Housing and lead frame unit

Abstract

In at least one embodiment, a housing (2) for an optoelectronic semiconductor chip (3) is provided and has:-a first lead frame part (41) and a second lead frame part (42),-a housing body (5) which mechanically connects the first and second lead frame parts (41, 42) to one another, wherein-the first lead frame part (41) has a mounting region (45) for accommodating the semiconductor chip (3) and / or for accommodating the electrical connection device (6) and an edge region (46) at a side edge of the housing (2),-the first lead frame part (41) has a trench (7) between the mounting region (45) and the edge region (46), and-the trench (7) is located at an outer side (44) of the first lead frame part (41), the outer side (44) is designed to mount the housing (2) and the mounting region (45) and the edge region (46) extend straight towards the outer side (44).

Description

[0001] A housing for an optoelectronic semiconductor chip and a lead frame unit therefor are specified.

[0002] The object to be achieved is to specify a housing which is resistant to thermal loads.

[0003] This object is achieved in particular by a housing and leadframe unit having the features of the independent patent claim. Preferred developments are the subject matter of the dependent claims.

[0004] According to at least one embodiment, the housing is a housing provided for at least one optoelectronic semiconductor chip. The semiconductor chip or the semiconductor chips are, for example, light emitting diode chips, LED chips for short, and / or laser diode chips, LD chips for short. A plurality of different types of optoelectronic semiconductor chips can be combined with one another in the housing, for example, optoelectronic semiconductor chips for generating different light colors.

[0005] According to at least one embodiment, the housing comprises a first lead frame part and a second lead frame part. Additional lead frame parts may be present. The term lead frame part refers in particular to a metal body which is, for example, stamped and / or etched and / or cut from a sheet. All lead frame parts are preferably made of the same substrate, in particular a copper sheet or a copper film. The lead frame parts can be provided with at least one metal coating, which is, however, preferably much thinner than the substrate.

[0006] According to at least one embodiment, the housing comprises a housing body. The housing body is made of at least one electrically insulating material and is based on plastic, for example. The housing body can be based on epoxy resin or silicone. It is possible that the housing body contains a mixture, such as particles or fibers, for adapting thermal expansion or for improving mechanical stability. The housing body is preferably opaque.

[0007] According to at least one embodiment, the housing body mechanically connects the first and second lead frame parts and optionally further lead frame parts to each other. That is, without the housing body, the lead frame parts would be mechanically unstable relative to each other. For example, the housing body at least partially or completely shields the side surfaces of the lead frame parts within the housing body. In the lateral direction, the lead frame parts are, for example, only at the outer side wall of the housing without the housing body.

[0008] According to at least one embodiment, the first leadframe part has a mounting region for accommodating a semiconductor chip and / or for accommodating an electrical connection device. The semiconductor chip is in particular at least one optoelectronic semiconductor chip, but the semiconductor chip can also be another type of semiconductor chip, such as a control chip or a protection chip for the optoelectronic semiconductor chip, for example for preventing damage caused by electrostatic discharge (ESD for short). In the mounting region, the first leadframe part preferably has its full thickness.

[0009] In the same way, the second leadframe part or optionally also further leadframe parts can also have a mounting region.

[0010] According to at least one embodiment, the first leadframe part has an edge region. The edge region is preferably located at a side edge of the housing. That is, the edge region can border on an outer sidewall of the housing. Preferably, the edge region also has the full thickness of the first leadframe part, in particular with the exception of the welding control point, which can be completely surrounded by a region of the edge region with full thickness in the direction toward the housing body. The welding control point is preferably reachable from the outer sidewall.

[0011] The mounting region and the edge region may have the same overall thickness.

[0012] According to at least one embodiment, the first leadframe part has a groove. The groove is located between the mounting area and the edge area. In other words, it is possible that the groove defines a subdivision between the mounting area and the edge area. The mounting area is then located at one longitudinal side of the groove and the edge area is located at the opposite longitudinal side. In the region of the groove, the first leadframe part is thinner than in the mounting area and than in the edge area, so that possible welding control points are omitted.

[0013] According to at least one embodiment, the groove is located at the outside of the first lead frame part. The outside is provided in this case for mounting the housing. The outside is in particular opposite to the inside provided for at least one optoelectronic semiconductor chip. For example, the outside is provided for surface mounting of the housing, referred to as SMT or surface mounting technology (Surface Mount Technology). Therefore, the groove can be understood as a recess in the first lead frame part, which extends from the outside toward the inside into the substrate of the first lead frame part, but does not reach the inside. Therefore, the groove is not a hole passing through the first lead frame part.

[0014] According to at least one embodiment, the mounting area and the edge area extend straight to the outside. That is, the mounting area and the edge area are sub-areas of the outside.

[0015] In at least one embodiment, the housing is provided for an optoelectronic semiconductor chip and comprises

[0016] - a first lead frame portion and a second lead frame portion,

[0017] a housing body which mechanically connects the first and second leadframe parts to one another, wherein

[0018] the first leadframe part has a mounting region for accommodating a semiconductor chip and / or for accommodating an electrical connection device and an edge region at a side edge of the housing,

[0019] - the first leadframe portion has a groove between the mounting region and the edge region, and

[0020] The groove is located at the outer side of the first leadframe part, and the outer side is provided for mounting the housing and the mounting region and the edge region extend straight to the outer side.

