A MiniLED circuit board immersion etching system

Abstract

The present invention relates to the technical field of circuit board processing, and discloses a MiniLED circuit board immersion etching system, comprising an etching tank body, the bottom of the inner wall of the etching tank body is fixedly connected to a limit plate, and the bottom of the inner wall of the etching tank body is also provided with a positioning member that can cooperate with the limit plate to fix the external circuit board; wherein, the positioning member comprises a fixing plate, the lower surface of the fixing plate is fixedly connected to the bottom of the inner wall of the etching tank body, and the fixing plate is slidably connected to a connecting rod through a slot hole provided inside the fixing plate. The MiniLED circuit board immersion etching system can effectively solve the problem that when the circuit board is placed in the etching tank for etching in the prior art, the circuit board cannot be stably placed inside the etching tank, and multiple circuit boards will be stacked on each other, resulting in the overlapping surfaces between them being unable to fully contact with the etching liquid, reducing the uniformity of the circuit board etching process, thereby resulting in poor etching effect.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to an immersion etching system for a MiniLED circuit board. Background Art

[0002] A circuit board, also known as a printed circuit board, is a board made of an insulating material (such as fiberglass or plastic) with conductive paths engraved on it. These paths, also known as traces, are used to connect the various electronic components on the board. Circuit boards are an integral part of modern electronic devices. They make the design and manufacture of electronic products more precise and efficient by providing an efficient and reliable way to connect components.

[0003] In the prior art, when a circuit board is placed in an etching tank for etching, the circuit board cannot be stably placed inside the etching tank, and multiple circuit boards are stacked on each other, resulting in the overlapping surfaces between them being unable to fully contact the etching liquid, reducing the uniformity of the circuit board etching process, resulting in poor etching effect. Summary of the invention

[0004] Technical issues solved

[0005] In view of the above-mentioned shortcomings of the prior art, the present invention provides a MiniLED circuit board immersion etching system, which can effectively solve the problem that when the circuit board is placed in the etching tank for etching in the prior art, the circuit board cannot be stably placed inside the etching tank, and multiple circuit boards will be stacked on each other, resulting in the overlapping surfaces between them being unable to fully contact with the etching liquid, thereby reducing the uniformity of the circuit board etching process, resulting in poor etching effect.

[0006] Technical Solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] The present invention provides a MiniLED circuit board immersion etching system, comprising:

[0009] An etching tank body, wherein the bottom of the inner wall of the etching tank body is fixedly connected to a limiting plate, and the bottom of the inner wall of the etching tank body is also provided with a positioning piece that can cooperate with the limiting plate to fix the external circuit board;

[0010] Wherein, the positioning member comprises a fixing plate, the lower surface of which is fixedly connected to the bottom of the inner wall of the etching groove body, the fixing plate is slidably connected to a connecting rod through a slot hole provided inside the fixing plate, one end of the connecting rod close to the limiting plate is fixedly connected to a pressing plate, a corrosion-resistant spring is connected between adjacent surfaces of the fixing plate and the pressing plate, and the corrosion-resistant spring is sleeved on the circumferential outer surface of the connecting rod;

[0011] Wherein, the outer surface of the pressure plate is provided with an adjusting member which can be used to adjust the position of the pressure plate.

[0012] Furthermore, it also includes a rotating part, which includes a lifting rod. A sliding groove is opened on the circumferential inner surface of the etching groove body. The lifting rod is slidably connected to the sliding groove through a sliding seat arranged on its circumferential outer surface. The lower surface of the lifting rod is fixedly connected with an arc plate, and a transmission part is arranged on one side of the arc plate.

[0013] Furthermore, the interior of the pressure plate is rotatably connected to a clamping block via a rotating shaft, and the circumferential outer surface of the rotating shaft is sleeved with a torsion spring connected to the interior of the clamping block. Two clamping blocks are provided and are symmetrically distributed with the connecting rod as the center.

[0014] Furthermore, the adjusting member includes an adjusting block, the outer surface of the adjusting block is fixedly connected to the side of the pressure plate away from the limit plate, the upper surface of the adjusting block is provided with a V-shaped groove, the upper surface of the arc plate is fixedly connected to a guide rod, and the lower surface of the guide rod is fixedly connected to a guide column.

