Wafer vapor deposition device and use method

Abstract

The invention discloses a wafer vapor deposition device and a use method, and the wafer vapor deposition device comprises a wafer box lifting device which is used for lifting a wafer box; the load locking chamber is arranged between the reaction chamber and the wafer box lifting device, and a wafer cache structure is arranged in the load locking chamber; the wafer cache structure is used for storing wafers which are not subjected to film deposition and transferred from the wafer box to the reaction chamber or storing wafers which are subjected to film deposition and transferred from the reaction chamber to the wafer box; the reaction chambers are used for performing thin film deposition on the wafer; and the wafer transfer device is used for transferring wafers among the wafer box, the wafer cache structure and the reaction chamber. The opening and closing frequency of the load locking cavity is obviously reduced, frequent conversion between atmospheric pressure and vacuum pressure is avoided, the production efficiency is improved, and the operation pressure of a vacuum pumping system is effectively relieved.

Description

Technical Field

[0001] The present invention relates to the field of wafer processing technology, and in particular to a wafer vapor deposition device and a use method thereof. Background Art

[0002] The load lock chamber is a transition area between the wafer cassette and the reaction chamber, and its role is crucial. The thin film deposition operation of wafers in the chemical vapor deposition equipment (CVD) requires the wafer conveyor in the load lock chamber to transfer the wafers between the reaction chamber and the wafer cassette on the wafer cassette lifting device.

[0003] When it is necessary to transfer a wafer without thin film deposition from a wafer box to a reaction chamber, or to transfer a wafer with completed thin film deposition from a reaction chamber to a wafer box, the load lock chamber needs to be evacuated to atmospheric pressure and the vacuum gate valve of the load lock chamber needs to be opened so that the wafer can be transferred between the reaction chamber and the wafer box under atmospheric pressure. After the transfer is completed, the vacuum gate valve needs to be closed and the load lock chamber needs to be evacuated again to make the load lock chamber reach a vacuum state.

[0004] When wafers are deposited in batches for thin film deposition, the load-lock chamber needs to frequently switch between atmospheric pressure and vacuum pressure. The switching process requires evacuation / exhaustion, which not only consumes a lot of time and seriously affects the overall production efficiency, but also repeatedly evacuates the chamber and places a heavy burden on the vacuum pumping system of the chemical vapor deposition equipment, which may shorten the service life of the equipment, increase maintenance costs, and reduce the overall reliability of the equipment. Summary of the invention

[0005] The present invention provides a wafer vapor deposition device and a use method thereof, so as to avoid frequent switching between atmospheric pressure and vacuum pressure in a load-lock chamber, thereby improving production efficiency and reducing the burden of a vacuum pumping system.

[0006] In order to achieve the above object, the technical solution of the present invention is:

[0007] A wafer vapor deposition device comprises: a wafer box lifting device, the wafer box lifting device is used to lift the wafer box; a load lock chamber, the load lock chamber is arranged between the reaction chamber and the wafer box lifting device, and a wafer buffer structure is arranged in the load lock chamber; the wafer buffer structure is used to store wafers without thin film deposition transferred from the wafer box to the reaction chamber or to store wafers with completed thin film deposition transferred from the reaction chamber to the wafer box; a plurality of reaction chambers, the reaction chambers are used to perform thin film deposition on wafers; a wafer transfer device, the wafer transfer device is used to transfer wafers between the wafer box, the wafer buffer structure and the reaction chamber.

[0008] The invention also includes a method for using a wafer vapor deposition device, using the aforementioned wafer vapor deposition device, when it is necessary to transfer the wafers without thin film deposition in the wafer box to the reaction chamber for thin film deposition: the load lock chamber is opened, and the wafer transfer device transfers the wafers in the wafer box to the wafer cache structure for storage; when the number of wafers stored in the wafer cache structure reaches the number required by the process, the load lock chamber is closed, the load lock chamber is evacuated, the reaction chamber is opened, and the wafer transfer device transfers the wafers in the wafer cache structure to the reaction chamber; when the number of wafers stored in the wafer cache structure reaches the number required by the process, the load lock chamber is closed, the load lock chamber is evacuated, and the reaction chamber is opened, and the wafer transfer device transfers the wafers in the wafer cache structure to the reaction chamber; when the number of wafers stored in the wafer cache structure reaches the number required by the process, the load lock chamber is closed, the load lock chamber is evacuated, and the reaction chamber is opened. Move the wafers into the reaction chamber, close the reaction chamber to carry out thin film deposition; when it is necessary to transfer the wafers that have completed thin film deposition in the reaction chamber to the wafer box: open the reaction chamber, and the wafer transfer device transfers the wafers that have completed thin film deposition in the reaction chamber to the wafer cache structure. When the number of wafers stored in the wafer cache structure reaches the number required by the process, close the reaction chamber, open the load lock chamber, and the wafer transfer device transfers the wafers stored in the wafer cache structure to the wafer box. After the transfer is completed, close the load lock chamber.

[0009] Beneficial effects: The present invention provides a wafer vapor deposition device and a method of use. By setting a wafer cache structure in the load lock chamber, an area for batch storage of wafers is added to the load lock chamber. The wafers to be transferred are concentrated in the wafer cache structure for cache, and then transferred in a centralized manner through a wafer transfer device, which significantly reduces the opening and closing frequency of the load lock chamber, avoids frequent switching between atmospheric pressure and vacuum pressure, improves production efficiency, and effectively alleviates the operating pressure of the vacuum pumping system. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0011] Figure 1 A schematic diagram of the structure of a wafer vapor deposition device disclosed in the present invention Figure 1 ;

[0012] Figure 2 A schematic diagram of the structure of a wafer vapor deposition device disclosed in the present invention Figure 2 ;

[0013] Figure 3 A top view of a wafer vapor deposition device disclosed in the present invention;

[0014] Figure 4A schematic diagram of a wafer vapor deposition device disclosed in the present invention with part of the frame removed Figure 1 ;

[0015] Figure 5 A schematic diagram of a wafer vapor deposition device disclosed in the present invention with part of the frame removed Figure 2 ;

[0016] Figure 6 A schematic structural diagram of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention;

[0017] Figure 7 A side view of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention;

[0018] Figure 8 for Figure 7 V1-V1 cross-sectional view;

[0019] Fig. 9 A top view of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention;

[0020] Fig.10 for Fig. 9 V2-V2 cross-sectional view;

[0021] Fig.11 for Fig.10 A magnified view of D1;

[0022] Fig.12 for Fig. 9 V3-V3 cross-sectional view;

[0023] Fig.13 for Fig.12 The enlarged view of D2;

[0024] Fig.14 It is a structural schematic diagram of a hollow tensioning shaft of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention;

[0025] Fig.15 It is a structural schematic diagram of a lower first swing arm of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention;

[0026] Fig.16 A schematic top view of an upper first swing arm of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention;

[0027] Fig.17 It is a structural schematic diagram of a pipeline fixing bracket of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention;

[0028] Fig.18It is a structural schematic diagram of a support body of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention;

[0029] Fig.19a A schematic diagram of extending a wafer handling robot of a wafer vapor deposition device disclosed in the present invention;

[0030] Fig.19b A schematic diagram of the contraction of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention;

[0031] Fig.20a It is a schematic diagram of a wafer handling fork of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention handling a wafer through a card slot;

[0032] Fig.20b It is a schematic diagram of a wafer handling fork of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention handling a wafer through a vacuum suction cup;

[0033] Fig.21a It is a top view schematic diagram of a first wire rope pulley and a first transmission shaft of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention being driven by a wire rope;

[0034] Figure 21b It is a front view schematic diagram of a first wire rope pulley and a first transmission shaft of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention being driven by a wire rope;

[0035] Fig. 22 It is a structural schematic diagram of a tensioning block of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention;

[0036] Fig.23 A schematic diagram of the positions of wafers and wafer fetching forks stored in a wafer buffer structure disclosed in the present invention;

[0037] Fig.24 A schematic structural diagram of a wafer buffer structure of a wafer vapor deposition device disclosed in the present invention;

[0038] Fig.25 It is a side view of a wafer buffer structure of a wafer vapor deposition device disclosed in the present invention;

[0039] Fig.26 for Fig.25 V16-V16 cross-sectional view;

[0040] Fig. 27 It is a structural schematic diagram of a wafer lifting mechanism and a wafer carrier of a wafer vapor deposition device disclosed in the present invention;

[0041] Fig.28It is a front view of a wafer lifting mechanism and a wafer stage of a wafer vapor deposition device disclosed in the present invention;

[0042] Fig.29 for Fig.28 V4-V4 cross-sectional view;

[0043] Fig.30 for Fig.28 V5-V5 cross-sectional view;

[0044] Fig.31 A side view of a wafer lifting mechanism and a wafer stage of a wafer vapor deposition device disclosed in the present invention;

[0045] Fig.32a for Fig.31 V6-V6 cutaway view;

[0046] Figure 32b for Fig.31 V7-V7 cross-sectional view;

[0047] Fig.33 It is a structural schematic diagram of a lifting pin of a wafer vapor deposition device disclosed in the present invention;

[0048] Fig.34 A top view of a wafer lifting mechanism and a wafer stage of a wafer vapor deposition device disclosed in the present invention;

[0049] Fig.35 for Fig.34 V8-V8 cutaway view;

[0050] Fig.36 A schematic diagram of the pipelines of a gas cabinet of a wafer vapor deposition device disclosed in the present invention;

[0051] Fig.37 A schematic diagram of the structure of a gas cabinet for a wafer vapor deposition device disclosed in the present invention Figure 1 ;

[0052] Fig.38 A schematic diagram of the structure of a gas cabinet for a wafer vapor deposition device disclosed in the present invention Figure 2 ;

[0053] Fig.39 It is a structural schematic diagram of a gas cabinet of a wafer vapor deposition device disclosed in the present invention with the cabinet door removed;

[0054] Fig.40 It is a front view of a gas cabinet of a wafer vapor deposition device disclosed in the present invention with the cabinet door removed;

[0055] Fig.41 for Fig.40 A magnified view of D3;

[0056] Fig.42 It is a rear view of a gas cabinet of a wafer vapor deposition device disclosed in the present invention;

[0057] Fig.43 for Fig.42 A magnified view of D4;

[0058] Fig.44 is a schematic diagram of a gas control module of an existing gas cabinet;

[0059] Fig.45 It is a structural schematic diagram of a connection device of a wafer vapor deposition device disclosed in the present invention installed on a chamber;

[0060] Fig.46 It is a structural schematic diagram of a hinge structure of a connecting device of a wafer vapor deposition device disclosed in the present invention;

[0061] Fig.47 A side view of a hinge structure of a connection device for a wafer vapor deposition device disclosed in the present invention Figure 1 ;

[0062] Fig.48 for Fig.47 V9-V9 cross-sectional view;

[0063] Fig.49 A side view of a hinge structure of a connection device for a wafer vapor deposition device disclosed in the present invention Figure 2 ;

[0064] Fig.50 for Fig.49 V10-V10 cross-sectional view;

[0065] Fig.51 It is a front view of a hinge structure of a connection device of a wafer vapor deposition device disclosed in the present invention;

[0066] Fig.52 for Fig.51 V11-V11 cross-sectional view;

[0067] Fig.53 It is a structural schematic diagram of a limit slider of a connection device of a wafer vapor deposition device disclosed in the present invention;

[0068] Fig.54 It is a side view of a limiting slider of a connection device of a wafer vapor deposition device disclosed in the present invention;

[0069] Fig.55 It is a structural schematic diagram of a heating device for a wafer vapor deposition device disclosed in the present invention;

[0070] Fig.56It is a front view of a heating device of a wafer vapor deposition device disclosed in the present invention;

[0071] Fig.57 A top view of a heating device for a wafer vapor deposition device disclosed in the present invention;

[0072] Fig.58 A schematic structural diagram of a water-cooled lampshade of a heating device of a wafer vapor deposition device disclosed in the present invention;

[0073] Fig.59 A schematic structural diagram of a lamp holder of a heating device for a wafer vapor deposition apparatus disclosed in the present invention;

[0074] Fig.60 for Fig.56 V12-V12 cutaway view;

[0075] Fig.61 for Fig.56 V13-V13 cross-sectional view;

[0076] Fig.62 A schematic diagram of the coordination between a vacuum gate valve and a chamber of a wafer vapor deposition device disclosed in the present invention;

[0077] Fig.63 It is a structural schematic diagram of a chamber of a wafer vapor deposition device disclosed in the present invention;

[0078] Fig.64 A schematic diagram of the structure of a vacuum gate valve for removing a cavity of a wafer vapor deposition device disclosed in the present invention Figure 1 ;

[0079] Fig.65 A schematic diagram of the structure of a vacuum gate valve for removing a cavity of a wafer vapor deposition device disclosed in the present invention Figure 2 ;

[0080] Fig.66 It is a schematic structural diagram of a vacuum gate valve of a wafer vapor deposition device disclosed in the present invention without a chamber and a cover plate;

[0081] Fig.67 A side view of a vacuum gate valve without a chamber and a cover plate of a wafer vapor deposition device disclosed in the present invention;

[0082] Fig.68 A schematic structural diagram of a valve plate of a vacuum gate valve of a wafer vapor deposition device disclosed in the present invention;

[0083] Fig.69 A top view of a valve plate of a vacuum gate valve of a wafer vapor deposition device disclosed in the present invention;

[0084] Fig.70It is a structural schematic diagram of a transmission plate of a vacuum gate valve of a wafer vapor deposition device disclosed in the present invention;

[0085] Fig.71 for Fig.69 V14-V14 cross-sectional view;

[0086] Fig.72 for Fig.69 V15-V15 cross-sectional view;

[0087] Fig.73 It is a structural schematic diagram of an existing valve structure;

[0088] Fig.74 A schematic diagram of a structure in which an existing cavity is removed from an existing valve structure;

[0089] Fig.75 It is a structural schematic diagram of a wafer box lifting device of a wafer vapor deposition device disclosed in the present invention.

