Simplified modeling method and device for solder ball model on circuit board, equipment and medium

Abstract

The invention discloses a simplified modeling method and device for a solder ball model on a circuit board, equipment and a medium. The simplified modeling method for the solder ball model on the circuit board comprises the steps of obtaining a simulation electromagnetic frequency of a target circuit board and a simulation model of the target circuit board; when the solder ball model exists in the simulation model of the target circuit board, determining a to-be-simplified solder ball model and model simplification parameters of the target circuit board according to the simulation electromagnetic frequency of the target circuit board and a model simplification rule; and performing simplified modeling on the to-be-simplified solder ball model according to the model simplification parameters to obtain a target simplified circuit board model. According to the technical scheme, the simulation efficiency of the circuit board with the solder ball model in the early stage of development can be improved.

Description

Technical Field

[0001] The present invention relates to the field of hardware circuit technology, and in particular to a simplified modeling method, device, equipment and medium for a solder ball model on a circuit board. Background Art

[0002] ANSYS Electronics is a professional software for electromagnetic field simulation, which supports electromagnetic field simulation of electronic systems. When using ANSYS to perform electromagnetic simulation on a circuit board with BGA solder balls, you first need to model the circuit board stacking structure and BGA (ball grid array package) solder balls, because after actual welding, the BGA solder balls will be squeezed and deformed from a sphere to a drum-shaped body with round top and bottom and protruding sides due to gravity. You need to use a cuboid and a drum-shaped body to establish the circuit board layer and BGA solder balls respectively, and then perform a Boolean subtraction operation on the BGA solder ball model (drum-shaped body) and the circuit board layer model (cube) connected to the BGA solder ball to connect the BGA solder ball model with the circuit board layer model, and further add radiation space, boundary conditions, excitation, analysis settings, parameter optimization, etc. to the modeling, and perform simulation analysis after checking that everything is correct.

[0003] During the modeling process, BGA solder balls are the most complex models on the circuit board. In order to ensure the accuracy of the simulation results, the simulation tool needs to perform complex calculations such as finite element segmentation on complex models with curved boundaries such as drum-shaped bodies to reduce the errors of the simulation results. This will come at a certain cost, that is, more computing resources, time and hardware are required to solve. A complex PCB (Printed Circuit Board) may require hundreds of BGA solder balls, which leads to low simulation verification efficiency.

[0004] In the early stage of PCB design, the design plan has not yet been finalized. Designers need to constantly adjust and quickly iterate the design plan at this stage, which means that the efficiency of simulation verification at this stage is prioritized over the accuracy and precision of the simulation results. Therefore, in the early stage of PCB design, the efficiency of simulating PCBs with BGA solder balls using traditional simulation software is low, which is not conducive to the rapid iteration of design plans and prolongs the PCB design cycle. Summary of the invention

[0005] The present invention provides a simplified modeling method, device, equipment and medium for a solder ball model on a circuit board, so as to solve the problem of low simulation efficiency in the early stage of circuit board development with a solder ball model.

[0006] According to one aspect of the present invention, a simplified modeling method for a solder ball model on a circuit board is provided, comprising:

[0007] Acquire a simulated electromagnetic frequency of a target circuit board and a simulation model of the target circuit board;

[0008] When a solder ball model exists in the simulation model of the target circuit board, the solder ball model to be simplified and the model simplification parameters of the target circuit board are determined according to the simulation electromagnetic frequency of the target circuit board and the model simplification rule;

[0009] The solder ball model to be simplified is simplified according to the model simplification parameters to obtain the target simplified circuit board model.

[0010] According to another aspect of the present invention, there is provided a simplified modeling device for a solder ball model on a circuit board, comprising:

[0011] A data acquisition module, used to acquire a simulated electromagnetic frequency of a target circuit board and a simulation model of the target circuit board;

[0012] A data processing module, used for determining the solder ball model to be simplified and the model simplification parameters of the target circuit board according to the simulated electromagnetic frequency and the model simplification rule of the target circuit board when there is a solder ball model in the simulation model of the target circuit board;

[0013] The simplified modeling module is used to simplify the solder ball model to be simplified according to the model simplification parameters to obtain the target simplified circuit board model.

