Electronic component surface mounting equipment and method for intelligent manufacturing

Abstract

The invention relates to the technical field of electronic component surface mounting equipment, and discloses electronic component surface mounting equipment for intelligent manufacturing, which comprises a working box and a protective door mounted in the working box, and further comprises a circuit board arranged in the working box and used for smearing solder paste on the circuit board, and a power supply arranged in the working box and used for supplying power to the circuit board, the fixing mechanism is arranged in the working box and is used for fixing a circuit board; the smearing box is connected to the top of the inner wall of the working box through a third air cylinder and used for smearing solder paste to the circuit board; and the smearing mechanism is arranged in the smearing box and is used for uniformly smearing the solder paste. According to the tin paste smearing device, through the arranged smearing mechanism, alternate smearing is carried out through the smearing plates installed below the two tin paste storage barrels, so that the smearing positions of the smearing plates below the two tin paste storage barrels are enlarged, and the situation that the tin paste is placed and smeared unevenly or smeared left is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component placement equipment, and in particular to an electronic component placement equipment and method for intelligent manufacturing. Background Art

[0002] Electronic component patch is a kind of package, called SMT. Surface mount packaging means that electronic components are directly soldered to the pads of PCB board. Some electronic components need to be fixed by manual spot welding. The size and shape of the welding point affect the use of single electronic components and even the entire circuit board. Therefore, the shape and size of the welding point of electronic components are very important.

[0003] For example, the application number 202210401090.X discloses an automated patch device for electronic components, including a support frame, a rotating shaft, a conveyor belt, and a fixed groove. The automated patch device for electronic components designed by the present invention adopts a patch mechanism to apply solder paste on the patch components, and then adjusts the position of the patch components to paste the patch components on the circuit board, thereby avoiding the problem that the solder paste applied on the circuit board is difficult to accurately apply according to the size of the patch components, resulting in more or less solder paste on the circuit board. At the same time, the solder paste is directly applied to the patch components, and only the patch position of the patch components needs to be adjusted, thereby avoiding the problem that the solder paste coating position and the patch component position are fully adjusted, resulting in a more cumbersome patch of electronic components;

[0004] However, in the above-mentioned device, when applying solder paste, it can only be applied according to the size of the components, but the solder paste only needs to be applied to the pins of the components. Therefore, it is only necessary to apply the solder paste evenly and stably on the circuit board to solve the problem of stable welding of electronic components. Therefore, an electronic component patch device and method for intelligent manufacturing are proposed to solve the above-mentioned problems. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide an electronic component placement device and method for intelligent manufacturing in view of the deficiencies in the above-mentioned prior art.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is: an electronic component placement device for intelligent manufacturing, comprising a working box and a protective door, wherein the protective door is installed in the working box, and further comprising:

[0007] A circuit board is arranged inside the working box and is used to apply solder paste on the circuit board;

[0008] A fixing mechanism, arranged inside the working box, for fixing the circuit board;

[0009] The coating box is connected to the top of the inner wall of the working box through the cylinder three, and is used to apply solder paste to the circuit board;

[0010] A coating mechanism, disposed in the coating box, for evenly coating solder paste;

[0011] Wherein, the smearing mechanism comprises:

[0012] Two solder paste storage cylinders, both sides of which are slidably connected to the inner wall of the coating box through sliders, are used to store solder paste;

[0013] Two cylinders 2 are respectively connected to the outer wall of the coating box, and the output ends are connected to the solder paste storage cylinder, so as to push the solder paste storage cylinder to move;

[0014] A plurality of fixing rods are respectively connected to the front and rear sides of the inner walls of the two solder paste storage cylinders;

[0015] The telescopic sleeve is sleeved on the outer walls of the two fixed rods, and the interior of the telescopic sleeve is connected to the two fixed rods through a second spring;

[0016] The smear plate is installed below the solder paste storage cylinder and is used for evenly smearing the solder paste.