[0015] Furthermore, a counterweight plate for supporting an external circuit board is fixedly connected to the lower surface of the pressure plate, and adjacent surfaces of the two clamping blocks are both designed with curved surfaces.

[0016] Furthermore, the transmission member includes an upper tooth plate and a lower tooth plate, the outer surfaces of which are fixedly connected to one side of the arc plate close to the fixed plate, and one end of the connecting rod close to the arc plate is fixedly connected to a gear, and the upper tooth plate and the lower tooth plate are staggered.

[0017] Furthermore, four lifting rods are provided and distributed in a circular array with the axis of the etching tank body as the center, and the upper surfaces of the four lifting rods are fixedly connected with rotating rings.

[0018] Beneficial Effects

[0019] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0020] The present invention is provided with a limit plate, a positioning member and a guide column. When the circuit boards are independently and stably placed in the etching liquid, the guide column rotates with the rotating part and cooperates with the V-shaped groove to drive the pressure plate in the positioning member to move to the side away from the limit plate. The clamping block is in a contracted state, and the packaged circuit board does not deviate or shake. When the circuit board is placed, the guide column cooperates with the V-shaped groove to make the pressure plate gradually restore its initial state and approach the limit plate to limit the circuit board. At the same time, the clamping block is in an expanded state, so that both surfaces of the circuit board are in contact with the etching liquid, the etching is uniform, and the circuit board processing effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of an embodiment of the present invention;

[0023] Figure 2 Schematic diagram of the cross-sectional structure of the etching groove body according to an embodiment of the present invention;

[0024] Figure 3 It is a structural schematic diagram of a rotating part according to an embodiment of the present invention;

[0025] Figure 4 It is a schematic diagram of the three-dimensional structure of the pressure plate and the transmission member according to an embodiment of the present invention;

[0026] Figure 5 It is a schematic structural diagram of a gear of a positioning assembly according to an embodiment of the present invention;

[0027] Figure 6 For the embodiment of the present invention Figure 4 A schematic diagram of the structure with a partial enlargement at the center;

[0028] Figure 7 This is a schematic diagram of the structure of a limit plate, a positioning member and an arc plate according to an embodiment of the present invention;

[0029] Figure 8 This is a separation diagram of the pressure plate, torsion spring and clamping block according to an embodiment of the present invention.

[0030] The numbers in the figure represent respectively: 1. etching groove body; 11. limit plate; 12. positioning member; 121. fixing plate; 122. connecting rod; 123. pressure plate; 1231. counterweight plate; 124. corrosion-resistant spring; 125. clamping block; 126. torsion spring; 13. adjusting member; 131. adjusting block; 1311. V-shaped groove; 132. guide rod; 133. guide column; 2. rotating part; 21. lifting rod; 22. sliding seat; 23. arc plate; 24. transmission member; 241. upper tooth plate; 242. lower tooth plate; 243. gear; 25. rotating ring. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] The present invention will be further described below in conjunction with the embodiments.

[0033] Example:

[0034] See also Figure 1-Figure 8 The present invention provides a technical solution: a MiniLED circuit board immersion etching system, comprising:

[0035] An etching slot body 1, the bottom of the inner wall of the etching slot body 1 is fixedly connected to a limiting plate 11, and the bottom of the inner wall of the etching slot body 1 is also provided with a positioning piece 12 that can cooperate with the limiting plate 11 to fix the external circuit board; multiple groups of limiting plates 11 and positioning pieces 12 are arranged in a one-to-one correspondence, and are distributed in a circular array with the axis of the etching slot body 1 as the center.

[0036] The positioning member 12 includes a fixing plate 121, the lower surface of which is fixedly connected to the bottom of the inner wall of the etching tank body 1, and the fixing plate 121 is slidably connected to a connecting rod 122 through a slot hole provided inside the fixing plate 121, and one end of the connecting rod 122 close to the limiting plate 11 is fixedly connected to a pressing plate 123, and a corrosion-resistant spring 124 is connected between adjacent surfaces of the fixing plate 121 and the pressing plate 123, and the corrosion-resistant spring 124 is sleeved on the circumferential outer surface of the connecting rod 122;

[0037] The outer surface of the pressing plate 123 is provided with an adjusting member 13 for adjusting the position thereof.

