Heat dissipation device and server

Abstract

According to the heat dissipation device comprising the air cooling structure and the liquid cooling structure and the server, the air cooling structure is used for conducting air cooling heat dissipation on a first type of devices and a second type of devices at the same time, and the liquid cooling structure is applied to conducting liquid cooling heat dissipation on the first type of devices; wherein the heat generated by the first type of devices is higher than that generated by the second type of devices. The liquid cooling structure specifically comprises a liquid cooling assembly and a heat exchanger. The liquid cooling assembly can conduct heat generated by the first type of devices to cooling liquid of a liquid supply pipeline of the liquid cooling assembly. And the heat exchanger is used for heat exchange between the cooling liquid and external air and is arranged at the tail end of the server. The heat exchanger is arranged at the tail end of the server, so that heat dissipation of other devices of the server cannot be affected by heat dissipation outlet air of heat exchange, heat can be effectively managed, and the heat dissipation capacity of the server is improved.

Description

[0001] This application is a divisional application. The application number of the original application is 202111135533.7, and the original application date is September 27, 2021. The entire contents of the original application are incorporated into this application by reference. Technical Field

[0002] The present application relates to the technical field of servers, and in particular to a heat dissipation device and a server. Background Art

[0003] With the development of technology, the performance of processors in electronic devices such as servers continues to improve, and their power consumption is also getting higher and higher, which puts higher requirements on the heat dissipation of electronic devices. Traditional air-cooled radiators cannot solve the heat dissipation problem of processors well.

[0004] In order to improve the heat dissipation effect, liquid cooling assisted by air cooling can also be used for high-power devices such as processors. However, due to the limitations of the structural layout, the high-temperature air outlet of the radiator will affect the heat dissipation of these functional devices. Therefore, how to provide a more efficient heat dissipation device has become a technical problem that needs to be solved urgently. Summary of the invention

[0005] The present application provides a heat dissipation device and a server, which are used to improve the heat dissipation capacity of the server.

[0006] In the first aspect, the present application provides a heat dissipation device that can be applied to a server, the heat dissipation device includes an air cooling structure and a liquid cooling structure, and the heat dissipation of the server is performed by combining air cooling with liquid cooling. It is assumed that a first type of device and a second type of device are provided in the server, the heat generated by the first type of device is higher than that of the second type of device, the first type of device can be a device with a higher heat dissipation such as a processor, and the second type of device can be a device such as a PCIe (peripheral component interconnect express) card; the air cooling structure in the heat dissipation device provided by the present application is used to perform air cooling and heat dissipation on the first type of device and the second type of device at the same time, and the liquid cooling structure is used for targeted liquid cooling and heat dissipation of the first type of device; the liquid cooling structure specifically includes: a liquid cooling component and a heat exchanger, the liquid cooling component can conduct the heat generated by the first type of device to the coolant in the liquid supply pipeline of the liquid cooling component; the heat exchanger is used for heat exchange between the coolant and the external air, and the heat exchanger here is arranged at the end of the server.

[0007] The heat dissipation device provided in the present application adopts a combination of air cooling and liquid cooling to dissipate heat for the first type of devices and the second type of devices in the server, wherein the liquid cooling structure can perform targeted heat dissipation for the first type of devices with higher heat dissipation; the heat exchanger is arranged at the end of the server so that the heat exchange heat dissipation air outlet will not affect the heat dissipation of other devices in the server, thereby achieving effective heat management, thereby improving the heat dissipation capacity of the server.

[0008] The heat exchanger has a heat exchange inner cavity and a liquid replenishment cavity located at the top of the heat exchange inner cavity; the heat exchange inner cavity has a liquid inlet for coolant to flow in and a liquid outlet for coolant to flow out, the liquid replenishment cavity is filled with coolant, and the liquid replenishment cavity and the heat exchange inner cavity are connected through a liquid replenishment channel. Specifically, the amount of coolant in the liquid replenishment cavity is not less than a liquid amount threshold, and the liquid amount threshold is the amount of coolant loss in the heat dissipation device within the service life.

[0009] In a specific implementation, the air cooling structure can form an air duct in the chassis of the server, and the heat exchanger of the liquid cooling structure is arranged at the air outlet of the air duct, which will not have an adverse effect on the heat dissipation of other devices.

