitting substrate 10, the material of the back plate 30 includes aluminum, and the back plate 30 is provided with a through hole 31, and the flexible circuit board 20 further includes a bonding area 27, and the bonding area 27 is bonded to the backlight side of the light-emitting substrate 10 through a tape T, and one end of the flexible circuit board 20 on the side away from the bending area 21 of the bonding area 27 passes through the through hole 31. After passing through the through hole 31, the flexible circuit board 20 can be connected to the printed circuit board PCB.

[0083] The embodiments of the present disclosure further provide a display device, the display device includes the flexible circuit board 20 in any embodiment of the present disclosure, or the display device includes the light-emitting module in the embodiments of the present disclosure.

[0084] The display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or the like.

[0085] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0086] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0087] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0088] In the present disclosure, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0089] The disclosure above provides many different embodiments or examples to implement different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0090] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A flexible circuit board, characterized in that: Including a bending area, the flexible circuit board includes: A circuit board body, comprising a first side and a second side arranged opposite to each other, wherein a first binding portion is arranged on the first side of the circuit board body, and the first binding portion is located in an area outside the bending area; A first protective layer is located on the first side of the circuit board body and in an area outside the first binding portion; A second protective layer is located on the second side of the circuit board body and is located outside the bending area; The third protective layer is located on the second side of the circuit board body and in the bending area, and the third protective layer includes a plurality of protective bodies arranged at intervals.

2. The flexible circuit board according to claim 1, characterized in that: The protective body is in a strip shape and extends along a second direction. A plurality of the protective bodies are arranged in sequence along a first direction. The second direction is perpendicular to the first direction. The first direction is a direction from the first binding portion to the bending area.

3. The flexible circuit board according to claim 2, characterized in that: The dimension of the protection body in a direction perpendicular to the second direction is 0.3 mm to 0.5 mm.

4. The flexible circuit board according to claim 2, characterized in that: In the first direction, from the edge of the bending area toward the center, the size of the protection body in the first direction gradually decreases; or, In the first direction, the protection bodies have the same size in the first direction.

5. The flexible circuit board according to claim 2, characterized in that: In the first direction, the distances between two adjacent protection bodies are the same.

6. The flexible circuit board according to any one of claims 1 to 5, characterized in that: The distance between two adjacent protection bodies is greater than 0 and less than or equal to 0.05 mm.

7. The flexible circuit board according to claim 1, characterized in that: The dimension of the third protective layer in a direction perpendicular to the circuit board body is the same as the dimension of the second protective layer in a direction perpendicular to the circuit board body.

8. The flexible circuit board according to claim 1, characterized in that: The size of the third protective layer in a direction perpendicular to the circuit board body is 50 μm to 100 μm.

9. The flexible circuit board according to claim 1, characterized in that: The material of the third protection layer includes polyimide or ink.

10. The flexible circuit board according to claim 1, characterized in that: The circuit board body comprises a first flexible substrate layer, a metal layer and a second flexible substrate layer which are stacked in sequence. The first flexible substrate layer and the second flexible substrate layer are both made of resin material, and the metal layer is made of copper.

11. A light emitting module, characterized in that: A light-emitting substrate and a flexible circuit board as claimed in any one of claims 1 to 10; The light-emitting substrate includes a light-emitting area and a second binding portion located at one side of the light-emitting area. The first binding portion of the flexible circuit board is bound and connected to the second binding portion. The flexible circuit board is bent to the backlight side of the light-emitting substrate through the bending area.

12. A display device, characterized in that: The flexible circuit board comprises any one of claims 1 to 10, or the light-emitting module comprises the light-emitting module according to claim 11.

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