Display screen substrate, display device, preparation method of display device and display device

Abstract

The invention discloses a display screen substrate, a display device, a preparation method of the display device and a display device, and relates to the technical field of display, the display screen substrate comprises a first substrate, a light-emitting device layer and a common electrode layer, a plurality of first bonding structures arranged at intervals are embedded in the first substrate, and the first bonding structures are exposed on the bottom surface of the first substrate; the light-emitting device layer comprises at least three light-emitting unit layers; the light-emitting structure comprises a first electrode layer, a light-emitting layer and a second electrode layer which are sequentially stacked in the direction away from the first substrate, and the first electrode layer is electrically connected with the corresponding first bonding structure through a first conductive structure; the common electrode layer is arranged on the surface, away from the first substrate, of the light-emitting unit layer, and the second electrode layers are electrically connected with the common electrode layer through second conductive structures. According to the technical scheme, material waste during preparation of the display device can be reduced, and the display brightness of the display device is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display screen substrate, a display device and a preparation method thereof, and a display apparatus. Background Art

[0002] OLED (Organic Light Emitting Diode) display device is an organic thin film electroluminescent device, which is widely used in display devices such as televisions, mobile phones, computers, monitors and head-mounted display devices. In the related art, when manufacturing OLED display devices, electrodes, light-emitting layers and other functional layers are manufactured in sequence on a driving substrate provided with a driving circuit. Once any defect occurs in any process of forming each functional layer, the current driving substrate will also be wasted. Summary of the invention

[0003] The main purpose of the present invention is to provide a display screen substrate, a display device and a preparation method thereof, and a display apparatus, aiming to reduce material waste when preparing the display device and improve the display brightness of the display device.

[0004] To achieve the above object, the display screen substrate provided by the present invention comprises:

[0005] A first substrate, wherein a plurality of first bonding structures arranged at intervals are embedded in the first substrate, and the first bonding structures are exposed on the bottom surface of the first substrate; and

[0006] a light-emitting device layer, the light-emitting device layer being arranged on the first substrate and comprising at least three light-emitting unit layers emitting light of different colors, the light-emitting unit layer comprising a transparent insulating structure and a plurality of light-emitting structures arranged in the transparent insulating structure, and light-emitting regions of the light-emitting structures located in different light-emitting unit layers being arranged in a staggered manner;

[0007] The light emitting structure comprises a first electrode layer, a light emitting layer and a second electrode layer which are sequentially stacked in a direction away from the first substrate, and the first electrode layer is electrically connected to the corresponding first bonding structure through a first conductive structure; and

[0008] A common electrode layer is provided on a surface of the light-emitting unit layer away from the first substrate, and a plurality of the second electrode layers are electrically connected to the common electrode layer through second conductive structures.

[0009] In one embodiment, the first substrate includes a stacked base substrate and an insulating heat-insulating layer, and the first bonding structure is embedded in the base substrate;

[0010] The light emitting device layer is arranged on a surface of the insulating and heat-insulating layer away from the base substrate, and the display screen substrate further comprises a plurality of first conductive structures penetrating the insulating and heat-insulating layer, and two ends of the first conductive structures are respectively connected to the first electrode layer and the first bonding structure;

[0011] And / or, a first inorganic layer is provided on the bottom surface of the first substrate.

[0012] In one embodiment, the light-emitting structure further includes a pixel definition structure, the pixel definition structure encloses an opening area, and the first electrode layer and the light-emitting layer are both located in the opening area.

[0013] In one embodiment, the second electrode layer has a central portion covering the opening area and an edge portion located around the central portion, and the second conductive structure is connected to the edge portion;

[0014] And / or, the pixel definition structure overlaps with a projection portion of at least one pixel definition structure located in another light-emitting unit layer on the first substrate.

[0015] In one embodiment, the display screen substrate further includes a first encapsulation layer, and the first encapsulation layer is disposed on a surface of the common electrode layer away from the light-emitting unit layer.

[0016] In one embodiment, the first electrode layer includes a reflective electrode and a transparent electrode stacked in sequence, and the light-emitting layer is disposed on a surface of the transparent electrode away from the reflective electrode;

[0017] And / or, the light emitting device comprises a second encapsulation layer, and the second encapsulation layer is stacked on the second electrode layer.

[0018] The present invention further provides a display device, comprising a driving substrate and a display screen substrate as described in any of the above embodiments, wherein the driving substrate comprises a second substrate, a driving circuit embedded in the second substrate, and a plurality of second bonding structures, wherein the second bonding structures are electrically connected to the driving circuit and exposed on the top surface of the second substrate;

[0019] The surface of the display screen substrate provided with a plurality of first bonding structures is bonded to the top surface of the driving substrate, and the plurality of first bonding structures are connected to the plurality of second bonding structures in a one-to-one correspondence.

[0020] The present invention further provides a method for manufacturing a display device, wherein the display device is provided with a plurality of pixel units, each of the pixel units includes a first sub-pixel, a second sub-pixel and a third sub-pixel with different luminous colors, and the manufacturing method comprises the following steps:

[0021] Prepare a first substrate, wherein a plurality of first bonding structures and a plurality of first conductive vias penetrating from a top surface of the first substrate to the first bonding structures are embedded in the first substrate, and the plurality of first conductive vias correspond one-to-one to the plurality of first sub-pixels;

[0022] Preparing a plurality of the first sub-pixels and a first transparent medium structure covering the first substrate on the top surface of the first substrate to form a first light-emitting unit layer;

[0023] Prepare a plurality of second conductive vias penetrating from the top surface of the first transparent medium structure to the first bonding structure, wherein the plurality of second conductive vias correspond one-to-one to the plurality of second sub-pixels;

[0024] Prepare a plurality of the second sub-pixels and a second transparent medium structure covering the first light-emitting unit layer on the top surface of the first light-emitting unit layer to form a second light-emitting unit layer;

[0025] Prepare a plurality of third conductive vias penetrating from the top surface of the second transparent structure to the first bonding structure, wherein the plurality of third conductive vias correspond one-to-one to the plurality of third sub-pixels;

[0026] Prepare a plurality of the third sub-pixels and a third transparent medium structure covering the second light-emitting unit layer on the top surface of the second light-emitting unit layer to form a third light-emitting unit layer;

[0027] Prepare a plurality of fourth conductive vias penetrating from the top surface of the third light-emitting unit layer to each sub-pixel;

[0028] A common electrode layer is prepared on the top surface of the third light-emitting unit layer, and a display screen substrate is formed after packaging;

[0029] The display screen substrate and the driving substrate are bonded and connected, and a plurality of second bonding structures electrically connected to the driving circuit are arranged on the top surface of the driving substrate, and the plurality of second bonding structures are connected to the plurality of first bonding structures in a one-to-one correspondence.

[0030] In one embodiment, the step of preparing the first substrate comprises:

[0031] A plurality of grooves are formed on the top surface of the substrate;

[0032] Depositing a metal layer on the substrate to fill the groove to form a first bonding structure, and removing the metal material outside the groove;

[0033] An insulating heat-insulating layer is prepared on the base substrate, a connection hole penetrating to the first bonding structure is prepared in the area of ​​the insulating heat-insulating layer corresponding to the first sub-pixel, and a connecting metal is prepared in the connection hole to form a first conductive via, thereby completing the preparation of the first substrate.

[0034] In one embodiment, before the step of bonding the display substrate and the driving substrate, the method further includes:

[0035] The bottom surface of the display screen substrate is polished and thermally oxidized to expose the first bonding structure on the bottom surface of the display screen substrate.

[0036] In one embodiment, the connection metal in the first conductive via is formed by a physical vapor deposition process or an electroplating process;

[0037] and / or, the connection metal in the second conductive via is formed by an electroplating process;

[0038] and / or, the connection metal in the third conductive via is formed by an electroplating process;

[0039] And / or, the connection metal in the fourth conductive via is formed by an electroplating process.

[0040] In one embodiment, the steps of preparing each light-emitting unit layer include:

[0041] After preparing the first electrode layer, patterning is performed to form anodes of a plurality of sub-pixels;

[0042] After preparing the pixel definition layer, a patterning process is performed to form a pixel definition structure corresponding to each anode, and the anode is exposed in an opening area of ​​the pixel definition structure;

[0043] After sequentially preparing a light-emitting material layer, a second electrode layer and an inorganic encapsulation layer, a patterning process is performed, and the light-emitting material layer, the second electrode layer and the inorganic encapsulation layer on the anode and the pixel definition structure are retained to form a light-emitting layer, a cathode and an encapsulation layer of each sub-pixel, and the preparation of multiple sub-pixels is completed;

[0044] After the transparent medium structure is deposited, a planarization process is performed to complete the preparation of the light-emitting unit layer.

[0045] In one embodiment, the step of preparing the first electrode layer comprises:

[0046] A reflective electrode and a transparent electrode are sequentially deposited to form a first electrode layer.

[0047] In one embodiment, the step of preparing the driving substrate comprises:

[0048] Prepare a chip substrate, wherein the chip substrate is provided with a driving circuit and a plurality of electrical connection structures electrically connected to the driving circuit, wherein the electrical connection structures are exposed on the top surface of the second substrate;

[0049] After depositing a metal layer on the chip substrate, patterning is performed to form a plurality of second bonding structures corresponding to the plurality of electrical connection structures;

[0050] After the dielectric layer is deposited, polishing and planarization are performed to expose the plurality of the second bonding structures.

[0051] The present invention further provides a display device, comprising the display device as described in the above embodiments.