[0010] In a possible implementation, the air cooling structure includes a partition, which divides the cavity of the server into at least two air ducts, and the at least two air ducts include a first air duct and a second air duct: the heat exchanger is located at the air outlet of the first air duct. The first type of device and the second type of device can be arranged in the second air duct, thereby reducing temperature cascade and improving heat dissipation capacity. The material of the partition can be sheet metal or plastic.

[0011] The air cooling structure may also include a heat dissipation fan, which is specifically located at the air inlet side of the heat exchanger to provide stronger wind force to the heat exchanger and improve the air cooling effect. In order to improve the heat dissipation capacity, the liquid cooling structure may also include an auxiliary heat exchanger, which may be specifically arranged in the first air duct and connected in series with the heat exchanger.

[0012] Specifically, the partition is parallel to the PCB in the server, and the distance between the partition and the highest device in the PCB is less than the height threshold. The height threshold can ensure that any device on the circuit board can achieve good air cooling and heat dissipation effect in the air duct. Possibly, a plurality of installation stations are provided in the server along the direction perpendicular to the partition, and the partition can be detachably installed at any installation station, so that the height of the partition can be adjusted according to different application scenarios.

[0013] In one possible implementation, the liquid cooling component may specifically include a liquid pipeline, a coolant and a circulation pump; the liquid pipeline is connected to the heat exchanger, and the coolant is filled in the liquid pipeline and the heat exchanger; the circulation pump is connected to the liquid pipeline to drive the coolant to circulate between the heat exchanger and the liquid pipeline.

[0014] In order to improve the liquid cooling effect of the first type of devices, the liquid cooling component can also include a cold plate, and part of the liquid pipeline is encapsulated in the cold plate; the cold plate is used to contact the above-mentioned first type of devices to facilitate heat exchange between the first type of devices and the coolant in the liquid pipeline.

[0015] In one possible implementation, the circulating pump is located at a higher position. When a partition is fixed in the cavity of the server, a hollow area can be set on the partition. The hollow area can avoid the circulating pump, which can not only play the role of air duct isolation, but also will not affect the realization of liquid cooling.

[0016] In a second aspect, the present application provides a server, which includes a first type of component, a second type of component, and any one of the above-mentioned heat dissipation devices.

[0017] Based on the implementations provided in the above aspects, this application can also be further combined to provide more implementations. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram showing a structure of a heat dissipation device provided in an embodiment of the present application applied to a server;

[0019] Figure 2 A schematic diagram showing a structure of another heat dissipation device provided in an embodiment of the present application applied to a server;

[0020] Figure 3 A schematic diagram of the structure of an installation station in a server chassis for adjusting the installation position of a partition in a heat dissipation device provided by an embodiment of the present application is shown;

[0021] Figure 4 A schematic diagram of the structure of a heat exchanger in a heat dissipation device provided in an embodiment of the present application;

[0022] Figure 5 A schematic diagram of the structure of a heat exchanger in another heat dissipation device provided in an embodiment of the present application;

[0023] Figure 6 A schematic diagram of a structure of a heat dissipation device provided in an embodiment of the present application applied to a server;

[0024] Figure 7 A schematic diagram of the structure of a cold plate and a liquid pipeline package in a heat dissipation device provided in an embodiment of the present application;

[0025] Figure 8 A schematic diagram of the structure of the cold plate and liquid pipeline packaging in another heat dissipation device provided in an embodiment of the present application;

[0026] Fig. 9 A schematic diagram of a structure of a heat dissipation device provided in an embodiment of the present application applied to a server;

[0027] Fig.10 A schematic diagram of a structure in which a liquid cooling structure in a heat dissipation device provided in an embodiment of the present application dissipates heat for a processor;

[0028] Fig.11 A schematic diagram of a structure in which a liquid cooling structure in another heat dissipation device provided in an embodiment of the present application dissipates heat for a processor;

[0029] Fig.12 A schematic diagram of a structure in which a liquid cooling structure in another heat dissipation device provided in an embodiment of the present application dissipates heat for a processor;

[0030] Fig.13 A schematic diagram of a structure in which a liquid cooling structure in another heat dissipation device provided in an embodiment of the present application dissipates heat for a processor;

[0031] Fig.14 A schematic diagram of a structure in which a liquid cooling structure in another heat dissipation device provided in an embodiment of the present application dissipates heat for a processor;

[0032] Fig.15 A schematic diagram of a structure of a heat dissipation device provided in an embodiment of the present application applied to a server;

