Multi-temperature-field automatic thermal cycle test device and test method thereof

Abstract

The invention provides a multi-temperature-field automatic thermal cycle test device and a test method thereof. The multi-temperature-field automatic thermal cycle test device comprises an automatic material conveying unit, a high-temperature environment field unit, a low-temperature environment field unit, a room-temperature environment field unit, an electrical control unit and an outer frame platform unit, the automatic material conveying unit comprises a lifting storage rack, a lifting operation mechanical arm and a rotating main shaft; the high-temperature environment field unit comprises a high-temperature environment box body which can be opened and closed, and an electric heating element is mounted in the high-temperature environment box body; the low-temperature environment field unit comprises a low-temperature environment box body which can be opened and closed, and a liquid nitrogen refrigerating device is mounted in the low-temperature environment box body; the room temperature environment field unit comprises a room temperature field fan. A plurality of temperature fields are adopted, a refrigerating medium is used for achieving rapid cooling at the low temperature, a heating wire is used for achieving rapid heating at the normal temperature in the air environment and at the high temperature, the multiple temperature fields are provided at the same time or different temperature fields can be rapidly switched, and thermal cycle test research under large-range temperature changes can be carried out.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature control, and in particular to a multi-temperature field automatic thermal cycle test device and a test method thereof. Background Art

[0002] In aerospace applications, many key components are repeatedly exposed to low and high temperature environments during service. In order to study the performance changes of materials or components after repeated exposure to extreme environments, a multi-temperature field automatic thermal cycle test device is required.

[0003] The existing Chinese patent with publication number CN115727434A discloses an automatic temperature control device, system and method. The automatic temperature control device is connected to a control device, and the control device is used to obtain the temperature of the environment in which a work station is located and the target temperature of the work station. The automatic temperature control device is used to adjust the temperature of the environment in which the work station is located. The automatic temperature control device includes a bellows, a shielding member and a mobile drive assembly; an air inlet is provided on the bellows, and the air inlet is used to supply cold air into the bellows, and the bellows is connected to the environment in which the work station is located; the shielding member is arranged on the bellows, and is used to move on the bellows to shield the air inlet; the mobile drive assembly is connected to the control device, and the control device is used to compare the temperature of the environment in which the work station is located with the target temperature, and control the operation of the mobile drive assembly according to the comparison result, thereby driving the shielding member to move.

[0004] Existing temperature automatic control devices usually have a single temperature field, which means that there is only one temperature or only one temperature can be achieved at the same time. For example, a high-temperature furnace can only achieve high temperature requirements. A single environmental chamber can use a compressor or a refrigeration medium to achieve a low-temperature environment, or it can use electric heating wires to achieve a certain high-temperature environment. The compressor method has a slow cooling rate and a limited low temperature range; the cooling rate of the cooling medium (liquid nitrogen, liquid helium) is faster, but the dissipation of the cooling medium directly increases the economic cost of using the environmental chamber; in addition, the environmental chamber is heated by electric heating wires, and the fan stirs the air to achieve a slow heating rate in a high-temperature environment; some high-temperature furnaces use silicon carbon rod heating elements with a faster heating rate, but high-temperature furnaces can only achieve a high-temperature environment.

[0005] Therefore, the inventors believe that it is necessary to provide a multi-temperature field automatic thermal cycle test device, which has multiple temperature fields including low temperature, normal temperature, and high temperature, and has the ability to quickly switch between different temperature fields and stably control the specified temperature. In addition, multiple temperature field switches also need to consider time and economic costs, so as to be able to conduct thermal cycle test research under a wide range of temperature changes. Summary of the invention

[0006] In view of the defects in the prior art, an object of the present invention is to provide a multi-temperature field automatic thermal cycle test device and a test method thereof.

[0007] A multi-temperature field automatic thermal cycle test device provided by the present invention comprises:

[0008] Automatic material conveying unit: comprising a lifting rack, a lifting operation mechanical arm and a rotating spindle, wherein the rotating spindle can rotate around its central axis, the lifting operation mechanical arm is fastened to the rotating spindle, the lifting operation mechanical arm is drivingly connected to the lifting rack, and the lifting rack can move up and down;

[0009] High temperature environment field unit: comprising a high temperature environment box that can be opened and closed, wherein an electric heating element is installed inside the high temperature environment box;

[0010] Low temperature environment field unit: comprising a low temperature environment box that can be opened and closed, wherein a liquid nitrogen refrigeration device is installed inside the low temperature environment box;

[0011] Room temperature environment field unit: including a normal temperature field fan, the high temperature environment box and the low temperature environment box are relatively arranged on both sides of the rotating main shaft, the two normal temperature field fans are relatively arranged on both sides of the rotating main shaft, and the high temperature environment box, the low temperature environment box and the two normal temperature field fans are arranged in a cross shape;

[0012] Electrical control unit: electrically connected to the high temperature environment field unit, the low temperature environment field unit, the room temperature environment field unit, and the automatic material conveying unit respectively;

[0013] External frame platform unit: serves as the installation basis.