[0038] It also includes a rotating part 2, which includes a lifting rod 21. A sliding groove is provided on the circumferential inner surface of the etching tank body 1. The lifting rod 21 is slidably connected to the sliding groove through a sliding seat 22 arranged on its circumferential outer surface. An arc plate 23 is fixedly connected to the lower surface of the lifting rod 21, and a transmission member 24 is provided on one side of the arc plate 23.

[0039] The inside of the pressure plate 123 is rotatably connected to a clamping block 125 via a rotating shaft, and the outer surface of the rotating shaft is sleeved with a torsion spring 126 connected to the inside of the clamping block 125. Two clamping blocks 125 are provided and are symmetrically distributed around the connecting rod 122.

[0040] The adjusting member 13 includes an adjusting block 131, the outer surface of the adjusting block 131 is fixedly connected to the side of the pressure plate 123 away from the limiting plate 11, the upper surface of the adjusting block 131 is provided with a V-shaped groove 1311, the upper surface of the arc plate 23 is fixedly connected with a guide rod 132, the lower surface of the guide rod 132 is fixedly connected with a guide column 133, the pressure plate 123 is fixedly connected to the adjusting block 131, and when the guide column 133 cooperates with the V-shaped groove 1311, the pressure plate 123 can be driven to move, thereby changing the distance between the pressure plate 123 and the limiting plate 11, thereby achieving clamping of the external circuit board.

[0041] A counterweight plate 1231 for supporting an external circuit board is fixedly connected to the lower surface of the pressing plate 123 , and the adjacent surfaces of the two clamping blocks 125 are both designed with curved surfaces.

[0042] The transmission member 24 includes an upper tooth plate 241 and a lower tooth plate 242. The outer surfaces of the upper tooth plate 241 and the lower tooth plate 242 are fixedly connected to the side of the arc plate 23 close to the fixed plate 121. The end of the connecting rod 122 close to the arc plate 23 is fixedly connected with a gear 243. The upper tooth plate 241 and the lower tooth plate 242 are staggered. By moving the upper and lower positions of the arc plate 23, the upper tooth plate 241 is in contact with the gear 243, or the lower tooth plate 242 is in contact with the gear 243, so as to achieve different effects.

[0043] Four lifting rods 21 are provided and distributed in a circular array with the axis of the etching tank body 1 as the center. The upper surfaces of the four lifting rods 21 are fixedly connected with a rotating ring 25 .

[0044] Circuit board placement process:

[0045] In actual application, when etching the surface of the circuit board, the required etching liquid is placed in the etching tank body 1, and the driving motor is started to drive the rotating ring 25 to rotate around the axis of the etching tank body 1. The lifting rod 21 and the arc plate 23 fixedly connected to the rotating ring 25 rotate together with it. In the initial state, the lifting rod 21 and the arc plate 23 are at the bottom end within the controllable range, and the rack of the upper toothed plate 241 on the outer surface of the arc plate 23 can be engaged with the gear 243. Four arc plates 23 are provided, which are distributed in a circular array with the axis of the etching tank body 1 as the center, and multiple groups of limit plates 11 are provided, which correspond one by one to the positioning members 12.

[0046] After the etching system is started, the arc plate 23 will rotate clockwise with the lifting rod 21 and the rotating ring 25, and the outer surface of the arc plate 23 will slide in contact with the circumferential inner wall of the etching tank body 1, and the sliding seat 22 sleeved on the outer surface of the lifting rod 21 will slide in contact with the slide groove, ensuring the stable rotation of the arc plate 23. A plurality of positioning members 12 for placing external circuit boards are arranged inside the etching tank body 1. A guide rod 132 is fixedly connected to the upper surface of the arc plate 23, and the guide rod 132 extends out of the outside of the arc plate 23. The guide column 133 on the lower surface of the guide rod 132 can slide in contact with the inner wall of the V-shaped groove 1311. When the rotating part 2 rotates clockwise, the etching tank body 1 and the positioning member 12 inside it remain stationary, and the guide rod 132 on the upper surface of the arc plate 23 first approaches the positioning member 12. As the rotation continues, the guide column 133 fits with the side opening of the V-shaped groove 1311 on the upper surface of the adjustment block 131, and the inner wall of the V-shaped groove 1311 and the circumferential outer surface of the guide column 133 cooperate with each other. As the guide column 133 continues to rotate, the guide column 133 follows the path direction of the V-shaped groove 1311. The movable adjustment block 131 approaches one side of the arc plate 23. Since the adjustment block 131 is fixedly connected to the pressure plate 123, the pressure plate 123, the clamping block 125, the counterweight plate 1231, the connecting rod 122 and the gear 243 are horizontally displaced in the direction of the arc plate 23 at the same time. The gear 243 does not fit with the circumferential inner wall of the etching tank body 1 in the initial state, but fits with the circumferential inner wall of the etching tank body 1 after movement, and can always be in contact with the upper tooth plate 241 and the lower tooth plate 242.

