Quality detection method for BGA (Ball Grid Array) chip board and related equipment thereof

Abstract

The invention provides a quality detection method for a BGA chip board and related equipment thereof, and the method comprises the steps: transmitting a test signal to a tested chip board, the tested chip board being a BGA chip board, the test signal being used for enabling an I / O port of the tested chip board to output a reaction signal, the output process of the reaction signal needs to be completed under the participation of a BGA circuit of the BGA chip board; receiving the response signal replied by the tested chip board; and judging whether the BGA chip board meets a preset quality requirement or not based on the reaction signal. According to the method, a test signal is sent to the tested chip board, and a reaction signal is received and analyzed, so that comprehensive and accurate evaluation of the quality of the chip board is realized. According to the method, the detection efficiency and accuracy are improved, the detection cost is reduced, and powerful support is provided for production and quality control of the BGA chip board. The invention further provides quality detection equipment for the BGA chip board, and the quality detection equipment has the same beneficial effects as the method.

Description

Technical Field

[0001] The present application belongs to the field of equipment control, and in particular, relates to a quality inspection method for BGA chip boards and related equipment. Background Art

[0002] With the rapid development of electronic technology, the packaging technology of integrated circuits (ICs) is also constantly improving. Ball Grid Array (BGA) is a high-density surface mounting packaging technology that makes array solder balls at the bottom of the package substrate as the I / O end of the circuit to interconnect with the printed circuit board (PCB).

[0003] Ball grid array (BGA) packaging technology is widely used in various high-end electronic devices, such as smart phones, tablets, servers, and high-performance computing devices, due to its high density, high performance, and good heat dissipation performance. As the core component of these devices, the quality of BGA chip boards is directly related to the stability and reliability of the entire system.

[0004] However, in the production process of BGA chip boards, various quality problems may occur due to the influence of various factors such as materials, processes, and environment, such as solder joint defects, circuit short circuits, open circuits, signal attenuation, etc. These problems will not only affect the performance of the chip board, but may also cause malfunction or failure of the entire electronic equipment, causing inconvenience and economic losses to users.

[0005] Traditional BGA chip board quality inspection methods often rely on single means such as manual visual inspection and CCD visual inspection equipment inspection. These methods have the disadvantages of low inspection efficiency, poor accuracy, and susceptibility to human factors. Especially when facing high-density and complex-structure BGA chip boards, traditional methods often find it difficult to fully and accurately evaluate their quality status. Summary of the invention

[0006] The purpose of the present invention is to provide a quality inspection method for BGA chip boards, aiming to solve the problems of low efficiency and poor accuracy of existing BGA chip board inspections. The present application provides:

[0007] A first aspect of an embodiment of the present application provides a quality inspection method for a BGA chip board, comprising:

[0008] Sending a test signal to the chip board under test, the chip board under test being a BGA chip board, the test signal being used to make the I / O port of the chip board under test output a response signal, the output process of the response signal being completed with the participation of the BGA circuit of the BGA chip board;

[0009] Receiving the response signal replied by the chip board under test;

[0010] Based on the reaction signal, it is determined whether the BGA chip board meets the preset quality requirements.

[0011] Based on the quality inspection method of the BGA chip board provided in the first aspect of the embodiment of the present application, optionally:

[0012] The test signal is used to make a specific I / O port of the target board output a high level or a low level.

[0013] Based on the quality inspection method for the BGA chip board provided in the first aspect of the embodiment of the present application, optionally: there are multiple test signals, and the multiple test signals are used to perform parallel testing on multiple I / O ports of the BGA chip board.

[0014] Based on the quality detection method of the BGA chip board provided in the first aspect of the embodiment of the present application, optionally: judging whether the BGA chip board meets the preset quality requirements based on the reaction signal includes:

[0015] Determine whether the BGA chip board has quality abnormality based on the reaction signal, wherein the quality abnormality includes: cold soldering, short circuit or open circuit;

[0016] If the BGA chip board has quality abnormalities, it is determined that the BGA chip board does not meet the preset quality requirements.

