A semiconductor wafer clamping and grabbing device

Abstract

The present invention relates to the technical field of clamping devices, and discloses a clamping and grasping device for semiconductor wafers, including a U-shaped support plate, the outer surface of the U-shaped support plate is slidably connected to a guide assembly, one side of the guide assembly is fixedly connected to a first inclined plate, one end of the first inclined plate is rotatably connected to a positioning wheel assembly, the upper surface of the guide assembly is fixedly connected to an L-shaped plate, the outer surface of the L-shaped plate is fixedly connected to a cylinder, and the front end of the U-shaped support plate is rotatably connected to a second inclined plate. The present invention arranges a positioning wheel assembly, when in contact with the peripheral edge of the wafer, the annular airbag can adaptively deform according to the edge shape and surface conditions of the wafer, avoiding scratches, indentations and other damages caused by rigid contact, so that the entire positioning wheel assembly can form a flexible clamping of the peripheral edge of the wafer, and in the clamping process, through the cooperation of components such as a sleeve and a piston, the instantaneous power output of the cylinder can be buffered, further avoiding the wafer from rigidly contacting the positioning wheel assembly.

Description

Technical Field

[0001] The invention relates to the technical field of clamping devices, and in particular to a clamping and grasping device for semiconductor wafers. Background Art

[0002] Semiconductor wafers are the core basic materials of the modern electronics industry and are widely used in many high-tech fields. Their manufacturing and processing technology has become increasingly sophisticated and complex with the development of science and technology. Frequent grasping operations are required in each production link of wafers, but traditional grasping methods have problems, such as easy scratching and damage of wafers, and grasping accuracy is difficult to meet the needs of precision processing.

[0003] According to the search, the Chinese patent document, announcement number: CN110148576A, discloses a mechanical clamping device for semiconductor wafer transmission. The five articulated rods in the driving assembly are articulated to drive the five clamping plates to move up and down, so as to clamp the semiconductor wafer between the clamping plates, improve the transmission efficiency between the articulated rods and improve the clamping effect; multiple semiconductor wafers are transmitted simultaneously through multiple clamping plates, which improves the transmission efficiency and increases the production efficiency.

[0004] However, in actual use, the above-mentioned clamping device is directly and rigidly clamped on the upper and lower end faces of the wafer through multiple clamping plates, and lacks a structure to control the clamping force. Therefore, once the clamping force is too large, it is easy to cause indentations on the two end faces of the wafer; if the clamping force is too small, it is very easy to cause loose clamping, and the wafer is likely to fall during the movement. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a clamping and grasping device for semiconductor wafers, which has the advantages of being able to flexibly clamp the wafer, ensuring stable clamping of the wafer without damaging the outer surface of the wafer, and solving the above-mentioned technical problems.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical scheme: a clamping and grasping device for a semiconductor wafer, comprising a U-shaped support plate, the outer surface of the U-shaped support plate is slidably connected with a guide assembly, one side of the guide assembly is fixedly connected with a first inclined plate, one end of the No. 1 inclined plate is rotatably connected with a positioning wheel assembly, the upper surface of the guide assembly is fixedly connected with an L-shaped plate, the outer surface of the L-shaped plate is fixedly connected with a cylinder, the front end of the U-shaped support plate is rotatably connected with a second inclined plate, the lower surface of the No. 2 inclined plate is rotatably connected with a sleeve rod, one end of the sleeve rod is equipped with a piston, the outer surface of the piston is provided with a sleeve, one end of the sleeve is threadedly connected with a rotating seat, and the outer surface of the sleeve is connected with an air nozzle, the outer surface of the air nozzle is threadedly connected with a cap, an air pipe 1 is fixedly connected to the end surface of the cap, one end of the air pipe 1 is fixedly connected to a stop valve, a compression spring is sleeved on the outer surface of the sleeve, and the lower surface of the U-shaped support plate is fixedly connected with a connecting plate;

[0007] The positioning wheel assembly includes a rotating shaft, the outer surface of the rotating shaft is rotatably connected to a core body, the outer surface of the core body is sleeved with an annular airbag, the upper and lower surfaces of the annular airbag are both fitted with limiting plates, the outer surface of the rotating shaft is fixedly connected to a blocking plate, and the top end of the rotating shaft is threadedly connected to a locking nut.