[0090] In the figure: 1. slice fork; 101. first clamping part; 102. second clamping part; 103. main body; 104. vacuum suction cup; 2. swing arm part; 201. first lower swing arm; 202. second upper swing arm; 203. second lower swing arm; 204. first upper swing arm; 205. driving gear; 206. driven gear; 207. first rotating shaft; 208. second rotating shaft; 209. upper gear cover; 210. lower gear cover; 211. first opening ring; 212. second opening ring; 213. deformation groove; 3. turntable; 301. connecting sleeve; 4. base flange; 5. telescopic drive device; 501. second motor; 502. second mounting frame; 503. second transmission shaft; 504. second wire rope wheel; 505 , second driven pulley; 6, rotary drive device; 601, first motor; 602, first mounting frame; 603, first transmission shaft; 604, first wire rope wheel; 605, first driven pulley; 7, multi-axis magnetic fluid sealing transmission device; 701, hollow shaft; 702, intermediate shaft; 703, base shaft; 8, swing arm adjustment mechanism; 801, adjustment support; 802, hollow adjustment member; 803, hollow tensioning shaft; 804, locking bolt; 805, tensioning block; 806, tensioning part; 807, tensioning strip; 808, spring; 809, step surface; 810, milling plane; 811, internal threaded pipe; 9, pipeline fixing bracket; 901, bracket body; 902, pressure plate; 10, vacuum joint; 11, wire rope; 1 2. Waist-shaped hole; 13. Cavity connecting plate; 14. First adjustment plate; 1401. Y-direction slide rail; 15. Second adjustment plate; 1501. X-direction slide rail; 16. Lifting mechanism; 1601. Support; 1602. Motor; 1603. Lead screw; 1604. Z-direction slide rail; 1605. Z-direction slider; 1606. Fixed shaft clamping part; 1607. Lead screw nut; 1608. Lead screw nut seat; 1609. Clamping block; 1701. Connecting bolt; 1702. Leveling top screw; 1703. Leveling locking nut; 18. Y-direction adjustment mechanism; 1801. First connecting plate; 1802. First hollow bolt; 1803. First guide screw; 1804. First fixing nut; 19. X-direction adjustment structure; 190 1. Second connecting plate; 1902. Second hollow bolt; 1903. Second guide screw; 1904. Second fixing nut; 2001. Y-direction spring; 2002. Y-direction spring mounting pin; 2003. Y-direction spring mounting screw; 2101. X-direction spring; 2102. X-direction spring mounting pin; 2103. X-direction spring mounting screw; 22. Y-direction insert; 23. X-direction insert; 24. First bolt; 25. First nut; 26. Second bolt; 27. Second nut; 28. Third bolt; 29. ​​Wafer stage; 291. Fixed shaft; 30. Wafer; 31. First gas delivery unit; 32. Second gas delivery unit; 33a. First filter; 33b. Second filter; 33c. Third filter;33d, fourth filter; 33e, fifth filter; 33f, sixth filter; 34a, first manual valve; 34b, second manual valve; 34c, third manual valve; 34d, fourth manual valve; 34e, fifth manual valve; 34f, sixth manual valve; 35a, first gas mass flow controller; 35b, second gas mass flow controller; 35c, third gas mass flow controller; 35d, fourth gas mass flow controller; 35e, fifth gas mass flow controller; 35f, sixth gas mass flow controller; 36a, first pneumatic valve; 36b, second pneumatic valve; 36c, third pneumatic valve; 36d, fourth pneumatic valve; 36e, fifth pneumatic valve; 36f, sixth pneumatic valve; 37a, first switch valve; 37b, second switch valve; 37c, third switch valve; 37d, fourth switch valve; 38, exhaust pipe; 39, cabinet door; 40, cabinet body; 41, first branch; 42, second branch; 43, third branch; 44, fourth branch; 4501, air supply interface; 4502, exhaust interface; 46, first page; 4601, locking hole; 4602, slide groove; 4603, unlocking groove; 47, second page; 48, locking plate; 4801, pin hole; 4802, arc portion; 49, latch spring; 50, latch; 51, limit slider; 5101, stop portion; 5102, sliding portion; 5103, blind hole; 52, spring; 53, handle; 54, gas spring; 55, handle; 56, blind plate; 57, rotating shaft; 58, light bulb; 5801, plug; 59, water-cooled lampshade; 60, seat plate; 6001, wire hole; 61, neutral copper bar; 62, live copper bar; 63, socket; 64, outer cover; 6401, main body; 6402, inspection window cover; 65, connector plug; 66, water pipe; 67, through hole; 68, valve port; 69, valve plate; 6901, sealing ring groove; 6902, valve plate body; 6903, transmission plate; 6904, positioning protrusion; 6905, positioning groove; 70, driving device; 7001, first cylinder; 7002, second cylinder; 7003, cylinder seat; 7004, shell; 7005, magnetic switch; 7006, air pipe joint; 7007, electrical connector; 7008, housing; 7009, cover plate; 71, sealing ring; 72, positioning sinker; 73, sinker; 74, cylindrical pin; 75, substrate; 76, vertical guide rail; 77, vertical slider; 78, linear module; 79, rodless cylinder; 80, support frame; 81, rod cylinder; 82, clamping part; 83, wafer buffer box; 8401, mounting support; 8402, drive motor; 8403, buffer box lifting screw; 8404, buffer box Z-direction slide rail; 8405, buffer box Z-direction slider; 8406, connecting shaft clamping block; 8407, buffer box screw nut; 8408, buffer box screw nut seat; 85, lifting ejector pin; 86, connecting shaft; 87, lifting ejector pin fixing shaft;

[0091] A. Wafer box lifting device; B. Wafer box; C. Load lock chamber; C1. Load lock chamber body; D. Wafer buffer structure; E. Wafer handling robot; F. Reaction chamber; F1. Chamber body; F2. Upper cover; G1. First process gas source; G2. Second process gas source; G3. Third process gas source; G4. First purge gas source; G5. Second purge gas source; G6. Fourth process gas source; H. Vacuum pumping system; I. Interface; J. Existing cavity; K. Valve plate of existing valve structure; L. Connecting rod mechanism; M. Gas cabinet; N. Cabinet; O. Frame. DETAILED DESCRIPTION

[0092] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0093] Example 1

[0094] This embodiment provides a wafer vapor deposition device, such as Figures 1 to 5 As shown, including:

[0095] Wafer box lifting device A, the wafer box lifting device A is used to lift the wafer box B, the wafer box lifting device A can clamp the wafer box B, and drive the wafer box B to rise and fall in the vertical direction to cooperate with the action of the wafer fork 1, so that the wafer fork 1 can pick up and place the wafer;

[0096] A load lock chamber C, wherein the load lock chamber C is disposed between the reaction chamber F and the wafer box lifting device A, and a wafer buffer structure D and a wafer handling robot E are disposed in the load lock chamber C;

[0097] The wafer buffer structure D is used to store wafers that have not been deposited with thin films and are transferred from the wafer box B to the reaction chamber F, or to store wafers that have been deposited with thin films and are transferred from the reaction chamber F to the wafer box B;

[0098] The wafer handling robot E is used to transfer wafers between the wafer box B, the wafer buffer structure D and the reaction chamber F;

[0099] A plurality of reaction chambers F, wherein the reaction chambers F are used to perform thin film deposition on wafers;

[0100] When it is necessary to transfer the wafers without thin film deposition in the wafer box B to the reaction chamber F for thin film deposition:

[0101] The load lock chamber C is opened, and the wafer handling robot E transfers the wafers in the wafer box B to the wafer buffer structure D for storage. When the number of wafers stored in the wafer buffer structure D reaches the number required by the process (in this embodiment, the upper limit of the number of wafers stored in the wafer buffer structure D is 15, and the number required by the process is not greater than the upper limit of the number of wafers stored), the load lock chamber C is closed, the load lock chamber C is evacuated, and the reaction chamber F is opened (that is, the slit valve provided on the reaction chamber F is opened, and the slit valve is a prior art and will not be described in detail), the wafer handling robot E transfers the wafers in the wafer buffer structure D to the reaction chamber F, and the reaction chamber F is closed for thin film deposition;

[0102] When it is necessary to transfer the wafers that have completed thin film deposition in the reaction chamber F to the wafer box B:

[0103] The reaction chamber F is opened, and the wafer handling robot E transfers the wafers on which thin film deposition has been completed in the reaction chamber F to the wafer cache structure D. When the number of wafers stored in the wafer cache structure D reaches the number required by the process, the reaction chamber F is closed, and the load lock chamber C is opened. The wafer handling robot E transfers the wafers stored in the wafer cache structure D to the wafer box B. After the transfer is completed, the load lock chamber C is closed.

[0104] A wafer vapor deposition device provided in this embodiment provides a wafer cache structure D in the load lock chamber C, thereby adding an area in the load lock chamber C that can store wafers in batches. The wafers to be transferred are concentrated in the wafer cache structure D for cache, and then transferred in a centralized manner through a wafer transfer device, thereby significantly reducing the opening and closing frequency of the load lock chamber C, avoiding frequent switching between atmospheric pressure and vacuum pressure, improving production efficiency, and effectively alleviating the operating pressure of the vacuum pumping system.

[0105] In a specific embodiment, Figure 24 to Figure 26 As shown, the wafer cache structure D includes: a wafer cache box 83 and a wafer cache box lifting device, the wafer cache box 83 is provided with a plurality of storage positions for storing wafers along the vertical direction, and the wafer cache box lifting device is used to lift the wafer cache box 83;

[0106] The wafer cache box lifting device includes a mounting support 8401, a drive motor 8402, a cache box lifting screw 8403, a cache box Z-direction slide rail 8404, a cache box Z-direction slider 8405, a connecting shaft clamping block 8406 and a cache box screw nut seat 8408. The mounting support 8401 is fixed on the load lock chamber body C1, and the connecting shaft clamping block 8406 is fixed on the cache box screw nut seat 8408 by bolts. The connecting shaft clamping block 8406 is used to clamp and fix the connecting shaft 86 fixed on the wafer cache box 83 on the cache box screw nut seat 8408. In this embodiment, the mounting support 8401 is provided with an axial hole matching the connecting shaft 86, and the connecting shaft 86 can slide along the axial hole;

[0107] The cache box lifting screw 8403 is rotatably arranged on the mounting support 8401 through a bearing, and the drive motor 8402 is fixed on the mounting support 8401. The drive motor 8402 can drive the cache box lifting screw 8403 to rotate. In this embodiment, the drive motor 8402 drives the cache box lifting screw 8403 to rotate through a belt transmission, and the cache box Z-direction slide rail 8404 is arranged on the mounting support 8401, and the cache box Z-direction slider 8405 is installed on the cache box Z-direction slide rail 8404. The cache box screw nut seat 8408 is fixedly connected to the cache box Z-direction slider 8405, and a cache box screw nut 8407 is provided on the cache box screw nut seat 8408, and the cache box screw nut 8407 is installed on the cache box lifting screw 8403;

[0108] The wafer buffer structure D is lifted and lowered in the vertical direction to lift the wafer on the wafer fork 1 or put down the wafer on the storage position, so that the wafer can be placed from the wafer fork 1 to the wafer buffer structure D or from the wafer buffer structure D to the wafer fork 1.

[0109] The wafer handling robot E carries the wafer by means of the wafer fork 1. After the wafer buffer structure D is added, the distance between the wafer box B and the wafer handling robot E increases accordingly. In order to ensure that the wafer handling robot E can smoothly carry out the wafer handling work, the travel range of the wafer handling robot E can be expanded or the length of the wafer fork 1 can be increased. Accordingly, more space is required to avoid mechanical interference, resulting in an increase in the overall size of the chemical vapor deposition equipment, which is not conducive to the control of the cleanliness of the equipment. At the same time, since the overall space of the clean room where the chemical vapor deposition equipment is stored is limited, the larger the size of the chemical vapor deposition equipment, the fewer chemical vapor deposition equipment can be stored in a unit space.

[0110] To overcome the above problems, in a specific embodiment, Figure 6 As shown, the wafer handling robot E comprises: a wafer picking fork 1, a swing arm 2, a turntable 3, a base flange 4, a telescopic driving device 5 and a rotating driving device 6;

[0111] The base flange 4 is fixed on the load lock chamber body C1 of the load lock chamber C, the turntable 3 is rotatably arranged on the base flange 4, the swing arm 2 is installed on the turntable 3, the rotation drive device 6 can drive the turntable 3 to rotate, and the telescopic drive device 5 can drive the swing arm 2 to move, so that the swing arm 2 drives the slice taking fork 1 to extend (such as Fig.19a as shown) or contraction (as Fig.19b shown);

[0112] In this embodiment, if Fig. 9 As shown, the wafer taking fork 1 includes a first clamping portion 101, a second clamping portion 102 and a main body 103, wherein the first clamping portion 101 and the second clamping portion 102 are arranged on the top of the main body 103, and the first clamping portion 101 and the second clamping portion 102 are arranged opposite to each other, and the first clamping portion 101, the second clamping portion 102 and the main body 103 form a clamping slot for placing a wafer, and the wafer taking fork 1 can receive the wafer in the wafer buffer structure D through the clamping slot;

[0113] A vacuum suction cup 104 is provided at one end of the wafer taking fork 1 away from the swing arm part 2 , and a vacuum air passage connected to the vacuum suction cup 104 is provided inside the wafer taking fork 1 . The wafer taking fork 1 can absorb the wafer in the wafer box B through the vacuum suction cup 104 .

[0114] The present embodiment provides a wafer vapor deposition device, wherein the rotating disk 3 is driven to rotate by the rotating driving device 6 of the wafer handling robot E, and the swing arm 2 is driven to move by the telescopic driving device 5, thereby driving the slice picking fork 1 to extend and retract, thereby realizing the movement of the slice picking fork 1; a vacuum suction cup 104 is arranged at one end of the slice picking fork 1 away from the swing arm 2, such as Fig.20b As shown, the wafer 30 is carried by the fork 1 through the vacuum suction cup 104, and the wafer 30 is vacuum-adsorbed by the vacuum suction cup 104, so that the front end of the fork 1 only needs to contact a part of the wafer to drive the wafer to be transferred from the wafer box B to the wafer buffer structure D. The fork 1 is provided with a slot for placing the wafer, as shown in FIG. Fig.20a As shown, the wafer retrieval fork 1 transports the wafer 30 through the card slot, so that the wafer can be transferred from the wafer buffer structure D to the reaction chamber F. The wafer transfer is achieved without expanding the travel range of the wafer transport robot E and increasing the length of the wafer retrieval fork 1, thereby avoiding an increase in the overall size of the equipment.

[0115] When it is necessary to transfer the wafers without thin film deposition in the wafer box B to the reaction chamber F for thin film deposition:

[0116] The load lock chamber C is opened, and the wafer box lifting device A lifts the wafer box B so that the wafer to be transferred is aligned with the wafer fork 1, and the wafer fork 1 extends into the wafer box B, and the wafer in the wafer box B is sucked by the vacuum suction cup 104;

[0117] The wafer taking fork 1 transfers the adsorbed wafer to the wafer buffer structure D, the wafer buffer structure D rises and falls, so that the wafer to be transferred is aligned with the wafer taking fork 1, the wafer taking fork 1 extends into the wafer buffer structure D, and the wafer buffer structure D rises and falls, so that the wafer falls into the card slot of the wafer taking fork 1;

[0118] When the number of wafers stored in the wafer buffer structure D reaches the number required by the process, the load lock chamber C is closed, the load lock chamber C is evacuated, the reaction chamber F is opened, the wafer fork 1 transfers the wafer to the reaction chamber F, the lifting pin of the reaction chamber F rises, and after the wafer on the wafer fork 1 is lifted, the wafer fork 1 leaves the reaction chamber F, the reaction chamber F is closed, the lifting pin descends, so that the wafer falls on the wafer stage, the wafer stage rises to the position where the wafer is subjected to thin film deposition, and process gas is introduced into the reaction chamber F for thin film deposition;

[0119] When it is necessary to transfer the wafers that have completed thin film deposition in the reaction chamber F to the wafer box B:

[0120] The wafer stage descends, the lifting pin ascends, and the wafer on which the thin film deposition has been completed is lifted from the wafer stage, the reaction chamber F is opened, the wafer taking fork 1 enters the reaction chamber F, and the lifting pin descends, so that the wafer falls into the card slot of the wafer taking fork 1;

[0121] The wafer fork 1 transfers the wafer to the wafer buffer structure D, and the wafer buffer structure D is raised and lowered so that the wafer on the wafer fork 1 is aligned with the storage position in the wafer buffer structure D (such as Fig.23 As shown, the storage position is a groove on the wafer buffer box 83, the wafer taking fork 1 extends into the wafer buffer structure D, and the wafer buffer structure D descends, so that the wafer falls into the storage position in the wafer buffer structure D;

[0122] When the number of wafers stored in the wafer buffer structure D reaches the number required by the process, the reaction chamber F is closed, the load lock chamber C is opened, the wafer fork 1 is inserted into the wafer buffer structure D, the wafer buffer structure D rises, and the wafer falls on the wafer fork 1. The wafer fork 1 absorbs the wafer in the wafer box B through the vacuum suction cup 104. The wafer box lifting device A lifts the wafer box B to align the wafer on the wafer fork 1 with the storage position in the wafer box B (the storage position is the groove on the wafer box B). The wafer fork 1 is inserted into the wafer box B to store the wafer in the storage position of the wafer box B. After the wafer transfer is completed, the load lock chamber C is closed.

[0123] In a specific embodiment, it also includes a frame O, a vacuum gate valve and a gas cabinet M. The wafer box lifting device A, the load lock chamber C and the reaction chamber F are arranged in the frame O. A cabinet N is fixedly arranged on the periphery of the frame O. The cabinet N is used to accommodate control components. The control components include but are not limited to components that need to be frequently repaired, such as a wire adapter box and a sensor adapter box. By setting up the cabinet N, the components that need to be frequently repaired are placed therein, which is convenient for installation and maintenance, and at the same time, installation space can be reserved for subsequent addition of components.