[0033] Fig.16 A schematic diagram of a structure in which a heat dissipation device provided in an embodiment of the present application is arranged in a server;

[0034] Fig.17 A schematic diagram of another structure of a heat dissipation device provided in an embodiment of the present application arranged in a server;

[0035] Fig.18 A schematic diagram of another structure of a heat dissipation device provided in an embodiment of the present application arranged in a server;

[0036] Fig.19 A schematic diagram of a structure in which a heat dissipation device provided in an embodiment of the present application is arranged in a server. DETAILED DESCRIPTION

[0037] Existing servers often use liquid cooling assisted by air cooling for heat dissipation. However, due to the limitations of the structural space layout, liquid cooling and air cooling affect each other, resulting in poor heat dissipation effect.

[0038] The present application will be described in further detail below in conjunction with the accompanying drawings.

[0039] Figure 1The chassis 201 of the server shown is provided with a first type of device and a second type of device; wherein the heat generated by the first type of device is higher than the heat generated by the second type of device; the first type of device may be a device with high power consumption and high heat dissipation such as a processor 202, and the second type of device may be a device with low power consumption and less heat dissipation such as a PCIe card 204. Generally, a PCB (print circuit board) 203 is provided in the chassis 201, the processor 202 is coupled to the PCB 203, and the PCIe card 204 is located in the chassis 201 and plugged into the PCB 203. Since the heat generated by the first type of device and the second type of device is different, different heat dissipation methods may be used for the first type of device and the second type of device.

[0040] Please continue to refer to Figure 1 The heat dissipation device provided in the present application includes an air cooling structure and a liquid cooling structure, realizing a heat dissipation method of air cooling plus liquid cooling. The air cooling structure includes a system fan 11, which can be specifically arranged at a relatively front end position of the chassis 201. The system fan 11 can form a heat dissipation duct in the chassis 201, and the first type of devices and the second type of devices are cooled by air cooling. Here, the "end" and "front end" of the server chassis 201 are relative position concepts. Figure 1 The server shown is for reference. The system fan 11 forms a heat dissipation duct in the chassis 201. Along the direction of airflow in the heat dissipation duct, the end of the chassis 201 is close to the rear panel of the server. Fig.16 In the top view of the entire structure shown, the right area of ​​the chassis 201 is the front panel 220, and the end of the chassis 201 refers to the end side opposite to the front panel 220. For example, the range shown in area 221 in the figure can be called the end of the chassis 201.

[0041] The liquid cooling structure performs liquid cooling and heat dissipation for the first type of devices, specifically including a liquid cooling component 21 and a heat exchanger 22. The liquid cooling component 21 has a liquid pipeline 211 and a circulation pump 212 connected to the liquid pipeline 211. The liquid pipeline 211 is connected to the heat exchanger 22, and the liquid pipeline 211 and the heat exchanger 22 are filled with coolant, thereby forming a closed circulation system; the circulation pump 212 can drive the coolant to circulate between the liquid cooling pipeline 211 and the heat exchanger 22; the path of the liquid cooling pipeline 211 is set to pass through the first type of devices (taking the processor 202 as an example), so that the heat emitted by the processor 202 can be absorbed into the coolant. Driven by the circulation pump 212, the coolant after absorbing the heat moves to the heat exchanger 22. The heat exchanger 22 is used for heat exchange between the coolant and the outside air. The cooled coolant is driven back to the liquid cooling pipeline 211 by the circulation pump 212 to realize the liquid cooling circulation of the coolant for the first type of devices. The heat exchanger 22 is disposed at the end of the server, and the heat dissipated by the heat exchanger 22 can directly contact the outside world without affecting the heat dissipation of other devices (including but not limited to the first type of devices and the second type of devices). Figure 1 In the figure, along the height direction Z of the server chassis 201, the heat exchanger 22 and the PCIe card 204 are arranged in parallel.