[0021] In the case of the housing described here, the welding control structure is in particular mechanically decoupled from the mounting region, thereby reducing the risk of delamination of the housing body from the first leadframe part in the region of the edge region.

[0022] The housing may be a so-called Quad Flat No Leads component, or QFN component for short.

[0023] Guideline AEC Q 102 #3 stipulates that delamination of metal pads on which bonding wires are fastened is not permitted. This guideline particularly relates to LED components that contain ICs and are intended for use in the automotive sector.

[0024] With the concept described here for the lead frame part, the forces and stresses in the housing can be reduced to such an extent that the surrounding housing plastic of the housing body remains bonded to the metal of the lead frame part. Studies have shown that the plastic is particularly susceptible to peeling off on the upper side of the etched solder control structure, i.e. at the edge area. One reason for this may be that the large lead frame part transfers a large leverage effect to the solder control structure. With the concept described here, the solder control structure in question is mechanically decoupled from the large assembly area, but continues to remain thermally and electrically connected.

[0025] In the narrow connection in the area between the mounting area and the edge area, the material thickness is preferably halved in a linear manner, for example continuously, by removing material on the underside of the component, that is, forming a groove. The groove is preferably located in the area of ​​the cavity and not in the area of ​​the housing plastic wall when viewed in longitudinal section and in plan view. The groove is therefore located in particular below the cavity bottom and close to the cavity wall.

[0026] The continuous reduction in material thickness in the area of ​​the groove creates a link between the large mounting area and the edge area with the weld control structure. The groove should run in a straight line in order to achieve the maximum effect. Material removal is carried out from the outside so that the remaining metal connection is closer to the neutral zone of the imaginary bending line.

[0027] If conventional QFN components are stored at temperature and humidity, for example at 60° C. and 85% relative humidity for 168 hours according to temperature and humidity storage, THS for short, and subsequently soldered to an FR4 circuit board, for example according to the resistance to solder heat test, RTSH for short, then delamination between the cavity potting material and the metal lead frame (also called lead frame) develops relatively often over a large area. According to the guideline AEC Q102 #3, for such LED components with ICs, all delamination between the cavity potting material and the metal pads is excluded if these pads are wire bonding pads.

[0028] Delamination occurs in particular due to the so-called popcorn effect. That is, during temperature and humidity storage, a wet film forms in the gap between the lead frame part and the housing body. During the subsequent soldering according to RTSH, at a maximum temperature of 260° C., the moisture suddenly evaporates and occupies a significantly larger volume in the form of hot water vapor. When viewed in longitudinal cross-section, the explosively formed water vapor emanates from the gap and is squeezed directly between the cavity casting material and the lead frame. The cavity casting material is, for example, silicone or epoxy resin. As a result, large-area delamination occurs between the cavity casting material and the metal surface.

[0029] This means that the gaps that exist between the housing body and the metal lead frame are the main cause of the described damage mechanism. On the one hand, the adhesion between the housing body, for example based on epoxy resin casting material or silicone casting material, and the metal is relatively low, and on the other hand, the metal lead frame is quite rigid. In addition, the difference in the thermal expansion coefficients between the metal and the housing body leads to strong bending in the panel composite, so that the panel composite is usually flattened several times by machine.

[0030] In particular, in the housing described here, several solutions are combined with one another:

[0031] a) Generally speaking, a switch should be made from so-called pre-plating to post-plating. For this purpose, the lead frame, in particular a copper lead frame, is first provided with a housing body and only then coated with a metallization, such as NiPdAu. In the case of pre-plating, the opposite is done. The housing body generally adheres better to copper than to a metallization, such as NiPdAu.

[0032] b) In the region of the second lead frame part, the welding control structure can be omitted. As a result, the second lead frame part is better anchored in the housing body and is also more flexible. This can reduce gap formation in the region of the second lead frame part.

[0033] c) However, a groove and a solder control structure (also called Solder Control Structure or SCS for short) are present at the first, preferably larger lead frame portion. Thus, a nominal bending point is built into the lead frame by the groove in order to protect the SCS area from forces causing delamination.

[0034] Since the housing body is mechanically more stable, especially in the region of the full material thickness, i.e. outside the cavity, than in the region of the cavity, the housing plastic is more likely to deform in the region of the cavity when the panel is twisted. A metal lead frame is similarly rigid and essentially maintains its shape without a groove. The lead frame can be bent by the groove. Thus, half-side delamination starting from the inside of the edge region can be prevented. That is to say, the housing described here is based on the idea that, outside the region of the SCS, additional bending points are created in the form of grooves, at which the lead frame can be bent, so that the adhesion to the housing body no longer has to break under load.

[0035] The bending point is preferably directly at or close to the cavity wall. Preferably, the bending point is created in the large first cavity. However, it may make sense to create bending points on both sides of the SCS area, also at the second lead frame part.