[0014] Preferably, the high temperature environment field unit further comprises: a high temperature box temperature controller and a high temperature box fan, wherein the high temperature box fan is arranged on the back of the high temperature environment box;

[0015] The high temperature box temperature controller includes a high temperature thermocouple for measuring temperature. Three high temperature thermocouples are installed in the high temperature environment box, and each of the three high temperature thermocouples is connected to a temperature sensor.

[0016] The electric heating elements are mounted on four vertical inner side walls of the high temperature environment box.

[0017] Preferably, the high temperature environment box body comprises a high temperature box upper door of the translational opening type, the middle contact surface of the high temperature box upper door is covered with thermal insulation material, and the high temperature box upper door is connected to a high temperature box opening and closing door driving device.

[0018] Preferably, the low temperature environment field unit further comprises: a low temperature box temperature controller and a low temperature box fan, the low temperature box temperature controller comprises a low temperature thermocouple for measuring temperature, and the low temperature thermocouple is connected to a temperature sensor;

[0019] The cryogenic box fan and the liquid nitrogen refrigeration device are installed on the same side of the cryogenic environment box, and the low-temperature thermocouple is installed at the air outlet of the cryogenic box fan;

[0020] The liquid nitrogen refrigeration device comprises a liquid nitrogen solenoid valve for controlling the inflow and outflow of liquid nitrogen, and the liquid nitrogen solenoid valve is connected to the interior of the low temperature environment box through a copper tube.

[0021] Preferably, the low-temperature environment box body includes a low-temperature box upper door of the type of translational opening, the middle contact surface of the low-temperature box upper door is covered with thermal insulation material, anti-ice and snow paint is arranged on the translational slide rail of the low-temperature box upper door, and the low-temperature box upper door is connected to a low-temperature box opening and closing door drive device.

[0022] Preferably, a rotating drive device is installed at the bottom of the rotating spindle, and the rotating drive device includes: a spindle gear, a rotating conductive slip ring, a spindle rotating motor, and a spindle rotating driving gear. The spindle rotating motor is drivingly connected to the spindle rotating driving gear, and the spindle rotating driving gear is drivingly connected to the spindle gear.

[0023] Preferably, the lifting operation mechanical arm comprises a lifting rope, a lifting support wheel disc, a lifting drive wheel disc and a lifting wheel disc drive motor, the lifting wheel disc drive motor is drivingly connected to the lifting drive wheel disc, the lifting rope is wound around the lifting support wheel disc and the lifting drive wheel disc, and the lifting rack is connected to the end of the lifting rope;

[0024] The lifting rack is a hollow frame structure.

[0025] Preferably, the outer frame platform unit includes: a test device base, a high and low temperature environment box fixing frame, and a test platform. The control instrument panel of the electrical control unit is installed on the test platform, and the outer frame of the high temperature environment box and the outer frame of the low temperature environment box are both fastened to the high and low temperature environment box fixing frame.

[0026] According to a test method of a multi-temperature field automatic thermal cycle test device provided by the present invention, the multi-temperature field automatic thermal cycle test device is used, including sequentially performing the following cycles: high temperature environment test, normal temperature environment test, low temperature environment test, and normal temperature environment test.

[0027] Preferably, the high temperature environment test comprises the following steps: rotating the rotating main shaft to drive the lifting rack containing the sample to move to the top of the high temperature environment box, opening the door of the high temperature environment box, controlling the lifting operation mechanical arm to descend to the inside of the high temperature environment box, closing the door of the high temperature environment box, heating and heat preservation for testing, opening the door of the high temperature environment box, controlling the lifting operation mechanical arm to ascend and leave the high temperature environment box, closing the door of the high temperature environment box, and rotating the rotating main shaft to drive the lifting rack containing the sample to move to the room temperature environment field unit;