[0042] To facilitate heat management, please refer to Figure 2 As shown, the air cooling structure also includes a partition 12, which can separate the cavity of the server chassis 201 into at least two air ducts: a first air duct A1 and a second air duct A2. The partition 12 extends along the air flow direction of the system fan 11. The above-mentioned heat exchanger 22 can be specifically arranged at the air outlet of the first air duct A1, which is equivalent to the air cooling of the heat exchanger 22 being realized only through the first air duct A1. The first type of device (taking the processor 202 as an example) and the second type of device (taking the PCIe card 204 as an example) are arranged in the second air duct A2, and the air cooling of the first type of device and the second type of device is realized only through the second air duct A2. By setting the partition 12, the air cooling of the heat exchanger 22 is separated from the air cooling of the first type of device and the second type of device, which can reduce the temperature cascade of the heat dissipation structure, and thus can improve the heat dissipation capacity of the bottleneck device. The material of the partition 12 is not limited, and sheet metal or plastic can be selected specifically.

[0043] Among them, the partition 12 can be parallel to the PCB203 in the server, and the distance between the partition 12 and the highest component in the PCB203 is less than or equal to the height threshold h; assuming that the highest component on the PCB203 is the processor 202, the distance between the partition 12 and the surface of the processor 202 facing away from the PCB203 should not be greater than the height threshold h, and the height threshold h can ensure that all components in the second air duct can achieve air cooling.

[0044] When different devices can be arranged in the server, the heights of the devices that may be located in the second air duct A2 may be different, so the position of the partition plate 12 in the chassis 201 can be adjusted. Figure 3 As shown, along the thickness direction Z of the partition 12, a plurality of installation stations can be provided in the chassis 201 of the server, and the partition 12 can be detachably installed at any installation station as needed. The installation station here refers to a position where the partition 12 can be fixed to the chassis 201. When the partition 12 is installed to an installation station, the partition 12 has a corresponding position in the chassis 201, and the position is related to the horizontal height of the partition 12 in the chassis 201 along the height direction Z of the chassis 201. In other words, one installation station is equivalent to a relative horizontal height of a corresponding partition 12 in the chassis 201. Exemplarily, each installation station can be a bayonet group M formed on the inner walls of the chassis 201 on both sides parallel to the direction Z. The bayonet group M has a slot for accommodating the edge of the partition 12. The edge of the partition 12 is inserted into the slot formed by the bayonet group M, and the partition 12 can be fixed to the chassis 201. With such a structural design, the ventilation volume in the first air duct A1 and the second air duct A2 can be adjusted by adjusting the position of the partition 12 in the chassis 201 .

[0045] As for the structure of the heat exchanger 22, please refer to Figure 4 The structure of the heat exchanger 22 shown in the figure has a liquid inlet box 2211, a liquid outlet box 2212, a circulation pipe 2213 and a liquid replenishing tank 222. The liquid inlet box 2211 has a liquid inlet P for receiving the coolant delivered by the liquid pipeline 211, and the liquid outlet box 2212 has a liquid outlet Q for delivering the coolant to the liquid pipeline 211. The liquid inlet box 2211 and the liquid outlet box 2212 are connected by at least one circulation pipe 2213, and a plurality of circulation pipes 2213 are arranged in parallel. The outer surface of the circulation pipe 2213 is provided with a heat dissipation fin 2214, and the heat dissipation fin 2214 is shown in a corrugated shape (of course, it can also be other shapes). The liquid replenishing tank 222 is located at the top of the heat exchanger 22, and the liquid replenishing tank 222 is connected to the liquid outlet box 2212 through the liquid replenishing pipe 223. Among them, the liquid replenishing tank 222 is welded to the top of the liquid outlet box 2212.

[0046] Reference Figure 5The internal structure of the heat exchanger 22 shown is equivalent to forming a heat exchange inner cavity, which specifically includes a liquid inlet cavity W1 formed by a liquid inlet box 2211, a liquid outlet cavity W2 formed by a liquid outlet box 2212, and a flow channel T formed by a flow pipe 2213. The liquid inlet cavity W1 is connected to the liquid pipeline 211 through the liquid inlet port P, and the cooling liquid that absorbs the heat emitted by the first type of device enters the liquid inlet cavity W1 from the liquid inlet port P; a plurality of parallel circulation channels T are arranged between the liquid inlet cavity W1 and the liquid outlet cavity W2, and the cooling liquid can enter the liquid outlet cavity W2 from the liquid inlet cavity W1 through the circulation channels T. When the air-cooled airflow passes through the heat exchanger 22, the cooling liquid with a higher temperature in the circulation channels T can achieve heat exchange with the outside air to achieve air-cooled heat dissipation, and the temperature of the cooling liquid that finally enters the liquid outlet cavity W2 is lower; the liquid outlet cavity W2 is connected to the liquid pipeline 211 through the liquid outlet port Q, and the cooling liquid with a lower temperature in the liquid outlet cavity W2 can enter the liquid pipeline 211 from the liquid outlet port Q, and flow along the liquid pipeline 211 to perform liquid cooling and heat dissipation on the first type of device. Among them, the heat dissipation fins 2214 arranged on the outer surface of the circulation channel T can increase the heat dissipation area and improve the heat dissipation effect.