[0124] The gas cabinet M is fixed on the frame O, and the gas cabinet M is used to control the process gas input into the reaction chamber F. The vacuum gate valve is arranged on the load lock chamber C, and the vacuum gate valve is located on a side of the load lock chamber C close to the wafer box lifting device A;

[0125] In actual use, the wafer box lifting device A lifts the wafer box B to cooperate with the wafer fork 1 to pick up and place the wafer, open the vacuum gate valve on the load lock chamber C, and the wafer fork 1 of the wafer handling robot E extends from the load lock chamber C to vacuum absorb the wafer in the wafer box B. The wafer fork 1 drives the wafer to be cached in the wafer buffer structure D, and then the wafer in the wafer buffer structure D is transferred to the reaction chamber F by the wafer fork 1. The wafer is supported by the wafer carrier 29 in the reaction chamber F, and the process gas is introduced into the reaction chamber F. The heating equipment installed on the reaction chamber F provides the temperature required for coating (thin film deposition), and the wafer is coated. The coated wafer is reversely transferred from the reaction chamber F to the wafer box B.

[0126] In a specific embodiment, the wafer handling robot further includes a multi-axis magnetic fluid sealing transmission device 7, such as Figure 7 and Figure 8As shown, the multi-axis magnetic fluid sealed transmission device 7 includes a hollow shaft 701, an intermediate shaft 702 and a base shaft 703 which are coaxially arranged from the inside to the outside. The multi-axis magnetic fluid sealed transmission device is a finished component, which is easy to install and has a simple structure, which is beneficial to the overall structural layout of the manipulator. The multi-axis magnetic fluid sealed transmission device achieves sealing through magnetic fluid, has better sealing performance during operation, longer service life, and is suitable for vacuum environments;

[0127] The hollow shaft 701 and the intermediate shaft 702 are rotatably connected via a bearing, the intermediate shaft 702 and the base shaft 703 are rotatably connected via a bearing, the base shaft 703 is fixed to the base flange 4 via bolts, and the base flange 4 is fixed to the cavity of the load lock chamber C via bolts;

[0128] The two ends of the intermediate shaft 702 are connected to the turntable 3 and the rotation driving device 6 respectively. The rotation driving device 6 can rotate the turntable 3 by driving the intermediate shaft 702. The turntable 3 is fixedly connected to the intermediate shaft 702.

[0129] The two ends of the hollow shaft 701 are connected to the swing arm 2 and the telescopic driving device 5 respectively. The telescopic driving device 5 can drive the hollow shaft 701 to rotate to make the swing arm 2 move. The hollow shaft 701 is connected to the vacuum air passage in the slice taking fork 1 through a gas hose.

[0130] In this embodiment, a vacuum connector 10 is provided at one end of the hollow shaft 701 away from the wafer taking fork 1, and the vacuum pumping system is connected to the hollow shaft 701 via the vacuum connector 10, and the hollow shaft 701 is connected to the vacuum air passage in the wafer taking fork 1 via a gas hose, so that the vacuum pumping system can act on the vacuum suction cup 104, so that the vacuum suction cup 104 can vacuum absorb the wafer.

[0131] In a specific embodiment, Figures 9 to 11 As shown, the swing arm portion 2 includes a lower first swing arm 201, an upper second swing arm 202, a lower second swing arm 203, an upper first swing arm 204 and a linkage portion, wherein the upper second swing arm 202 and the upper first swing arm 204 are located above the lower first swing arm 201 and the lower second swing arm 203;

[0132] One end of the lower first swing arm 201 is fixedly connected to the hollow shaft 701, and the other end of the lower first swing arm 201 is connected to the upper second swing arm 202 through a linkage portion. The lower first swing arm 201 drives the upper second swing arm 202 to swing through the linkage portion, and one end of the upper second swing arm 202 away from the linkage portion is hinged to the slice taking fork 1;

[0133] One end of the lower second swing arm 203 is rotatably connected to the turntable 3, and the other end of the lower second swing arm 203 is rotatably connected to the upper second swing arm 202 via a second rotating shaft 208 and a bearing sleeved on the second rotating shaft 208, and the second rotating shaft 208 is fixed on the upper second swing arm 202;

[0134] One end of the upper first swing arm 204 is rotatably connected to the end of the lower first swing arm 201 away from the hollow shaft 701 through the first rotating shaft 207 and a bearing sleeved on the first rotating shaft 207. The first rotating shaft 207 is fixed on the upper first swing arm 204. The other end of the upper first swing arm 204 is hinged to the slice taking fork 1.

[0135] In this embodiment, the linkage part includes a driving gear 205, a driven gear 206, a gear upper cover 209 and a gear lower cover 210. In this embodiment, the driving gear 205 and the driven gear 206 are both shift gears, and the transmission process is more stable and the transmission accuracy is higher. The swing arm part 2 will not shake during the transmission process due to the meshing clearance problem.

[0136] The gear upper cover 209 is rotatably connected to the first rotating shaft 207 and the second rotating shaft 208 through two bearings respectively, and the gear lower cover 210 is connected to the gear upper cover 209 through bolts. The gear lower cover 210 and the gear upper cover 209 enclose a cavity for accommodating the driving gear 205 and the driven gear 206;

[0137] The driving gear 205 is fixedly mounted on one end of the lower first swing arm 201 away from the hollow shaft 701, and the driven gear 206 is fixedly mounted on one end of the upper second swing arm 202 away from the slice taking fork 1, and the driven gear 206 is meshed with the driving gear 205;

[0138] The gear lower cover 210 and the gear upper cover 209 can prevent the driving gear 205 and the driven gear 206 from being exposed, and play a protective role. At the same time, the gear lower cover 210 and the gear upper cover 209 can ensure that the center distance between the first rotating shaft 207 and the second rotating shaft 208 remains unchanged, so that the driving gear 205 and the driven gear are always meshed, ensuring the normal operation of the swing arm part 2;

[0139] When the slice fork 1 needs to be extended and retracted, the hollow shaft 701 rotates, driving the lower first swing arm 201 to swing, and the upper second swing arm 202 is driven to swing by the driven gear 206 meshing with the driving gear 205, and the upper first swing arm 204 and the lower second swing arm 203 follow the lower first swing arm 201 and the upper second swing arm 202 to move. Fig.19a and Fig.19b As shown, the swing is converted into the telescopic action of the slice taking fork 1, and the upper first swing arm 204 and the lower second swing arm 203 also play a role in ensuring that the slice taking fork 1 can move stably.

[0140] In a specific embodiment, Figure 7 and Figure 8 As shown, the rotation drive device 6 includes a first motor 601, a first mounting frame 602, a first transmission shaft 603 and a first wire rope wheel 604. The first transmission shaft 603 and the first wire rope wheel 604 are connected by a wire rope transmission. In this embodiment, Fig.21a and Figure 21b As shown, two steel ropes 11 are wound around the first transmission shaft 603 and the first steel rope wheel 604 at the same time, and both ends of each steel rope 11 are fixed to the first transmission shaft 603 and the first steel rope wheel 604 respectively;

[0141] The first mounting frame 602 is fixedly connected to the base shaft 703 by bolts, the first transmission shaft 603 is rotatably set on the first mounting frame 602, the first wire rope pulley 604 is fixed to the intermediate shaft 702 by bolts, and the first motor 601 can drive the first transmission shaft 603 to rotate, and then drive the first wire rope pulley 604 to rotate through the wire rope wound around the first transmission shaft 603.

[0142] In a specific embodiment, Figure 7 and Figure 8 As shown, the telescopic drive device 5 includes a second motor 501, a second mounting frame 502, a second transmission shaft 503 and a second wire rope wheel 504, and the second transmission shaft 503 and the second wire rope wheel 504 are connected by a wire rope 11. In this embodiment, the arrangement of the wire rope 11 on the telescopic drive device 5 is similar to that of the rotary drive device 6. The two wire ropes 11 are simultaneously wound around the second transmission shaft 503 and the second wire rope wheel 504, and the two ends of each wire rope 11 are respectively fixed to the second transmission shaft 503 and the second wire rope wheel 504;

[0143] The second mounting frame 502 is fixedly connected to the first wire rope pulley 604 and will rotate with the first wire rope pulley 604. Therefore, in actual production, it is necessary to ensure that the highest point of the telescopic drive device 5 is lower than the lowest point of the rotating drive device 6 to avoid interference. The second transmission shaft 503 is rotatably set on the second mounting frame 502, and the second wire rope pulley 504 is sleeved and fixed on the hollow shaft 701. The second motor 501 can drive the second transmission shaft 503 to rotate.

[0144] Traditional belt transmission has elasticity of the synchronous belt material, which leads to elastic slip during the transmission process, which makes it impossible to guarantee the accuracy of the transmission ratio and the transmission efficiency is relatively low. In contrast, the telescopic drive device 5 and the rotary drive device 6 use steel wire rope as the transmission medium, and the transmission structure is simpler. Compared with the belt drive, the overall size is smaller, the transmission accuracy is high, the noise is low, the transmission is smooth, and the thermal deformation of the steel wire rope is much smaller than that of the synchronous belt, which is more suitable for the high temperature environment inside the chemical vapor deposition equipment.

[0145] In a specific embodiment, Figure 6 As shown, a waist-shaped hole 12 is provided on the first mounting frame 602 of the rotary drive device 6, and the first mounting frame 602 is fixedly connected to the base shaft 703 by bolts passing through the waist-shaped hole 12, and the center distance between the first transmission shaft 603 and the first wire rope wheel 604 is adjusted through the waist-shaped hole 12 to ensure that the wire rope 11 of the rotary drive device 6 is tensioned;

[0146] The second mounting frame 502 of the telescopic drive device 5 is also provided with a waist-shaped hole 12. The second mounting frame 502 is fixedly connected to the first wire rope pulley 604 by bolts passing through the waist-shaped hole 12. The center distance between the second transmission shaft 503 and the second wire rope pulley 504 is adjusted through the waist-shaped hole 12 to ensure that the wire rope 11 of the telescopic drive device 5 is tensioned.

[0147] In a specific embodiment, a first driving pulley is provided on the output shaft of the first motor 601. Figure 8 As shown, the first transmission shaft 603 is provided with a first driven pulley 605, the first driving pulley and the first driven pulley 605 are connected through a synchronous belt transmission, and the output shaft of the second motor 501 is provided with a second driving pulley, as shown in FIG. Figure 7 and Figure 8 As shown, a second driven pulley 505 is provided on the second transmission shaft 503, and the second driving pulley and the second driven pulley 505 are connected through a synchronous belt transmission;

[0148] The diameter of the first driving pulley is smaller than that of the first driven pulley 605 , and the diameter of the second driving pulley is smaller than that of the second driven pulley 505 , so as to adjust the transmission ratio through belt transmission.

[0149] In practical applications, vapor deposition equipment also involves the following issues, such as Fig.23 As shown, when the wafer 30 is stored in the wafer buffer structure D, the gap between two adjacent layers of wafers is relatively narrow. If the horizontality deviation of the wafer fork is large, the wafer fork may scratch the wafer during the wafer taking and placing operations, causing scratches on the wafer surface, making the uncoated wafer unusable and the coated wafer become waste. In addition, a large horizontality deviation will also have an adverse effect on the stability of the wafer transfer process.

[0150] The wafer handling robot of traditional chemical vapor deposition equipment does not have the function of adjusting the wafer fork in the vertical direction. Therefore, after assembly is completed, the position of the wafer fork in the vertical direction cannot be adjusted. The relative position of the wafer fork is completely dependent on the previous processing accuracy and assembly accuracy. Once problems occur during the processing or assembly process, the wafer handling robot cannot meet the use requirements of the wafer fork through fine-tuning.

[0151] In order to overcome the above problems, a horizontal adjustment mechanism is provided on the wafer handling robot E of the present application to achieve horizontal adjustment of the wafer picking fork 1, so that the wafer handling robot E can meet the use requirements of the wafer picking fork 1 through fine adjustment.

[0152] In a specific embodiment, the level adjustment mechanism includes: Fig. 9 The swing arm adjustment mechanism 8 shown in FIG. Fig.12 and Fig.13 As shown, the swing arm adjustment mechanism 8 includes an adjustment support 801, a hollow adjustment member 802, a hollow tensioning shaft 803, a locking bolt 804 and a tensioning block 805;

[0153] The adjustment support 801 is fixed to the top of the turntable 3 by bolts, the adjustment support 801 is provided with a threaded hole, and the hollow adjustment member 802 is provided with an external thread corresponding to the threaded hole;

[0154] By screwing the hollow adjustment member 802, the hollow adjustment member 802 can be vertically displaced relative to the adjustment support 801;

[0155] The hollow tensioning shaft 803 is sleeved with a bearing fixed on the lower second swing arm 203, and one end of the hollow tensioning shaft 803 is detachably connected to the hollow adjusting piece 802 through a thread. After the bearing fixed on the lower second swing arm 203 is sleeved on the hollow tensioning shaft 803, the hollow tensioning shaft 803 and the hollow adjusting piece 802 are tightened and fixed for easy installation. Fig.14 As shown, a tensioning portion 806 is provided at the other end of the hollow tensioning shaft 803, and the tensioning portion 806 is provided with a step surface 809, which can limit the bearing installed on the hollow tensioning shaft 803. The tensioning portion 806 is provided with a plurality of tensioning strips 807 evenly distributed around the circumference, and the tensioning strips 807 can be inserted into the connecting sleeve 301 provided on the turntable 3. In actual application, a milling plane 810 is processed on the outer side of the tensioning strip 807 to facilitate the installer to screw the hollow tensioning shaft 803 with a wrench;

[0156] In this embodiment, the thread between the hollow tensioning shaft 803 and the hollow adjusting member 802 adopts a reverse thread with a rotation direction opposite to that between the adjusting support 801 and the hollow adjusting member 802, so as to prevent the hollow tensioning shaft 803 and the hollow adjusting member 802 from being separated from each other when the hollow adjusting member 802 is screwed;

[0157] The locking bolt 804 passes through the central holes of the hollow adjustment member 802 and the hollow tensioning shaft 803 and is threadedly connected with the tensioning block 805;

[0158] In this embodiment, if Fig.13 and Fig. 22 As shown, the tension block 805 is in the shape of a truncated cone, the axial section of the truncated cone is an isosceles trapezoid, the angle range of the lower base angle of the isosceles trapezoid is 75-83 degrees, and the truncated cone within this angle range can more smoothly open the tension strip 807, the tension strip 807 is made of elastic metal material, and the tension strip 807 is provided with a conical surface matching the side of the truncated cone on one side close to the tension block 805;

[0159] In practical applications, it also includes an internal threaded tube 811, which is integrally formed with the tension block 805, extending the contact length between the tension block 805 and the locking bolt 804, so as to improve the reliability of the connection between the locking bolt 804 and the tension block 805 by arranging the internal threaded tube 811 on the tension block 805;

[0160] The locking bolt 804 is screwed, and the locking bolt 804 can drive the tension block 805 to vertically displace relative to the tension part 806. When the tension block 805 moves toward the tension part 806, the plurality of tension strips 807 are squeezed by the tension part 806 and gradually open, so that the tension strips 807 and the connecting sleeve 301 are locked. When the tension block 805 moves in a direction away from the tension part 806, the plurality of tension strips 807 are not squeezed by the tension part 806 and gradually return to their original positions and close, so that the tension strips 807 and the connecting sleeve 301 are unlocked.

[0161] Also includes a first tensioning bolt, such as Fig.15 As shown, the first lower swing arm 201 is provided with a first open ring 211 at one end close to the hollow shaft 701, the hollow shaft 701 is located in the center hole of the first open ring 211, and the two free ends of the first open ring 211 are respectively provided with a threaded hole and a countersunk hole, and the first tensioning bolt passes through the countersunk hole and is threadedly connected with the threaded hole;

[0162] In this embodiment, Fig.15 The left free end of the first open ring 211 is provided with a countersunk hole, through which the head of the first tightening bolt is accommodated. The first tightening bolt is inserted from the countersunk hole on the left free end and comes out from the threaded hole on the right free end. Tightening the first tightening bolt can bring the two free ends closer to each other, so that the first open ring 211 is deformed and contracted to hold the hollow shaft 701 tightly.

[0163] Also includes a second tension bolt, such as Fig.16As shown, the end of the upper first swing arm 204 close to the first rotating shaft 207 is provided with a second open ring 212, the first rotating shaft 207 is located in the center hole of the second open ring 212, and the two free ends of the second open ring 212 are respectively provided with a threaded hole and a countersunk hole, and the second tension bolt passes through the countersunk hole and is threadedly connected with the threaded hole;

[0164] In this embodiment, Fig.16 The second open ring 212 shown is provided with a countersunk hole on the right free end, through which the head of the second tightening bolt is accommodated. The second tightening bolt is inserted from the countersunk hole on the right free end and comes out from the threaded hole on the left free end. Tightening the second tightening bolt can bring the two free ends closer to each other, so that the second open ring 212 is deformed and contracted to hold the first rotating shaft 207 tightly.