[0036] The housing described here can in particular achieve the following effects:

[0037] - The solder control structure SCS can be retained and does not have to be removed to solve the delamination problem. In combination with other measures, such as post-plating of the second lead frame part and / or an adapted profile, this is an efficient measure to reduce the risk of delamination between the housing body and the metal at important points, especially to achieve comfort with guideline AEC Q102 #3.

[0038] Another effect is that such a layer above the SCS represents a layer for gases such as H 2 Undesirable ingress paths of S at the inner side of the gas should be avoided in order to achieve a higher corrosion resistance.

[0039] According to at least one embodiment, the groove extends continuously between the mounting region and the edge region. This means in particular that the leadframe is not thicker at any point between the mounting region and the edge region than in the region of the lowest point of the groove.

[0040] The grooves preferably extend along a straight line.

[0041] According to at least one embodiment, the groove is interrupted by one or more crossbars. In particular, there is exactly one crossbar or exactly two crossbars. By such a crossbar, the material flow of the housing body can be controlled during its manufacture.

[0042] According to at least one embodiment, at least one crossbar is exactly as thick as the mounting region and the edge region. In the region of the crossbar, the first leadframe part therefore preferably has full thickness.

[0043] According to at least one embodiment, the width of the crossbar or the sum of the widths of all crossbars along the groove is generally at most 40% or at most 30% or at most 20% of the total length of the groove including at least one crossbar.

[0044] According to at least one embodiment, the groove is partially or completely filled by the housing body. In particular, in the case of two of the crossbars, the groove can be free of the housing body.

[0045] According to at least one embodiment, the housing forms a first cavity. In the first cavity, there is no housing body inside the first lead frame part, which is set up, for example, for accommodating the semiconductor chip. It is possible that the first cavity is confined to the first lead frame part in a top view from the inside. In this case, there may be a second cavity that exposes the inside of the second lead frame part. Alternatively, the first cavity extends above the first and second lead frame parts.

[0046] According to at least one embodiment, the edge region is partially or completely covered by the cavity wall of the first cavity when viewed from above on the inside. That is, the first cavity does not reach as far as the edge region, but in particular only reaches as far as the groove.

[0047] According to at least one embodiment, the groove is located partially or completely within the first cavity when viewed from above from the inside.

[0048] According to at least one embodiment, the groove borders on the cavity wall of the first cavity, seen in a top view from the inside and towards the edge region. In particular, in the direction from the outer side wall of the housing at the edge region towards the mounting region, the boundary line of the cavity wall and the longitudinal edge of the groove towards the edge region, seen in a top view from the inside, overlap congruently. This applies, for example, to the width of the groove with a tolerance of at most 20 μm or at most 50 μm or at most 0.1 mm, alternatively or additionally with a tolerance of at most 10% or at most 25% or at most 50%.

[0049] According to at least one embodiment, the cavity wall of the first cavity and the groove partially or completely overlap, preferably only a small part of the base area of ​​the groove, for example at most 40% or at most 20%, when viewed in plan view from the inside.

[0050] According to at least one embodiment, in a top view from the inside, all ends of the groove are located in the first cavity. In other words, the groove ends in the first cavity.

[0051] According to at least one embodiment, the edge region comprises one or more welding control points. It is possible that at least one welding control point is provided with a metal coating. In particular, such a metal coating of the welding control point is located at a surface of the welding control point extending transversely to the outside. The transversely extending surface can be located in the plane of the associated outer side wall of the housing or set back relative to the outer side wall. The metal coating is preferably the same metal coating as the metal coating of the region of the edge region located at the outside of the mounting region and in the outer side.

[0052] That is to say that the metallic coating is applied to the first leadframe part at least in the region of the soldering control points and preferably also in the region of the mounting region.

[0053] According to at least one embodiment, the edge region includes a plurality of welding control points. It is possible that there is exactly one welding control point for each edge region or that the edge region includes a plurality or all of the welding control points of the lead frame part in question. If there are a plurality of edge regions with at least one welding control point, these edge regions can all be designed identically or can also be different from one another.

[0054] According to at least one embodiment, at least two of the welding control points are subdivided from each other in a direction transverse to the groove by a gap through the first leadframe part. That is, the welding control points in question can be adjacent to each other and have an identical design. In particular, in a direction parallel to the groove, there is no continuous material connection between the welding control points in the first leadframe part due to the gap.

[0055] According to at least one embodiment, the slit partially or completely cuts through the groove. That is, due to the slit, in a direction parallel to the groove and in the region of the groove, at least partially no material of the first leadframe part is present. It is possible that the groove is subdivided into two sub-grooves by the slit.

[0056] According to at least one embodiment, the gap widens locally in a direction away from the assigned welding control point and in particular in the direction towards the groove. It is possible that the gap remains the same width in the first plane and widens only in the second plane. The second plane is, for example, the half-etched side of the first leadframe part into which the groove is formed.

[0057] According to at least one embodiment, viewed in cross section, in particular perpendicular to the longitudinal axis of the groove, the groove is partially or along the entire longitudinal axis semicircular or polygonal, such as quadrilateral. For example, quadrilateral means that the groove has a square or trapezoidal cross-sectional area.