[0014] According to another aspect of the present invention, there is provided an electronic device, the electronic device comprising:

[0015] at least one processor; and

[0016] a memory communicatively connected to the at least one processor; wherein,

[0017] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the simplified modeling method of the solder ball model on the circuit board described in any embodiment of the present invention.

[0018] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the simplified modeling method of the solder ball model on the circuit board described in any embodiment of the present invention when executed.

[0019] The technical solution of the embodiment of the present invention obtains the simulated electromagnetic frequency of the target circuit board and the simulation model of the target circuit board, so that when there is a solder ball model in the simulation model of the target circuit board, the target circuit board's to-be-simplified solder ball model and the model simplification parameters are determined according to the simulated electromagnetic frequency of the target circuit board and the model simplification rule, and then the simplified solder ball model is simplified and modeled according to the model simplification parameters to obtain the target simplified circuit board model. Since the BGA solder balls required on a complex PCB board can reach hundreds, and in the early stage of circuit board design, it is necessary to continuously adjust and quickly iterate the design scheme, and the solder ball model in the simulation needs to perform complex calculations such as finite element segmentation to reduce the error of the simulation result, resulting in the simulation requiring more computing resources, time and hardware to solve. Through this solution, the solder ball model is simplified and modeled before simulation, which can shorten the simulation time without affecting the thermal characteristics, improve the efficiency of the designer's iterative design scheme, solve the problem of low simulation efficiency in the early stage of circuit board development with solder ball models, and can improve the simulation efficiency in the early stage of circuit board development with solder ball models.

[0020] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A flowchart of a simplified modeling method for a solder ball model on a circuit board provided in Embodiment 1 of the present invention;

[0023] Figure 2 A flowchart of a simplified modeling method for a solder ball model on a circuit board provided in the second embodiment of the present invention;

[0024] Figure 3 A schematic diagram of the structure of a simplified modeling device for a solder ball model on a circuit board provided in a third embodiment of the present invention;

[0025] Figure 4 A schematic diagram of the structure of an electronic device that can be used to implement an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0027] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0028] Embodiment 1

[0029] Figure 1 This is a flowchart of a simplified modeling method for a solder ball model on a circuit board provided in the first embodiment of the present invention. This embodiment is applicable to the rapid simulation iteration of a circuit board with a solder ball model. The method can be executed by a simplified modeling device for a solder ball model on a circuit board. The simplified modeling device for a solder ball model on a circuit board can be implemented in the form of hardware and / or software. The simplified modeling device for a solder ball model on a circuit board can be configured in an electronic device. Figure 1 As shown, the method includes:

[0030] Step 110: Acquire a simulated electromagnetic frequency of a target circuit board and a simulation model of the target circuit board.

[0031] The target circuit board may be a circuit board that currently needs to be simulated for electromagnetic and thermal characteristics in the early stage of development. The simulated electromagnetic frequency may be the frequency of the electromagnetic simulation of the target circuit board. The simulation model may be a model obtained by circuit board simulation modeling. Exemplarily, the simulation model may include but is not limited to a via structure and a solder ball model.

[0032] In the embodiment of the present invention, the simulation verification task of the target circuit board can be analyzed to determine the simulated electromagnetic frequency of the target circuit board and the simulation modules corresponding to the hardware modules in the target circuit board.

[0033] Step 120: When a solder ball model exists in the simulation model of the target circuit board, the solder ball model to be simplified and the model simplification parameters of the target circuit board are determined according to the simulation electromagnetic frequency of the target circuit board and the model simplification rule.

[0034] The model simplification rule may be a pre-set simplification rule of the simulation model in the circuit board, which is used to determine whether the solder ball model can be simplified and the simplification method. The solder ball model to be simplified may be a solder ball model in the target circuit board that meets the model simplification rule. The model simplification parameter may be a parameter required for model simplification modeling.

[0035] In an embodiment of the present invention, it can be determined whether a solder ball model exists in the simulation model of the target circuit board. If a solder ball model exists in the simulation model of the target circuit board, a solder ball model that meets the simplification conditions in the target circuit board is calculated according to the simulated electromagnetic frequency of the target circuit board and the model simplification rule, that is, the solder ball model to be simplified, and the model simplification parameters corresponding to the solder ball model to be simplified are further determined using the specific simplification method in the model simplification rule.

[0036] Step 130: Simplify the solder ball model to be simplified according to the model simplification parameters to obtain a target simplified circuit board model.