[0165] In this embodiment, since the second open ring 212 is relatively thick and not easily deformed, the second open ring 212 is provided with a Fig.16 The deformation groove 213 shown makes the second open ring 212 more easily deformed, and the pulling force required for the two free ends of the second open ring 212 to move closer to each other is smaller.

[0166] When the horizontality deviation of the wafer picking fork 1 is large, the wafer picking fork 1 may scratch the wafer during wafer picking and placing operations. At the same time, during the wafer transfer process, the wafer picking fork 1 will pass through the valve port of the vacuum gate valve of the load lock chamber C, and the position of the valve port is fixed. If the position of the wafer picking fork 1 deviates in the vertical direction, it is easy to interfere with the valve port, causing the wafer picking fork 1 to collide. Therefore, to ensure the normal use of the wafer picking fork 1, after the swing arm part 2 is installed on the turntable 3, the horizontality of the swing arm part 2 and the height of the swing arm part 2 relative to the turntable 3 need to be fine-tuned to ensure the horizontality and height of the wafer picking fork 1.

[0167] When fine adjustment is required, the locking bolt 804 can be loosened so that the tension block 805 no longer stretches the tension strip 807. At this time, the tension strip 807 no longer locks the connecting sleeve 301, and the two are separated from each other. The vertical displacement of the hollow tension shaft 803 is no longer constrained by the connecting sleeve 301. At this time, the hollow adjustment member 802 is screwed, and the hollow adjustment member 802 drives the hollow tension shaft 803 to move vertically, thereby driving the lower second swing arm 203 to move vertically relative to the turntable 3. After adjusting the rear position, the locking bolt 804 is tightened, and the tension block 805 stretches the tension strip 807, and the tension strip 807 is close to the connecting sleeve 301, so that the connecting sleeve 301 and the hollow tension shaft 803 are locked;

[0168] Loosen the first tightening bolt to separate the two free ends of the first open ring 211 from each other, so that the first open ring 211 no longer holds the hollow shaft 701 tightly. At this time, the position of the lower first swing arm 201 relative to the hollow shaft 701 can be adjusted vertically. After the position is adjusted, tighten the first tightening bolt again to make the first open ring 211 hold the hollow shaft 701 tightly again.

[0169] Loosen the second tightening bolt to separate the two free ends of the second open ring 212 from each other, and the second open ring 212 no longer holds the first rotating shaft 207. At this time, the position of the upper first swing arm 204 relative to the first rotating shaft 207 can be adjusted vertically. After adjusting the rear position, re-tighten the second tightening bolt to make the second open ring 212 hold the first rotating shaft 207 again.

[0170] In a specific embodiment, Fig.13 As shown, it also includes a spring 808, one end of the spring 808 is connected to the tensioning portion 806, and the other end of the spring 808 is connected to the tensioning block 805;

[0171] By loosening the locking bolt 804, the spring 808 can release its elastic force to separate the tension block 805 from the tension strip 807, thereby preventing the tension block 805 and the tension strip 807 from being stuck together due to friction, making it impossible for the connecting sleeve 301 and the hollow tension shaft 803 to be separated.

[0172] In a specific embodiment, Figure 6 and Figure 7 As shown, it also includes a pipeline fixing bracket 9. In this embodiment, the pipeline fixing bracket 9 is fixed to the linkage part above the turntable 3 by bolts. The pipeline fixing bracket 9 is used to fix the gas hose connected between the slice taking fork 1 and the hollow shaft 701. The position of the gas hose is constrained by the pipeline fixing bracket 9 to prevent the gas hose from interfering with the movement of the swing arm part 2.

[0173] In this embodiment, if Fig.17 As shown, the pipeline fixing bracket 9 includes a bracket body 901 and a pressing plate 902. Fig.18 As shown, the bracket body 901 is provided with a groove for placing the gas hose, and the pressing plate 902 is fixed to the bracket body 901 by bolts, and the gas hose is pressed tightly in the groove by the pressing plate 902.

[0174] In a specific embodiment, a plurality of vacuum suction cups 104 are evenly distributed on one end of the wafer taking fork 1 away from the swing arm portion 2 , and the plurality of vacuum suction cups 104 can better absorb the wafer 30 .

[0175] Example 2

[0176] This embodiment provides a wafer vapor deposition device. The main structure of this embodiment is similar to that of Embodiment 1. The differences between this embodiment and Embodiment 1 are as follows:

[0177] In order to reasonably utilize the space, reduce the volume of the vapor deposition device, and reduce the difficulty of cleanliness control, in this embodiment, the wafer stage 29 in the reaction chamber F adopts a cantilever design (one end of the wafer stage 29 is fixed to the fixed shaft 291). This design easily causes the table surface of the wafer stage 29 to be uneven, which may cause the risk of wafer displacement during loading, and then cause the failure of the loading operation. In addition, it may also cause adverse conditions such as wafer sliding, which has a significant negative impact on the precision control of thin film deposition.

[0178] To ensure that wafer manufacturing can achieve a high pass rate, it is necessary to ensure that the wafer stage is in a horizontal state. However, the traditional lifting structure is mainly used to achieve the displacement adjustment of the wafer stage in the three directions of XYZ, which is difficult to meet the needs of adjusting the horizontality of the wafer stage.

[0179] Therefore, in this embodiment, the cavity F1 of the reaction chamber F is provided with a wafer lifting mechanism, such as Fig. 27 , Fig.28 , Fig.31 and Fig.34 As shown, the wafer lifting mechanism includes: a cavity connecting plate 13, a first adjustment plate 14, a second adjustment plate 15, a leveling mechanism and a lifting mechanism 16. In this embodiment, the cavity connecting plate 13 is fixed to the cavity of the reaction chamber by bolts;

[0180] The first adjustment plate 14 is slidably disposed on the cavity connecting plate 13 along the Y direction, and the second adjustment plate 15 is slidably disposed on the first adjustment plate 14 along the X direction;

[0181] The lifting mechanism 16 can drive the wafer stage 29 to move along the Z direction. The lifting mechanism 16 is installed on the second adjustment plate 15 through a leveling mechanism. The leveling mechanism can adjust the angle between the travel direction of the lifting mechanism 16 and the plane where the second adjustment plate 15 is located.

[0182] The wafer vapor deposition device provided in this embodiment realizes the Z-direction displacement of the wafer stage 29 by lifting and lowering the lifting mechanism 16. In this embodiment, the Z-direction is the vertical direction. The Y-direction and X-direction displacements of the lifting mechanism 16 are realized by slidingly setting the first adjustment plate 14 on the chamber connecting plate 13 and the second adjustment plate 15 on the first adjustment plate 14, thereby realizing the Y-direction and X-direction displacements of the wafer stage 29.

[0183] The angle between the travel direction of the lifting mechanism 16 and the second adjustment plate 15 is adjusted by the leveling mechanism, so as to adjust the horizontality of the wafer stage 29. While ensuring the horizontal state of the wafer stage 29, the displacement of the wafer stage 29 in three directions of XYZ is realized. The leveling function is integrated with the displacement function, with high space utilization, thereby reducing the volume of the vapor deposition device.

[0184] In a specific embodiment, the leveling mechanism includes three groups of leveling modules distributed in a triangle, such as Fig.28 and Fig.35 As shown, each set of the leveling modules includes a connecting bolt 1701, a leveling top screw 1702 and a leveling locking nut 1703;

[0185] The lifting mechanism 16 includes a support 1601, the leveling screw 1702 is threadedly connected to the support 1601, and a through hole is opened on the support 1601 to allow the connecting bolt 1701 to pass through. After passing through the through hole, the connecting bolt 1701 is threadedly connected to the second adjustment plate 15;

[0186] The leveling screw 1702 abuts against the second adjustment plate 15 , and the leveling screw 1702 is screwed to adjust the length of the leveling screw 1702 protruding from the top surface of the support 1601 , so that the support 1601 is away from or close to the second adjustment plate 15 ;

[0187] The leveling locking nut 1703 is arranged on a side of the support 1601 away from the second adjustment plate 15 , and the leveling locking nut 1703 is arranged on the leveling top screw 1702 ;

[0188] By respectively screwing three leveling screws 1702 that can abut against the bottom surface of the second adjustment plate 15, the plane is determined by three points, so that the angle between the bottom surface of the second adjustment plate 15 and the top surface of the support 1601 can be changed, so that the travel direction of the lifting mechanism 16 and the angle between the second adjustment plate 15 are changed, so as to adjust the horizontality of the wafer stage 29 connected to the lifting mechanism 16 through the three sets of leveling modules distributed in a triangle;

[0189] In actual use, the connecting bolt 1701 can be loosened first to create a gap between the support 1601 and the second adjustment plate 15 for adjusting the horizontality, and then the leveling screw 1702 is screwed for leveling. After leveling, the connecting bolt 1701 and the leveling locking nut 1703 are tightened. The leveling locking nut 1703 can prevent the leveling screw 1702 from loosening. In this embodiment, a flat washer and a spring washer are arranged on the connecting bolt 1701 to prevent the connecting bolt 1701 from loosening by setting a spring washer.

[0190] In a specific embodiment, the cavity connecting plate 13 is provided with a Y-direction slide groove, the first adjustment plate 14 is provided with a Y-direction slide rail 1401, and the Y-direction slide rail 1401 is slidably connected with the Y-direction slide groove;

[0191] The first adjustment plate 14 is provided with an X-direction slide groove, and the second adjustment plate 15 is provided with an X-direction slide rail 1501, and the X-direction slide rail 1501 is slidably connected with the X-direction slide groove;

[0192] This embodiment does not adopt the form of matching the slider with the slide rail, but adopts the form of direct matching of the slide groove with the slide rail, which occupies less space and thus reduces the volume of the vapor deposition device.

[0193] In a specific embodiment, Fig. 27 As shown, it also includes a Y-direction adjustment mechanism 18 and an X-direction adjustment structure 19; Fig.30 As shown, the Y-axis adjustment mechanism 18 includes a first connecting plate 1801, a first hollow bolt 1802, a Y-axis guide screw 1803 and a first fixing nut 1804, and the first connecting plate 1801 is fixed to the cavity connecting plate 13 by bolts;

[0194] The first hollow bolt 1802 is provided with a first guide through hole, the first connecting plate 1801 is connected to the first hollow bolt 1802 by threads, the Y-direction guide screw 1803 passes through the first guide through hole and is connected to the first adjustment plate 14 by threads, and the Y-direction guide screw 1803 can slide along the first guide through hole; the first fixing nut 1804 is arranged on a side of the first hollow bolt 1802 away from the first adjustment plate 14, and the first fixing nut 1804 is arranged on the Y-direction guide screw 1803;

[0195] By screwing the first hollow bolt 1802 in the positive direction, the end of the first hollow bolt 1802 can abut against the side surface of the first adjustment plate 14, so that the first hollow bolt 1802 can push the first adjustment plate 14 away from the first connecting plate 1801, thereby achieving positive displacement of the wafer stage 29 in the Y direction;

[0196] The first hollow bolt 1802 is screwed in the reverse direction, so that the end of the first hollow bolt 1802 can leave the side of the first adjustment plate 14. At this time, the Y-direction guide screw 1803 is pulled, and the Y-direction guide screw 1803 slides along the first guide through hole, so that the first adjustment plate 14 can be close to the first connecting plate 1801, so as to achieve the reverse displacement of the wafer stage 29 in the Y direction;

[0197] After adjusting the displacement of the wafer stage 29 in the Y direction, tighten the first fixing nut 1804 so that the first fixing nut 1804 abuts against the end of the first hollow bolt 1802 away from the first adjustment plate 14, thereby locking the first adjustment plate 14 in the Y direction;

[0198] like Figure 32b As shown, the X-direction adjustment structure 19 includes a second connecting plate 1901, a second hollow bolt 1902, an X-direction guide screw 1903 and a second fixing nut 1904, and the second connecting plate 1901 is fixed to the first adjustment plate 14 by bolts;

[0199] The second hollow bolt 1902 is provided with a second guide through hole, the second connecting plate 1901 is connected to the second hollow bolt 1902 by threads, the X-direction guide screw 1903 passes through the second guide through hole and is threadedly connected to the second adjustment plate 15, and the X-direction guide screw 1903 can slide along the second guide through hole;

[0200] The second fixing nut 1904 is disposed on a side of the second hollow bolt 1902 away from the second adjustment plate 15, and the second fixing nut 1904 is disposed on the X-direction guide screw 1903;

[0201] The second hollow bolt 1902 is screwed forwardly, so that the end of the second hollow bolt 1902 abuts against the side of the second adjustment plate 15, so that the second hollow bolt 1902 can push the second adjustment plate 15 away from the second connecting plate 1901, thereby achieving positive displacement of the wafer stage 29 in the X direction;

[0202] The second hollow bolt 1902 is screwed in the reverse direction, so that the end of the second hollow bolt 1902 can leave the side of the second adjustment plate 15. At this time, the X-direction guide screw 1903 is pulled, and the X-direction guide screw 1903 slides along the second guide through hole, so that the second adjustment plate 15 can be close to the second connecting plate 1901, so as to achieve the reverse displacement of the wafer stage 29 in the X direction;

[0203] After adjusting the displacement of the wafer stage 29 in the X direction, tighten the second fixing nut 1904 so that the second fixing nut 1904 abuts against the end of the second hollow bolt 1902 away from the second adjustment plate 15, thereby locking the second adjustment plate 15 in the X direction.

[0204] In a specific embodiment, it also includes a Y-direction resistance mechanism and an X-direction resistance mechanism;

[0205] like Fig.29 As shown, the Y-direction resistance mechanism includes a Y-direction spring 2001, one end of the Y-direction spring 2001 is connected to the first connecting plate 1801, and the other end of the Y-direction spring 2001 is connected to the first adjustment plate 14;

[0206] like Fig.32aAs shown, the X-direction resistance mechanism includes an X-direction spring 2101, one end of the X-direction spring 2101 is connected to the second connecting plate 1901, and the other end of the X-direction spring 2101 is connected to the second adjustment plate 15;

[0207] When the first connecting plate 1801 and the first adjusting plate 14 move away from each other, the elastic force generated by the stretching of the Y-direction spring 2001 will become the resistance for the first connecting plate 1801 and the first adjusting plate 14 to move away from each other, so that the first adjusting plate 14 will not move easily, and the displacement change is more controllable, which is convenient for accurate adjustment;

[0208] When the second connecting plate 1901 and the second adjusting plate 15 move away from each other, the elastic force generated by the stretching of the X-direction spring 2101 will become a resistance to the second connecting plate 1901 and the second adjusting plate 15 moving away from each other, so that the second adjusting plate 15 will not move easily, and the displacement change is more controllable, which is convenient for accurate adjustment;

[0209] In this embodiment, if Fig.29 As shown, the Y-direction resistance mechanism also includes a Y-direction spring mounting pin 2002 and a Y-direction spring mounting screw 2003, the Y-direction spring mounting pin 2002 is threadedly connected to the first connecting plate 1801, the Y-direction spring mounting screw 2003 is threadedly connected to the first adjustment plate 14, and the hooks at both ends of the Y-direction spring 2001 are respectively sleeved on the Y-direction spring mounting pin 2002 and the Y-direction spring mounting screw 2003;

[0210] In this embodiment, if Fig.32a As shown, the X-direction resistance mechanism also includes an X-direction spring mounting pin 2102 and an X-direction spring mounting screw 2103. The X-direction spring mounting pin 2102 is threadedly connected to the second connecting plate 1901, and the X-direction spring mounting screw 2103 is threadedly connected to the second adjustment plate 15. The hook rings at both ends of the X-direction spring 2101 are respectively mounted on the X-direction spring mounting pin 2102 and the X-direction spring mounting screw 2103.

[0211] In a specific embodiment, the X-direction slide groove and the Y-direction slide groove are both dovetail slide grooves, and the X-direction slide rail 1501 and the Y-direction slide rail 1401 are both dovetail slide rails. Dovetail slide rails have high precision and good rigidity and can withstand large loads.