[0017] Preferably, the solder paste storage cylinder comprises:

[0018] A cover plate, installed above the solder paste storage cylinder;

[0019] The upper fixed plate, the bottom of which is connected to the upper part of the cover plate through spring three;

[0020] A plurality of movable rods movably passing through the cover plate and connected to the bottom of the upper fixed plate;

[0021] A push plate, connected to the bottom of the movable rod and located inside the solder paste storage cylinder, for pushing the internal solder paste;

[0022] A plurality of solder paste conduits are connected to both sides of the outer wall of the solder paste storage tube and are used for guiding out the solder paste.

[0023] Preferably, the solder paste storage cylinder further includes:

[0024] A movable block is disposed inside the solder paste storage cylinder and is used to move up and down to stir the solder paste to prevent the solder paste from hardening;

[0025] A plurality of fixing columns are fixedly connected to the bottom of the cover plate, and the other side of the fixing columns is inserted into the circular groove of the movable block;

[0026] A plurality of springs four are arranged in the circular groove and connected with the movable block and the fixed column;

[0027] The push plates are provided in two groups and are respectively arranged on both sides of the movable block and are fitted with the solder paste storage cylinder and the outer wall of the movable block.

[0028] Preferably, the smear plate comprises:

[0029] A smearing flap, arranged below the solder paste storage cylinder, for smearing solder paste;

[0030] A plurality of adjusting balls are installed below the inner wall of the solder paste storage cylinder;

[0031] A telescopic rod, movably connected to the inner wall of the adjusting ball, the bottom of which is connected to the smear flap, and is used to deflect the smear flap;

[0032] Spring 5, installed on the outer wall of the telescopic rod and inside the adjusting ball, is used to push the coating flap to move downward;

[0033] The resistance rod is connected to the top of the adjusting ball, and the top of the resistance rod contacts the bottom of the movable block through the round ball, so as to push the movable block upward.

[0034] Preferably, a rectangular hole is provided at the bottom of the inner wall of the coating box, and a steel plate is placed inside the hole to assist in coating solder paste onto the circuit board;

[0035] A plurality of grooves are provided at the bottom of the coating box, and a support rod is movably connected therein, and one side of the support rod is connected to the groove through a spring so as to be pushed upward by a force.

[0036] Preferably, the fixing mechanism comprises:

[0037] A workbench connected to the interior of the work box;

[0038] Cylinder 1, connected to the interior of the workbench;

[0039] Two push blocks are movably connected to the inner sides of the workbench and are hinged to the telescopic end of the cylinder through a connecting rod;

[0040] A U-shaped rod, hinged to one side of the push block through a pin and located above the workbench;

[0041] A connecting rod, the middle of which is hinged on the U-shaped rod, and the two sides of which are respectively hinged with a push rod 1 and a push rod 2, wherein one side of the push rod 2 is hinged on the workbench through a pin shaft;

[0042] One side of the push rod is hinged to a limit block through a pin shaft, and the bottom of the limit block is in contact with the top of the workbench;

[0043] The inner side of the limit block is arranged in an arc shape to abut against the circuit board.

[0044] Preferably, the fixing mechanism further comprises:

[0045] A plurality of support springs are arranged in the mounting grooves of the workbench;

[0046] A support plate, connected to the top of the support spring and located in the mounting groove to move up and down;

[0047] The circuit board is placed above the supporting plate.

[0048] A method for mounting electronic components for intelligent manufacturing, using the above-mentioned electronic component mounting equipment to manufacture electronic components, comprising the following steps:

[0049] Step 1: Place the circuit board to be patched on top of the support plate and use a fixing mechanism to fix it on both sides to ensure that the solder paste is more stable when applied;

[0050] Step 2: Place the corresponding steel plate in the coating box, and after placing it, push the entire coating box downward through the work of cylinder 3, which will push multiple support rods downward to contact the circuit board, so as to fix the circuit board from the front and back sides;

[0051] Step 3: Push the cylinders 2 on both sides to extend and retract in turn. At this time, the solder paste in the solder paste storage tube is squeezed out synchronously, and the solder paste is applied through the smearing flap, so that the solder paste is evenly applied and passes through the holes on the steel plate to the circuit board, thereby completing the solder paste coating operation;

[0052] Step 4: Place the circuit board coated with solder paste into the placement machine for electronic component placement.