[0058] According to at least one embodiment, the trench depth is at least 35% or at least 40% or at least 45% of the total thickness of the first leadframe portion. Alternatively or additionally, the trench depth is at most 65% or at most 50% of the total thickness.

[0059] According to at least one embodiment, the total thickness of the first leadframe portion is at least 100 μm or at least 140 μm. Alternatively or additionally, the total thickness is at most 250 μm or at most 210 μm.

[0060] According to at least one embodiment, the width of the groove is at least 50% or at least 80% of the total thickness of the first leadframe portion. Alternatively or additionally, the width is at most 300% or at most 200% or at most 150% of the total thickness. For example, the width of the groove is between 0.1 mm and 0.3 mm, inclusive.

[0061] According to at least one embodiment, the first leadframe part is larger than the second leadframe part. For example, the sizes of the leadframe parts differ by at least 1.2 times or at least 1.5 times or at least 2 times and / or at most 10 times. The size here particularly relates to the base area of ​​the leadframe part when viewed in a top view from the inside.

[0062] According to at least one embodiment, the second lead frame portion includes a mounting area and / or one or more other welding control points. The mounting area of ​​the second lead frame portion is provided, for example, for an ESD protection chip, a control IC and / or a bonding wire connection.

[0063] According to at least one embodiment, the second leadframe part has a constant thickness between the other welding control points and the mounting area. In other words, the second leadframe part does not include an edge area offset from the mounting area, but the mounting area extends to the edge and includes at least one other welding control point.

[0064] According to at least one embodiment, at least one further groove is located between at least one further welding control point and the mounting region of the second leadframe portion. That is, due to the groove, the second leadframe portion is subdivided into the mounting region and at least one edge region.

[0065] The statements regarding the grooves, the welding control points and the edge region for the first lead frame part apply in the same way to the other grooves, the other welding control points and the other grooves of the second lead frame part.

[0066] According to at least one embodiment, the first leadframe portion includes a plurality of edge regions in the edge region, the edge regions being respectively separated from the mounting region of the first leadframe portion by the grooves.

[0067] Furthermore, a lead frame unit for a housing as described in conjunction with one or more of the above embodiments is described. Therefore, features of the lead frame unit are also disclosed for the housing, and vice versa.

[0068] In at least one embodiment, a leadframe unit for a housing of an optoelectronic semiconductor chip is provided, the leadframe unit comprising a first leadframe part and a second leadframe part, wherein

[0069] the first leadframe part has a mounting region for accommodating a semiconductor chip and / or for accommodating an electrical connection device and an edge region at a side edge of the leadframe unit,

[0070] - the first leadframe portion has a groove between the mounting region and the edge region, and

[0071] The groove is located at the outer side of the first leadframe part, and the outer side is provided for planar solder mounting of the mounting area and the edge area.

[0072] Furthermore, an optoelectronic semiconductor component having a housing as described in conjunction with one or more of the above embodiments is described. Therefore, features of the optoelectronic semiconductor component are also disclosed for the housing, and vice versa.

[0073] In at least one embodiment, the optoelectronic semiconductor component comprises a housing and at least one optoelectronic semiconductor chip accommodated in the housing.

[0074] Furthermore, a method for producing a housing as described in conjunction with one or more of the above embodiments is described. Therefore, features of the housing are also disclosed for the method, and vice versa.

[0075] In at least one embodiment, the method comprises the following steps, in particular in the order described:

[0076] - Provide semi-finished metal products,

[0077] - producing a leadframe assembly having a plurality of leadframe units from a semi-finished product, in particular by means of a two-stage etching process, wherein each etching step is carried out from a main side of the semi-finished product,

[0078] - producing a housing base body on the lead frame assembly,

[0079] - optionally, at least one optoelectronic semiconductor chip is accommodated in a housing and electrically contacted,

[0080] - optionally filling the cavity with a filler, and

[0081] - separation into housings and / or optoelectronic semiconductor components.

[0082] The housing described here, the optoelectronic semiconductor component described here, the method described here, and the lead frame unit described here are explained in more detail below by way of example with reference to the drawings. The same reference numerals denote the same elements in the individual figures. However, this does not represent a reference to the correct scale, but rather individual elements may be shown exaggeratedly for a better understanding.

[0083] Figure 1 A schematic perspective view showing an embodiment of a lead frame unit described here for a housing described here,

[0084] Figure 2 Shown with Figure 1 Schematic perspective sectional view of an embodiment of a housing of a lead frame unit described here,

[0085] Figure 3 Show Figure 2 A schematic perspective bottom view of a housing,

[0086] Figure 4 and 5 Show Figure 1 Schematic top view of the main side of a lead frame unit,

[0087] Figure 6 Shown with Figure 2 a schematic sectional view of an exemplary embodiment of an optoelectronic semiconductor component described here,

[0088] Figure 7 Schematic sectional views showing method steps of an exemplary embodiment of a method described here for producing a housing described here,

[0089] Figure 8 Show Figure 1 Schematic perspective view of a variant of a lead frame unit,