[0017] Based on the quality inspection method of the BGA chip board provided in the first aspect of the embodiment of the present application, optionally: the method further includes:

[0018] Monitoring the current information when the chip board under test outputs the response signal;

[0019] The step of judging whether the BGA chip board meets the preset quality requirements based on the reaction signal includes:

[0020] Based on the current information and the reaction signal, it is determined whether the BGA chip board meets the preset quality requirements.

[0021] Based on the quality inspection method of the BGA chip board provided in the first aspect of the embodiment of the present application, optionally: the method further includes:

[0022] Output a test report, wherein the test report includes the test results of each I / O port of the chip board under test and quality abnormalities.

[0023] Based on the BGA chip board quality inspection method provided in the first aspect of the embodiment of the present application, optionally: the testing process is carried out under a preset temperature environment.

[0024] A second aspect of an embodiment of the present application provides a quality inspection device for a BGA chip board, comprising:

[0025] A sending unit, used for sending a test signal to a chip board under test, wherein the chip board under test is a BGA chip board, wherein the test signal is used to make an I / O port of the chip board under test output a response signal, and the output process of the response signal needs to be completed with the participation of a BGA circuit of the BGA chip board;

[0026] A receiving unit, used for receiving the response signal replied by the chip board under test;

[0027] A judging unit is configured to judge whether the BGA chip board meets preset quality requirements based on the response signal.

[0028] Based on the quality inspection equipment for the BGA chip board provided in the second aspect of the embodiment of the present application, optionally: the test signal is used to make a specific I / O port of the target board output a high level or a low level.

[0029] Based on the quality inspection equipment for the BGA chip board provided in the second aspect of the embodiment of the present application, optionally: there are multiple test signals, and the multiple test signals are used to perform parallel testing on multiple I / O ports of the BGA chip board.

[0030] Based on the quality inspection device for the BGA chip board provided in the second aspect of the embodiment of the present application, optionally, the judgment unit is specifically used for:

[0031] Determine whether the BGA chip board has quality abnormality based on the reaction signal, wherein the quality abnormality includes: cold soldering, short circuit or open circuit;

[0032] If the BGA chip board has quality abnormalities, it is determined that the BGA chip board does not meet the preset quality requirements.

[0033] Based on the quality inspection device for the BGA chip board provided in the second aspect of the embodiment of the present application, optionally, the device includes: a monitoring unit for monitoring the current information when the chip board under test outputs the reaction signal;

[0034] The judging unit is specifically used for:

[0035] Based on the current information and the reaction signal, it is determined whether the BGA chip board meets the preset quality requirements.

[0036] Based on the BGA chip board quality inspection device provided in the second aspect of the embodiment of the present application, optionally, the device also includes: an output unit for outputting a test report, wherein the test report includes the test results of each I / O port of the chip board under test and quality abnormalities.

[0037] Based on the quality inspection equipment for the BGA chip board provided in the second aspect of the embodiment of the present application, optionally, the testing process is carried out under a preset temperature environment.

[0038] A third aspect of the embodiment of the present application provides a quality inspection device for a BGA chip board, characterized by comprising:

[0039] CPU, memory, input and output interfaces, wired or wireless network interfaces, and power supply;

[0040] The memory is a short-term storage memory or a persistent storage memory;

[0041] The central processing unit is configured to communicate with the memory and execute instruction operations in the memory on the device to perform a method as described in any one of the first aspects of the embodiments of the present application.

[0042] A fourth aspect of an embodiment of the present application provides a computer-readable storage medium, including instructions, which, when executed on a computer, enable the computer to execute a method as described in any one of the first aspects of the embodiment of the present application.