[0037] The target simplified circuit board model may be a simulation model obtained by completing module simplification processing of the target circuit board.

[0038] In an embodiment of the present invention, a simulation model that replaces the solder ball model to be simplified can be created based on the model simplification parameters, so that the created simulation model can be used to replace the corresponding solder ball model to be simplified to obtain a target simplified circuit board model.

[0039] The technical solution of the embodiment of the present invention obtains the simulated electromagnetic frequency of the target circuit board and the simulation model of the target circuit board, so that when there is a solder ball model in the simulation model of the target circuit board, the target circuit board's to-be-simplified solder ball model and the model simplification parameters are determined according to the simulated electromagnetic frequency of the target circuit board and the model simplification rule, and then the simplified solder ball model is simplified and modeled according to the model simplification parameters to obtain the target simplified circuit board model. Since the BGA solder balls required on a complex PCB board can reach hundreds, and in the early stage of circuit board design, it is necessary to continuously adjust and quickly iterate the design scheme, and the solder ball model in the simulation needs to perform complex calculations such as finite element segmentation to reduce the error of the simulation result, resulting in the simulation requiring more computing resources, time and hardware to solve. Through this solution, the solder ball model is simplified and modeled before simulation, which can shorten the simulation time without affecting the thermal characteristics, improve the efficiency of the designer's iterative design scheme, solve the problem of low simulation efficiency in the early stage of circuit board development with solder ball models, and can improve the simulation efficiency in the early stage of circuit board development with solder ball models.

[0040] Embodiment 2

[0041] Figure 2 This is a flowchart of a simplified modeling method for a solder ball model on a circuit board provided in the second embodiment of the present invention. This embodiment is specific based on the above embodiment and provides a specific optional implementation method for determining the solder ball model to be simplified and the model simplification parameters of the target circuit board according to the simulated electromagnetic frequency and model simplification rules of the target circuit board. Figure 2 As shown, the method includes:

[0042] Step 210: Acquire a simulated electromagnetic frequency of a target circuit board and a simulation model of the target circuit board.

[0043] Step 220: When a solder ball model exists in the simulation model of the target circuit board, a model radius threshold and a model simplification gradient accuracy range in the model simplification rule are determined.

[0044] The model radius threshold may be the maximum radius at which the preset solder ball model can be simplified when the circuit board is subjected to electromagnetic field and thermal characteristic simulation. The model simplification gradient accuracy interval may be a plurality of preset simulation accuracy requirement intervals.

[0045] In an embodiment of the present invention, when it is determined that a solder ball model exists in the simulation model of the target circuit board, it is characterized that there may be a model that can be simplified in the simulation model, and then the model simplification rule is analyzed to obtain a model radius threshold and a model simplification gradient accuracy range.

[0046] In an optional embodiment of the present invention, determining the model radius threshold in the model simplification rule may include: determining the model radius threshold based on the following formula: Where X represents the model radius threshold, u represents the wave speed, and f represents the simulated electromagnetic frequency of the target circuit board.

[0047] The simulated electromagnetic frequency can be the electromagnetic wave simulation frequency used in the electromagnetic simulation of the target circuit board. The wave velocity is the propagation speed of the electromagnetic wave (3×10 8 m / s).

[0048] Step 230: Use the solder ball model in the target circuit board whose first cross-section radius is less than or equal to the model radius threshold as the solder ball model to be simplified.

[0049] The first cross-sectional radius may be a radius of a maximum cross-sectional area of ​​the solder ball model.

[0050] In an embodiment of the present invention, the first cross-sectional radius of the solder ball model in the target circuit board can be compared with the model radius threshold, and then the solder ball model in the target circuit board whose first cross-sectional radius is less than or equal to the model radius threshold is screened out to obtain the solder ball model to be simplified. The solder ball model in the target circuit board whose first cross-sectional radius is greater than the model radius threshold cannot be used as the solder ball model to be simplified, and the simplification will affect the electromagnetic simulation results of the target circuit board.

[0051] Exemplarily, if the first cross-sectional radius of the target circuit board is less than or equal to It has little impact on the electromagnetic simulation effect, and the solder ball model can be simplified according to the user's accuracy requirements.