[0047] In the initial state, the outer surface of the rotating shaft inside the pressing plate 123 is sleeved with a torsion spring 126 connected to the inside of the clamping block 125, so that the clamping block 125 remains in the expanded state in the absence of external force, and the bottom of the fixed plate 121 is fixedly connected to the bottom of the inner wall of the etching tank body 1, and always remains motionless. When the pressing plate 123 moves toward the side of the fixed plate 121, the corrosion-resistant spring 124 sleeved on the outer surface of the connecting rod 122 is in a compressed state under the influence of the pressing plate 123, until the guide column 133 moves to the middle of the V-shaped groove 1311, the gap between the pressing plate 123 and the fixed plate 121 is the smallest, and the distance between the pressing plate 123 and the limiting plate 11 is increased. The side of the clamping block 125 away from the limit plate 11 contacts the fixed plate 121 from the initial inclined state, and then contacts and adheres to the outer surface of the fixed plate 121, so that the clamping block 125 rotates around the rotating axis until the side of the clamping block 125 away from the limit plate 11 is completely in contact with the outer surface of the fixed plate 121. At this time, both clamping blocks 125 are in a retracted state.

[0048] At this time, the circuit board is grabbed by an external manipulator and placed on the counterweight plate 1231 between the positioning member 12 and the limiting plate 11 in the etching tank body 1. Four guide posts 133 are provided, and the positions of the pressure plates 123 in the four positioning members 12 can be adjusted, so four circuit boards can be placed by the manipulator at the same time. At this time, the clamping block 125 is in an open state, and the opening of the clamping block 125 near the limiting plate 11 adopts an arc-shaped inclined surface design. When the circuit board is placed vertically, the side of the circuit board near the positioning member 12 is located in the arc-shaped inclined surfaces of the two clamping blocks 125, and the bottom side of the circuit board is located above the counterweight plate 1231. When the robot arm has placed the circuit board stably and then recovers upward to continue placing other circuit boards, at the same time, the rotating part 2 continues to rotate clockwise at the original speed, and the guide column 133 continues to rotate clockwise from the middle of the V-shaped groove 1311. During this process, the inner wall of the V-shaped groove 1311 and the circumferential outer surface of the guide column 133 cooperate with each other. As the guide column 133 continues to rotate, the guide column 133 follows the path direction of the V-shaped groove 1311 and drives the adjustment block 131 to start moving away from the arc plate 23. At the same time, the pressure plate 123, the clamping block 125, the counterweight plate 1231, the connecting rod 122 and the gear 243 move toward the side of the limit plate 11 at the same time, and the distance between the pressure plate 123 and the fixed plate 121 increases. The corrosion-resistant spring 124 loses the squeezing force of the pressure plate 123 on it, and begins to restore its elastic potential energy, and the gap between the pressure plate 123 and the limit plate 11 becomes smaller.