[0053] The present invention adopts the above technical solution to bring the following beneficial effects:

[0054] 1. The electronic component patch equipment and method for intelligent manufacturing, through the setting of the coating mechanism, uses the coating plate installed under the two solder paste storage cylinders to perform alternating coating, thereby expanding the coating position of the coating plate under the two solder paste storage cylinders, thereby avoiding uneven coating or missing coating.

[0055] 2. The electronic component patch equipment and method for intelligent manufacturing can squeeze the solder paste in the solder paste storage tube and move it downward along the inside thereof by moving the push plate downward, squeeze it out through multiple solder paste ducts, and drip it onto the steel plate, thereby achieving the purpose of auxiliary coating. At the same time, the movable block that can move up and down produces an effect of moving the solder paste, thereby preventing the solder paste from hardening inside it and affecting its use.

[0056] 3. The electronic component patch equipment and method for intelligent manufacturing, through the provision of a coating flap, utilizes its reverse deflection relative to the movement direction of the solder paste storage cylinder, so that the coating effect can be improved during the movement. At the same time, during the flipping process, through the deflection movement around the adjustment ball as the center of the circle, the resistance rod is used to squeeze the movable block to move upward, and it is reset under the action of the spring four, thereby causing the movable block to move, stirring the solder paste inside it to prevent it from hardening.

[0057] 4. The electronic component patch equipment and method for intelligent manufacturing, through the setting of the fixing mechanism, uses the limit block on one side of the arc to squeeze the circuit board to fix the circuit board to assist in the stable application of solder paste. At the same time, the support rod contacts the front and rear sides of the circuit board in the process of following the downward movement of the coating box, and squeezes the spring 1 upward, thereby achieving sufficient resistance and further improving the limit fixation of the circuit board.

[0058] 5. The electronic component patch equipment and method for intelligent manufacturing can be adapted to circuit boards of different thicknesses for solder paste coating and position fixing by placing the circuit board on a support plate and pushing it upward through a support spring. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1 It is a schematic diagram of the structure of the present invention;

[0060] Figure 2 It is a schematic diagram of the internal structure of the present invention;

[0061] Figure 3 It is a schematic diagram of the local structure of the present invention;

[0062] Figure 4 This is a schematic diagram of the explosion structure of the fixing mechanism of the present invention;

[0063] Figure 5 This is a schematic diagram of the partial explosion structure of the coating mechanism of the present invention;

[0064] Figure 6 It is a schematic diagram of the structure of the coating mechanism of the present invention;

[0065] Figure 7 This is a schematic diagram of the cross-sectional structure of the solder paste storage cylinder of the present invention;

[0066] Figure 8 For the present invention Figure 7 Enlarged structural diagram at A in the middle.

[0067] In the figure: 1, work box; 2, protective door; 3, fixing mechanism; 31, workbench; 32, support spring; 33, support plate; 34, cylinder 1; 35, push block; 36, U-shaped rod; 37, connecting rod; 38, push rod 1; 39, push rod 2; 310, limit block; 4, smear box; 41, support rod; 42, spring 1; 5, circuit board; 6, steel plate; 7, smear mechanism; 71, solder paste storage cylinder; 711 , cover plate; 712, upper fixed plate; 713, spring three; 714, movable rod; 715, push plate; 716, movable block; 717, fixed column; 718, spring four; 72, cylinder two; 73, fixed rod; 74, spring two; 75, telescopic sleeve; 76, smear plate; 761, smear flap; 762, telescopic rod; 763, spring five; 764, adjustment ball; 765, resistance rod; 77, solder paste guide tube. DETAILED DESCRIPTION

[0068] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0069] See also Figure 1-8 One embodiment of the present invention is: an electronic component placement device for intelligent manufacturing, comprising a working box 1 and a protective door 2, wherein the protective door 2 is installed in the working box 1, and further comprising:

[0070] A circuit board 5 is arranged inside the working box 1 and is used to apply solder paste on the circuit board 5;