[0052] Step 240: Determine the model simplification parameters according to the model simplification gradient accuracy range and the second cross-section radius of the solder ball model to be simplified.

[0053] The second cross-sectional radius may be the radius of the bottom surface of the solder ball model.

[0054] In an embodiment of the present invention, the shape into which the solder ball model to be simplified can be simplified can be determined through the model simplification gradient accuracy range, and the cross-sectional area of ​​the shape into which the solder ball model to be simplified can be calculated based on the second cross-sectional radius of the solder ball model to be simplified, thereby determining the model simplification parameters based on the shape into which the solder ball model to be simplified can be simplified and the cross-sectional area of ​​the simplified shape.

[0055] In an optional embodiment of the present invention, determining the model simplification parameters according to the model simplification gradient accuracy interval and the second cross-sectional radius of the solder ball model to be simplified may include: determining the model type of the target simplified model of the solder ball model to be simplified according to the model simplification gradient accuracy interval; determining the cross-sectional association parameters of the target simplified model according to the second cross-sectional radius of the solder ball model to be simplified; and using the model type, cross-sectional association parameters and model height of the target simplified model as model simplification parameters.

[0056] The target simplified model may be the model that the solder ball model to be simplified is finally simplified into. The model type may be used to indicate the shape of the model. The cross-section associated parameter may be a parameter related to the cross-section of the target simplified model, and is used to determine the cross-section area and cross-section shape of the target simplified model.

[0057] In an embodiment of the present invention, the model type of the simplified model corresponding to each sub-interval of the model simplification gradient accuracy interval can be obtained, so as to determine the model type corresponding to the solder ball model to be simplified under the model accuracy requirement required by the user, that is, the model type of the target simplified model. Furthermore, based on the principle of equal cross-sectional area, the cross-sectional association parameters of the target simplified model are determined according to the second cross-sectional radius of the solder ball model to be simplified, so as to use the model type, cross-sectional association parameters and model height of the target simplified model as model simplification parameters.

[0058] In an optional embodiment of the present invention, determining the model type of the target simplified model of the solder ball model to be simplified according to the model simplification gradient accuracy interval may include: when the user required accuracy is in the first accuracy interval of the model simplification gradient accuracy interval, determining that the target simplified model of the solder ball model to be simplified is a cylinder; when the user required accuracy is in the second accuracy interval of the model simplification gradient accuracy interval, determining that the target simplified model of the solder ball model to be simplified is an octagonal prism.

[0059] The first precision interval may be a precision interval in the model simplification gradient precision interval, and the second precision interval may be a precision interval adjacent to the first precision interval in the model simplification gradient precision interval.

[0060] Exemplarily, the first accuracy interval may be [93%-95%), and the second accuracy interval may be [90%-93%).

[0061] In an embodiment of the present invention, the user required accuracy can be matched with the model simplification gradient accuracy interval. If it is determined that the user required accuracy is in the first accuracy interval of the model simplification gradient accuracy interval, the cylinder corresponding to the first accuracy interval is used as the shape of the target simplified model after the solder ball model to be simplified is simplified. If it is determined that the user required accuracy is in the second accuracy interval of the model simplification gradient accuracy interval, the octagonal prism corresponding to the second accuracy interval is used as the shape of the target simplified model after the solder ball model to be simplified is simplified.

[0062] In an optional embodiment of the present invention, determining the model type of the target simplified model of the solder ball model to be simplified according to the model simplification gradient accuracy interval may include: when the user required accuracy is in the third accuracy interval of the model simplification gradient accuracy interval, determining that the target simplified model of the solder ball model to be simplified is a hexagonal prism; when the user required accuracy is in the fourth accuracy interval of the model simplification gradient accuracy interval, determining that the target simplified model of the solder ball model to be simplified is a quadrangular prism.

[0063] The third precision interval may be another precision interval adjacent to the model simplification gradient precision interval and the second precision interval. The fourth precision interval may be a precision interval adjacent to the third precision interval in the model simplification gradient precision interval. The minimum values ​​of the first precision interval, the second precision interval, the third precision interval, and the fourth precision interval gradually decrease.

[0064] Exemplarily, the third accuracy interval may be [88%-90%), and the fourth accuracy interval may be [85%-88%).