[0090] Fig. 9 Show Figure 2 Schematic perspective bottom view of a variant of the housing,

[0091] Fig.10 A schematic perspective view showing an embodiment of a lead frame unit described here for a housing described here,

[0092] Fig.11 Shown with Fig.10 Schematic sectional view of an embodiment of a housing of a lead frame unit described here,

[0093] Fig.12 A schematic perspective view showing an embodiment of a lead frame unit described here for a housing described here,

[0094] Fig.13 Shown with Fig.12 Schematic sectional view of an embodiment of a housing of a lead frame unit described here,

[0095] Fig.14 Show Fig.12 Schematic perspective view of a variant of a lead frame unit,

[0096] Fig.15 A schematic perspective view showing an embodiment of a lead frame unit described here for a housing described here,

[0097] Fig.16 Shown with Fig.15 Schematic perspective sectional view of an embodiment of a housing of a lead frame unit described here,

[0098] Fig.17 Show Fig.15 A schematic perspective view of a variant of a lead frame unit, and

[0099] Fig.18 and Fig.19 A schematic perspective view shows an exemplary embodiment of a lead frame unit described here for a housing described here.

[0100] exist Figure 1 , 4 An example of a lead frame unit 4 is shown in FIGS. 4 and 5. The lead frame unit 4 comprises a first lead frame portion 41 and a smaller second lead frame portion 42. Optionally, there are one or more further lead frame portions 83, which may be smaller than the second lead frame portion 42. The lead frame portions 41, 42, 83 are for example made of a sheet material, for example a copper sheet material, which is made of a semi-finished product.

[0101] Many of these lead frame units 4 may be combined in a lead frame composite not shown. Then, adjacent lead frame units 4 are mechanically connected to each other by support bars 48 (also called tie bars in English) until separation.

[0102] The lead frame parts 41, 42, 83 are etched from the semi-finished product by means of a two-stage half-etch from both main sides and are therefore made of the same material and are of the same thickness. In this case, the half-etching is more extensive, for example, from the outer side 44 than from the opposite inner side 43, see in particular Figure 4 and Figure 5 Therefore, the inner side 43 has a larger area than the outer side 44 .

[0103] The outer side 44 is provided for later surface mounting of the housing 2 and the lead frame unit 4, see also Figure 2 and Figure 3 The inner side 43 of the first leadframe part 41 is provided in a mounting region 45 for accommodating an optoelectronic semiconductor chip, such as an LED chip. Correspondingly, the inner side of the second leadframe part 42 is used in particular for accommodating bonding wires and / or ESD protection diodes. In the respective mounting region 45, the leadframe parts 41, 42 have their full thickness.

[0104] The first leadframe part 41 also has an edge region 46 which borders the outer contour of the leadframe unit 4 and is therefore partially exposed at the outer side wall of the housing 2 , see Figure 3 The edge region 46 has two soldering control points 47 which are formed by pockets coming from the outer side 44. The soldering control points 47 comprise surfaces which are oriented transversely to the outer side 44 and which are designed to be wetted by solder during assembly of the housing 2.

[0105] Unlike the illustration in the figure, it is not mandatory for the welding control point 47 to include a pocket. It is also possible that the welding control point 47 is only composed of a surface at the outer side wall that is set up for wetting with solder. This also applies to all other examples.

[0106] Apart from the area with the optional pocket, the edge area 46 has the full thickness of the lead frame part 41. The area of ​​reduced thickness is located between the edge area 46 and the mounting area 45 of the first lead frame part 41. This area represents a groove 7 which preferably separates the edge area 46 from the mounting area 45 without interruption in a straight line. The groove 7 is approximately rectangular when viewed in cross section.

[0107] The smaller second lead frame portion 42 has no such grooves, so that the second lead frame portion 42 is continuous up to the outer contour line with a full thickness.

[0108] Optionally, there are a plurality of welding control points 47 at the first and / or second lead frame part 41, 42, for example two welding control points 47 in each case. As a further option, it is possible that the welding control points 47 are each separated from each other by gaps 72. It is possible that the gaps 72 widen at least at the outer side 44 in a direction away from the welding control points 47, see the second lead frame part 42. Alternatively, the gaps 72 may be of a constant width, see the first lead frame part 41.

[0109] It is possible that the slot 72 extends into the groove 7 at the first leadframe part 41. In this case, however, the slot 72 only partially penetrates the groove 7 in a direction perpendicular to the longitudinal axis of the groove, see Figure 1 and Figure 4 .

[0110] exist Figure 2 As can be seen from FIG. 1 , the housing 2 still includes a housing body 5 in addition to the lead frame unit 4. Figure 2 The housing 2 which does not yet comprise a semiconductor chip may still be present in the housing assemblage (not shown), so that the outer side walls 55 are only formed when the housing assemblage is divided into individual housings 2 or semiconductor components.

[0111] The housing body 5 forms two cavities 51, 52, wherein each of the lead frame parts 41, 42 and optionally the other lead frame part 83 is partially exposed due to the cavities 51, 52, so that the inner side 43 is accessible. The cavities 51, 52 are preferably surrounded on all sides by a cavity wall 53. It is possible that the cavity wall 53 between the cavities 51, 52 is lower than at the outer side wall 55.