[0047] As a possible implementation, the heat exchanger 22 further includes a liquid replenishment chamber V formed by a liquid replenishment tank 222, and the liquid replenishment chamber V is pre-filled with coolant; the liquid replenishment chamber V is specifically located at the top of the heat exchange inner cavity, and the liquid replenishment chamber V is connected to the heat exchange inner cavity through a liquid replenishment channel F formed by a liquid replenishment pipe 223. The coolant in the liquid pipeline 211 will suffer a certain loss due to the material of the liquid pipeline 211, and the coolant in the liquid replenishment chamber V can enter the heat exchange inner cavity through the liquid replenishment channel F under the action of gravity, ensuring sufficient coolant to achieve liquid cooling circulation; generally, the liquid replenishment chamber V is connected to the liquid outlet chamber W2 through the liquid replenishment channel F, and the coolant can be directly replenished into the coolant after air cooling and heat dissipation.

[0048] During the operation of the heat dissipation device, the coolant circulates back and forth in the closed circulation system formed by the liquid cooling structure. Part of the liquid may adhere to the inner wall of the heat exchanger 22 and the inside of the liquid pipeline 211. A small amount of evaporation and leakage may also occur due to the material of the various parts of the liquid cooling structure (of course, this loss is very small). Based on this consideration, a liquid volume threshold can be set for the liquid volume of the coolant in the liquid replenishment chamber 222. The liquid volume threshold can be estimated based on the amount of heat dissipated per unit time of the entire liquid cooling structure and the service life of the heat dissipation device. In theory, the liquid volume threshold is at least not less than the amount of heat dissipated per unit time of the liquid cooling structure and the estimated amount of the service life of the heat dissipation device, so as to avoid the reduction of heat dissipation performance caused by liquid volume loss.

[0049] The liquid pipeline 211 in the liquid cooling assembly 21 is generally a hose, which is convenient for layout according to the position of the processor 202. However, such a liquid pipeline 211 is not convenient for heat exchange with the first type of device (taking the processor 202 as an example). Figure 6 As shown, part of the liquid pipeline 211 used for heat dissipation with the first type of device can be packaged in the cold plate 213, and the part of the liquid pipeline 211 can be densely arranged in the cold plate 213 (for example Figure 7 The serpentine distribution shown or Figure 8 The cold plate 213 is fixed in a manner of contacting or being close to the first type of device, and the coolant in the liquid pipeline 211 in the cold plate 213 can have a more sufficient heat exchange with the first type of device, thereby having a good liquid cooling and heat dissipation effect on the first type of device. Generally, there will be multiple first type devices in the server (taking at least two processors 202 as an example), and the cold plate 213 can be provided with a pair, so that the cold plate 213 can exchange heat with the processor 202 in a one-to-one manner. It should be understood that in order for the cold plate 213 and the processor 202 to be relatively close, the cold plate 213 is located in the second air duct A2.

[0050] In order to ensure the smooth flow of the coolant between the liquid pipeline 211 and the heat exchanger 22, a plurality of circulation pumps 212 are provided, such as Fig. 9 As shown, each processor 202 may correspond to a circulation pump 212, and the circulation pump 212 may be specifically fixed on the surface of the cold plate 213. In combination with the above embodiment, the maximum distance between the partition 12 and the highest device on the PCB 203 is the height threshold h, so as to take into account both the air cooling effect and the compact structure. The processor 202 already has a relatively high height after adding the cold plate 213, and the cold plate 213 is very close to the partition 12; then the circulation pump 212 is arranged on the cold plate 213. If the circulation pump 212 protrudes from the partition 12, a hollow structure that can avoid the circulation pump 212 can be opened on the partition 12. The hollow structure can avoid the circulation pump 212 so that the circulation pump 212 can partially enter the first air duct A2.