[0008] As a preferred technical solution of the present invention, the upper surface of the U-shaped support plate is fixedly connected to a mounting plate, the outer surface of the mounting plate is connected to the cylinder body end of the cylinder, and the output end of the cylinder is fixedly connected to the L-shaped plate.

[0009] As a preferred technical solution of the present invention, the guide assembly includes an arc-shaped bottom plate, two side blocks and a roller shaft, the two ends of the arc-shaped bottom plate are connected to the side blocks by screws, and the roller shaft is rotatably connected between the two side blocks.

[0010] As a preferred technical solution of the present invention, the inner wall of the sleeve fits the piston, and the outer surface of the sleeve is provided with an air hole connected to the air nozzle, and the stop valve is installed on the lower surface of the U-shaped support plate.

[0011] As a preferred technical solution of the present invention, the center of the rotating seat is rotatably connected to the U-shaped support plate through an axis, the outer surfaces of the sleeve rod and the sleeve are fixedly connected to a limiting ring, and both ends of the compression spring abut against the limiting ring.

[0012] As a preferred technical solution of the present invention, a limit block is fixedly connected to the upper surface of the U-shaped support plate near the second inclined plate, and four groups of positioning wheel assemblies are provided.

[0013] As a preferred technical solution of the present invention, two of the No. 1 inclined plate and the No. 2 inclined plate are provided, one end of the two No. 1 inclined plates and the two No. 2 inclined plates are rotatably connected to the rotating shaft, and the outer surface of the core body has an annular groove, which fits the annular airbag.

[0014] As a preferred technical solution of the present invention, two limiting plates are provided, and the centers of the two limiting plates are inserted into the rotating shaft, and the wall thickness of the annular airbag is 2mm-3mm.

[0015] As a preferred technical solution of the present invention, a suction cup is fixedly connected to the upper surface of the U-shaped support plate, and the lower surface of the U-shaped support plate is fixedly connected to a U-shaped air pipe, the outer surface of the U-shaped air pipe is fixedly connected to a pipe joint, one end of the pipe joint is connected to air pipe two, and one end of air pipe two is connected to a micro vacuum generator.

[0016] As a preferred technical solution of the present invention, the lower surface of the connecting plate is connected to a T-shaped plate by bolts, one side of the T-shaped plate is fixedly connected to a box body, the interior of the box body is rotatably connected to a worm, the worm transmission is connected to a worm wheel, the end face of the worm wheel is rotatably connected to the T-shaped plate by an axis, one end of the worm is connected to the output shaft of a servo motor, a vacuum switch is installed on the inner bottom surface of the box body, and the lower surface of the box body is connected to a robotic arm.

[0017] Compared with the prior art, the present invention provides a semiconductor wafer clamping and grasping device, which has the following beneficial effects:

[0018] 1. The present invention provides a positioning wheel assembly. When the annular airbag contacts the outer peripheral edge of the wafer, it can adaptively deform according to the edge shape and surface conditions of the wafer to avoid scratches, indentations and other damages caused by rigid contact. At the same time, two limit plates prevent the annular airbag from excessive deformation. The core body plays a supporting role, so that the entire positioning wheel assembly can form a flexible clamping on the outer peripheral edge of the wafer. In the clamping process, the instantaneous power output by the cylinder can be buffered through the cooperation of the sleeve, piston and other components, further avoiding the wafer from rigidly contacting the positioning wheel assembly. The overall structure realizes flexible clamping of the wafer to avoid damage to the wafer.