[0112] The welding control points 47 are, for example, respectively completely covered by the associated cavity wall 53. It is possible that the gap 72 is only partially concealed by the corresponding cavity wall 53. The groove 7, which can be completely or substantially completely filled by the housing body 5, is located at the cavity wall 53. For example, the inner edge of the cavity wall 53 is located at the inner side 43 and the outer side wall of the groove 7 closer to the associated side wall 55 is in a common plane perpendicular to the inner side 43. This applies, for example, with a tolerance of at most 0.2 mm.

[0113] Due to this position of the groove 7, it is possible that the relatively large first leadframe part 41 can yield to stress, ie can have a slight curvature along the groove 7. As a result, the edge region 46 adheres better to the cavity wall 53 than in the case of a first leadframe part 41 of constant thickness.

[0114] This subdivision of the first leadframe part 41 into an edge region 46 with optional soldering control points 47 and a mounting region 45 due to the groove 7 can be particularly advantageous. Figure 3It can be seen in FIG. 4 that the housing body 5 extends continuously between the edge region 46 and the assembly region 45 .

[0115] Figures 1 to 5 The illustrations in the drawings are drawn to scale. For example, the 2720 component is involved.

[0116] exist Figure 6 An example of an optoelectronic semiconductor component 1 is shown in FIG. Figure 2 and 3 The optoelectronic semiconductor chip 3 and other semiconductor chips 31, such as an ESD protection chip, are soldered in the cavities 51, 52. The electrical connection is made via electrical connection means 6, such as bonding wires.

[0117] The groove 7 has a groove depth D, which is, for example, between 40% and 60% of the total thickness T of the leadframe parts 41, 42, 83. In order to ensure a sufficient reduction in the bending stiffness of the first leadframe part 41 in the region of the groove 7, the groove 7 preferably has a width B, such that it applies that: 0.8T≤B≤2T or 1.2T≤B≤1.6T. This also applies in all other examples.

[0118] exist Figure 6 As a further option, the cavities 51, 52 can be partially or completely filled with a filler 54. The filler 54 is, for example, a silicone substance which can contain at least one compound such as light scattering particles, luminescent materials and / or filter materials.

[0119] Combination Figure 7 The manufacturing method for the housing 2 is schematically illustrated. Here, the housing 2 is for example combined with Figures 1 to 5 Build as described.

[0120] The lead frame assembly 40, half-etched from both main sides thereof, with a plurality of lead frame units 4, is placed on a carrier 84, for example a film for film-assisted molding (Film-Assisted Molding or FAM for short). The housing assembly 20 is produced on the carrier 84. The adjacent units are subsequently separated along the separation lines 82, thereby obtaining the individual components and the side walls 55. The semiconductor chips 3, 31, the electrical connections 6 and the optional filler 54 are preferably already placed before the separation.

[0121] In addition, Figure 7 4 illustrates that only the area of ​​the outer side 44 that is not shielded by the housing body 5 is shielded by a metal coating 81 such as NiPdAu. The metal coating 81 also shields all exposed surfaces of the pockets that form the solder control points 47. Such a metal coating 81 can be formed in such a way that the metal coating 81 is applied only after the housing body 5 is produced.

[0122] exist Figure 8 Shown in Figure 1 A variant of the lead frame unit in 94, and in Fig. 9 Shown in Figure 2 A variant 92 of the housing is shown which does not show the groove at the first lead frame part 41. Thus, in the hazardous area (see Figure 6 ) shows an increased risk that the first lead frame part 41, in particular during welding, cannot adequately compensate for the mechanical thermal stresses and detaches from the housing body 5 in the region of the cavity wall 53. The risk of such delamination is significantly reduced by the grooves 7 in the lead frame unit 4 described here.

[0123] exist Fig.10 Other examples of lead frame units 4 are illustrated in FIG. The housing 2 to which it belongs can be Fig.11 can be seen in; for Fig.11 The cutting line of the cross section is Fig.10 In the figure, the dotted line is drawn. Figures 1 to 5 Unlike the case of the structural form of the embodiment of the present invention, the groove 7 is semicircular in cross section and is not angular.

[0124] As a further option, it is possible that the slit 72 in the first leadframe part 41 completely penetrates the groove 7 at the outer side 44. Thus, two sub-grooves extending in extension to each other are present at the outer side 44. Thus, apart from the groove 7, the slit 72 of the two leadframe parts 41, 42 can be formed in the same way.

[0125] These configurations of the grooves 7 and the slots 72 are correspondingly possible in all other examples.

[0126] Fig.10 and 11 The illustrations are drawn to scale. For example, it relates to a 2720 component.

[0127] In addition, Figures 1 to 7 The statement applies in the same way to Fig.10 and 11 , and vice versa.

[0128] exist Fig.12 Another example of the lead frame unit 4 is illustrated in FIG. Fig.13 It can be seen that; for Fig.13 The cutting line of the cross section is Fig.12 Draw with dotted lines.

