Linear resin feeding mechanism of integrated circuit plastic packaging equipment

Abstract

The invention discloses a linear resin feeding mechanism for integrated circuit plastic packaging equipment, and particularly relates to the technical field of integrated circuit plastic packaging equipment.The linear resin feeding mechanism is characterized in that resin is firstly arranged through an arraying assembly, the resin which is irregularly arranged is arrayed into resin which is vertically and linearly arranged, and the height of the resin is screened through a detection sensor; unqualified resin is removed, and qualified resin is guided into the pusher dog according to the specified step pitch; the carrying assembly grabs all qualified resin from the pusher dog at a time and conveys the qualified resin to the position above the putting assembly, and all the resin is put at a time. The feeding assembly moves up and down, after resin in the resin clamp is lifted, the feeding assembly is matched with the pushing unit to start action, the resin in the resin clamp is fed into the feeding mechanical arm, and therefore the whole automatic resin feeding action is completed, and the working efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of integrated circuit plastic packaging equipment, in particular to a resin linear feeding mechanism for integrated circuit plastic packaging equipment. Background Art

[0002] Integrated circuits are microelectronic devices or components that use processes to interconnect components such as transistors and resistors and wiring, and are made on small semiconductor chips or dielectric substrates, and finally packaged in a tube shell. With the rapid development of the electronics industry, the degree of intelligence and mechanization of integrated circuit plastic packaging equipment is becoming higher and higher. Despite this, many manufacturers still use manual feeding racks to place resin materials into the mold when plastic packaging integrated circuits. This method of feeding is not only inefficient but also unsafe. Although the automatic packaging system uses a robot to automatically discharge materials, which can greatly liberate productivity, how to arrange, screen, and transport irregularly arranged resins efficiently in the resin clamp according to the required step distance, and then inject them into the robot, and finally put them into the mold has always been a very important technical breakthrough point, which is crucial to the operating efficiency of the entire equipment.

[0003] After searching, the invention patent with publication number CN111038983B discloses an automatic resin row loader, which effectively improves the degree of automation of the production process, greatly reduces the workload of employees, and reduces employees' direct contact with resin materials.

[0004] As shown in the attached picture Figure 6 The figure shows the feeding scheme adopted by the prior art, that is, the resin feeding of the conventional integrated circuit plastic packaging equipment adopts the feeding method of rotary feeding, that is, after the resin is arranged in a horizontal straight line by the resin loader, the resin is individually transported by the resin handling mechanical claw and driven into the rotating resin loading platform and arranged in a circular array. Then, the cylinder drives the single resin material into the resin clamp respectively, the resin material turning feeding mechanism turns over, and then the resin material collecting and pushing device pushes the resin into the feeding robot and puts it into the designated barrel, which reduces the efficiency of the resin feeding work. Summary of the invention

[0005] The object of the present invention is to provide a linear resin feeding mechanism for integrated circuit plastic packaging equipment to solve the problems mentioned in the above background technology.

[0006] The technical problems mainly solved by the present invention are:

[0007] The existing resin loading is carried separately and driven into the rotating resin loading platform respectively. A single resin material is driven into the resin clamp, the resin material is turned over by the feeding mechanism, and then the resin material collection and pushing device pushes the resin into the loading robot, resulting in low loading efficiency.

[0008] The present invention can be achieved through the following technical solutions:

[0009] A linear resin feeding mechanism for integrated circuit plastic packaging equipment, comprising an array assembly for arranging resins, a delivery assembly is arranged on one side of the array assembly, and a transport assembly for transferring the resins in the array assembly at one time is arranged above the delivery assembly;

[0010] The alignment component comprises a silo for storing resin, a vibration plate is fitted on the bottom surface of the silo, and an alignment track for vertically arranging the resin is connected to the discharge end of the silo, a detection sensor for detecting the height of the resin is provided at the end of the alignment track, a docking unit for storing qualified resin is slidably provided on one side of the detection sensor, and a waste collection bin for unqualified resin to fall into is provided below the detection sensor;