[0028] The low temperature environment test comprises the following steps: rotating the rotating main shaft to drive the lifting rack containing the sample to move to the top of the low temperature environment box, opening the door of the low temperature environment box, controlling the lifting rack to descend to the inside of the low temperature environment box by the lifting operation mechanical arm, closing the door of the low temperature environment box, cooling and preserving the temperature for the test, opening the door of the low temperature environment box, controlling the lifting rack to rise and leave the low temperature environment box by the lifting operation mechanical arm, closing the door of the low temperature environment box, and rotating the rotating main shaft to drive the lifting rack containing the sample to move to the room temperature environment field unit;

[0029] The normal temperature environment test includes the following steps: rotating the rotating spindle to drive the lifting rack containing the sample to move to the room temperature environment field unit, the lifting operation robot arm controls the lifting rack to descend, the normal temperature field fan works to perform the test, the lifting operation robot arm controls the lifting rack to rise, and the rotating spindle is rotated to drive the lifting rack containing the sample to move above the high temperature environment box / low temperature environment box.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] 1. The present invention adopts multiple temperature fields including low temperature, normal temperature and high temperature. The low temperature uses a refrigeration medium to achieve rapid cooling, the normal temperature is in an air environment, and the high temperature uses a heating wire to achieve rapid heating. Multiple temperature fields are available at the same time or different temperature fields can be quickly switched. Thermal cycle test research under a wide range of temperature changes including low temperature, normal temperature and high temperature can be carried out to simulate the temperature changes of the test piece under actual service working conditions.

[0032] 2. The present invention uses PID to stably control the temperature of the low-temperature environment field and the high-temperature environment field, and the lifting rack reciprocates around the rotating main axis. The switch door above the environment field is controlled by a pneumatic valve to achieve automatic control of temperature field switching, which can achieve stable control of the specified temperature and automatic control of temperature field switching.

[0033] 3. The present invention reaches the specified temperature when on standby in the low-temperature environment field and the high-temperature environment field. When the sample is taken out and put in, there is a temperature fluctuation when the door is opened and closed, and the sample is quickly cooled or heated to the required temperature. When the sample is in the normal temperature field, a fan is used to blow air, which can make the sample cool down or heat up to normal temperature faster, so as to reduce the temperature difference between it and the next temperature field; it can reduce the heating and cooling time of the sample, and also reduce the use of cooling medium, thereby reducing time and economic costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0035] Figure 1 This is a schematic diagram of the structure of a multi-temperature field automatic thermal cycle test device mainly embodied in the present invention;

[0036] Figure 2 The figure is a top view of the multi-temperature field automatic thermal cycle test device mainly embodied in the present invention.

[0037] As shown in the figure:

[0038] Rotating spindle 1 Spindle gear 2 Rotating conductive slip ring 3

[0039] Spindle rotation motor 4 Spindle rotation drive gear 5 High temperature environment box 6

[0040] Electric heating element 7 High temperature thermocouple 8 Door opening and closing drive device 9

[0041] High temperature box upper door 10 lifting rack 11 hanging rope 12

[0042] Lifting support wheel 13 Lifting drive wheel 14 Lifting operation mechanical arm 15

[0043] Low temperature box upper door 16 Low temperature box door opening and closing drive device 17 Liquid nitrogen solenoid valve 18

[0044] Low temperature thermocouple 19 Low temperature box fan 20 Low temperature environment box 21

[0045] Normal temperature field fan 22 Lifting wheel drive motor 23 Test platform 24

[0046] Control instrument panel 25 DETAILED DESCRIPTION

[0047] The present invention is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several changes and improvements can also be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0048] Example 1

[0049] like Figure 1 and 2 As shown, a multi-temperature field automatic thermal cycle test device provided according to the present invention includes: an automatic material conveying unit, a high temperature environment field unit, a low temperature environment field unit, a room temperature environment field unit, an electrical control unit, and an outer frame platform unit. The automatic material conveying unit includes a lifting rack 11, a lifting operation robot arm 15, and a rotating spindle 1. The rotating spindle 1 can rotate around its central axis. The lifting operation robot arm 15 is fastened to the rotating spindle 1. The lifting operation robot arm 15 is drivingly connected to the lifting rack 11, and the lifting rack 11 can move up and down; the high temperature environment field unit includes a high temperature environment box 6 that can be opened and closed, and an electric heating element 7 is installed inside the high temperature environment box 6; the low temperature environment field unit includes a low temperature environment box 21 that can be opened and closed, and the low temperature environment A liquid nitrogen refrigeration device is installed inside the box 21; the room temperature environment field unit includes a normal temperature field fan 22 and a storage platform, the high temperature environment box 6 and the low temperature environment box 21 are relatively arranged on both sides of the rotating main shaft 1, and the two normal temperature field fans 22 are relatively arranged on both sides of the rotating main shaft 1, and the high temperature environment box 6, the low temperature environment box 21 and the two normal temperature field fans 22 are arranged in a cross shape; the electrical control unit is electrically connected to the high temperature environment field unit, the low temperature environment field unit, the room temperature environment field unit, and the automatic material conveying unit respectively; the outer frame platform unit serves as the installation base.