[0212] In a specific embodiment, it also includes a Y-direction strip 22 and an X-direction strip 23. Figure 32b As shown, the Y-direction insert 22 is arranged in the Y-direction slide groove. Fig.35 As shown, the X-direction insert 23 is arranged in the X-direction slide groove;

[0213] The Y-direction insert 22 is used to reduce the clearance between the Y-direction slide rail 1401 and the Y-direction slide groove, thereby preventing the lifting mechanism 16 from shaking during movement, thereby ensuring the movement accuracy and position accuracy of the wafer stage 29;

[0214] The X-direction insert 23 is used to reduce the clearance between the X-direction slide rail 1501 and the X-direction slide groove, thereby preventing the lifting mechanism 16 from shaking during movement, thereby ensuring the movement accuracy and position accuracy of the wafer stage 29;

[0215] In this embodiment, if Figure 32b As shown, the cavity connecting plate 13 is provided with a first bolt 24, and the gap between the Y-direction insert 22 and the Y-direction slide rail 1401 can be adjusted by screwing the first bolt 24, and a first nut 25 is sleeved on the first bolt 24, and the first nut 25 is used to prevent the first bolt 24 from loosening;

[0216] In this embodiment, if Fig.35 As shown, the first adjustment plate 14 is provided with a third bolt 28, and the third bolt 28 is screwed to adjust the gap between the X-direction insert 23 and the X-direction slide rail 1501. In order to avoid the Y-direction resistance mechanism and prevent interference, the X-direction insert 23 in this embodiment is arranged Fig.35 The right side of the first adjustment plate 14 is close to the body of the reaction chamber in actual use, and the operation space is small, so it is inconvenient to screw. Therefore, a second bolt 26 is additionally provided on the first adjustment plate 14. The gap between the X-direction insert 23 and the X-direction slide rail 1501 can be adjusted by screwing the second bolt 26. A second nut 27 is sleeved on the second bolt 26. The second nut 27 is used to prevent the second bolt 26 from loosening.

[0217] In this embodiment, the first hollow bolt 1802 and the second bolt 26 are both arranged on a side of the cavity away from the reaction chamber, and the second hollow bolt 1902 and the first bolt 24 are both arranged on a side away from the fixed shaft 291 to ensure that the operator has sufficient operating space for tightening.

[0218] In a specific embodiment, Fig.28 As shown, the lifting mechanism 16 also includes a motor 1602, a lead screw 1603, a Z-direction slide rail 1604, a Z-direction slider 1605, a fixed shaft clamping portion 1606 and a lead screw nut seat 1608. The fixed shaft clamping portion 1606 is used to clamp the fixed shaft 291 of the wafer stage 29. The fixed shaft clamping portion 1606 is arranged on the lead screw nut seat 1608. In this embodiment, the lead screw 1603 is a trapezoidal lead screw.

[0219] In this embodiment, if Fig.32a As shown, the fixed shaft clamping portion 1606 includes two clamping blocks 1609, and the two clamping blocks 1609 clamp the fixed shaft 291 and are fixed to the screw nut seat 1608 by bolts;

[0220] The lead screw 1603 is rotatably arranged on the support 1601 via a bearing, and the motor 1602 is fixed on the support 1601. The motor 1602 can drive the lead screw 1603 to rotate. In the present embodiment, the motor 1602 drives the lead screw 1603 to rotate via a belt transmission, and the Z-direction slide rail 1604 is arranged on the support 1601, and the Z-direction slider 1605 is installed on the Z-direction slide rail 1604. The lead screw nut seat 1608 is fixedly connected to the Z-direction slider 1605, and a lead screw nut 1607 is provided on the lead screw nut seat 1608, and the lead screw nut 1607 is installed on the lead screw 1603.

[0221] In actual use, Fig.33 As shown, the lifting pin 85 (lifting pin PI N ) can also adopt the same cantilever design as the wafer stage 29, and adopt the same wafer lifting mechanism as the wafer stage 29 for lifting and leveling. The lifting pin fixed shaft 87 of the lifting pin 85 is connected to the wafer lifting mechanism (the connection form of the lifting pin fixed shaft 87 and the wafer lifting mechanism is the same as the connection form of the fixed shaft 291 of the wafer stage 29 and the wafer lifting mechanism), so that the lifting pin 85 can be driven by the wafer lifting mechanism. Fig. 27 The four ejector pin holes provided on the wafer carrier 29 are shown to extend / retract to cooperate with the action of the wafer taking fork 1 .

[0222] Example 3

[0223] This embodiment provides a wafer vapor deposition device. The main structure of this embodiment is similar to that of Embodiment 1. The differences between this embodiment and Embodiment 1 are as follows:

[0224] As a key component, the gas cabinet M is responsible for transporting a variety of reactive process gases to the reaction chamber F for chemical reactions to generate solid products and gaseous by-products. The solid products will be deposited on the wafer surface to form a solid film.

[0225] By changing the process gas introduced into the reaction chamber F by the gas cabinet M, different processes can be switched to meet diverse production needs. However, during the process switching, the residual gas from the previous process will affect the process after switching, which may change the final process effect. Therefore, in order to ensure the stability of the process, effective measures must be taken to remove the residual gas from the previous process.

[0226] In addition, when the existing gas cabinet transports multiple process gases, the reducing gas and oxidizing gas that can react with each other will be fully mixed in the pipeline before reaching the reaction chamber. This premature mixing not only leads to the premature generation of solid products and gaseous by-products, which interferes with the normal reaction process in the reaction chamber and has an adverse effect on the process effect, but also causes unnecessary consumption and waste of process gases, increasing production costs.

[0227] Therefore, in this embodiment, the gas cabinet M includes several gas control modules, such as Fig.40 As shown, it includes several gas control modules, and the number of gas control modules corresponds to the number of reaction chambers F in the CVD equipment. Fig.40 The part selected by D3 is a gas control module. The structure of the gas control module is as follows: Fig.41 As shown, Fig.40 The gas cabinet has four gas control modules, corresponding to the CVD equipment with four reaction chambers F, such as Fig.36 As shown, the gas control module includes a first gas delivery unit 31 and a second gas delivery unit 32;

[0228] The first gas delivery unit 31 includes a purge pipeline and a plurality of process gas delivery pipelines, such as Fig.36 As shown, one end of the purge pipeline of the first gas delivery unit 31 away from the purge gas source is connected with one end of the process gas delivery pipeline away from the process gas source to form a first branch 41 and a third branch 43 provided with a switch valve;

[0229] The second gas delivery unit 32 includes a purge pipeline and a plurality of process gas delivery pipelines, such as Fig.36 As shown, one end of the purge pipeline of the second gas delivery unit 32 away from the purge gas source is connected with one end of the process gas delivery pipeline away from the process gas source to form a second branch 42 and a fourth branch 44 provided with a switch valve;

[0230] The first gas delivery unit 31 is provided with at least one process gas delivery pipeline capable of delivering oxidizing gas, the second gas delivery unit 32 is provided with at least one process gas delivery pipeline capable of delivering reducing gas, the first branch 41 and the second branch 42 are connected in parallel to the reaction chamber F, and the third branch 43 and the fourth branch 44 are connected in parallel to the vacuum pumping system H;

[0231] To better illustrate the beneficial effects of the gas cabinet M provided in this embodiment, the gas control module of the existing gas cabinet is introduced below. Fig.44The gas control module of the existing gas cabinet shown is provided with six process gas delivery pipelines, which are connected to the reaction chamber through the interface I after being connected in parallel. The reducing gas and the oxidizing gas that react with each other will be mixed in advance in the pipeline, resulting in the premature generation of solid products and gaseous by-products.

[0232] The gas cabinet M provided in this embodiment effectively isolates the reducing gas and the oxidizing gas that can react with each other by providing a first gas delivery unit 31 for delivering the oxidizing gas and a second gas delivery unit 32 for delivering the reducing gas. Before the first branch 41 and the second branch 42 merge, the reducing gas and the oxidizing gas do not contact each other, which greatly reduces the premature generation of solid products and gaseous by-products that may be caused by early mixing of the gases, thereby ensuring the stability of the reaction in the reaction chamber F and reducing unnecessary consumption and waste of process gases.

[0233] The purge pipeline of the first gas delivery unit 31 is connected to the reaction chamber F and the vacuum pumping system H through the first branch 41 and the third branch 43 respectively, and the purge pipeline of the second gas delivery unit 32 is connected to the reaction chamber F and the vacuum pumping system H through the second branch 42 and the fourth branch 44 respectively, so that impurities such as residual gas in the pipeline and the reaction chamber can be effectively removed to ensure the stability of the process.

[0234] In a specific embodiment, when the first gas delivery unit 31 includes a plurality of process gas delivery pipelines, the plurality of process gas delivery pipelines of the first gas delivery unit 31 can deliver a plurality of process gases that do not react with each other, so as to avoid the reaction of the plurality of process gases in the pipeline after mixing, resulting in the premature generation of solid products and gaseous by-products, thereby affecting the normal reaction in the reaction chamber F;

[0235] When the second gas delivery unit 32 includes multiple process gas delivery pipelines, the multiple process gas delivery pipelines of the second gas delivery unit 32 can transport multiple non-reactive process gases, thereby avoiding the reaction of multiple process gases in the pipeline after mixing, causing the premature generation of solid products and gaseous by-products, and affecting the normal reaction in the reaction chamber F.

[0236] In a specific embodiment, a gas cabinet body is also included, and the gas control module is arranged in the gas cabinet body, such as Figures 37 to 40 as well as Fig.42 As shown, the gas cabinet body includes a cabinet body 40 and a cabinet door 39 hinged on the cabinet body 40, the cabinet body 40 and the cabinet door 39 can form an airtight space, and an exhaust pipe 38 is provided on the top of the cabinet body 40, and the exhaust pipe 38 is connected to the exhaust system;

[0237] When the gas control module is under maintenance, the cabinet door 39 needs to be opened, and outside air will enter the gas cabinet body. As the pipeline is disassembled, the residual gas and impurities in the pipeline will overflow into the gas cabinet body, causing the gas cabinet body to be contaminated, seriously affecting the cleanliness of the working environment of the gas control module. Therefore, after the maintenance is completed, the exhaust pipe 38 connected to the exhaust system is used to suck out the residual gas and impurities in the gas cabinet body to eliminate the pollution in the airtight space and ensure the cleanliness of the gas cabinet body.

[0238] In a specific embodiment, a gas mass flow controller and a pneumatic valve are provided on the process gas delivery pipelines of the first gas delivery unit 31 and the second gas delivery unit 32, a filter is provided on one end of the process gas delivery pipelines of the first gas delivery unit 31 and the second gas delivery unit 32 close to the process gas source, and a manual valve is provided on the process gas delivery pipelines of the first gas delivery unit 31 and the second gas delivery unit 32;

[0239] A gas mass flow controller and a pneumatic valve are provided on the purge pipelines of the first gas delivery unit 31 and the second gas delivery unit 32, a filter is provided on one end of the purge pipelines of the first gas delivery unit 31 and the second gas delivery unit 32 close to the purge gas source, and a manual valve is provided on the purge pipelines of the first gas delivery unit 31 and the second gas delivery unit 32;

[0240] The filter is used to ensure the purity of the gas being transported, the gas mass flow controller is used to accurately control the flow of the gas being transported, the pneumatic valve is used to control the on-off of the pipeline, the manual valve is normally open, and the manual valve only needs to be closed when the gas cabinet is being repaired or there is a gas leak in the pipeline;

[0241] In this embodiment, the switch valve and the pneumatic valve are both pneumatic diaphragm valves, and the manual valves are both manual diaphragm valves. Each process gas delivery pipeline is individually provided with a manual diaphragm valve and a pneumatic diaphragm valve. The valves of the corresponding pipelines can be opened and closed individually according to different process requirements to meet different process requirements.

[0242] In this embodiment, if Fig.36 As shown, the first gas delivery unit 31 includes three process gas delivery pipelines and one purge pipeline, the three process gas delivery pipelines are respectively connected to the first process gas source G1, the second gas source process gas G2 and the third process gas source G3, and the purge pipeline is connected to the first purge gas source G4;

[0243] The second gas delivery unit 32 includes a process gas delivery pipeline and a purge pipeline, the process gas delivery pipeline is connected to the fourth process gas source G6, and the purge pipeline is connected to the second purge gas source G5;

[0244] In this embodiment, the gas corresponding to the first process gas source G1 is N2O (oxidizing gas), the gas corresponding to the second process gas source G2 is CF4, the gas corresponding to the third process gas source G3 is NH3, the gas corresponding to the fourth process gas source G6 is SiH4 (reducing gas), and the gases corresponding to the first purge gas source G4 and the second purge gas source G5 are both N2;

[0245] The process gas delivery pipelines and the purge pipelines of the first gas delivery unit 31 and the second gas delivery unit 32 are both provided with filters (corresponding to Fig.36 The first filter 33a to the sixth filter 33f), the manual valve (corresponding to Fig.36 The first manual valve 34a to the sixth manual valve 34f), the gas mass flow controller (corresponding to Fig.36 The first gas mass flow controller 35a to the sixth gas mass flow controller 35f) and the pneumatic valve (corresponding to Fig.36 The first pneumatic valve 36a to the sixth pneumatic valve 36f), the first branch 41 to the fourth branch 44 are respectively provided with a switch valve (corresponding to Fig.36 In the embodiment, the first switch valve 37a to the fourth switch valve 37d are Fig.43 As shown, the first branch 41 and the second branch 42 are connected in parallel and connected to the reaction chamber F through the gas supply interface 4501, and the third branch 43 and the fourth branch 44 are connected in parallel and connected to the vacuum pumping system H through the gas pumping interface 4502;

[0246] When the gas cabinet is working normally, the manual valve is normally open, the fourth pneumatic valve 36d, the fifth pneumatic valve 36e, the third switch valve 37c and the fourth switch valve 37d are closed, and different process gases are selected according to different process requirements, and one or more of the first pneumatic valve 36a, the second pneumatic valve 36b, the third pneumatic valve 36c and the sixth pneumatic valve 36f corresponding to different process gases are opened, and the first switch valve 37a and the second switch valve 37b are opened to provide process gas to the reaction chamber F;

[0247] When the cavity of the reaction chamber F needs to be opened, the flammable, explosive, toxic and harmful process gases remaining in the reaction chamber F need to be discharged, the third switch valve 37c and the fourth switch valve 37d are closed, the first pneumatic valve 36a, the second pneumatic valve 36b, the third pneumatic valve 36c and the sixth pneumatic valve 36f are closed, the fourth pneumatic valve 36d, the fifth pneumatic valve 36e, the first switch valve 37a and the second switch valve 37b are opened, and N2 is introduced into the reaction chamber F for cleaning (in actual application, the reaction chamber F is also connected to the vacuum exhaust system H, and the vacuum exhaust system H can be used to exhaust gas while introducing N2 to clean the inside of the reaction chamber F);

[0248] Since there are toxic, harmful, flammable and explosive gases in the process gas, when the accessories of the gas cabinet (such as valves, pipelines, gas mass flow controllers and other accessories of the gas control module) need to be replaced or repaired, the residual process gas in the pipeline needs to be emptied, the first switch valve 37a and the second switch valve 37b are closed, the first pneumatic valve 36a, the second pneumatic valve 36b, the third pneumatic valve 36c and the sixth pneumatic valve 36f are closed, the third switch valve 37c and the fourth switch valve 37d are opened to evacuate the pipeline, the fourth pneumatic valve 36d and the fifth pneumatic valve 36e are opened to introduce N2 into the pipeline to evacuate the residual process gas in the pipeline, and then the third switch valve 37c and the fourth switch valve 37d are closed. After all manual valves are closed, the gas cabinet can be inspected and repaired;

[0249] When it is necessary to switch the process, the first pneumatic valve 36a, the second pneumatic valve 36b, the third pneumatic valve 36c and the sixth pneumatic valve 36f are closed, the first switch valve 37a and the second switch valve 37b are closed, the third switch valve 37c and the fourth switch valve 37d are opened to evacuate the pipeline, the fourth pneumatic valve 36d and the fifth pneumatic valve 36e are opened to introduce N2 into the pipeline to exhaust the residual process gas in the pipeline to ensure that the newly introduced process gas after the process is switched will not be contaminated by the residual gas in the pipeline; after the residual process gas is exhausted, the fourth pneumatic valve 36d, the fifth pneumatic valve 36e, the third switch valve 37c and the fourth switch valve 37d are closed, and different process gases are selected according to different process requirements, one or more of the first pneumatic valve 36a, the second pneumatic valve 36b, the third pneumatic valve 36c and the sixth pneumatic valve 36f corresponding to different process gases are opened, the first switch valve 37a and the second switch valve 37b are opened to provide gas to the reaction chamber F.