[0011] The transport assembly includes a second transverse linear motion module, a longitudinal linear motion module is slidably arranged on the second transverse linear motion module, and the second transverse linear motion module is vertically arranged to the longitudinal linear motion module, a clamping unit for fixing the resin is slidably installed on the longitudinal linear motion module, the clamping unit includes a plurality of clamping cylinders, and the bottom surface of the clamping cylinder is driven and connected with a clamping claw for clamping the resin;

[0012] The delivery assembly includes a support plate, a pulley unit is installed inside the support plate, a side plate frame is fixed to the belt surface of the pulley unit, at least one resin clamp is fixedly connected to the inner side of the side plate frame, and a pushing unit for ejecting resin into the loading robot is installed inside the side plate frame below the resin clamp.

[0013] A further technical improvement of the present invention is that the docking unit includes a transverse linear motion module 1 sliding in the direction close to the waste collection bin, a pusher claw is slidably mounted on the outside of the transverse linear motion module 1, and the upper end surface of the pusher claw is provided with a groove for qualified resin to enter.

[0014] A further technical improvement of the present invention is that the first transverse linear motion module is arranged in parallel with the second transverse linear motion module, and support frames are installed at both ends of the bottom surface of the second transverse linear motion module.

[0015] A further technical improvement of the present invention is that the clamping unit also includes a lifting cylinder slidably arranged with the longitudinal linear motion module, the pushing end of the lifting cylinder is connected to a movable plate, the bottom end of the movable plate is installed with a connecting shaft, the end of the connecting shaft is fixed with a mounting plate 1, and the lower surface of the mounting plate 1 is fixed to the mounting end surface of multiple clamping cylinders.

[0016] A further technical improvement of the present invention is that the pushing unit includes a mounting plate 2 arranged on the bottom inner side of the side plate frame, a lifting cylinder is installed on the bottom surface of the mounting plate 2, and a push rod mounting plate pushed by the lifting cylinder piston rod is installed above the mounting plate 2, and a push rod matching the number of resin clips is installed on the upper surface of the push rod mounting plate.

[0017] A further technical improvement of the present invention is that: a plug hole for the top end of the push rod to enter is provided on the bottom surface of the resin clamp, and the diameter of the hole groove for placing the resin on the resin clamp is larger than the diameter of the plug hole.

[0018] A further technical improvement of the present invention is that: the bottom surface of the support frame is connected to a base plate 2, the installation end of the waste collection bin and the transverse linear motion module 1 are connected to the same base plate 1, and the base plate 1 is arranged flush with the base plate 2.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. In the present invention, the resin is first arranged by the alignment component, and the irregularly arranged resin is arranged into a vertically straight resin, and the height of the resin is screened by the detection sensor to remove the unqualified resin, and the qualified resin is introduced into the inside of the claw according to the specified step distance; the transport component grabs all the qualified resin from the claw at one time, transports it to the top of the delivery component and delivers all the resin at one time; the delivery component moves up and down, and after the resin in the resin clamp is raised and lowered, it starts to work with the pusher unit, and the resin in the resin clamp is delivered to the loading robot, thereby completing the entire resin automatic loading action and improving work efficiency;

[0021] 2. The sliding docking unit is used to change the distance between the pusher claw and the end of the entire track, which facilitates the automatic loading of qualified resin and unqualified resin. After the qualified resin is loaded into the pusher claw, the position of the pusher claw is changed through the horizontal linear motion module, which facilitates the docking and grabbing of the handling components, with a high degree of fit. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0023] Figure 1 It is a schematic diagram of the external structure of the present invention;

[0024] Figure 2 It is a schematic diagram of the three-dimensional structure of the resin array assembly of the present invention;

[0025] Figure 3 It is a three-dimensional structural schematic diagram of the handling assembly of the present invention;

[0026] Figure 4 It is a three-dimensional structural schematic diagram of the transport assembly of the present invention in motion state;

[0027] Figure 5 It is a three-dimensional structural schematic diagram of the delivery component of the present invention;

[0028] Figure 6 It is a structural schematic diagram of the prior art.