[0065] In the embodiment of the present invention, if it is determined that the user required accuracy is in the third accuracy interval of the model simplification gradient accuracy interval, the hexagonal prism corresponding to the third accuracy interval is used as the shape of the target simplified model after the solder ball model to be simplified is simplified. If it is determined that the user required accuracy is in the fourth accuracy interval of the model simplification gradient accuracy interval, the quadrangular prism corresponding to the fourth accuracy interval is used as the shape of the target simplified model after the solder ball model to be simplified is simplified.

[0066] Optionally, the cross-section of the quadrangular prism may be rectangular or square.

[0067] In an optional embodiment of the present invention, determining the cross-sectional association parameters of the target simplified model according to the second cross-sectional radius of the solder ball model to be simplified may include: calculating the target cross-sectional area of ​​the target simplified model according to the second cross-sectional radius of the solder ball model to be simplified; and calculating the cross-sectional association parameters of the target simplified model according to the target cross-sectional area and the model type of the target simplified model.

[0068] The target cross-sectional area may be the cross-sectional area of ​​the target simplified model.

[0069] In an embodiment of the present invention, the bottom area of ​​the solder ball model to be simplified can be calculated based on the second cross-sectional radius of the solder ball model to be simplified and the circular area formula, which can be used as the target cross-sectional area of ​​the target simplified model. Then, based on the target cross-sectional area of ​​the target simplified model and the model type of the target simplified model, the cross-sectional side length or cross-sectional radius of the target simplified model can be determined, that is, the cross-sectional association parameters of the target simplified model can be obtained.

[0070] Step 250: Simplify the solder ball model to be simplified according to the model simplification parameters to obtain a target simplified circuit board model.

[0071] For example, assuming that the radius of the second cross section of the solder ball model to be simplified is r, and the bottom area of ​​the solder ball model to be simplified is πr 2 According to the law of heat conduction in thermodynamics (In the formula, Q is the heat conduction heat, k is the thermal conductivity, and A is the thermal conduction area. is the temperature gradient), we know that when the heat conduction area is the same, the heat conduction heat of the same material is the same. If you want to ensure that the simplified model does not affect the thermal conductivity, you need to keep the cross-sectional area of ​​the target simplified model the same as the cross-sectional area of ​​the solder ball model. If the target simplified model is a cylinder, the cross-section of the target simplified model is circular. According to πa 2 =πr 2 , the radius of the cylinder is calculated to be r. It should be noted that the sections in this article are all cross sections.

[0072] This solution considers simplifying the BGA solder ball model without affecting the electromagnetic simulation results. If it can be simplified, an algorithm that takes into account the electromagnetic and thermal characteristics of the BGA solder ball of the circuit board is used to simplify the drum-shaped model of the BGA solder ball into a cylindrical model with the same cross-sectional area and height, and then perform simulation calculations to improve the simulation verification efficiency. Compared with the existing electromagnetic simulation method, this solution has higher simulation verification efficiency without affecting the electromagnetic simulation results.

[0073] The technical solution of the embodiment of the present invention obtains the simulated electromagnetic frequency of the target circuit board and the simulation model of the target circuit board, so that when there is a solder ball model in the simulation model of the target circuit board, the model radius threshold and the model simplification gradient accuracy interval in the model simplification rule are determined, and then the solder ball model with a first cross-sectional radius less than or equal to the model radius threshold in the target circuit board is used as the solder ball model to be simplified, and the model simplification parameters are further determined according to the model simplification gradient accuracy interval and the second cross-sectional radius of the solder ball model to be simplified. Finally, the solder ball model to be simplified is simplified and modeled according to the model simplification parameters to obtain the target simplified circuit board model. Since the BGA solder balls required on a complex PCB board can reach hundreds, and in the early stage of circuit board design, it is necessary to continuously adjust and quickly iterate the design scheme, and the solder ball model in the simulation needs to perform complex calculations such as finite element segmentation to reduce the error of the simulation result, resulting in the simulation requiring more computing resources, time and hardware to solve. Through this solution, the solder ball model is simplified and modeled before simulation, which can shorten the simulation time without affecting the thermal characteristics, improve the efficiency of the designer's iterative design scheme, solve the problem of low simulation efficiency in the early stage of circuit board development with solder ball models, and improve the simulation efficiency in the early stage of circuit board development with solder ball models.