[0019] 2. The present invention improves the clamping stability by adopting a double fixing method. On the one hand, the four positioning wheel assemblies can be clamped on the outer peripheral edge of the wafer; on the other hand, after the four positioning wheel assemblies fix the wafer, the air pipe 2, the U-shaped air pipe and the suction cup are vacuumed through the micro vacuum generator, and the suction cup contacts the lower surface of the wafer to generate adsorption force. The two fixing methods act on the wafer from different directions, and cooperate with each other to achieve a more comprehensive and stable fixation of the wafer, which greatly improves the reliability and stability of the entire device for wafer clamping. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1It is a three-dimensional schematic diagram of the structure of the present invention;

[0021] Figure 2 It is a three-dimensional schematic diagram of the wire assembly in the structure of the present invention;

[0022] Figure 3 A cross-sectional schematic diagram of the positioning wheel assembly in the structure of the present invention;

[0023] Figure 4 It is a top view schematic diagram of the U-shaped support plate and other components in the structure of the present invention;

[0024] Figure 5 It is a three-dimensional schematic diagram of the U-shaped support plate and other components in the structure of the present invention;

[0025] Figure 6 It is a cross-sectional schematic diagram of the sleeve, sleeve rod and other components in the structure of the present invention;

[0026] Figure 7 It is a schematic diagram of the interior of the box body in the structure of the present invention;

[0027] Figure 8 It is a top view schematic diagram of the structural box body of the present invention.

[0028] Among them: 1. U-shaped support plate; 2. Guide assembly; 201. Arc bottom plate; 202. Side block; 203. Roller; 3. No. 1 inclined plate; 4. Positioning wheel assembly; 41. Rotating shaft; 42. Core; 43. Annular airbag; 44. Limiting plate; 45. Block; 46. Locking nut; 5. L-shaped plate; 6. Cylinder; 7. No. 2 inclined plate; 8. Sleeve rod; 9. Piston; 10. Sleeve; 11. Rotating seat; 1 2. Air nozzle; 13. Cover cap; 14. Air pipe one; 15. Stop valve; 16. Compression spring; 17. Connecting plate; 18. Mounting plate; 19. Limit block; 20. Suction cup; 21. U-shaped air pipe; 22. Pipe joint; 23. Air pipe two; 24. Mini vacuum generator; 25. T-shaped plate; 26. Box body; 27. Worm; 28. Worm gear; 29. ​​Servo motor; 30. Vacuum switch; 31. Robotic arm. DETAILED DESCRIPTION

[0029] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0030] In the description of the present invention, unless otherwise specified, "plurality" means two or more than two; the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] See also Figure 1-Figure 8 , a semiconductor wafer clamping and grasping device comprises a U-shaped support plate 1, the outer surface of the U-shaped support plate 1 is slidably connected with a guide assembly 2, one side of the guide assembly 2 is fixedly connected with a first inclined plate 3, one end of the first inclined plate 3 is rotatably connected with a positioning wheel assembly 4, the upper surface of the guide assembly 2 is fixedly connected with an L-shaped plate 5, the outer surface of the L-shaped plate 5 is fixedly connected with a cylinder 6, the front end of the U-shaped support plate 1 is rotatably connected with a second inclined plate 7, the lower surface of the second inclined plate 7 is rotatably connected with a sleeve rod 8, one end of the sleeve rod 8 is installed with a piston 9, the outer surface of the piston 9 is provided with a sleeve 10, one end of the sleeve 10 is threadedly connected with a rotating seat 11, and the outer surface of the sleeve 10 is connected with an air nozzle 12, the outer surface of the air nozzle 12 is threadedly connected with a cap 13, an end surface of the cap 13 is fixedly connected with an air pipe 14, one end of the air pipe 14 is fixedly connected with a stop valve 15, the outer surface of the sleeve 10 is sleeved with a compression spring 16, and the lower surface of the U-shaped support plate 1 is fixedly connected with a connecting plate 17;

[0033] The positioning wheel assembly 4 includes a rotating shaft 41, the outer surface of the rotating shaft 41 is rotatably connected to a core body 42, the outer surface of the core body 42 is sleeved with an annular airbag 43, the upper and lower surfaces of the annular airbag 43 are both fitted with a limiting plate 44, the outer surface of the rotating shaft 41 is fixedly connected to a blocking plate 45, and the top end of the rotating shaft 41 is threadedly connected to a locking nut 46.