[0029] In the figure: 1. Base plate 1; 2. Arrangement component; 20. Bin; 21. Vibration plate; 22. Arrangement track; 23. Detection sensor; 24. Pusher; 25. Horizontal linear motion module 1; 26. Waste collection bin; 3. Transport component; 30. Horizontal linear motion module 2; 31. Longitudinal linear motion module; 32. Moving plate; 33. Lifting cylinder; 34. Connecting shaft; 35. Mounting plate 1; 36. Clamping cylinder; 37. Clamping claw; 38. Support frame; 4. Delivery component; 40. Resin clamp; 41. Side plate frame; 42. Push rod; 43. Push rod mounting plate; 44. Support plate; 45. Pulley unit; 46. Mounting plate 2; 47. Lifting cylinder. DETAILED DESCRIPTION

[0030] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation methods, structures, features and effects of the present invention are described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0031] See also Figure 1-Figure 5As shown, the present invention provides a linear resin feeding mechanism for integrated circuit plastic packaging equipment, including an arranging component 2 for arranging resin, a delivery component 4 is arranged on one side of the arranging component 2, and a handling component 3 for transferring the resin in the arranging component 2 at one time is arranged above the delivery component 4; the arranging component 2 includes a silo 20 for storing resin, a vibration plate 21 is fitted on the bottom surface of the silo 20, and a arranging track 22 for vertically arranging the resin is connected to the discharge end of the silo 20, and a detection sensor 23 for detecting the height of the resin is arranged at the end of the arranging track 22, and the detection sensor 23 adopts a laser distance measuring sensor, and the height of the resin is obtained by calculating the propagation time of the laser beam, and a docking unit for storing qualified resin is slidably arranged on one side of the detection sensor 23, and the detection sensor 23 is a detection sensor for detecting the height of the resin. A waste collection bin 26 for unqualified resin to fall into is provided below the detection sensor 23. The alignment component 2, the transport component 3 and the delivery component 4 cooperate with each other. First, in the alignment component 2, irregular resin batches are placed in the silo 20. After being vibrated by the vibration plate 21, the resin is vertically and neatly arranged on the alignment track 22. Then, the detection sensor 23 quickly detects the height of the resin. When the detection is unqualified, the docking unit is away from the end of the alignment track 22, and the resin falls into the waste collection bin 26; when the detection is qualified, the docking unit is adjacent to the end of the alignment track 22, and the resin enters the docking unit one by one and is arranged according to the set distance (pitch). The docking unit slides in two directions, and then moves the resin to the specified position for the transport component 3 to grab the qualified resin at one time;

[0032] The transport assembly 3 includes a second transverse linear motion module 30, on which a longitudinal linear motion module 31 is slidably arranged, and the second transverse linear motion module 30 is vertically arranged with the longitudinal linear motion module 31, and a clamping unit for fixing the resin is slidably installed on the longitudinal linear motion module 31, and the clamping unit includes a plurality of clamping cylinders 36, and the bottom surface of the clamping cylinder 36 is driven and connected with a clamping claw 37 for clamping the resin, refer to Figure 1 and Figure 3 As shown, initially, after the resin passes through the alignment component 2, it is arranged in the docking unit according to the specified pitch. At this time, the clamping cylinder 36 in the clamping unit drives the clamping claw 37 to open, and under the joint movement of the horizontal linear motion module 2 30 and the longitudinal linear motion module 31, it moves to the top of the docking unit. Then the clamping cylinder 36 is closed, driving the clamping claw 37 to clamp the resin, and then moves to the position of the delivery component 4, which is convenient for the lifting and loading of the resin;

[0033] The delivery assembly 4 includes a support plate 44, a pulley unit 45 is installed inside the support plate 44, a side plate frame 41 is fixed to the belt surface of the pulley unit 45, at least one resin clamp 40 is fixedly connected to the inner side of the side plate frame 41, and a pushing unit for ejecting resin into the loading robot is installed inside the side plate frame 41 below the resin clamp 40, the resin is aligned directly above the resin clamp 40, the clamping cylinder 36 is in an open state, and the resin enters the resin clamp 40; then the side plate frame 41 is driven by the pulley unit 45 to move along the Z axis to the resin delivery position, and then the pushing unit starts to move, and the resin in the resin clamp 40 is delivered to the loading robot, thereby completing all the actions of resin loading of the plastic packaging equipment.