[0051] In the above embodiment, a circulation pump 212 is configured for each first-type device. When the number of the first-type devices is at least two, the number of the circulation pumps 212 is also two. When the liquid cooling structure performs liquid cooling on multiple first-type devices, taking the first-type device as the processor 202 as an example, the liquid flow path of the coolant in the liquid pipeline 211 may be as follows: Figures 10 to 14 In the illustrated implementations, the number of the processor 202 , the number of the cold plate 213 , and the circulation pump 212 are all set to two and they correspond one to one, and the liquid pipeline 211 is structurally divided into different parts.

[0052] Please refer to Fig.10As shown, the coolant flowing out of the heat exchanger 22 enters the first circulation pump 212a through the liquid pipeline 211a, then enters the second cold plate 213b from the first circulation pump 212a through the liquid pipeline 211b, enters the first cold plate 213a from the second cold plate 213b through the liquid pipeline 211c, then enters the second circulation pump 211b from the first cold plate 213a through the liquid pipeline 211d, and returns to the heat exchanger 22 from the second circulation pump 211b through the liquid pipeline 211e. This structure does not limit the circulation path of the coolant. In actual work, the order of liquid inlet and liquid outlet between the circulation pump 212 and the cold plate 213 can be adjusted according to demand.

[0053] Please refer to Fig.11 As shown, the coolant flowing out of the heat exchanger 22 enters the first circulation pump 212a through the liquid pipeline 211a, then enters the second circulation pump 212b from the first circulation pump 212a through the liquid pipeline 211b, enters the first cold plate 213a from the second circulation pump 212b through the liquid pipeline 211c, then enters the second cold plate 213b from the first cold plate 213a through the liquid pipeline 211d, and returns to the heat exchanger 22 from the second cold plate 213b through the liquid pipeline 211e. This structural design is equivalent to the coolant first passing through the two circulation pumps 212, and then passing through the two cold plates 213 to perform liquid cooling on the processor 202; wherein, the two cold plates 213 are connected in series.

[0054] Please refer to Fig.12 As shown, the coolant flowing out of the heat exchanger 22 enters the first circulation pump 212a through the liquid pipeline 211a, and then enters the second circulation pump 212b from the first circulation pump 212a through the liquid pipeline 211b; the second circulation pump 212b has two outlets, one outlet enters the first cold plate 213a through the liquid pipeline 211c, and the other outlet enters the second cold plate 213b through the liquid pipeline 211d. The coolant in the first cold plate 213a enters the liquid pipeline 211e, and the coolant in the second cold plate 213b enters the liquid pipeline 211f. The liquid pipeline 211e and the liquid pipeline 211f merge and then merge into the liquid pipeline 211g, and the liquid pipeline 211g introduces the coolant into the heat exchanger 22. This structural design is equivalent to the coolant passing through the two circulation pumps 212 first, and then passing through the two cold plates 213 to perform liquid cooling on the processor 202; wherein, the two cold plates 213 are connected in parallel.

[0055] Please refer to Fig.13As shown, the coolant flowing out of the heat exchanger 22 is divided into two paths after passing through the liquid pipeline 211a. One path enters the first circulation pump 212a through the liquid pipeline 211b, and then enters the first cold plate 213a from the first circulation pump 212a through the liquid pipeline 211c; the other path enters the second circulation pump 212b through the liquid pipeline 211d, and then enters the second cold plate 213b from the second cold pump 212b through the liquid pipeline 211e; the coolant in the first cold plate 213a enters the liquid pipeline 211f, and the coolant in the second cold plate 213b enters the liquid pipeline 211g, and the liquid pipeline 211f and the liquid pipeline 211g merge and merge into the liquid pipeline 211h, and the liquid pipeline 211h introduces the coolant into the heat exchanger 22. This structural design is equivalent to treating one circulation pump 212 corresponding to one cold plate 213 as a group of cooling units, and each cooling unit is connected in parallel.

[0056] Please refer to Fig.14 As shown, the coolant flowing out of the heat exchanger 22 enters the first circulation pump 212a through the liquid pipeline 211a, then enters the first circulation pump 212a from the first circulation pump 212a through the liquid pipeline 211b, and enters the second circulation pump 212b from the first circulation pump 212a through the liquid pipeline 211c; the second circulation pump 212b sends the coolant to the second cold plate 213b through the liquid pipeline 211d, and the coolant returns to the heat exchanger 22 from the second cold plate 213b through the liquid pipeline 211e. This structure is more concise and can save space.