[0050] The present application includes a variety of temperature fields, which are used for thermal cycle test research of samples and structures under a wide range of temperature changes such as low temperature, normal temperature and high temperature, to simulate the temperature changes of the test pieces under actual service working conditions. The high temperature environment box 6 and the low temperature environment box 21 are placed relative to each other, and the adjacent positions on the left and right are the normal temperature field areas. The fan 22 is arranged in the normal temperature field to realize the temperature transition of the test piece from the low temperature field to the high temperature field or from the high temperature field to the low temperature field. In actual applications, it is possible to test a single sample, or to test two to four samples at the same time, that is, to switch scenes by controlling the corresponding lifting racks 11 through multiple lifting and operating mechanical arms 15.

[0051] The electrical control unit includes the electrical control parts of all functional units of this application, namely, high temperature heating control, low temperature cooling control, normal temperature control, automatic door opening and closing control of high and low temperature environmental chambers, material transfer rotation control, and shelf lifting control. The electrical control system integrates high temperature and low temperature signals, and the control panel realizes the setting, recording, control and feedback of the test environment parameters (test temperature, insulation time). At the same time, it controls the logical sequence of the automatic door opening and closing of the high and low temperature environmental chambers, the lifting of the shelf, and the material transfer rotation actions.

[0052] The control instrument panel 25 of the electrical control unit is connected to the temperature sensor to directly control the high temperature and low temperature functional units. The relevant parameters are set on the control instrument panel 25 to control the temperature rise, insulation and cooling of the environmental box with high precision and stability in certain program steps. The external power socket switch includes a grounding wire, and the control instrument panel 25 has over-temperature alarm protection and timing functions to ensure the safety of equipment and operators. The high temperature environment field unit also includes: a high temperature box temperature controller and a high temperature box fan. The high temperature box temperature controller includes a high temperature thermocouple 8 for measuring temperature. Three high temperature thermocouples 8 are installed in the high temperature environment box 6, and the three high temperature thermocouples 8 are connected to temperature sensors respectively. The high temperature box temperature controller is connected to the temperature sensor, and the electric heating element 7 is controlled to work according to the measured temperature feedback of the temperature sensor. High temperature thermocouples 8 are installed in the upper, middle and lower positions of the high temperature environment box 6 to measure the temperature, and the control panel is fed back to perform PID control on the working power of the upper, middle and lower heating wires.

[0053] The electric heating element 7 is generally a heating wire, which is installed on the four vertical inner walls of the high temperature environment box 6, that is, located on the front, back, left and right sides of the high temperature environment box 6. After the heating wire is energized, it generates heat for heating the environment box. The high temperature box fan is located on the back of the high temperature environment box 6. When heating, the fan works, and hot air enters from the upper air inlet and exits from the lower air inlet, circulates in the environment box, and heats the environment box evenly.

[0054] The high temperature environment box has a cubic appearance, including an outer box frame and an inner box cavity. The high temperature environment box 6 also includes a high temperature box upper door 10 in a translational opening form, the middle contact surface of the high temperature box upper door 10 is covered with thermal insulation material, and the high temperature box upper door 10 is connected to a high temperature box door opening and closing drive device 9, which is generally driven by a pneumatic valve to realize the door opening and closing action. In the closed form, the thermal insulation material on the middle contact surface of the two opening doors can be passed through the lifting rope 12 connected to the lifting rack 11 without affecting the thermal insulation effect.