[0043] It can be seen from the above technical scheme that the embodiment of the present application has the following advantages: The present application provides a quality detection method for BGA chip boards, including: sending a test signal to the chip board under test, the chip board under test is a BGA chip board, the test signal is used to make the I / O port of the chip board under test output a reaction signal, and the output process of the reaction signal needs to be completed with the participation of the BGA circuit of the BGA chip board; receiving the reaction signal from the chip board under test; judging whether the BGA chip board meets the preset quality requirements based on the reaction signal. The method realizes a comprehensive and accurate evaluation of the quality of the chip board by sending a test signal to the chip board under test and receiving and analyzing the reaction signal. The method not only improves the detection efficiency and accuracy, but also reduces the detection cost, and provides strong support for the production and quality control of BGA chip boards. The present solution is implemented by automated software, and does not require visual or CCD visual inspection equipment. At the same time, the present case does not require the use of signal generators, oscilloscopes, boundary scan controllers, boundary scan control software programs, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without creative work. It is understood that the drawings provided in this section are only used to better understand the present solution and do not constitute a limitation of the present application.

[0045] Figure 1 A flow chart of a quality inspection embodiment for a BGA chip board provided in this application.

[0046] Figure 2 Another flow chart of the quality inspection embodiment of the BGA chip board provided in the present application.

[0047] Figure 3 A schematic diagram of the overall architecture of the test system provided in this application.

[0048] Figure 4 A structural schematic diagram of the quality inspection equipment for BGA chip boards provided in this application.

[0049] Figure 5 Another structural schematic diagram of the quality inspection equipment for BGA chip boards provided in this application. DETAILED DESCRIPTION

[0050] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application are clearly and completely described below. Obviously, the described embodiments are only embodiments of a part of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work should belong to the scope of protection of the present application. At the same time, for the sake of clarity and simplicity, the description of well-known functions and structures is omitted in the following description.

[0051] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0052] With the rapid development of electronic technology, the packaging technology of integrated circuits (ICs) is also constantly improving. Ball Grid Array (BGA) is a high-density surface mounting packaging technology that makes array solder balls at the bottom of the package substrate as the I / O end of the circuit to interconnect with the printed circuit board (PCB).

[0053] Ball grid array (BGA) packaging technology is widely used in various high-end electronic devices, such as smart phones, tablets, servers, and high-performance computing devices, due to its high density, high performance, and good heat dissipation performance. As the core component of these devices, the quality of BGA chip boards is directly related to the stability and reliability of the entire system. However, in the production process of BGA chip boards, various quality problems may occur due to the influence of various factors such as materials, processes, and environment, such as solder joint defects, circuit short circuits, open circuits, and signal attenuation. These problems will not only affect the performance of the chip board, but may also cause the failure or failure of the entire electronic device, causing inconvenience and economic losses to users. At present, visual inspection / CCD visual inspection equipment is mainly used to check the welding of PCBA, but it is difficult to detect problems in BGA packaging. The bottom of the BGA chip cannot be checked by visual inspection / CCD visual inspection equipment to check whether there is a cold solder joint or short circuit.

[0054] To solve the above problems, the present application provides a new quality inspection method for BGA chip boards. Figure 1 , an embodiment of the present application includes: step 101-step 103.

[0055] 101. Send a test signal to the chip board under test.

[0056] A test signal is sent to the chip board under test, wherein the chip board under test is a BGA chip board, and the test signal is used to make the I / O port of the chip board under test output a response signal, and the output process of the response signal needs to be completed with the participation of the BGA circuit of the BGA chip board; in the actual implementation process, a special test equipment can be used for testing, that is, a connection is established between the test motherboard and the chip board under test, and the test signal can be designed in advance according to the actual situation of the chip board under test. For example, if the chip board under test has multiple I / O ports, multiple groups of test signals are set, which can be determined according to the actual situation and is not limited here.

[0057] 102. Receive the response signal from the chip board under test.