[0034] See also Figure 2 As shown, the docking unit includes a transverse linear motion module 25 that slides in the direction close to the waste collection bin 26. A pusher claw 24 is slidably installed outside the transverse linear motion module 25. The upper end surface of the pusher claw 24 is provided with a groove for qualified resin to enter. The position of the pusher claw 24 is changed by the transverse linear motion module 25 to facilitate handling and grabbing.

[0035] See also Figure 2 and Figure 3 As shown, the transverse linear motion module 1 25 is arranged in parallel with the transverse linear motion module 2 30 , and support frames 38 are installed at both ends of the bottom surface of the transverse linear motion module 2 30 to support the stability of the transverse linear motion module 2 30 .

[0036] See also Figure 3 and Figure 4 As shown, the clamping unit also includes a lifting cylinder 33 that is slidably arranged with the longitudinal linear motion module 31, and the pushing end of the lifting cylinder 33 is connected to the moving plate 32, and a connecting shaft 34 is installed at the bottom end of the moving plate 32, and a mounting plate 35 is fixed to the end of the connecting shaft 34. The lower surface of the mounting plate 35 is fixed to the mounting end surface of multiple clamping cylinders 36, and the clamping cylinder 36 is lifted and controlled by the lifting cylinder 33 connected to the moving plate 32, which facilitates the smooth transportation of the resin from the docking unit to the resin clamp 40.

[0037] See also Figure 5 As shown, the pusher unit includes a second mounting plate 46 fixed on the inner bottom of the side plate frame 41, a lifting cylinder 47 is installed on the bottom surface of the second mounting plate 46, and a push rod mounting plate 43 pushed by the piston rod of the lifting cylinder 47 is installed above the second mounting plate 46, and push rods 42 matching the number of resin clips 40 are installed on the upper surface of the push rod mounting plate 43;

[0038] The bottom surface of the resin clamp 40 is provided with a socket for the top end of the push rod 42 to enter, and the diameter of the hole for placing the resin on the resin clamp 40 is larger than the diameter of the socket. When pushed, the resin follows the pulley unit 45 to move along the Z axis to the delivery position, and the lifting cylinder 47 is actuated to drive the push rod mounting plate 43 and the push rod 42 to rise. At this time, the push rod 42 enters the resin clamp 40 through the socket at the bottom position, and the resin in the resin clamp 40 is delivered to the loading robot, and the resin loading is automatically completed.

[0039] See also Figure 1 and Figure 3 As shown, the bottom surface of the support frame 38 is connected to the base plate 2, and the installation ends of the waste collection bin 26 and the transverse linear motion module 1 25 are connected to the same base plate 1, and the base plate 1 is arranged flush with the base plate 2.

[0040] When the present invention is in use, the resin is first arranged by the alignment component 2, and the irregularly arranged resin is arranged into a vertically straight resin, and the height of the resin is screened by the detection sensor 23, and the distance between the claw 24 and the end of the alignment track 22 is controlled at the same time, so as to facilitate the removal of unqualified resin and the introduction of qualified resin into the claw 24 according to the specified step distance; the transport component 3 grabs all qualified resins from the claw 24 at one time, transports them to the top of the delivery component 4 and delivers all the resins at one time; the delivery component 4 moves up and down, and after the resin in the resin clamp 40 is raised and lowered, it starts to work in conjunction with the pushing unit to deliver the resin in the resin clamp 40 into the loading robot, thereby completing the entire resin automatic loading action and improving work efficiency.