[0034] Furthermore, a mounting plate 18 is fixedly connected to the upper surface of the U-shaped support plate 1, the outer surface of the mounting plate 18 is connected to the cylinder body end of the cylinder 6, and the output end of the cylinder 6 is fixedly connected to the L-shaped plate 5. The advantage is that the mounting plate 18 plays a role in connecting the U-shaped support plate 1 and the cylinder body of the cylinder 6, so that the cylinder 6 can be stably mounted on the U-shaped support plate 1, and through the stable support of the mounting plate 18, the cylinder 6 can more effectively transmit the force to the L-shaped plate 5, and when the cylinder 6 is extended and retracted, it can accurately drive the L-shaped plate 5 to perform corresponding movements, thereby driving the guide assembly 2 to slide on the U-shaped support plate 1, so that the first inclined plate 3 can be driven, and the first inclined plate 3 drives the two sets of positioning wheel assemblies 4 to move, so that when the U-shaped support plate 1 holds the semiconductor wafer, the four sets of positioning wheel assemblies 4 can be clamped on the outer peripheral edge of the wafer.

[0035] Furthermore, the guide assembly 2 includes an arc-shaped bottom plate 201, two side blocks 202 and a roller shaft 203. The two ends of the arc-shaped bottom plate 201 are connected with the side blocks 202 by screws, and the roller shaft 203 is rotatably connected between the two side blocks 202. The advantage is that the outer surface of the arc-shaped bottom plate 201 has an arc groove adapted to the U-shaped air pipe 21, and the arc-shaped bottom plate 201 and the two side blocks 202 are connected by screws, which is convenient for installation and adjustment. When the cylinder 6 drives the L-shaped plate 5 to move, the L-shaped plate 5 drives the two side blocks 202 connected thereto to move, so that the side blocks 202 drive the roller shaft 203 to slide on the U-shaped support plate 1, so that the friction resistance during movement can be reduced, and the entire guide assembly 2 can guide the movement direction of the first inclined plate 3.

[0036] Furthermore, the inner wall of the sleeve 10 fits the piston 9, and the outer surface of the sleeve 10 is provided with an air hole connected to the air nozzle 12, and the stop valve 15 is installed on the lower surface of the U-shaped support plate 1. The advantage is that after the wafer is lifted by the U-shaped support plate 1, when the cylinder 6 is started to move the two No. 1 inclined plates 3, and then drive the two positioning wheel assemblies 4 to approach the outer peripheral edge of the wafer, the stop valve 15 needs to be opened during this clamping process. When the wafer is pushed by the two positioning wheel assemblies 4 rotatably connected to the No. 1 inclined plate 3, it will gradually approach the other two positioning wheel assemblies 4 rotatably connected to the No. 2 inclined plate 7, and the No. 2 inclined plate 7 can drive the sleeve rod 8, and the sleeve rod 8 drives the piston 9 to slide in the sleeve 10, and the piston 9 squeezes the air in the sleeve 10 and discharges it into the air pipe through the air nozzle 12. 14, and then the excess air is discharged through the stop valve 15; when the output end of the cylinder 6 no longer extends, the stop valve 15 is immediately closed, so that the air in the sleeve 10 is in a closed state, and the piston 9 can be prevented from moving further into the sleeve 10, which means that the sleeve rod 8 and the second inclined plate 7 connected thereto will also be fixed. The entire clamping process can buffer the instantaneous power output by the cylinder 6, thereby implementing a stable and flexible clamping of the wafer, thereby preventing the wafer from hard contact with the four positioning wheel assemblies 4, which can play a buffering role and avoid damage to the wafer.