[0052] The technical solution of the present invention divides the display device into two parts, namely, a display screen substrate and a driving substrate. The display screen substrate is formed by manufacturing a light-emitting device layer on a first substrate, wherein a first bonding structure is provided in the first substrate; and a driving circuit and a second bonding structure electrically connected to the driving circuit are provided on the driving substrate. In this way, the display screen substrate and the driving substrate can be prepared separately, and then the display screen substrate and the driving substrate are connected, so that the first bonding structure therein is electrically connected to the second bonding structure, thereby electrically connecting the light-emitting structure to the driving circuit, and thus the display device can be formed. That is, by adopting the technical solution of the present invention, it is not necessary to directly manufacture structures such as electrodes and light-emitting layers on the driving substrate to form a light-emitting device layer, and the preparation processes of the display screen substrate and the driving substrate do not affect each other, and the other substrate does not need to be discarded due to defects in the preparation of one of the substrates, thereby reducing the waste of materials in the preparation of the display device and improving the production yield of the display device.

[0053] Furthermore, the light-emitting structures for emitting different colors of light are arranged in different light-emitting unit layers, respectively, without the need for color filters, which can improve light extraction efficiency and display brightness. Light-emitting structures of different light-emitting colors are made in sequence, and a laminated structure of multiple light-emitting unit layers is adopted. When preparing the light-emitting structure to be formed later, it will not affect the already formed light-emitting structure, thereby improving the preparation yield of the display screen substrate, and without the need for fine metal mask plates, which improves the convenience of preparing the light-emitting structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0055] Figure 1 A partial cross-sectional view of an embodiment of a display device provided by the present invention;

[0056] Figure 2 A partial cross-sectional view of an embodiment of a display screen substrate provided by the present invention;

[0057] Figure 3 for Figure 2 A cross-sectional view of a light emitting structure in a display screen substrate;

[0058] Figure 4 A state diagram of an unpolished bottom surface of an embodiment of a display screen substrate provided by the present invention;

[0059] Figure 5 A partial cross-sectional view of an embodiment of a driving substrate in a display device provided by the present invention.

[0060] Description of Figure Numbers:

[0061] 100, display device; 1, display screen substrate; 11, first substrate; 111, substrate substrate; 112, insulation and heat insulation layer; 113, first bonding structure; 12, light-emitting device layer; 121, light-emitting unit layer; 1211, first light-emitting unit layer; 1212, second light-emitting unit layer; 1213, third light-emitting unit layer; 122, common electrode layer; 123, second conductive structure; 1231, fourth conductive via;

[0062] 124, light emitting structure; 1241, first electrode layer; 1241a, reflective electrode; 1241b, transparent electrode; 1242, light emitting layer; 1243, second electrode layer; 1243a, center portion; 1243b, edge portion; 1244, pixel definition structure; 1245, second encapsulation layer; 125, transparent insulation structure; 1251, first transparent medium structure; 1252, second transparent medium structure; 1253, third transparent medium structure;

[0063] 13. first conductive structure; 131. first conductive via; 132. second conductive via; 133. third conductive via; 14. first packaging layer; 15. connecting electrode;

[0064] 2. driving substrate; 21. second substrate; 211. driving circuit layer; 212. dielectric layer; 22. top connection metal; 23. second bonding structure; 24. electrical connection structure.

[0065] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0066] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0067] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0068] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0069] The present invention provides a display screen substrate 1 applied to a display device 100 . The display device 100 further includes a driving substrate 2 for electrically connecting to the display screen substrate 1 .

[0070] See also Figure 1 , Figure 2 and Figure 5 In one embodiment of the present invention, the display screen substrate 1 includes a first substrate 11, a light-emitting device layer 12 and a common electrode layer 122. The first substrate 11 is embedded with a plurality of first bonding structures 113 arranged at intervals, and the first bonding structures 113 are exposed on the bottom surface of the first substrate 11; the light-emitting device layer 12 is arranged on the first substrate 11, and includes at least three light-emitting unit layers 121 emitting light of different colors, and the light-emitting unit layer 121 includes a transparent insulating structure 125 and a plurality of light-emitting structures 124 arranged in the transparent insulating structure 125, and the light-emitting units 121 are arranged in different light-emitting units. The light-emitting areas of the light-emitting structure 124 of the element layer 121 are staggered; the light-emitting structure 124 includes a first electrode layer 1241, a light-emitting layer 1242 and a second electrode layer 1243 which are stacked in sequence along a direction away from the first substrate 11, and the first electrode layer 1241 is electrically connected to the corresponding first bonding structure 113 through the first conductive structure 13; the common electrode layer 122 is arranged on the surface of the light-emitting unit layer 121 away from the first substrate 11, and a plurality of second electrode layers 1243 are electrically connected to the common electrode layer 122 through the second conductive structure 123 respectively.

[0071] In the embodiment of the present application, the display device 100 includes a display screen substrate 1 and a driving substrate 2. A plurality of light-emitting structures 124 are provided in the display screen substrate 1, and a driving circuit is provided in the driving substrate 2. When the display screen substrate 1 and the driving substrate 2 are assembled to form the display device 100, each light-emitting structure 124 is electrically connected to the driving circuit, so that electrical signal transmission is achieved between the driving substrate 2 and the display screen substrate 1, and then each light-emitting structure 124 can be controlled to emit light, so that the display screen substrate 1 can display a picture.

[0072] Specifically, the display screen substrate 1 includes a first substrate 11 as a bearing base and a light-emitting device layer 12 disposed on the surface of the first substrate 11. A plurality of first bonding structures 113 are embedded in the first substrate 11. The first bonding structures 113 may be made of aluminum or other metal materials. One side of the first bonding structure 113 is exposed on the bottom surface of the first substrate 11, and is used to be electrically connected to the second bonding structure 23 exposed on the surface of the driving substrate 2. Optionally, the other end of the first bonding structure 113 may be exposed on the top surface of the first substrate 11, so as to be electrically connected to the light-emitting structure 124 in the light-emitting device layer 12; or one end of the first bonding structure 113 away from the bottom surface of the first substrate 11 may be accommodated inside the first substrate 11, and a first conductive structure 13 penetrating from the top surface of the first substrate 11 to the inside of the first substrate 11 may be provided to connect the light-emitting structure 124 and the first bonding structure 113. In addition, the first substrate 11 can be a single-layer plate-like structure, such as a silicon substrate made of single-crystal silicon or polycrystalline silicon, or a glass substrate made of materials such as silicon oxide; it can also be a structure with two or more layers stacked to form the first substrate 11, for example, the first substrate 11 includes a base substrate 111 and an insulating and heat-insulating layer 112 arranged on the top surface of the base substrate 111 or other functional layers that meet other performance requirements; the first bonding structure 113 can be arranged through each layer of the first substrate 11, or it can be only embedded in the base substrate 111.

[0073] Each functional layer of the light-emitting device layer 12 can be prepared by evaporation, inkjet printing, vapor deposition, etc. A plurality of light-emitting structures 124 are provided in the light-emitting device layer 12. The light-emitting structure 124 includes a first electrode layer 1241, a light-emitting layer 1242, and a second electrode layer 1243 which are stacked. The first electrode layer 1241 can be a single metal layer, or two or more metal layers can be provided to form the first electrode layer 1241. For example, a stacked reflective electrode 1241a and a transparent electrode 1241b can be provided in the following embodiment; the light-emitting layer 1242 is provided on the surface of the first electrode layer 1241 which is not facing the first substrate 11, and the light-emitting layer 1242 is an organic material layer; the second electrode layer 1243 is provided on the surface of the light-emitting layer 1242 which is not facing the first electrode layer 1241, and can be a single metal layer, or two or more metal layers. Among them, the first electrode layer 1241 and the second electrode layer 1243 correspond to the anode and the cathode respectively. When voltage is applied to the first electrode layer 1241 and the second electrode layer 1243, the anode attracts electrons released from the cathode, and at the same time the anode injects holes into the cathode side. The holes and electrons combine in the light-emitting layer 1242, so that the electrons fill the holes. In this process, the organic molecules return to the ground state from the excited state, release energy and reflect it in the form of photons, thereby generating light.

[0074] In the embodiment of the present application, at least three light-emitting structures 124 that can emit light of different colors are arranged in the display screen substrate 1 to realize full-color display; specifically, the light-emitting structures 124 in the light-emitting device layer 12 at least include a plurality of first sub-pixels that can emit light of a first color, a plurality of second sub-pixels that can emit light of a second color, and a third sub-pixel that can emit light of a third color, for example, a plurality of red sub-pixels, green sub-pixels, and blue sub-pixels can be arranged respectively; by controlling the light-emitting brightness of each light-emitting structure 124 to mix and form light of various colors, the effect of displaying a color image is realized. Optionally, the display screen substrate 1 can also be provided with a plurality of white sub-pixels to increase the brightness.

[0075] Several light-emitting structures 124 can be combined into a plurality of pixel units, each pixel unit is composed of at least three light-emitting structures 124 adjacent to the light-emitting area, each light-emitting structure 124 is used as a sub-pixel, and the plurality of light-emitting structures 124 combined into the same pixel unit include at least three light-emitting structures 124 with different light-emitting colors; for example, a pixel unit can be composed of a red light sub-pixel, a green light sub-pixel and a blue light sub-pixel adjacent to the light-emitting area; a pixel unit can also be composed of a red light sub-pixel, a green light sub-pixel, a blue light sub-pixel and a white light sub-pixel; in addition, two or more sub-pixels emitting the same color light in a pixel unit can also be set, which is not limited here. Compared with the display structure using a white organic light-emitting layer plus a color film, the light output efficiency will not be affected and the brightness of the display device 100 will not be reduced due to the setting of the color film, which is conducive to improving the brightness of the display device 100 and improving the display effect.