[0055] The low temperature environment field unit also includes: a low temperature box temperature controller and a low temperature box fan 20. The low temperature box temperature controller includes a low temperature thermocouple 19 for measuring temperature, and the low temperature thermocouple 19 is connected to a temperature sensor; the low temperature box fan 20 and the liquid nitrogen refrigeration device are installed on the same side of the low temperature environment box 21, and the low temperature thermocouple 19 is installed at the air outlet of the low temperature box fan 20; the liquid nitrogen refrigeration device includes a liquid nitrogen solenoid valve 18 for controlling the inlet and outlet of liquid nitrogen, and the liquid nitrogen solenoid valve 18 is connected to the inside of the low temperature environment box 21 through a copper tube. Liquid nitrogen is used as a refrigeration medium, and the liquid nitrogen solenoid valve 18 controls the inlet and outlet of liquid nitrogen. The thin copper tube is connected to the liquid nitrogen solenoid valve 18, and the copper tube outlet is close to the low temperature box fan 20. When cooling, the low temperature box fan 20 works, and the cold air circulates in the environment box to evenly cool the environment box. The temperature controller is connected to the temperature sensor, and the liquid nitrogen solenoid valve 18 is controlled to work according to the temperature measured by the temperature sensor. The low temperature thermocouple 19 is installed at the internal liquid nitrogen outlet to measure the temperature, and the feedback control instrument panel 25 controls the switch action of the liquid nitrogen valve.

[0056] The low-temperature environment box 21 has a cubic appearance, including an outer frame and an inner cavity. The low-temperature environment box 21 includes a low-temperature box upper door 16 in a translational opening form, the middle contact surface of the low-temperature box upper door 16 is covered with thermal insulation material, and anti-ice and snow coating is arranged on the translational slide rail of the low-temperature box upper door 16. The low-temperature box upper door 16 is connected to a low-temperature box door opening and closing drive device 17, which is generally driven by a pneumatic valve to realize the door opening and closing action. In the closed form, the thermal insulation material on the middle contact surface of the two opening doors can be passed through the lifting rope 12 connected to the lifting rack 11 without affecting the thermal insulation effect. Anti-ice and snow coating is arranged on the translational slide rail of the opening and closing doors to prevent low-temperature frost from affecting the normal operation of the door opening and closing.

[0057] A rotating drive device is installed at the bottom of the rotating spindle 1, and the rotating drive device includes: a spindle gear 2, a rotating conductive slip ring 3, a spindle rotating motor 4, and a spindle rotating driving gear 5. The spindle rotating motor 4 is drivingly connected to the spindle rotating driving gear 5, and the spindle rotating driving gear 5 is drivingly connected to the spindle gear 2. The spindle rotating motor 4 drives the rotating spindle 1 to work and rotate through the gears. Considering that the temperature cycle is more, the rotating spindle 1 rotates infinitely in a single direction, and the conductive slip ring 3 is installed at the bottom 1 of the rotating spindle to connect the power supply to prevent the power line from being entangled due to too many rotation cycles.

[0058] The rotating spindle 1 is used in conjunction with the spindle rotating motor 4, the spindle gear 2 and the spindle rotating driving gear 5. The rotating conductive slip ring 3 is installed at the lower part of the rotating spindle 1, and the power line of the lifting wheel drive motor 23 is arranged along the spindle 1 through the rotating conductive slip ring 3.

[0059] The lifting operation mechanical arm 15 includes a lifting rope 12, a lifting support wheel disc 13, a lifting drive wheel disc 14 and a lifting wheel disc drive motor 23. The lifting wheel disc drive motor 23 is connected to the lifting drive wheel disc 14. The lifting rope 12 is wound around the lifting support wheel disc 13 and the lifting drive wheel disc 14. The lifting rack 11 is connected to the end of the lifting rope 12. The lifting rack 11 can be lifted in and out of the environmental chamber by the lifting rope 12 connected to the lifting operation mechanical arm 15. The lifting operation mechanical arm 15 tightens and releases the lifting rope 12 by rotating the lifting support wheel disc 13 and the lifting drive wheel disc 14. The lifting operation mechanical arm 15 is fixed on the rotating main shaft 1. Each time the sample changes the environmental field, the rotating main shaft 1 rotates 90 degrees, and the lifting operation mechanical arm 15 rotates together with the lifting rope 12, the lifting rack 11 and the sample.

[0060] The lifting rack 11 is mainly used to place the sample, and the initial height of the built-in platform of the environmental chamber is adjusted according to the size of the test piece. The lifting rack 11 is a hollow frame structure, which is conducive to uniform heating of the test piece.

[0061] The sample is placed in the lifting rack 11, which is connected to the lifting operation mechanical arm 15 through the suspension rope 12. The lifting rack 11 is lifted and lowered by the lifting wheel drive motor 23 to drive the lifting drive wheel 14. The lifting operation mechanical arm 15 is installed on the rotating spindle 1, and the rotating spindle 1 drives the sample to switch the temperature field.