[0037] Furthermore, the center of the rotating seat 11 is rotatably connected to the U-shaped support plate 1 through an axis, and a limit ring is fixedly connected to the outer surface of the sleeve rod 8 and the sleeve 10, and both ends of the compression spring 16 abut against the limit ring. The advantage is that after the clamped wafer is placed, the sleeve rod 8 can be reset by resetting the cylinder 6 and reopening the stop valve 15. At this time, the sleeve rod 8 can be driven to reset under the action of the compression spring 16, and the sleeve rod 8 drives the piston 9 to reset, so that the second inclined plate 7 and the positioning wheel assembly 4 rotatably connected thereto can be restored to the initial state.

[0038] Furthermore, the upper surface of the U-shaped support plate 1 is fixedly connected to the position near the second inclined plate 7, and four groups of positioning wheel assemblies 4 are provided. The advantage is that the maximum rotation angle of the second inclined plate 7 can be limited by setting the limit block 19, which can prevent it from rotating excessively and ensure that the second inclined plate 7 moves within a reasonable range.

[0039] Furthermore, two inclined plates No. 1 3 and No. 2 7 are provided, and one end of the two inclined plates No. 1 3 and the two inclined plates No. 2 7 are rotatably connected to the rotating shaft 41 , and the outer surface of the core body 42 has an annular groove, which fits the annular airbag 43 .

[0040] Furthermore, two limiting pieces 44 are provided, and the centers of the two limiting pieces 44 are inserted into the rotating shaft 41, and the wall thickness of the annular airbag 43 is 2mm-3mm. The advantage is that when the positioning wheel assembly 4 contacts the peripheral edge of the wafer, the annular airbag 43 can be adaptively deformed according to the shape and surface condition of the wafer edge, avoiding damage to the wafer edge caused by rigid contact, such as scratches or indentations, so as to better protect the wafer, the core 42 can support the annular airbag 43, so that the annular airbag 43 can be attached to the outer surface of the core 42, and the two limiting pieces 44 are attached to the upper and lower surfaces of the annular airbag 43 to prevent the annular airbag 43 from excessive deformation, and the entire positioning wheel assembly 4 can further form a flexible clamping on the peripheral edge of the wafer.

[0041] Furthermore, the upper surface of the U-shaped support plate 1 is fixedly connected with a suction cup 20, and the lower surface of the U-shaped support plate 1 is fixedly connected with a U-shaped air pipe 21, the outer surface of the U-shaped air pipe 21 is fixedly connected with a pipe joint 22, one end of the pipe joint 22 is connected to the air pipe 23, and one end of the air pipe 23 is connected to the micro vacuum generator 24. The advantage is that after the four positioning wheel assemblies 4 fix the wafer, the air pipe 23 is connected through the vacuum end of the micro vacuum generator 24, and the air pipe 23 can be vacuumed when the micro vacuum generator 24 can be started by the vacuum switch 30, so that the air pipe 23 can be vacuumed, and then the U-shaped air pipe 21 and the suction cup 20 can be vacuumed, so that when the suction cup 20 contacts the lower surface of the wafer, it can generate an adsorption force on the wafer, and cooperate with the four positioning wheel assemblies 4 to fix the wafer in different directions. The combination of the two can achieve a more comprehensive and stable fixation of the wafer, and improve the reliability and accuracy of the wafer clamping of the entire device.

[0042] Further, the lower surface of the connecting plate 17 is connected to the T-shaped plate 25 by bolts, one side of the T-shaped plate 25 is fixedly connected to the box body 26, the inner part of the box body 26 is connected to the worm 27 by rotation, the worm 27 is connected to the worm wheel 28 by transmission, the end face of the worm wheel 28 is connected to the T-shaped plate 25 by shaft rotation, one end of the worm 27 is connected to the output shaft of the servo motor 29, the vacuum switch 30 is installed on the inner bottom surface of the box body 26, and the lower surface of the box body 26 is connected to the mechanical arm 31. The advantage is that when the wafer is clamped, the servo motor 29 can be started to drive the worm 27 to rotate, the worm 27 drives the worm wheel 28 to rotate, the worm wheel 28 drives the T-shaped plate 25 to rotate, and the T-shaped plate 25 drives the connecting plate 17 to rotate, so that the U-shaped pallet 1 can be turned over, so that the wafer can be handled. In this way, the existing PLC control equipment can be used to uniformly control the cylinder 6, the stop valve 15 and the vacuum switch 30 and other components, so that it can automatically coordinate the operation of the control device, and the wafer can be transported by the mechanical arm 31.