[0074] Embodiment 3

[0075] Figure 3 This is a schematic diagram of a simplified modeling device for a solder ball model on a circuit board provided in the third embodiment of the present invention. Figure 3 As shown, the device comprises:

[0076] The data acquisition module 310 is used to acquire the simulated electromagnetic frequency of the target circuit board and the simulation model of the target circuit board.

[0077] The data processing module 320 is used to determine the solder ball model to be simplified and the model simplification parameters of the target circuit board according to the simulated electromagnetic frequency and model simplification rules of the target circuit board when there is a solder ball model in the simulation model of the target circuit board.

[0078] The simplified modeling module 330 is used to simplify the solder ball model to be simplified according to the model simplification parameters to obtain a target simplified circuit board model.

[0079] The technical solution of the embodiment of the present invention obtains the simulated electromagnetic frequency of the target circuit board and the simulation model of the target circuit board, so that when there is a solder ball model in the simulation model of the target circuit board, the target circuit board's to-be-simplified solder ball model and the model simplification parameters are determined according to the simulated electromagnetic frequency of the target circuit board and the model simplification rule, and then the simplified solder ball model is simplified and modeled according to the model simplification parameters to obtain the target simplified circuit board model. Since the BGA solder balls required on a complex PCB board can reach hundreds, and in the early stage of circuit board design, it is necessary to continuously adjust and quickly iterate the design scheme, and the solder ball model in the simulation needs to perform complex calculations such as finite element segmentation to reduce the error of the simulation result, resulting in the simulation requiring more computing resources, time and hardware to solve. Through this solution, the solder ball model is simplified and modeled before simulation, which can shorten the simulation time without affecting the thermal characteristics, improve the efficiency of the designer's iterative design scheme, solve the problem of low simulation efficiency in the early stage of circuit board development with solder ball models, and can improve the simulation efficiency in the early stage of circuit board development with solder ball models.

[0080] Optionally, the data processing module 320 is specifically used to determine a model radius threshold and a model simplification gradient accuracy range in the model simplification rule; use a solder ball model in the target circuit board whose first cross-sectional radius is less than or equal to the model radius threshold as the solder ball model to be simplified; and determine the model simplification parameters according to the model simplification gradient accuracy range and the second cross-sectional radius of the solder ball model to be simplified.

[0081] Optionally, the data processing module 320 is specifically configured to determine the model radius threshold based on the following formula: Wherein, X represents the model radius threshold, u represents the wave speed, and f represents the simulated electromagnetic frequency of the target circuit board.

[0082] Optionally, the data processing module 320 is specifically used to determine the model type of the target simplified model of the solder ball model to be simplified according to the model simplification gradient accuracy interval; determine the cross-section associated parameters of the target simplified model according to the second cross-section radius of the solder ball model to be simplified; and use the model type of the target simplified model, the cross-section associated parameters and the model height as the model simplification parameters.

[0083] Optionally, the data processing module 320 is specifically used to determine that the target simplified model of the solder ball model to be simplified is a cylinder when the user required accuracy is in the first accuracy interval of the model simplification gradient accuracy interval; and to determine that the target simplified model of the solder ball model to be simplified is an octagonal prism when the user required accuracy is in the second accuracy interval of the model simplification gradient accuracy interval.

[0084] Optionally, the data processing module 320 is specifically used to determine that the target simplified model of the solder ball model to be simplified is a hexagonal prism when the user required accuracy is in the third accuracy interval of the model simplification gradient accuracy interval; and to determine that the target simplified model of the solder ball model to be simplified is a quadrangular prism when the user required accuracy is in the fourth accuracy interval of the model simplification gradient accuracy interval.

[0085] Optionally, the data processing module 320 is specifically used to calculate the target cross-sectional area of ​​the target simplified model according to the second cross-sectional radius of the solder ball model to be simplified; and calculate the cross-sectional association parameters of the target simplified model according to the target cross-sectional area and the model type of the target simplified model.

[0086] The simplified modeling device for the solder ball model on a circuit board provided in an embodiment of the present invention can execute the simplified modeling method for the solder ball model on a circuit board provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0087] Embodiment 4

[0088] Figure 4 A schematic diagram of an electronic device that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0089] like Figure 4 As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0090] A number of components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0091] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a simplified modeling method for a solder ball model on a circuit board.