[0129] The first lead frame portion 41 has a plurality of edge regions 46, each of which has one of the welding control points 47. Therefore, the welding control points 47 of the first lead frame portion 41 exist at three side walls of the cubic housing 2, and the other welding control points 49 of the second lead frame portion 42 are located at the fourth side wall.

[0130] Therefore, three of the grooves 7 exist in the first lead frame portion 41. The second lead frame portion 42 may be groove-free.

[0131] Optionally, as also in all other examples, the mounting region 45 of the first leadframe part 41 can be provided with corner extensions 85 in order to increase the stability of the housing 2 .

[0132] Fig.12 and 13 The illustrations are drawn to scale. For example, it relates to a 2720 component.

[0133] In addition, for Figures 1 to 11 The statement applies in the same way to Fig.12 and 13 , and vice versa.

[0134] exist Fig.14 Variant 94 is shown, which corresponds to Fig.12 .

[0135] exist Fig.15 Another example of the lead frame unit 4 is illustrated in FIG. Fig.16 It can be seen that; for Fig.16 The cutting line of the cross section is Fig.15 Draw with dotted lines.

[0136] The mounting area 45 is formed to be elongated, and the welding control points 47, 49 are located at the short sides of the lead frame unit 4. The first lead frame part 41 in turn has a groove 7.

[0137] exist Fig.15 : The second leadframe part 42 can also have further grooves 71 in order to place further welding control points 49 in the edge region. Such further grooves 71, to which the statements for the grooves 7 apply correspondingly, can also be present in all other examples, especially in Figure 1 , 10 , 12, 18 and 19.

[0138] Fig.15 and Fig.16 The illustrations are drawn to scale. For example, the 4014 component is involved.

[0139] In addition, for Figures 1 to 14 The statement applies in the same way to Fig.15 and 16 , and vice versa.

[0140] exist Fig.17 Variant 94 is shown, which corresponds to Fig.15 .

[0141] Fig.18 and 19 The example is based on Fig.15 , and shows that the groove 7 does not necessarily have to be continuous.

[0142] Thus, in Fig.18 A central crossbar 73 is present in the groove 7 of the first lead frame part 41, which crossbar extends through the groove 7 over the full thickness of the first lead frame part 41. However, in a direction parallel to the longitudinal axis of the groove 7, the crossbar 73 is narrow, so that the bending ability of the first lead frame part 41 is not significantly reduced by the crossbar 73.

[0143] In contrast, Fig.19 The groove 7 of is equipped with two crossbars 73. The crossbars 73 are located at the ends of the groove 7 and thus close the groove 7, so that a pocket 74 is obtained. Due to the two crossbars 73, the pocket 74 can remain without the housing body 5.

[0144] As in Fig.18 and 19 Such a crossbar 73 can also be present in all other examples as illustrated in FIG. 1. If other grooves 71 are present at the second leadframe portion 42, such a crossbar 73 can also be used in the case of other grooves 71.

[0145] Fig.15 and 16 The illustrations are drawn to scale. For example, the 4014 component is involved.

[0146] In addition, for Figures 1 to 16 The statement applies in the same way to Fig.17 and 18 And vice versa.

[0147] Unless otherwise stated, the components shown in the figures preferably follow one another in the order in which they are described, in particular directly one another. Components that do not touch one another in the figures preferably have a distance from one another. If the lines are drawn parallel to one another, the associated surfaces are preferably also aligned parallel to one another. Furthermore, the relative positions of the drawn components to one another are reproduced correctly in the figures unless otherwise stated.

[0148] The invention described here is not limited to the description based on the exemplary embodiments. On the contrary, the invention includes every new feature and every combination of features, which in particular includes every combination of features in the patent claims, even if this feature or this combination itself is not explicitly described in the patent claims or exemplary embodiments.

[0149] This patent application claims the priority of German patent application 10 2022 112 609.9, the disclosure content of which is hereby incorporated herein by reference.

[0150] Reference numerals list

[0151] 1 Optoelectronic semiconductor components

[0152] 2 Housing

[0153] 20 Shell complex

[0154] 3 Optoelectronic semiconductor chips

[0155] 31 Other semiconductor chips

[0156] 4 Lead frame unit

[0157] 40 Lead frame assembly

[0158] 41 first lead frame portion

[0159] 42 Second, especially the smaller lead frame part

[0160] 43 Inside

[0161] 44 outside

[0162] 45 Installation area

[0163] 46 Edge Area

[0164] 47 welding control points

[0165] 48 Support rod

[0166] 49 Other welding control points

[0167] 5 Shell body

[0168] 51 First cavity

[0169] 52 Second cavity

[0170] 53 Cavity wall

[0171] 54 Filling, especially the first cavity

[0172] 55 Outer wall

[0173] 6Electrical connection device

[0174] 7 Grooves

[0175] 71Other grooves

[0176] 72 Gap

[0177] 73 crossbar

[0178] 74 Bag

[0179] 81 Metal Cladding

[0180] 82 separation line

[0181] 83Other lead frame parts

[0182] 84 carrier

[0183] 85 angle extension

[0184] 92 Shell variants

[0185] 94 Lead Frame Unit Variants

[0186] B Groove Width

[0187] D Groove Depth

[0188] TTotal thickness of the lead frame part

[0189] X Danger Zone.