[0076] In the present embodiment, the light-emitting structures 124 for emitting light of different colors are respectively arranged in different light-emitting unit layers 121; it can be understood that the light-emitting structures 124 of different light-emitting colors are manufactured in sequence, and a stacked structure of multiple light-emitting unit layers 121 is adopted. When preparing the light-emitting structure 124 formed later, it will not affect the already formed light-emitting structure 124, thereby improving the preparation yield of the display substrate 1, and there is no need to use a fine metal mask plate, thereby improving the convenience of preparing the light-emitting structure 124.

[0077] Specifically, taking the setting of three-layer light-emitting unit layer 121 as an example, the three-layer light-emitting unit layer 121 are defined as a first light-emitting unit layer 1211, a second light-emitting unit layer 1212 and a third light-emitting unit layer 1213; a plurality of light-emitting structures 124 capable of emitting a first color light are set in the first light-emitting unit layer 1211 as a first sub-pixel, a plurality of light-emitting structures 124 capable of emitting a second color light are set in the second light-emitting unit layer 1212 as a second sub-pixel, and a plurality of light-emitting structures 124 capable of emitting a third color light are set in the third light-emitting unit layer 1213 as a third sub-pixel. A plurality of light-emitting structures 124 capable of emitting light of a first color are first prepared on the top surface of the first substrate 11 by evaporation, exposure, development, etching, etc., and then a transparent insulating structure 125 is deposited on the top surface of the first substrate 11 to fill and cover the spaces between the light-emitting structures 124 to form a first light-emitting unit layer 1211. After the light-emitting unit layer 121 is planarized, a plurality of light-emitting structures 124 capable of emitting light of a second color are prepared on the top surface of the first light-emitting unit layer 1211, and then a transparent insulating structure 125 is filled to fill and cover the spaces between the light-emitting structures 124 to form a The second light-emitting unit layer 1212 is formed, and after the second light-emitting unit layer 1212 is flattened, a plurality of light-emitting structures 124 that can emit a third color light are prepared, and a transparent insulating structure 125 is deposited to form a third light-emitting unit layer 121; it can be understood that the light-emitting area of ​​the light-emitting structure 124 in each light-emitting unit layer 121 and the light-emitting area of ​​the light-emitting structure 124 in any other light-emitting unit layer 121 are misaligned on the projection of the first substrate 11 to prevent the light-emitting area of ​​the light-emitting structure 124 from being blocked by the light-emitting structure 124 in the light-emitting unit layer 121 located on its light-emitting side. Among them, the transparent insulating structure 125 can be made of materials such as silicon dioxide (SiO2) or silicon nitrogen polymer (SiNx), which has good insulation and low thermal conductivity.

[0078] It should be noted that the transparent insulating structure 125 in the two stacked light-emitting unit layers 121 can be made of the same material or different materials. When made of the same material, there is no obvious boundary between the two adjacent transparent insulating structures 125. The figure is only shown to facilitate the distinction between the light-emitting unit layers 121.

[0079] In this embodiment, the first electrode layer 1241 in the light emitting structure 124 is connected to the corresponding first bonding structure 113 in the first substrate 11 through the first conductive structure 13. Optionally, the first conductive structure 13 can be set as a metal hole, that is, a through hole with a metal layer on the hole wall; the first conductive structure 13 can also be a conductive column or a conductive structure of other shapes located between the first electrode layer 1241 and the first bonding structure 113. Specifically, for the light emitting structure 124 in the first light emitting unit layer 1211 stacked on the top surface of the first substrate 11, a first conductive structure 13 extending from the top surface of the first substrate 11 to the first bonding structure 113 can be set, so that the first electrode layer 1241 in the first light emitting unit layer 1211 is electrically connected to the corresponding first bonding structure 113. For the second light-emitting unit layer 1212 stacked on the top surface of the first light-emitting unit layer 1211, a first conductive structure 13 extending from the top surface of the first light-emitting unit layer 1211 to the first bonding structure 113 may be provided, so that the first electrode layer 1241 in the second light-emitting unit layer 1212 is electrically connected to the corresponding first bonding structure 113. For the third light-emitting unit layer 1213 stacked on the top surface of the second light-emitting unit layer 1212, a first conductive structure 13 extending from the top surface of the second light-emitting unit layer 1212 to the first bonding structure 113 may be provided, so that the first electrode layer 1241 in the second light-emitting unit layer 1212 is electrically connected to the corresponding first bonding structure 113.

[0080] In this embodiment, a common electrode layer 122 is disposed on the top surface of the light-emitting unit layer 121 located at the top, and the common electrode layer 122 may be an indium zinc oxide (IZO) film; the common electrode layer 122 is electrically connected to the second electrode layer 1243 of the light-emitting structure 124 in each light-emitting unit layer 121, so that the second electrode layer 1243 of each light-emitting structure 124 is interconnected and conductive, so that the display screen substrate 1 has a common cathode structure. Among them, a second conductive structure 123 may be disposed to connect the common electrode layer 122 and the second electrode layer 1243 in the light-emitting unit layer 121 spaced apart from the common electrode layer 122. The second electrode layer 1243 in the light-emitting unit layer 121 in contact with the common electrode layer 122 can be directly in contact with the common electrode layer 122 and electrically connected to the common electrode layer 122, or a part of the transparent insulating structure 125 in the light-emitting unit layer 121 can be covered on the second electrode layer 1243, and a second conductive structure 123 penetrating the transparent insulating structure 125 is provided to connect the common electrode layer 122 and the second electrode layer 1243. Optionally, the second conductive structure 123 can be provided as a metal hole, that is, a through hole of a metal layer is provided on the hole wall; the second conductive structure 123 can also be a conductive column or other conductive structure of a shape located between the second electrode layer 1243 and the common electrode layer 122, and the second conductive structure 123 can be made of materials such as indium tin oxide (ITO) or indium zinc oxide (IZO). Optionally, a connecting electrode 15 electrically connected to the common electrode layer 122 is provided on the side of the display screen substrate 1, so that the common electrode layer 122 is connected to the control circuit.

[0081] The driving substrate 2 includes a second substrate 21 and a driving circuit and a second bonding structure 23 disposed on the second substrate 21. The second bonding structure 23 is exposed on the top surface of the second substrate 21 and is used to connect with the first bonding structure 113 of the display screen substrate 1. The second substrate 21 can be a single-layer structure, in which the driving circuit and the second bonding structure 23 are disposed on the same layer; or a combination structure of two or more layers, for example, the driving circuit and the second bonding structure 23 can be disposed in the driving circuit layer 211 and the dielectric layer 212, respectively, which is not limited here.

[0082] When preparing the display device 100, a display screen substrate 1 and a driving substrate 2 are respectively manufactured, and the display screen substrate 1 is bonded to the driving substrate 2. The first bonding structures 113 exposed on the surface of the first substrate 11 of the display screen substrate 1 are connected one by one with the second bonding structures 23 exposed on the surface of the second substrate 21 of the driving substrate 2, so that each light-emitting structure 124 in the display screen substrate 1 is electrically connected to the driving circuit in the driving substrate 2 through the connection between the first bonding structure 113 and the second bonding structure 23, so that each light-emitting structure 124 can receive the electrical signal of the driving circuit and emit light. The first bonding structure 113 and the second bonding structure 23 can be connected by atomic diffusion bonding. In some embodiments, the first bonding structure 113 and the second bonding structure 23 can also be electrically connected by conductive glue or other connection methods. Optionally, the first substrate 11 and the second substrate 21 can be bonded with insulating adhesive in the area outside the first bonding structure 113 and the second bonding structure 23, or the first substrate 11 and the second substrate 21 can be made of inorganic non-metallic materials, or inorganic non-metallic material layers are respectively arranged only on the contact surfaces of the first substrate 11 and the second substrate 21, for example, a first inorganic layer is arranged on the bottom surface of the first substrate 11, and a second inorganic layer is arranged on the top surface of the second substrate 21. For example, silicon dioxide inorganic layers can be respectively arranged on the surfaces of the first substrate 11 and the second substrate 21. In this arrangement, when the display screen substrate 1 and the drive substrate 2 are bonded, hot pressing or other methods can be used to generate chemical bond recombination between the first inorganic layer and the second inorganic layer, thereby connecting the first substrate 11 and the second substrate 21.

[0083] That is, the technical solution of the present invention divides the display device 100 into two parts, namely, a display screen substrate 1 and a driving substrate 2. The display screen substrate 1 is formed by manufacturing a light-emitting device layer 12 on a first substrate 11, wherein a first bonding structure 113 is provided in the first substrate 11; and a driving circuit and a second bonding structure 23 electrically connected to the driving circuit are provided on the driving substrate 2. In this way, the display screen substrate 1 and the driving substrate 2 can be prepared separately, and then the display screen substrate 1 and the driving substrate 2 are connected, so that the first bonding structure 113 therein is electrically connected to the second bonding structure 23, thereby electrically connecting the light-emitting structure 124 to the driving circuit, and thus the display device 100 can be formed. That is, by adopting the technical solution of the present invention, it is not necessary to directly manufacture structures such as electrodes and a light-emitting layer 1242 on the driving substrate 2 to form the light-emitting device layer 12, and the preparation processes of the display screen substrate 1 and the driving substrate 2 do not affect each other, and the other substrate does not need to be discarded due to a defect in the preparation of one substrate, thereby reducing the waste of materials in the preparation of the display device 100 and improving the production yield of the display device 100.