[0043] When in use, first move the U-shaped pallet 1 to the bottom of the wafer to be transported by the robot arm 31, then slightly raise the U-shaped pallet 1 so that the suction cup 20 contacts the lower surface of the wafer, and when the cylinder 6 starts to extend and retract, its output end drives the L-shaped plate 5 to move, thereby driving the guide assembly 2 to slide on the U-shaped pallet 1, so that the No. 1 inclined plate 3 connected to the guide assembly 2 drives the two sets of positioning wheel assemblies 4 to move, and open the stop valve 15. As the cylinder 6 drives the No. 1 inclined plate 3 to drive the positioning wheel assembly 4 to approach the outer peripheral edge of the wafer, the wafer approaches the positioning wheel assembly 4 rotatably connected to the No. 2 inclined plate 7 under the push of the positioning wheel assembly 4. At this time, the No. 2 inclined plate 7 drives the sleeve rod 8, and the sleeve rod 8 drives the piston 9 to slide in the sleeve 10. The piston 9 squeezes the air in the sleeve 10 and discharges it into the air pipe 14 through the air nozzle 12 and passes through the stop valve 15 exhausts excess air and buffers the instantaneous power output by the cylinder 6, thereby achieving stable and flexible clamping of the wafer; then, by starting the micro vacuum generator 24, the air pipe 23 generates a vacuum, and then the U-shaped air pipe 21 and the suction cup 20 generate a vacuum, the suction cup 20 contacts the lower surface of the wafer to generate adsorption force, and cooperates with the four positioning wheel assemblies 4 to fix the wafer more comprehensively and stably from different directions; the robotic arm 31 is used again to transport the wafer. If the wafer needs to be flipped, the servo motor 29 drives the worm 27 to rotate, the worm 27 drives the worm gear 28, the worm gear 28 drives the T-shaped plate 25 to rotate, and the T-shaped plate 25 drives the connecting plate 17 to rotate, thereby realizing the flipping of the U-shaped support plate 1 and the wafer, and the wafer can be released by resetting the cylinder 6 and disconnecting the micro vacuum generator 24.

[0044] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer gripping device, comprising a U-shaped support plate (1), characterized in that: The outer surface of the U-shaped support plate (1) is slidably connected to a guide assembly (2); a first inclined plate (3) is fixedly connected to one side of the guide assembly (2); one end of the first inclined plate (3) is rotatably connected to a positioning wheel assembly (4); an upper surface of the guide assembly (2) is fixedly connected to an L-shaped plate (5); an outer surface of the L-shaped plate (5) is fixedly connected to a cylinder (6); a front end of the U-shaped support plate (1) is rotatably connected to a second inclined plate (7); a lower surface of the second inclined plate (7) is rotatably connected to a sleeve rod (8); a piston (9) is mounted on one end of the sleeve rod (8). ), the outer surface of the piston (9) is provided with a sleeve (10), one end of the sleeve (10) is threadedly connected to a rotating seat (11), and the outer surface of the sleeve (10) is connected to a gas nozzle (12), the outer surface of the gas nozzle (12) is threadedly connected to a cover cap (13), an end surface of the cover cap (13) is fixedly connected to an air pipe 1 (14), one end of the air pipe 1 (14) is fixedly connected to a stop valve (15), the outer surface of the sleeve (10) is sleeved with a compression spring (16), and the lower surface of the U-shaped support plate (1) is fixedly connected to a connecting plate (17); The positioning wheel assembly (4) comprises a rotating shaft (41), the outer surface of the rotating shaft (41) is rotatably connected to a core body (42), the outer surface of the core body (42) is sleeved with an annular airbag (43), the upper and lower surfaces of the annular airbag (43) are both in contact with a limiting plate (44), the outer surface of the rotating shaft (41) is fixedly connected to a blocking plate (45), and the top end of the rotating shaft (41) is threadedly connected to a locking nut (46).