[0041] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A linear resin feeding mechanism for integrated circuit plastic packaging equipment, characterized in that: It comprises an array assembly (2) for arranging resins, a delivery assembly (4) is arranged on one side of the array assembly (2), and a transport assembly (3) for transferring the resins in the array assembly (2) at one time is arranged above the delivery assembly (4); The alignment component (2) comprises a silo (20) for storing resin, a vibration plate (21) is fitted on the bottom surface of the silo (20), and an alignment track (22) for vertically arranging the resin is connected to the discharge end of the silo (20), a detection sensor (23) for detecting the height of the resin is arranged at the end of the alignment track (22), a docking unit for storing qualified resin is slidably arranged on one side of the detection sensor (23), and a waste collection bin (26) for unqualified resin to fall into is arranged below the detection sensor (23); The transport assembly (3) comprises a second transverse linear motion module (30), a longitudinal linear motion module (31) is slidably arranged on the second transverse linear motion module (30), and the second transverse linear motion module (30) is arranged perpendicular to the longitudinal linear motion module (31), a clamping unit for fixing the resin is slidably installed on the longitudinal linear motion module (31), the clamping unit comprises a plurality of clamping cylinders (36), and the bottom surface of the clamping cylinder (36) is drivingly connected to a clamping claw (37) for clamping the resin; The delivery assembly (4) comprises a support plate (44), a pulley unit (45) is installed inside the support plate (44), a side plate frame (41) is fixed to the belt surface of the pulley unit (45), at least one resin clamp (40) is fixedly connected to the inner side of the side plate frame (41), and a pushing unit for ejecting resin into a loading robot is installed inside the side plate frame (41) below the resin clamp (40).

2. The linear resin feeding mechanism for integrated circuit plastic packaging equipment according to claim 1, characterized in that: The docking unit comprises a transverse linear motion module (25) sliding in a direction close to the waste collection bin (26), a pusher claw (24) is slidably mounted on the outside of the transverse linear motion module (25), and a groove is provided on the upper end surface of the pusher claw (24) for qualified resin to enter.

3. The linear resin feeding mechanism for integrated circuit plastic packaging equipment according to claim 2, characterized in that: The transverse linear motion module 1 (25) is arranged in parallel with the transverse linear motion module 2 (30), and support frames (38) are installed at both ends of the bottom surface of the transverse linear motion module 2 (30).

4. The linear resin feeding mechanism for integrated circuit plastic packaging equipment according to claim 1, characterized in that: The clamping unit also includes a lifting cylinder (33) slidably arranged with the longitudinal linear motion module (31), the pushing end of the lifting cylinder (33) is connected to a moving plate (32), the bottom end of the moving plate (32) is installed with a connecting shaft (34), the end of the connecting shaft (34) is fixed with a mounting plate (35), and the lower surface of the mounting plate (35) is fixed to the mounting end surfaces of multiple clamping cylinders (36).

5. The linear resin feeding mechanism for integrated circuit plastic packaging equipment according to claim 1, characterized in that: The pushing unit includes a second mounting plate (46) arranged on the inner bottom of the side plate frame (41), a lifting cylinder (47) is installed on the bottom surface of the second mounting plate (46), and a push rod mounting plate (43) pushed by the piston rod of the lifting cylinder (47) is installed above the second mounting plate (46), and push rods (42) matching the number of resin clamps (40) are installed on the upper surface of the push rod mounting plate (43).

6. The linear resin feeding mechanism for integrated circuit plastic packaging equipment according to claim 5, characterized in that: The bottom surface of the resin clamp (40) is provided with an insertion hole for the top end of the push rod (42) to enter, and the diameter of the hole groove on the resin clamp (40) for placing the resin is larger than the diameter of the insertion hole.

7. The linear resin feeding mechanism for integrated circuit plastic packaging equipment according to claim 3, characterized in that: The bottom surface of the support frame (38) is connected to a base plate 2, and the installation ends of the waste collection bin (26) and the transverse linear motion module 1 (25) are connected to the same base plate 1 (1), and the base plate 1 (1) is arranged flush with the base plate 2.

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