[0250] Example 4

[0251] This embodiment provides a wafer vapor deposition device. The main structure of this embodiment is similar to that of Embodiment 1. The differences between this embodiment and Embodiment 1 are as follows:

[0252] During the maintenance and debugging process, since the reaction chamber F needs to be opened multiple times, the hinge connecting the chamber body F1 and the upper cover F2 needs to have a self-locking function to ensure that the upper cover F2 can be firmly locked after opening, thereby effectively preventing the upper cover from accidentally falling and causing harm to the staff, ensuring the safety and stability of the working environment.

[0253] At present, hinges with self-locking function generally adopt a structure in which springs, gears and toothed operating rods cooperate with each other to achieve the locking purpose. The hinges of this structure can be locked at any position through the mutual engagement of the gears and the toothed operating rod. However, in terms of the actual application of the upper cover, the locking function at any position is not necessary, and locking at a specific angle can meet the actual needs.

[0254] The mechanism of meshing between the gear and the toothed joystick requires the operator to exert relatively large force to press the joystick when performing the switching action, which makes the switching process very laborious; in addition, during the process of opening the cover, unnecessary noise will be generated due to the physical contact between the gear and the joystick, which also has a negative impact on the actual use experience.

[0255] In this embodiment, the cavity F1 and the upper cover F2 of the reaction chamber F are connected by a connecting device, such as Fig.45 and Fig.46 As shown, the connecting device includes a hinge structure, such as Fig.50 As shown, the hinge structure includes a first leaf piece 46 and a second leaf piece 47 hingedly connected by a rotating shaft 57, and a limiting structure is provided on the first leaf piece 46;

[0256] like Fig.48 and Fig.52 As shown, the first leaf 46 has locking holes 4601 on both sides, and the locking holes 4601 are provided with latch springs 49 and latch pins 50. The latch pins 50 can move along the axial direction of the latch springs 49. The axial direction of the latch springs 49 is parallel to the axial direction of the rotating shaft 57. Fig.46 As shown, locking plates 48 are provided on both sides of the second leaf 47, and the locking plates 48 and the second leaf 47 are fixed by bolts. Fig.48 and Fig.49 As shown, the locking plate 48 is provided with a pin hole 4801 for allowing the latch 50 to be inserted;

[0257] When the second leaf 47 rotates until the latch 50 is aligned with the pin hole 4801, the latch 50 extends from the locking hole 4601 under the elastic force of the latch spring 49 and is inserted into the pin hole 4801, and the hinge structure is locked at this time; the limiting structure can prevent the latch 50 from extending from the locking hole 4601 when the hinge structure is not locked;

[0258] Compared with the prior art, the connection device provided in this embodiment does not adopt the traditional mechanism of meshing gears and toothed joysticks to achieve the self-locking function. Instead, when the second leaf 47 is rotated to a specific position where the latch 50 is aligned with the pin hole 4801, the latch spring 49 provides elastic force to insert the latch 50 into the pin hole 4801, so that the hinge structure can be firmly and reliably locked, and the hinge structure can be opened and closed smoothly, which saves effort and generates no noise. By setting a limit structure, the latch 50 is prevented from popping out when the latch 50 is not aligned with the pin hole 4801, thereby ensuring that the hinge structure can work normally.

[0259] In a specific embodiment, the limiting structure includes: Fig.46 The limit slider 51 shown and Fig.48 The slide groove 4602 shown in the figure is arranged on both sides of the first leaf 46. Fig.48 As shown, a spring 52 is provided in the slide groove 4602;

[0260] like Fig.53 and Fig.54 As shown, the limit slider 51 includes a stopper 5101 and a sliding part 5102. The sliding part 5102 is slidably disposed in the slide groove 4602. Rotating the second page 47 can enable the locking plate 48 to push the stopper 5101.

[0261] Under the elastic force of the spring 52, the sliding portion 5102 can slide along the sliding groove 4602 until the stop portion 5101 blocks the locking hole 4601, so as to prevent the latch 50 from extending from the locking hole 4601;

[0262] The second leaf piece 47 rotates, driving the locking plate 48 to rotate, so that the locking plate 48 pushes the stop portion 5101. Under the thrust of the locking plate 48, the sliding portion 5102 can slide in the opposite direction along the slide groove 4602, and the stop portion 5101 moves away from the locking hole 4601 until the stop portion 5101 no longer blocks the locking hole 4601. When the second leaf piece 47 rotates until the latch 50 is aligned with the pin hole 4801, the latch 50 extends out of the locking hole 4601 and is inserted into the pin hole 4801, thereby locking the hinge structure.

[0263] In a specific embodiment, Fig.51 and Fig.52 As shown, both sides of the first leaf piece 46 are further provided with unlocking grooves 4603 connected to the locking hole 4601, and the unlocking grooves 4603 extend along the axial direction of the latch spring 49. The latch 50 is provided with a handle 55. In this embodiment, the latch 50 is threadedly connected with the handle 55, and the handle 55 extends out from the unlocking groove 4603. Pulling the handle 55 can retract the latch 50 into the locking hole 4601 to achieve unlocking of the hinge structure.

[0264] In a specific application, after the latch 50 extends from the locking hole 4601, the distance between the handles 55 on both sides should be smaller than the length of a normal person's thumb and index finger, and can be designed to be 5-10 cm, so as to facilitate one-handed operation of the two handles 55 for unlocking.

[0265] In a specific embodiment, a damping device is also included, such as Fig.45As shown, the first leaf piece 46 is fixed on the cavity F1, and the second leaf piece 47 is fixed on the upper cover F2. The damping device can provide resistance during the closing process of the upper cover F2 and the cavity F1, so that when the operator closes the upper cover F2, one hand is required to apply pressure to the upper cover F2, and the other hand is required to operate the two handles 55 to unlock them. Both hands need to be operated at the same time to avoid the operator being accidentally pinched by the upper cover F2.

[0266] In a specific embodiment, Fig.45 As shown, the damping device is a gas spring 54, one end of which is rotatably connected to the upper cover F2, and the other end of the gas spring 54 is rotatably connected to the cavity F1. The elasticity of the gas spring can be adjusted by filling gas with different pressures, so that the resistance during the closing process of the upper cover F2 and the cavity F1 can be controlled.

[0267] In a specific embodiment, Fig.48 and Fig.49 As shown, the locking plate 48 is provided with an arc portion 4802, and the locking plate 48 pushes the stop portion 5101 through the arc portion 4802;

[0268] By providing the arc portion 4802 , when the locking plate 48 pushes the stop portion 5101 , the top surface of the stop portion 5101 is always tangent to the arc portion 4802 , thereby ensuring that the pushing process can proceed smoothly.

[0269] In a specific embodiment, Fig.47 and Fig.48 As shown, a blind plate 56 is also included. The slide groove 4602 is open at one end away from the locking hole 4601. The sliding part 5102 is inserted into the slide groove 4602 from the opening for easy installation. The blind plate 56 is connected to the first leaf 46 by bolts to block the opening.

[0270] like Fig.53 As shown, a blind hole 5103 is provided on the sliding portion 5102 , one end of the spring 52 is inserted into the blind hole 5103 , and the other end of the spring 52 abuts against the blind plate 56 . The blind hole 5103 enables the spring 52 to better apply force to the sliding portion 5102 .

[0271] In a specific embodiment, Fig.45 As shown, it also includes a handle 53, which is fixed on the upper cover F2. The handle 53 is convenient for operators to hold so as to better apply force to the upper cover F2 and facilitate the opening and closing of the upper cover F2.

[0272] Example 5

[0273] This embodiment provides a wafer vapor deposition device. The main structure of this embodiment is similar to that of Embodiment 1. The differences between this embodiment and Embodiment 1 are as follows:

[0274] In the design of existing heating equipment, the copper busbar and the socket corresponding to the bulb plug are designed to be tightly integrated with the water-cooled lampshade. When the water-cooled lampshade needs to be repaired or replaced, all the related line connections must be removed first to ensure the effective separation of the water-cooled lampshade from the copper busbar and the socket.

[0275] This integrated design increases the complexity of maintenance operations. When there is a problem with the water-cooled lamp cover, it is difficult to repair it quickly and requires a long time, which will have a certain impact on the overall production progress and production efficiency of wafer thin film deposition.

[0276] In this embodiment, the cavity of the reaction chamber F is provided with a heating device, such as Figure 55 to Figure 59 As shown, it includes: a light bulb 58, a water-cooled lampshade 59 and a lamp holder, wherein the water-cooled lampshade 59 and the lamp holder are detachably connected by bolts;

[0277] The lamp holder includes a base plate 60, the base plate 60 is made of insulating material, a copper bar is provided on the base plate 60, the copper bar includes a neutral copper bar 61 and a live copper bar 62, and a socket 63 is also provided on the base plate 60 to match the plug 5801 of the light bulb 58. In this embodiment, the copper bar and the socket 63 are mounted on the base plate 60 by bolts, and the socket 63 is connected to the neutral copper bar 61 and the live copper bar 62 by wires;

[0278] When the plug 5801 is inserted into the socket 63, the bulb 58 is located in the water-cooled lampshade 59. The water-cooled lampshade 59 prevents the bulb 58 from heating up and causing the lampshade itself to overheat, which may cause burns to people who touch the lampshade. At the same time, the water-cooled lampshade 59 can prevent high temperature from damaging the cables near the bulb 58 and the bulb 58 itself.

[0279] The heating device provided in this embodiment effectively uses the modular design concept by integrating the copper busbar and the socket 63 on the base plate 60 of the lamp holder and making the water-cooled lampshade 59 detachably connected to the lamp holder, thereby significantly improving the installation and replacement efficiency of the device. When the user encounters a failure of the water-cooled lampshade 59, the water-cooled lampshade 59 can be quickly separated from the copper busbar and the socket 63, thereby reducing the complexity of the maintenance operation and shortening the maintenance time.

[0280] When a fault occurs, the faulty water-cooling lampshade 59 can be completely disassembled and directly replaced with a normally usable water-cooling lampshade 59, thereby reducing the downtime of the heating equipment and ensuring the overall production progress and production efficiency of wafer thin film deposition;

[0281] like Fig.55As shown, one end of the water-cooled lampshade 59 away from the base plate 60 is open, and the bulb 58 is placed into the water-cooled lampshade 59 through the opening and inserted into the socket 63. When the water-cooled lampshade 59 needs to be separated from the lamp holder, it can be separated after taking out the bulb 58 through the opening.

[0282] In a specific embodiment, Fig.60 and Fig.61 As shown, the socket 63 and the wiring copper bus are respectively located on both sides of the base plate 60. The base plate 60 is provided with a wire hole 6001. The socket 63 is connected to the wiring copper bus by passing the wire through the wire hole 6001. The wire hole 6001 can reduce the length of the wire connecting the socket 63 and the wiring copper bus. The wire hole 6001 corresponds to the socket 63 one by one, which is convenient for wire management and makes it easier to troubleshoot during maintenance.

[0283] In a specific embodiment, Fig.60 As shown, the plurality of sockets 63 are arranged in a circular array on the base plate 60, so that the plurality of bulbs 58 inserted in the sockets 63 can be arranged in a circular array, so that the heating device can provide heat more evenly.

[0284] In a specific embodiment, Fig.55 As shown, the lamp holder further includes an outer cover 64 detachably connected to the seat plate 60 by bolts. The outer cover 64 is arranged on a side of the seat plate 60 away from the water-cooled lamp cover 59 , thereby providing protection for the seat plate 60 .

[0285] In a specific embodiment, Fig.56 and Fig.59 As shown, the outer cover 64 includes a main body 6401 and an inspection window cover 6402, and the main body 6401 and the inspection window cover 6402 are made of insulating material. The main body 6401 is provided with a connector plug 65 connected to the wiring copper busbar. The connector plug 65 on the main body 6401 can be connected to an external power supply so that the power supply supplies power to the heating device through the wiring copper busbar. The inspection window cover 6402 is detachably connected to the seat plate 60 by bolts. When maintenance is required, there is no need to remove the main body 6401. Only the inspection window cover 6402 needs to be removed to inspect the wires and the wiring copper busbar on the seat plate 60.

[0286] In a specific embodiment, Fig.55 As shown, it also includes a water pipe 66, such as Fig.59 As shown, a through hole 67 is provided in the middle of the lamp holder, one end of the water pipe 66 is connected to the water-cooled lampshade 59, and the other end of the water pipe 66 passes through the through hole 67 and is connected to an external cold water source. Fig.56 One of the two water pipes shown is a water inlet pipe, and the other is a water return pipe. The cold water source is connected to the water channel of the water-cooled lampshade 59 through the water inlet pipe and the water return pipe, and the heat is taken away by circulating water supply.

[0287] In a specific embodiment, the socket 63 is a ceramic socket, which has high strength, long service life, and is flame retardant, and is suitable for heating equipment.

[0288] Example 6

[0289] This embodiment provides a wafer vapor deposition device. The main structure of this embodiment is similar to that of Embodiment 5. The differences between this embodiment and Embodiment 5 are as follows:

[0290] In Embodiment 1, the connection copper bar includes a neutral copper bar 61 and a live copper bar 62 .

[0291] In this embodiment, the wiring copper bar includes a neutral copper bar 61 and a plurality of live copper bars 62. The neutral copper bar 61 is annular and arranged in the middle of the base plate 60. The plurality of live copper bars 62 are evenly distributed around the neutral copper bar 61. The plurality of live copper bars 62 can connect a corresponding number of live wires.

[0292] Each socket 63 needs to be connected to a neutral copper bar 61 and a live copper bar 62 through wires. To ensure that the distance between each socket 63 and the neutral copper bar 61 and the live copper bar 62 is kept moderate, in this embodiment, Fig.61 As shown, three live copper bars 62 are evenly distributed around the neutral copper bar 61. This layout is intended to prevent a certain socket 63 from being too far away from the neutral copper bar 61 or the live copper bar 62, thereby avoiding the wires required for connection from being too long. At the same time, the wires are arranged more neatly, which is convenient for wire management and makes it easier to troubleshoot during maintenance.

[0293] The hardness of the wire is proportional to the cross-sectional size, that is, the thicker the wire, the greater its hardness, which makes the wiring process more complicated and difficult, indirectly increasing the cost of installation and subsequent maintenance. Compared with using a single live wire with a larger cross-sectional size to transmit current, the form of multiple live wires shared by the present embodiment can reduce the cross-sectional size of each live wire and reduce the difficulty and cost of wiring.

[0294] Example 7

[0295] This embodiment provides a wafer vapor deposition device. The main structure of this embodiment is similar to that of Embodiment 1. The differences between this embodiment and Embodiment 1 are as follows:

[0296] The load lock chamber is opened and closed by a valve structure. The existing valve structure is as follows Fig.73 and Fig.74As shown, the valve plate K of the existing valve structure is opened and closed by flipping the connecting rod mechanism L driven by the cylinder. When opening, the upper part of the sealing ring of the valve plate K of the existing valve structure first leaves the existing cavity J of the load locking chamber, which can easily lead to uneven force distribution on the whole sealing ring, and cause significant deformation of the local area of ​​the sealing ring, which directly affects the sealing effect and greatly shortens the service life of the sealing ring; at the same time, the surface where the existing cavity J of the load locking chamber cooperates with the valve plate K of the existing valve structure is an inclined surface, which is difficult to process as a whole and has high processing costs.