[0084] Furthermore, the light emitting structures 124 for emitting light of different colors are respectively arranged in different light emitting unit layers 121; no color filter is required, which can improve the light extraction efficiency and display brightness. The light emitting structures 124 of different light emitting colors are sequentially manufactured, and a stacked structure of multiple light emitting unit layers 121 is adopted. When preparing the light emitting structure 124 formed later, it will not affect the already formed light emitting structure 124, thereby improving the manufacturing yield of the display screen substrate 1, and there is no need to use a fine metal mask plate, thereby improving the convenience of preparing the light emitting structure 124.

[0085] See also Figure 2 In one embodiment, the first substrate 11 includes a stacked base substrate 111 and an insulating heat-insulating layer 112, and a first bonding structure 113 is embedded in the base substrate 111. The light-emitting device layer 12 is provided on a surface of the insulating heat-insulating layer 112 that is away from the base substrate 111, and the display screen substrate 1 also includes a plurality of first conductive structures 13 penetrating the insulating heat-insulating layer 112, and two ends of the first conductive structure 13 are respectively connected to the first electrode layer 1241 and the first bonding structure 113.

[0086] In this embodiment, the base substrate 111 can be an insulating substrate structure made of silicon wafer or other materials, and the insulating heat-insulating layer 112 can be made of materials such as silicon dioxide (SiO2) or silicon nitrogen polymer (SiNx), so that it has good insulation and low thermal conductivity. The first bonding structure 113 is embedded in the base substrate 111, and is spaced apart from the light-emitting device layer 12 by the insulating heat-insulating layer 112; in this way, when the display screen substrate 1 is bonded to the drive substrate 2, the insulating heat-insulating layer 112 can reduce the heat transferred to the light-emitting device layer 12 during bonding, thereby reducing the risk of damage to the display screen substrate 1 during the bonding process. Optionally, the insulating heat-insulating layer 112 can be formed on the surface of the base substrate 111 by chemical vapor deposition or other methods; in addition, the thickness of the insulating heat-insulating layer 112 can be 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, and any value between 5μm and 10μm, which is not limited here.

[0087] In one embodiment, a first inorganic layer (not shown) is disposed on the bottom surface of the first substrate 11 .

[0088] In this embodiment, a first inorganic layer is disposed on the bottom surface of the first substrate 11, and the first bonding structure 113 is exposed from the first inorganic layer. With the provision of the first inorganic layer, when the display screen substrate 1 and the driving substrate 2 are bonded, chemical bonds between the first inorganic layer and the second inorganic layer disposed on the top surface of the driving substrate 2 can be reorganized by means of heat pressing or the like, so that the first substrate 11 and the second substrate 21 are bonded, so that the display screen substrate 1 and the driving substrate 2 have a high connection strength, and the overall structural stability and performance stability of the display device 100 are improved. Among them, the first inorganic layer can be a silicon dioxide inorganic layer. Optionally, a silicon wafer can be used to make a portion of the first substrate 11 for embedding the first bonding structure 113. At this time, a silicon dioxide inorganic layer generated by thermal oxidation is formed on the bottom surface of the silicon wafer as the first inorganic layer. The thickness of the silicon dioxide inorganic layer can be 0.1 μm, 0.2 μm, 0.3 μm, and any value between 0.1 μm and 0.3 μm, which is not limited here.

[0089] Combined with reference Figure 2 and Figure 4 Optionally, a silicon substrate with a relatively large thickness can be used as the base substrate 111. After the preparation of the display screen substrate 1 is completed, the bottom surface of the base substrate 111 is polished and thinned before the display screen substrate 1 is bonded to the drive substrate 2, and then a thermal oxidation process is performed to generate oxide on the surface layer to form a silicon dioxide inorganic layer, and finally a secondary exposure is performed to expose the first bonding structure 113. For example, a silicon substrate with a thickness of about 0.5mm to 0.7mm is used, and before the display screen substrate 1 is bonded to the drive substrate 2, a polishing and thinning process and a thermal oxidation process are performed to thin the silicon substrate to about 0.3mm. At this time, the first bonding structure 113 is exposed on the bottom surface of the display screen substrate 1, and the surface layer of the base substrate 111 is a silicon dioxide inorganic layer generated by thermal oxidation as the first inorganic layer in the aforementioned embodiment, with a thickness of about 0.1um to 0.3um, which is mainly used for bonding between inorganic layers.

[0090] See also Figure 2 and Figure 3 In one embodiment, the light emitting structure 124 further includes a pixel definition structure 1244 , and the pixel definition structure 1244 encloses an opening area, and the first electrode layer 1241 and the light emitting layer 1242 are both located in the opening area.

[0091] In this embodiment, the pixel definition structure 1244 defines the light-emitting area of ​​each light-emitting structure 124, and the pixel definition structure 1244 encloses an opening area for accommodating the first electrode layer 1241, the light-emitting layer 1242 and other functional layers; the pixel definition structure 1244 can separate the light-emitting layer 1242 and the first electrode layer 1241 from the transparent insulating structure 125, and can avoid affecting the light-emitting layer 1242 and the first electrode layer 1241 when depositing the transparent insulating structure 125. Optionally, the inner wall of the opening area formed by the pixel definition structure 1244 has a slope angle, which helps to improve the aperture ratio of the display device 100, that is, the ratio of the area that can display an effective image to the entire display panel area is increased, thereby improving the display efficiency.

[0092] See also Figure 3 In one embodiment, the second electrode layer 1243 has a central portion 1243a covering the opening area and an edge portion 1243b located around the central portion 1243a, and the second conductive structure 123 is connected to the edge portion 1243b.

[0093] In this embodiment, the central portion 1243a of the second electrode layer 1243 is located in the opening area enclosed by the pixel definition structure 1244, and at least a portion of the light-emitting layer 1242 is located between the central portion 1243a and the first electrode layer 1241. When a voltage is applied to the first electrode layer 1241 and the second electrode layer 1243, the opening area is the light-emitting area; the edge portion 1243b of the second electrode layer 1243 is located above the pixel definition structure 1244, and can be directly stacked on the pixel definition structure 1244, or a portion of the light-emitting layer 1242 can be stacked on the pixel definition structure 1244. At this time, the edge portion 1243b of the second electrode layer 1243 is stacked on the portion of the light-emitting layer 1242.

[0094] In this embodiment, the second conductive structure 123 is connected to the edge portion 1243b of the second electrode layer 1243, and the projection of the second conductive structure 123 on the second electrode layer 1243 falls on the edge portion 1243b. This arrangement can reduce the influence of the second conductive structure 123 on the outward light of the light-emitting structure 124, thereby improving the display effect of the display device 100.

[0095] See also Figure 2 In one embodiment, the pixel definition structure 1244 overlaps with at least one pixel definition structure 1244 located in another light emitting unit layer 121 at a projection portion on the first substrate 11 .

[0096] In this embodiment, the pixel definition structures 1244 in two light-emitting structures 124 located in different light-emitting unit layers 121 are partially overlapped. This arrangement can shorten the distance between the projections of the light-emitting areas of the two light-emitting structures 124 on the first substrate 11, thereby making the distance between the light-emitting areas of each light-emitting structure 124 closer, which is beneficial to increasing the number and density of the light-emitting structures 124 in the display screen substrate 1, improving the resolution and clarity of the display device 100, and improving the display effect.

[0097] See also Figure 2 In one embodiment, the display screen substrate 1 further includes a first encapsulation layer 14 , and the first encapsulation layer 14 is disposed on a surface of the common electrode layer 122 away from the light emitting unit layer 121 .

[0098] In this embodiment, the display substrate 1 further includes a first packaging layer 14 disposed on the top surface of the common electrode layer 122 . The first packaging layer 14 can be formed of an inorganic thin film packaging layer using an inorganic insulating material, which can protect the light-emitting device layer 12 and reduce the risk of damage to the light-emitting device layer 12 .

[0099] See also Figure 3 In one embodiment, the first electrode layer 1241 includes a reflective electrode 1241a and a transparent electrode 1241b which are stacked in sequence, and the light-emitting layer 1242 is disposed on a surface of the transparent electrode 1241b away from the reflective electrode 1241a.

[0100] In this embodiment, the first electrode layer 1241 includes a reflective electrode 1241a and a transparent electrode 1241b. The reflective electrode 1241a can be made of materials such as Al or TiN. Optionally, the thickness of the reflective electrode 1241a can be 60nm, 70nm, 80nm, 90nm, 100nm or any value between 60nm and 100nm. Of course, it can also be a similar value outside of 60nm to 100nm, which is not limited here. The provision of the reflective electrode 1241a can make part of the light emitted from the light-emitting layer 1242 toward the side of the first electrode layer 1241 be reflected through the reflective electrode 1241a toward the side of the second electrode layer 1243 and thus emitted outward, thereby improving the light utilization rate and light extraction efficiency, which is beneficial to improving the light brightness of the display device 100. The transparent electrode 1241b can be made of indium tin oxide (ITO) or other conductive transparent materials, and its thickness can be 10nm, 20nm, 30nm, and any value between 10nm and 30nm. Of course, it can also be a value close to 10nm and 30nm, which is not limited here. The two layers of electrodes are arranged to form the first electrode layer 1241, which can increase the resistance of the first electrode layer 1241, prevent the device from being damaged or overheated due to excessive current, and can also reduce parasitic capacitance and improve light uniformity.