Claims

1. A housing (2) for an optoelectronic semiconductor chip (3), comprising: - a first lead frame portion (41) and a second lead frame portion (42), - a housing body (5) which mechanically connects the first and second lead frame parts (41, 42) to one another, wherein the first leadframe part (41) has a mounting region (45) for accommodating the semiconductor chip (3) and / or for accommodating the electrical connection device (6) and an edge region (46) at a side edge of the housing (2), - the first leadframe part (41) has a groove (7) between the mounting region (45) and the edge region (46), and the groove (7) is located at the outer side (44) of the first lead frame part (41), and the outer side (44) is provided for mounting the housing (2), and the mounting area (45) and the edge area (46) extend straight toward the outer side (44), the housing body (5) forms a first cavity (51), and in the first cavity (51), the inner side (45) of the first lead frame part (41) provided for accommodating the semiconductor chip (3) is free of the housing body (5), - when viewed from above on the inner side (45), the edge region (46) is at least partially covered by a cavity wall (53) of the first cavity (51), and - When viewed from above on the inner side ( 45 ), all ends of the groove ( 7 ) are located in the first cavity ( 51 ).

2. A housing (2) according to the preceding claim, The groove (7) extends continuously between the mounting area (45) and the edge area (46).

3. The housing (2) according to claim 1, wherein the groove (7) is interrupted by one or more crossbars (73), and at least one crossbar (73) is exactly as thick as the mounting region (45) and the edge region (46), The width of the crossbar (73) or the sum of the widths of all crossbars (7) along the groove (7) is at most 40% of the total length of the groove (7) including at least one crossbar (73).

4. A housing (2) according to any one of the preceding claims, The groove (7) is partially or completely filled by the housing body (5).

5. A housing (2) according to any one of the preceding claims, The housing body (5) further forms a second cavity (52), so that the inner side (45) of the second lead frame part (42) is exposed.

6. A housing (2) according to any one of the preceding claims, In this case, when viewed in a plan view of the inner side ( 45 ), the groove ( 7 ) is located completely within the first cavity ( 51 ).

7. A housing (2) according to any one of the preceding claims, In this case, when viewed in plan view of the inner side ( 45 ) and in the direction of the edge region ( 46 ), the groove ( 7 ) borders on the cavity wall ( 53 ) of the first cavity ( 51 ).

8. A housing (2) according to any one of the preceding claims, wherein the edge region (46) comprises at least one welding control point (47), The welding control point (47) is freely accessible from the outer side wall (55) of the housing (2).

9. Housing (2) according to the preceding claim, A metal coating (81) is applied to the first leadframe part (41) at least in the region of the welding control points (47).

10. Housing (2) according to any of the two preceding claims, The edge region (46) includes a plurality of welding control points among the welding control points (47), The welding control points (47) are subdivided from one another in a direction transverse to the groove (7) by slots (72) passing through the first leadframe part (41).

11. Housing (2) according to the preceding claim, The slot (72) cuts partially or completely through the groove (7).

12. Housing (2) according to any of the two preceding claims, The gap (72) widens locally in a direction away from the welding control point (47) and in a direction toward the groove (7).

13. A housing (2) according to any one of the preceding claims, In this case, the groove (7) is at least partially semicircular or quadrilateral when viewed in cross section.

14. A housing (2) according to any one of the preceding claims, wherein the trench depth (D) is at least 35% and at most 65% of the total thickness (T) of the first leadframe portion (41), The total thickness (T) is between 100 μm and 250 μm, inclusive.

15. The housing (2) according to any one of the preceding claims, The width (B) of the groove (7) is at least 50% and at most 200% of the total thickness (T) of the first lead frame portion (41).

16. A housing (2) according to any one of the preceding claims, wherein the first lead frame portion (41) is larger than the second lead frame portion (42), The second lead frame portion (42) includes a mounting area (45) and additional welding control points (49).

17. Housing (2) according to the preceding claim, The thickness of the second lead frame portion (42) between the additional welding control point (49) and the mounting area (45) remains unchanged.

18. The housing (2) according to claim 16, The further groove (71) is located between the further welding control point (49) and the mounting area (45) of the second lead frame portion (42).

19. A housing (2) according to any one of the preceding claims, The invention comprises a plurality of edge regions among the edge regions (46), wherein the edge regions are respectively separated from the mounting region (45) of the first lead frame portion (41) by grooves (7).

20. A lead frame unit (4) for a housing (2) of an optoelectronic semiconductor chip (3), comprising a first lead frame part (41) and a second lead frame part (41), wherein the first lead frame part (41) has a mounting region (45) for accommodating the semiconductor chip (3) and / or for accommodating the electrical connection device (6) and an edge region (46) at a side edge of the lead frame unit (4), - the first leadframe part (41) has a groove (7) between the mounting region (45) and the edge region (46), and The groove (7) is located at the outer side (44) of the first leadframe part (41), and the outer side (44) is provided for planar solder mounting of the mounting area (45) and the edge area (46).

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