[0062] The outer frame platform unit includes: a test device base, a high and low temperature environment box fixed frame, and a test platform 24. A control instrument panel 25 of an electrical control unit is installed on the test platform 24. All parameter settings of this application are completed on the control panel 25. The outer frame of the high temperature environment box 6 and the outer frame of the low temperature environment box 21 are both fastened to the high and low temperature environment box fixed frame.

[0063] In aerospace applications, the temperature difference between solar charging panels before and after illumination is very different. In order to test the performance stability of the panel material during its normal service life, it is necessary to conduct temperature cycle tests with repeated low-temperature and high-temperature transitions. This temperature cycle test requires thousands or even tens of thousands of cycles. A single environmental chamber that can achieve high and low temperature environments usually takes more than an hour to cool down from a high temperature of 200°C to -190°C and maintain stability. Similarly, it takes more than an hour to heat up from -190°C to 200°C and maintain stability. At the same time, the heating process consumes a lot of electrical energy, and the cooling process consumes a lot of cooling media. Regardless of the time cost and economic cost, an environmental chamber with a single temperature field is not suitable for the above scenarios.

[0064] The multi-temperature field automatic thermal cycle test device of the present application can be used as a single temperature field (low temperature or high temperature) or can perform automatic temperature rise and fall thermal cycle tests. The present application is particularly suitable for multiple thermal cycle tests to simulate extreme cold and high temperature environments.

[0065] The high temperature environment field and the low temperature environment field are on standby at the same time, and the normal temperature environment field plays a role in temperature transition. Reasonable setting of the relevant parameters of equipment material transfer can effectively speed up the progress of the test. Taking the circular arrangement of 1 high temperature environment field, 1 normal temperature environment field, 1 low temperature environment field, and 1 normal temperature environment field as an example, thermal cycle tests of 4 test pieces can be carried out at the same time. The material transfer is controlled by rotation, and a single test piece undergoes high temperature environment, normal temperature environment, low temperature environment, and normal temperature environment in turn (recorded as a temperature cycle). This cycle is repeated to carry out multi-temperature field automatic thermal cycle tests. The working logic sequence of the test device is shown in Table 1.

[0066]

[0067] Table 1 The working logic sequence of the test device

[0068] This application has multiple temperature fields including low temperature, normal temperature and high temperature. The low temperature uses a refrigeration medium to achieve rapid cooling, the normal temperature is in an air environment, and the high temperature uses a heating wire to achieve rapid heating. When the high temperature environment field space is large, a fan is used for stirring.

[0069] The multiple temperature fields of the present application are available at the same time or different temperature fields can be quickly switched. The three temperature fields included in the present application are on standby at the same time. The test samples are placed in a special rack, and the lifting rack 11 containing the samples is placed in or taken out of the low-temperature and high-temperature environmental fields by the lifting operation robot 15. The high and low temperature environmental fields are fixed when the test device is working. When the lifting rack 11 is taken out or put in, the switch door above the environmental field opens automatically, and when the low-temperature and high-temperature environmental fields are working, the switch door above is closed to achieve heat preservation. The lifting handle rotates around the rotating spindle 1, and the low-temperature environmental field and the high-temperature environmental field are relatively arranged in the first and third quadrants of the test device operating platform, respectively, and the second and fourth quadrants are normal temperature environmental fields.

[0070] The present application can realize the stable control of the specified temperature and the automatic control of the temperature field switching. The temperature of the low temperature environment field and the high temperature environment field is stably controlled by PID. The lifting handle automatically reciprocates around the rotating main axis 1, and the opening and closing door above the environment field is controlled by a pneumatic valve to realize the automatic control of the temperature field switching.

[0071] The multiple temperature field switching of this application fully considers the time and economic cost. The low temperature environment field and the high temperature environment field reach the specified temperature when on standby. When the sample is taken out and put in, there is a temperature fluctuation when the door is opened and closed, and the sample is quickly cooled or heated to the required temperature. When the sample is in the normal temperature field, a fan is used to blow air, which can make the sample cool down or heat up to normal temperature faster, so as to reduce the temperature difference with the next temperature field. This can not only reduce the time for the sample to heat up and cool down, but also reduce the use of cooling media to reduce costs.

[0072] Example 2

[0073] Based on Example 1, a test method for a multi-temperature field automatic thermal cycle test device provided according to the present invention adopts the multi-temperature field automatic thermal cycle test device of Example 1, including performing cycles in sequence: high temperature environment test, normal temperature environment test, low temperature environment test, and normal temperature environment test.