[0049] As the gap between the pressure plate 123 and the fixed plate 121 increases, the clamping block 125 moves toward the side of the limit plate 11 together with the pressure plate 123, and the side of the clamping block 125 close to the arc plate 23 begins to separate from the outer surface of the fixed plate 121. After separation, under the action of the torsion spring 126 inside the clamping block 125, it rotates around the axis of rotation, gradually expands outward until it returns to its original state. The torsion spring 126 is made of the same material as the corrosion-resistant spring 124. During this process, the distance between the pressure plate 123 and the limiting plate 11 decreases, the pressure plate 123 gradually moves toward the circuit board, the clamping block 125 also gradually opens, and the bottom side of the circuit board is placed on the counterweight plate 1231. As the pressure plate 123 moves together, when one side edge of the circuit board is moved to fit with the limiting plate 11 (in this process, the side edge of the circuit board is located in the arc-shaped inclined surface between the two clamping blocks 125 and will not fall outside the positioning member 12 due to movement), the pressure plate 123 continues to move to fit the other side edge of the circuit board with the outer surface of the pressure plate 123 between the two clamping blocks 125. During this process, the clamping block 125 expands outward, and the two clamping blocks 125 are moved outward. The corners of the adjacent surfaces of the clamping blocks 125 close to the rotating shaft also adopt an arc surface design. When the clamping block 125 is fully unfolded, the inner arc surface of the clamping block 125 can still stably confine the circuit board therein without falling off. At this point, the guide column 133 is completely separated from the V-groove 1311 opened on the upper surface of the adjustment block 131, and the bottom side of the circuit board is in contact with the upper surface of the counterweight plate 1231, one side of the circuit board is in contact with the outer surface of the pressure plate 123, and the other side of the circuit board is in contact with the outer surface of the limiting plate 11. The circuit board is fixed in multiple directions at the front, back, left, right and bottom, but is not stuck. It is in the space surrounded by the pressure plate 123, the limiting plate 11, the clamping block 125 and the counterweight plate 1231.

[0050] The rotating ring 25 continues to rotate clockwise. After the guide rod 132 and the guide column 133 pass the adjusting block 131, the upper toothed plate 241 on the outer surface of the arc plate 23 rotates clockwise with them. When passing the connecting rod 122, the teeth of the upper toothed plate 241 begin to mesh with the gear 243. The upper toothed plate 241 continues to rotate clockwise. During the rotation, the gear 243 is driven to rotate. The gear 243 is fixedly connected to the connecting rod 122 and the pressure plate 123. When the gear 243 rotates, the pressure plate 123 and the connecting rod 122 are driven to rotate around the slot hole opened inside the fixed plate 121. When the pressure plate 123 rotates a certain angle, the upper toothed plate 241 is disengaged from the teeth of the gear 243. The lengths of the upper toothed plate 241 and the lower toothed plate 242 can be designed according to the size of the circuit board to ensure that the circuit board rotates a certain angle inside the positioning member 12.

[0051] Since the bottom of the fixed plate 121 is fixedly connected to the lower surface of the inner wall of the etching tank body 1, and the pressure plate 123 and the counterweight plate 1231 are in a suspended state, and are at a certain distance from the etching tank body 1, there will be no collision during the rotation of the pressure plate 123, and the circuit board in the pressure plate 123, the counterweight plate 1231 and the clamping block 125 rotate together, which is used to eliminate the bubbles or liquid films that may be generated on the surface of the board, especially the small holes, slits and other parts due to the surface tension when the circuit board is immersed in the etching liquid, so as to avoid the problem that the etching liquid cannot contact the surface of the circuit board due to the obstruction of bubbles or liquid films, resulting in uneven etching of the circuit board and poor etching effect. During the rotation process, the clamping block 125 is in an open state, but the inner arc surface of the clamping block 125 can still stably confine the circuit board therein without falling off. After the gear 243 is separated from the upper tooth plate 241, since the counterweight plate 1231 has a certain weight, it can drive the pressure plate 123 and the clamping block 125 to quickly return to the initial state for stability.

[0052] The rotating ring 25 continues to rotate clockwise to the next positioning member 12, and the above action is repeated. The circuit board is placed on the positioning member 12 and fixed in a limited position. The upper tooth plate 241 is engaged with the gear 243 to drive the circuit board to swing within a certain range to eliminate bubbles and liquid film on its surface. This action is repeated until the circuit boards are placed inside the positioning member 12 for etching.