[0071] A fixing mechanism 3 is arranged inside the working box 1 and is used to fix the circuit board 5;

[0072] The coating box 4 is connected to the top of the inner wall of the working box 1 through the cylinder 3 and is used to apply solder paste to the circuit board 5;

[0073] A coating mechanism 7 is arranged in the coating box 4 and is used for evenly coating the solder paste;

[0074] Wherein, the smearing mechanism 7 comprises:

[0075] Two solder paste storage cylinders 71, both sides of which are slidably connected to the inner wall of the coating box 4 through sliders, and are used to store solder paste;

[0076] Two cylinders 72 are respectively connected to the outer wall of the coating box 4, and the output ends are connected to the solder paste storage cylinder 71, so as to push the solder paste storage cylinder 71 to move;

[0077] A plurality of fixing rods 73 are respectively connected to the front and rear sides of the inner walls of the two solder paste storage cylinders 71;

[0078] The telescopic sleeve 75 is sleeved on the outer wall of the two fixed rods 73, and its interior is connected to the two fixed rods 73 through the spring 2 74;

[0079] The smear plate 76 is installed below the solder paste storage cylinder 71 and is used to evenly spread the solder paste.

[0080] Working principle: In the process of applying solder paste to the circuit board, it is only necessary to open the two cylinders 72 alternately in sequence to push the two solder paste storage barrels 71 to move in sequence. At this time, the two solder paste storage barrels 71 move left and right, and the solder paste on the steel plate 6 can be applied to the circuit board 5 through its holes by using the smearing plate 76 below. At the same time, when smearing to the side, the solder paste storage barrel 71 on one side can no longer move after it hits the inner wall of the smearing box 4, and is squeezed, so that the other solder paste storage barrel 71 moves in the telescopic sleeve 75 and can continue to move and smear, thereby expanding the smearing position of the smearing plate 76 below the two solder paste storage barrels 71, thereby avoiding uneven placement or missing smearing.

[0081] See also Figure 1-8 Based on the above embodiment, in another embodiment of the present invention, the solder paste storage cylinder 71 includes:

[0082] A cover plate 711 is installed above the solder paste storage cylinder 71;

[0083] The upper fixing plate 712, the bottom of which is connected to the top of the cover plate 711 through a spring 3 713;

[0084] A plurality of movable rods 714 movably penetrate the cover plate 711 and are connected to the bottom of the upper fixed plate 712;

[0085] A push plate 715, connected to the bottom of the movable rod 714 and located inside the solder paste storage cylinder 71, for pushing the internal solder paste;

[0086] A plurality of solder paste conduits 77 are connected to both sides of the outer wall of the solder paste storage tube 71 for guiding out the solder paste.

[0087] The solder paste storage cylinder 71 also includes:

[0088] The movable block 716 is disposed inside the solder paste storage tube 71 and is used to move up and down to stir the solder paste to prevent the solder paste from hardening;

[0089] A plurality of fixed columns 717 are fixedly connected to the bottom of the cover plate 711 and the other side is inserted into the circular groove of the movable block 716;

[0090] A plurality of springs 718 are disposed in the circular groove and connected to the movable block 716 and the fixed column 717;

[0091] There are two groups of push plates 715 , which are respectively arranged on both sides of the movable block 716 , and are in contact with the outer wall of the solder paste storage cylinder 71 and the movable block 716 .

[0092] Working principle: After the solder paste is stored in the solder paste storage tube 71, the spring 713 provided therein pulls the upper fixed plate 712 downward to move, thereby pushing the push plate 715 to move through multiple movable rods 714, and then the solder paste stored inside can be squeezed out along multiple solder paste ducts 77 and dripped onto the steel plate 6, thereby achieving the purpose of auxiliary coating; at the same time, after the movable block 716 is squeezed by the spring four 718, it moves downward to produce the purpose of pushing, and then it will move in the solder paste storage tube 71, stirring the solder paste to prevent the solder paste from hardening inside it, thereby affecting its use.