[0057] It should be understood that Figures 10 to 14 The liquid cooling structure shown is only an example, and since only two processors 202 are shown to be liquid cooled, the liquid cooling structure is relatively simple. By analogy, when the number of processors 202 (or first-class devices) is more than two, the specific implementation of the liquid cooling structure can be deformed, integrated and improved on the basis of the above-mentioned embodiments, so as to realize more diverse implementation methods, which will not be repeated here.

[0058] In order to improve the heat dissipation effect of the heat exchanger 22, as Fig.15 As shown, the air cooling structure can also include a heat dissipation fan 13, which can be specifically arranged on the air inlet side of the heat exchanger 22. The heat dissipation fan 13 can provide air cooling to the heat exchanger 22 alone, further improving the efficiency of heat exchange between the coolant in the heat exchanger 22 and the outside air.

[0059] In addition, the liquid cooling structure also includes an auxiliary heat exchanger 23, which can be connected to the heat exchanger 22 in series to achieve the circulation of the coolant between the liquid pipeline 211, the heat exchanger 22 and the auxiliary heat exchanger 23. The auxiliary heat exchanger 23 is also used for heat exchange between the coolant and the outside air. Here, the auxiliary heat exchanger 23 is shown as one. In actual applications, the number of auxiliary heat exchangers 23 can be multiple, and multiple auxiliary heat exchangers 23 are connected in series with the heat exchanger 22.

[0060] In combination with the above embodiments, Fig.16 FIG. 1 shows a specific implementation of the heat dissipation device provided by the present application being arranged in a server. Fig.16 As shown in the figure, a circuit board 203 is arranged in a server chassis 201, a processor 202 (equivalent to the first type of device) is coupled to the circuit board 203, and a PCIe card 204 (equivalent to the second type of device) plugged into the circuit board 203 is arranged at the rear end of the server; a system fan 11 is arranged between the circuit board 203 and the front end of the server, and the system fan 11 can drive air to form an airflow in the direction from the front end of the server to the rear end, thereby forming an air duct in the chassis 201, and the airflow formed by the air driven by the system fan 11 can cool the circuit board 201, the processor 202 and the PCIe card 204. The heat exchanger 22 in the heat dissipation device is arranged at the rear end of the server, and the heat dissipated by the heat exchanger 22 will not affect the heat dissipation of other devices. The liquid pipeline 211 in the liquid cooling structure is connected to the heat exchanger 22, and the circulating pump 212 is connected to the liquid pipeline 211 to drive the coolant in the liquid pipeline 211 to circulate between the liquid pipeline 211 and the heat exchanger 22; a cold plate 213 capable of realizing heat exchange between the coolant and the processor 202 is arranged on the liquid pipeline 211, and each processor 202 is correspondingly provided with a cold plate 213, and each cold plate 213 is correspondingly provided with a circulating pump 212. The communication method between the liquid pipeline 211, the circulating pump 212 and the cold plate 213 can refer to Figures 10 to 14 The heat exchanger 22 is also located in the air duct formed by the air driven by the system fan 11, which facilitates the heat exchange between the coolant with a higher temperature in the heat exchanger 22 and the outside air to complete the cooling of the coolant. A cooling fan 13 is provided at the air inlet end of the heat exchanger 22 to increase the air cooling and heat dissipation effect of the heat exchanger 22.

[0061] Combination Figure 1 , please refer to Fig.17 The top view of the heat dissipation device arranged in the server shows that along the width direction X of the server, the rear end of the server is divided into area B1 and area B2. The heat exchanger 22 can only occupy area B2. The heat exchanger 22 is equivalent to being arranged in parallel with the PCIe card 204 along the height direction Z of the server ( Figure 1), and is also arranged in parallel with the PCIe card 204 along the width direction X of the server. Of course, it can also be as shown in Fig.18 As shown, along the width direction X of the server, the heat exchanger 22 occupies all the area at the rear end of the server. At this time, along the height direction Z of the server, the heat exchanger 22 blocks the PCIe card 204, and the heat exchanger 22 is equivalent to being only parallel to the PCIe card 204 along the height direction Z of the server ( Figure 1 ).