[0101] See also Figure 3 In one embodiment, the light-emitting device includes a second encapsulation layer 1245, and the second encapsulation layer 1245 is stacked on the second electrode layer 1243. Optionally, the second encapsulation layer 1245 can be a single-layer film layer, or a two-layer or more encapsulation structure; the second encapsulation layer 1245 can be formed of materials such as aluminum oxide (Al2O3) and silicon nitride polymer (SiNx); in addition, the thickness of the second encapsulation layer 1245 can be 1μm, 2μm, or any value between 1μm and 2μm, which is not limited here. The provision of the second encapsulation layer 1245 can protect the second electrode layer 1243, the light-emitting layer 1242, and other functional layers of the light-emitting structure 124, and reduce the risk of damage.

[0102] See also Figure 1 and Figure 5 The present invention further proposes a driving substrate 2, which includes a second substrate 21, a driving circuit embedded in the second substrate 21 and a plurality of second bonding structures 23, wherein the second bonding structures 23 are electrically connected to the driving circuit and exposed on the surface of the second substrate 21.

[0103] The driving substrate 2 proposed in the present invention is used to form a display device 100 in combination with a display screen substrate 1. The specific structure of the display screen substrate 1 refers to any of the above-mentioned embodiments and will not be described in detail here. The driving substrate 2 includes a second substrate 21 and a driving circuit and a second bonding structure 23 provided on the second substrate 21. The second bonding structure 23 can be made of aluminum or other metal materials. The second bonding structure 23 is exposed on the top surface of the second substrate 21 and is used to connect with the first bonding structure 113 of the display screen substrate 1. Among them, the second substrate 21 can be a single-layer structure, and the driving circuit and the second bonding structure 23 are arranged on the same layer structure, such as a silicon substrate made of single crystal silicon or polycrystalline silicon, or a glass substrate made of silicon oxide or other materials. The second substrate 21 can also be set as a combination structure of two or more layers, for example, the second substrate 21 includes a driving circuit layer 211 provided with a driving circuit and a dielectric layer 212 provided with a second bonding structure 23, and the second bonding structure 23 is formed on the surface of the prepared driving circuit layer 211.

[0104] When preparing the display device 100, a display screen substrate 1 and a driving substrate 2 are respectively manufactured, and the display screen substrate 1 is bonded to the driving substrate 2. A plurality of first bonding structures 113 of the display screen substrate 1 exposed on the surface of the first substrate 11 are connected one-to-one with a plurality of second bonding structures 23 of the driving substrate 2 exposed on the surface of the second substrate 21, so that each light-emitting structure 124 in the display screen substrate 1 is electrically connected to the driving circuit in the driving substrate 2 through the connection between the first bonding structure 113 and the second bonding structure 23, so that each light-emitting structure 124 can receive the electrical signal of the driving circuit and emit light.

[0105] Among them, the first bonding structure 113 and the second bonding structure 23 can be connected by atomic diffusion bonding. In some embodiments, the first bonding structure 113 and the second bonding structure 23 can also be electrically connected by conductive glue or other connection methods. Optionally, the first substrate 11 and the second substrate 21 can be bonded by insulating glue in the area outside the first bonding structure 113 and the second bonding structure 23, or the first substrate 11 and the second substrate 21 can be made of inorganic non-metallic materials, or only inorganic non-metallic material layers are respectively arranged on the contact surfaces of the first substrate 11 and the second substrate 21, for example, the first inorganic layer is arranged on the bottom surface of the first substrate 11, and the second inorganic layer is arranged on the top surface of the second substrate 21, for example, silicon dioxide inorganic layers can be respectively arranged on the surfaces of the first substrate 11 and the second substrate 21. In this arrangement, when the display screen substrate 1 and the drive substrate 2 are bonded, hot pressing or other methods can be used to generate chemical bond recombination between the first inorganic layer and the second inorganic layer, so that the first substrate 11 and the second substrate 21 are connected.

[0106] See also Figure 1 and Figure 5 In one embodiment, the second substrate 21 includes a driving circuit layer 211 and a dielectric layer 212, and the driving circuit layer 211 is provided with a driving circuit; the dielectric layer 212 is provided on the surface of the driving circuit layer 211, and the second bonding structure 23 is embedded in the dielectric layer 212; the driving substrate 2 also includes a plurality of electrical connection structures 24, and the two ends of the electrical connection structure 24 are respectively electrically connected to the driving circuit and the corresponding second bonding structure 23.

[0107] In this embodiment, the second substrate 21 includes a driving circuit layer 211 in which a driving circuit is provided and a dielectric layer 212 provided on the surface of the driving circuit layer 211. The second bonding structure 23 is embedded in the dielectric layer 212. The second bonding structure 23 is connected to the top-layer connection metal 22 of the driving circuit through an electrical connection structure 24 penetrating the driving circuit layer 211. The electrical connection structure 24 may be a conductive via. The dielectric layer 212 may be made of corresponding materials according to performance requirements. For example, the dielectric layer 212 may be formed of silicon dioxide (SiO2) to have good insulation and heat insulation properties, thereby preventing heat from being transferred to the light-emitting device layer 12 during bonding, thereby reducing the risk of damage to the driving circuit during the bonding process. In addition, the dielectric layer 212 may be formed of silicon dioxide (SiO2) as the second inorganic layer in the following embodiment, so that when the display screen substrate 1 and the driving substrate 2 are bonded, the second inorganic layer and the first inorganic layer on the bottom surface of the display screen substrate 1 are chemically recombined to improve the connection strength.

[0108] In one embodiment, the second inorganic layer is provided on the top surface of the second substrate 21. In this embodiment, the first inorganic layer is provided on the bottom surface of the first substrate 11, and the first bonding structure 113 is exposed from the first inorganic layer. The first inorganic layer is provided, when the display screen substrate 1 and the drive substrate 2 are bonded, chemical bonds between the first inorganic layer and the second inorganic layer provided on the top surface of the drive substrate 2 can be reorganized by hot pressing or the like, so that the first substrate 11 and the second substrate 21 are bonded, so that the display screen substrate 1 and the drive substrate 2 have a higher connection strength, and the overall structural stability and performance stability of the display device 100 are improved. Among them, the second inorganic layer can be a silicon dioxide inorganic layer.

[0109] Optionally, the second organic layer and the dielectric layer 212 may have the same structure, or the dielectric layer 212 and the second organic layer may be formed of two materials and stacked.

[0110] See also Figure 1 The present invention further provides a display device 100, which includes a display screen substrate 1 and a driving substrate 2. The specific structures of the display screen substrate 1 and the driving substrate 2 refer to any of the aforementioned embodiments. The surface of the display screen substrate 1 having a plurality of first bonding structures 113 is bonded to the top surface of the driving substrate 2 having a plurality of second bonding structures 23, and the plurality of first bonding structures 113 are connected to the plurality of second bonding structures 23 in a one-to-one correspondence.

[0111] In this embodiment, the display device 100 includes a display screen substrate 1 and a driving substrate 2 connected to each other, and the specific structures of the display screen substrate 1 and the driving substrate 2 refer to the above embodiment. The display device 100 can be applied to mobile phones, tablet computers, laptop computers, desktop monitors, televisions, and display devices such as AR (Augmented Reality) glasses, VR (Virtual Reality) glasses, and MR (Mixed Reality) glasses. Since the display device 100 proposed by the present invention adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0112] The present invention also provides a method for manufacturing a display device 100, the method comprising the following steps:

[0113] Step S1, preparing a first substrate 11, wherein a plurality of first bonding structures 113 and a plurality of first conductive vias 131 penetrating from the top surface of the first substrate 11 to the first bonding structures 113 are embedded in the first substrate 11, wherein the plurality of first conductive vias 131 correspond one-to-one to the plurality of first sub-pixels;

[0114] Step S2, preparing a plurality of first sub-pixels on the top surface of the first substrate 11 and a first transparent medium structure 1251 covering the first substrate 11 to form a first light-emitting unit layer 1211;

[0115] Step S3, preparing a plurality of second conductive vias 132 penetrating from the top surface of the first transparent medium structure 1251 to the first bonding structure 113, wherein the plurality of second conductive vias 132 correspond one-to-one to the plurality of second sub-pixels;

[0116] Step S4, preparing a plurality of second sub-pixels on the top surface of the first light-emitting unit layer 1211 and a second transparent medium structure 1252 covering the first light-emitting unit layer 1211 to form a second light-emitting unit layer 1212;

[0117] Step S5, preparing a plurality of third conductive vias 133 penetrating from the top surface of the second transparent structure to the first bonding structure 113, wherein the plurality of third conductive vias 133 correspond one-to-one to the plurality of third sub-pixels;

[0118] Step S6, preparing a plurality of third sub-pixels on the top surface of the second light-emitting unit layer 1212 and a third transparent medium structure 1253 covering the second light-emitting unit layer 1212 to form a third light-emitting unit layer 1213;

[0119] Step S7, preparing a plurality of fourth conductive vias 1231 penetrating from the top surface of the third light-emitting unit layer 1213 to each sub-pixel;

[0120] Step S8, preparing a common electrode layer 122 on the top surface of the third light-emitting unit layer 1213, and forming a display screen substrate 1 after completing packaging;

[0121] Step S9 , bonding the display substrate 1 and the driving substrate 2 , wherein the top surface of the driving substrate 2 is provided with a plurality of second bonding structures 23 electrically connected to the driving circuit, and the plurality of second bonding structures 23 are connected to the plurality of first bonding structures 113 in a one-to-one correspondence.