[0074] The high temperature environment test includes the following steps: rotating the rotating main shaft 1 to drive the lifting rack 11 containing the sample to move to the top of the high temperature environment box 6, the high temperature environment box 6 opens the door, the lifting operation mechanical arm 15 controls the lifting rack 11 to descend to the inside of the high temperature environment box 6, the high temperature environment box 6 closes the door, heating and heat preservation are carried out, the high temperature environment box 6 opens the door, the lifting operation mechanical arm 15 controls the lifting rack 11 to rise and leave the high temperature environment box 6, the high temperature environment box 6 closes the door, and the rotating main shaft 1 drives the lifting rack 11 containing the sample to move to the room temperature environment field unit;

[0075] The low temperature environment test includes the following steps: rotating the rotating main shaft 1 to drive the lifting rack 11 containing the sample to move to the top of the low temperature environment box 21, the low temperature environment box 21 opens the door, the lifting operation mechanical arm 15 controls the lifting rack 11 to descend to the inside of the low temperature environment box 21, the low temperature environment box 21 closes the door, the temperature is reduced and the heat is kept to perform the test, the low temperature environment box 21 opens the door, the lifting operation mechanical arm 15 controls the lifting rack 11 to rise and leave the low temperature environment box 21, the low temperature environment box 21 closes the door, and the rotating main shaft 1 drives the lifting rack 11 containing the sample to move to the room temperature environment field unit;

[0076] The normal temperature environment test includes the following steps: rotating the rotating main shaft 1 to drive the lifting rack 11 containing the sample to move to the room temperature environment field unit, the lifting operation robot arm 15 controls the lifting rack 11 to descend, the normal temperature field fan 22 works to perform the test, the lifting operation robot arm 15 controls the lifting rack 11 to rise, and the rotating main shaft 1 drives the lifting rack 11 containing the sample to move to above the high temperature environment box 6 / low temperature environment box 21.

[0077] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0078] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A multi-temperature field automatic thermal cycle test device, characterized in that: include: The automatic material conveying unit comprises a lifting rack (11), a lifting operation mechanical arm (15) and a rotating main shaft (1), wherein the rotating main shaft (1) is capable of rotating around its central axis, the lifting operation mechanical arm (15) is fixedly mounted on the rotating main shaft (1), the lifting operation mechanical arm (15) is drivingly connected to the lifting rack (11), and the lifting rack (11) is capable of moving up and down; The high temperature environment field unit comprises a high temperature environment box (6) that can be opened and closed, wherein an electric heating element (7) is installed inside the high temperature environment box (6); The low temperature environment field unit comprises a low temperature environment box (21) that can be opened and closed, wherein a liquid nitrogen refrigeration device is installed inside the low temperature environment box (21); The room temperature environment field unit comprises a normal temperature field fan (22), the high temperature environment box (6) and the low temperature environment box (21) are arranged on both sides of the rotating main shaft (1) in a relative manner, the two normal temperature field fans (22) are arranged on both sides of the rotating main shaft (1) in a relative manner, and the high temperature environment box (6), the low temperature environment box (21) and the two normal temperature field fans (22) are arranged in a cross shape; Electrical control unit: electrically connected to the high temperature environment field unit, the low temperature environment field unit, the room temperature environment field unit, and the automatic material conveying unit respectively; External frame platform unit: serves as the installation basis.

2. The multi-temperature field automatic thermal cycle test device according to claim 1, characterized in that: The high temperature environment field unit further comprises: a high temperature box temperature controller and a high temperature box fan, wherein the high temperature box fan is arranged on the back side of the high temperature environment box body (6); The high temperature box temperature controller comprises a high temperature thermocouple (8) for measuring temperature, three high temperature thermocouples (8) are installed in the high temperature environment box (6), and the three high temperature thermocouples (8) are respectively connected to a temperature sensor; The electric heating element (7) is installed on the four vertical inner side walls of the high temperature environment box (6).

3. The multi-temperature field automatic thermal cycle test device according to claim 1, characterized in that: The high temperature environment box body (6) comprises a high temperature box upper door (10) of the translationally movable opening type, the middle contact surface of the high temperature box upper door (10) is covered with heat insulation material, and the high temperature box upper door (10) is connected to a high temperature box door opening and closing drive device (9).