[0058] The purpose of this step is to capture and record the response signals generated by the chip board I / O port. These signals are the chip board's response to the test signal and contain important information about the chip board's working status and performance. In the actual implementation process, the signal can be a specific high or low level that makes the I / O port output a bit. In order to accurately receive the response signal, professional test equipment or instruments, such as oscilloscopes, logic analyzers, etc., can be used. These devices can accurately capture and display the waveform, frequency, amplitude and other characteristics of the response signal.

[0059] 103. Determine whether the BGA chip board meets preset quality requirements based on the response signal.

[0060] This step is the core of the entire test process. Its purpose is to determine whether the BGA chip board meets the preset quality requirements based on the received response signal. These quality requirements include but are not limited to the electrical performance of the I / O port, timing requirements, functional correctness, etc. If the chip board meets the quality requirements, the test process ends and the next step of production or use can be carried out; if it does not meet the quality requirements, troubleshooting and repair work is required, or the chip board is treated as a defective product.

[0061] It can be seen from the above technical scheme that the embodiment of the present application has the following advantages: The present application provides a quality detection method for BGA chip boards, including: sending a test signal to the chip board under test, the chip board under test is a BGA chip board, the test signal is used to make the I / O port of the chip board under test output a reaction signal, and the output process of the reaction signal needs to be completed with the participation of the BGA circuit of the BGA chip board; receiving the response signal from the chip board under test; judging whether the BGA chip board meets the preset quality requirements based on the reaction signal. . The method realizes a comprehensive and accurate evaluation of the quality of the chip board by sending a test signal to the chip board under test and receiving and analyzing the reaction signal. The method not only improves the detection efficiency and accuracy, but also reduces the detection cost, providing strong support for the production and quality control of BGA chip boards.

[0062] To facilitate the use of this method in actual implementation, the present application also provides a more detailed embodiment that can be optionally implemented, please refer to Figure 2 , an embodiment of the present application includes: step 201-step 205.

[0063] In the actual implementation process, the test main board and the test target board (tested chip board) can be connected to each other to form a test system. The specific overall architecture of the test system can be referred to Figure 3 , Figure 3 This is a schematic diagram of the overall architecture of the test system provided in this application.

[0064] 201. Send a test signal to the chip board under test.

[0065] The test signal in this step is designed to trigger a specific I / O port on the BGA chip board to output a high or low level. This design can directly evaluate the electrical performance and responsiveness of the I / O port.

[0066] In order to improve the test efficiency, the process uses multiple test signals to perform parallel testing on multiple I / O ports of the BGA chip board, that is, the test equipment is allowed to send test signals to multiple (or even all) I / O ports at the same time, and receive the response signals of these I / O ports at the same time. Since the test of multiple I / O ports is carried out simultaneously, the test time is no longer directly affected by the number of I / O ports, thereby greatly shortening the overall test cycle. The sending of test signals and the receiving of response signals both rely on the normal operation of the BGA circuit, which ensures the comprehensiveness and accuracy of the test. In the actual implementation process, pulse signals can also be used to test the transient response capability of the I / O port, including the rise time and fall time.

[0067] In the actual test process, in order to avoid the mutual influence of multiple groups of I / O ports measured simultaneously, the test can be started with the two I / O ports that are farthest apart, and then tested in sequence with these two I / O ports as the starting point in a clockwise direction to complete the test process.

[0068] 202. Monitor the current information of the chip board under test during the process of outputting the response signal.

[0069] During the test, in addition to receiving the response signal, it is also necessary to monitor the current information of the chip board when it outputs the response signal. The current information can provide important clues about the working status of the internal circuit of the chip board, which helps to find potential quality problems such as cold solder joints, short circuits or open circuits.

[0070] 203. Receive the response signal from the chip board under test.

[0071] Use professional testing equipment or instruments to receive the response signal, receive and analyze the response signal output by the tested BGA chip board to ensure the accuracy and integrity of the signal.