[0093] See also Figure 1-8 Based on the above embodiment, in another embodiment of the present invention, the smear plate 76 includes:

[0094] The smearing flap 761 is arranged below the solder paste storage cylinder 71 and is used for smearing the solder paste;

[0095] A plurality of adjustment balls 764 are installed below the inner wall of the solder paste storage cylinder 71;

[0096] The telescopic rod 762 is movably connected to the inner wall of the adjusting ball 764, and the bottom of the telescopic rod 762 is connected to the smear flap 761 for deflecting the smear flap 761;

[0097] Spring five 763, installed on the outer wall of the telescopic rod 762 and located inside the adjusting ball 764, is used to push the smear flap 761 to move downward;

[0098] The abutment rod 765 is connected to the top of the adjustment ball 764, and its top contacts the bottom of the movable block 716 through the ball, so as to push the movable block 716 upward.

[0099] Working principle: When the smear plate 76 moves, a reverse force is generated due to the contact with the steel plate 6. At this time, the smear flap 761 installed thereon will deflect in the direction of movement of the solder paste storage tube 71, and through the action of the set adjusting ball 764, a deflection around the adjusting ball 764 is generated, and at the same time, the smear flap 761 is pushed downward by the spring five 765, so that the smear flap 761 continues to contact the steel plate and achieves uniform smearing. At the same time, in the process of flipping, through the deflection movement around the adjusting ball 764 as the center of the circle, the resistance rod 765 is used to squeeze the movable block 716 upward, and it is reset under the action of the spring four 718, so that the movable block 716 moves, stirs the solder paste inside it, and prevents it from hardening.

[0100] See also Figure 1-8 In another embodiment of the present invention, based on the above embodiment, a rectangular hole is provided at the bottom of the inner wall of the coating box 4, and a steel plate 6 is placed inside the hole to assist in coating solder paste on the circuit board 5;

[0101] A plurality of grooves are provided at the bottom of the coating box 4, and a support rod 41 is movably connected therein, and one side of the support rod 41 is connected to the groove through a spring 42 so as to be pushed upward by the support rod 41.

[0102] Working principle: The support rod 41 is arranged to contact the front and rear sides of the circuit board 5 in the process of following the downward movement of the coating box 4, and press the spring 1 42 upward, thereby achieving sufficient resistance and further improving the limit fixation of the circuit board 5.

[0103] See also Figure 1-8 Based on the above embodiment, in another embodiment of the present invention, the fixing mechanism 3 includes:

[0104] A workbench 31 is connected to the inside of the work box 1;

[0105] Cylinder 1 34, connected to the inside of the workbench 31;

[0106] Two push blocks 35 are movably connected to the inner sides of the workbench 31 and are hinged to the telescopic ends of the cylinder 1 34 through connecting rods;

[0107] A U-shaped rod 36 is hinged to one side of the push block 35 through a pin and is located above the workbench 31;

[0108] A connecting rod 37, the middle of which is hinged on the U-shaped rod 36, and the two sides of which are respectively hinged with a push rod 1 38 and a push rod 2 39, wherein one side of the push rod 2 39 is hinged on the workbench 31 through a pin shaft;

[0109] One side of the push rod 38 is hinged to the limit block 310 through a pin, and the bottom of the limit block 310 is in contact with the top of the workbench 31;

[0110] The inner side of the limiting block 310 is arc-shaped for contacting the circuit board 5 .

[0111] Working principle: The cylinder 34 is set to work, pushing the connecting rod at its output end to push the two push blocks 35 to move, and then push the U-shaped rod 36 to move, and by changing the angle of the connecting rod 37, the angle of the push rod 38 is changed, thereby pushing the limit block 310 to move, and through its arc-shaped side to squeeze the circuit board 5, to achieve the fixation of the circuit board 5, so as to assist in the stable application of solder paste.

[0112] See also Figure 1-8Based on the above embodiment, in another embodiment of the present invention, the fixing mechanism 3 further includes:

[0113] A plurality of support springs 32 are arranged in the mounting grooves of the workbench 31;

[0114] The support plate 33 is connected to the top of the support spring 32 and is located in the mounting groove and moves up and down;

[0115] The circuit board 5 is placed above the supporting plate 33 .