4. The multi-temperature field automatic thermal cycle test device according to claim 1, characterized in that: The low temperature environment field unit further comprises: a low temperature box temperature controller and a low temperature box fan (20), wherein the low temperature box temperature controller comprises a low temperature thermocouple (19) for measuring temperature, and the low temperature thermocouple (19) is connected to a temperature sensor; The cryogenic box fan (20) and the liquid nitrogen refrigeration device are installed on the same side of the low-temperature environment box (21), and the low-temperature thermocouple (19) is installed at the air outlet of the cryogenic box fan (20); The liquid nitrogen refrigeration device comprises a liquid nitrogen solenoid valve (18) for controlling the inflow and outflow of liquid nitrogen, and the liquid nitrogen solenoid valve (18) is connected to the interior of the low temperature environment box (21) through a copper tube.

5. The multi-temperature field automatic thermal cycle test device according to claim 1, characterized in that: The low temperature environment box (21) comprises a low temperature box upper door (16) of the type of translationally opening, the middle contact surface of the low temperature box upper door (16) is covered with thermal insulation material, anti-ice and snow coating is arranged on the translational slide rail of the low temperature box upper door (16), and the low temperature box upper door (16) is connected to a low temperature box door opening and closing drive device (17).

6. The multi-temperature field automatic thermal cycle test device according to claim 1, characterized in that: A rotation drive device is installed at the bottom of the rotating main shaft (1), and the rotation drive device comprises: a main shaft gear (2), a rotating conductive slip ring (3), a main shaft rotating motor (4), and a main shaft rotating driving gear (5). The main shaft rotating motor (4) is drivingly connected to the main shaft rotating driving gear (5), and the main shaft rotating driving gear (5) is drivingly connected to the main shaft gear (2).

7. The multi-temperature field automatic thermal cycle test device according to claim 1, characterized in that: The lifting operation mechanical arm (15) comprises a lifting rope (12), a lifting support wheel disc (13), a lifting drive wheel disc (14) and a lifting wheel disc drive motor (23); the lifting wheel disc drive motor (23) is drivingly connected to the lifting drive wheel disc (14); the lifting rope (12) is wound around the lifting support wheel disc (13) and the lifting drive wheel disc (14); and the lifting rack (11) is connected to the end of the lifting rope (12); The lifting rack (11) is a hollow frame structure.

8. The multi-temperature field automatic thermal cycle test device according to claim 1, characterized in that: The outer frame platform unit comprises: a test device base, a high and low temperature environment box fixing frame, and a test platform (24); a control instrument panel (25) of the electrical control unit is installed on the test platform (24); and the outer frame of the high temperature environment box (6) and the outer frame of the low temperature environment box (21) are both fastened to the high and low temperature environment box fixing frame.

9. A test method for a multi-temperature field automatic thermal cycle test device, characterized in that: The multi-temperature field automatic thermal cycle test device according to any one of claims 1 to 8 is used, comprising the following steps of sequentially performing a cycle: a high temperature environment test, a normal temperature environment test, a low temperature environment test, and a normal temperature environment test.

10. The test method of the multi-temperature field automatic thermal cycle test device according to claim 9, characterized in that: The high temperature environment test comprises the following steps: rotating the main rotating shaft (1) to drive the lifting rack (11) containing the sample to move to the top of the high temperature environment box (6), opening the door of the high temperature environment box (6), controlling the lifting rack (11) to descend to the inside of the high temperature environment box (6), closing the door of the high temperature environment box (6), heating and heat preservation for testing, opening the door of the high temperature environment box (6), controlling the lifting rack (11) to ascend and leave the high temperature environment box (6), closing the door of the high temperature environment box (6), rotating the main rotating shaft (1) to drive the lifting rack (11) containing the sample to move to the room temperature environment field unit; The low temperature environment test comprises the following steps: rotating the main rotating shaft (1) to drive the lifting rack (11) containing the sample to move to the top of the low temperature environment box (21), opening the door of the low temperature environment box (21), controlling the lifting rack (11) to descend to the inside of the low temperature environment box (21), closing the door of the low temperature environment box (21), cooling and preserving the temperature for testing, opening the door of the low temperature environment box (21), controlling the lifting rack (11) to ascend and leave the low temperature environment box (21), closing the door of the low temperature environment box (21), rotating the main rotating shaft (1) to drive the lifting rack (11) containing the sample to move to the room temperature environment field unit; The normal temperature environment test comprises the following steps: rotating the rotating main shaft (1) to drive the lifting rack (11) containing the sample to move to the room temperature environment field unit, the lifting operation mechanical arm (15) controls the lifting rack (11) to descend, the normal temperature field fan (22) works to perform the test, the lifting operation mechanical arm (15) controls the lifting rack (11) to ascend, and the rotating main shaft (1) drives the lifting rack (11) containing the sample to move to the top of the high temperature environment box (6) / low temperature environment box (21).

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