[0122] In the embodiment of the present application, the display device 100 includes a display screen substrate 1 and a driving substrate 22. A plurality of light-emitting structures 124 are provided in the display screen substrate 1, and a driving circuit is provided in the driving substrate 22. When the display screen substrate 1 and the driving substrate 22 are assembled to form the display device 100, each light-emitting structure 124 is electrically connected to the driving circuit, so that electrical signal transmission is achieved between the driving substrate 22 and the display screen substrate 1, and then each light-emitting structure 124 can be controlled to emit light, so that the display screen substrate 1 can display a picture.

[0123] Specifically, the display screen substrate 1 includes a first substrate 11 and a light-emitting device layer 12 formed by combining at least three light-emitting unit layers 121 arranged on the first substrate 11. Each light-emitting unit layer 121 is provided with a plurality of light-emitting structures 124 emitting light of the same color and a transparent insulating structure 125 filled between each light-emitting structure 124. Each light-emitting structure 124 is a sub-pixel; at least three sub-pixels located in different light-emitting unit layers 121 constitute a group of pixel units. For the sake of distinction, in this embodiment, the three light-emitting unit layers 121 stacked in sequence are regarded as the first light-emitting unit layer 1211, the second light-emitting unit layer 1212, and the third light-emitting unit layer 1213. The transparent insulating structure 125 in the first light-emitting unit layer 1211 is the first transparent medium structure 1251, the transparent insulating structure 125 in the second light-emitting unit layer 1212 is the second transparent medium structure 1252, and the transparent insulating structure 125 in the third light-emitting unit layer 1213 is the third transparent medium structure 1253.

[0124] Before preparing the display device 100, the display screen substrate 1 and the drive substrate 2 are prepared respectively. When preparing the display screen substrate 1, a plurality of first bonding structures 113 are set in the substrate structure used to prepare the first substrate 11. The substrate structure can be a single-layer silicon substrate, or it can include a substrate substrate 111 and an insulating heat-insulating layer 112 deposited on the substrate substrate 111. The first bonding structure 113 can be a metal block embedded in the substrate structure, or it can be a pad set on the surface of the substrate structure or other conductive structure combined with the substrate structure; a plurality of first conductive vias 131 are set in the first substrate 11, and a plurality of connecting holes can be set on the substrate structure by a through silicon via process, and connecting metal is deposited in the connecting holes by a physical vapor deposition process (PVD) or an electroplating process, so that the connecting holes form first conductive vias 131; after removing the connecting metal outside the first conductive vias 131 by a process such as mechanical polishing or chemical mechanical grinding, the preparation of the first substrate 11 is completed.

[0125] Then, a first light-emitting unit layer 1211 is prepared on the first substrate 11. The first light-emitting unit layer 1211 includes a light-emitting structure 124 for forming a plurality of first sub-pixels and a first transparent medium structure 1251 filled between the plurality of first sub-pixels and covering the first substrate 11. The anode, the light-emitting layer 1242 and the cathode of the first sub-pixel are prepared on the first substrate 11 in sequence. Optionally, a pixel definition structure 1244 can also be prepared and the first sub-pixel can be packaged in the process of preparing the first sub-pixel. Optionally, a first electrode layer 1241 is first deposited on the first substrate 11, and the first electrode layer 1241 is patterned to form an anode of the first sub-pixel by using processes such as exposure, development, and etching; an inorganic material is deposited on the anode and the first substrate 11 by using a chemical vapor deposition process (CVD) to form a pixel definition layer, and then the pixel definition layer is patterned by using processes such as exposure, development, and etching to form a plurality of pixel definition structures 1244 of the first sub-pixels, and each pixel definition structure 1244 forms an opening area to expose the anode. On the first substrate 11 with the pixel definition structure 1244, a light-emitting material layer and a second electrode layer 1243 are sequentially prepared using an evaporation process; an inorganic encapsulation layer is formed using an atomic layer deposition (ALD) and a chemical vapor deposition process (CVD); and patterning is performed using process steps such as coating, exposure and development, and dry etching to remove the light-emitting material layer, the second electrode layer 1243, and the inorganic encapsulation layer outside the first sub-pixel region, and only the anode of the first sub-pixel and the light-emitting layer 1242, the cathode, and the encapsulation layer on the pixel definition structure 1244 are retained, thereby completing the preparation of multiple first sub-pixels in the first light-emitting unit layer 1211. Finally, a first transparent medium structure 1251 is deposited using a low-temperature chemical vapor deposition process, and the first transparent medium structure 1251 is thinned and flattened using processes such as mechanical polishing or chemical mechanical grinding, wherein the first transparent medium structure 1251 can cover the first sub-pixel, or the first transparent medium structure 1251 can be flush with the cathode of the first sub-pixel, thereby forming a first light-emitting unit layer 1211 with a flat surface.

[0126] A plurality of second conductive vias 132 corresponding to the second sub-pixels are prepared in the first transparent medium structure 1251 of the first light-emitting unit layer 1211, wherein the connection metal in the second conductive via 132 can be prepared by electroplating metal filling technology to ensure that the connection metal can be well formed to the position of the first bonding structure 113 when the depth of the second conductive via 132 is deep; of course, in some embodiments, the connection metal in the second conductive via 132 can also be prepared by physical vapor deposition. After the preparation of the second conductive via 132 is completed, a plurality of second sub-pixels and a second transparent medium structure 1252 covering the first light-emitting unit layer 1211 are sequentially prepared on the surface of the first light-emitting unit layer 1211. The preparation method can refer to the preparation steps of the first light-emitting unit layer 1211, which will not be described in detail here.

[0127] After the preparation of the second light-emitting unit layer 1212 is completed, a plurality of third conductive vias 133 corresponding to the third sub-pixels are prepared in the second transparent medium structure 1252 of the second light-emitting unit layer 1212, and then the third light-emitting unit layer 1213 is prepared. The preparation method of the third conductive vias 133, the third sub-pixels in the third light-emitting unit layer 1213, and the third transparent medium structure 1253 refers to the preparation steps of the second conductive vias 132 and the second light-emitting unit layer 1212, and will not be repeated here.

[0128] It can be understood that when there are four or more light-emitting unit layers 121 in the display screen substrate 1 , the preparation of each light-emitting unit layer 121 is completed in sequence with reference to the above preparation method to form a complete light-emitting device layer 12 .

[0129] A number of connection holes extending to each sub-pixel are prepared on the top surface of the light-emitting device layer 12. The through silicon via (TSV) technology can be used to form the connection holes in sequence above the non-light-emitting areas of the first sub-pixel, the second sub-pixel and the third sub-pixel. For example, the connection holes can be correspondingly arranged above the edge portion 1243b of the pixel definition structure 1244, and the electroplating metal filling technology is used to complete the filling of the connection metal to form a number of fourth conductive vias 1231. The connection metal outside the fourth conductive via 1231 is removed and flattened. Then, a layer of transparent metal oxide is deposited on the light-emitting device layer 12 as a common electrode layer 122. The cathodes of each sub-pixel are connected to the common electrode layer 122 through the corresponding fourth conductive vias 1231. The cathodes of all the light-emitting structures 124 of the entire display screen substrate 1 are interconnected. The side of the display screen substrate 1 is provided with a connecting electrode 15 electrically connected to the common electrode layer 122. The common electrode layer 122 is connected to the connecting electrode 15 of the display screen to achieve electrical signal transmission. Finally, an inorganic thin film is used on the upper surface of the common electrode layer 122 as a packaging layer of the entire display screen substrate 1. The packaging layer can be prepared by atomic layer deposition (ALD) and chemical vapor deposition (CVD). For the sake of distinction, the packaging layer on the common electrode layer 122 is regarded as the first packaging layer 14, and the packaging layer in each sub-pixel is regarded as the second packaging layer 1245. After the packaging is completed, the preparation of the display screen substrate 1 is completed.

[0130] When preparing the driving substrate 2, a chip substrate is first prepared. The chip substrate is provided with a driving circuit and several electrical connection structures 24 electrically connected to the driving circuit. The driving circuit can be a plurality of thin film transistors arranged in an array formed by evaporation, exposure, development, etching, etc. The electrical connection structure 24 is exposed from the top surface of the chip substrate; the electrical connection structure 24 can be a conductive via. Then, a metal layer can be deposited on the chip substrate using a physical vapor deposition process (PVD), and patterned using an exposure and development process to form several second bonding structures 23 corresponding to the several electrical connection structures 24. On the chip substrate on which the second bonding structure 23 has been prepared, a dielectric layer 212 is formed by depositing an insulating dielectric material. The dielectric layer 212 can be prepared by a high-temperature plasma enhanced chemical vapor deposition process (PECVD) or other chemical vapor deposition processes or physical deposition processes. Then, the surface is polished and flattened by a process such as mechanical polishing or chemical mechanical grinding, and the second bonding structure 23 is exposed, thereby completing the preparation of the driving substrate 2.

[0131] The prepared display screen substrate 1 and the driving substrate 2 are bonded to each other, and the bonding is carried out at a certain temperature and pressure, so that a plurality of first bonding structures 113 and a plurality of second bonding structures 23 are connected one by one. In this process, the bonding between the first bonding structure 113 and the second bonding structure 23 is mainly diffusion between atoms. The areas outside the first bonding structure 113 and the second bonding structure 23 can be respectively set as inorganic insulating structures, for example, the bottom surface of the display screen substrate 1 and the top surface of the driving substrate 2 are both provided with a silicon dioxide inorganic layer, and the bonding between the inorganic layers is mainly chemical bond recombination. After the bonding is completed, the preparation of the display device 100 is completed, and the driving substrate 2 and the display screen substrate 1 are connected through the first bonding structure 113 and the second bonding structure 23 to realize electrical signal transmission, and then the display screen substrate 1 can be controlled to realize picture display.