[0092] In some embodiments, the simplified modeling method of the solder ball model on the circuit board can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the simplified modeling method of the solder ball model on the circuit board described above can be executed. Alternatively, in other embodiments, the processor 11 can be configured to execute the simplified modeling method of the solder ball model on the circuit board in any other appropriate manner (for example, by means of firmware).

[0093] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0094] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0095] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0096] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0097] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0098] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0099] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0100] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A simplified modeling method for a solder ball model on a circuit board, characterized in that: include: Acquire a simulated electromagnetic frequency of a target circuit board and a simulation model of the target circuit board; When a solder ball model exists in the simulation model of the target circuit board, determining the solder ball model to be simplified and model simplification parameters of the target circuit board according to the simulated electromagnetic frequency and model simplification rules of the target circuit board; The solder ball model to be simplified is simplified and modeled according to the model simplification parameters to obtain a target simplified circuit board model.

2. The method according to claim 1, characterized in that Determining the solder ball model to be simplified and the model simplification parameters of the target circuit board according to the simulated electromagnetic frequency and the model simplification rule of the target circuit board includes: Determining a model radius threshold and a model simplification gradient accuracy interval in the model simplification rule; Using a solder ball model in the target circuit board whose first cross-section radius is less than or equal to the model radius threshold as the solder ball model to be simplified; The model simplification parameter is determined according to the model simplification gradient accuracy range and the second cross-section radius of the solder ball model to be simplified.

3. The method according to claim 2, characterized in that The step of determining the model radius threshold in the model simplification rule includes: The model radius threshold is determined based on the following formula: Wherein, X represents the model radius threshold, u represents the wave speed, and f represents the simulated electromagnetic frequency of the target circuit board.

4. The method according to claim 2, characterized in that: Determining the model simplification parameter according to the model simplification gradient accuracy range and the second cross-sectional radius of the solder ball model to be simplified includes: Determining the model type of the target simplified model of the solder ball model to be simplified according to the model simplification gradient accuracy range; Determining a cross-section associated parameter of the target simplified model according to a second cross-section radius of the solder ball model to be simplified; The model type of the target simplified model, the cross-section associated parameters and the model height are used as the model simplification parameters.

5. The method according to claim 4, characterized in that Determining the model type of the target simplified model of the solder ball model to be simplified according to the model simplification gradient accuracy range includes: When the user required accuracy is in the first accuracy interval of the model simplification gradient accuracy interval, determining that the target simplified model of the solder ball model to be simplified is a cylinder; When the user required accuracy is in the second accuracy interval of the model simplification gradient accuracy interval, it is determined that the target simplified model of the solder ball model to be simplified is an octagonal prism.

6. The method according to claim 5, characterized in that Determining the model type of the target simplified model of the solder ball model to be simplified according to the model simplification gradient accuracy range includes: When the user required accuracy is in the third accuracy interval of the model simplification gradient accuracy interval, determining that the target simplified model of the solder ball model to be simplified is a hexagonal prism; When the user required accuracy is in the fourth accuracy interval of the model simplification gradient accuracy interval, it is determined that the target simplified model of the solder ball model to be simplified is a quadrangular prism.

7. The method according to claim 4, characterized in that The step of determining the cross-section associated parameters of the target simplified model according to the second cross-section radius of the solder ball model to be simplified includes: Calculating a target cross-sectional area of ​​the target simplified model according to a second cross-sectional radius of the solder ball model to be simplified; According to the target cross-sectional area and the model type of the target simplified model, the cross-sectional association parameters of the target simplified model are calculated.

8. A simplified modeling device for a solder ball model on a circuit board, characterized in that: include: A data acquisition module, used to acquire a simulated electromagnetic frequency of a target circuit board and a simulation model of the target circuit board; A data processing module, used for determining the solder ball model to be simplified and the model simplification parameters of the target circuit board according to the simulated electromagnetic frequency and the model simplification rule of the target circuit board when there is a solder ball model in the simulation model of the target circuit board; The simplified modeling module is used to simplify the solder ball model to be simplified according to the model simplification parameters to obtain a target simplified circuit board model.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the simplified modeling method of the solder ball model on the circuit board according to any one of claims 1-7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the simplified modeling method of a solder ball model on a circuit board according to any one of claims 1 to 7 when executed.

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