[0297] In this embodiment, the vacuum gate valve is as follows Fig.62 As shown, it includes a valve port 68, a valve plate 69 and a driving device 70. The valve port 68 is opened on the load lock chamber body C1 of the load lock chamber C. The valve plate 69 is arranged opposite to the valve port 68. Fig.68 As shown, a sealing ring 71 is provided on one side of the valve plate 69 close to the valve port 68, and the driving device 70 is arranged on the cavity C1 of the load lock chamber;

[0298] The driving device 70 can drive the valve plate 69 to approach or move away from the valve port 68 along a first direction perpendicular to the valve port 68 to close or open the valve port 68. In actual use, the size of the sealing ring 71 needs to ensure that the orthographic projection of the valve port 68 along the first direction can be completely located within the sealing ring 71.

[0299] When the valve plate 69 is away from the valve port 68, the driving device 70 can drive the valve plate 69 to reciprocate along a second direction perpendicular to the first direction, so that the orthographic projection of the valve port 68 along the first direction does not overlap or overlaps with the valve plate 69;

[0300] like Fig.63 As shown, it also includes a sink 73 disposed on the load lock chamber body C1. When the valve plate 69 is away from the valve port 68, the valve plate 69 is partially or completely located in the sink 73.

[0301] In view of the fact that the load lock chamber is located adjacent to related components such as wafer boxes in the chemical vapor deposition equipment, in order to reduce the impact of the valve structure on the internal layout of components such as wafer boxes in the chemical vapor deposition equipment, the vacuum gate valve provided in this embodiment significantly improves the space utilization efficiency by adding a sink 73 on the load lock chamber cavity C1, ensuring that the valve plate 69 can be partially or completely accommodated in the sink 73, thereby effectively avoiding potential interference between the valve structure and components such as wafer boxes.

[0302] In actual use, when the wafer box needs to transfer wafers to the load lock chamber, the driving device 70 drives the valve plate 69 away from the valve port 68 in the first direction to connect the load lock chamber to the atmosphere, and then the driving device 70 drives the valve plate 69 to move downward in the second direction to avoid the robot that transfers the wafers;

[0303] When the load lock chamber needs to be isolated from the atmosphere, the driving device 70 drives the valve plate 69 to move upward in the second direction, and then the driving device 70 drives the valve plate 69 to move close to the valve port 68 in the first direction to isolate the load lock chamber from the atmosphere;

[0304] Different from the existing valve structure that realizes opening and closing through the connecting rod mechanism L, the valve structure of a chamber provided by the present invention drives the valve plate 69 to reciprocate along the first direction through the driving device 70 to realize the opening and closing of the valve port 68, so that the load lock chamber can be connected to or isolated from the atmosphere, and drives the valve plate 69 to reciprocate along the second direction through the driving device 70, so that the positive projection of the valve port 68 along the first direction does not overlap with the valve plate 69, so that the valve plate 69 can avoid the robot and does not cause obstruction to the robot, so that the robot can smoothly transfer the wafer;

[0305] The valve plate 69 is moved vertically relative to the valve port 68 by the driving device 70, so that the sealing ring 71 on the valve plate 69 can be moved away from the load locking chamber body C1 at the same time, ensuring that the sealing ring 71 is evenly stressed and avoiding significant deformation in local areas. At the same time, the surface where the load locking chamber body C1 and the valve plate 1 match each other does not need to be processed into an inclined surface, but can be processed into a flat surface, thereby reducing the processing difficulty of the load locking chamber body C1 and saving processing costs.

[0306] In a specific embodiment, Fig.62 and Fig.64 As shown, the two driving devices 70 are symmetrically arranged on both sides of the load lock chamber body C1, and the two ends of the valve plate 69 are respectively connected to the two driving devices 70;

[0307] The two symmetrically arranged driving devices 70 drive the valve plate 69 simultaneously, so that the force on the valve plate 69 is more uniform and the sealing effect of the sealing ring 71 is better.

[0308] In a specific embodiment, Fig.68 and Fig.69 As shown, the valve plate 69 includes a valve plate body 6902 and a transmission plate 6903 detachably connected to the valve plate body 6902, and two ends of the transmission plate 6903 are respectively connected to two driving devices 70;

[0309] The valve plate body 6902 is arranged opposite to the valve port 68. Fig.71As shown, a sealing ring groove 6901 is formed on the surface of the valve plate body 6902 opposite to the valve port 68, and a sealing ring 71 is installed in the sealing ring groove 6901;

[0310] To ensure the sealing effect, the sealing ring 71 needs to be replaced regularly. The operating space between the valve plate 69 and the valve port 68 is small. To facilitate the replacement of the sealing ring 71, the valve plate body 6902 and the transmission plate 6903 are detachably connected by bolts, so that the sealing ring 71 can be removed together with the valve plate body 6902.

[0311] In a specific embodiment, Fig.66 and Fig.67 As shown, the driving device 70 includes a first cylinder 7001, a second cylinder 7002, a cylinder seat 7003 and a housing 7004. In this embodiment, Fig.65 As shown, the housing 7004 includes a shell 7008 and a cover plate 7009, and the shell 7008 and the cover plate 7009 are detachably connected by bolts. The first cylinder 7001 and the second cylinder 7002 arranged in the housing 7004 can be inspected by removing the cover plate 7009;

[0312] The housing 7004 is fixedly connected to the load lock chamber body C1 by threaded fasteners, the second cylinder 7002 is fixedly connected to the housing 7004 by threaded fasteners, the piston rod of the second cylinder 7002 is fixedly connected to the cylinder seat 7003 by threaded fasteners, the first cylinder 7001 is fixedly connected to the cylinder seat 7003 by threaded fasteners, and the piston rod of the first cylinder 7001 is fixedly connected to the transmission plate 6903 of the valve plate 69 by threaded fasteners;

[0313] The first cylinder 7001 can drive the valve plate 69 to reciprocate along a first direction, and the second cylinder 7002 can drive the cylinder seat 7003 to reciprocate along a second direction. In this embodiment, the second direction is a vertical direction.

[0314] In actual use, corresponding pin holes are set on the housing 7004 and the load lock chamber body C1, such as Fig.65 As shown, the position accuracy of the housing 7004 is ensured by inserting two ends of a cylindrical pin 74 that is interference-fitted with the pin hole into two corresponding pin holes on the housing 7004 and the load lock chamber cavity C1 .

[0315] The existing valve structure is as follows Fig.73 and Fig.74 As shown in the figure, the transmission route of the connecting rod mechanism L is long, and the dimensional errors of each component and the clearance in the kinematic pair will produce a large cumulative error, which is easy to cause insufficient motion accuracy. The wear and fatigue of each component over a long period of use will greatly increase the cumulative error, resulting in the valve structure not being closed tightly.

[0316] The vacuum gate valve provided in this embodiment replaces the connecting rod mechanism L with the first cylinder 7001 and the second cylinder 7002, so that the cumulative error is only affected by the stroke error of the first cylinder 7001 and the second cylinder 7002. The error source is single and controllable, the movement accuracy of the drive device 70 is higher, and the problem of loose closing of the valve structure is less likely to occur; when a fault occurs, the problem is easy to detect and maintenance is more convenient, and the maintenance can be completed by directly replacing the first cylinder 7001 and / or the second cylinder 7002.

[0317] In a specific embodiment, Fig.63 As shown, two positioning sinkers 72 are also included, and the two positioning sinkers 72 are respectively arranged on both sides of the load lock chamber body C1;

[0318] The shape of the positioning platform 72 is matched with the shell 7004 , and the shell 7004 is arranged in the positioning platform 72 . By setting the positioning platform 72 , the shell 7004 can be quickly positioned on the load lock chamber body C1 , so as to facilitate the disassembly, assembly and maintenance of the driving device 70 .

[0319] In a specific embodiment, Fig.66 and Fig.67 As shown, a magnetic switch 7005 is installed on the first cylinder 7001;

[0320] In actual application, an electrical connector 7007 is provided on the housing 7004, and the driving device 70 is connected to an external controller through wires and the electrical connector 7007. A magnetic switch 7005 is provided to accurately detect the position of the first cylinder 7001, so that the controller can accurately control the stroke of the first cylinder 7001.

[0321] In a specific embodiment, Fig.66 and Fig.67 As shown, an air pipe joint 7006 is provided on the housing 7004, and the first cylinder 7001 and the second cylinder 7002 are connected to the air source through the air pipe joint 7006 and the air pipe connected to the air pipe joint 7006 to ensure that the first cylinder 7001 and the second cylinder 7002 can be used normally.

[0322] In a specific embodiment, Fig.69 As shown, the valve plate body 6902 is provided with a positioning protrusion 6904. Fig.70 As shown, the transmission plate 6903 is provided with a corresponding positioning groove 6905;

[0323] In actual use, Fig.71As shown, the valve plate body 6902 is provided with a pin hole, a positioning pin which is interference fit with the pin hole is provided in the pin hole, and a positioning protrusion 6904 is formed on the part of the positioning pin exposed from the pin hole;

[0324] Insert the positioning protrusion 6904 of the valve plate body 6902 into the positioning groove 6905 of the transmission plate 6903 from above to achieve rapid positioning of the valve plate body 6902 and the transmission plate 6903 .

[0325] In a specific embodiment, Fig.72 As shown, the cross-section of the sealing ring groove 6901 is an inverted trapezoid, which can ensure that the sealing ring 71 is firmly installed on the valve plate 69.

[0326] Example 8

[0327] This embodiment provides a wafer vapor deposition device. The main structure of this embodiment is similar to that of Embodiment 1. The differences between this embodiment and Embodiment 1 are as follows:

[0328] In order to improve the wafer transmission efficiency, the wafer box lifting device A provided in this embodiment has a wafer box switching function; Fig.75 As shown, the wafer box lifting device A includes a vertical lifting mechanism, a horizontal displacement mechanism arranged on the vertical lifting mechanism, a support frame 80 arranged on the horizontal displacement mechanism, and a plurality of clamping mechanisms for clamping the wafer box B. The plurality of clamping mechanisms are horizontally arranged on the support frame 80. The vertical lifting mechanism can drive the horizontal displacement mechanism to vertically lift and lower, and the horizontal displacement mechanism can drive the support frame 80 to horizontally move.

[0329] By setting up multiple clamping mechanisms to clamp multiple wafer boxes B at the same time, when it is necessary to switch the wafer boxes B, it is only necessary for the horizontal displacement mechanism to drive the support frame 80 to move horizontally, so that the wafer boxes B on the clamping mechanism correspond to the valve port position of the vacuum gate valve, and the wafer boxes B can be switched;

[0330] In this embodiment, a base plate 75 is further included, and the base plate 75 is fixed to the frame O by bolts, so that the wafer box lifting device A can be disassembled and assembled as a whole, the vertical lifting mechanism includes a vertical guide rail 76, a vertical slider 77 and a linear module 78, the horizontal displacement mechanism includes a rodless cylinder 79, and the clamping mechanism includes a clamping cylinder 81 and a pressing part 82;

[0331] The vertical guide rail 76 and the linear module 78 are fixed on the base plate 75, the vertical slider 77 is installed on the vertical guide rail 76, the rodless cylinder 79 is fixed on the slider of the linear module 78 and the vertical slider 77, the support frame 80 is fixed on the slider of the rodless cylinder 79, the clamping part 82 is hinged to the support frame 80, the clamping cylinder 81 is tiltedly arranged between the clamping part 82 and the support frame 80, and the two ends of the clamping cylinder 81 are respectively hinged to the clamping part 82 and the support frame 80;

[0332] The linear module 78 drives the rodless cylinder 79 to rise and fall, and the vertical guide rail 76 plays a guiding and fixing role to ensure that the rodless cylinder 79 rises and falls smoothly. The rodless cylinder 79 drives the support frame 80 to move horizontally. Through the extension and retraction of the clamping cylinder 81, the clamping part 82 can clamp the wafer box B on the support frame 80, thereby realizing the clamping of the wafer box B. The linear module 78 and the rodless cylinder 79 are small in size and occupy a small space, which is conducive to the miniaturization of the overall size of the equipment.

[0333] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer vapor deposition device, characterized in that: include: A wafer box lifting device (A), wherein the wafer box lifting device (A) is used to lift the wafer box (B); A load lock chamber (C), the load lock chamber (C) being arranged between the reaction chamber (F) and the wafer box lifting device (A), and a wafer buffer structure (D) being arranged in the load lock chamber (C); The wafer buffer structure (D) is used to store wafers that have not been deposited with thin films and are transferred from the wafer box (B) to the reaction chamber (F), or to store wafers that have been deposited with thin films and are transferred from the reaction chamber (F) to the wafer box (B); A plurality of reaction chambers (F), wherein the reaction chambers (F) are used for performing thin film deposition on a wafer; A wafer transfer device is provided, wherein the wafer transfer device is used to transfer wafers between a wafer box (B), a wafer buffer structure (D) and a reaction chamber (F).

2. A wafer vapor deposition device according to claim 1, characterized in that: The wafer cache structure (D) comprises: a wafer cache box (83) and a wafer cache box lifting device, wherein the wafer cache box (83) is provided with a plurality of storage positions for storing wafers in a vertical direction, and the wafer cache box lifting device is used to lift the wafer cache box (83).

3. A wafer vapor deposition device according to claim 2, characterized in that: The wafer cache box lifting device comprises a mounting support (8401), a driving motor (8402), a cache box lifting screw (8403), a cache box Z-direction slide rail (8404), a cache box Z-direction slider (8405), a connecting shaft clamping block (8406) and a cache box screw nut seat (8408), wherein the connecting shaft clamping block (8406) is arranged on the cache box screw nut seat (8408), and the connecting shaft clamping block (8406) is used to clamp and fix the connecting shaft (86) on the wafer cache box (83) on the cache box screw nut seat (8408); The cache box lifting screw (8403) is rotatably arranged on the mounting support (8401), the drive motor (8402) is fixed on the mounting support (8401), and the drive motor (8402) can drive the cache box lifting screw (8403) to rotate, the cache box Z-direction slide rail (8404) is arranged on the mounting support (8401), the cache box Z-direction slider (8405) is installed on the cache box Z-direction slide rail (8404), the cache box screw nut seat (8408) is fixedly connected to the cache box Z-direction slider (8405), and the cache box screw nut seat (8408) is provided with a cache box screw nut (8407), and the cache box screw nut (8407) is installed on the cache box lifting screw (8403).

4. The wafer vapor deposition device according to claim 1, characterized in that: The wafer transfer device is a wafer handling robot (E), and the wafer handling robot (E) comprises: a wafer picking fork (1), a swing arm (2), a turntable (3), a base flange (4), a telescopic drive device (5) and a rotation drive device (6); The base flange (4) is fixed on the load lock chamber body (C1) of the load lock chamber (C); the turntable (3) is rotatably arranged on the base flange (4); the swing arm portion (2) is mounted on the turntable (3); the rotation drive device (6) can drive the turntable (3) to rotate; the telescopic drive device (5) can drive the swing arm portion (2) to move, so that the swing arm portion (2) drives the slice taking fork (1) to extend or retract; The wafer taking fork (1) is provided with a slot for placing wafers, and the wafer taking fork (1) can receive the wafer in the wafer buffer structure (D) through the slot; A vacuum suction cup (104) is provided at one end of the wafer taking fork (1) away from the swing arm portion (2), and a vacuum air passage connected to the vacuum suction cup (104) is provided inside the wafer taking fork (1). The wafer taking fork (1) can absorb the wafer in the wafer box (B) through the vacuum suction cup (104).

5. The wafer vapor deposition device according to claim 4, characterized in that: The wafer handling robot further comprises a multi-axis magnetic fluid sealing transmission device (7), wherein the multi-axis magnetic fluid sealing transmission device (7) comprises a hollow shaft (701), an intermediate shaft (702) and a base shaft (703) which are coaxially arranged in sequence from the inside to the outside; The hollow shaft (701) and the intermediate shaft (702) are rotatably connected, the intermediate shaft (702) and the base shaft (703) are rotatably connected, and the base shaft (703) is fixed on the base flange (4); The two ends of the intermediate shaft (702) are respectively connected to the rotating disk (3) and the rotating drive device (6); the rotating drive device (6) can rotate the rotating disk (3) by driving the intermediate shaft (702); The two ends of the hollow shaft (701) are respectively connected to the swing arm part (2) and the telescopic driving device (5); the telescopic driving device (5) can drive the hollow shaft (701) to rotate, thereby causing the swing arm part (2) to move; the hollow shaft (701) is connected to the vacuum air passage through a gas hose.