[0132] In one embodiment, step S1 of preparing the first substrate 11 includes:

[0133] S11, preparing a plurality of grooves on the top surface of the base substrate 111;

[0134] S12, depositing a metal layer on the base substrate 111 to fill the groove to form a first bonding structure 113, and removing the metal material outside the groove;

[0135] S13, prepare an insulating heat-insulating layer 112 on the base substrate 111, prepare a connection hole penetrating to the first bonding structure 113 in the area of ​​the insulating heat-insulating layer 112 corresponding to the first sub-pixel, prepare a connecting metal in the connection hole to form a first conductive via 131, and complete the preparation of the first substrate 11.

[0136] In this embodiment, the substrate structure in the first substrate 11 includes a stacked substrate substrate 111 and an insulating heat-insulating layer 112. A silicon substrate is used as the substrate substrate 111. A plurality of grooves corresponding to a plurality of sub-pixels are formed on the substrate substrate 111 by photolithography and etching processes, and the grooves do not penetrate the substrate substrate 111. A metal layer is then deposited on the substrate substrate 111 by a physical vapor deposition process (PVD), and part of the metal material is filled in the groove to form a first bonding structure 113. The metal layer outside the groove is removed by mechanical polishing or chemical mechanical grinding. Then, a plurality of connection holes are set on the substrate structure by a through silicon via process on the substrate substrate 111, and connection metals are deposited in the connection holes by a physical vapor deposition process (PVD) or an electroplating process, so that the connection holes form first conductive vias 131, thereby completing the preparation of the first substrate 11.

[0137] Combined with reference Figure 1 and Figure 4 In one embodiment, before the step S9 of bonding the display substrate 1 and the drive substrate 2, the method further includes:

[0138] Step S81 , grinding, thermal oxidation and exposure treatment are performed on the bottom surface of the display screen substrate 1 , so that the first bonding structure 113 is exposed on the bottom surface of the display screen substrate 1 .

[0139] In this embodiment, before the display screen substrate 1 and the drive substrate 2 are bonded, the bottom surface of the display screen substrate 1 is first polished, thermally oxidized, and exposed to expose the first bonding structure 113 and generate oxide on the surface. Optionally, a silicon substrate is used as the base substrate 111. After polishing and thermal oxidation, a silicon dioxide inorganic layer is formed on the bottom surface of the base substrate 111. When bonding with the inorganic layer on the surface of the drive substrate 2, chemical bond recombination can be generated to improve the connection strength. In the embodiment, a thicker base substrate 111 is used. Before polishing, thermal oxidation, and exposure, the first bonding structure 113 is not exposed, which can protect the first bonding structure 113 and prevent the first bonding structure 113 from being worn. Optionally, a silicon substrate with a thickness of about 0.5 mm to 0.7 mm is used, and a polishing and thinning and thermal oxidation process is performed before the display screen substrate 1 is bonded to the drive substrate 22, so that the silicon substrate is thinned to about 0.3 mm. At this time; the first bonding structure 113 is exposed on the bottom surface of the display screen substrate 1, and the surface layer of the base substrate 111 is a silicon dioxide inorganic layer generated by thermal oxidation as the first inorganic layer, with a thickness of about 0.1 um to 0.3 um, which is mainly used for bonding between inorganic layers.

[0140] In one embodiment, the connection metal in the first conductive via 131 is formed by a physical vapor deposition process or an electroplating process.

[0141] In this embodiment, the first conductive via 131 is formed in the first substrate 11 . At this time, the depth of the first conductive via 131 is relatively small, and the connection metal can be well prepared in the first conductive via 131 by using a physical vapor deposition process or an electroplating process.

[0142] In one embodiment, the connection metal in the second conductive via 132 is formed by an electroplating process. It can be understood that the second conductive via 132 needs to penetrate the first transparent medium structure 1251 and a portion of the first substrate 11. The second conductive via 132 has a large depth, and the electroplating process can ensure that the connection metal in the second conductive via 132 is well prepared.

[0143] In one embodiment, the connection metal in the third conductive via 133 is formed by an electroplating process. The third conductive via 133 needs to penetrate the first transparent medium structure 1251, the second transparent medium structure 1252 and a portion of the first substrate 11. The hole depth is relatively deep, and the electroplating process can ensure that the connection metal in the third conductive via 133 is well prepared.

[0144] In one embodiment, the connection metal in the fourth conductive via 1231 is formed by an electroplating process. In this embodiment, part of the fourth conductive via 1231 needs to be provided in the second transparent medium structure 1252 and the third transparent medium structure 1253, and part of the fourth conductive via 1231 needs to be provided in the second transparent medium structure 1252, that is, the hole depth of part of the fourth conductive via 1231 will be relatively deep, and the connection metal in each fourth conductive via 1231 is prepared simultaneously by the electroplating process, which can ensure that the connection metal in each fourth conductive via 1231 is well prepared.

[0145] In one embodiment, the steps of preparing a plurality of sub-pixels in each light-emitting unit layer 121 include:

[0146] Step S100, preparing the first electrode layer 1241 and then performing patterning to form anodes of a plurality of sub-pixels;

[0147] Step S200, after preparing the pixel definition layer, patterning is performed to form pixel definition structures 1244 corresponding to the respective anodes, and the anodes are exposed in the opening regions of the pixel definition structures 1244;

[0148] Step S300, prepare the light-emitting material layer, the second electrode layer 1243 and the inorganic packaging layer in sequence and then perform patterning treatment, retain the light-emitting material layer, the second electrode layer 1243 and the inorganic packaging layer on the anode and the pixel definition structure 1244 to form the light-emitting layer 1242, the cathode and the packaging layer of each sub-pixel, and complete the preparation of multiple sub-pixels.

[0149] In this embodiment, the preparation method of multiple sub-pixels in each light-emitting unit layer 121 can be prepared in the same way. Taking the preparation of multiple second sub-pixels in the second light-emitting unit layer 1212 as an example, the first electrode layer 1241 is first deposited on the second substrate 21, and the first electrode layer 1241 is patterned by exposure, development, etching and other processes to form the anode of the second sub-pixel; the inorganic material is deposited on the anode and the second substrate 21 by chemical vapor deposition (CVD) to form a pixel definition layer, and then the pixel definition layer is patterned by exposure, development, etching and other processes to form a plurality of pixel definition structures 1244 of the second sub-pixels, and each pixel definition structure 1244 forms an opening area to expose the anode. On the second substrate 21 with the pixel definition structure 1244, a light-emitting material layer and a second electrode layer 1243 are sequentially prepared using an evaporation process; an inorganic encapsulation layer is formed using an atomic layer deposition (ALD) and a chemical vapor deposition process (CVD); and patterning is performed using process steps such as coating, exposure and development, and dry etching to remove the light-emitting material layer, the second electrode layer 1243, and the inorganic encapsulation layer outside the second sub-pixel region, and only the anode of the second sub-pixel and the light-emitting layer 1242, the cathode, and the encapsulation layer on the pixel definition structure 1244 are retained, thereby completing the preparation of multiple second sub-pixels in the second light-emitting unit layer 1212. The preparation method of the sub-pixels in the light-emitting unit layer 121 such as the first light-emitting unit layer 1211 and the third light-emitting unit layer 1213 refers to the preparation method of the second sub-pixel, and will not be repeated here.

[0150] In one embodiment, the step S100 of preparing the first electrode layer 1241 includes:

[0151] In step S110 , a reflective electrode 1241 a and a transparent electrode 1241 a are sequentially deposited to form a first electrode layer 1241 .

[0152] In this embodiment, the first electrode layer 1241 includes a reflective electrode 1241a and a transparent electrode 1241b. The reflective electrode 1241a and the transparent electrode 1241b can be prepared by a physical vapor deposition process (PVD). After depositing the reflective electrode 1241a and the transparent electrode 1241b, they are patterned by exposure, development, etching and other processes to form the anode of the sub-pixel. Among them, the reflective electrode 1241a can be made of materials such as Al or TiN. Optionally, the thickness of the reflective electrode 1241a can be 60nm, 70nm, 80nm, 90nm, 100nm or any value between 60nm and 100nm. Of course, it can also be a value close to 60nm and 100nm, which is not limited here. The setting of the reflective electrode 1241a can make part of the light emitted from the light-emitting layer 1242 to the first electrode layer 1241 side be reflected by the reflective electrode 1241a to the second electrode layer 1243 side and then emitted outward, thereby improving the light utilization rate and light extraction efficiency, which is conducive to improving the light emitting brightness of the display device 100. The transparent electrode 1241b can be made of indium tin oxide (ITO) or other conductive transparent materials, and its thickness can be 10nm, 20nm, 30nm and any value between 10nm and 30nm. Of course, it can also be a value close to 10nm and 30nm, which is not limited here. Providing two layers of electrodes to form the first electrode layer 1241 can increase the resistance of the first electrode layer 1241, prevent excessive current from causing device damage or overheating, and can also reduce parasitic capacitance and improve light emission uniformity.

[0153] In one embodiment, the step of preparing the driving substrate 2 includes:

[0154] Step S1', preparing a chip substrate, in which a driving circuit and a plurality of electrical connection structures 24 electrically connected to the driving circuit are provided, and the electrical connection structures 24 are exposed on the top surface of the second substrate 21;

[0155] Step S2', depositing a metal layer on the chip substrate and then performing patterning to form a plurality of second bonding structures 23 corresponding to the plurality of electrical connection structures 24;

[0156] Step S3 ′: after depositing the insulating layer, polishing and planarization are performed to expose a plurality of second bonding structures 23 .