[0116] Working principle: After placing the circuit board 5 on the support plate 33, the support plate 33 is pushed upward by the support spring 32, so that the circuit boards 5 of different sizes can be pushed upward in the installation groove, and at the same time, they can be limited and fixed by the fixing mechanism 3 to achieve auxiliary solder paste application.

[0117] See also Figure 1-8 Based on the above embodiments, the present invention provides an electronic component mounting method for intelligent manufacturing, which uses the above electronic component mounting equipment to manufacture electronic components, including the following steps:

[0118] Step 1: Place the circuit board 5 to be patched on top of the support plate 33, and use the fixing mechanism 3 to fix it on both sides to ensure that the solder paste is more stable when applied;

[0119] Step 2: Place the corresponding steel plate 6 into the coating box 4, and after placing it, push the entire coating box 4 downward through the work of the cylinder 3, and push the multiple support rods 41 downward to contact the circuit board 5, so as to fix the circuit board 5 from the front and rear sides;

[0120] Step 3: Push the cylinders 2 72 on both sides to perform telescopic work in turn, and at this time, the solder paste in the solder paste storage tube 71 is squeezed out synchronously, and the solder paste is applied through the application flap 761, so that the solder paste is evenly applied and passes through the holes on the steel plate 6 to the circuit board 5, thereby completing the solder paste application operation;

[0121] Step 4: Place the circuit board 5 coated with solder paste into a placement machine for electronic component placement.

[0122] The present invention provides an electronic component placement device and method for intelligent manufacturing. There are many methods and ways to implement the technical solution. The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention. All components not specified in this embodiment can be implemented by existing technologies.

Claims

1. An electronic component placement device for intelligent manufacturing, comprising a working box (1) and a protective door (2), wherein the protective door (2) is installed in the working box (1), characterized in that: Also includes: A circuit board (5) is arranged inside the working box (1) and is used to apply solder paste on the circuit board (5); A fixing mechanism (3) is arranged inside the working box (1) and is used to fix the circuit board (5); A coating box (4) is connected to the top of the inner wall of the working box (1) through a cylinder 3 and is used to coat solder paste on the circuit board (5); A coating mechanism (7), arranged in the coating box (4), for uniformly coating solder paste; Wherein, the smearing mechanism (7) comprises: Two solder paste storage cylinders (71), both sides of which are slidably connected to the inner wall of the coating box (4) via sliders, and are used to store solder paste; Two air cylinders (72) are respectively connected to the outer wall of the coating box (4), and the output ends are connected to the solder paste storage cylinder (71) for pushing the solder paste storage cylinder (71) to move; A plurality of fixing rods (73) are respectively connected to the front and rear sides of the inner walls of the two solder paste storage cylinders (71); A telescopic sleeve (75) is sleeved on the outer walls of the two fixed rods (73), and its interior is connected to the two fixed rods (73) via a second spring (74); A smearing plate (76) is installed below the solder paste storage cylinder (71) and is used to evenly spread the solder paste.

2. The electronic component placement equipment for intelligent manufacturing according to claim 1, characterized in that: The solder paste storage cylinder (71) comprises: A cover plate (711) is installed above the solder paste storage cylinder (71); An upper fixing plate (712), the bottom of which is connected to the top of the cover plate (711) via a spring three (713); A plurality of movable rods (714) movably passing through the cover plate (711) and connected to the bottom of the upper fixed plate (712); A push plate (715), connected to the bottom of the movable rod (714) and located inside the solder paste storage cylinder (71), for pushing the internal solder paste; A plurality of solder paste conduits (77) are connected to both sides of the outer wall of the solder paste storage cylinder (71) and are used to guide the solder paste out.