[0053] Circuit board etching process:

[0054] At this time, the external driving motor is started to lift the rotating ring 25 upward by a certain distance, and the lifting rod 21, the arc plate 23, the upper tooth plate 241 and the lower tooth plate 242 move upward together until the teeth on the upper side of the lower tooth plate 242 can mesh with the gear 243. At this time, the rotating ring 25 continues to rotate. Since the guide rod 132 and the guide column 133 are moved upward together, they no longer contact the V-shaped groove 1311 on the upper surface of the adjusting block 131 during the rotation process. When the rotating ring 25 drives the lower tooth plate 242 to rotate, when the lower tooth plate 242 passes the positioning member 12, it will contact the gear 243 therein, and then engage with the upper The process of driving the pressing plate 123 to rotate and swing around the axis of the connecting rod 122 is consistent with the process of driving the pressing plate 123 to rotate and swing around the axis of the connecting rod 122 when the lower tooth plate 242 contacts the gear 243, driving the circuit board and the positioning member 12 to rotate together in the etching liquid. After the lower tooth plate 242 and the gear 243 are separated, under the action of the counterweight plate 1231, the pressing plate 123 swings quickly until it returns to its original state. In this process, it can help the etching liquid to be evenly distributed inside the etching tank body 1, and at the same time, it can break the stagnant layer composed of reactants formed on the surface of the circuit board during the etching process, thereby improving the flushing of the etching liquid on the surface of the circuit board and further promoting the etching reaction. When the circuit board meets the etching time requirements, an external manipulator is used to pick up and move it from the top of the circuit board to the outside of the etching tank body 1 to proceed to the next step. In this process, the rotating part 2 is lowered to restore the initial state, and the matching relationship between the guide column 133 and the V-groove 1311 is used to increase the distance between the pressing plate 123 and the limiting plate 11, so as to facilitate the manipulator to grab without wearing the circuit board surface. This process is consistent with the feeding process of the circuit board.

[0055] In summary, the circuit board has the following advantages when being etched inside the etching tank body 1:

[0056] Advantage 1: Multiple groups of limiting plates 11 and positioning members 12 are arranged inside the etching tank body 1. The circuit board can be limited in multiple directions in the space surrounded by the pressure plates 123 and the counterweight plates 1231 in the limiting plates 11 and the positioning members 12. The circuit boards are independently and stably placed inside the etching tank body 1. Both surfaces of the circuit boards are in contact with the etching liquid, and the etching effect is good.

[0057] Advantage 2: When the circuit board is placed downward, the rotating part 2 drives the guide column 133 to rotate, so that it cooperates with the V-groove 1311 above the adjustment block 131, pulls the pressure plate 123, and increases the distance between it and the limiting plate 11, so that the process of placing the circuit board downward is smoother and no wear occurs; the rotating part 2 continues to rotate, so that the placed circuit board is wrapped between the pressure plate 123 and the limiting plate 11, completing the positioning of the circuit board.

[0058] Advantage three, when the adjusting member 13 moves the position of the pressing plate 123, the clamping block 125 can adjust its own expansion angle. When the gap between the pressing plate 123 and the limiting plate 11 is the largest, the clamping block 125 is in a retracted state, so as to prevent the circuit board from tilting and collapsing and falling on the outside of the positioning member 12 due to lack of support when the pressing plate 123 has not yet positioned and clamped the circuit board with the limiting plate 11; when the distance between the pressing plate 123 and the limiting plate 11 is the smallest, the clamping block 125 does not fit the outer surface of the fixed plate 121, and is in an expanded state under the action of the internal torsion spring 126. At this time, the pressing plate 123 and the limiting plate 11 limit the position of the circuit board. The clamping block 125 in the expanded state can maximize the contact between the circuit board and the etching liquid during the etching process, thereby ensuring the uniformity of etching and improving the production quality of the circuit board. At the same time, the bottom ends of the adjacent surfaces of the two clamping blocks 125 are designed with arc surfaces, which can ensure that the circuit board does not fall outside the positioning member 12 when tilted even in the unfolded state.

[0059] Advantage 4: During the rotation of the rotating part 2, the guide column 133 passes through the V-groove 1311, and after the pressure plate 123 is retracted and clamped, the upper tooth plate 241 meshes with the gear 243, and the circuit board, the pressure plate 123 and the counterweight plate 1231 rotate simultaneously. After the upper tooth plate 241 is disengaged from the gear 243, it swings back and forth under the action of the counterweight plate 1231 to restore the initial state, so as to eliminate the bubbles or liquid film that may be generated on the surface of the board, especially in the small holes and slits, due to the surface tension of the circuit board, so as to avoid the problem that the etching liquid cannot contact the surface of the circuit board due to the obstruction of bubbles or liquid film, resulting in uneven etching of the circuit board and poor etching effect.