[0072] 204. Determine whether the BGA chip board meets preset quality requirements based on the current information and the reaction signal

[0073] Compare and analyze the received reaction signal and the monitored current information with the preset quality requirements. This step not only focuses on the correctness of the reaction signal, but also considers whether the current information is abnormal, so as to comprehensively evaluate the quality of the chip board. Identify and determine whether the chip board has quality abnormalities such as cold soldering, short circuit or open circuit. These abnormalities will directly affect the performance and reliability of the chip board. If there are any quality abnormalities in the chip board, it is determined that it does not meet the preset quality requirements; otherwise, the chip board is considered to be of qualified quality. Receive and analyze the reaction signal output by the tested BGA chip board, and compare it with the preset standard or expected value according to the characteristics of the reaction signal (such as waveform, timing, amplitude, etc.) to evaluate the quality of the BGA chip board and its BGA circuit.

[0074] In the actual test process, the test process can also be divided into multiple stages, each stage using different frequencies, amplitudes or types of test signals. In the early stage, a relatively mild test signal is used to quickly screen out obvious faults, and in the subsequent stages, the complexity and intensity of the test signal are gradually increased to deeply detect potential problems.

[0075] 205. Output test report

[0076] Output a test report, the test report includes the test results of each I / O port of the chip board under test and the quality abnormalities. Generate and output a detailed test report, the report includes the test results of each I / O port of the chip board under test and the quality abnormalities found. Specifically, it includes the position of each I / O port of the chip board under test and the corresponding test results (including normal, cold soldering, short circuit or open circuit, etc.).

[0077] It should be noted that the entire test process can be carried out under a preset temperature environment, which can be the temperature environment when the system is actually working, thereby ensuring that the obtained results can actually reflect the stability of the chip board.

[0078] It can be seen from the above technical scheme that the embodiment of the present application has the following advantages: The present application provides a quality detection method for BGA chip boards, including: sending a test signal to the chip board under test, the chip board under test is a BGA chip board, the test signal is used to make the I / O port of the chip board under test output a reaction signal, and the output process of the reaction signal needs to be completed with the participation of the BGA circuit of the BGA chip board; receiving the response signal from the chip board under test; judging whether the BGA chip board meets the preset quality requirements based on the reaction signal. The method realizes a comprehensive and accurate evaluation of the quality of the chip board by sending a test signal to the chip board under test and receiving and analyzing the reaction signal. The method not only improves the detection efficiency and accuracy, but also reduces the detection cost, providing strong support for the production and quality control of BGA chip boards.

[0079] The above content describes the quality inspection method for BGA chip board provided by the present application. To support the implementation of the above embodiment, the present application also provides a quality inspection device for BGA chip board, please refer to Figure 4 , an embodiment of the quality inspection equipment for BGA chip board of the present application includes:

[0080] The sending unit 401 is used to send a test signal to the chip board under test, wherein the chip board under test is a BGA chip board, and the test signal is used to make the I / O port of the chip board under test output a response signal, and the output process of the response signal needs to be completed with the participation of the BGA circuit of the BGA chip board;

[0081] The receiving unit 402 is used to receive the response signal replied by the chip board under test;

[0082] The judging unit 403 judges whether the BGA chip board meets the preset quality requirements based on the response signal.

[0083] In this embodiment, the process performed by each unit in the quality inspection device for BGA chip board is the same as the above Figure 1 , Figure 2 The method flow described in the corresponding embodiment is similar and will not be repeated here.

[0084] Figure 5 It is a structural schematic diagram of a quality inspection device for a BGA chip board provided in an embodiment of the present application. The quality inspection device 500 for a BGA chip board may include one or more central processing units (CPU) 501 and a memory 505, and the memory 505 stores one or more application programs or data.

[0085] In this embodiment, the specific functional module division in the central processing unit 501 can be the same as the above Figure 4 The functional module division method of each unit described in is similar and will not be repeated here.

[0086] The memory 505 may be a volatile storage or a persistent storage. The program stored in the memory 505 may include one or more modules, each of which may include a series of instruction operations on the server. Furthermore, the central processor 501 may be configured to communicate with the memory 505 and execute a series of instruction operations in the memory 505 on the server 500.