[0157] In this embodiment, when preparing the driving substrate 2, a chip substrate is first prepared. The chip substrate is provided with a driving circuit and a plurality of electrical connection structures 24 electrically connected to the driving circuit. The driving circuit can be a plurality of thin film transistors arranged in an array formed by evaporation, exposure, development, etching, etc. The electrical connection structure 24 extends from the top surface of the chip substrate to the top layer connection metal 22 of the driving circuit; the electrical connection structure 24 can be a conductive via. A metal layer can be deposited on the chip substrate using a physical vapor deposition process (PVD), and patterned using an exposure and development process to form a plurality of second bonding structures 23 corresponding to the plurality of electrical connection structures 24. On the chip substrate on which the second bonding structure 23 has been prepared, an insulating dielectric material is deposited to form a dielectric layer 212. The dielectric layer 212 can be prepared by a high temperature plasma enhanced chemical vapor deposition process (PECVD) or other chemical vapor deposition processes or physical deposition processes. Then, the surface is polished and flattened by a process such as mechanical polishing or chemical mechanical grinding, and the second bonding structure 23 is exposed, thereby completing the preparation of the driving substrate 2.

[0158] The present invention also proposes a display device, including a display device 100 as in the above-mentioned embodiment. The display device may be, but is not limited to, a mobile phone, a tablet computer, a laptop computer, a desktop display, a television, and a head-mounted display device such as AR (Augmented Reality) glasses, VR (Virtual Reality) glasses, and MR (Mixed Reality) glasses. The specific structure of the display device 100 in the display device refers to the above-mentioned embodiment. Since the display device proposed by the present invention adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one.

[0159] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A display screen substrate, characterized in that: include: A first substrate, wherein a plurality of first bonding structures arranged at intervals are embedded in the first substrate, and the first bonding structures are exposed on the bottom surface of the first substrate; a light-emitting device layer, the light-emitting device layer being arranged on the first substrate and comprising at least three light-emitting unit layers emitting light of different colors, the light-emitting unit layer comprising a transparent insulating structure and a plurality of light-emitting structures arranged in the transparent insulating structure, and light-emitting regions of the light-emitting structures located in different light-emitting unit layers being arranged in a staggered manner; The light-emitting structure comprises a first electrode layer, a light-emitting layer and a second electrode layer which are sequentially stacked in a direction away from the first substrate, and the first electrode layer is electrically connected to the corresponding first bonding structure through a first conductive structure; and A common electrode layer is provided on a surface of the light-emitting unit layer away from the first substrate, and a plurality of the second electrode layers are electrically connected to the common electrode layer through second conductive structures.

2. The display screen substrate according to claim 1, wherein: The first substrate comprises a stacked substrate and an insulating heat-insulating layer, and the first bonding structure is embedded in the substrate; The light emitting device layer is arranged on a surface of the insulating and heat-insulating layer away from the base substrate, and the display screen substrate further comprises a plurality of first conductive structures penetrating the insulating and heat-insulating layer, and two ends of the first conductive structures are respectively connected to the first electrode layer and the first bonding structure; And / or, a first inorganic layer is provided on the bottom surface of the first substrate.

3. The display screen substrate according to claim 1, wherein: The light-emitting structure further includes a pixel definition structure, which encloses an opening area, and the first electrode layer and the light-emitting layer are both located in the opening area.

4. The display screen substrate according to claim 3, wherein: The second electrode layer has a central portion covering the opening area and an edge portion located around the central portion, and the second conductive structure is connected to the edge portion; And / or, the pixel definition structure overlaps with a projection portion of at least one pixel definition structure located in another light emitting unit layer on the first substrate.

5. The display screen substrate according to any one of claims 1 to 4, characterized in that: The display screen substrate further comprises a first encapsulation layer, wherein the first encapsulation layer is disposed on a surface of the common electrode layer away from the light-emitting unit layer; And / or, the first electrode layer comprises a reflective electrode and a transparent electrode which are stacked in sequence, and the light-emitting layer is arranged on a surface of the transparent electrode which is away from the reflective electrode; And / or, the light emitting device comprises a second encapsulation layer, and the second encapsulation layer is stacked on the second electrode layer.

6. A display device, characterized in that: A display screen substrate comprising a driving substrate and the display screen substrate as claimed in any one of claims 1 to 5, wherein the driving substrate comprises a second substrate, a driving circuit embedded in the second substrate, and a plurality of second bonding structures, wherein the second bonding structures are electrically connected to the driving circuit and exposed on the top surface of the second substrate; The surface of the display screen substrate provided with a plurality of first bonding structures is bonded to the top surface of the driving substrate, and the plurality of first bonding structures are connected to the plurality of second bonding structures in a one-to-one correspondence.

7. A method for preparing a display device, characterized in that: The display device is provided with a plurality of pixel units, each of which includes a first sub-pixel, a second sub-pixel and a third sub-pixel with different luminous colors, and the preparation method includes the following steps: Prepare a first substrate, wherein a plurality of first bonding structures and a plurality of first conductive vias penetrating from a top surface of the first substrate to the first bonding structures are embedded in the first substrate, and the plurality of first conductive vias correspond one-to-one to the plurality of first sub-pixels; Preparing a plurality of the first sub-pixels and a first transparent medium structure covering the first substrate on the top surface of the first substrate to form a first light-emitting unit layer; Prepare a plurality of second conductive vias penetrating from the top surface of the first transparent medium structure to the first bonding structure, wherein the plurality of second conductive vias correspond one-to-one to the plurality of second sub-pixels; Prepare a plurality of the second sub-pixels and a second transparent medium structure covering the first light-emitting unit layer on the top surface of the first light-emitting unit layer to form a second light-emitting unit layer; Prepare a plurality of third conductive vias penetrating from the top surface of the second transparent structure to the first bonding structure, wherein the plurality of third conductive vias correspond one-to-one to the plurality of third sub-pixels; Prepare a plurality of the third sub-pixels and a third transparent medium structure covering the second light-emitting unit layer on the top surface of the second light-emitting unit layer to form a third light-emitting unit layer; Prepare a plurality of fourth conductive vias penetrating from the top surface of the third light-emitting unit layer to each sub-pixel; A common electrode layer is prepared on the top surface of the third light-emitting unit layer, and a display screen substrate is formed after packaging; The display screen substrate and the driving substrate are bonded and connected, and a plurality of second bonding structures electrically connected to the driving circuit are arranged on the top surface of the driving substrate, and the plurality of second bonding structures are connected to the plurality of first bonding structures in a one-to-one correspondence.

8. The method for preparing a display device according to claim 7, characterized in that: The step of preparing the first substrate comprises: A plurality of grooves are formed on the top surface of the substrate; Depositing a metal layer on the substrate to fill the groove to form a first bonding structure, and removing the metal material outside the groove; An insulating heat-insulating layer is prepared on the base substrate, a connection hole penetrating to the first bonding structure is prepared in the area of ​​the insulating heat-insulating layer corresponding to the first sub-pixel, and a connecting metal is prepared in the connection hole to form a first conductive via, thereby completing the preparation of the first substrate.

9. The method for preparing a display device according to claim 7, characterized in that: Before the step of bonding the display substrate and the drive substrate, the method further includes: The bottom surface of the display screen substrate is polished and thermally oxidized to expose the first bonding structure on the bottom surface of the display screen substrate.

10. The method for manufacturing a display device according to claim 7, wherein: The connection metal in the first conductive via is formed by a physical vapor deposition process or an electroplating process; and / or, the connection metal in the second conductive via is formed by an electroplating process; and / or, the connection metal in the third conductive via is formed by an electroplating process; And / or, the connection metal in the fourth conductive via is formed by an electroplating process.

11. The method for manufacturing a display device according to claim 7, wherein: The steps of preparing each light-emitting unit layer include: After preparing the first electrode layer, patterning is performed to form anodes of a plurality of sub-pixels; After preparing the pixel definition layer, a patterning process is performed to form a pixel definition structure corresponding to each anode, and the anode is exposed in an opening area of ​​the pixel definition structure; After sequentially preparing a light-emitting material layer, a second electrode layer and an inorganic encapsulation layer, a patterning process is performed, and the light-emitting material layer, the second electrode layer and the inorganic encapsulation layer on the anode and the pixel definition structure are retained to form a light-emitting layer, a cathode and an encapsulation layer of each sub-pixel, and the preparation of multiple sub-pixels is completed; After the transparent medium structure is deposited, a planarization process is performed to complete the preparation of the light-emitting unit layer.

12. The method for manufacturing a display device according to claim 11, characterized in that: The step of preparing the first electrode layer comprises: A reflective electrode and a transparent electrode are sequentially deposited to form a first electrode layer.

13. The method for preparing a display device according to any one of claims 7 to 12, characterized in that: The steps of preparing the driving substrate include: Prepare a chip substrate, wherein the chip substrate is provided with a driving circuit and a plurality of electrical connection structures electrically connected to the driving circuit, wherein the electrical connection structures are exposed on the top surface of the second substrate; After depositing a metal layer on the chip substrate, patterning is performed to form a plurality of second bonding structures corresponding to the plurality of electrical connection structures; After the dielectric layer is deposited, polishing and planarization are performed to expose the plurality of the second bonding structures.

14. A display device, characterized in that: Comprising the display device as claimed in claim 6.

Images