[0062] exist Figures 16 to 18 In the structure shown, in order to clearly show the liquid cooling structure, the partition used to isolate the air duct is not shown. Fig.19 As shown, the partition 12 separates the air duct along the height direction of the server. Fig.19 In the top view shown, the circuit board 203, the processor 202, part of the liquid pipeline 211, the cold plate 213, and the PCIe card 204 are all blocked by the partition 12 and are not shown. The circulating pump 212 is shown because it is located at a higher position and partially protrudes out of the partition 12. Here, the partition 12 has an escape hole for avoiding the circulating pump 212. The air duct with the partition 12 can cool the heat exchanger 22 separately, reducing the adverse effects of temperature cascading.

[0063] Based on the above embodiments, the present application also discloses a server having the above heat dissipation device. The structure of the server can refer to Figures 16 to 19 It should be understood that since the server is provided with the above heat dissipation device, its heat dissipation capacity can be improved. According to simulation data, the heat dissipation capacity of the server provided with the above heat dissipation device can be increased by more than 20% compared with the existing ordinary air cooling, and the comprehensive energy consumption of the system can also be reduced.

[0064] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation device, characterized in that: Applied to a server, the heat dissipation device comprises: Cooling fan; A liquid cooling structure is used to dissipate heat from a first type of device by liquid cooling, wherein the first type of device is a high power consumption device, and the liquid cooling structure comprises: A liquid cooling component, used to conduct the heat generated by the first type of device to the cooling liquid in the liquid supply pipeline of the liquid cooling component; The heat exchanger is used for heat exchange between the coolant and the external air, wherein the cooling fan is located at the air inlet side of the heat exchanger and provides air cooling and heat dissipation for the heat exchanger alone.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further includes a system fan, and the system fan forms a heat dissipation air duct in the server to perform air cooling on the first type of components.

3. The heat dissipation device according to claim 1 or 2, characterized in that: The heat dissipation device also includes a partition, which divides the cavity of the server into at least two air ducts, and the at least two air ducts include a first air duct and a second air duct. The heat exchanger is arranged in the first air duct, the first type of device is arranged in the second air duct, and the heat exchanger is located at the air outlet of the first air duct.

4. The heat dissipation device according to any one of claims 1 to 3, characterized in that: The liquid cooling structure further includes an auxiliary heat exchanger, which is disposed in the first air duct and connected in series with the heat exchanger.

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The liquid cooling assembly includes a liquid pipeline, a coolant and a circulation pump; The liquid pipeline is in communication with the heat exchanger, and the coolant is filled in the liquid pipeline and the heat exchanger; The circulation pump is connected to the liquid pipeline to drive the coolant to circulate between the heat exchanger and the liquid pipeline.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The liquid cooling assembly also includes a cold plate, in which part of the liquid pipeline is encapsulated; the cold plate is used to contact the first type of device.

7. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The heat exchanger comprises a heat exchange inner cavity and a liquid replenishing cavity located at the top of the heat exchange inner cavity; The heat exchange inner cavity has a liquid inlet for the coolant to flow in and a liquid outlet for the coolant to flow out. The liquid replenishment cavity is filled with coolant and the liquid replenishment cavity is connected to the heat exchange inner cavity through a liquid replenishment channel.

8. The heat dissipation device according to claim 7, characterized in that: The amount of coolant in the liquid replenishing chamber is not less than a liquid amount threshold, and the liquid amount threshold is the amount of coolant loss in the heat dissipation device within the service life.

9. The heat dissipation device according to any one of claims 3 to 8, characterized in that: The server further includes a second type of device, the heat generated by the second type of device is lower than the heat generated by the first type of device, and the second type of device is located in the second air duct.

10. The heat dissipation device according to claim 3, characterized in that: The partition is parallel to a printed circuit board PCB in the server, the first type of components and the second type of components are arranged on the PCB, and there is a gap between the partition and the highest component arranged on the PCB.

11. The heat dissipation device according to any one of claims 3 or 10, characterized in that: The material of the partition is sheet metal or plastic.

12. The heat dissipation device according to any one of claims 3, characterized in that: The partition has a hollow area; When the partition is fixed in the cavity of the server, the hollow area is used to avoid the circulation pump of the liquid cooling component.

13. The heat dissipation device according to any one of claims 9, characterized in that: A plurality of installation stations are arranged in the server along a direction perpendicular to the partition, and the partition can be detachably installed at any installation station according to the height of the first category components or the second category components.

14. A server, characterized in that: A printed circuit board PCB is arranged in the server chassis, and a first type of device and a heat dissipation device as described in any one of claims 1 to 13 are coupled to the PCB.

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