3. The electronic component placement equipment for intelligent manufacturing according to claim 2, characterized in that: The solder paste storage cylinder (71) further comprises: A movable block (716) is disposed inside the solder paste storage cylinder (71) and is used to move up and down to stir the solder paste to prevent the solder paste from hardening; A plurality of fixed columns (717) are fixedly connected to the bottom of the cover plate (711), and the other side of the fixed columns are inserted into the circular groove of the movable block (716); A plurality of springs (718) are disposed in the circular groove and connected to the movable block (716) and the fixed column (717); The push plates (715) are provided in two groups and are respectively arranged on both sides of the movable block (716) and are fitted with the outer walls of the solder paste storage cylinder (71) and the movable block (716).

4. The electronic component placement equipment for intelligent manufacturing according to claim 3, characterized in that: The smear plate (76) comprises: A smearing flap (761), arranged below the solder paste storage cylinder (71), for smearing solder paste; A plurality of adjustment balls (764) are installed below the inner wall of the solder paste storage cylinder (71); A telescopic rod (762) movably connected to the inner wall of the adjusting ball (764), the bottom of which is connected to the smear flap (761) for deflecting the smear flap (761); Spring five (763), installed on the outer wall of the telescopic rod (762) and located inside the adjusting ball (764), is used to push the smear flap (761) to move downward; The abutment rod (765) is connected to the top of the adjusting ball (764), and the top of the abutment rod (765) contacts the bottom of the movable block (716) through the round ball, so as to push the movable block (716) upward.

5. The electronic component placement equipment for intelligent manufacturing according to claim 4, characterized in that: The bottom of the inner wall of the coating box (4) is provided with a rectangular hole, and a steel plate (6) is placed inside the hole to assist in coating solder paste on the circuit board (5); The bottom of the coating box (4) is provided with a plurality of grooves, inside which a support rod (41) is movably connected, and one side of the support rod (41) is connected to the groove via a spring (42) so as to be pushed upward by the support rod (41).

6. The electronic component placement equipment for intelligent manufacturing according to claim 5, characterized in that: The fixing mechanism (3) comprises: A workbench (31) connected to the interior of the work box (1); Cylinder 1 (34), connected to the inside of the workbench (31); Two push blocks (35) are movably connected to the inner sides of the workbench (31) and are hinged to the telescopic ends of the cylinder (34) through connecting rods; A U-shaped rod (36) is hinged to one side of the push block (35) through a pin and is located above the workbench (31); A connecting rod (37), the middle of which is hinged on the U-shaped rod (36), and the two sides of which are respectively hinged with a push rod 1 (38) and a push rod 2 (39), wherein one side of the push rod 2 (39) is hinged on the workbench (31) through a pin shaft; One side of the push rod (38) is hinged to a limit block (310) through a pin shaft, and the bottom of the limit block (310) is in contact with the top of the workbench (31); The inner side of the limit block (310) is arranged in an arc shape, and is used to abut against the circuit board (5).

7. The electronic component placement equipment for intelligent manufacturing according to claim 6, characterized in that: The fixing mechanism (3) further comprises: A plurality of supporting springs (32) are arranged in the mounting groove of the workbench (31); A support plate (33) connected to the top of the support spring (32) and located in the mounting groove to move up and down; The circuit board (5) is placed above the support plate (33).

8. A method for mounting electronic components for intelligent manufacturing, using the electronic component mounting device as claimed in claim 7 to manufacture electronic components, characterized in that: The following steps are involved: Step 1: Place the circuit board (5) to be patched on top of the support plate (33), and use the fixing mechanism (3) to fix it on both sides to ensure that the solder paste is more stable when applied; Step 2: Place the corresponding steel plate (6) into the coating box (4), and after placing it, push the entire coating box (4) downward through the operation of the air cylinder 3, and push the multiple support rods (41) downward to contact the circuit board (5), so as to fix the circuit board (5) from both the front and rear sides; Step 3: Push the cylinders 2 (72) on both sides to perform telescopic work in turn, and at this time, the solder paste in the solder paste storage tube (71) is squeezed out synchronously, and the solder paste is applied through the application flap (761), so that the solder paste is evenly applied and passes through the holes on the steel plate (6) to the circuit board (5), thereby completing the solder paste application operation; Step 4: Place the circuit board (5) coated with solder paste into a placement machine for electronic component placement.

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