2. A semiconductor wafer clamping and grabbing device according to claim 1, characterized in that: The upper surface of the U-shaped support plate (1) is fixedly connected to a mounting plate (18), the outer surface of the mounting plate (18) is connected to the cylinder body end of the cylinder (6), and the output end of the cylinder (6) is fixedly connected to the L-shaped plate (5).

3. The semiconductor wafer clamping and grabbing device according to claim 1, characterized in that: The guide assembly (2) comprises an arc-shaped bottom plate (201), two side blocks (202) and a roller shaft (203); the two ends of the arc-shaped bottom plate (201) are connected to the side blocks (202) via screws; and the roller shaft (203) is rotatably connected between the two side blocks (202).

4. The semiconductor wafer clamping and grabbing device according to claim 1, characterized in that: The inner wall of the sleeve (10) fits the piston (9), and the outer surface of the sleeve (10) is provided with an air hole connected to the air nozzle (12), and the stop valve (15) is installed on the lower surface of the U-shaped support plate (1).

5. The semiconductor wafer clamping and grabbing device according to claim 1, characterized in that: The center of the rotating seat (11) is rotatably connected to the U-shaped support plate (1) via a shaft, and the outer surfaces of the sleeve rod (8) and the sleeve (10) are fixedly connected to a limiting ring, and both ends of the compression spring (16) abut against the limiting ring.

6. The semiconductor wafer clamping and grabbing device according to claim 1, characterized in that: A position of the upper surface of the U-shaped support plate (1) close to the second inclined plate (7) is fixedly connected to a limiting block (19), and four groups of positioning wheel assemblies (4) are provided.

7. The semiconductor wafer clamping and grabbing device according to claim 1, characterized in that: Two of the first inclined plate (3) and the second inclined plate (7) are provided, one end of each of the two first inclined plates (3) and the two second inclined plates (7) are rotatably connected to the rotating shaft (41), and the outer surface of the core (42) has an annular groove, and the annular groove is in contact with the annular airbag (43).

8. The semiconductor wafer clamping and grabbing device according to claim 1, characterized in that: Two limiting plates (44) are provided, and the centers of the two limiting plates (44) are inserted into the rotating shaft (41). The wall thickness of the annular airbag (43) is 2 mm-3 mm.

9. The semiconductor wafer clamping and grabbing device according to claim 1, characterized in that: The upper surface of the U-shaped support plate (1) is fixedly connected to a suction cup (20), and the lower surface of the U-shaped support plate (1) is fixedly connected to a U-shaped air pipe (21), the outer surface of the U-shaped air pipe (21) is fixedly connected to a pipe joint (22), one end of the pipe joint (22) is connected to air pipe 2 (23), and one end of the air pipe 2 (23) is connected to a micro vacuum generator (24).

10. The semiconductor wafer clamping and grabbing device according to claim 1, characterized in that: The lower surface of the connecting plate (17) is connected to a T-shaped plate (25) via bolts; one side of the T-shaped plate (25) is fixedly connected to a box body (26); the interior of the box body (26) is rotatably connected to a worm (27); the worm (27) is transmission-connected to a worm wheel (28); the end surface of the worm wheel (28) is rotatably connected to the T-shaped plate (25) via an axis; one end of the worm (27) is connected to an output shaft of a servo motor (29); a vacuum switch (30) is installed on the inner bottom surface of the box body (26); and the lower surface of the box body (26) is connected to a mechanical arm (31).

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