[0087] The quality inspection equipment 500 for BGA chip boards may also include one or more power supplies 502, one or more wired or wireless network interfaces 503, one or more input and output interfaces 504, and / or one or more operating systems, such as Windows ServerTM, Mac OS XTM, UnixTM, LinuxTM, FreeBSDTM, etc.

[0088] The CPU 501 can execute the aforementioned Figure 1 or Figure 2 The operations performed by the quality inspection method for the BGA chip board in the illustrated embodiment will not be described in detail here.

[0089] An embodiment of the present application also provides a computer storage medium for storing computer software instructions used for the above-mentioned quality inspection method for BGA chip boards, which includes a program designed for executing the quality inspection method for BGA chip boards.

[0090] The quality inspection method for BGA chip board can be as described above. Figure 1 The quality inspection method for BGA chip boards described in .

[0091] The present application also provides a computer program product, which includes computer software instructions, which can be loaded by a processor to implement the above Figure 1 Figure 2 Any one of the processes for the quality inspection method for BGA chip boards.

[0092] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the equivalent transformation of the circuit, the division of the unit, is only a logical function division, and there may be other division methods in actual implementation, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point, the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0093] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0094] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0095] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent substitution or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A quality inspection method for a BGA chip board, characterized in that: include: Sending a test signal to the chip board under test, the chip board under test being a BGA chip board, the test signal being used to make the I / O port of the chip board under test output a response signal, the output process of the response signal being completed with the participation of the BGA circuit of the BGA chip board; Receiving the response signal replied by the chip board under test; Based on the reaction signal, it is determined whether the BGA chip board meets the preset quality requirements.

2. The quality inspection method for the BGA chip board according to claim 1, characterized in that: The test signal is used to make a specific I / O port of the target board output a high level or a low level.

3. The quality inspection method for BGA chip board according to claim 1, characterized in that: There are multiple test signals, and the multiple test signals are used to perform parallel testing on multiple I / O ports of the BGA chip board.

4. The quality inspection method for BGA chip board according to claim 1, characterized in that: The determining whether the BGA chip board meets the preset quality requirements based on the reaction signal includes: Determine whether the BGA chip board has quality abnormality based on the reaction signal, wherein the quality abnormality includes: cold soldering, short circuit or open circuit; If the BGA chip board has quality abnormalities, it is determined that the BGA chip board does not meet the preset quality requirements.

5. The quality inspection method for BGA chip board according to claim 1, characterized in that: The method further comprises: Monitoring the current information when the chip board under test outputs the response signal; The step of judging whether the BGA chip board meets the preset quality requirements based on the reaction signal includes: Based on the current information and the reaction signal, it is determined whether the BGA chip board meets the preset quality requirements.

6. The quality inspection method for BGA chip board according to claim 1, characterized in that: The method further comprises: Output a test report, wherein the test report includes the test results of each I / O port of the chip board under test and quality abnormalities.

7. The quality inspection method for a BGA chip board according to claim 1, characterized in that: The testing process is carried out under a preset temperature environment.

8. A quality inspection device for BGA chip boards, characterized in that: include: A sending unit, used for sending a test signal to a chip board under test, wherein the chip board under test is a BGA chip board, wherein the test signal is used to make an I / O port of the chip board under test output a response signal, and the output process of the response signal needs to be completed with the participation of a BGA circuit of the BGA chip board; A receiving unit, used for receiving the response signal replied by the chip board under test; A judging unit is configured to judge whether the BGA chip board meets preset quality requirements based on the response signal.

9. A quality inspection device for BGA chip board, characterized in that: include: CPU, memory, input and output interfaces, wired or wireless network interfaces, and power supply; The memory is a short-term storage memory or a persistent storage memory; The central processing unit is configured to communicate with the memory, and execute instructions in the memory on the device to perform the method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The method comprises instructions, which, when executed on a computer, cause the computer to execute the method according to any one of claims 1 to 7.

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