6. The wafer vapor deposition device according to claim 5, characterized in that: The swing arm portion (2) comprises a lower first swing arm (201), an upper second swing arm (202), a lower second swing arm (203), an upper first swing arm (204) and a linkage portion; One end of the lower first swing arm (201) is fixedly connected to the hollow shaft (701), and the other end of the lower first swing arm (201) is connected to the upper second swing arm (202) via a linkage portion; the lower first swing arm (201) drives the upper second swing arm (202) to swing via the linkage portion, and one end of the upper second swing arm (202) away from the linkage portion is hinged to the slice taking fork (1); One end of the lower second swing arm (203) is rotationally connected to the turntable (3), and the other end of the lower second swing arm (203) is rotationally connected to the upper second swing arm (202) via a second rotating shaft (208); One end of the upper first swing arm (204) is rotatably connected to one end of the lower first swing arm (201) away from the hollow shaft (701) via a first rotating shaft (207), and the other end of the upper first swing arm (204) is hinged to the slice taking fork (1).

7. The wafer vapor deposition device according to claim 6, characterized in that: The linkage part comprises a driving gear (205), a driven gear (206), a gear upper cover (209) and a gear lower cover (210); The gear upper cover (209) is rotatably connected to the first rotating shaft (207) and the second rotating shaft (208) respectively through two bearings, and the gear lower cover (210) is connected to the gear upper cover (209) through bolts, and the gear lower cover (210) and the gear upper cover (209) enclose a cavity for accommodating the driving gear (205) and the driven gear (206); The driving gear (205) is fixedly arranged at one end of the lower first swing arm (201) away from the hollow shaft (701), and the driven gear (206) is fixedly arranged at one end of the upper second swing arm (202) away from the slice taking fork (1), and the driven gear (206) is meshed with the driving gear (205).

8. The wafer vapor deposition device according to claim 6, characterized in that: It also includes a swing arm adjustment mechanism (8), wherein the swing arm adjustment mechanism (8) includes an adjustment support (801), a hollow adjustment member (802), a hollow tensioning shaft (803), a locking bolt (804) and a tensioning block (805); The adjustment support (801) is fixed on the top of the turntable (3), a threaded hole is provided on the adjustment support (801), and the hollow adjustment member (802) is provided with an external thread corresponding to the threaded hole; The hollow adjustment member (802) is screwed to vertically displace the hollow adjustment member (802) relative to the adjustment support (801); The hollow tensioning shaft (803) is sleeved with a bearing fixed on the lower second swing arm (203); one end of the hollow tensioning shaft (803) is detachably connected to the hollow adjustment member (802); the other end of the hollow tensioning shaft (803) is provided with a tensioning portion (806); the tensioning portion (806) is provided with a plurality of tensioning strips (807) evenly distributed around the circumference; the tensioning strips (807) can be inserted into a connecting sleeve (301) provided on the turntable (3); The locking bolt (804) passes through the central holes of the hollow adjustment member (802) and the hollow tensioning shaft (803) and is threadedly connected to the tensioning block (805); By screwing the locking bolt (804), the locking bolt (804) can drive the tensioning block (805) to move vertically relative to the tensioning portion (806), so as to open or close the plurality of tensioning strips (807), thereby achieving locking or unlocking of the tensioning strips (807) and the connecting sleeve (301).

9. The wafer vapor deposition device according to claim 8, characterized in that: It also includes a first tightening bolt, a first opening ring (211) is provided at one end of the lower first swing arm (201) close to the hollow shaft (701), the hollow shaft (701) is located in the center hole of the first opening ring (211), a threaded hole and a countersunk hole are respectively provided on two free ends of the first opening ring (211), and the first tightening bolt passes through the countersunk hole and is threadedly connected to the threaded hole; Tightening the first tightening bolt can bring the two free ends closer to each other, causing the first open ring (211) to deform and shrink to hold the hollow shaft (701); It also includes a second tensioning bolt, a second open ring (212) is provided at one end of the upper first swing arm (204) close to the first rotating shaft (207), the first rotating shaft (207) is located in the center hole of the second open ring (212), and two free ends of the second open ring (212) are respectively provided with a threaded hole and a countersunk hole, and the second tensioning bolt passes through the countersunk hole and is threadedly connected with the threaded hole; Tightening the second tightening bolt can bring the two free ends closer to each other, causing the second open ring (212) to deform and shrink to hold the first rotating shaft (207).

10. The wafer vapor deposition device according to claim 1, characterized in that: A wafer lifting mechanism is provided on the cavity of the reaction chamber (F), and the wafer lifting mechanism comprises: a cavity connecting plate (13), a first adjustment plate (14), a second adjustment plate (15), a leveling mechanism and a lifting mechanism (16); The first adjustment plate (14) is slidably disposed on the cavity connecting plate (13) along the Y direction, and the second adjustment plate (15) is slidably disposed on the first adjustment plate (14) along the X direction; The lifting mechanism (16) can drive the wafer carrier (29) to move along the Z direction. The lifting mechanism (16) is installed on the second adjustment plate (15) through a leveling mechanism. The leveling mechanism can adjust the angle between the travel direction of the lifting mechanism (16) and the plane where the second adjustment plate (15) is located.

11. The wafer vapor deposition device according to claim 10, characterized in that: The leveling mechanism comprises three groups of leveling modules distributed in a triangle, and each group of the leveling modules comprises a connecting bolt (1701) and a leveling top screw (1702); The lifting mechanism (16) comprises a support (1601), the leveling screw (1702) is threadedly connected to the support (1601), the support (1601) is provided with a through hole allowing the connecting bolt (1701) to pass through, and the connecting bolt (1701) is threadedly connected to the second adjustment plate (15) after passing through the through hole; By screwing the leveling screw (1702), the length of the leveling screw (1702) protruding from the top surface of the support (1601) can be adjusted.

12. The wafer vapor deposition device according to claim 1, characterized in that: Also included is a gas cabinet (M), the gas cabinet (M) includes a plurality of gas control modules, the gas control modules include a first gas delivery unit (31) and a second gas delivery unit (32); The first gas delivery unit (31) comprises a purge pipeline and a plurality of process gas delivery pipelines, wherein an end of the purge pipeline of the first gas delivery unit (31) away from a purge gas source is connected to an end of the process gas delivery pipeline away from a process gas source to form a first branch (41) and a third branch (43) provided with a switch valve; The second gas delivery unit (32) comprises a purge pipeline and a plurality of process gas delivery pipelines, wherein an end of the purge pipeline of the second gas delivery unit (32) away from a purge gas source is connected to an end of the process gas delivery pipeline away from a process gas source to form a second branch (42) and a fourth branch (44) provided with a switch valve; The first gas delivery unit (31) is provided with at least one process gas delivery pipeline capable of delivering oxidizing gas, the second gas delivery unit (32) is provided with at least one process gas delivery pipeline capable of delivering reducing gas, the first branch (41) and the second branch (42) are connected in parallel to a reaction chamber (F), and the third branch (43) and the fourth branch (44) are connected in parallel to a vacuum pumping system (H).

13. The wafer vapor deposition device according to claim 1, characterized in that: The cavity (F1) and the upper cover (F2) of the reaction chamber (F) are connected by a connecting device, the connecting device comprises a hinge structure, the hinge structure comprises a first leaf (46) and a second leaf (47) hingedly connected by a rotating shaft (57), and the first leaf (46) is provided with a limiting structure; The first leaf (46) is provided with locking holes (4601) on both sides, and a latch spring (49) and a latch (50) are provided in the locking holes (4601). The latch (50) can move along the axial direction of the latch spring (49), and the axial direction of the latch spring (49) is parallel to the axial direction of the rotating shaft (57). The second leaf (47) is provided with locking plates (48) on both sides, and the locking plates (48) are provided with pin holes (4801) for allowing the latch (50) to be inserted; When the second leaf (47) is rotated until the latch (50) is aligned with the pin hole (4801), the latch (50) extends from the locking hole (4601) and is inserted into the pin hole (4801) under the elastic force of the latch spring (49), and the hinge structure is locked at this time; The limiting structure can prevent the latch (50) from extending from the locking hole (4601) when the hinge structure is not locked.

14. The wafer vapor deposition device according to claim 13, characterized in that: The limiting structure comprises a limiting slider (51) and a slide groove (4602), wherein the slide groove (4602) is arranged on both sides of the first leaf (46), and a spring (52) is arranged in the slide groove (4602); The limiting slider (51) comprises a stopper (5101) and a sliding part (5102), wherein the sliding part (5102) is slidably arranged in the slide groove (4602), and the second leaf piece (47) is rotated to enable the locking plate (48) to push the stopper (5101); Under the elastic force of the spring (52), the sliding portion (5102) can slide along the sliding groove (4602) until the stop portion (5101) blocks the locking hole (4601); Under the thrust of the locking plate (48), the sliding portion (5102) can slide in the opposite direction along the sliding groove (4602) until the stop portion (5101) no longer blocks the locking hole (4601).

15. The wafer vapor deposition device according to claim 13, characterized in that: The first leaf (46) is also provided with unlocking grooves (4603) on both sides thereof and connected to the locking hole (4601); the unlocking grooves (4603) extend along the axial direction of the latch spring (49); the latch (50) is provided with a handle (55); the handle (55) extends from the unlocking groove (4603); and the latch (50) can be retracted into the locking hole (4601) by pulling the handle (55).

16. The wafer vapor deposition device according to claim 1, characterized in that: The reaction chamber (F) is provided with a heating device on its cavity, characterized in that it comprises: a light bulb (58), a water-cooled lampshade (59) and a lamp holder, wherein the water-cooled lampshade (59) and the lamp holder are detachably connected; The lamp holder comprises a base plate (60), the base plate (60) is provided with a wiring copper bar, the wiring copper bar comprises a neutral copper bar (61) and at least one live copper bar (62), the base plate (60) is also provided with a socket (63) adapted to the plug (5801) of the light bulb (58), the socket (63) being electrically connected to the neutral copper bar (61) and the live copper bar (62); When the plug (5801) is inserted into the socket (63), the light bulb (58) is located in the water-cooled lampshade (59).

17. The wafer vapor deposition device according to claim 1, characterized in that: It also includes a vacuum gate valve disposed on the load lock chamber (C), wherein the vacuum gate valve is located on a side of the load lock chamber (C) close to the wafer box lifting device (A); The vacuum gate valve comprises a valve port (68), a valve plate (69) and a driving device (70); the valve port (68) is provided on a load lock chamber body (C1) of a load lock chamber (C); the valve plate (69) is arranged opposite to the valve port (68); a sealing ring (71) is provided on one side of the valve plate (69) close to the valve port (68); and the driving device (70) is arranged on the load lock chamber body (C1); The driving device (70) is capable of driving the valve plate (69) to move closer to or farther from the valve port (68) along a first direction perpendicular to the valve port (68) so as to close or open the valve port (68); When the valve plate (69) is away from the valve port (68), the driving device (70) can drive the valve plate (69) to reciprocate along a second direction perpendicular to the first direction, so that the orthographic projection of the valve port (68) along the first direction does not overlap or overlaps with the valve plate (69); It also includes a sink (73) arranged on the load lock chamber body (C1); when the valve plate (69) is away from the valve port (68), the valve plate (69) is partially or completely located in the sink (73).

18. The wafer vapor deposition device according to claim 17, characterized in that: The two driving devices (70) are symmetrically arranged on both sides of the load lock chamber body (C1), and the two ends of the valve plate (69) are respectively connected to the two driving devices (70); The driving device (70) comprises a first cylinder (7001), a second cylinder (7002), a cylinder seat (7003) and a housing (7004); The housing (7004) is fixedly connected to the load lock chamber body (C1), the second cylinder (7002) is fixedly connected to the housing (7004), the piston rod of the second cylinder (7002) is fixedly connected to the cylinder seat (7003), the first cylinder (7001) is fixedly connected to the cylinder seat (7003), and the piston rod of the first cylinder (7001) is fixedly connected to the valve plate (69); The first cylinder (7001) can drive the valve plate (69) to reciprocate in a first direction, and the second cylinder (7002) can drive the cylinder seat (7003) to reciprocate in a second direction.

19. The wafer vapor deposition device according to claim 1, characterized in that: It also includes a frame (O), wherein the wafer box lifting device (A), the load lock chamber (C) and the reaction chamber (F) are arranged in the frame (O), and a cabinet (N) is arranged on the periphery of the frame (O), and the cabinet (N) is used to accommodate control components.

20. A method for using a wafer vapor deposition device, using the wafer vapor deposition device according to any one of claims 1 to 19, characterized in that ； When it is necessary to transfer the wafers without thin film deposition in the wafer box (B) to the reaction chamber (F) for thin film deposition: The load lock chamber (C) is opened, and the wafer transfer device transfers the wafers in the wafer box (B) to the wafer buffer structure (D) for storage. When the number of wafers stored in the wafer buffer structure (D) reaches the number required by the process, the load lock chamber (C) is closed, the load lock chamber (C) is evacuated, and the reaction chamber (F) is opened. The wafer transfer device transfers the wafers in the wafer buffer structure (D) to the reaction chamber (F), and the reaction chamber (F) is closed to perform thin film deposition; When it is necessary to transfer the wafers in the reaction chamber (F) that have completed thin film deposition to the wafer box (B): The reaction chamber (F) is opened, and the wafer transfer device transfers the wafers on which thin film deposition has been completed in the reaction chamber (F) to the wafer buffer structure (D). When the number of wafers stored in the wafer buffer structure (D) reaches the number required by the process, the reaction chamber (F) is closed, and the load lock chamber (C) is opened. The wafer transfer device transfers the wafers stored in the wafer buffer structure (D) to the wafer box (B). After the transfer is completed, the load lock chamber (C) is closed.

21. A method for using a wafer vapor deposition device according to claim 20, characterized in that ； When it is necessary to transfer the wafers without thin film deposition in the wafer box (B) to the reaction chamber (F) for thin film deposition: The load lock chamber (C) is opened, and the wafer box lifting device (A) lifts the wafer box (B) so that the wafer to be transferred is aligned with the wafer fork (1), and the wafer fork (1) extends into the wafer box (B) and absorbs the wafer in the wafer box (B) through the vacuum suction cup (104); The wafer taking fork (1) transfers the adsorbed wafer to the wafer buffer structure (D), the wafer buffer structure (D) rises and falls, so that the wafer to be transferred is aligned with the wafer taking fork (1), the wafer taking fork (1) extends into the wafer buffer structure (D), and the wafer buffer structure (D) rises and falls, so that the wafer falls into the card slot of the wafer taking fork (1); When the number of wafers stored in the wafer buffer structure (D) reaches the number required by the process, the load lock chamber (C) is closed, the load lock chamber (C) is evacuated, the reaction chamber (F) is opened, the wafer fork (1) transfers the wafer to the reaction chamber (F), after the wafer is transferred to the reaction chamber (F), the wafer fork (1) leaves the reaction chamber (F), the reaction chamber (F) is closed, and process gas is introduced into the reaction chamber (F) to perform thin film deposition; When it is necessary to transfer the wafers in the reaction chamber (F) that have completed thin film deposition to the wafer box (B): The reaction chamber (F) is opened, the wafer taking fork (1) enters the reaction chamber (F), the wafer taking fork (1) receives the wafer through the card slot, the wafer taking fork (1) transfers the wafer to the wafer buffer structure (D), the wafer buffer structure (D) is raised and lowered so that the wafer on the wafer taking fork (1) is aligned with the storage position in the wafer buffer structure (D), the wafer taking fork (1) extends into the wafer buffer structure (D), the wafer buffer structure (D) is lowered, and the wafer falls into the storage position in the wafer buffer structure (D); When the number of wafers stored in the wafer buffer structure (D) reaches the number required by the process, the reaction chamber (F) is closed, the load lock chamber (C) is opened, the wafer fork (1) is inserted into the wafer buffer structure (D), the wafer buffer structure (D) rises, and the wafer falls on the wafer fork (1), the wafer fork (1) absorbs the wafer in the wafer box (B) through the vacuum suction cup (104), the wafer box lifting device (A) lifts the wafer box (B) so that the wafer on the wafer fork (1) is aligned with the storage position in the wafer box (B), the wafer fork (1) is inserted into the wafer box (B), and the wafer is stored in the storage position of the wafer box (B). After the wafer transfer is completed, the load lock chamber (C) is closed.

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