[0060] Advantage 5: The rotating part 2 is designed to be able to be lifted and moved up and down. When the rotating part 2 is at the bottom as a whole and its upper tooth plate 241 can be engaged with the gear 243, its rotating action can be used to complete the clamping and loosening actions required by the circuit board loading and unloading pressure plate 123; when the rotating part 2 is at the top as a whole and its lower tooth plate 242 can be engaged with the gear 243, its rotating action can be used to complete the back and forth swinging of the circuit board during the etching process, helping the etching liquid to be evenly distributed inside the etching tank body 1, and at the same time breaking a stagnant layer composed of reactants formed on the surface of the circuit board during the etching process, thereby improving the flushing of the etching liquid on the surface of the circuit board and further promoting the etching reaction.

[0061] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A MiniLED circuit board immersion etching system, characterized in that: include: An etching tank body (1), wherein the bottom of the inner wall of the etching tank body (1) is fixedly connected to a limiting plate (11), and the bottom of the inner wall of the etching tank body (1) is also provided with a positioning piece (12) that can cooperate with the limiting plate (11) to fix an external circuit board; The positioning member (12) comprises a fixing plate (121), the lower surface of the fixing plate (121) is fixedly connected to the bottom of the inner wall of the etching tank body (1), the fixing plate (121) is slidably connected to a connecting rod (122) via a slot hole provided inside the fixing plate (121), one end of the connecting rod (122) close to the limiting plate (11) is fixedly connected to a pressing plate (123), a corrosion-resistant spring (124) is connected between adjacent surfaces of the fixing plate (121) and the pressing plate (123), and the corrosion-resistant spring (124) is sleeved on the circumferential outer surface of the connecting rod (122); Wherein, the outer surface of the pressing plate (123) is provided with an adjusting member (13) which can be used to adjust its position; A rotating part (2), the rotating part (2) comprising a lifting rod (21), a lower surface of the lifting rod (21) being fixedly connected to an arc-shaped plate (23), and a transmission member (24) being provided on one side of the arc-shaped plate (23); The adjusting member (13) comprises an adjusting block (131), the outer surface of the adjusting block (131) is fixedly connected to a side of the pressure plate (123) away from the limiting plate (11), the upper surface of the adjusting block (131) is provided with a V-shaped groove (1311), the upper surface of the arc plate (23) is fixedly connected to a guide rod (132), the lower surface of the guide rod (132) is fixedly connected to a guide column (133), the transmission member (24) comprises an upper tooth plate (241) and a lower tooth plate (242), the upper tooth plate (241) and the lower tooth plate (242) are fixedly connected to each other. 2) are fixedly connected to one side of the arc plate (23) close to the fixed plate (121); one end of the connecting rod (122) close to the arc plate (23) is fixedly connected to a gear (243); the upper tooth plate (241) and the lower tooth plate (242) are arranged in a staggered manner; the interior of the pressure plate (123) is rotatably connected to a clamping block (125) via a rotating shaft; and a torsion spring (126) connected to the interior of the clamping block (125) is sleeved on the circumferential outer surface of the rotating shaft; and two clamping blocks (125) are arranged and are symmetrically distributed with the connecting rod (122) as the center.

2. A MiniLED circuit board immersion etching system according to claim 1, characterized in that: The circumferential inner surface of the etching tank body (1) is provided with a sliding groove, and the lifting rod (21) is slidably connected to the sliding groove via a sliding seat (22) provided on the circumferential outer surface of the etching tank body (1).

3. The MiniLED circuit board immersion etching system according to claim 1, characterized in that: A counterweight plate (1231) that can be used to support an external circuit board is fixedly connected to the lower surface of the pressure plate (123), and the adjacent surfaces of the two clamping blocks (125) are both designed with curved surfaces.

4. A MiniLED circuit board immersion etching system according to claim 2, characterized in that: Four lifting rods (21) are provided and distributed in a circular array around the central axis of the etching tank body (1); the upper surfaces of the four lifting rods (21) are all fixedly connected with a rotating ring (25).

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